An intelligent laser processing system and method integrating laser measuring instruments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-09
- Publication Date
- 2026-08-14
AI Technical Summary
[0004]然后,极端深孔加工时即使采用无衍射光场,随着加工深度增加,光束在狭长孔道内仍会发生明显的衍射发散与反射损耗,导致孔底能量密度下降
[0030](1)通过构建由无衍射光场与同频调制声波场组成的多维声光耦合场,使得材料去除过程中声空化效应对熔融排出的主动强化;调制声波场在孔底液体介质中产生周期性的正负压交替,当声压幅值超过空化阈值时,熔融材料内部的微气泡经历成核、生长与瞬态溃灭,气泡溃灭瞬间释放集中能量并产生指向孔外的微射流,该微射流对高粘度熔融材料施加定向驱动力,迫使孔底堆积的熔融物沿孔壁快速排出,同时微射流的扰动显著增强局部对流换热,加速热耗散,相较于依赖重力或辅助气体吹拂的被动排渣方式,通过利用声空化产生的主动泵送作用解决了深孔内熔融材料滞留与热积累的难题,排渣通畅使得激光能量能够持续作用于新鲜材料,避免了熔融物屏蔽造成的能量浪费,从而在极端深孔加工中维持了稳定的材料去除效率。
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Abstract
Description
Technical Field
[0001] This invention relates to the field of laser beam processing technology, and in particular to an intelligent laser processing system and method integrating laser measuring instruments. Background Technology
[0002] Intelligent laser processing with integrated laser measuring instruments is an advanced manufacturing technology that deeply integrates high-precision optical measurement modules with laser processing systems. During the processing, this technology uses coaxial or off-axis integrated interferometric measurement modules and optical coherence tomography modules to acquire real-time three-dimensional topographic data and contour feature parameters of the processing area. Based on these measurement data, the system dynamically optimizes laser processing parameters to achieve adaptive closed-loop control of the processing process. This technology aims to solve the problem of uncontrollable accuracy caused by open-loop operation and post-processing inspection in traditional laser processing. It is particularly suitable for applications with extremely high requirements for dimensional accuracy and topographic quality, such as micro-hole processing, deep hole processing, and complex cavity processing.
[0003] Currently, in laser processing of deep and micro holes, existing technologies mainly utilize non-diffraction light fields with long focal depth characteristics, such as Bessel or Airy beams, to delay beam divergence and extend the effective processing depth. Alternatively, they use galvanometers or displacement stages to drive the light spot to perform helical or concentric circular trajectories for spatial scanning to homogenize energy distribution and expand the processing aperture. Other technologies include ultrasonic vibration-assisted processing, which utilizes the cavitation effect generated by sound waves in liquid media to promote the discharge of molten material, and using high-speed cameras or photodetectors to monitor plasma signals during processing to indirectly determine the processing status. Some high-end systems also integrate optical coherence tomography modules for post-processing or intermittent measurement of hole depth and hole wall morphology.
[0004] Furthermore, even with a non-diffraction optical field during extreme deep hole machining, significant diffraction divergence and reflection losses still occur within the narrow hole as the machining depth increases, leading to a decrease in energy density at the bottom of the hole. Traditional spatial trajectory scanning can only disperse heat in a two-dimensional plane, making it difficult to compensate for axial energy attenuation. Moreover, long-stroke scanning easily introduces mechanical yaw, which, combined with uneven energy distribution, makes it difficult to control the taper error of the hole wall. There is a lack of strict frequency synchronization between ultrasonic assistance and the optical field, resulting in random and unstable acoustic cavitation effects that may even interfere with optical field transmission. Existing measurement methods are mostly offline or have low refresh rates, making it impossible to achieve millisecond-level real-time feedback on the fault morphology and taper characteristics within the hole, resulting in lag in closed-loop control. Summary of the Invention
[0005] This invention overcomes the shortcomings of the prior art and provides an intelligent laser processing system and method integrating laser measuring instruments.
[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a method for intelligent laser processing integrating laser measuring instruments, comprising the following steps:
[0007] S1. Obtain and load the preset 3D digital model standard of the area to be processed;
[0008] S2. Generate a non-diffraction light field and drive it to perform spatial trajectory scanning, and simultaneously excite a modulated acoustic wave field with the same frequency as the scanning in the processing area to construct a multidimensional acousto-optic coupling field.
[0009] S3. Material removal is performed based on the multidimensional acoustic-optical coupling field, and acoustic cavitation effect is induced at the bottom of the hole by the modulated acoustic wave field to enhance the discharge of molten material and heat dissipation.
[0010] S4. Real-time acquisition of fault morphology contour data and borehole taper feature data during the processing;
[0011] S5. Based on the fault morphology contour data and borehole wall taper characteristic data, dynamically adjust the process parameters of the multidimensional acoustic-optical coupling field until the three-dimensional morphology of the processing area meets the three-dimensional digital model standard.
[0012] In a preferred embodiment of the present invention, in step S1, the three-dimensional digital model standard includes the target aperture, target hole depth, allowable taper error range, and bottom topography tolerance of the area to be processed.
[0013] In a preferred embodiment of the present invention, in step S2, the diffraction-free light field is a Bessel beam or an Airy beam, which has a long focal depth, a central main lobe diameter of no more than 2 μm, and a diffraction-free transmission distance of no less than 2 mm.
