A wafer dispensing machine

Abstract

This invention discloses a wafer dispensing machine, comprising a frame body, a material loading mechanism, a motion mechanism, a dispensing module, a curing station, a glue removal and weighing mechanism, a wafer loading and unloading mechanism, an FFU (High-Efficiency Particulate Filter), and a material storage and receiving assembly for storing wafer workpieces. The material loading mechanism, motion mechanism, curing station, glue removal and weighing mechanism, wafer loading and unloading mechanism, and FFU are arranged on the frame body. The dispensing module is mounted on the motion mechanism, which drives the dispensing module to move, thereby performing dispensing operations on the wafer workpieces carried on the material loading mechanism. The material storage and receiving assembly 9 is located on the outer side of the frame body. This invention enables continuous production, effectively improving equipment uptime, thereby increasing overall production capacity and improving dispensing quality.

Description

Technical Field

[0001] This invention relates to the field of dispensing machine technology, and more specifically to a wafer dispensing machine. Background Technology

[0002] As the core substrate material for semiconductor chip fabrication, wafers are widely used in chip packaging, reinforcement, insulation protection, bonding and other processes through surface dispensing technology. The dispensing accuracy, glue quantity consistency and cleanliness of the process directly determine the production yield and performance of semiconductor products.

[0003] Currently, most traditional wafer dispensing equipment on the market adopts a single-station operation mode. This design requires the wafer loading, dispensing, curing, and unloading processes to be completed sequentially, resulting in low overall equipment uptime and production efficiency that cannot meet the demands of large-scale mass production. Secondly, conventional dispensing equipment usually lacks a dedicated cleaning mechanism for residual adhesive on the dispensing nozzle, leading to adhesive accumulation and curing after long-term use. This can cause problems such as stringing, dripping, and uneven dispensing, affecting dispensing quality. Therefore, it is necessary to design a wafer dispensing machine to effectively solve the above-mentioned technical problems. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the present invention aims to provide a wafer dispensing machine that improves production efficiency and overall utilization rate while cleaning the dispensing nozzles and improving dispensing quality.

[0005] To achieve the above-mentioned technical objectives and effects, the present invention is implemented through the following technical solution: A wafer dispensing machine includes a frame body, on which are arranged: The material carrier mechanism is used to support the wafer workpiece; A motion mechanism is provided, on which a dispensing module is provided. The motion mechanism can drive the dispensing module to move, thereby realizing the dispensing operation on the wafer workpiece carried on the material carrier mechanism. The curing station is where the adhesive layer on the wafer workpiece after dispensing is cured. The glue removal and weighing mechanism is used to remove residual glue from the dispensing nozzles of the dispensing module while detecting the amount of glue sprayed by the dispensing module in a single operation. Wafer loading and unloading mechanism, used for loading and unloading wafer workpieces and transferring wafer workpieces during processing; FFU (High-efficiency particulate air) filters are used to purify the air, remove dust and impurities in the wafer dispensing area, and maintain the high-cleanliness working environment required for wafer dispensing. It also includes a material storage and receiving assembly; the material storage and receiving assembly is located on the outside of the frame body and is used to supply the wafer workpiece to be dispensed and to collect the wafer workpiece after dispensing.

[0006] Furthermore, the material loading mechanism is a vacuum turntable.

[0007] Furthermore, the motion mechanism consists of a Y-axis slide module and a Z-axis slide module. The Z-axis slide module is mounted on the slide of the Y-axis slide module, and the Z-axis slide module can be driven to move back and forth in the Y direction through the Y-axis slide module.

[0008] Furthermore, the dispensing module includes a connecting plate, on which a dispensing assembly for dispensing operations and a CCD vision positioning assembly for wafer positioning and height detection are provided.

[0009] Furthermore, the dispensing assembly includes a dispensing valve and a low level sensor disposed on the dispensing valve.

[0010] Furthermore, the CCD vision positioning component includes a vision module for wafer positioning and a laser height sensor for height detection.

[0011] Furthermore, the adhesive removal and weighing mechanism consists of an adhesive removal module for removing residual adhesive from the dispensing nozzles of the dispensing module and a weighing module for detecting the amount of adhesive sprayed by the dispensing module in a single operation.

[0012] Furthermore, the adhesive removal module includes a support frame, and a vacuum cleaning module and a simulated curing soaking tank are provided on the upper end of the support frame.

[0013] Furthermore, the wafer loading and unloading mechanism is a dual-arm robotic arm.

[0014] Furthermore, the material storage and receiving assembly includes a supply bin for storing wafer workpieces to be dispensed and a return bin for receiving wafer workpieces after dispensing.

