A flexible brain-computer interface electrode and its preparation method

Abstract

This invention provides a flexible brain-computer interface electrode and its fabrication method, relating to the field of brain-computer interface technology. It solves the problems of weak bending resistance, lack of implantation cushioning, poor long-term stability, and complex manufacturing processes inherent in implantable brain-computer interface electrodes. The fabrication method includes: obtaining a base material for an inner support core tube and an electrode layer; forming metal wires and electrode sites on the base material to obtain an electrode layer; uniformly spirally winding the electrode layer around the outer surface of the inner support core tube at a predetermined pitch to obtain a first electrode core; encapsulating the first electrode core with an outer layer of silicone to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer; and performing post-processing on the flexible brain-computer interface electrode blank to obtain a flexible brain-computer interface electrode with an outer encapsulation layer. The solution of this invention achieves buffer protection, bending resistance, and tensile strength of the electrode, while ensuring simple manufacturing processes, mass production feasibility, and improved long-term implantation stability and biocompatibility.

Description

Technical Field

[0001] This invention relates to the field of brain-computer interface technology, and in particular to a flexible brain-computer interface electrode and its preparation method. Background Technology

[0002] Brain-computer interface (BCI) is a core technology connecting the brain to external devices. Implantable electrodes, as key components for signal transmission, directly determine the stability and long-term service capability of the BCI. Currently, most existing implantable BCI electrodes adopt planar laying or straight wire structures, which have the following technical defects in practical applications: poor stability during implantation: when electrodes are implanted into brain tissue, they need to withstand a certain puncture force. Existing structures lack a buffering mechanism, which can easily lead to electrode displacement, deformation, or even damage to brain tissue; insufficient resistance to bending and fatigue: when the electrodes themselves are bent or twisted, straight wire or planar electrodes are prone to tensile and shear stress, leading to electrode wire breakage, decreased conductivity, and inability to work stably for a long time. Summary of the Invention

[0003] This invention provides a flexible brain-computer interface electrode and its preparation method, which solves the problems of weak bending resistance, lack of implantation buffer, poor long-term stability, and complex manufacturing process of implantable brain-computer interface electrodes.

[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: This invention provides a method for fabricating a flexible brain-computer interface electrode, comprising: Obtain the substrate material for the inner support core tube and electrode layer; Metal wires and electrode sites are formed on the substrate material to obtain an electrode layer; The electrode layer is spirally wound uniformly around the outer surface of the inner support core tube with a preset pitch to obtain the first electrode core. The first electrode core is encapsulated with an outer layer of silicone to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer. The flexible brain-computer interface electrode blank is post-processed to obtain a flexible brain-computer interface electrode with an outer encapsulation layer.

[0005] Optionally, an inner support core tube may be obtained, including: Obtain the silicone tube of the material corresponding to the inner support core tube; The silicone tube is cut to a preset length to obtain the inner support core tube rough fitting; The inner support core tube is obtained by ultrasonic cleaning of the outer surface of the inner support core tube fitting with anhydrous ethanol.

[0006] Optionally, the electrode layer is spirally wound uniformly around the outer surface of the inner support core tube at a preset pitch to obtain a first electrode core, comprising: The electrode layer is spirally wound evenly around the outer surface of the inner support core tube with a preset pitch, and is temporarily fixed by a bio-adhesive of a preset material during the winding process, forming the first electrode core.

[0007] Optionally, the first electrode core is encapsulated with an outer layer of silicone to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer, comprising: The first electrode core is placed into a preset mold and a preset liquid silicone is injected to obtain the preset mold after the liquid silicone is injected. The pre-formed mold after being injected with liquid silicone is placed in a vacuum drying oven for vacuum degassing treatment to obtain the pre-formed mold after vacuum degassing treatment. The pre-designed mold, after vacuum degassing, is placed in a constant temperature oven for curing to obtain a flexible brain-computer interface electrode blank.

[0008] Optionally, the preset mold includes: A cylindrical shell, wherein a cavity is provided inside the cylindrical shell; A retaining ring is disposed at one end of the accommodating cavity and is fixedly connected to the interior of the cylindrical shell; In use, the inner support core tube is placed in the receiving cavity, and one end of the inner support core tube passes through the retaining ring, so that the retaining ring is sleeved on the inner support core tube and contacts and connects with the side wall of the inner support core tube.

