A femtosecond laser manufacturing method and apparatus for in-situ shielding structure of fused silica optical element damage

Abstract

This application discloses a femtosecond laser manufacturing method and apparatus for in-situ shielding structure of fused silica optical element damage, relating to the field of engineering optics. The method includes: obtaining the size of the damage point on the light-emitting surface and determining the shielding structure on the light-incident surface; the shielding structure adopts a helical structure, with a central portion consisting of a densely spaced helical shielding area and an edge portion consisting of a softening area with varying spacing helical lines, the spacing of which increases progressively from the inside out to achieve a higher transmittance; determining the processing trajectory and laser parameters based on the shielding structure; cleaning the fused silica optical element; processing the cleaned element using a femtosecond laser based on the processing trajectory and laser parameters; and etching the element with hydrofluoric acid to complete the manufacturing of the light-incident surface damage shielding structure. This application ensures that a strong laser passing through this shielding structure will not irradiate the damaged area again, thus preventing the growth of damage points on the light-emitting surface, achieving the purpose of suppressing damage growth and extending the service life of the optical element.

Description

Technical Field

[0001] This application relates to the field of engineering optics, and in particular to a femtosecond laser manufacturing method and apparatus for an in-situ shielding structure for damage to fused silica optical elements. Background Technology

[0002] The optical system of the Inertial Confinement Fusion (ICF) actuator consists of a large number of optical elements, including many fused silica optical elements with a diameter of more than 400×400mm.

[0003] Because the surface of fused silica optical elements is easily damaged under strong ultraviolet laser irradiation, the damaged area expands rapidly during subsequent strong laser irradiation, eventually rendering the optical element unusable. Due to the difficulty and high cost of processing large-diameter fused silica optical elements, it is necessary to adopt a recycling method to repair the damaged parts. Therefore, it is urgent to solve the problem of surface damage repair of fused silica optical elements and promote their recycling. The implementation of recycling strategies has greatly reduced the production cost of optical elements and promoted the development of optical element repair technology. Currently, the main repair technologies include magnetorheological modification, active ion etching, chemical wet etching, and carbon dioxide laser ablation. After years of development, CO2 laser fused silica optical element repair technology has become relatively mature. However, with the continuous increase in the operating throughput of high-power laser devices, the surface damage scale of fused silica optical elements is constantly increasing, and surface damage point cracks are gradually expanding and extending into the element. Since the aspect ratio of the repaired structure after CO2 laser repair has specific requirements, the lateral dimension of the repair structure must be correspondingly larger to achieve the repair of internal cracks. The increased lateral size of this repair structure will affect the light transmission performance of the components, deteriorate the laser beam quality, and thus reduce the fusion ignition energy. Moreover, repairing large-sized damage points is difficult and costly due to the significantly increased time required. Summary of the Invention

[0004] To address the aforementioned problems in the existing technology, this application provides a femtosecond laser manufacturing method and apparatus for in-situ shielding structure of fused silica optical element damage.

[0005] To achieve the above objectives, this application provides the following solution: In a first aspect, this application provides a femtosecond laser manufacturing method for an in-situ damage shielding structure of fused silica optical elements, comprising: Obtain the size of the damage points on the light-emitting surface of the fused silica optical element; The shielding structure of the incident light surface is determined based on the size of the damage point; the shielding structure adopts a spiral structure; the central part of the shielding structure is a densely spaced spiral shielding area; the edge part of the shielding structure is a variable-spacing spiral softening area; the spiral spacing of the variable-spacing spiral softening area increases continuously from the inside to the outside; The processing trajectory and laser parameters are determined based on the aforementioned shielding structure; Clean the fused silica optical element; A femtosecond laser is used to process the cleaned fused silica optical element based on the processing trajectory and the laser parameters to obtain the processed element; The processing element is etched with hydrofluoric acid to complete the fabrication of the light incident surface damage shielding structure of the fused silica optical element.

