Apparatus for supporting a substrate, apparatus for processing a substrate and method

CN122556211APending Publication Date: 2026-08-11JUSUNG ENG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2026-08-11

AI Technical Summary

Benefits of technology

[0030]根据一个示例性实施例,由于沿该一个方向的移动和绕着该一个方向的旋转,因此通过驱动这一对臂而可稳定地夹持和翻转基板。

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Abstract

This disclosure relates to an apparatus for supporting a substrate and to an apparatus and method for processing a substrate, and more specifically, to an apparatus for supporting a substrate that flips the substrate to an opposite surface, and to an apparatus and method for processing a substrate.
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Description

Technical Field

[0001] This disclosure relates to an apparatus for supporting a substrate and to an apparatus and method for processing a substrate, and more particularly to an apparatus for supporting a substrate that flips the substrate to an opposite surface, and to an apparatus and method for processing a substrate. Background Technology

[0002] Generally, the substrate can be processed during transport, and there may be situations where the orientation of one surface of the substrate is changed during the process.

[0003] For example, in the case of deposition processes, there are upward deposition processes where the deposition material is provided from the top side of the substrate upwards, and downward deposition processes where the deposition material is provided from the top side downwards, and it is necessary to flip the substrate so that the deposition surface faces the direction in which the deposition material is provided.

[0004] Furthermore, even when depositing material in one direction, it may still be necessary to flip the substrate. For example, in semiconductor devices or display devices, there are situations where thin films need to be deposited on both surfaces of a substrate (i.e., not only on one surface but also on the other). In this case, after the thin film is deposited on one surface of the substrate, the substrate is turned to deposit a thin film on the other surface. Therefore, there is an increasing demand for a substrate support device capable of stably holding and flipping the substrate.

[0005] Existing technical documents

[0006] (Patent Document 1) KR 10-1384477 B1 Summary of the Invention

[0007] Technical issues

[0008] This disclosure provides an apparatus for supporting a substrate, capable of stably clamping and flipping the substrate, as well as an apparatus and method for processing the substrate.

[0009] This disclosure also provides an apparatus for supporting a substrate, which is capable of flipping the substrate within a vacuum processing space, as well as an apparatus and method for processing the substrate.

[0010] Technical solution

[0011] According to an exemplary embodiment of the present disclosure, a device for supporting a substrate, which clamps the substrate to flip the substrate, includes: a clamping portion including a pair of arms that can be opened and closed to clamp the edge of the substrate; a driver including a shaft extending in one direction and an actuator for moving the shaft in the one direction and rotating the shaft about the one direction; and a connector for connecting the clamping portion to the driver, such that the pair of arms are opened and closed in conjunction with the movement of the shaft in the one direction and rotated in conjunction with the rotation of the shaft.

[0012] The clamping part may include a coupling for hinged connection of a pair of arms.

[0013] Each of the two arms may include: a first region on which the edge of the substrate is held, and a second region extending between the first region and the bonding member to be spaced apart from the edge of the substrate.

[0014] The second region can be stepped relative to the first region.

[0015] The arm may have a groove in the inner surface facing the substrate into which the edge of the substrate is inserted.

[0016] The arm may include a buffer element mounted in the trench.

[0017] The shaft may include: a first shaft that is movable along the one direction and rotates about the one direction, and a second shaft that is coupled to the first shaft to rotate in conjunction with the rotation of the first shaft.

[0018] The actuator may include: a first actuator connected to a first shaft to rotate the first shaft about the direction, and a second actuator for moving the first actuator in the direction to move the first shaft along the direction.

[0019] The device may also include sensors for detecting the movement distance of the first axis and the rotation angle of the second axis.

[0020] According to another exemplary embodiment of the present disclosure, an apparatus for processing a substrate includes: a cavity having a vacuum processing space inside, and means for supporting the substrate as claimed in any one of claims 1 to 9, which is mounted in the cavity to clamp the substrate provided to the processing space, thereby flipping the substrate.

[0021] According to yet another exemplary embodiment of this disclosure, a method for processing a substrate includes: preparing the substrate such that one surface of the substrate faces upward; moving an axis connected to a pair of arms in one direction to clamp an edge of the substrate using the pair of arms; rotating the axis about the one direction to flip the substrate using the pair of arms so that another surface of the substrate faces upward; and moving the axis in the one direction to separate the substrate from the pair of arms.

