A turning plate milling chip removal lubricating device, a milling tool and a chip removal lubricating method

Abstract

The present application relates to machine tool accessory technical field, especially to a kind of plate milling chip removal lubricating device, milling cutter and chip removal lubricating method.The device includes disc body, and negative pressure adsorption structure and lubricating structure are arranged on disc body;Disc body is provided with annular baffle and annular protrusion;Negative pressure adsorption structure includes vacuum generation flow channel and airflow channel, vacuum generation flow channel is distributed along the radial direction of disc body, airflow channel is communicated with vacuum generation flow channel, the bottom of airflow channel is provided with suction groove, and suction groove is located at the radial outer side of annular baffle;Lubricating structure includes liquid flow channel and nozzle flow channel, liquid flow channel is annular flow channel and is aligned with annular protrusion, nozzle flow channel is opened in annular protrusion and is communicated with liquid flow channel.The present application solves the problem that chips are easy to splash into the cavity during plate milling, effectively controls the flight trajectory of chips, and has micro-lubrication and cooling functions simultaneously.

Description

Technical Field

[0001] This invention relates to the field of machine tool accessories technology, and in particular to a chip removal and lubrication device, milling cutter, and chip removal and lubrication method for flip milling. Background Technology

[0002] Flip milling is a high-end machining method used for efficient roughing and finishing of large, thin-walled, or complex aerospace components. This process transforms vertical milling into horizontal milling by flipping the workpiece 90 degrees to a vertical position, allowing chips to fall directly into a recovery bin under gravity, thus preventing chip accumulation on the workpiece cavity surface.

[0003] In the field of flip milling, the machining objects are mainly thin-walled structural parts with various types of cavities. Gravity and the flushing effect of cutting fluid alone cannot accurately control the chip discharge direction. Traditional negative pressure chip removal methods and devices are mostly geared towards deep hole drilling. For example, existing technology discloses an internal cooling chip removal and lubrication device for deep hole machining of motor bases, which uses high-pressure coolant to generate negative pressure at the top of an annular negative pressure channel to draw out the coolant and chips. However, this device is assembled from multiple dispersed functional components, resulting in a complex flow channel structure, and the airtightness of the negative pressure is limited by the assembly and machining accuracy of the components. For milling, existing technology discloses chip removal devices for vertical milling machines, which use a follow-up chip removal nozzle mounted on the machine bed to deliver high-pressure airflow to blow chips into the chip removal groove. However, flip milling and vertical milling have different processes and operating conditions, and the above-mentioned gas jet method is difficult to effectively remove chips deep in narrow grooves during flip milling. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a chip removal and lubrication device for flip milling, which solves the problem of chips easily splashing into the cavity during flip milling, achieves effective control of chip flight trajectory, and also has micro-lubrication and cooling functions.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions: In a first aspect, embodiments of the present invention provide a chip removal and lubrication device for flip milling, for mounting on a tool holder, comprising a disc body, wherein the disc body is provided with a negative pressure adsorption structure and a lubrication structure; one end face of the disc body is provided with an annular baffle and an annular protrusion, the annular baffle being located on the outer ring of the annular protrusion; the negative pressure adsorption structure includes a vacuum generating channel and an air flow channel, the vacuum generating channel being distributed radially along the disc body, the air flow channel being annular and communicating with the vacuum generating channel, the bottom of the air flow channel being provided with a circumferential array of baffles, the baffles forming a suction groove, the suction groove being located radially outside the annular baffle; the lubrication structure includes a liquid flow channel and a nozzle flow channel, the liquid flow channel being annular and aligned with the annular protrusion, the nozzle flow channel being formed in the annular protrusion and communicating with the liquid flow channel.

[0006] As a further technical solution, both the annular baffle and the annular protrusion are located on the end face of the disk body facing the milling process, and the height of the annular baffle is greater than the height of the annular protrusion.

[0007] As a further technical solution, the end face of the disk body facing the milling process forms a ramp, the ramp is conical, the distance from the inner circle of the ramp to the milling surface is greater than the distance from the outer circle of the ramp to the milling surface, and the air intake groove is provided on the ramp.

[0008] As a further technical solution, the nozzle flow channel is arranged at an angle, and the distance from the liquid inlet end of the nozzle flow channel to the center line of the disk body is greater than the distance from the liquid outlet end of the nozzle flow channel to the center line of the disk body.

[0009] As a further technical solution, the vacuum generating flow channel includes an air inlet, a Laval nozzle, an ejected cavity, a mixing pipe, and an exhaust port. The air inlet, Laval nozzle, ejected cavity, mixing pipe, and exhaust port are arranged radially from the inside to the outside. The air inlet is located on the mounting hole at the center of the disk body, and the exhaust port is located on the outer wall surface of the disk body. The ejected cavity is connected to the airflow channel.

[0010] Secondly, embodiments of the present invention also provide a milling cutter, including a tool holder, a cutter head, and the aforementioned flip-plate milling chip removal and lubrication device. The cutter head is mounted on the end of the tool holder, and the outer wall of the tool holder has a mounting frustum. The center of the disc body of the chip removal and lubrication device is provided with a mounting hole, and the mounting hole is mounted on the mounting frustum.

[0011] As a further technical solution, a positioning slot is provided on the mounting hole of the disc body, and a positioning protrusion is provided on the mounting platform of the tool holder, the positioning protrusion being inserted into the positioning slot.