[0006] Secondly, this application provides a femtosecond laser manufacturing apparatus for in-situ shielding structure of fused silica optical element damage, comprising: a controller, a laser, and a processing platform system; The controller is connected to the laser and the processing platform system respectively; the controller is used to implement the femtosecond laser manufacturing method for in-situ shielding structure of fused silica optical element damage provided above, so as to control the laser and the processing platform system to complete the manufacturing of the incident surface damage shielding structure of fused silica optical element.

[0007] According to the specific embodiments provided in this application, this application has the following technical effects: This application provides a femtosecond laser manufacturing method and apparatus for in-situ shielding structures of damaged fused silica optical elements. By using a femtosecond laser to process a shielding structure on the incident light surface corresponding to the damage point of the fused silica optical element, after strong laser irradiation passes through the shielding structure, no high-energy laser passes through the corresponding damage area on the output light surface of the fused silica optical element, thereby suppressing damage growth and extending the service life of the fused silica optical element in high-energy laser systems. Furthermore, the design and processing of the shielding repair planar structure for damaged fused silica optical elements using a femtosecond laser, unlike existing methods for repairing damage to the output light surface, can effectively improve damage repair efficiency. The application of hydrofluoric acid etching to process the element has a high damage threshold and low transmittance, thereby suppressing damage to the output light surface and extending service life. Simultaneously, the shielding structure adopts a spiral structure, which can effectively suppress the diffraction effect generated by the shielding structure, will not enhance the optical field of downstream optical elements, and has little impact on subsequent optical path transmission, thus preventing the growth of damage points on the output light surface. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A schematic flowchart of a femtosecond laser manufacturing method for an in-situ damage shielding structure of a fused silica optical element, provided as an embodiment of this application; Figure 2 A schematic diagram of the frame of a femtosecond laser manufacturing apparatus for an in-situ shielding structure for damage to fused silica optical elements, provided in an embodiment of this application; Figure 3 A schematic diagram of a femtosecond laser manufacturing apparatus and its optical path for an in-situ shielding structure for fused silica optical element damage, provided in an embodiment of this application; Figure 4 This is a schematic diagram of the location of the shielding structure provided in one embodiment of this application; Figure 5 This is a schematic diagram of a single-layer shielding structure design provided in an embodiment of this application; Figure 6 This is a schematic diagram of a processed single-layer shielding structure provided in an embodiment of this application; Figure 7 This is a schematic diagram of SEM test results after a femtosecond laser is used to fabricate a shielding structure on the surface of a fused silica optical element, according to an embodiment of this application. Figure 8 This is a schematic diagram of SEM test results after a femtosecond laser is used to process a shielding structure on the surface of a fused silica optical element and then cleaned, according to an embodiment of this application. Figure 9 This is a schematic diagram of SEM test results after a femtosecond laser is used to process a shielding structure on the surface of a fused silica optical element and then etched with hydrofluoric acid, according to an embodiment of this application.

[0010] Figure label: 1-Focusing objective lens, 2-Camera, 3-Beam expander. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0013] In one exemplary embodiment, this application provides a femtosecond laser manufacturing method for an in-situ shielding structure to prevent damage to fused silica optical elements, such as... Figure 1 As shown, the method includes: Step 100: Obtain the size of the damage point on the light-emitting surface of the fused silica optical element.

[0014] Step 101: Determine the blocking structure of the incident light surface based on the size of the damage point. The blocking structure adopts a spiral structure. The central part of the blocking structure is a densely spaced spiral blocking area; the edge part of the blocking structure is a variable-spacing spiral softening area; the spiral spacing of the variable-spacing spiral softening area increases continuously from the inside to the outside. In practical applications, to effectively suppress the diffraction effect generated by the shielding structure, avoid enhancing the light field of downstream optical components, and minimize the impact on subsequent optical path transmission, step 101 includes: determining the diameter of the central shielding structure and the edge softening layer structure based on the damage point size; and forming the shielding structure based on the diameter of the central shielding structure and the edge softening layer structure.

[0015] Furthermore, to ensure that no high-energy laser light passes through the corresponding damage area from the light-emitting surface of the fused silica optical element, thereby further effectively suppressing damage growth, step 101 includes the following steps: (1) Determine the initial blocking structure of the incident surface based on the size of the damage point.