[0009] Optionally, the flexible brain-computer interface electrode blank is post-processed to obtain a flexible brain-computer interface electrode with an outer encapsulation layer, including: Excess silicone on both ends and the surface of the flexible brain-computer interface electrode blank is corrected to expose the electrode sites on the electrode layer of the inner support core tube and the lead-out ends of the metal wires, thus obtaining a flexible brain-computer interface electrode with an outer encapsulation layer.

[0010] This invention provides a flexible brain-computer interface electrode, which is prepared using the method described above. The flexible brain-computer interface electrode comprises: Inner support core tube; Electrode layer disposed on the inner support core tube; An outer encapsulation layer that wraps around the inner support core tube and the electrode layer; The inner support core tube is a silicone tube; The electrode layer is a long strip-shaped flexible electrode, and the electrode layer is uniformly wound in a spiral winding manner on the outer surface of the inner support core tube. The outer encapsulation layer is made of silicone.

[0011] Optionally, the electrode layer includes: A substrate film disposed on the inner support core tube; Metal wires embedded within the substrate film; Electrode sites are located at one end of the substrate film.

[0012] Optionally, the substrate film is a flexible biocompatible material.

[0013] Optionally, the pitch of the spiral winding is greater than the width of the electrode layer.

[0014] The above-described solution of the present invention has at least the following beneficial effects: The method for fabricating the flexible brain-computer interface electrode of the present invention includes: obtaining a base material for an inner support core tube and an electrode layer; forming metal wires and electrode sites on the base material to obtain an electrode layer; uniformly spirally winding the electrode layer around the outer surface of the inner support core tube with a preset pitch to obtain a first electrode core; performing an outer silicone potting treatment on the first electrode core to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer; and performing post-processing on the flexible brain-computer interface electrode blank to obtain a flexible brain-computer interface electrode with an outer encapsulation layer. The solution of the present invention achieves buffer protection, bending resistance, and tensile resistance of the electrode, while ensuring simple processing, mass production capability, and improving the long-term implantation stability and biocompatibility of the electrode. Attached Figure Description

[0015] Figure 1 This is a schematic flowchart of the preparation method of the flexible brain-computer interface electrode of the present invention; Figure 2 This is a partial vertical cross-sectional view of the flexible brain-computer interface electrode of the present invention; Figure 3 This is a schematic diagram of the structure of the electrode layer of the flexible brain-computer interface electrode of the present invention after winding; Figure 4 This is a schematic diagram of the structure of the flexible brain-computer interface electrode of the present invention during the outer silicone potting process; Explanation of reference numerals in the attached figures: 1. Inner support core tube; 2. Electrode layer; 21. Substrate film; 22. Metal wire; 23. Electrode site; 3. Outer encapsulation layer; 41. Cylindrical shell; 42. Retaining ring. Detailed Implementation

[0016] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0017] like Figures 1 to 4 As shown, an embodiment of the present invention proposes a method for fabricating a flexible brain-computer interface electrode, comprising: Step 11: Obtain the substrate material of the inner support core tube 1 and the electrode layer 2; Step 12: Form metal wires 22 and electrode sites 23 on the substrate material to obtain electrode layer 2; Step 13: The electrode layer 2 is spirally wound uniformly around the outer surface of the inner support core tube 1 with a preset pitch to obtain the first electrode core. Step 14: Perform an outer silicone potting process on the first electrode core to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer 3. Step 15: Post-process the flexible brain-computer interface electrode blank to obtain a flexible brain-computer interface electrode with an outer encapsulation layer 3.

[0018] In this embodiment, step 12 may specifically include: selecting a flexible biocompatible substrate material (such as polyimide PI, polydimethylsiloxane PDMS), and using processes such as photolithography, sputtering, RIE, and baking to prepare metal wires 22 and electrode sites 23 on the substrate material. The metal wires are made of biocompatible metals (such as gold, platinum, iridium), and the electrode sites are circular. After preparation, a long strip flexible electrode, namely electrode layer 2, is obtained.