[0015] The beneficial effects of this invention are as follows: 1. This invention sets up two sets of vacuum rotary material loading mechanisms, and cooperates with a dual-arm robotic arm and motion mechanism to achieve the two sets of material loading mechanisms to alternately carry out dispensing operations, realize continuous production operations, effectively improve equipment utilization rate, and thus improve overall production capacity. 2. The dispensing module of this invention integrates a CCD vision positioning component and a laser height sensor, realizing precise positioning and height detection of the wafer, thereby enabling real-time calibration and height compensation of the dispensing position, ensuring accurate and controllable dispensing position; and by using a piezoelectric jet dispensing valve and setting a low liquid level sensor on the valve body, it effectively avoids the problems of dry dispensing and dispensing interruption, improving dispensing quality. 3. By setting up a glue-cleaning and weighing mechanism, this invention enables the cleaning of residual glue on the dispensing nozzle, thereby avoiding problems such as glue accumulation, glue stringing, and glue dripping. This improves the dispensing effect and enables the detection and feedback correction of the actual weight of glue sprayed by the dispensing nozzle in a single spray, ensuring consistent glue output and improving product processing quality.

[0016] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it according to the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Specific embodiments of the present invention are given in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the dispensing machine of the present invention; Figure 2 This is a top view of the present invention after removing some structural elements; Figure 3 This is a partial structural diagram of the dispensing machine of the present invention; Figure 4 This is a schematic diagram showing the connection between the motion mechanism and the dispensing module of the present invention; Figure 5 For the present invention Figure 4 Method diagram at point A; Figure 6 This is a schematic diagram of the adhesive removal and weighing mechanism of the present invention; Figure 7 This is a schematic diagram of the vacuum cleaning module structure of the present invention.

[0018] Explanation of reference numerals in the attached drawings: 1. Frame body; 2. Loading mechanism; 3. Motion mechanism; 4. Dispensing module; 5. Curing station; 6. Glue removal and weighing mechanism; 7. Wafer loading and unloading mechanism; 8. FFU high-efficiency filter; 9. Material storage and receiving assembly; 31. Y-axis slide module; 32. Z-axis slide module; 41. Connecting plate; 42. Dispensing assembly; 43. CCD vision positioning assembly; 421. Dispensing valve; 422. Low liquid level sensor; 431. Vision module; 432. Laser height sensor; 61. Glue removal module; 62. Weighing module; 611. Support frame; 612. Vacuum cleaning module; 613. Simulated curing immersion tank; 6121. Vacuum chamber; 6122. Vacuum nozzle; 6123. Displacement sensor; 91. Supply bin; 92. Return bin. Detailed Implementation

[0019] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] It should be noted that all directional indicators (such as up, down, left, right, front, back, upper end, lower end, top, bottom, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0021] See Figure 1-3 As shown, a wafer dispensing machine includes a frame body 1, a material loading mechanism 2 for carrying wafer workpieces, a motion mechanism 3, a dispensing module 4 for dispensing the wafer workpieces, a curing station 5 for curing the adhesive layer on the wafer workpieces after dispensing, a cleaning and weighing mechanism 6 for removing residual adhesive from the dispensing nozzles of the dispensing module 4 and detecting the amount of adhesive sprayed by the dispensing module 4 in a single spray, a wafer loading and unloading mechanism for loading and unloading wafer workpieces and transferring wafer workpieces during processing, and an air purification and dust removal mechanism for the wafer dispensing operation area to maintain the high cleanliness required for wafer dispensing. The system includes an FFU (High-Efficiency Particulate Filter) 8 for the environment and a material storage and receiving assembly 9 for supplying the wafer workpiece to be dispensed and for collecting the dispensed wafer workpiece. The material loading mechanism 2, the motion mechanism 3, the curing station 5, the adhesive removal and weighing mechanism 6, the wafer loading and unloading mechanism 7, and the FFU 8 are arranged on the frame body 1. The dispensing module 4 is mounted on the motion mechanism 3, which drives the dispensing module 4 to move, thereby enabling dispensing operations on the wafer workpiece carried on the material loading mechanism 2. The material storage and receiving assembly 9 is located on the outside of the frame body 1.

[0022] In this embodiment, see Figure 3 As shown, the material loading mechanism 2 is provided in two sets, both of which are vacuum turntables. This allows the wafer workpiece to be adsorbed onto the turntable through vacuum adsorption, thereby avoiding problems such as wafer workpiece displacement and shaking during the dispensing process. At the same time, it drives the wafer workpiece to rotate, and works in conjunction with the dispensing module 4 to complete the dispensing operation on the wafer workpiece. In this embodiment, during dispensing, the two sets of vacuum turntables operate independently and work in an alternating manner.