[0014] In a preferred embodiment of the present invention, step S2, wherein the synchronous excitation and scanning of the modulated acoustic wave field at the same frequency includes: acquiring the instantaneous frequency and phase information of the spatial trajectory scan; generating an ultrasonic frequency band excitation electrical signal that is strictly phase-locked with the instantaneous frequency and phase information through direct digital frequency synthesis technology; and converting the ultrasonic frequency band excitation electrical signal into mechanical vibration to excite the modulated acoustic wave field in the processing area.
[0015] In a preferred embodiment of the present invention, step S3, wherein the modulation acoustic wave field induces acoustic cavitation effect at the bottom of the hole, includes: controlling the acoustic pressure amplitude of the modulation acoustic wave field to be greater than the cavitation threshold of the molten material in the processing area; and using the alternating positive and negative pressure cycles of the modulation acoustic wave field to induce microbubbles inside the molten material to undergo nucleation, growth and transient collapse processes, thereby generating microjets pointing outward from the hole.
[0016] In a preferred embodiment of the present invention, step S4, which involves acquiring fault morphology contour data and borehole wall taper feature data in real time, includes: emitting a probe beam and receiving an interference echo signal, extracting a tomographic image through demodulation and frequency domain transformation, generating a fault morphology by fitting edge contours, and calculating the angle between the contours of adjacent depth layers to generate taper features.
[0017] In a preferred embodiment of the present invention, step S5, the dynamic adjustment of process parameters includes: when the material removal rate is lower than a preset threshold, simultaneously fine-tuning the focal depth of the optical field, the scanning angular velocity, and the acoustic frequency domain parameters; when the taper of the hole wall exceeds the threshold or trajectory distortion occurs, dynamically reversing the phase to calculate the reverse acoustic damping parameters, and adjusting the standing wave field to stabilize the scanning trajectory and the position of the optical field.
[0018] In a preferred embodiment of the present invention, the dynamic phase reversal calculation of the reverse acoustic damping parameters includes: inputting the bore wall taper and trajectory distortion into a multidimensional state evaluation model, extracting the spatial sway feature vector, and calculating the required target sound pressure level and phase difference in combination with the acoustic radiation force formula, which are then output as the reverse acoustic damping parameters.
[0019] Secondly, the present invention provides an intelligent laser processing system integrating laser measuring instruments, comprising:
[0020] The model loading module is used to acquire and load the preset three-dimensional digital model standard of the area to be processed;
[0021] The acousto-optic coupling generation module is used to generate a diffraction-free light field and drive it to perform spatial trajectory scanning. At the same time, a modulated acoustic wave field with the same frequency as the scanning is synchronously excited in the processing area to construct a multidimensional acousto-optic coupling field.
[0022] The material removal module is used to remove material from the processing area using the multidimensional acoustic-optical coupling field, and to induce acoustic cavitation effect at the bottom of the hole through the modulated acoustic wave field to enhance the discharge of molten material and heat dissipation.
[0023] The feature acquisition module is used to acquire fault morphology contour data and borehole wall taper feature data in real time during the processing.
[0024] The closed-loop control module is used to dynamically adjust the process parameters of the multidimensional acoustic-optic coupling field based on the fault topography contour data and the borehole wall taper feature data, until the three-dimensional topography of the processing area meets the three-dimensional digital model standard.
[0025] Thirdly, the present invention provides an electronic device, comprising:
[0026] At least one processor; and
[0027] A memory that is communicatively connected to the at least one processor;
[0028] The memory stores a computer program that can be executed by at least one processor, which is then executed by the at least one processor to enable the at least one processor to execute the intelligent laser processing system and method with integrated laser measuring instrument as described in any of the preceding claims.
[0029] This invention addresses the shortcomings of the prior art and has the following beneficial effects:
[0030] (1) By constructing a multidimensional acoustic-optical coupling field composed of a non-diffractive optical field and a co-frequency modulated acoustic wave field, the acoustic cavitation effect is actively enhanced to melt discharge during the material removal process. The modulated acoustic wave field generates periodic positive and negative pressure alternation in the liquid medium at the bottom of the hole. When the acoustic pressure amplitude exceeds the cavitation threshold, the microbubbles inside the molten material undergo nucleation, growth and transient collapse. The bursting of the bubbles releases concentrated energy and generates microjets pointing outward from the hole. The microjets apply directional driving force to the high-viscosity molten material, forcing the molten material accumulated at the bottom of the hole to be discharged rapidly along the hole wall. At the same time, the disturbance of the microjets significantly enhances local convective heat transfer and accelerates heat dissipation. Compared with the passive slag removal method that relies on gravity or auxiliary gas blowing, the active pumping effect generated by acoustic cavitation solves the problem of molten material retention and heat accumulation in deep holes. Smooth slag removal allows the laser energy to continuously act on fresh material, avoiding energy waste caused by the shielding of molten material, thus maintaining a stable material removal efficiency in extreme deep hole processing.
[0031] (2) By utilizing the standing wave distribution characteristics of the modulated acoustic field, non-contact acoustic damping is applied to the beam scanning trajectory, effectively suppressing the expansion of the hole wall taper in deep hole processing. When the closed-loop control module detects the trajectory distortion, the system dynamically calculates the reverse acoustic damping parameters and adjusts the distribution of the nodes and antinodes of the standing wave field, forming a local high-pressure region on the opposite side of the sway direction. This high-pressure region physically constrains the laser-induced plasma channel or beam transmission path through acoustic radiation force, which is equivalent to setting an invisible guide rail for the high-speed scanning beam. It forcibly pulls the beam action position that deviates from the ideal axis back to the geometric center, eliminating the trajectory sway caused by mechanical vibration or spot divergence during long-stroke scanning. Compared with the mechanical compensation method, which has lag and oscillation, by utilizing the acoustic field to achieve instantaneous non-contact stabilization, the hole wall taper can be controlled within a very small range, ensuring the perpendicularity and roundness of the hole wall, so that microholes with a depth-to-diameter ratio greater than 10:1 still have a near-straight wall morphology.