[0022] The steps of preparing the substrate may include: setting the substrate at the same height as the pair of arms, and moving the substrate horizontally to provide the substrate to the processing space, wherein setting the substrate at the same height as the pair of arms can be performed by measuring the height of the robotic arm that provides the substrate to the processing space.

[0023] In the step of clamping the edge of the substrate, a portion of the edge of the substrate can be clamped.

[0024] The step of clamping the edge of the substrate can be performed by inserting the edge of the substrate into the inner surface of each of the pairs of arms.

[0025] The step of clamping the edge of the substrate can be performed by moving the axis forward from the substrate, and the step of separating the substrate can be performed by moving the axis backward toward the substrate.

[0026] The step of clamping the edge of the substrate may include detecting the distance of axial forward movement, the step of flipping the substrate may include detecting the angle of axial rotation, and the step of separating the substrate may include detecting the distance of axial backward movement.

[0027] The steps of clamping the edge of the substrate and separating the substrate can be performed by rotating each of the two arms relative to one end of the other arm.

[0028] The method may also include moving the pair of arms in the vertical direction or rotating the pair of arms about the vertical direction between the step of clamping the edge of the substrate and the step of separating the substrate.

[0029] Beneficial effects

[0030] According to an exemplary embodiment, the substrate can be stably clamped and flipped by driving the pair of arms due to movement along and rotation about the direction.

[0031] Furthermore, this pair of arms can be provided into the processing space, and the actuators used to drive this pair of arms can be located in a space separate from the processing space to prevent the vacuum state of the processing space from being disrupted, thereby improving the space utilization inside the cavity and minimizing the size of the cavity. Attached Figure Description

[0032] Exemplary embodiments can be understood in detail from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic diagram of an apparatus for supporting a substrate according to an exemplary embodiment of the present disclosure; Figure 2 It shows Figure 1 A schematic diagram of the internal structure of the device used to support the substrate is shown. Figure 3 The accompanying drawing shows the clamping portion of a device for supporting a substrate in an open state according to an exemplary embodiment of the present disclosure; Figure 4 A drawing shows the clamping portion of a device for supporting a substrate in a closed state, according to an exemplary embodiment of the present disclosure; and Figure 5 A schematic diagram is shown of a clamping portion of a device for supporting a substrate according to an exemplary embodiment of the present disclosure in a rotating state. Detailed Implementation

[0033] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. However, the present disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided instead to make the present disclosure thorough and complete, and to fully convey the scope of the disclosure to those skilled in the art to which it pertains.

[0034] It should also be understood that when a layer, membrane, region, or plate is referred to as being "on" another, it can be located directly on the other, or one or more intermediate layers, membranes, regions, or plates may exist.

[0035] Furthermore, for ease of description, spatially relative terms such as "above" or "upper" and "below" or "lower" may be used herein to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings. It should be understood that the spatially relative terms are intended to cover different orientations of the device other than those depicted in the figures during use or operation. For the sake of detailed explanation of this disclosure, the drawings may be exaggerated, and the same reference numerals in the drawings denote the same elements.

[0036] Figure 1 This is a schematic diagram of an apparatus for supporting a substrate according to an exemplary embodiment of the present disclosure, and Figure 2 It shows Figure 1 A schematic diagram of the internal structure of the device used to support the substrate is shown.

[0037] Reference Figure 1 and Figure 2 The device for supporting the substrate can be a substrate support device capable of clamping the substrate to flip the substrate, and may include a clamping part 100 that can be opened and closed to clamp the edge of the substrate, a driver 200 including a shaft 210 extending in one direction and actuators 230, 240 for moving the shaft in that one direction and rotating the shaft 210 about that one direction, and a connecting member 300 connecting the clamping part 100 to the driver 200 so that the opening and closing of the pair of arms 110 is linked to the movement of the shaft 210 in that one direction and is linked to the rotation of the shaft 210.

[0038] The substrate support device can be installed in various spaces where substrates need to be clamped and flipped. For example, the substrate support device can be installed in a cavity of a processing space used to process substrates under atmospheric pressure or a set pressure. Furthermore, the substrate support device can be installed in a vacuum processing space. In this case, the substrate support device can be installed in a cavity such that the clamping part 100 is positioned in the vacuum processing space, and the actuators 230 and 240 can be installed in the cavity in a space separated from the processing space, such as a space separated from the processing space to become an atmospheric state rather than a vacuum state. To mount the substrate support device in various shapes, the substrate support device may include a housing portion 400 capable of internally accommodating at least a portion of the actuator 200. The housing portion 400 may include a first housing 410 accommodating at least a portion of the shaft 210 and coupled to the cavity, a second housing 430 spaced apart from the first housing, and a bellows 420 connecting the first housing 410 to the second housing 430.