[0012] As a further technical solution, the tool holder is provided with a liquid supply structure and a gas supply structure. The liquid supply structure includes a main liquid supply channel and a branch liquid supply channel. The main liquid supply channel is annular, and the branch liquid supply channel connects the main liquid supply channel and the lubrication structure. The gas supply structure includes a main gas supply channel and a branch gas supply channel. The main gas supply channel is located at the center of the tool holder, and the branch gas supply channel connects the main gas supply channel and the negative pressure adsorption structure. The liquid supply branch channel and the gas supply branch channel are staggered in the axial and radial directions.

[0013] Thirdly, embodiments of the present invention also provide a chip removal lubrication method for a flip-milling chip removal lubrication device: Gas and lubricating liquid are supplied into the inside of the tool holder; The gas forms a high-speed jet in the vacuum generating channel, the high-speed jet generates negative pressure, the negative pressure is transmitted to the airflow channel and the suction groove, so that a negative pressure area is formed at the suction groove, the negative pressure area generates suction force on the chips, the suction force and the weight of the chips form a resultant force, and the resultant force changes the flight trajectory of the chips; The lubricating fluid is sprayed into the cutting area of ​​the tool through the nozzle channel.

[0014] As a further technical solution, the gas supply pressure to the inside of the tool holder is adjusted in real time according to the working conditions, and the gas supply pressure is determined by the following formula: P in =A×n+B×f z +C×m+P0; Among them, P in The pressure gauge for the air supply to the vacuum generation channel inlet is MPa; n is the milling cutter spindle speed in r / min; f z is the single-tooth feed rate, in mm / z; m is the average mass of a single chip, in mg; A, B, and C are experimental calibration coefficients, all of which are positive; P0 is the minimum air supply pressure that generates effective suction, in MPa.

[0015] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages: The chip removal and lubrication device for flip milling of the present invention features a negative pressure adsorption structure and a lubrication structure on the disc body. Vacuum generating channels are radially distributed, forming suction grooves at the bottom of the channels. When high-pressure gas flows through the vacuum generating channels, negative pressure is generated, creating a negative pressure area at the suction grooves. This suction force pulls the chips further away from the machined surface. This suction force, combined with the chip's gravity, guides the chips directly into the recovery chamber before they splash into the cavity. Therefore, this device treats chips through negative pressure adsorption rather than jet blowing, and is not limited by the depth of narrow grooves or spatial location. It can effectively extract chips that have not yet fallen into the cavity, solving the problem of chips easily splashing into the cavity during flip milling, and achieving trajectory control and effective cleaning of the chips. Simultaneously, the liquid flow channels and nozzle channels of the lubrication structure spray lubricating liquid onto the tool cutting area, achieving micro-lubrication and cooling. Furthermore, an annular baffle separates the negative pressure working area from the lubrication working area, ensuring that the chip removal and lubrication functions do not interfere with each other.

[0016] Advantages of additional aspects of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In addition, the dimensions or spacing between the components are exaggerated to show the position of each component, and the schematic diagrams are for illustrative purposes only.

[0018] Figure 1 This is a schematic diagram of the overall chip removal and lubrication device provided in an embodiment of the present invention; Figure 2 This is a three-dimensional cross-sectional view of the chip removal and lubrication device provided in an embodiment of the present invention; Figure 3 This is a cross-sectional view of the chip removal and lubrication device provided in an embodiment of the present invention; Figure 4 This is a bottom view of the chip removal and lubrication device provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the airflow channel fluid domain in the chip removal lubrication device provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the overall simulation of the fluid domain provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the fluid domain cross-section simulation provided in an embodiment of the present invention; Figure 8This is a schematic diagram of a milling tool provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the overall handle provided in an embodiment of the present invention; Figure 10 This is a cross-sectional view of the first section of the tool holder provided in an embodiment of the present invention; Figure 11 This is a cross-sectional view of the second section of the tool holder provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the installation of the tool holder and chip removal lubrication device provided in an embodiment of the present invention; Figure 13 This is a first cross-sectional view of the tool holder and chip removal lubrication device provided in an embodiment of the present invention; Figure 14 This is a second cross-sectional view of the tool holder and chip removal lubrication device provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of the processing state provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of the chip trajectory change provided in an embodiment of the present invention; In the diagram: 1. Chip removal and lubrication device; 11. Disc body; 111. Positioning slot; 112. Annular baffle; 113. Annular protrusion; 114. Inclined platform; 115. Mounting hole; 12. Negative pressure adsorption structure; 121. Vacuum generation channel; 1211. Exhaust port; 1212. Mixing pipe; 1213. Injection chamber; 1214. Laval nozzle; 1215. Air inlet; 122. Airflow channel; 123. Suction groove; 13. Lubrication structure; 131. Liquid flow channel; 132. Nozzle flow channel; 2. Tool holder; 21. Liquid supply structure; 211. Main liquid supply channel; 212. Sub-liquid supply channel; 22. Air supply structure; 221. Main air supply channel; 222. Sub-air supply channel; 23. Positioning protrusion; 24. Mounting frustum; 3. Tool head. Detailed Implementation

[0019] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0020] Generally speaking, the terms "comprising" and "including" only indicate that the steps and elements are explicitly identified, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements.