[0019] The method for preparing the flexible brain-computer interface electrode described in this invention can be used for the rapid preparation of flexible brain-computer interface electrodes. The prepared flexible brain-computer interface electrode has the following advantages: Excellent implantation buffering performance: Its helical winding structure is similar to a spring structure, which can effectively buffer impact and compression forces during electrode puncture and implantation into brain tissue, reducing instantaneous electrode damage, improving implantation success rate, and reducing secondary damage to brain tissue during surgery; Strong bending and tensile resistance: When the electrode as a whole is bent, twisted, or stretched, the helical structure can undergo adaptive deformation to release stress, preventing the metal wires of the flexible electrode from breaking or opening, ensuring the integrity of the electrode's electrical performance, and solving the problem of easy breakage of traditional straight flexible electrodes; High long-term stability: The helical structure can adapt to the physiological micro-movements of brain tissue, reducing the relative shear force between the electrode and brain tissue, and reducing the risk of brain tissue damage. Inflammatory response; simultaneously, the outer silicone encapsulation forms a dense protective layer, preventing electrode corrosion by body fluids, ensuring electrode site non-displacement and signal stability, suitable for long-term implantation; excellent biocompatibility: both the inner support core tube and the outer encapsulation layer are made of medical-grade implantable silicone, the flexible electrode substrate is made of biocompatible materials, and the metal wires are made of biocompatible metals, resulting in high overall compatibility with brain tissue, reducing foreign body reactions and improving implantation safety; simple process and mass production capability: the core process consists of only three steps: flexible electrode preparation, spiral winding, and silicone encapsulation, requiring no complex micro-processing equipment, making operation simple, preparation cost low, and enabling mass production, with good electrode consistency, suitable for large-scale applications; flexible structure and strong adaptability: the diameter and length of the inner support silicone tube, as well as the pitch and angle of the spiral winding, can be adjusted according to the implantation site and requirements to adapt to different brain region implantation needs, making it highly practical.

[0020] In an optional embodiment of the present invention, step 11, obtaining the inner support core tube 1, may include: Step 111: Obtain the silicone tube of the material corresponding to the inner support core tube 1; Step 112: Cut the silicone tube to a preset length to obtain the inner support core tube blank; Step 113: The outer surface of the inner support core tube fitting is ultrasonically cleaned with anhydrous ethanol to obtain the inner support core tube 1.

[0021] In this embodiment, step 11 can specifically be as follows: first, select an implantable silicone tube that meets medical standards, cut it to a preset length according to the implantation requirements, then use anhydrous ethanol to ultrasonically clean the outer surface of the silicone tube to remove impurities and oil stains, and after drying, obtain the inner support core tube rough accessory.

[0022] In an optional embodiment of the present invention, step 13, which involves uniformly spirally winding the electrode layer 2 around the outer surface of the inner support core tube 1 with a preset pitch to obtain a first electrode core, may include: The electrode layer 2 is spirally wound uniformly around the outer surface of the inner support core tube 1 with a preset pitch, and is temporarily fixed by a bio-adhesive of a preset material during the winding process, forming the first electrode core.

[0023] In this embodiment, the bio-adhesive is silicone adhesive. During the winding process, medical bio-adhesive is used for temporary fixation, which can ensure that the electrode layer 2 is tightly attached to the inner support core tube 1 without loosening or wrinkling. After the winding is completed, the spiral wound electrode core, i.e., the first electrode core, can be obtained.

[0024] In an optional embodiment of the present invention, step 14, which involves encapsulating the first electrode core with an outer silicone layer to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer 3, may include: Step 141: Place the first electrode core into a preset mold and inject a preset liquid silicone to obtain the preset mold after injecting the liquid silicone. Step 142: Place the pre-set mold after injecting liquid silicone into a vacuum drying oven for vacuum degassing treatment to obtain the pre-set mold after vacuum degassing treatment. Step 143: Place the pre-set mold after vacuum degassing into a constant temperature oven for curing to obtain a flexible brain-computer interface electrode blank.

[0025] like Figure 4 As shown, the preset mold includes: A cylindrical shell 41, wherein a cavity is provided inside the cylindrical shell 41; A retaining ring 42 is disposed at one end of the accommodating cavity and is fixedly connected to the interior of the cylindrical housing 41; In use, the inner support core tube 1 is placed in the receiving cavity, and one end of the inner support core tube 1 passes through the retaining ring 42, so that the retaining ring 42 is sleeved on the inner support core tube 1 and contacts and connects with the side wall of the inner support core tube 1.