[0039] The clamping portion 100 can clamp the edge of the substrate. The substrate may be a circular or polygonal plate with a predetermined thickness, and the substrate may have one side and another side facing each other. Here, at least one of the one side and the other side of the substrate may be a surface to be processed (hereinafter referred to as the processed surface) for substrate processing such as deposition, etching, annealing, curing, cleaning, oxide removal, etc. If the clamping portion 100 clamps the processed surface of the substrate, it may have a negative impact on the substrate processing. That is, if the clamping portion 100 clamps the processed surface before the substrate processing, the substrate may not be processed with the required quality, and if the clamping portion 100 clamps the processed surface after the substrate processing, the condition of the processed substrate may deteriorate. Therefore, the clamping portion 100 can clamp the edge of the substrate to minimize any adverse effects on the substrate processing.

[0040] The clamping portion 100 may include the pair of arms 110. Here, each arm 110 may include a clamping arm 112 capable of clamping the edge of a substrate and an operating arm 114 having one end connected to the clamping arm 112 and extending in a direction intersecting the clamping arm 112. In addition, the clamping portion 100 may also include a first coupling member 120 for hinged to the other end of the operating arm 114.

[0041] The clamping arm 112 can clamp the edge of the substrate and extends in one direction while the substrate is clamped. For example, when... Figure 1 The pair of arms 110 shown are configured to be spaced apart from each other in the X-axis direction, and the clamping arm 112 can extend in the Y-axis direction while the substrate is clamped. However, the extension direction of the clamping arm 112 is not limited to this, and while the substrate is clamped, the clamping arm 112 can extend in a direction in which one end of the clamping arm 112 is open or closed.

[0042] The clamping arm 112 may have a length that clamps the edge of the substrate. For example, when clamping a circular substrate, the clamping arm 112 may have a length that sets the center of the substrate between a pair of clamping arms 112. Furthermore, when clamping a quadrilateral substrate, the clamping arm 112 may have a length that supports at least a portion of the edge of each of the two sides of the substrate. Here, the clamping arm 112 may have various lengths for all the edges on both sides of the substrate. However, when the length of the clamping arm 112 is unnecessarily increased, the space required for driving the clamping part 100 increases; therefore, the clamping arm 112 may have a minimum length for all or a portion of the edges on both sides of the substrate.

[0043] Here, the clamping arm 112 may include a first region that clamps the edge of the substrate thereon and a second region that extends between the first region and the first coupling member 120 and is spaced apart from the edge of the substrate. For example, when clamping a quadrilateral substrate, this pair of clamping arms 112 may include a first region that clamps the edges of both sides of the substrate thereon and a second region that extends to the first region and is spaced apart from the edges of both sides of the substrate, so that the substrate is accommodated in the clamping arm 112 and spaced apart from the edges of both sides of the substrate. Hereinafter, the first region of the clamping arm 112 capable of clamping the edge of the substrate may be referred to as a clamp, and the second region of the clamping arm 112 that extends and is spaced apart from the edge of the substrate may be referred to as a spacer 112b.

[0044] The clamping arm 112 may include a clamp 112a capable of clamping the edge of a substrate and a spacer 112b connected to the clamp 112a to be spaced apart from the edge of the substrate. For example, when clamping a quadrilateral substrate, the clamp 112a may contact a first region that is a portion of the edge of each of the two sides of the substrate (e.g., a region corresponding to about 1 / 2 to about 2 / 3 of the edge of each of the two sides of the substrate from one end), while the spacer 112b may be connected to the clamp 112a to be spaced apart from a second region that is another portion of the edge of each of the two sides of the substrate (i.e., a region corresponding to about 1 / 2 to about 2 / 3 of the edge of each of the two sides of the substrate from the other end). For this purpose, as shown in the figures, the spacer 112b may be stepped relative to the clamp 112a to be spaced apart from the edge of the substrate.