[0032] (3) By integrating a coaxial interferometric measurement module and acquiring fault morphology contour and borehole taper feature data in real time at a kilohertz refresh rate, and combining the synergistic effect of multidimensional acoustic-optical coupling and closed-loop feedback, the two core problems of energy compensation and trajectory stability in extreme deep hole processing are solved simultaneously. This measurement method is based on the principle of frequency domain optical coherence tomography. By emitting a broadband probe beam and analyzing the interference echo signal, it can extract the morphology information of the depth dimension layer by layer during the processing, and realize the millisecond-level online perception of the three-dimensional morphology inside the hole. When the energy density at the bottom of the hole decays due to the divergence of the light spot, the system synchronously fine-tunes. The optical field depth of focus extends into the deeper regions and the scanning speed is reduced to increase the pulse overlap rate. At the same time, the acoustic frequency is adjusted to match the intrinsic resonance of the deep-hole fluid column, providing synergistic compensation from both energy input and slag removal assistance aspects. When the taper expansion trend is detected, the system activates the reverse acoustic damping mechanism to actively constrain the beam trajectory through the standing wave field. This dual dynamic locking mechanism of energy and trajectory breaks the vicious cycle of energy shortage and taper deterioration that mutually exacerbates each other in traditional schemes, expanding the technological capabilities of laser precision machining in high-end fields such as aerospace air film holes, microelectronic through-silicon vias, and medical device microfluidic chips. Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 This is a flowchart of a preferred embodiment of the present invention;
[0035] Figure 2 This is a flowchart illustrating the construction of a multidimensional acoustic-optical coupling field and the execution of acoustic cavitation effect according to a preferred embodiment of the present invention.
[0036] Figure 3 This is a flowchart of the real-time morphology measurement and closed-loop control dynamic adjustment of a preferred embodiment of the present invention;
[0037] Figure 4 This is a flowchart of the control system of a preferred embodiment of the present invention. Detailed Implementation
[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0039] Application Overview:
[0040] In extreme deep hole machining, as the depth increases, a vicious cycle forms between energy attenuation caused by beam divergence and difficulty in removing molten material. Insufficient energy prevents the material from being fully melted and removed, while the accumulated molten material further absorbs and scatters laser energy, exacerbating the energy shortage at the bottom of the hole. At the same time, the tiny trajectory bias introduced by long-stroke scanning is geometrically amplified in the confined space of the deep hole. The asymmetric energy deposition caused by the bias will cause over-removal on one side of the hole wall and under-removal on the other side, thus quickly forming a taper. Traditional solutions treat energy delivery, slag removal assistance, and trajectory control as independent links, ignoring the inherent coupling relationship between them, and therefore cannot fundamentally break the above vicious cycle.
[0041] The applicant discovered that the acoustic field in the liquid medium can not only generate cavitation microjets to enhance slag discharge, but the standing wave distribution formed by it in the confined space can also exert a non-contact acoustic radiation force on the beam transmission path. This acoustic radiation force can play a role similar to acoustic damping. If the acoustic field and the optical field scanning can achieve strict frequency phase locking and spatial synchronization, then the same acoustic field can play the dual role of a slag discharge pump and a trackless guide rail in the same time and space.
[0042] The applicant proposed an innovative approach to construct a multidimensional acoustic-optical coupling field. This approach simultaneously addresses the two major challenges of energy compensation and trajectory stabilization through acoustic-optical synergy. First, a diffraction-free light field is generated and driven to perform spatial trajectory scanning. Simultaneously, a modulated acoustic wave field of the same frequency is excited in the processing area to construct the multidimensional acoustic-optical coupling field. The acoustic wave field induces acoustic cavitation at the bottom of the hole, generating microjets that forcefully expel molten material. A coaxial interference module acquires real-time data on the tomographic morphology and hole wall taper. A closed-loop control module dynamically adjusts the focal depth of the light field, scanning parameters, and acoustic wave frequency accordingly. When the material removal rate is insufficient, the above parameters are fine-tuned to maintain the energy density at the bottom of the hole. When the taper exceeds tolerance or the trajectory is distorted, the reverse acoustic damping parameters are dynamically calculated and the standing wave field is adjusted to apply a reverse acoustic radiation force to the beam to stabilize its position until the processing morphology meets the standards of the three-dimensional digital model. This is achieved through a triple-synergistic closed-loop control system of energy compensation, enhanced slag removal, and trajectory locking.
[0043] Example 1:
[0044] like Figure 1 As shown, a method for intelligent laser processing integrating a laser measuring instrument includes the following steps:
[0045] S1. Obtain and load the preset 3D digital model standard of the area to be processed;
[0046] S2. Generate a non-diffraction light field and drive it to perform spatial trajectory scanning, and simultaneously excite a modulated acoustic wave field with the same frequency as the scanning in the processing area to construct a multidimensional acousto-optic coupling field.
[0047] S3. Material removal is performed based on the multidimensional acoustic-optical coupling field, and acoustic cavitation effect is induced at the bottom of the hole by the modulated acoustic wave field to enhance the discharge of molten material and heat dissipation.
[0048] S4. Real-time acquisition of fault morphology contour data and borehole taper feature data during the processing;
[0049] S5. Based on the fault morphology contour data and borehole wall taper characteristic data, dynamically adjust the process parameters of the multidimensional acoustic-optical coupling field until the three-dimensional morphology of the processing area meets the three-dimensional digital model standard.