[0026] In this embodiment, the diameter of the accommodating cavity inside the cylindrical shell 41 can be calculated based on the thickness of the outer encapsulation layer 3. The diameter of the accommodating cavity is equal to the thickness of the outer encapsulation layer 3 multiplied by two, plus the diameter of the first electrode core. The retaining ring 42 is an annular structure. The outer ring is fixedly connected to the side wall of the accommodating cavity of the cylindrical shell 41, and the inner ring is used to sleeve one end of the first electrode core and is in contact with the side wall of one end of the first electrode core, thereby fixing one end of the first electrode core placed in the accommodating cavity of the preset mold and simultaneously sealing one end of the preset mold. After placing the first electrode core into the preset mold, liquid medical silicone is injected into the cavity from the other end of the preset mold. After the injection of liquid medical silicone is completed, the preset mold after the injection of liquid silicone is placed in a vacuum drying oven for vacuum degassing for 5 to 10 minutes to remove air bubbles in the silicone and avoid pores in the encapsulation layer. Then the mold is placed in a constant temperature oven and cured for 1 to 2 hours under the required temperature curing conditions for silicone, or cured at room temperature for 24 hours to ensure that the silicone is completely cured. After the silicone is completely cured, the blank in the preset mold is demolded to obtain a flexible brain-computer interface electrode blank.

[0027] In an optional embodiment of the present invention, step 15, post-processing the flexible brain-computer interface electrode blank to obtain a flexible brain-computer interface electrode with an outer encapsulation layer 3, may include: Excess silicone on both ends and the surface of the flexible brain-computer interface electrode blank is corrected to expose the electrode sites and lead-out ends of the metal wires on the electrode layer 2 of the inner support core tube 1, thus obtaining a flexible brain-computer interface electrode with an outer encapsulation layer 3.

[0028] In this embodiment, after curing, after the electrode is demolded from the mold, a precision tool is used to trim the two ends of the electrode blank of the flexible brain-computer interface to expose the electrode sites and wire lead-out ends. Excess silicone on the surface is removed to obtain the final flexible brain-computer interface electrode based on the spiral winding structure.

[0029] like Figures 2 to 4 As shown, embodiments of the present invention also propose a flexible brain-computer interface electrode, which is prepared using the method described in the above embodiments. The flexible brain-computer interface electrode comprises: Inner support core tube 1; Electrode layer 2 is disposed on the inner support core tube 1; An outer encapsulation layer 3 that wraps around the inner support core tube 1 and the electrode layer 2; The inner support core tube 1 is a silicone tube; The electrode layer 2 is a long strip-shaped flexible electrode, and the electrode layer 2 is uniformly wound around the outer surface of the inner support core tube 1 in a spiral winding manner. The outer encapsulation layer 3 is made of silicone.

[0030] In this embodiment, the inner support core tube 1 is a medical implantable silicone tube. The inner support core tube 1 is a hollow or solid structure with good biocompatibility and flexibility. It is used to provide basic flexible support and maintain the overall shape of the electrode layer 2. It also has good biocompatibility and flexibility. In this embodiment, after the electrode layer 2 is uniformly wound in a spiral shape on the outer surface of the inner support core tube 1, medical biodegradable fixation adhesive or temporary fixation clamps can be used to temporarily fix the motor wires of the spirally wound electrode layer 2, thereby preventing the winding structure from loosening or shifting during the subsequent outer encapsulation layer 3 process. The amount of fixation adhesive should be just enough to cover the connection between the wires and the silicone tube to avoid excessive impact on subsequent potting. The outer encapsulation layer 3 can be achieved by mold potting. Specifically, medical implantable liquid silicone can be used to pot and cure the mold containing the inner support core tube 1 and the electrode layer 2. After the medical implantable liquid silicone is mixed to a uniform and bubble-free state, it is potted by dripping or pouring to completely encapsulate the spiral electrode structure electrode layer 2 and the inner support core tube 1 of the medical flexible silicone tube, forming a complete outer silicone protective layer. The outer surface of the spirally wound electrode layer 2 and the inner support core tube 1 is wrapped to form a smooth and dense integrated encapsulation structure. The thickness is sufficient to meet the requirements of flexibility and long-term stability, ensuring that the electrode wires are completely covered and that there are no air bubbles or gaps in the protective layer, thus ensuring insulation and sealing, preventing the electrode from being corroded by body fluids, and further improving the flexibility and biocompatibility of the electrode, reducing foreign body reactions in brain tissue. After encapsulation, the encapsulated mold can be placed in a preset temperature environment for curing. After curing, the mold and temporary fixing clamps are removed (if biodegradable fixing adhesive is used, no additional removal is required, as it can degrade naturally), and a semi-finished brain-computer interface electrode can be obtained. For the semi-finished brain-computer interface electrode, the two ends of the electrode can be trimmed with a precision tool to expose the electrode sites and wire lead-out ends, and excess silicone on the surface is removed to obtain the final flexible brain-computer interface electrode based on the spiral wound structure.