[0045] As described above, when the clamping arm 112 includes a clamp 112a and a spacer 112b connected to the clamp 112a, the opening angle of the pair of arms 110 required to clamp the substrate can be minimized. For example, if the clamping arm 112 only includes a clamp 112a that contacts the edge of each of the two sides of the substrate, the pair of arms 110 can be opened before clamping the substrate to move the clamp 112a to a position where it does not contact the substrate, so that the substrate is placed between the pair of arms 110. On the other hand, if the clamping arm 112 as described above includes a spacer 112b connected to the clamp 112a to space it from the edge of the substrate, the substrate can be placed in the available space defined by the spacer 112b when the pair of arms 110 is opened to place the substrate, thereby relatively reducing the opening angle of the pair of arms 110. Therefore, when the substrate support device clamps and flips the substrate, the operating radius of the pair of arms 110 can be minimized, and the space utilization inside the cavity can be maximized.

[0046] As described above, the clamp 112a may have a groove H in its inner surface facing the substrate for insertion of the substrate edge. The groove H may be defined by recessing the inner surface of the clamp 112a, and the groove H may extend in the extending direction of the clamp 112a. The thickness of the groove H may be adjusted according to the thickness of the substrate, and the groove H may have the same thickness as the substrate or a thickness greater than the substrate thickness to minimize friction with the substrate.

[0047] The clamp 112a may include a buffer C mounted in the trench H. That is, the clamp 112a may include a buffer C mounted in the trench H to stably support the edge of the substrate and minimize damage to the substrate before and after processing. Multiple buffers C may be configured to be spaced apart from each other along the extension direction of the trench H, or may be configured to extend along the extension direction of the trench H. The buffer C may be made of a material capable of minimizing friction (e.g., polytetrafluoroethylene resin).

[0048] One end of the operating arm 114 can be connected to the clamping arm 112. For example, the operating arm can be integrally formed with and connected to the clamping arm 112. The operating arm 114 can extend between the clamping arm 112 and the first coupling member 120 to operate according to the movement or rotation of the shaft 210, thereby opening or closing the pair of arms 110. For example, the operating arm 114 can extend in a direction intersecting the direction of extension of the clamping arm 112. When the clamping arm 112 extends in the Y-axis direction while the substrate is clamped, the operating arm 114 can be bent at one end of the clamping arm 112 to extend in the X-axis direction. However, the extension direction of the operating arm 114 is not limited to this, and the pair of clamping arms 112 can extend in various directions where the pair of clamping arms 112 are spaced apart from each other within the range where the substrate is clamped.

[0049] The other end of the operating arm 114 is hinged to the first coupling 120. As described above, one end of the operating arm 114 is connected to the clamping arm 112, while the other end (opposite side) of the operating arm 114 is hinged to the first coupling 120. That is, the other end of each of the pair of operating arms 114 is hinged to the first coupling 120. The clamping arm 112 and the operating arm 114 can be rotated using the engagement position of the operating arm 114 with the first coupling 120 as an axis, and therefore, the pair of arms 110 can open or close to clamp or separate the clamped substrate. The first coupling 120 can be connected to the second coupling 220 mounted on one end of the shaft 210 via the connector 300 described below.

[0050] The driver 200 may include a shaft 210 extending in one direction and actuators 230, 240 for moving the shaft 210 in one direction and rotating the shaft 210 about that direction.

[0051] Shaft 210 may extend in one direction (e.g., the Y-axis direction). Shaft 210 may include a first shaft 210a that moves along the one direction and a second shaft 210b that rotates about the one direction, having an internal space defined by the one direction to accommodate the first shaft 210a. That is, the second shaft 210b may have an internal space passing through the second shaft 210b in the Y-axis direction, and the first shaft 210a may be disposed within the internal space of the second shaft 210b to be movable in the Y-axis direction. For example, the first shaft 210a may have a length longer than the second shaft 210b. In this case, the central portion of the first shaft 210a may be accommodated within the internal space of the second shaft 210b, such that one end of the first shaft 210a and the other end are exposed to the outside of the second shaft 210b.

[0052] Here, the second axis 210b can be driven independently, but the first axis 210a can rotate in one direction, and the second axis 210b can rotate in conjunction with the rotation of the first axis 210a. That is, the first axis 210a can move in the Y-axis direction and simultaneously rotate around the Y-axis, while the second axis 210b can be coupled to the first axis 210a so that it is not coupled with the first axis 210a when the first axis 210a moves in the Y-axis direction, but is coupled with the first axis 210a and rotates in the Y-axis direction when the first axis 210a rotates around the Y-axis. As described above, the second axis 210b can be coupled to the first axis 210a via a feather key so that the second axis 210b accommodates the Y-axis movement of the first axis 210a and is coupled with its rotation around the Y-axis. The second coupling 220, which is connected to the first coupling 120, can be mounted at one end of the first shaft 210a, and the structure of the second coupling 220 connected to the clamping part 100 will be described below in relation to the connector 300.