[0050] The core innovation of this invention lies in the construction of a multidimensional acoustic-optical coupling field that is strictly synchronized with laser scanning, enabling the acoustic field to play two key roles simultaneously: first, actively expelling molten material from deep holes through acoustic cavitation effect; and second, applying non-contact acoustic damping to the beam using the acoustic radiation force generated by the standing wave distribution to stabilize the trajectory and suppress taper. This mechanism, combined with real-time morphology measurement at the kilohertz level, forms a collaborative closed-loop control system that can dynamically adjust energy, slag discharge, and trajectory simultaneously.
[0051] Each step will be explained in detail below.
[0052] In step S1, the three-dimensional digital model standard is obtained by acquiring a data model that is pre-established in computer-aided design software, which includes the target hole diameter, target hole depth, allowable taper error range, and bottom topographic tolerance requirements of the area to be processed. The system loads the model through the standard file interface and parses the key control indicators from it.
[0053] It should be noted that the standard for 3D digital models involves creating a 3D geometric model of the workpiece substrate within a computer-aided design environment, and defining the ideal geometry of the area to be processed, including the target aperture, through feature definition. , with the target hole depth .
[0054] Subsequently, manufacturing semantics and process constraints are attached to the model in the form of geometric dimensions and tolerance annotations, specifically specifying the allowable taper error range. Including bottom topographic tolerances, thus forming an enhanced 3D model that integrates product manufacturing information.
[0055] To adapt to this laser processing system, the model loading module analyzes the enhanced model, extracting key information including the axis space vector, entrance center coordinates, target geometric dimensions, and various tolerance thresholds. Then, the processing path is discretized and parameterized; for example, a predetermined spatial trajectory for laser scanning is generated for each processing depth layer. Its parameterized equation can be expressed as:
[0056] ;
[0057] in, For the first The instantaneous radius of the layer scan trajectory, with time Linear increments are used to achieve spiral scanning; For the first The starting angular frequency of the layer scan.
[0058] Simultaneously, based on the workpiece material properties, the system associates and retrieves initial parameters from the built-in process database, including laser power. Pulse frequency and sound wave frequency .
[0059] Finally, all the geometric constraints, tolerance thresholds, path parameters and initial process parameters obtained from the analysis are integrated and serialized into a structured data file, which constitutes the standard three-dimensional digital model that can be acquired and loaded by the system in step S1.
[0060] like Figure 2 As shown, in step S2, the Gaussian beam is converted into a Bessel beam or Airy beam with a long focal depth using an optical shaping element; the beam spot is controlled to move along a spiral or concentric circle trajectory by a galvanometer; at the same time, the instantaneous frequency and phase of the scan are captured by a high-speed data acquisition card, and a phase-locked ultrasonic frequency band excitation signal is generated using direct digital frequency synthesis technology. After power amplification, the signal drives the ultrasonic transducer to generate mechanical vibration, forming a standing wave pattern with controllable sound pressure distribution in the liquid medium of the processing area.
[0061] A diffraction-free light field refers to a special light field in which the transverse intensity distribution of the central main lobe remains constant or has an extremely small divergence angle within a certain transmission distance when propagating in free space or a homogeneous medium. In this embodiment, a Bessel beam with a central main lobe diameter of no more than 2 μm and a diffraction-free transmission distance of no less than 2 mm is preferred. Its electric field distribution can be approximately expressed as:
[0062] ;
[0063] in, It is a zero-order Bessel function. Radial wave vector, Let be the axial wave vector, satisfying , ω is the angular frequency.
[0064] central main lobe diameter Non-diffraction transmission distance .
[0065] Spatial trajectory scanning refers to the path along which the focal point of a light beam moves continuously over time in three-dimensional space according to a pre-defined mathematical equation. Taking a helical trajectory as an example, the parameterized equation for its instantaneous position coordinates is expressed as:
[0066] ;
[0067] ;
[0068] in, Let the initial radius be , Radial expansion velocity, It is the angular displacement, equal to the instantaneous angular frequency. Integral over time.
[0069] Modulated acoustic wave field: refers to a mechanical longitudinal wave field whose frequency, phase, or amplitude changes according to a specific pattern over time by being controlled by an external electrical signal. In this embodiment, the sound pressure distribution of the acoustic wave field can... This can be represented as the superposition of sound waves excited by multiple transducers:
[0070] ;
[0071] in, The amplitude coefficient, For wavenumber vectors, For sound wave frequency, For phase.
[0072] A multidimensional acousto-optic coupled field refers to a composite energy field in which the photon energy distribution of the non-diffractive light field and the sound pressure gradient distribution of the modulated sound wave field overlap and interact with each other within the same physical space and time scale, jointly determining the material removal dynamics process.
[0073] The system generates a diffraction-free light field through physical devices such as spatial light modulators. This process essentially achieves a fundamental transformation of the spatial light intensity distribution by changing the phase wavefront of the incident light beam.
[0074] The system drives the scanning galvanometer and other actuators, and forces the light field to perform a preset spatial trajectory scan by inputting continuously changing control signals.
[0075] To ensure precise coordination between the light and sound fields, the system synchronously excites a modulated sound wave field with the same frequency as the light scan. This requires that the start time of the sound wave generation and the frequency change period be kept in strict mathematical proportion to the beam scan on the time axis to ensure that the two are in phase synchronization and do not drift relative to each other.
