A bioelectric signal sensor and information acquisition device

Abstract

This invention provides a bioelectric signal sensor and information acquisition device, the structure of which includes: a finger positioning end, a device body, an infrared skin temperature sensor, a PPG sensor, connecting lines, and a data display panel. The finger positioning end is located in the upper half of the device body, the infrared skin temperature sensor is located in the middle of the device body, and the PPG sensor is located in the lower half of the device body. The device body is electrically connected to the data display panel through side connecting lines. This invention uses a "three-dimensional octave" information acquisition scheme that fits the palm (three dimensions: wrist, palm, and fingertips; octave: eight acquisition points), far exceeding the monitoring points of a health watch. Each additional detection point increases the amount of feedback data, providing stronger data support for our models and algorithms, thus offering greater development advantages in the breadth and depth of evaluation.

Description

Technical Field

[0001] This invention relates to the field of bioelectric signal sensing technology, and more specifically to a bioelectric signal sensor and information acquisition device. Background Technology

[0002] The pulse reflects the flow of Qi and blood in the human body. It can very intuitively show the strength or weakness of a person's Qi and blood. Through subtle changes in the pulse, it can provide an early warning in the early stages of disease, i.e., the "sub-health" state, and achieve the function of assessing the pre-disease state. However, Traditional Chinese Medicine (TCM) can divide the radial artery into three parts: "cun," "guan," and "chi," each corresponding to different internal organs. Based on the pulse's response, it can accurately distinguish between cold and heat, heat syndromes, deficiency and excess syndromes, and qi and blood disorders. Therefore, traditional Chinese medicine uses the information from the four diagnostic methods of observation, auscultation and olfaction, and inquiry to comprehensively judge the patient's condition. However, the diagnosis of traditional Chinese medicine is highly dependent on the doctor's experience and is very subjective. Different doctors may have serious differences in their experience and feelings. At the same time, traditional Chinese medicine pulse diagnosis still has limitations. It cannot determine the specific type of bacteria / virus, the benign or malignant nature of tumors, or the precise changes in anatomical structures (such as fracture type and vascular plaque size) through simple hand pulse diagnosis. For acute, severe, and traumatic conditions, traditional Chinese medicine has certain limitations and must first rely on modern medical examination methods. Traditional Chinese medicine pulse diagnosis addresses qualitative issues concerning the body's overall functional state, energy balance, and the circulation of qi and blood, but lacks the quantitative and qualitative diagnostic methods sought by modern medicine, which locate the problem at the molecular or cellular level. Therefore, in the context of modern technology, the combination of traditional Chinese medicine pulse diagnosis theory with modern sensing equipment, and the massive data processing of AI models, can provide a more comprehensive and personalized assessment conclusion for each sub-healthy individual, based on traditional Chinese medicine theory, using sensor data as a measuring tool, and using massive data from AI models as clinical experience. Therefore, we will propose a bioelectric signal sensor and information acquisition device to solve the above problems, so as to ensure the accuracy of disease assessment and avoid the situation where there are large differences in the diagnoses of different TCM practitioners. Summary of the Invention

[0003] The technical solution adopted by the present invention to achieve the technical objective is: a bioelectric signal sensor and information acquisition device, the structure of which includes: a finger positioning end, a device body, an infrared skin temperature sensor, a PPG sensor, connecting lines, and a data display board. The finger positioning end is located in the upper half of the device body and the infrared skin temperature sensor is located in the middle of the device body. The PPG sensor is located in the lower half of the device body. The device body is electrically connected to the data display board through the side connecting lines.

[0004] As a further improvement of the present invention, the modules used in the device body, infrared skin temperature sensor, and PPG sensor, the power supply values, and the typical current used are composed of the following parts: The infrared temperature (MLX90632) module has a typical current of 1-3mA (standby <100uA) and a power supply voltage of 3.3V. The typical current of the PPG (MAXM86161 / AFE4404) module is 0.6-2mA (excluding LEDs). PPG LED channel module, typical current is 5-120mA peak / channel (low duty cycle). The typical current of the MCU (nRF52 / ESP32-S3) module is 2-20mA (operating) and <50uA (deep sleep). The above content pertains to the overall power supply and drive, and the power supply recommendations are: 1 3.3V LDO / BUCK + 1 1.8V LDO, LEDs should be used for independent boost or AFE built-in drive, proper grounding and star circuitry should be implemented, and the LED pulse circuit should be separated from the AFE / IR sensor.