[0053] Actuators 230 and 240 can move the first shaft 210a in one direction and rotate the first shaft 210a about that direction. Here, actuators 230 and 240 may include a first actuator 230 connected to the first shaft 210a to rotate the first shaft 210a about that direction, and a second actuator 240 capable of moving the first actuator 230 in one direction to move the first shaft 210a in that direction.

[0054] The first actuator 230 can be coupled to one end of the first shaft 210a and rotate the first shaft 210a about one direction. As described above, the substrate support device may include a housing portion 400 capable of accommodating at least a portion of the driver 200, and the housing portion 400 may include a first housing 410 accommodating at least a portion of the shaft 210 and coupled to a cavity, a second housing 430 spaced apart from the first housing, and a bellows 420 connecting the first housing 410 to the second housing 430. Here, the first actuator 230 may be mounted as being fixed to the second housing 430 exposing one end of the first shaft 210a. The first actuator 230 may include various drive devices capable of rotating the first shaft 210a, such as a rotary cylinder, a rotary motor, etc.

[0055] The second actuator 240 can be mounted to move the first actuator 230 in one direction, thereby moving the first shaft 210a in that direction. For this purpose, the second actuator 240 can be mounted to connect the first housing 410 to the second housing 430. That is, the first housing 410 can be incorporated into the cavity, and the first housing 410 and the second housing 430 can be spaced apart from each other and connected to each other via a bellows 420. The second actuator 240 can be mounted to change the distance between the first housing 410 and the second housing 430 to move the first actuator 230 in the Y-axis direction. The second actuator 240 may include various drive devices for changing the distance between the first housing 410 and the second housing 430, such as cylinders, linear motors, etc.

[0056] The connector 300 connects the clamping part 100 to the driver 200, so that the pair of arms 110 open and close in conjunction with the movement of the shaft 210 in one direction, and rotate in conjunction with the rotation of the shaft 210. The connector 300 may include a linkage 310 having one end hinged to the operating arm 114 and the other end hinged to the first shaft 210a, and a spacer 320 having one end fixedly connected to the first coupling 120 and the other end fixedly connected to the second shaft 210b.

[0057] Linkage member 310 connects the operating arm 114 to the first shaft 210a, with one end hinged to the operating arm 114 and the other end hinged to the first shaft 210a. Here, one end of linkage member 310 can be connected to the end of the operating arm 114 that is connected to the clamping arm 112. Furthermore, the other end of linkage member 310 can be hinged to the first shaft 210a. As described above, the second coupling member 220 can be mounted on one end of the first shaft 210a. Here, this pair of linkage members 310 can be mounted with one end hinged to the operating arm 114 and the other end hinged to the second coupling member 220, thereby connecting the clamping portion 100 to the driver 200. Spacer member 320 may have one end fixedly connected to the first coupling member 120 and the other end fixedly connected to the second shaft 210b. Therefore, this pair of arms 110 can open and close by movement along the Y-axis of the first shaft 210a, and rotate by rotation about the Y-axis of the second shaft 210b. The operating principle will be referred to... Figures 3 to 5 As described below.

[0058] The substrate support device according to an exemplary embodiment of this disclosure may further include a sensor (not shown) capable of detecting the operating state of the pair of arms 110. The sensor may be mounted on at least one of the pairs of arms 110 to detect the operating state of these arms 110, but the operating state of the pair of arms 110 may also be detected by detecting the travel distance of the first axis 210a and the rotation angle of the second axis 210b. For example, the sensor may be mounted on each of the first actuator 230 and the second actuator 240 to detect the travel distance of the first axis 210a and the rotation angle of the second axis 210b.

[0059] Figure 3 The accompanying drawing shows the clamping portion of a substrate support device according to an exemplary embodiment of the present disclosure in an open state, and... Figure 4 The accompanying drawing shows the clamping portion of a substrate support device in a closed state according to an exemplary embodiment of the present disclosure. Figure 5 A schematic diagram is shown of the clamping portion of a substrate support device according to an exemplary embodiment of the present disclosure in a rotating state.

[0060] Reference Figure 3 The clamping part 100 can initially operate with the pair of arms 110 in an open state to clamp the substrate. For this purpose, the second actuator 240 can operate to move the second housing 430 away from the first housing 410, and thus the bellows 420 can extend. As described above, when the second housing 430 moves away from the first housing 410 via the second actuator 240, the first shaft 210a can move rearward in the Y-axis direction within the second shaft 210b. Therefore, the linkage 310 can pull the operating arm 114, and the clamp 112a connected to the operating arm 114 can also be pulled, thus allowing the pair of arms 110 to open.