[0021] Example 1 The main objects processed by flip milling are thin-walled structural parts with various types of cavities. During the processing, the direction of chip discharge cannot be precisely controlled by gravity and the flushing effect of cutting fluid alone. Furthermore, due to the depth, structure and spatial position of the cavity, some chips will still remain in the narrow gaps or corners of the cavity, which will affect the quality of the cutting tool and the cutting surface.

[0022] Traditional negative pressure chip removal methods and devices are mostly geared towards deep hole drilling processes. For example, existing technology discloses an internal cooling chip removal and lubrication device for deep hole machining of motor bases. During operation, part of the high-pressure coolant passes through the cooling channel to cool the tool and break chips, while the other part generates negative pressure at the top of the annular negative pressure channel, drawing out the coolant and chips. This creates a dual effect of high-pressure internal cooling and negative pressure chip removal, solving the problems of insufficient tool cooling and difficult chip removal in deep hole machining. For milling, existing technology discloses a high-efficiency chip removal telescopic guide rail protective cover for vertical milling machines. A follow-up chip removal nozzle mounted on the machine bed delivers high-pressure airflow to blow chips into the chip removal groove, thus achieving efficient chip removal. Essentially, it utilizes gas jet flushing to carry away the chips.

[0023] Due to differences in processes and operating conditions, flip milling cannot directly utilize the negative pressure chip removal mechanism of deep hole drilling. Furthermore, existing gas / liquid jet methods for vertical milling are difficult to effectively remove chips deep in narrow slots during flip milling. Therefore, existing technologies lack a chip removal solution for flip milling that comprehensively utilizes both gravity and negative pressure suction principles, addressing the complex chip distribution in flip milling.

[0024] This embodiment is based on the concept of fully controlled chip removal in flip milling. Utilizing the basic physical principle of Bernoulli, an airflow field is formed in the chip contact area between the tool and the workpiece, creating a suction effect. The combined force of gravity and the airflow field alters the chip trajectory, preventing chips from entering the cavity and causing them to fall into the recovery chamber. A small amount of lubricating liquid is mixed into the supplied airflow, achieving the effects of micro-lubrication, cooling, and friction reduction. This significantly improves the manufacturing efficiency and effectiveness of high-end flip milling processes, and has a positive effect on improving tool life, surface finish, and manufacturing efficiency in flip milling.

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, in a typical embodiment of this disclosure, a flip milling chip removal and lubrication device 1 is provided for mounting on a tool holder 2. It includes a disc body 11, on which a negative pressure adsorption structure 12 and a lubrication structure 13 are provided. One end face of the disc body 11 is provided with an annular baffle 112 and an annular protrusion 113, the annular baffle 112 being located on the outer ring of the annular protrusion 113. The negative pressure adsorption structure 12 includes a vacuum generating channel 121 and an airflow channel 122, the vacuum generating channel 121 extending along the disc body... The airflow channel 122 is annular and communicates with the vacuum generating channel 121. The bottom of the airflow channel 122 is provided with a circumferential array of baffles, and the baffles form a suction groove 123. The suction groove 123 is located on the radial outer side of the annular baffle 112. The lubrication structure 13 includes a liquid flow channel 131 and a nozzle flow channel 132. The liquid flow channel 131 is annular and aligned with the annular protrusion 113. The nozzle flow channel 132 is formed in the annular protrusion 113 and communicates with the liquid flow channel 131.

[0026] The disk body 11 serves as the base of the device. An annular baffle 112 and an annular protrusion 113 on its end face define the negative pressure working area and the lubrication working area. The annular baffle 112 is located on the outer ring of the annular protrusion 113, causing the negative pressure adsorption structure 12 to be located radially outside the disk body 11, and the lubrication structure 13 to be located radially inside. The negative pressure adsorption structure 12 consists of a vacuum generating channel 121 and an airflow channel 122. The vacuum generating channel 121 is radially distributed and is used to convert high-pressure gas into a high-speed jet and generate negative pressure. The airflow channel 122 is annular and communicates with the vacuum generating channel 121. A suction groove 123 is formed between the baffles at its bottom. The suction groove 123 is located radially outside the annular baffle 112 and is used to transfer negative pressure to the outside and generate suction for the chips. The lubrication structure 13 consists of a liquid flow channel 131 and a nozzle flow channel 132. The liquid flow channel 131 is an annular flow channel and is aligned with the annular protrusion 113. The nozzle flow channel 132 is opened in the annular protrusion 113 and communicates with the liquid flow channel 131, and is used to spray lubricating liquid onto the cutting area of ​​the tool.

[0027] This device integrates the negative pressure adsorption structure 12 and the lubrication structure 13 onto the same disc body 11, achieving synergy between chip removal and lubrication functions. The bottom space of the device is divided into two areas by the annular baffle 112: the inner radial ring is the cutting fluid working area, and the outer radial ring is the negative pressure working area. The suction force generated by the negative pressure adsorption structure 12 combines with the gravity of the chips, altering their flight trajectory and causing them to fall directly into the recovery chamber before splashing into the cavity. The lubrication structure 13 precisely supplies lubricating liquid to the tool rake face area through the nozzle flow channel 132, achieving micro-lubrication and cooling. The annular baffle 112 separates the negative pressure working area from the lubrication working area, preventing the lubricating liquid from being attracted by the negative pressure in the suction groove 123 area after being sprayed from the nozzle, thus preventing it from reaching the tool cooling and lubrication area. The suction groove 123 is located radially outside the annular baffle 112, keeping the negative pressure area away from the tool cutting area and avoiding interference with the supply of lubricating spray.

