Method of processing conductive reeds for accelerometer conductive connections

Abstract

This invention belongs to the field of manufacturing technology and relates to a method for processing a conductive hairspring for an accelerometer conductive connection device. The invention includes the following steps: Step 1, removing material processing stress at 400-450℃ and annealing for 24 hours; Step 2, forming the conductive hairspring in one step; Step 3, holding at 80℃ for 12 hours to remove moisture adhering to the conductive hairspring; Step 4, holding at -55℃ for 3 hours, then raising the temperature to +80℃ and holding for 3 hours as one cycle, performing this high and low temperature cycle aging thirty times to remove the forming stress of the conductive hairspring. Using the conductive hairspring processing method of this invention, the conductive hairspring is formed in one step, introducing less assembly stress, improving the rigidity of the conductive hairspring, and ensuring sufficient mechanical strength and shape consistency during long-term operation; the annealing and aging treatment methods improve the environmental resistance of the high-precision accelerometer.

Description

Technical Field

[0001] This invention belongs to the field of manufacturing technology and relates to a method for processing a conductive hairspring used in a conductive connection device for a high-precision accelerometer. Background Technology

[0002] Accelerometers, as inertial sensors widely used in Chinese aircraft, directly affect the motion accuracy of various vehicles due to their annual zero-point repeatability. With the development of my country's aviation, maritime, and aerospace industries, the requirements for accelerometers are becoming increasingly stringent. Military aircraft, for example, have raised the annual zero-point repeatability requirement from the original 10... -3 The g-order level has been increased to 10. -5 On the order of g.

[0003] The performance of the conductive hairspring in the conductive connection device is one of the important factors affecting the annual repeatability of the zero point of the accelerometer. The conductive hairspring must have a strong current carrying capacity and limit the generation of heat; the conductive hairspring must have a certain rigidity and mechanical strength to ensure reliable connection at all points of the conductive connection device; the stress of the conductive hairspring should be released before use so as not to introduce stress into later use.

[0004] The conductive hairspring previously used in the conductive connection device underwent multiple forming processes, which were complex. As a result, in actual use, the conductive hairspring would change shape due to insufficient material strength, causing sudden changes in the zero-point output of the accelerometer. In terms of process, after three major steps of annealing, multiple hairspring forming, and aging treatment, the assembly stress introduced by multiple hairspring forming could not be eliminated after aging treatment. Ultimately, the dynamic and static indicators of the accelerometer were far from meeting the design requirements, becoming a "bottleneck" for further improving the zero-point repeatability of the accelerometer. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for processing the conductive hairspring of the conductive connection device of the accelerometer, which can improve the annual repeatability of the zero position of the accelerometer.

[0006] The technical solution of the present invention is: a method for processing the conductive hairspring of an accelerometer conductive connection device, characterized by comprising the following steps:

[0007] Step 1: Remove the processing stress of the material at a temperature of 400-450℃ and anneal for 24 hours;

[0008] Step two: Form the conductive hairspring in one step;

[0009] Step 3: Keep at 80℃ for 12 hours to remove moisture adhering to the conductive hairspring;

[0010] Step four: Hold at -55℃ for 3 hours, then raise the temperature to +80℃ and hold for 3 hours to complete one cycle. Repeat this high and low temperature cycle thirty times to remove the stress from the conductive hairspring forming process.

[0011] The beneficial effects of this invention are as follows: the conductive hairspring is formed in one step using the processing method of this invention, which introduces less assembly stress compared to the previous multiple forming method, improves the rigidity of the conductive hairspring, and ensures that the conductive hairspring has sufficient mechanical strength and shape consistency during long-term operation; the annealing and aging treatment methods improve the environmental resistance of the high-precision accelerometer; the conductive hairspring treated by this invention can improve the annual stability of the accelerometer by half an order of magnitude. Attached Figure Description

[0012] Figure 1 This is a flowchart of the method for processing the conductive hairspring of the present invention;

[0013] Figure 2 This is a schematic diagram of the installation of a conductive hairspring treated using the conductive hairspring treatment method of the present invention in an accelerometer conductive connection device;

[0014] Among them, 1-swing plate, 2-conductive hairspring, 3-electrode plate, 4-cover. Detailed Implementation

[0015] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0016] See Figure 1 A method for processing the conductive hairspring used in an accelerometer conductive connection device includes the following steps:

[0017] Step 1: The copper-gold alloy strip is subjected to stress-relief annealing in a vacuum furnace. After annealing at 400–450°C for 24 hours, the processing stress of the material is eliminated.

[0018] Step 2: Use a fixture to form the conductive hairspring 2 into a C-shape in one step.

[0019] Step 3: Place the conductive hairspring, along with the clamps, into an 80°C oven and keep it warm for 12 hours to remove the moisture adhering to the conductive hairspring.

[0020] Step four: Hold at -55℃ for 3 hours, then raise the temperature to +80℃ and hold for 3 hours to complete one cycle. Repeat this high and low temperature cycle thirty times to remove the stress from the conductive hairspring forming process.

[0021] See Figure 2This is a schematic diagram of the installation of a conductive hairspring treated using the method of the present invention in an accelerometer conductive connection device. The accelerometer conductive connection device consists of a pendulum 1, a conductive hairspring 2, electrode plates 3, and a cover 4. The electrode plates 3, which are installed concentrically with the pendulum 1, are connected by the conductive hairspring 2. The cover 4 is installed slightly higher than the electrode plates 3 and is also connected by the conductive hairspring 2. The pendulum 1 is located at the bottom of the accelerometer housing. The electrode plates 3 and the cover 4 are installed concentrically with the pendulum 1. The pendulum 1 is circular with two openings at two points around its periphery. The conductive hairspring 2 connects to the electrode plates 3 through these two openings. The electrode plates 3 have a circular opening at their center, which is fitted and fixed to the pendulum 1. The outer circular surface of the cover 4 rests on a protrusion on the inner side of the accelerometer housing. The electrode plates 3 and the cover 4 are connected by the conductive hairspring 2.

Claims

1. A processing method for the conductive reed of the conductive connecting device of an accelerometer, characterized by comprising the following steps: Step 1: removing material processing stress at a temperature of 400-450℃ for annealing treatment for 24 hours; the material is a copper-gold alloy strip; Step 2: one-time forming of the conductive reed using a clamp; Step 3: removing water vapor adhered to the conductive reed by keeping the conductive reed and the clamp at a temperature of 80℃ for 12 hours; Step 4: removing the forming stress of the conductive reed by high-low temperature cycle aging for thirty rounds, each round being keeping at a temperature of -55℃ for 3 hours and then increasing the temperature to +80℃ for 3 hours.

2. The method of claim 1, further characterized by: In Step 2, the conductive reed is one-time formed, and the shape is C-shaped.

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