[0061] Reference Figure 4 When the substrate is loaded into the processing space, the clamping part 100 can operate to close the pair of arms 110, thereby clamping the substrate. For this purpose, the second actuator 240 can operate to move the second housing 430 toward the first housing 410, and thus the bellows 420 can retract. As described above, when the second housing 430 moves toward the first housing 410 via the second actuator 240, the first shaft 210a can move forward in the Y-axis direction within the second shaft 210b. Therefore, the linkage 310 can push the operating arm 114, and the clamp 112a connected to the operating arm 114 can also be pushed, and thus the pair of arms 110 can be closed.

[0062] Reference Figure 5 When the substrate is clamped, the clamping part 100 can operate to rotate the pair of arms 110, thereby flipping the substrate. For this purpose, the first actuator can operate to rotate the first shaft 210a, and the second shaft 210b can rotate in conjunction with the rotation of the first shaft 210a. Here, since the second shaft 210b is fixedly connected to the first coupling member 120 through the spacer member 320, the first coupling member 120 can rotate in conjunction with the rotation of the second shaft 210b, and the pair of arms 110 connected to the first coupling member 120 can rotate simultaneously to flip the substrate S from one surface S1 facing upwards to the other surface S2 facing upwards.

[0063] As described above, a substrate support device according to an exemplary embodiment of the present disclosure can be included in an apparatus for processing a substrate to flip the substrate. That is, the apparatus for processing a substrate may include a cavity having a vacuum processing space inside, and a substrate support device mounted in the cavity to hold and flip the substrate provided to the processing space.

[0064] For example, a substrate support device can be installed in a cavity so that the clamping part 100 is disposed in a vacuum processing space, and actuators 230 and 240 can be installed in the cavity to be disposed in a space separate from the processing space, such as a space separated from the processing space to become an atmospheric state rather than a vacuum state. That is, the equipment for processing substrates may include multiple vacuum cavities performing various functions, and the substrate support device can be installed in at least one of these vacuum cavities to flip the substrate. That is, the substrate support device can be installed in a cavity that provides a separate space for flipping the substrate. In addition, the substrate support device can be installed in a processing cavity where a substrate processing process is performed, or in a load locking cavity storing the substrate to flip the substrate. Here, the substrate support device can be installed by passing through the wall of each cavity so that the actuators 230 and 240 are disposed outside the cavity. The substrate support device can be installed in a transfer cavity for transferring substrates. Therefore, the apparatus for processing substrates may further include a housing disposed within the transfer cavity to form a receiving space separate from the processing space within the transfer cavity, and the substrate support device may be mounted through the wall of the housing so that the actuators 230, 240 are disposed within the receiving space within the housing. Here, the housing may be mounted to move vertically or rotate about vertically within the transfer cavity. As described above, when the housing is mounted to move vertically or rotate about vertically within the transfer cavity, the clamping portion 100 may be exposed outside the receiving space within the transfer cavity to move vertically or rotate about vertically according to the movement of the housing, thereby replacing the function of a robotic arm.

[0065] The following describes a method for processing a substrate according to an exemplary embodiment of the present disclosure. The method for processing a substrate may be a method for processing a substrate using the aforementioned substrate support device and a substrate processing apparatus. Therefore, descriptions that are repeated above regarding the substrate support device and the substrate processing apparatus will be omitted.

[0066] A method for processing a substrate according to an exemplary embodiment of the present disclosure may include a process of preparing a substrate S in a processing space such that one surface S1 of the substrate S faces upward; a process of moving a shaft 210 mounted through the processing space in one direction to clamp the edge of the substrate S using a pair of arms 110 connected to the shaft 210; a process of rotating the shaft 210 about the one direction to flip the substrate S by the pair of arms 110 so that another surface S2 of the substrate S faces upward; and a process of moving the shaft 210 along the one direction to separate the substrate S from the pair of arms 110.

[0067] In the process of preparing the substrate S, the substrate S can be prepared in the processing space such that one surface S1 faces upward. Here, the process of preparing the substrate S may include setting the substrate S at the same height as the pair of arms 110 and horizontally moving the substrate S to provide it to the processing space.