[0028] In some further specific examples of this disclosure, the annular baffle 112 and the annular protrusion 113 are both located on the milled end face of the disk body 11, and the height of the annular baffle 112 is greater than the height of the annular protrusion 113.

[0029] During the flip milling process, the annular baffle 112 acts as a physical barrier, separating the negative pressure area of ​​the radial outer ring from the lubrication area of ​​the radial inner ring. Because the annular baffle 112 is higher than the annular protrusion 113, the lubricating spray ejected from the nozzle channel 132 is blocked by the annular baffle 112 as it moves towards the tool's rake face. This prevents it from being deflected by the negative pressure at the radially outer suction groove 123, thus ensuring that the lubricating spray accurately reaches the cutting area of ​​the tool. Simultaneously, the higher annular baffle 112 limits the negative pressure range at the suction groove 123 to the outside of the annular baffle 112, preventing interference from the negative pressure on the lubricating spray.

[0030] In some other specific examples of this disclosure, the end face of the disk body 11 facing the milling process forms a ramp 114, the ramp 114 is conical, the distance from the inner ring of the ramp 114 to the milling process surface is greater than the distance from the outer ring of the ramp 114 to the milling process surface, and the suction groove 123 is disposed on the ramp 114.

[0031] The inclined platform 114 is conical, and this conical structure causes the opening of the suction groove 123 on the inclined platform 114 to face radially outward. During the flip milling process, chips separate from the workpiece surface and splash outward. The opening direction of the suction groove 123 is opposite to the direction of chip splashing, which is beneficial for the negative pressure area to generate suction force on the chips. At the same time, the suction groove 123 is located on the inclined platform 114, so that the negative pressure adsorption area is formed on the radial outer ring of the disc body 11, that is, away from the milling area or the lubrication spray action area, further reducing interference with the lubrication spray.

[0032] In some other specific examples of this disclosure, the nozzle channel 132 is arranged at an angle, and the distance from the liquid inlet end of the nozzle channel 132 to the center line of the disk body 11 is greater than the distance from the liquid outlet end of the nozzle channel 132 to the center line of the disk body 11.

[0033] The inlet end of the nozzle channel 132 is located radially outward of the disk body 11, and the outlet end is located radially inward of the disk body 11. This inclined arrangement causes the lubricating spray ejected from the nozzle channel 132 to converge towards the center of the disk body 11. During the flip milling process, the milling cutter is located in the central region of the disk body 11. With the nozzle channel 132 inclined, the spray direction of the lubricating spray points towards the center of the disk body 11, that is, towards the cutting area of ​​the tool. If the nozzle channel 132 is arranged parallel to the axial direction, the lubricating spray may diffuse outward and fail to accurately reach the rake face of the tool. By the inclined arrangement, the lubricating spray is converged and concentrated to the cutting area of ​​the tool, improving the utilization rate of the lubricating fluid. At the same time, the outlet end of the nozzle channel 132 is located radially inward, that is, within the inner ring of the annular baffle 112, so that the spray path of the lubricating spray is within the protection range of the annular baffle 112, further reducing the interference of the negative pressure area on the lubricating spray.

[0034] In some other specific examples of this disclosure, the vacuum generating channel 121 includes an air inlet 1215, a Laval nozzle 1214, an ejected cavity 1213, a mixing pipe 1212, and an exhaust port 1211. The air inlet 1215, the Laval nozzle 1214, the ejected cavity 1213, the mixing pipe 1212, and the exhaust port 1211 are arranged radially from the inside to the outside. The air inlet 1215 is located on the mounting hole 115 at the center of the disk body 11, and the exhaust port 1211 is disposed on the outer wall surface of the disk body 11. The ejected cavity 1213 is connected to the airflow channel 122.

[0035] like Figure 5 , Figure 6 , Figure 7As shown, the air inlet 1215 is located on the mounting hole 115 at the center of the disk body 11, and is used to receive high-pressure gas supplied from inside the tool holder 2. The high-pressure gas enters the Laval nozzle 1214 through the air inlet 1215, where it is further compressed and accelerated to form a high-speed jet. After the high-speed jet enters the ejection chamber 1213, a relatively low pressure is generated according to Bernoulli's principle. The ejection chamber 1213 is connected to the airflow channel 122, creating a negative pressure region at the suction groove 123. External air is drawn into the ejection chamber 1213 under the action of negative pressure, mixes with the high-speed jet, and flows together through the mixing pipe 1212, finally being discharged from the exhaust port 1211 located on the outer wall of the disk body 11. This design of the vacuum generating channel 121 allows the device to generate negative pressure suction using only the supplied high-pressure gas without an external vacuum pump. The use of the Laval nozzle 1214 increases the speed of the high-speed jet and enhances the negative pressure effect.

[0036] Example 2 This embodiment provides a milling tool, such as Figure 8 As shown, the device includes a tool holder 2, a tool head 3, and a flip milling chip removal and lubrication device 1 as described in Embodiment 1. The tool head 3 is installed at the end of the tool holder 2. The outer wall of the tool holder 2 has a mounting frustum 24. The center of the disc body 11 of the chip removal and lubrication device 1 is provided with a mounting hole 115, which is installed on the mounting frustum 24.