[0023] See Figure 4As shown, the motion mechanism 3 consists of a Y-axis slide module 31 and a Z-axis slide module 32. The Z-axis slide module 32 is mounted on the slide of the Y-axis slide module 31, and the Y-axis slide module 31 can drive the Z-axis slide module 32 to move back and forth in the Y direction. The dispensing module 4 is mounted on the slide of the Z-axis slide module 32, and the Z-axis slide module 32 can drive the dispensing module 4 to move in the Z direction. The two sets of vacuum turntables are arranged along the Y-axis slide module 31, thereby enabling the motion mechanism 3 to drive the dispensing module 4 to switch positions back and forth between the two sets of vacuum turntables, realizing alternating dispensing operations.

[0024] See Figure 4-5 As shown, the dispensing module 4 includes a connecting plate 41, on which a dispensing assembly 42 for dispensing operations and a CCD vision positioning assembly 43 for wafer positioning and height detection are provided; wherein, in this embodiment, the dispensing assembly 42 includes a dispensing valve 421, the dispensing valve 421 is a piezoelectric jet valve, and a low liquid level sensor 422 is provided on the outer surface of the dispensing valve 421. The low liquid level sensor 422 monitors the amount of glue in the valve body, realizes glue shortage warning, and plays a role in operation protection; The CCD vision positioning component 43 includes a vision module 431 and a laser height sensor 432. The vision module 431 uses an industrial camera, and an RGB light source is set at the front end of the lens of the industrial camera. The vision module 431 is used to position the wafer workpiece carried on the material carrier 2, and the laser height sensor 432 is used to detect the height of the wafer workpiece and the distance between the workpiece and the point, thereby realizing the point calibration and height compensation of the dispensing valve 421, ensuring accurate dispensing position and improving the overall dispensing quality.

[0025] See Figure 6-7 As shown, the adhesive removal and weighing mechanism 6 consists of an adhesive removal module 61 and a weighing module 62. The adhesive removal module 61 includes a support frame 611, and a vacuum cleaning module 612 and a simulated curing soaking tank 613 are provided on the upper end of the support frame 611. During the dispensing process, the vacuum cleaning module 612 is used to remove residual adhesive on the dispensing nozzle of the dispensing valve 421, thereby avoiding the impact of residual adhesive accumulation on the subsequent dispensing effect (e.g., dispensing accuracy, adhesive stringing, dripping, etc.). The simulated curing soaking tank 613 is used to soak and soften the cured and semi-cured residual adhesive on the surface of the dispensing nozzle before the vacuum cleaning module 612 operates, reducing the adhesion and hardness of the residual adhesive, and improving the cleaning efficiency of the vacuum cleaning module 612 and the cleanliness of the dispensing nozzle.

[0026] In this embodiment, the vacuum cleaning module 612 includes a vacuum chamber 6121, on which a vacuum nozzle 6122 for adsorbing residual adhesive and a displacement sensor 6123 are provided. The displacement sensor 6123 detects the position of the dispensing nozzle to ensure that the dispensing nozzle is accurately aligned with the vacuum nozzle 6122.

[0027] The weighing module 62 is an electronic scale used to detect the amount of adhesive sprayed by the dispensing valve 421 in a single operation.

[0028] See Figure 2 As shown, the wafer loading and unloading mechanism 7 is a dual-arm robotic arm, which completes the wafer workpiece loading, solidification transfer and receiving actions.

[0029] See Figure 1-2 As shown, the material storage and receiving assembly 9 includes a supply bin 91 for storing wafer workpieces to be glued and a return bin 92 for receiving wafer workpieces after glue dispensing; both the supply bin 91 and the return bin 92 are equipped with rollers at their lower ends to facilitate quick replacement of the supply bin 91 and the return bin 92.

[0030] The working principle of this invention is as follows: Before starting work, connect this dispensing machine to the control system.

[0031] During operation, the wafer loading / unloading mechanism 7 (i.e., the dual-arm robotic arm) first removes the wafer workpiece to be processed from the supply chamber 91 and transfers it to the loading mechanism 2. The loading mechanism 2 (i.e., the vacuum turntable) adsorbs and fixes the wafer workpiece. Then, while the vacuum turntable drives the wafer workpiece adsorbed and fixed on it to rotate, the motion mechanism 3 drives the dispensing module 4 to move above the vacuum turntable. After cooperating with the rotating wafer workpiece, the dispensing operation is realized. Among them, since two sets of loading mechanisms 2 are set (for ease of distinction in subsequent description, the loading mechanisms 2 are divided into loading mechanism 2A and loading mechanism 2B), during the dispensing operation, the two sets of loading mechanisms 2 (operate in an alternating station mode, for example, when the wafer on the loading mechanism 2A is finished with dispensing, the dual-arm robotic arm immediately transfers the wafer to the curing station 5 for adhesive layer curing. At the same time, the motion mechanism 3 drives the dispensing module 4 to move and perform dispensing operation on the wafer that has been loaded onto the loading mechanism 2B.