[0068] The processes of setting the substrate S at the same height as the pair of arms 110 and horizontally moving the substrate S to provide it to the processing space can be performed by a robotic arm that provides the substrate to the substrate support device. Here, the substrate S provided by the robotic arm may need to be provided at the same height as the pair of arms 110 so that the substrate support device can accurately clamp the substrate. For this purpose, the process of setting the substrate S at the same height as the pair of arms 110 can be performed by measuring the height of the robotic arm that provides the substrate S to the processing space.

[0069] By moving the shaft 210, which is installed through the processing space, in one direction, the edge of the substrate S can be clamped using the pair of arms 110 connected to the shaft 210 to perform the process of clamping the edge of the substrate S. First, the pair of arms 110 can operate in an open or closed state. For this purpose, the second actuator 240 can operate to move the second housing 430 toward the first housing 410, and thus the bellows 420 can retract. As described above, when the second housing 430 moves toward the first housing 410 via the second actuator 240, the first shaft 210a can move forward from the substrate S within the second shaft 210b. Therefore, the linkage 310 can push the operating arm 114, and the clamp 112a connected to the operating arm 114 can also be pushed, and thus the pair of arms 110 can be closed. Here, the substrate S can be inserted into and engaged in the groove H formed in the inner surface of each of the pair of arms 110.

[0070] Here, the process of clamping the edge of the substrate S may include a process of detecting the distance the shaft 210 has moved forward. That is, in order to confirm whether the substrate S is accurately clamped by the pair of arms 110, the sensor can confirm whether the shaft 210 has moved to the distance at which the pair of arms 110 are closed. The sensor can be mounted in the second actuator 240 to detect the distance the first shaft 210a has moved.

[0071] In the process of flipping the substrate S, shaft 210 can rotate about one direction to flip the substrate S via the pair of arms 110 so that the other surface S2 of the substrate S faces upward. For this purpose, a first actuator can operate to rotate the first shaft 210a, and the second shaft 210b can rotate in conjunction with the rotation of the first shaft 210a. Here, since the second shaft 210b is fixedly connected to the first coupling member 120 via the spacer member 320, the first coupling member 120 can rotate in conjunction with the rotation of the second shaft 210b. Furthermore, the second coupling member 220 can rotate in conjunction with the rotation of the first shaft 210a, and the linkage member 310 connected to the second coupling member 220 can also rotate together with the second coupling member 220. Therefore, the pair of arms 110, connected to the first coupling member 120 and the linkage member 310, can rotate about one direction to flip the substrate S from one surface S1 facing upward to the other surface S2 facing upward.

[0072] Here, the process of flipping the substrate S may include a process of detecting the rotation angle of the shaft 210. That is, in order to confirm whether the substrate S has been accurately rotated to the direction in which one surface S1 faces upward and the other surface S2 faces upward, a sensor can be used to confirm whether the shaft 210 has been rotated to the angle flipped by this pair of arms 110. The sensor can be mounted on the first actuator 230 to detect the rotation angle of the first shaft 210a.

[0073] In the process of separating the substrate S, the shaft can move in one direction to separate the substrate S from the pair of arms 110. For this purpose, the second actuator 240 can operate to move the second housing 430 away from the first housing 410, and thus, the bellows 420 can extend. As described above, when the second housing 430 is moved away from the first housing 410 by the second actuator 240, the first shaft 210a can move backward in the Y-axis direction within the second shaft 210b. Therefore, the linkage 310 can pull the operating arm 114, and the gripper 112a connected to the operating arm 114 can also be pulled, and thus, the pair of arms 110 can open.

[0074] Here, the process of separating the substrate S may include a process of detecting the distance the shaft 210 has moved backward. That is, in order to confirm whether the substrate S has been accurately separated from the pair of arms 110, the sensor can confirm whether the shaft 210 has moved to the distance the pair of arms 110 have opened. The sensor can be mounted in the second actuator 240 to detect the distance the first shaft 210a has moved.

[0075] As described above, the method for processing the substrate can be performed in various spaces used for flipping the substrate. Furthermore, the method for processing the substrate can be performed in a transfer cavity. Therefore, the method for processing the substrate can include, between the process of clamping the edge of the substrate S and the process of separating the substrate S, a process of moving the pair of arms 110 in the vertical direction or rotating the pair of arms 110 about the vertical direction. For this purpose, a housing providing a receiving space separate from the processing space within the transfer cavity can be further provided inside the transfer cavity, and the substrate support device can be mounted through the wall of the housing so that the actuators 230, 240 are disposed in the receiving space within the housing. Here, the housing can be mounted to move or rotate about the vertical direction within the transfer cavity, and therefore, the pair of arms 110 can be exposed to the outside of the receiving space within the transfer cavity to move or rotate about the vertical direction according to the movement of the housing, thereby replacing the function of a robotic arm.