[0076] By integrating the independently generated and precisely controlled optical and acoustic subsystems through system-level temporal coordination and spatial alignment, a stable energy superposition state is formed within the processing area, thereby successfully constructing the required multidimensional acousto-optic coupling field.
[0077] In step S3, the material is melted when the laser power density exceeds the material damage threshold; the acoustic pressure amplitude of the modulated acoustic field is controlled to be greater than the cavitation threshold of the liquid medium, the micro-gas nuclei expand in the negative pressure phase of the acoustic wave, and the bubbles collapse transiently in the positive pressure phase, releasing concentrated energy to generate micro-jets pointing outward from the hole, and applying directional shear force to the high-viscosity molten material.
[0078] Material removal is achieved by exceeding the material damage threshold with laser power density. At this time, the material rapidly melts or even vaporizes. The volume of material removed per unit time... It can be approximated as:
[0079] ;
[0080] in, The absorption rate of the material to laser light. For laser power, For material density, This is the latent heat of fusion.
[0081] The system performs continuous processing, outputting energy according to a predetermined program to cause the workpiece material to undergo a physical phase transition from solid to liquid. The laser energy causes the material temperature to exceed its melting point, forming a molten material. Under the thermal effect of the laser, the workpiece material's temperature exceeds its melting point but has not yet reached its boiling point, exhibiting a liquid substance with a certain viscosity and surface tension.
[0082] The synchronously excited modulated acoustic wave field plays a role in the liquid medium at the bottom of the hole. Its periodically alternating positive and negative pressure will induce acoustic cavitation when the acoustic pressure amplitude exceeds the threshold. This effect refers to the dynamic phenomenon in which tiny bubbles in the liquid undergo nonlinear oscillation, expansion, compression, and finally violent implosion and collapse under the action of acoustic pressure. The instantaneous collapse of the bubbles generates a high-speed microjet, which can powerfully push the high-viscosity molten material out along the hole wall.
[0083] This process not only enhances slag removal but also promotes heat dissipation. The strong disturbance brought by the micro-jet enhances the convective heat transfer between the molten material and the surrounding cooling medium. At the same time, the process of bubble collapse and material discharge also carries away heat, thereby accelerating the transfer of heat accumulated in the processing area to the surroundings, effectively reducing the local temperature and avoiding thermal damage.
[0084] It should be noted that the sound pressure amplitude condition refers to the sound pressure amplitude of the modulated sound wave field. It must be greater than the cavitation threshold of the molten material in the processing area. ,Right now For typical water-based media, It is approximately 0.5 to 2 MPa.
[0085] Triggering refers to the action that breaks the original equilibrium of a system by applying external stimuli that meet specific physical conditions, causing a specific physical phenomenon to begin; the energy released at the moment of bubble collapse. It can be approximated as:
[0086] ;
[0087] in, Do not define the maximum and minimum radii of the bubble. Due to environmental pressures, This is the vapor pressure.
[0088] Enhancement refers to the improvement action of significantly increasing the slag removal velocity and heat transfer coefficient of the original gravity- or natural convection-dependent system by introducing the directional driving force and strong disturbance of microjets, thereby improving slag removal and heat dissipation efficiency by orders of magnitude; microjets velocity With sound pressure amplitude The relationship is:
[0089] ;
[0090] in, The geometric constraint coefficient at the bottom of the hole. The density is the liquid density.
[0091] The microjet applies directional shear force to the molten material, pushing the deposit at the bottom of the hole upwards along the hole wall. At the same time, the strong disturbance enhances local convective heat transfer and accelerates heat dissipation.
[0092] like Figure 3 As shown, in step S4, a broadband probe beam is emitted and an interference echo signal is received using the principle of frequency domain optical coherence tomography; the axial reflectivity distribution is obtained by performing Fourier transform on the interference spectrum signal, and a two-dimensional tomographic image is extracted; the point set of the hole wall interface is identified by the edge detection algorithm and fitted into a closed contour using the least squares method; finally, the taper feature is generated by calculating the local half-cone angle of the contour of adjacent depth layers.
[0093] Fault morphology contour data refers to a set of two-dimensional coordinate points or fitted curve equations reflecting the geometric boundary shape of the inner wall of a hole on a cross-section at a specific depth perpendicular to the machining axis; for the first... The contour of the depth layer, its radius function This can be expanded into a Fourier series:
[0094] ;
[0095] in, The average radius, , This is the shape error coefficient.
[0096] The taper characteristic data of the borehole wall refers to the inclination of the borehole wall along the depth direction, usually expressed as the rate of change or angle of the profile dimensions of adjacent depth layers. (Adjacent depth layers) Of Local semi-cone angle It is given by the following formula:
[0097] ;
[0098] in, ;
[0099] Real-time acquisition refers to continuously acquiring physical signals at an extremely high sampling rate during the same time process of laser material removal, and completing data processing and feature extraction within a very short calculation cycle to ensure that the acquired data can reflect the current processing status without delay.
[0100] In step S5, physical signals are continuously acquired at an extremely high sampling rate during the same time process of laser material removal, and data processing and feature extraction are completed within an extremely short calculation cycle to ensure that the acquired data can reflect the current processing status without delay.
[0101] The system first performs real-time acquisition, synchronously collecting physical signals during the processing at an extremely high frequency, and completing the processing and feature extraction with almost no delay, thereby obtaining morphological data reflecting the current state inside the hole.
[0102] These real-time data will be compared with the ideal three-dimensional shape defined by the preset three-dimensional digital model standard, where the three-dimensional shape includes the comprehensive spatial form of all geometric features such as aperture, aperture depth, and taper.