[0032] During the switching interval between wafer curing and dispensing module 4, dispensing module 4 will intermittently perform glue cleaning of the nozzles belonging to dispensing valve 421 and detect the amount of glue sprayed in a single spray. Specifically, under the drive of motion mechanism 3, dispensing module 4 first moves to the imitation curing soaking tank 613, so that the nozzles belonging to dispensing valve 421 in dispensing module 4 enter the imitation curing soaking tank 613. After soaking and softening the hardened glue on the dispensing nozzle, the nozzle is moved above the vacuum cleaning module 612, so that the nozzle and vacuum suction nozzle 6122 use negative pressure to remove the glue on the nozzle. After the glue cleaning is completed, the nozzle is driven to move above the weighing module 62 and spray glue onto the weighing module 62. The actual weight of the glue sprayed in a single spray is detected. The weighing module 62 obtains the actual weight and feeds it back to the control system. The control system compares it with the process standard glue weight and corrects the glue dispensing amount.

[0033] After the wafer in the curing station 5 has completed the adhesive layer curing, the dual-arm robotic arm takes the finished wafer out of the curing station 5 and transfers it to the return hopper 92 outside the frame for storage; repeat the above actions to achieve continuous automated dispensing operation.

[0034] Throughout the dispensing process, the FFU high-efficiency filter 8 must continuously purify the air and remove dust and impurities from the work area to prevent dust and impurities from contaminating the wafer and the adhesive, thereby improving product yield.

[0035] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer dispensing machine, comprising a frame body (1), characterized in that, The frame body (1) is provided with: Material carrier (2) is used to carry wafer workpieces; Motion mechanism (3), on which a dispensing module (4) is provided, the motion mechanism (3) can drive the dispensing module (4) to move, so as to perform dispensing operation on the wafer workpiece carried on the material carrier (2); Curing station (5) is where the adhesive layer of the wafer workpiece after dispensing is cured; The glue removal and weighing mechanism (6) is used to remove the residual glue on the dispensing nozzle of the dispensing module (4) and detect the amount of glue sprayed by the dispensing module (4) in a single spray. The wafer loading and unloading mechanism (7) is used for loading and unloading wafer workpieces and transferring wafer workpieces during processing. FFU high-efficiency filter (8) is used to purify the air, remove dust and impurities in the wafer dispensing operation area, and maintain the high cleanliness operation environment required for wafer dispensing. It also includes a material storage and receiving component (9); the material storage and receiving component (9) is located on the outside of the frame body (1) and is used to supply the wafer workpiece to be glued and to collect the wafer workpiece after the glue is applied.

2. The wafer dispensing machine according to claim 1, characterized in that: The material loading mechanism (2) is a vacuum turntable.

3. The wafer dispensing machine according to claim 1, characterized in that: The motion mechanism (3) consists of a Y-axis slide module (31) and a Z-axis slide module (32). The Z-axis slide module (32) is mounted on the slide of the Y-axis slide module (31). The Z-axis slide module (32) can be driven to move back and forth in the Y direction by the Y-axis slide module (31).

4. The wafer dispensing machine according to claim 1, characterized in that: The dispensing module (4) includes a connecting plate (41), on which a dispensing assembly (42) for dispensing operations and a CCD vision positioning assembly (43) for wafer positioning and height detection are provided.

5. The wafer dispensing machine according to claim 4, characterized in that: The dispensing assembly (42) includes a dispensing valve (421) and a low level sensor (422) disposed on the dispensing valve (421).

6. The wafer dispensing machine according to claim 4, characterized in that: The CCD vision positioning component (43) includes a vision module (431) for wafer positioning and a laser height sensor (432) for height detection.

7. The wafer dispensing machine according to claim 1, characterized in that: The glue removal and weighing mechanism (6) consists of a glue removal module (61) for removing residual glue from the dispensing nozzle of the dispensing module (4) and a weighing module (62) for detecting the amount of glue sprayed by the dispensing module (4) in a single spray.

8. The wafer dispensing machine according to claim 7, characterized in that: The adhesive removal module (61) includes a support frame (611), and a vacuum cleaning module (612) and a simulated curing soaking tank (613) are provided on the upper end of the support frame (611).

9. The wafer dispensing machine according to claim 1, characterized in that: The wafer loading and unloading mechanism (7) is a dual-arm robotic arm.

10. The wafer dispensing machine according to claim 1, characterized in that: The storage and receiving assembly (9) includes a supply bin (91) for storing wafer workpieces to be glued and a return bin (92) for receiving wafer workpieces after the glued operation.

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