[0016] (2) Based on the initial shading structure, a light transmission simulation model and a transmittance change model were established by combining fused silica optical elements.

[0017] (3) Light transmission simulation was performed based on the light transmission simulation model and the transmittance change model to obtain simulation results.

[0018] (4) When the simulation results do not meet the set requirements, adjust the initial occlusion structure and return to step (2). Wherein, the damage threshold is greater than the set damage value and the occlusion efficiency is less than the set efficiency value.

[0019] (5) When the simulation results meet the set requirements, the initial occlusion structure is the occlusion structure.

[0020] Furthermore, the spacing between the lines in the equally spaced dense spiral blocking region is determined based on the parameters of the focusing objective lens used during manufacturing. For example, this spacing is twice the diameter of the focused spot of the focusing objective lens. The variation in the spiral spacing of the variable spacing spiral softening region is determined by the focusing objective lens parameters and the softening region design. For example, the spacing gradually changes from twice the focused spot diameter to three, four, five, six, seven times, and so on. The specific range of variation and the maximum spacing value are specifically determined by the requirements of the softening region.

[0021] Step 102: Determine the machining trajectory and laser parameters based on the obstruction structure. Laser parameters include laser energy, repetition rate, and scanning speed.

[0022] Step 103: Clean the fused silica optical components.

[0023] Step 104: Using a femtosecond laser, the cleaned fused silica optical element is processed based on the processing trajectory and laser parameters to obtain the processed element. The wavelength of the femtosecond laser can be 1030 nm.

[0024] This step uses a femtosecond laser to process the cleaned fused silica optical element based on the processing trajectory and laser parameters. The process of obtaining the processed element also includes: Real-time acquisition of processing images of fused silica optical components after cleaning during the processing.

[0025] The current processing position is determined based on the processing image.

[0026] The laser parameters are adjusted in real time based on the current processing position. This adjustment process can be combined with the optical transmission simulation described below.

[0027] Step 105: Use hydrofluoric acid to etch the components to complete the fabrication of the light incident surface damage shielding structure of the fused silica optical element.

[0028] Furthermore, after etching the components with hydrofluoric acid, the etched components can be subjected to mega-sound rinsing and drying.

[0029] Based on the same inventive concept, this application also provides an apparatus for manufacturing a femtosecond laser structure for in-situ shielding structure of fused silica optical element damage, used to implement the aforementioned method for manufacturing a femtosecond laser structure for in-situ shielding structure of fused silica optical element damage. The solution provided by this apparatus is similar to the solution described in the above method. Therefore, the specific limitations of one or more embodiments of the femtosecond laser manufacturing apparatus for in-situ shielding structure of fused silica optical element damage provided below can be found in the limitations of the femtosecond laser manufacturing method for in-situ shielding structure of fused silica optical element damage described above, and will not be repeated here.

[0030] In one exemplary embodiment, such as Figure 2 As shown, a femtosecond laser manufacturing apparatus for in-situ shielding structure of fused silica optical element damage is provided, comprising: a controller, a laser, and a processing platform system.

[0031] The controller is connected to both the laser and the processing platform system. The controller is used to implement the femtosecond laser manufacturing method for in-situ damage shielding structures of fused silica optical elements, as described above, to control the laser and processing platform system to complete the manufacturing of the incident light surface damage shielding structure of the fused silica optical element. The laser is used to emit a femtosecond laser (1030 nm, less than 290 fs). As an optional implementation method, such as Figure 2 As shown, the femtosecond laser fabrication apparatus for in-situ shielding structure of fused silica optical element damage provided in this application also includes: a water-cooling device and a coaxial microscope system. The coaxial microscope system is used to determine the focal plane of the light-applied processing and to observe the condition of the processed surface.

[0032] Among them, such as Figure 3 As shown, the coaxial microscope system includes a camera 2 (such as a CCD camera). The processing platform system includes a focusing objective 1 and an XYZ platform.