[0076] Although specific terminology has been used to describe and illustrate particular embodiments, these terms are merely examples used to clearly illustrate the embodiments, and it will therefore be apparent to those skilled in the art to which this disclosure pertains that these embodiments and technical terms can be made and modified in other specific forms without altering the technical concept or essential characteristics. Therefore, it should be understood that simple modifications to these embodiments of this disclosure may fall within the technical spirit of this disclosure.

Claims

1. A device for supporting a substrate, clamping the substrate to flip it, the device comprising: The clamping part includes a pair of arms that can be opened and closed to clamp the edge of the substrate; A drive includes a shaft extending in one direction and an actuator for moving the shaft in one direction and rotating the shaft about the one direction; as well as A connector for connecting the clamping part to the driver so that the pair of arms open and close in linkage with the movement of the shaft in one direction and rotate in linkage with the rotation of the shaft.

2. The apparatus of claim 1, wherein, The clamping part includes a connecting member for hinged connection of the pair of arms.

3. The apparatus of claim 2, wherein, Each of the pair of arms includes: A first region, wherein the edge of the substrate is clamped in the first region; and The second region extends between the first region and the bonding member to be spaced apart from the edge of the substrate.

4. The apparatus of claim 3, wherein, The second region is connected in a stepped manner relative to the first region.

5. The apparatus of claim 3, wherein, The arm has a groove in its inner surface facing the substrate for insertion into the edge of the substrate.

6. The apparatus of claim 5, wherein, The arm includes a buffer element mounted in the trench.

7. The apparatus of claim 2, wherein, The shaft includes: The first axis is movable along and rotatable about the said direction; and The second axis is coupled to the first axis to rotate in conjunction with the rotation of the first axis.

8. The apparatus of claim 7, wherein, The actuator includes: A first actuator, connected to the first shaft, causes the first shaft to rotate about the one direction; and A second actuator is used to move the first actuator in the one direction so that the first shaft moves in the one direction.

9. The apparatus of claim 7 further includes a sensor for detecting the travel distance of the first axis and the rotation angle of the second axis.

10. An apparatus for processing a substrate, comprising: A cavity having a vacuum processing space; as well as The device for supporting the substrate according to any one of claims 1 to 9, the device being mounted in the cavity to clamp the substrate provided to the processing space, thereby flipping the substrate.

11. A method for processing a substrate, comprising: Prepare a substrate such that one surface of the substrate faces upward; Move the shaft connected to the pair of arms in one direction to use the pair of arms to clamp the edge of the substrate; Rotate the axis about one direction to flip the substrate using the pair of arms so that the other surface of the substrate faces upward; as well as The axis is moved along the one direction to separate the substrate from the pair of arms.

12. The method of claim 11, wherein, The steps for preparing the substrate include: The substrate is positioned at the same height as the pair of arms; and The substrate is moved horizontally to provide it to the processing space. The step of setting the substrate at the same height as the pair of arms is performed by measuring the height of the robotic arm that provides the substrate to the processing space.

13. The method of claim 11, wherein, In the step of clamping the edge of the substrate, a portion of the edge of the substrate is clamped.

14. The method of claim 11, wherein, The step of clamping the edge of the substrate is performed by inserting the edge of the substrate into the inner surface of each of the pair of arms.

15. The method of claim 11, wherein, The step of clamping the edge of the substrate is performed by moving the axis forward from the substrate, and The step of separating the substrate is performed by moving the axis backward toward the substrate.

16. The method of claim 15, wherein, The step of clamping the edge of the substrate includes detecting the distance of the axial forward movement. The step of flipping the substrate includes detecting the angle of rotation of the axis; and The step of separating the substrate includes detecting the distance of the axial rearward movement.

17. The method of claim 11, wherein, The steps of clamping the edge of the substrate and separating the substrate are performed by rotating each of the pair of arms around one end of its center.

18. The method of claim 11, further comprising, between the step of clamping the edge of the substrate and the step of separating the substrate, moving the pair of arms in a vertical direction or rotating the pair of arms about a vertical direction.

Citation Information

Patent Citations

  • Substrate inverting apparatus, substrate handling method, and substrate processing apparatus

    KR101384477B1