[0037] The cutting head 3 is mounted on the end of the tool holder 2 for milling operations. The outer wall of the tool holder 2 has a mounting frustum 24, and the disc body 11 of the chip removal and lubrication device 1 has a mounting hole 115 at its center. The mounting hole 115 and the mounting frustum 24 are interference-fitted, allowing the chip removal and lubrication device 1 to be mounted on the tool holder 2. During horizontal milling operations, the chip removal and lubrication device 1 rotates with the tool holder 2, and the negative pressure area at the suction groove 123 generates suction on the chips, changing their flight trajectory. The rotation of the chip removal and lubrication device 1 with the tool holder 2 also helps prevent chips from clogging the suction groove 123: chips adsorbed on the suction groove 123 are thrown outwards by the centrifugal force of the rotating device. The fit between the mounting hole 115 and the mounting frustum 24 ensures that the chip removal and lubrication device 1 is accurately and reliably mounted on the tool holder 2.

[0038] In other specific examples of this disclosure, in order to achieve circumferential positioning of the chip removal and lubrication device 1 on the tool holder 2, four positioning slots 111 are provided on the mounting hole 115 of the disc body 11, and four positioning protrusions 23 are provided on the mounting frustum 24 of the tool holder 2, such as... Figure 9 As shown, the positioning protrusion 23 is inserted into the positioning slot 111.

[0039] During assembly, the positioning protrusion 23 is inserted into the positioning slot 111 to achieve circumferential positioning of the chip removal and lubrication device 1 on the tool holder 2, ensuring that the air inlet 1215 and liquid inlet on the inner cylindrical surface of the chip removal and lubrication device 1 correspond one-to-one with the air outlet and liquid outlet on the small cylindrical surface at the lower end of the tool holder 2.

[0040] In some other specific examples of this disclosure, in order to achieve the supply of gas and lubricating liquid from the tool holder 2 to the chip removal lubrication device 1, a tool holder 2 with an internal gas / liquid flow channel 131 that can cooperate with the chip removal lubrication device 1 is designed based on the conventional internal cooling tool holder 2 structure.

[0041] like Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 As shown, the tool holder 2 is provided with a liquid supply structure 21 and a gas supply structure 22. The liquid supply structure 21 includes a main liquid supply channel 211 and a branch liquid supply channel 212. The main liquid supply channel 211 is annular, and the branch liquid supply channel 212 connects the main liquid supply channel 211 and the lubrication structure 13. The gas supply structure 22 includes a main gas supply channel 221 and a branch gas supply channel 222. The main gas supply channel 221 is located at the center of the tool holder 2, and the branch gas supply channel 222 connects the main gas supply channel 221 and the negative pressure adsorption structure 12. The liquid supply branch channel 212 and the gas supply branch channel 222 are staggered in the axial and radial directions.

[0042] The tool holder 2 has air and liquid supply ports on its central cylindrical surface. An external gas-liquid transfer device supplies air and liquid to the tool holder 2 through these ports. The air supply port connects to the main air supply channel 221 inside the tool holder 2. The main air supply channel 221 is located at the center of the tool holder 2 and extends downwards along its axis, branching into six branch air supply channels 222, which connect to six air outlets on the lower cylindrical surface of the tool holder 2. The liquid supply port connects to the main liquid supply channel 211 inside the tool holder 2. The main liquid supply channel 211 is annular, surrounding the main air supply channel 221. The main liquid supply channel 211 branches into six branch liquid supply channels 212, evenly distributed around the main air supply channel 221 and spaced apart from the branch air supply channels 222. The six branch liquid supply channels 212 extend downwards, connecting to the six liquid outlets on the lower cylindrical surface of the tool holder 2. The liquid supply branch channel 212 and the gas supply branch channel 222 are staggered in the axial and radial directions to avoid interference between the gas supply branch channel 222 and the liquid supply branch channel 212 inside the tool holder 2.

[0043] The air and liquid inlets on the inner cylindrical surface of the chip removal and lubrication device 1 correspond one-to-one with the air and liquid outlets on the small cylindrical surface at the lower end of the tool holder 2, and can be sealed by O-rings.

[0044] like Figure 15 , Figure 16As shown, during the horizontal milling operation, the chip removal and lubrication device 1 rotates together with the tool holder 2. At the same time, high-pressure airflow and high-pressure cutting fluid are supplied to the device through the internal flow channel of the tool holder 2. The high-pressure cutting fluid forms a multi-directional jet spray through the nozzle flow channel 132 array, which is precisely supplied to the rake face of the milling cutter to achieve micro-lubrication, cooling and partial chip removal of the tool. The high-pressure airflow flows through the vacuum generating inner channel of the device and is further compressed and accelerated through the Laval nozzle 1214 to form a high-speed jet. According to Bernoulli's principle, the high-speed jet generates a relatively low pressure, which acts as an entrainment and suction force on the external air at the vacuum port. The external air is continuously drawn in and discharged from the air outlet on the outer cylindrical surface of the device with the high-speed jet. A dynamic negative pressure area is formed at the bottom airflow channel 122 and the suction groove 123, which generates a negative pressure suction force relative to the machined surface on the chips that are flying away from the cutting area. This changes their original trajectory, causing their flight trajectory to deflect outward and eventually fall downward into the recovery chamber under the action of gravity, thus preventing the chips from falling into the machined cavity and affecting the next stage of milling.

