An integrated optical modulator mounting structure using a lithium niobate substrate

Abstract

This invention pertains to fiber optic device design technology for fiber optic gyroscopes, specifically an integrated optical modulator mounting structure using a lithium niobate substrate. The integrated optical modulator mounting structure of this invention involves bonding the device's working chip to a lithium niobate substrate of the same material, which is then integrally bonded to the bottom of a metal housing. Unlike existing domestic designs that directly bond the working chip to the bottom of the metal housing, this invention improves the device's thermal shock resistance, optimizes thermal conductivity design, and enhances its temperature-dependent performance.

Description

Technical Field

[0001] This invention pertains to the design technology of fiber optic devices for fiber optic gyroscopes, and relates to an integrated optical modulator mounting structure using a lithium niobate substrate. Background Technology

[0002] Currently, in the installation structure design of integrated optical modulators for fiber optic gyroscopes in China, the working chip is directly glued to the base inside the metal housing. (See...) Figure 1 As shown. Lithium niobate is a transparent optoelectronic crystal, relatively hard like quartz, but also brittle, easily broken by heat or mechanical impact. Therefore, the current problems are as follows:

[0003] 1. The working chip is made of lithium niobate and is directly mounted on the bottom of the metal casing. The two materials have a large difference in thermal expansion coefficients, and their thermal expansion volumes cannot be perfectly matched. Under temperature shock, the chip is prone to cracking and breaking.

[0004] 2. Currently, in China, the working chip is partially mounted on a metal housing base, with both ends suspended in the air. (See [reference]). Figure 1 When the external temperature changes, because metal conducts heat faster than air, the two parts of the working chip that are in contact with the metal base and those that are not in contact with the metal base are heated unevenly, forming a temperature field. Lithium niobate crystal is a thermoelectric crystal, which will generate an additional thermoelectric field. The thermoelectric field affects the optoelectronic modulation performance of the device.

[0005] 3. The domestically used chip is partially mounted on a metal housing base, with both ends suspended (see [reference]). Figure 1 When a device is subjected to vibration or impact in the operating environment, generating a shock force, the device chip is prone to breakage.

[0006] To address the numerous issues encountered in the use of the device, new design improvements are needed. Summary of the Invention

[0007] The purpose of this invention is to provide an integrated optical modulator mounting structure using a lithium niobate substrate, which solves the problem of uneven heat conduction in integrated optical modulators and improves the device's adaptability to thermal and vibration environments.

[0008] The technical solution of the present invention is: an integrated optical modulator mounting structure using a lithium niobate substrate, which includes a lithium niobate substrate of the same material and crystal orientation as the integrated optical modulator working chip. The lithium niobate substrate is disposed on a buffer mounting layer of the same material, and the buffer mounting layer is disposed on a metal housing base.

[0009] The entire bottom surface of the lithium niobate substrate is set on the buffer mounting layer, without any suspension.

[0010] The size of the lithium niobate substrate is greater than or equal to that of the working chip.

[0011] Technical effects of the present invention: The present invention installs the device working chip by increasing the temperature buffer of the same material and uniformly transferring the heat, which not only improves the temperature performance of the device, but also improves the adaptability of the device in thermal shock and vibration environments. Attached Figure Description

[0012] Figure 1 This is a diagram showing the current installation of integrated optical modulator chips in China.

[0013] Figure 2 This is an installation diagram of an integrated optical modulator using a lithium niobate substrate.

[0014] In the diagram: 1-Working chip (lithium niobate), 2-Casing base (metal), 3-Lithium niobate substrate (lithium niobate). Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0016] Please see Figure 2 This invention utilizes a lithium niobate substrate in its integrated optical modulator mounting structure. A lithium niobate substrate of the same material and crystal orientation as the working chip of the integrated optical modulator is selected, and the size of the lithium niobate substrate is greater than or equal to that of the working chip. The lithium niobate substrate is bonded to a base within a metal housing, and then the working chip is bonded to the lithium niobate substrate.

[0017] This installation method is equivalent to adding a buffer layer made of the same material as the working chip between the metal casing and the working chip. The coefficient of thermal expansion and the coefficient of thermal conductivity are the same and perfectly matched, which alleviates and releases the impact of external temperature. This not only improves the performance of the device in variable temperature environments, but also enhances the device's environmental tolerance to thermal shock. At the same time, the bottom surface of the working chip is completely bonded to the substrate surface without any suspension, which also improves the device's tolerance to vibration environments.

Claims

1. An integrated optical modulator mounting structure using a lithium niobate substrate, characterized in that, It includes a lithium niobate substrate of the same material and crystal orientation as the integrated optical modulator working chip, the lithium niobate substrate is disposed on a buffer mounting layer of the same material, and the buffer mounting layer is disposed on a metal housing base.

2. The integrated optical modulator mounting structure using a lithium niobate substrate according to claim 1, characterized in that, The entire bottom surface of the lithium niobate substrate is set on the buffer mounting layer, without any suspension.

3. The integrated optical modulator mounting structure using a lithium niobate substrate according to claim 1, characterized in that, The size of the lithium niobate substrate is greater than or equal to that of the working chip.

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