[0033] In an exemplary embodiment, an optical material is used as the fused silica optical element after surface polishing, with a surface roughness of approximately 1 nm. Based on the device structure provided above, taking the processing of an incident surface shielding structure on this material as an example, the specific implementation process of the femtosecond laser manufacturing method for the in-situ shielding structure of the fused silica optical element damage provided in this application will be described. The real-time process includes: Step 1: Design a dense spiral shielding structure on the front surface so that the shielding structure can completely block the damage area of ​​the light-emitting surface of the fused silica optical element and effectively suppress the diffraction effect.

[0034] Step 2: After cleaning the fused silica optical element to be processed, fix it on the XYZ platform.

[0035] Step 3: Adjust the output wavelength of the femtosecond laser to 1030nm, move the XYZ platform to the focusing objective, plan the laser processing trajectory according to the pre-designed shielding structure, and adjust the laser parameters such as laser energy, repetition frequency, and scanning speed, and process at the position of the front surface (i.e. the incident light surface) corresponding to the damage point.

[0036] Step 4: Etch the processed fused silica optical element with hydrofluoric acid.

[0037] Based on the above description, in step 1, the diameter of the central shielding structure and the edge softening layer structure of the light-emitting surface will be designed according to the size of the damage point on the light-emitting surface of the fused silica optical element. After the shielding structure is designed, the cleaned fused silica optical element will be fixed onto the XYZ platform. After all the equipment is ready, the processing will begin.

[0038] In this embodiment, the laser used can be a 1030nm wavelength tunable femtosecond laser (the optical path and structural layout of the femtosecond laser are as follows). Figure 3 As shown, the structure includes multiple mirrors, polarizers, λ / 2 waveplates, and beam expanders (3). All parameters related to the femtosecond laser are adjustable, and the shielding structure is fabricated by controlling the laser parameters. An example shielding structure fabricated in this application is a shielding layer on a fused silica surface, with the shielding layer positioned as shown... Figure 4 As shown, the structure of a single shading structure is as follows: Figure 5 As shown, the processing effect of a single shielding structure is as follows: Figure 6 As shown.

[0039] In one exemplary embodiment, to adopt the specification as Taking a fused silica optical element as an example, the specific method of processing a shielding structure on the light-incident surface of a fused silica optical element based on a femtosecond laser is described using the device structure and method flow provided above in this application.

[0040] The first step is to design the diameter of the light-emitting surface blockage center structure and the edge softening zone structure based on the size of the damage point on the light-emitting surface of the fused silica optical element and the element thickness.

[0041] The second step involves processing the light-injection surface shielding structure by adjusting the parameters and planning the trajectory of the femtosecond laser.

[0042] Will as Figure 2 The device shown is divided into a laser section and a machine tool section. The laser section includes a laser, controller, and water cooling equipment. The machine tool section includes a controller, XYZ platform, focusing lens, and CCD camera (used to observe and determine the processing position). The laser section is used to process and repair microstructures by masking the light-receiving surface of fused silica optical elements.

[0043] 1) Design of light-incident surface shielding structure for fused silica optical elements.

[0044] This application designs an incident surface shielding structure based on the damage size of the light-emitting surface of the fused silica optical element. The structure consists of a central densely spaced spiral shielding area and an edge variable-spaced spiral softening area.

[0045] The shielding structure design determines the diameter of the shielding structure based on the size of the damage point to be shielded and the thickness of the component, and designs the edge softening zone structure based on the thickness of the fused silica optical element and the light transmission characteristics. The diameter of the central shielding zone and the edge softening zone structure of the outermost shielding structure are jointly determined by the positioning accuracy of the machine tool and laser parts, the light transmission direction error, and the size of the damage structure to be shielded on the rear surface. Based on these factors, a light transmission simulation model is established to experimentally simulate light transmission. In the light transmission simulation results, the shielding zone formed on the rear surface (i.e., the light-emitting surface) must be able to completely shield the damage point under maximum error conditions.

[0046] Based on the subsequent optical transmission characteristics in the device, parameters such as the variable pitch of the spirals in the edge softening region and the width of the softening region are designed. A transmittance variation model is established for the parameters such as the variable pitch of the spirals in the edge softening region and the width of the softening region. Based on this model, optical transmission simulation experiments are performed to ensure that the optical transmission calculation results do not produce modulation enhancement at the locations where optical elements exist in the entire optical link.