[0103] Once a deviation is detected, the system immediately initiates dynamic adjustment, which is an adaptive process that does not interrupt processing and continuously calculates and updates instructions based on real-time error signals.
[0104] The specific objects to be adjusted are process parameters, including physical quantity settings such as laser focal depth, pulse frequency, scanning speed, and acoustic drive frequency, which can be directly modified by the control unit.
[0105] Through such cyclical feedback and adjustment, the ultimate goal is to ensure that all errors between the actual three-dimensional shape after processing and the preset standard fall within the allowable tolerance zone, thus achieving a judgment result that meets the design requirements.
[0106] Example 2:
[0107] Based on Example 1, this embodiment further improves and elaborates on the core step in step S5, which involves dynamically reversing the phase to calculate the reverse acoustic damping parameters and adjusting the standing wave field to stabilize the scanning trajectory and the position of the light field when the taper characteristic data of the hole wall exceeds the threshold or trajectory distortion occurs.
[0108] In the later stages of extreme deep hole machining, laser mode degradation caused by multiple reflections from the hole wall and mechanical vibration accumulated during long-stroke scanning often cause the actual center of the beam to deviate from the ideal geometric axis, resulting in trajectory distortion and severe taper expansion. Traditional mechanical compensation methods suffer from significant mechanical inertia and control lag, which can easily lead to system oscillations.
[0109] This optimized embodiment employs an active acoustic damping control method based on a multidimensional state assessment model. Its core optimization principle is to abandon mechanical compensation with hysteresis and instead use the standing wave field formed by the sound wave in the liquid medium to apply a non-contact acoustic radiation force to the beam transmission path. By accurately calculating and adjusting the phase distribution of the sound field, a local high-pressure antinode is artificially created on the opposite side of the beam deflection direction. The acoustic radiation force generated by this high-pressure zone is used as reverse damping to forcibly push the deviated beam back to the ideal axis.
[0110] The multidimensional state assessment model adopts a mathematical model based on state space description. Its core structure consists of three parts connected in series: feature extraction layer, state mapping layer and control solution layer.
[0111] The feature extraction layer converts the real-time acquired hole wall taper feature data and trajectory distortion variables into a spatial yaw feature vector. Let the current depth be... The measured contour radius sequence is as follows The actual hole center coordinates were obtained by least-squares circle fitting. , and ideal axis coordinates The deviation is the yaw vector. .
[0112] Simultaneously, the local taper angle is calculated from the rate of change of radius of adjacent depth layers. The state vector is formed as ;
[0113] in, This represents the rate of change of the yaw.
[0114] State mapping layer: Employs a transfer function matrix based on physical field coupling. , the state vector Mapped to sound field control quantities. This transfer function is constructed based on the formula for sound radiation force and the principle of sound field superposition:
[0115] ;
[0116] in, For acoustic contrast factor, Let be the equivalent volume of the beam's effective region. To maximize the acoustic radiation force... Opposite to the yaw direction, the required sound pressure gradient distribution is solved by an inverse problem to form the target phase difference vector. .
[0117] The control solution layer employs an optimization solver based on the principle of minimum restoring force, using the phase difference of each transducer unit. To optimize the variables, the objective function is to minimize the magnitude of the yaw vector, and the optimal phase distribution is quickly solved under the constraint of sound pressure amplitude. The solution adopts the analytical gradient descent method, which guarantees convergence within milliseconds.
[0118] The feature extraction logic includes the following steps:
[0119] Contour fitting is obtained using the frequency domain optical coherence tomography module. Layer-depth tomographic images, after edge detection and morphological filtering, extract discrete point sets of borehole walls. Robust least-squares elliptic fitting was used to obtain the actual hole center coordinates at this depth. With radius .
[0120] The yaw vector is calculated by subtracting the current depth hole center coordinates from the preset axis coordinates. .
[0121] Taper feature calculation uses the current depth radius Compared to the previous depth radius Combined with depth interval Calculate the local half-cone angle:
[0122] ;
[0123] The yaw rate of change is estimated based on the yaw vectors of three consecutive depth layers, and the finite difference method is used to approximate the yaw rate of change. It is used to characterize the dynamic trend of trajectory distortion.
[0124] Specifically, the system inputs the borehole wall taper feature data and the deviation between the trajectory distortion and the ideal axis coordinates obtained in real time in Example 1 into a pre-constructed multi-dimensional state evaluation model; the model extracts the spatial yaw feature vector at the current depth through coordinate transformation. .
[0125] Subsequently, the system uses the spatial yaw feature vector The direction and modulus are used to calculate the required target sound pressure level and phase difference using the acoustic radiation force formula. For a laser plasma channel suspended in a liquid medium, the acoustic radiation force it experiences in the standing wave field... The calculation model is as follows:
[0126] ;
[0127] ;
[0128] in, Let be the acoustic radiation potential function. The equivalent radius of the plasma channel. and These are the compressibility and density of the liquid, respectively. and These are the time-averaged square values of the incident sound pressure and the particle velocity, respectively. and It is a dimensionless contrast factor related to the acoustic properties of the medium and channel.
[0129] In order to generate the yaw vector With equal and opposite restoring forces, the system uses the above formula to inversely solve for the desired target sound pressure gradient distribution. The key parameter determination method involves adjusting the phase difference of the driving signals of each element in the ultrasonic transducer array distributed around the processing area. This changes the spatial position of the nodes and antinodes of the standing wave.
[0130] The specific logical condition is: if the beam is directed towards... If the direction deviates, the control algorithm will increase. The phase lead of the directional transducer causes the standing wave to be anti-polarized. The direction is shifted and approaches the current position of the beam, thereby generating a pointing direction. The radiating force of sound.