[0031] In this embodiment, the inner support core tube 1 provides a flexible support base and has good bending performance. It can adapt to the implantation path and brain tissue micro-movements, avoiding damage to the brain tissue caused by rigid support. The design of the electrode layer 2, which is uniformly wound in a spiral shape on the outer surface of the inner support core tube 1, allows the spiral structure to undergo adaptive deformation such as axial stretching, radial contraction, and circumferential torsion when the electrode is subjected to bending, traction, compression, or brain tissue micro-movements. This effectively releases stress and prevents stress from directly acting on the metal wires and electrode sites of the flexible electrode, thus preventing wire breakage and electrode failure. The outer encapsulation layer 3 completely wraps the spirally wound electrode layer 2, forming a dense protective layer. On the one hand, it isolates the electrode layer 2 from contact with body fluids, preventing corrosion. On the other hand, it further improves the overall flexibility and structural integrity of the electrode layer 2, making the surface of the electrode layer 2 smooth, reducing friction with brain tissue, and reducing inflammatory response. The flexible brain-computer interface electrode of this invention adopts a three-layer composite structure design consisting of an inner supporting silicone tube, a spirally wound electrode layer, and an outer layer of silicone encapsulation. During implantation, the spiral structure can buffer the puncture impact and compression force, reducing instantaneous electrode damage and improving the implantation success rate. After implantation, the spiral structure can adapt to the physiological micro-movements of brain tissue, reducing the relative shear force between the electrode and brain tissue, ensuring electrode site stability, and achieving long-term stable acquisition of neural electrical signals and transmission of stimulation signals.

[0032] The flexible brain-computer interface electrode described in this invention can be bent at an angle of up to 120° during actual use without significant changes in its electrical properties; after repeated bending, the electrode signal acquisition stability remains stable; after implantation into animal brain tissue, there is no obvious inflammatory reaction, signal acquisition is stable, and it exhibits excellent adaptation to brain tissue micro-movement effects.

[0033] In an optional embodiment of the present invention, the electrode layer 2 includes: The substrate film 21 is disposed on the inner support core tube 1; Metal wires 22 embedded in the substrate film 21; Electrode sites 23 are disposed at one end of the substrate film 21.

[0034] In this embodiment, the substrate film 21 is made of a flexible biocompatible material, such as polyimide (PI) or polydimethylsiloxane (PDMS); the metal wire 22 can be made of a biocompatible metal, such as gold, platinum, or iridium; the electrode sites are circular; the metal wire 22 is embedded in the substrate film 21, and the electrode sites 23 are disposed at one end of the electrode layer 2 for collecting neural electrical signals or transmitting stimulation signals; the metal wire 22 and the electrode sites 23 can be fabricated on the substrate film 21 material using processes such as photolithography, sputtering, RIE, and baking.

[0035] In an optional embodiment of the present invention, the pitch of the helical winding is greater than the width of the electrode layer 2.

[0036] In a preferred embodiment, the ratio of the helical winding pitch to the electrode width is greater than or equal to 1.1. In an optional embodiment, the width of the electrode layer 2 is 0.8 mm, and the helical winding pitch is 1.0 mm. In this embodiment, the winding angle of the electrode layer 2 can be adjusted according to the design of the electrode layer 2. During the winding process, it is necessary to maintain the uniform tension of the wires of the electrode layer 2, and ensure that the wires of the electrode layer 2 are tightly attached to the outer wall of the inner support core tube 1 without loosening or wrinkling, forming a spiral electrode structure, with the electrode layers evenly distributed and having sufficient deformation buffer space.