[0047] 2) Incident surface shielding structure for femtosecond laser processing of fused silica optical elements.

[0048] After designing the shielding structure, while considering both the damage threshold after hydrofluoric acid (HF) etching and the shielding efficiency, the power, repetition rate, and scanning speed of the femtosecond laser are optimized. (The specific optimization process can be based on the focusing objective parameters, continuously changing the combination of laser power, repetition rate, and scanning speed to obtain an acceptable damage threshold and shielding efficiency for the laser.) The damage threshold of the front surface (i.e., the incident surface) shielding structure should be greater than the maximum possible operating flux of the laser, while the product of the maximum possible operating flux and the shielding efficiency should be less than the damage growth threshold of fused silica optical elements, which is 4 J / cm². 2 (This completes the parameter optimization process), and the shielding structure is fabricated based on the optimized laser parameter configuration. The shielding structure achieved after parameter optimization ensures that the laser flux irradiating the damaged structure after maximum laser throughput is less than the damage growth threshold of fused silica optical elements (4 J / cm²). 2 This effectively inhibits damage growth and improves the service life of fused silica optical elements in high-energy laser systems.

[0049] Furthermore, during the optimization process, when the incident femtosecond laser aperture is 5mm, the processing of the single-layer spiral structure involves keeping the laser beam position stationary and relying on the differential motion between the X and Y axes of the XYZ platform to achieve the processing of the shielding structure.

[0050] In the example of this application, the diameter of the central dense spiral region of the shielding structure is 1 mm, and the damage point size of the light-emitting surface is mainly 500 μm.

[0051] 3) Etching of fused silica optical elements with hydrofluoric acid (HF).

[0052] After the processed fused silica optical element (i.e. the processed element) is cleaned with alkaline solution, cleaned with ultrapure water, etched with mega-sonic hydrofluoric acid, rinsed with mega-sonic acid, and dried, the shielding structure with a high damage threshold is completed.

[0053] In this embodiment, the scanning electron microscope (SEM) test results after the femtosecond laser fabricated the shielding structure on the surface of the fused silica optical element are as follows: Figure 7 As shown, the SEM test results after femtosecond laser processing of the shielding structure on the surface of the fused silica optical element and subsequent cleaning are as follows. Figure 8 As shown, the SEM test results after femtosecond laser fabrication of a shielding structure on the surface of a fused silica optical element and etching with hydrofluoric acid are as follows. Figure 9 As shown.

[0054] Unless otherwise specified, the experimental methods used in the above embodiments are all conventional experimental methods.

[0055] In summary, compared with the prior art, the femtosecond laser manufacturing method and apparatus for in-situ shielding structure of fused silica optical element damage provided in this application has at least the following advantages: 1) Using femtosecond lasers to design and fabricate a damage shielding repair planar structure (i.e., shielding structure) for the light-incident surface of fused silica optical elements can effectively improve the damage repair efficiency.

[0056] 2) Etching the shielding structure with hydrofluoric acid results in a high damage threshold and low transmittance, which can suppress damage growth on the light-emitting surface and extend service life. Simultaneously, the shielding structure has an edge softening region, which effectively suppresses diffraction effects and does not enhance the light field of downstream optical components, thus having minimal impact on subsequent optical path transmission.

[0057] 3) Using femtosecond lasers to process the light-blocking structure of the incident surface of fused silica optical elements can improve processing efficiency, increase the flexibility of multi-scale structure processing, and effectively block damage of large, medium and small scales.

[0058] 4) Damage points on multiple optical elements that are distributed in close proximity can be concentrated on a single lightweight, easy-to-disassemble and install shielding structure, thereby simplifying the damage repair operation of the load optical path system.