[0131] Finally, the calculated target sound pressure level and phase difference array are output as inverse acoustic damping parameters and directly updated to the register of the direct digital frequency synthesizer to achieve microsecond-level sound field reconstruction.
[0132] During the processing, the system continuously monitors data such as the taper of the hole wall and compares it with preset thresholds. When trajectory distortion or taper exceeding the allowable range is detected, the closed-loop control module will be activated. It will first fine-tune parameters such as laser power and scanning speed, and optimize the frequency domain parameters of the modulated acoustic field.
[0133] The system uses a standing wave field to apply non-contact control. Through phase inversion calculations, the system can dynamically adjust this sound field to generate a force that pushes the deviated beam back to the correct position of the light field.
[0134] The above operations ultimately stabilize the target, that is, by using external constraints to counteract internal disturbances, the spatial coordinate fluctuations of the beam's position are controlled within the tolerance range; and the core physical basis of the entire process is the multidimensional acoustic-optical coupling field and the acoustic cavitation effect it induces at the bottom of the hole.
[0135] The improvements are significant: they resolve the hysteresis and oscillation issues inherent in traditional mechanical compensation methods. By utilizing the acoustic field to achieve instantaneous non-contact stabilization, it's equivalent to setting up an invisible and dynamically deformable guide rail for the high-speed scanning beam. This dual dynamic locking mechanism of energy and trajectory breaks the vicious cycle of energy depletion and tapered deterioration that plagues traditional solutions, allowing microholes with a depth-to-diameter ratio greater than 10:1 to retain near-straight-wall morphology. This greatly expands the technological capabilities of laser precision machining in high-end fields such as aerospace air film holes, microelectronic through-silicon vias, and microfluidic chips for medical devices.
[0136] Example 3:
[0137] like Figure 4 As shown, an intelligent laser processing system integrating laser measuring instruments includes:
[0138] Model loading module: Used to acquire and load the preset three-dimensional digital model standard of the area to be processed; this module includes a data parsing unit, which can read the enhanced three-dimensional model file, extract the target aperture, target aperture depth, allowable taper error range and bottom topography tolerance, and convert them into a discretized spatial trajectory coordinate matrix that the system can execute.
[0139] The acousto-optic coupling generation module generates a diffraction-free light field and drives it to perform spatial trajectory scanning. Simultaneously, it synchronously excites a modulated acoustic field with the same frequency as the scanning field in the processing area to construct a multidimensional acousto-optic coupling field. The module's hardware includes a femtosecond or picosecond laser, a spatial light modulator, a two-dimensional high-frequency scanning galvanometer, a direct digital frequency synthesizer (DDS), an RF power amplifier, and a ring piezoelectric ultrasonic transducer array. Its core is the built-in field-programmable gate array (FPGA) main control chip, which uses a hardware interrupt mechanism to ensure strict frequency-locked synchronization and time synchronization between the galvanometer deflection control signal and the DDS acoustic excitation signal at the nanosecond level.
[0140] Material Removal Module: This module utilizes the multidimensional acoustic-optical coupling field to remove material from the processing area. It also induces acoustic cavitation at the bottom of the hole through the modulated acoustic wave field, enhancing the removal of molten material and heat dissipation. This module primarily manifests as the physical interaction area of optical and acoustic energy on the workpiece surface. It overcomes the material damage threshold by adjusting the laser power density and simultaneously controls the sound pressure amplitude to exceed the cavitation threshold of the liquid medium, utilizing the microjet generated by microbubble collapse as an active slag removal pump.
[0141] Feature Acquisition Module: This module is used to acquire fault morphology contour data and borehole wall taper feature data in real time during the processing. It integrates a frequency-domain optical coherence tomography subsystem, including a broadband swept-frequency light source, a fiber optic Michelson interferometer, a high-speed linear array spectrometer, and a graphics processor. The broadband probe beam and the processing laser beam are transmitted to the bottom of the borehole via a coaxial common optical path through a dichroic mirror. The GPU utilizes a unified computing architecture to perform parallel fast Fourier transforms and edge contour fitting on the interference echo signals acquired by the spectrometer, achieving kilohertz-level morphology feature extraction.
[0142] Closed-loop control module: Based on the fault topography contour data and borehole wall taper feature data, dynamically adjust the process parameters of the multidimensional acoustic-optic coupling field until the three-dimensional topography of the processing area meets the three-dimensional digital model standard; This module embeds the multidimensional state evaluation model described in Example 3, which can dynamically invert and calculate the reverse acoustic damping parameters according to the real-time feedback topography and trajectory distortion data, and send the updated depth of focus, scanning speed, acoustic frequency and phase difference commands to the acoustic-optic coupling generation module to form a complete physical closed loop.
[0143] Example 4:
[0144] An electronic device, comprising:
[0145] The processor may include one or more combinations of a central processing unit (CPU), a graphics processing unit (GPU), a field-programmable gate array (FPGA), or an application-specific integrated circuit (ASIC).
[0146] Specifically, in a preferred embodiment of the present invention, a heterogeneous computing architecture of CPU+GPU+FPGA is adopted: the FPGA is responsible for the nanosecond-level synchronous triggering and signal acquisition of the underlying acousto-optic hardware; the GPU is responsible for the fast Fourier transform of massive interference spectral data and tensor inference calculation of the multidimensional state evaluation model; and the CPU is responsible for the parsing of the top-level three-dimensional digital model, the operation of the human-computer interaction interface, and global task scheduling.