[0037] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for fabricating a flexible brain-computer interface electrode, characterized in that, include: Obtain the substrate material of the inner support core tube (1) and the electrode layer (2); Metal wires (22) and electrode sites (23) are formed on the substrate material to obtain an electrode layer (2); The electrode layer (2) is spirally wound uniformly around the outer surface of the inner support core tube (1) with a preset pitch to obtain the first electrode core. The first electrode core is encapsulated with an outer layer of silicone to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer (3); The flexible brain-computer interface electrode blank is post-processed to obtain a flexible brain-computer interface electrode with an outer encapsulation layer (3).

2. The method for fabricating the flexible brain-computer interface electrode according to claim 1, characterized in that, Obtaining the inner support core tube (1) includes: Obtain the silicone tube of the material corresponding to the inner support core tube (1); The silicone tube is cut to a preset length to obtain the inner support core tube rough fitting; The inner support core tube (1) was obtained by ultrasonic cleaning of the outer surface of the inner support core tube fitting with anhydrous ethanol.

3. The method for fabricating the flexible brain-computer interface electrode according to claim 1, characterized in that, The electrode layer (2) is spirally wound uniformly around the outer surface of the inner support core tube (1) with a preset pitch to obtain a first electrode core, comprising: The electrode layer (2) is spirally wound evenly around the outer surface of the inner support core tube (1) with a preset pitch, and is temporarily fixed by a bio-adhesive of a preset material during the winding process, forming the first electrode core.

4. The method for fabricating the flexible brain-computer interface electrode according to claim 1, characterized in that, The first electrode core is encapsulated with an outer layer of silicone to obtain a flexible brain-computer interface electrode blank with an outer encapsulation layer (3), comprising: The first electrode core is placed into a preset mold and a preset liquid silicone is injected to obtain the preset mold after the liquid silicone is injected. The pre-formed mold after being injected with liquid silicone is placed in a vacuum drying oven for vacuum degassing treatment to obtain the pre-formed mold after vacuum degassing treatment. The pre-designed mold, after vacuum degassing, is placed in a constant temperature oven for curing to obtain a flexible brain-computer interface electrode blank.

5. The method for fabricating the flexible brain-computer interface electrode according to claim 4, characterized in that, The preset mold includes: A cylindrical shell (41) is provided with a cavity inside the cylindrical shell (41); A retaining ring (42) is disposed at one end of the accommodating cavity and is fixedly connected to the interior of the cylindrical housing (41). In use, the inner support core tube (1) is placed in the receiving cavity, and one end of the inner support core tube (1) passes through the retaining ring (42), so that the retaining ring (42) is sleeved on the inner support core tube (1) and contacts and connects with the side wall of the inner support core tube (1).

6. The method for fabricating the flexible brain-computer interface electrode according to claim 1, characterized in that, The flexible brain-computer interface electrode blank is post-processed to obtain a flexible brain-computer interface electrode with an outer encapsulation layer (3), comprising: The excess silicone on both ends and the surface of the flexible brain-computer interface electrode blank is corrected so that the electrode sites of the electrode layer (2) on the inner support core tube (1) and the lead-out end of the metal wire are exposed, thus obtaining a flexible brain-computer interface electrode with an outer encapsulation layer (3).

7. A flexible brain-computer interface electrode, characterized in that, The flexible brain-computer interface electrode is prepared by the method described in any one of claims 1 to 6, and the flexible brain-computer interface electrode comprises: Inner support core tube (1); Electrode layer (2) disposed on the inner support core tube (1); An outer encapsulation layer (3) that wraps around the inner support core tube (1) and the electrode layer (2); The inner support core tube (1) is a silicone tube; The electrode layer (2) is a long strip flexible electrode, and the electrode layer (2) is uniformly wound around the outer surface of the inner support core tube (1) in a spiral winding manner; The outer encapsulation layer (3) is made of silicone.

8. The flexible brain-computer interface electrode according to claim 7, characterized in that, The electrode layer (2) includes: The base film (21) is disposed on the inner support core tube (1). Metal wires (22) embedded in the substrate film (21); Electrode sites (23) are disposed at one end of the substrate film (21).

9. The flexible brain-computer interface electrode according to claim 8, characterized in that, The substrate film (21) is a flexible biocompatible material.

10. The flexible brain-computer interface electrode according to claim 7, characterized in that, The pitch of the spiral winding is greater than the width of the electrode layer (2).

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