[0005] As a further improvement of the present invention, the infrared skin temperature sensor is a non-contact type with a glass / sapphire window, and its specific structure consists of the following components: Transparent window outer diameter: Ø 4.0–5.0 mm (4.5 mm recommended), thickness 0.6–1.0 mm; Window material: Sapphire / IR glass (good near-infrared transmittance 0.8–2.5 µm), AR coating to reduce reflection; Metal pressure ring (stainless steel): outer diameter 1.5–2.0 mm larger than the window, wall thickness 0.5 mm; Window-to-shell clearance (plastic insulation): 0.4–0.8 mm; The PCB footprint below the sensor package is a small circular board (or a 10×10 mm square board) with a diameter of 10–12 mm and a board thickness of 0.8–1.0 mm. Window-to-chip optical clearance: 0.5–1.5 mm (to avoid scratches and control the field of view).

[0006] As a further improvement of the present invention, the PPG sensor has a centrally located window, and the LED and PD are integrated or separate. Its specific structure consists of the following components: Window / Black Window Outer Diameter: Ø 6.0–8.0 mm (7 mm recommended), Cover Thickness 0.5–0.8 mm (Polycarbonate + Black Light-Absorbing Coating or Black Glass); LED and PD center-to-center: 1.5–3.0 mm (to avoid light crosstalk and fit the curved surface); PPG small boards: 10–12 mm round boards (or 10×12 mm oval / square boards), board thickness 0.8–1.0 mm; Metal-segmented semi-ring to the plastic isolation strip of the window: ≥0.6 mm (electrical isolation + sweat-proof); The above dimensions match the current appearance: a Ø4.5 mm transparent window can be placed in the middle ring; a Ø7 mm PPG window is left in the middle of the lower half ring.

[0007] As a further improvement of the present invention, the device and electrical parameters of the infrared skin temperature sensor are as follows: Recommended chips (choose one of three): a. Melexis MLX90632 (SMD, ultra-compact 3×3×1 mm, FoV≈50°, I 2 C); b. Melexis MLX90614 (TO-39 round can, Ø8.5 mm, FoV multiple versions, I) 2 C); c.ams / TE type thermal radiation / thermopile (microlenses can be added if a narrower FoV is required); Power supply: 3.3 V (2.7–3.6 V for some); operating current ~1–3 mA (standby tens of µA); Interface: I 2 C (100 / 400 kHz), can be connected to the main MCU bus; Calibration: It has been done once at the factory, but the whole machine still needs to be compensated for window transmittance and self-heating of the casing; Optics: Select glass / sapphire with good near-infrared transmittance as the window material; AR coating can significantly enhance signal-to-noise ratio.

[0008] As a further improvement of the present invention, the PPG (heart rate / SpO2) of the PPG sensor is: Integrated optical module (smallest size, quick to use): a. Maxim MAXM86161 (3.5×5.6×1.3 mm, including 3-channel LED driver + PD + AFE, I 2 C) b. ams AS7050 (AFE + multi-channel LED driver, more flexible when external LED / PD is required); Discrete solution (allows for stronger luminescence, better suited for thicker skin / strong sunlight): d.AFE: TI AFE4404 / AFE4950 or ADI ADPD4100 / 4101 e. LED: Osram SFH 7060 / 7070 / 7072 (Green / Red / IR combination) f.PD: Osram / Excelitas high-sensitivity silicon photodiode (area 1.5–3 mm²) 2 ) ; Power supply: Digital 1.8 V / 3.3 V, LED driver 3.0–5.0 V (see LED Vf); LED pulse current: 5–30 mA (common), peak 50–120 mA (pulse width 50–400 µs, sampling 25–200 Hz, adjustable); Black window material: matte PC / black glass, with anti-light-crossing grooves and black glue on the inside, and a slight convexity of 0.2–0.3 mm on the outside for easy skin application.

[0009] As a further improvement of the present invention, the PCB and stack in the device body, infrared skin temperature sensor, and PPG sensor are as follows: Central IR board: Circular board Ø 10–12 mm (thickness 0.8–1.0 mm), top layer chip + pads, back side can be used for temperature-compensated NTC and shielding ground; leave ≥0.5 mm plastic ribs around the perimeter; PPG small board: round board Ø 10–12 mm, black window with a central opening of 4–6 mm, LEDs and PDs on the left and right or in a ring, light-blocking wall height 0.6–1.0 mm (3D printed / injection molded black parts); Main control motherboard: Based on the overall thickness of the machine, a size of 20–30 mm × 30–40 mm and a thickness of 1.0 mm are recommended; the IR / PPG small board should be connected using FFC / BTB. Shielding: Use plastic pillars rather than metal parts above the PPG AFE to avoid coupling; add a metal shield if necessary (but keep a distance from the antenna / magnetic device).