[0059] In one exemplary embodiment, a computer device is provided, which may be a server or a terminal. The computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is connected to the system bus via the I / O interfaces. The processor of the computer device provides computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database of the computer device stores femtosecond laser manufacturing data for in-situ shielding structures of fused silica optical elements damaged. The I / O interfaces of the computer device are used for exchanging information between the processor and external devices. The communication interface of the computer device is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a method for femtosecond laser manufacturing of in-situ shielding structures of fused silica optical elements damaged.

[0060] In one exemplary embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0061] In one exemplary embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0062] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0063] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (RRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM).

[0064] The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A femtosecond laser manufacturing method for an in-situ shielding structure to prevent damage to fused silica optical elements, characterized in that, include: Obtain the size of the damage points on the light-emitting surface of the fused silica optical element; The blocking structure of the incident light surface is determined based on the size of the damage point; The shielding structure adopts a spiral structure; The central part of the shielding structure is a densely spaced spiral shielding area; the edge part of the shielding structure is a variable-spacing spiral softening area; the spiral spacing of the variable-spacing spiral softening area increases continuously from the inside to the outside. The processing trajectory and laser parameters are determined based on the aforementioned shielding structure; Clean the fused silica optical element; A femtosecond laser is used to process the cleaned fused silica optical element based on the processing trajectory and the laser parameters to obtain the processed element; The processing element is etched with hydrofluoric acid to complete the fabrication of the light incident surface damage shielding structure of the fused silica optical element.

2. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 1, characterized in that, The blocking structure of the incident surface is determined based on the size of the damage point, including: The diameter of the central blocking structure of the incident surface and the edge softening layer structure are determined based on the size of the damage point. The occlusion structure is obtained based on the diameter of the central occlusion structure and the edge softening layer structure.

3. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 1, characterized in that, The femtosecond laser has a wavelength of 1030 nm.

4. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 1, characterized in that, The laser parameters include laser energy, repetition rate, and scanning speed.

5. The femtosecond laser manufacturing method for the in-situ damage shielding structure of fused silica optical elements according to claim 4, characterized in that, The process of processing the cleaned fused silica optical element using a femtosecond laser, based on the processing trajectory and the laser parameters, to obtain the processed element includes: Real-time acquisition of processing images of the cleaned fused silica optical element during the processing; Determine the current processing position based on the processed image; The laser parameters are adjusted in real time based on the current processing position.

6. The femtosecond laser manufacturing method for the in-situ damage shielding structure of fused silica optical elements according to claim 1, characterized in that, The spacing between the lines of the equally spaced dense spiral shielding region is determined based on the parameters of the focusing objective lens used in the manufacturing process; the variation of the spiral spacing in the variable spacing spiral softening region is determined in combination with the focusing objective lens parameters and the design of the softening region.

7. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 1, characterized in that, The blocking structure of the incident surface is determined based on the size of the damage point, including: The initial blocking structure of the incident light surface is determined based on the size of the damage point; Based on the initial blocking structure, a light transmission simulation model and a transmittance variation model are established using the fused silica optical element, respectively. Based on the optical transmission simulation model and the transmittance variation model, optical transmission simulation was performed, and simulation results were obtained. When the simulation results do not meet the set requirements, adjust the initial occlusion structure and return to the steps of establishing a light transmission simulation model and a transmittance change model based on the initial occlusion structure and the fused silica optical element, respectively. When the simulation results meet the set requirements, the initial occlusion structure is the occlusion structure.

8. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 7, characterized in that, The setting requirements refer to a damage threshold greater than a set damage value and an occlusion efficiency less than a set efficiency value.

9. The femtosecond laser manufacturing method for the in-situ shielding structure of fused silica optical element damage according to claim 1, characterized in that, After etching the processed element with hydrofluoric acid, the process further includes: The etched components are then subjected to mega-sound rinsing and drying.

10. A femtosecond laser manufacturing apparatus for in-situ shielding structure of fused silica optical element damage, characterized in that, include: Controller, laser, and processing platform system; The controller is connected to both the laser and the processing platform system. The controller is used to implement the femtosecond laser manufacturing method for in-situ shielding structure of fused silica optical element damage as described in any one of claims 1-9, so as to control the laser and the processing platform system to complete the manufacturing of the incident surface damage shielding structure of the fused silica optical element.

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