[0045] Under the influence of negative pressure suction, some chips may move toward the chip removal and lubrication device 1. In order to prevent chips from being sucked into the device and affecting the normal occurrence of vacuum, the size of the suction groove 123 should be designed to be smaller than the size of conventional chips, depending on the specific working conditions, so as to block the chips from entering. The chips adsorbed on the suction groove 123 will not block the airflow channel 122 and affect the negative pressure for two reasons: (1) Under the centrifugal force of the rotating device, the chips will be thrown outward, achieving chip cleaning; (2) If the chips block the airflow channel 122, the vacuum will not be generated. At this moment, the chips will no longer be subject to negative pressure suction and will fall naturally under the action of gravity.

[0046] Structural design of chip removal and lubrication device 1: The chip removal and lubrication device 1 is disc-shaped, with an outer cylindrical surface diameter of 100-120mm and a central cylindrical surface diameter of 30-60mm, and can be tightly fitted onto the matching tool holder 2. On the central cylindrical surface, there are 6 air inlets 1215 and 6 liquid inlets evenly distributed along the axis of the cylindrical surface.

[0047] The device contains a complex airflow channel 122, with six air inlets 1215 corresponding to six vacuum generating channels 121 evenly distributed along the central axis of the device. Each vacuum generating channel 121 is similar to a conventional vacuum generating channel 121, consisting of an air inlet 1215 (diameter 4-8mm), a Laval nozzle 1214 (neck diameter 1-3mm, outlet diameter 3-6mm), a vacuum port (diameter 3-6mm), an ejection chamber 1213 (maximum diameter 8-12mm), a mixing tube 1212 (diameter 4-6mm), and an exhaust port 1211 (diameter 6-10mm). Each vacuum generating channel 121 is uniformly connected to the airflow channel 122 (width 6-8mm) at the bottom of the device through a cylindrical vacuum port. The airflow channel 122 is connected to the outside atmosphere through a large number of suction slots 123 (rectangular slots 0.2-2mm wide and 3-7mm long) densely and evenly distributed along the central axis of the device. The device contains a complex fluid flow channel 131, with six inlets (1-4 mm in diameter) all connected to the fluid flow channel 131 (1-4 mm wide). The bottom of the fluid flow channel 131 connects to a large number of circumferentially distributed nozzle channels 132 (outlet diameter 0.2-2 mm), and a micro-nozzle array structure forms a boss at the bottom of the device. Cutting fluid flows into the fluid flow channel 131 from the inlets and forms a multi-directional jet through the micro-nozzle array. To reduce the impact of negative pressure on the cutting fluid supply effect and to keep the nozzle outlet away from the negative pressure working area, the outlet of the nozzle channel 132 should be 3-10 mm higher than the bottom of the conical surface of the suction groove 123, and the annular baffle 112 should be 1.5-5 mm higher than the nozzle boss. The radial distance between the outlet center of the nozzle channel 132 and the bottom of the conical surface of the suction groove 123 should be greater than or equal to 0.25 times the diameter of the tool holder 2.

[0048] The device is assembled onto the small cylindrical surface at the lower end of the tool holder 2 via an interference fit. Axial and circumferential positioning is achieved through the engagement of four positioning slots 111 on the inner cylindrical surface of the device with four positioning protrusions 23 on the tool holder 2. The air and liquid inlets on the inner cylindrical surface of the chip removal and lubrication device 1 correspond one-to-one with the air and liquid outlets on the small cylindrical surface at the lower end of the tool holder 2, ensuring that all flow channels are connected. The flow channel interfaces are sealed with O-rings.

[0049] Static pressure simulation of the internal airflow channel 122 of the chip removal and lubrication device 1, such as... Figure 5 , Figure 6 Figure 7As shown, the internal airflow channel 122 of the chip removal and lubrication device 1 is extracted and imported into simulation software for static pressure simulation. High-pressure airflow of 0.4-0.8 MPa is input at six inlets 1215. The airflow flows sequentially through inlets 1215, Laval nozzles 1214, the ejector chamber 1213, and the mixing pipe 1212, and exits from six exhaust ports 1211. At the outlet of the Laval nozzle 1214, a high-speed jet is formed. Due to Bernoulli's principle, a relative negative pressure is created between the vacuum port and the airflow channel 122, which ejects external air into the ejector chamber 1213, mixes with the high-speed jet, and flows together through the mixing pipe 1212 before exiting from the exhaust port 1211. Simulation results show that an absolute pressure of less than or equal to 88706 Pa can be achieved at the vacuum port and airflow channel 122. This creates a negative pressure region with a vacuum level greater than or equal to 12619 Pa relative to the standard atmospheric pressure of 101325 Pa, meeting the requirements for a rough vacuum. This generates negative pressure suction on the external atmosphere and chips, satisfying the need for chip removal. A rough vacuum requires an absolute pressure between 100000 Pa and 1000 Pa. The application of rough vacuum technology is mainly based on the pressure difference between it and the atmospheric environment; specific applications include vacuum cleaners and vacuum suction cups.

[0050] In summary, in view of the problems and shortcomings of existing technologies, the technical problems solved by this invention include: Based on Bernoulli's fundamental physical principle, a solution is provided that can control the directional flight trajectory of chips, ensuring that the chips fly completely into the chip recovery box, leaving no chips in the cavities of the machined surfaces of the workpiece.