[0010] As a further improvement of the present invention, the materials and isolation of the device body, infrared skin temperature sensor, and PPG sensor are as follows: Window bonding: UV adhesive / epoxy glue is applied between the IR window and the stainless steel ring, leaving a 0.2–0.3 mm circumferential adhesive gap; verified at 85 ℃ / 85%RH; Thermal isolation: An air gap / thermal insulation foam is added between the IR board and the motherboard to prevent the motherboard's heat from affecting the circuitry. Waterproofing: O-ring or double-sided sealing can be installed at the window and dark window locations, aiming for IPX4–IPX7 rating.

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention uses a "three-dimensional octave" information collection scheme that fits the palm (three dimensions: wrist, palm, and fingertips; octave: eight collection points), which far exceeds the monitoring points of a health watch. Each additional detection point increases the amount of feedback data, providing stronger data support for our models and algorithms, thus giving us a greater advantage in terms of the breadth and depth of evaluation.

[0012] 2. The three-dimensional detection of this invention is not merely an increase in the number of detection data points, but also a formation of data difference changes through the values ​​taken from the wrist, palm, and fingertips, presenting a three-dimensional data model. The interaction of three-dimensional data constructs a concrete logical relationship between blood pressure, pulse, power, and frequency, providing endless health insights. Attached Figure Description

[0013] Figure 1 This is a structural schematic diagram of a bioelectric signal sensor and information acquisition device.

[0014] Figure 2 This is a schematic representation of a device body, an infrared skin temperature sensor, a PPG sensor module, power supply values, and typical current data used.

[0015] In the diagram: finger positioning end-1, device body-2, infrared skin temperature sensor-3, PPG sensor-4, connecting line-5, data display board-6. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings: Example: Figures 1 to 2 As shown: This invention provides a bioelectrical signal sensor and an information acquisition device. Its structure includes: a finger positioning end 1, a device body 2, an infrared skin temperature sensor 3, a PPG sensor 4, a connecting line 5, and a data display board 6. The finger positioning end 1 is located in the upper half of the device body 2, the infrared skin temperature sensor 3 is located in the middle of the device body 2, and the PPG sensor 4 is located in the lower half of the device body 2. The device body 2 is electrically connected to the data display board 6 through the side connecting line 5.

[0017] The modules, power supply values, and typical current used by the device body 2, infrared skin temperature sensor 3, and PPG sensor 4 are composed of the following parts: The infrared temperature (MLX90632) module has a typical current of 1-3mA (standby <100uA) and a power supply voltage of 3.3V. The typical current of the PPG (MAXM86161 / AFE4404) module is 0.6-2mA (excluding LEDs). PPG LED channel module, typical current is 5-120mA peak / channel (low duty cycle). The typical current of the MCU (nRF52 / ESP32-S3) module is 2-20mA (operating) and <50uA (deep sleep). The above content pertains to the overall power supply and drive, and the power supply recommendations are: 1 3.3V LDO / BUCK + 1 1.8V LDO, LEDs should be used for independent boost or AFE built-in drive, proper grounding and star circuitry should be implemented, and the LED pulse circuit should be separated from the AFE / IR sensor.

[0018] The infrared skin temperature sensor 3 is a non-contact type with a glass / sapphire window, and its specific structure consists of the following components: Transparent window outer diameter: Ø 4.0–5.0 mm (4.5 mm recommended), thickness 0.6–1.0 mm; Window material: Sapphire / IR glass (good near-infrared transmittance 0.8–2.5 µm), AR coating to reduce reflection; Metal pressure ring (stainless steel): outer diameter 1.5–2.0 mm larger than the window, wall thickness 0.5 mm; Window-to-shell clearance (plastic insulation): 0.4–0.8 mm; The PCB footprint below the sensor package is a small circular board (or a 10×10 mm square board) with a diameter of 10–12 mm and a board thickness of 0.8–1.0 mm. Window-to-chip optical clearance: 0.5–1.5 mm (to avoid scratches and control the field of view).