[0147] The memory may include high-speed random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device, flash memory device or other solid-state storage device.
[0148] Furthermore, the memory not only stores the computer program code that executes the above methods, but also a built-in process database (containing damage thresholds, cavitation thresholds, initial process parameters, etc. for different materials) and a pre-trained multidimensional state assessment model weight file.
[0149] Based on the preferred embodiments of the present invention described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A method for intelligent laser processing integrating a laser measuring instrument, characterized in that, Includes the following steps: S1. Obtain and load the preset 3D digital model standard of the area to be processed; S2. Generate a non-diffraction light field and drive it to perform spatial trajectory scanning, and simultaneously excite a modulated acoustic wave field with the same frequency as the scanning in the processing area to construct a multidimensional acousto-optic coupling field. S3. Material removal is performed based on the multidimensional acoustic-optical coupling field, and acoustic cavitation effect is induced at the bottom of the hole by the modulated acoustic wave field to enhance the discharge of molten material and heat dissipation. S4. Real-time acquisition of fault morphology contour data and borehole taper feature data during the processing; S5. Based on the fault morphology contour data and borehole wall taper characteristic data, dynamically adjust the process parameters of the multidimensional acoustic-optical coupling field until the three-dimensional morphology of the processing area meets the three-dimensional digital model standard.
2. The intelligent laser processing method integrating a laser measuring instrument according to claim 1, characterized in that: In step S1, the three-dimensional digital model standard includes the target aperture, target hole depth, allowable taper error range, and bottom topography tolerance of the area to be processed.
3. The intelligent laser processing method integrating a laser measuring instrument according to claim 1, characterized in that: In step S2, the diffraction-free light field is a Bessel beam or an Airy beam, which has a long focal depth, a central main lobe diameter of no more than 2 μm, and a diffraction-free transmission distance of no less than 2 mm.
4. The intelligent laser processing method integrating a laser measuring instrument according to claim 1, characterized in that: In step S2, the synchronous excitation and scanning of the modulated acoustic wave field at the same frequency includes: acquiring the instantaneous frequency and phase information of the spatial trajectory scan; generating an ultrasonic frequency band excitation electrical signal that is strictly phase-locked with the instantaneous frequency and phase information through direct digital frequency synthesis technology; and converting the ultrasonic frequency band excitation electrical signal into mechanical vibration to excite the modulated acoustic wave field in the processing area.
5. The intelligent laser processing method with integrated laser measuring instrument according to claim 1, characterized in that: In step S3, the acoustic cavitation effect induced at the bottom of the hole by the modulated acoustic wave field includes: controlling the acoustic pressure amplitude of the modulated acoustic wave field to be greater than the cavitation threshold of the molten material in the processing area; and using the alternating positive and negative pressure of the modulated acoustic wave field to induce microbubbles inside the molten material to undergo nucleation, growth and transient collapse processes, thereby generating microjets pointing outward from the hole.
6. The intelligent laser processing method with integrated laser measuring instrument according to claim 1, characterized in that: In step S4, the real-time acquisition of fault morphology contour data and borehole wall taper feature data includes: emitting a probe beam and receiving an interference echo signal, extracting a tomographic image through demodulation and frequency domain transformation, generating a fault morphology by fitting edge contours, and calculating the angle between the contours of adjacent depth layers to generate taper features.
7. The intelligent laser processing method integrating a laser measuring instrument according to claim 1, characterized in that: In step S5, the dynamic adjustment of process parameters includes: when the material removal rate is lower than a preset threshold, simultaneously fine-tuning the focal depth of the optical field, the scanning angular velocity, and the acoustic frequency domain parameters; when the taper of the hole wall exceeds the threshold or trajectory distortion occurs, dynamically reversing the phase to calculate the reverse acoustic damping parameters, and adjusting the standing wave field to stabilize the scanning trajectory and the position of the optical field.
8. The intelligent laser processing method integrating a laser measuring instrument according to claim 7, characterized in that: The dynamic phase reversal calculation of the reverse acoustic damping parameters includes: inputting the bore wall taper and trajectory distortion into a multi-dimensional state evaluation model, extracting the spatial yaw feature vector, and combining the acoustic radiation force formula to calculate the required target sound pressure level and phase difference, which are then output as the reverse acoustic damping parameters.
9. An intelligent laser processing system integrating a laser measuring instrument, based on the intelligent laser processing method integrating a laser measuring instrument as described in any one of claims 1-8, characterized in that, include: The model loading module is used to acquire and load the preset three-dimensional digital model standard of the area to be processed; The acousto-optic coupling generation module is used to generate a diffraction-free light field and drive it to perform spatial trajectory scanning. At the same time, a modulated acoustic wave field with the same frequency as the scanning is synchronously excited in the processing area to construct a multidimensional acousto-optic coupling field. The material removal module is used to remove material from the processing area using the multidimensional acoustic-optical coupling field, and to induce acoustic cavitation effect at the bottom of the hole through the modulated acoustic wave field to enhance the discharge of molten material and heat dissipation. The feature acquisition module is used to acquire fault morphology contour data and borehole wall taper feature data in real time during the processing. The closed-loop control module is used to dynamically adjust the process parameters of the multidimensional acoustic-optic coupling field based on the fault topography contour data and the borehole wall taper feature data, until the three-dimensional topography of the processing area meets the three-dimensional digital model standard.
10. An electronic device, characterized in that, include: At least one processor; as well as A memory that is communicatively connected to the at least one processor; The memory stores a computer program executable by at least one processor, which is executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 8.