[0051] The chip removal and lubrication device 1 is fixed to the outer cylindrical surface of the tool holder 2 and rotates with the tool holder 2. Its interior has an annular internal flow channel structure, including a liquid flow channel 131 and an air flow channel 122, which respectively achieve the functions of supplying a small amount of coolant and generating an adsorption airflow. The liquid flow channel 131 is located radially near the end of the tool holder 2 and has a protruding, extremely small nozzle structure. The nozzles are densely and evenly distributed around the axis of the tool holder 2. The ultrasonically atomized liquid enters the liquid flow channel 131 located inside the tool holder 2, and is then supplied to the rake face area of ​​the end mill through the nozzle flow channel 132. The airflow channel 122 is located at the radial end of the tool holder 2. The vacuum generating channels 121 are evenly distributed around the axis of the tool holder 2. The air inlet 1215 of the vacuum generating channel 121 is located on the inner mating surface of the device and the tool holder 2, and the air outlet is located on the outer cylindrical surface of the device. The vacuum port at the bottom of each vacuum generating channel 121 is connected to the airflow channel 122, and then communicates with the outside world through the circumferentially densely distributed narrow suction grooves 123.

[0052] During the cutting process, after the chips separate from the workpiece surface, they inevitably undergo parabolic motion under the influence of gravity and the rotating airflow of the milling cutter. When they reach the radially outer region of the tool holder 2, a vacuum negative pressure adsorption zone is formed at the airflow channel 122 and the suction groove 123. This zone can exert a suction force on the flying chips, causing them to move further away from the machined surface area. Thus, the negative pressure suction and the chip's gravity combine to change the chip's flight trajectory after chip breaking. Before the chips splash into the cavity groove, they are guided directly to the recovery chamber, solving the problem of chips easily splashing into the surrounding cavities during flip milling. Chips already in the cavity groove can also be effectively extracted and discharged.

[0053] The tool holder 2 is an internally cooled tool holder 2 with an internal gas / liquid flow channel 131, which forms a pair with the designed chip removal and lubrication device 1. The upper cylindrical surface of the tool holder 2 has an inlet of the gas / liquid flow channel 131, which can be connected to an external gas / liquid supply device to realize the supply of gas / liquid to the inside of the tool holder 2. The inside of the tool holder 2 has independent gas / liquid flow channels 131 that branch downward along the axis of the tool holder 2. The main gas supply channel 221 is located at the center of the tool holder 2, and the main liquid supply channel 211 is circumferentially distributed around the main gas supply channel 221. The lower cylindrical surface of the tool holder 2 has an outlet of the gas / liquid flow channel 131, which is paired and connected with the inlet of the gas / liquid flow channel 131 of the device. The connection is sealed by an O-ring.

[0054] Example 3 This embodiment provides a chip removal lubrication method for the flip milling chip removal lubrication device 1 as described in Embodiment 1: gas and lubricating liquid are supplied into the tool holder 2; the gas forms a high-speed jet in the vacuum generating channel 121, the high-speed jet generates negative pressure, the negative pressure is transmitted to the airflow channel 122 and the suction groove 123, so that a negative pressure area is formed at the suction groove 123, the negative pressure area generates suction force on the chips, the suction force and the weight of the chips form a resultant force, the resultant force changes the flight trajectory of the chips; the lubricating liquid is sprayed into the cutting area of ​​the tool through the nozzle channel 132.

[0055] like Figure 15 , Figure 16 As shown, when the chip removal and lubrication device 1 is not used, the chips are instantly subjected to the combined force of cutting force and gravity, causing them to scatter in all directions. Although the horizontal milling characteristic of the flip mill reduces the probability of chips falling into the cavity groove by utilizing the gravity of the chips, in actual production, due to the depth, structure, and spatial position of the cavity, and the fact that the workpiece is only vertically erected, coupled with the uncontrollable flight trajectory of the chips during milling, some chips still actually fall into the cavity groove. Since the cavity is not formed in a single milling operation but requires multiple machining processes such as roughing and finishing, the chips remaining in the groove will have a serious impact on the tool, the machined surface, and the quality of the next stage of milling.

[0056] When using the chip removal and lubrication device 1, high-pressure airflow and high-pressure cutting fluid are supplied to the device through the internal flow channel of the tool holder 2. The high-pressure cutting fluid forms a multi-directional jet through a micro-nozzle array, precisely supplying the rake face of the end mill, achieving micro-lubrication, cooling, and partial chip removal for the tool. The high-pressure airflow flows through the vacuum generating channel 121, forming a negative pressure area at the bottom airflow channel 122 and the suction groove 123. This generates a negative pressure suction force relative to the machined surface on the chips flying away from the cutting area, changing their original trajectory and causing them to deflect outwards and fall downwards into the recovery chamber under the influence of gravity. This effectively prevents the chips from falling into the machined cavity groove, achieving effective chip removal.

[0057] The size and mass of chips produced by flip milling vary under different working conditions, and the required suction force also varies to achieve effective chip attraction and change in flight trajectory. Therefore, the gas supply pressure supplied to the tool holder 2 is adjusted in real time according to the working conditions, and the gas supply pressure is determined by the following formula: P in =A×n+B×f z +C×m+P0; Among them, P in : Vacuum generation flow channel 121 air inlet 1215 required air supply gauge pressure, MPa; n: Milling cutter spindle speed, r / min; f z : Single tooth feed rate, mm / z; m: Average mass of a single chip, mg, varies with workpiece material and cutting parameters, and can be measured experimentally; A, B, C: Experimental calibration coefficients, all positive numbers; P0: Minimum air supply pressure that can generate effective suction force, which is the inherent reference air supply gauge pressure of the device, MPa, determined by the resistance of the flow channel in the tool holder 2 and the device, sealing loss, and the starting pressure of the vacuum generating flow channel 121. It is a fixed constant after the structure is finalized and is independent of the cutting conditions.