[0019] The PPG sensor 4 has a centrally located window and is either an integrated LED and a separate LED+PD unit. Its specific structure consists of the following components: Window / Black Window Outer Diameter: Ø 6.0–8.0 mm (7 mm recommended), Cover Thickness 0.5–0.8 mm (Polycarbonate + Black Light-Absorbing Coating or Black Glass); LED and PD center-to-center: 1.5–3.0 mm (to avoid light crosstalk and fit the curved surface); PPG small boards: 10–12 mm round boards (or 10×12 mm oval / square boards), board thickness 0.8–1.0 mm; Metal-segmented semi-ring to the plastic isolation strip of the window: ≥0.6 mm (electrical isolation + sweat-proof); The above dimensions match the current appearance: a Ø4.5 mm transparent window can be placed in the middle ring; a Ø7 mm PPG window is left in the middle of the lower half ring.

[0020] The device and electrical parameters of the infrared skin temperature sensor 3 are as follows: Recommended chips (choose one of three): a. Melexis MLX90632 (SMD, ultra-compact 3×3×1 mm, FoV≈50°, I 2 C); b. Melexis MLX90614 (TO-39 round can, Ø8.5 mm, FoV multiple versions, I) 2 C); c.ams / TE type thermal radiation / thermopile (microlenses can be added if a narrower FoV is required); Power supply: 3.3 V (2.7–3.6 V for some); operating current ~1–3 mA (standby tens of µA); Interface: I 2 C (100 / 400 kHz), can be connected to the main MCU bus; Calibration: It has been done once at the factory, but the whole machine still needs to be compensated for window transmittance and self-heating of the casing; Optics: Select glass / sapphire with good near-infrared transmittance as the window material; AR coating can significantly enhance signal-to-noise ratio.

[0021] Wherein, the PPG (heart rate / SpO2) of the PPG sensor 4 is: Integrated optical module (smallest size, quick to use): a. Maxim MAXM86161 (3.5×5.6×1.3 mm, including 3-channel LED driver + PD + AFE, I 2 C) b. ams AS7050 (AFE + multi-channel LED driver, more flexible when external LED / PD is required); Discrete solution (allows for stronger luminescence, better suited for thicker skin / strong sunlight): g.AFE: TI AFE4404 / AFE4950 or ADI ADPD4100 / 4101 h. LED: Osram SFH 7060 / 7070 / 7072 (Green / Red / IR combination) i.PD: Osram / Excelitas high-sensitivity silicon photodiode (area 1.5–3 mm²)2 ) ; Power supply: Digital 1.8 V / 3.3 V, LED driver 3.0–5.0 V (see LED Vf); LED pulse current: 5–30 mA (common), peak 50–120 mA (pulse width 50–400 µs, sampling 25–200 Hz, adjustable); Black window material: matte PC / black glass, with anti-light-crossing grooves and black glue on the inside, and a slight convexity of 0.2–0.3 mm on the outside for easy skin application.

[0022] The PCB and stacking of the device body 2, infrared skin temperature sensor 3, and PPG sensor 4 are as follows: Central IR board: Circular board Ø 10–12 mm (thickness 0.8–1.0 mm), top layer chip + pads, back side can be used for temperature-compensated NTC and shielding ground; leave ≥0.5 mm plastic ribs around the perimeter; PPG small board: round board Ø 10–12 mm, black window with a central opening of 4–6 mm, LEDs and PDs on the left and right or in a ring, light-blocking wall height 0.6–1.0 mm (3D printed / injection molded black parts); Main control motherboard: Based on the overall thickness of the machine, a size of 20–30 mm × 30–40 mm and a thickness of 1.0 mm are recommended; the IR / PPG small board should be connected using FFC / BTB. Shielding: Use plastic pillars rather than metal parts above the PPG AFE to avoid coupling; add a metal shield if necessary (but keep a distance from the antenna / magnetic device).

[0023] The materials and insulation of the device body 2, infrared skin temperature sensor 3, and PPG sensor 4 are as follows: Window bonding: UV adhesive / epoxy glue is applied between the IR window and the stainless steel ring, leaving a 0.2–0.3 mm circumferential adhesive gap; verified at 85 ℃ / 85%RH; Thermal isolation: An air gap / thermal insulation foam is added between the IR board and the motherboard to prevent the motherboard's heat from affecting the circuitry. Waterproofing: O-ring or double-sided sealing can be installed at the window and dark window locations, aiming for IPX4–IPX7 rating.

[0024] The specific functions and operation procedures of this embodiment are as follows: In this invention, the main body 2 of the bioelectric signal sensor and information acquisition device can be electrically connected to the data display board 6 via the connecting line 5. The data display board 6 then controls the main body 2. This allows for the integration of traditional Chinese medicine pulse diagnosis theory with modern sensing equipment during patient diagnosis. By using a large AI model to process massive amounts of data, a more comprehensive and personalized assessment conclusion can be obtained for each sub-healthy individual, based on traditional Chinese medicine theory, sensor data, and massive AI model data for clinical experience. This improves diagnostic accuracy. Patients can place their hands on the main body 2, with their fingers in contact with the finger positioning end 1, and their palm and pulse points in contact with the infrared skin temperature sensor 3 and PPG sensor 4, respectively. This achieves a "three-dimensional eight-degree" information acquisition scheme (three dimensions: wrist, palm, and fingertips; eight degrees: eight acquisition points), far exceeding the monitoring points of a health watch. Each additional detection point provides feedback... The increase in data quantity provides stronger data support for our models and algorithms, giving us a greater advantage in terms of breadth and depth of assessment. The current 3D detection is not just about increasing the number of data points, but also about creating data difference changes through the values ​​taken from the wrist, palm, and fingertips, presenting a three-dimensional data model. The interaction of 3D data constructs a concrete logical relationship between blood pressure, pulse, dynamics, and frequency, providing endless health insights. The detected data is fed back to the data display panel 6, enabling rapid and accurate diagnosis of the patient's condition. This improves the accuracy of TCM diagnosis and avoids significant differences in diagnoses from different TCM practitioners. The current device combines TCM pulse diagnosis theory with modern sensing equipment, and through massive data processing using AI large models, it obtains a more comprehensive and personalized assessment conclusion for each sub-healthy individual, based on TCM theory, using sensor data as a measuring scale, and using massive AI large model data as clinical experience. Currently, we have conducted over 30 million tests on more than 1.1 million people. Through extensive user tracking and research, we have assessed that the accuracy rate of our reports exceeds 81%. In some diagnostic conclusions, our accuracy far surpasses the average level of veteran TCM practitioners with 30 years of experience. As the amount of data fed in increases, we continuously improve our models, enhance hardware compatibility, and improve sensing accuracy. We believe that within three years, our hand diagnosis device will achieve even greater technological advancements, utilizing TCM combined with technology to serve the health of all humanity.

[0025] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solutions described in this invention, or by designing similar technical solutions by those skilled in the art under the inspiration of the technical solutions described in this invention, falls within the protection scope of this invention.

Claims

1. A bioelectric signal sensor and information acquisition device, the structure of which includes: The device comprises a finger positioning end (1), a device body (2), an infrared skin temperature sensor (3), a PPG sensor (4), a connecting line (5), and a data display panel (6). The finger positioning end (1) is located on the upper half of the device body (2), the infrared skin temperature sensor (3) is located in the middle of the device body (2), and the PPG sensor (4) is located on the lower half of the device body (2). The device body (2) is electrically connected to the data display panel (6) via the side connecting line (5). The device body is characterized by: The modules, power supply values, and typical current used in the device body (2), infrared skin temperature sensor (3), and PPG sensor (4) consist of the following parts: The infrared temperature (MLX90632) module has a typical current of 1-3mA (standby <100uA) and a power supply voltage of 3.3V. The typical current of the PPG (MAXM86161 / AFE4404) module is 0.6-2mA (excluding LEDs). PPG LED channel module, typical current is 5-120mA peak / channel (low duty cycle). The typical current of the MCU (nRF52 / ESP32-S3) module is 2-20mA (operating) and <50uA (deep sleep). The above content pertains to the overall power supply and drive, and the power supply recommendations are: 1 3.3V LDO / BUCK + 1 1.8V LDO, LEDs should be used for independent boost or AFE built-in drive, proper grounding and star circuitry should be implemented, and the LED pulse circuit should be separated from the AFE / IR sensor.

2. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: The infrared skin temperature sensor (3) is a non-contact type with a glass / sapphire window, and its specific structure consists of the following components. composition: Transparent window outer diameter: Ø 4.0–5.0 mm (4.5 mm recommended), thickness 0.6–1.0 mm; Window material: Sapphire / IR glass (good near-infrared transmittance 0.8–2.5 µm), AR coating to reduce reflection; Metal pressure ring (stainless steel): outer diameter 1.5–2.0 mm larger than the window, wall thickness 0.5 mm; Window-to-shell clearance (plastic insulation): 0.4–0.8 mm; The PCB footprint below the sensor package is a small circular board (or a 10×10 mm square board) with a diameter of 10–12 mm and a board thickness of 0.8–1.0 mm. Optical clearance from window to chip: 0.5–1.5 mm (to avoid scratches and control the field of view).

3. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: The PPG sensor (4) has a central window and is either an integrated LED+PD unit or separate components. Its specific structure consists of the following parts: composition: Window / Black Window Outer Diameter: Ø 6.0–8.0 mm (7 mm recommended), Cover Thickness 0.5–0.8 mm (Polycarbonate + Black Light-Absorbing Coating or Black Glass); LED and PD center-to-center: 1.5–3.0 mm (to avoid light crosstalk and fit the curved surface); PPG small boards: 10–12 mm round boards (or 10×12 mm oval / square boards), board thickness 0.8–1.0 mm; Metal-segmented semi-ring to the plastic isolation strip of the window: ≥0.6 mm (electrical isolation + sweat-proof); The above dimensions match the current appearance: a Ø4.5 mm transparent window can be placed in the middle ring; a Ø7 mm PPG window is left in the middle of the lower half ring.

4. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: The device and electrical parameters of the infrared skin temperature sensor (3) are as follows: Recommended chips (choose one of three): a. Melexis MLX90632 (SMD, ultra-compact 3×3×1 mm, FoV≈50°, I 2 C); b. Melexis MLX90614 (TO-39 round can, Ø8.5 mm, FoV multiple versions, I) 2 C); c.ams / TE type thermal radiation / thermopile (microlenses can be added if a narrower FoV is required); Power supply: 3.3 V (2.7–3.6 V for some); operating current ~1–3 mA (standby tens of µA); Interface: I 2 C (100 / 400 kHz), can be connected to the main MCU bus; Calibration: It has been done once at the factory, but the whole machine still needs to be compensated for window transmittance and self-heating of the casing; Optics: Select glass / sapphire with good near-infrared transmittance as the window material; AR coating can significantly enhance signal-to-noise ratio.

5. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: PPG (heart rate / SpO2) of the PPG sensor (4): Integrated optical module (smallest size, quick to use): a. Maxim MAXM86161 (3.5×5.6×1.3 mm, including 3-channel LED driver + PD + AFE, I 2 C) b. ams AS7050 (AFE + multi-channel LED driver, more flexible when external LED / PD is required); Discrete solution (allows for stronger luminescence, better suited for thicker skin / strong sunlight): a.AFE: TI AFE4404 / AFE4950 or ADI ADPD4100 / 4101 b. LED: Osram SFH 7060 / 7070 / 7072 (Green / Red / IR combination) c.PD: Osram / Excelitas high-sensitivity silicon photodiode (area 1.5–3 mm²) 2 ) ; Power supply: Digital 1.8 V / 3.3 V, LED driver 3.0–5.0 V (see LED Vf); LED pulse current: 5–30 mA (common), peak 50–120 mA (pulse width 50–400 µs, sampling 25–200 Hz, adjustable); Black window material: matte PC / black glass, with anti-light-crossing grooves and black glue on the inside, and a slight convexity of 0.2–0.3 mm on the outside for easy skin application.

6. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: The PCB and stacking of the device body (2), infrared skin temperature sensor (3), and PPG sensor (4): Central IR board: Circular board Ø 10–12 mm (thickness 0.8–1.0 mm), top layer chip + pads, back side can be used for temperature-compensated NTC and shielding ground; leave ≥0.5 mm plastic ribs around the perimeter; PPG small board: round board Ø 10–12 mm, black window with a central opening of 4–6 mm, LEDs and PDs on the left and right or in a ring, light-blocking wall height 0.6–1.0 mm (3D printed / injection molded black parts); Main control motherboard: Based on the overall thickness of the machine, a size of 20–30 mm × 30–40 mm and a thickness of 1.0 mm are recommended; the IR / PPG small board should be connected using FFC / BTB. Shielding: Use plastic pillars rather than metal parts above the PPG AFE to avoid coupling; add a metal shield if necessary (but keep a distance from the antenna / magnetic device).

7. The bioelectric signal sensor and information acquisition device according to claim 1, characterized in that: Materials and isolation of the device body (2), infrared skin temperature sensor (3), and PPG sensor (4): Window bonding: UV adhesive / epoxy glue is applied between the IR window and the stainless steel ring, leaving a 0.2–0.3 mm circumferential adhesive gap; verified at 85 ℃ / 85%RH; Thermal isolation: An air gap / thermal insulation foam is added between the IR board and the motherboard to prevent the motherboard's heat from affecting the circuitry. Waterproofing: O-ring or double-sided sealing can be installed at the window and dark window locations, aiming for IPX4–IPX7 rating.

Images