[0058] The chip removal process is comprehensively considered, taking into account the effects of spindle speed, single-tooth feed, chip weight, and material properties. A larger chip mass *m* results in greater chip inertia and weight, requiring higher negative pressure suction, thus increasing the corresponding intake pressure. Increased spindle speed increases the initial velocity of chip splash, and increased single-tooth feed increases the volume of chips cut in a single pass; both necessitate increased supply pressure to enhance the ejector negative pressure. P0 is the no-load reference pressure, used only to overcome the device's own air path losses and maintain the basic ejector function of the vacuum generation channel 121. Coefficients A, B, and C are determined through fitting experiments using orthogonal cutting techniques on multi-material, multi-parameter flip milling. Based on this formula, the optimal intake pressure can be calculated according to the actual machining speed, feed, and chip mass corresponding to the workpiece material, achieving adaptive control of the supply pressure. Lightweight, small chips use low-pressure supply to save air consumption, while heavy, large chips use high-pressure enhanced negative pressure for chip removal, ensuring that the chip removal and lubrication device 1 is adaptable to various aerospace alloy material machining scenarios.

[0059] While the specific embodiments of the present invention have been described above, they are not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solutions of the present invention are still within the scope of protection of the present invention.

Claims

1. A chip removal and lubrication device for flip-plate milling, for mounting on a tool holder, characterized in that, Includes a disk body, on which a negative pressure adsorption structure and a lubrication structure are provided; One end face of the disk body is provided with an annular baffle and an annular protrusion, and the annular baffle is located on the outer ring of the annular protrusion. The negative pressure adsorption structure includes a vacuum generating channel and an air flow channel. The vacuum generating channel is distributed radially along the disk body. The air flow channel is annular and communicates with the vacuum generating channel. A circular array of baffles is provided at the bottom of the air flow channel, and suction grooves are formed between the baffles. The suction grooves are located on the radial outer side of the annular baffle. The lubrication structure includes a fluid flow channel and a nozzle flow channel. The fluid flow channel is an annular flow channel and is aligned with the annular protrusion. The nozzle flow channel is formed in the annular protrusion and communicates with the fluid flow channel.

2. The flip-plate milling chip removal and lubrication device as described in claim 1, characterized in that, Both the annular baffle and the annular protrusion are located on the end face of the disk body facing the milling process, and the height of the annular baffle is greater than the height of the annular protrusion.

3. The flip-plate milling chip removal and lubrication device as described in claim 2, characterized in that, The end face of the disc body facing the milling process forms a ramp, which is conical. The distance from the inner ring of the ramp to the milling surface is greater than the distance from the outer ring of the ramp to the milling surface. The air intake groove is provided on the ramp.

4. The flip-plate milling chip removal and lubrication device as described in claim 1, characterized in that, The nozzle flow channel is arranged at an angle, and the distance from the liquid inlet end of the nozzle flow channel to the center line of the disk body is greater than the distance from the liquid outlet end of the nozzle flow channel to the center line of the disk body.

5. The flip-plate milling chip removal and lubrication device as described in claim 1, characterized in that, The vacuum generating flow channel includes an air inlet, a Laval nozzle, an ejector cavity, a mixing pipe, and an exhaust port. The air inlet, Laval nozzle, ejector cavity, mixing pipe, and exhaust port are arranged radially from the inside to the outside. The air inlet is located on the mounting hole at the center of the disk body, and the exhaust port is located on the outer wall surface of the disk body. The ejector cavity is connected to the airflow channel.

6. A milling tool, characterized in that, The device includes a tool holder, a tool head, and a chip removal and lubrication device for flip milling as described in any one of claims 1-5. The tool head is mounted on the end of the tool holder, and the outer wall of the tool holder has a mounting frustum. The center of the disc body of the chip removal and lubrication device is provided with a mounting hole, and the mounting hole is mounted on the mounting frustum.

7. The milling tool as described in claim 6, characterized in that, The mounting hole of the disc body is provided with a positioning slot, and the mounting platform of the tool holder is provided with a positioning protrusion, which is inserted into the positioning slot.

8. The milling tool as described in claim 6, characterized in that, The tool holder is provided with a liquid supply structure and a gas supply structure. The liquid supply structure includes a main liquid supply channel and a branch liquid supply channel. The main liquid supply channel is annular, and the branch liquid supply channel connects the main liquid supply channel and the lubrication structure. The gas supply structure includes a main gas supply channel and a branch gas supply channel. The main gas supply channel is located at the center of the tool holder, and the branch gas supply channel connects the main gas supply channel and the negative pressure adsorption structure. The liquid supply branch channel and the gas supply branch channel are staggered in the axial and radial directions.

9. A chip removal lubrication method for a flip-plate milling chip removal lubrication device as described in any one of claims 1-5, characterized in that: Gas and lubricating liquid are supplied into the inside of the tool holder; The gas forms a high-speed jet in the vacuum generating channel, the high-speed jet generates negative pressure, the negative pressure is transmitted to the airflow channel and the suction groove, so that a negative pressure area is formed at the suction groove, the negative pressure area generates suction force on the chips, the suction force and the weight of the chips form a resultant force, and the resultant force changes the flight trajectory of the chips; The lubricating fluid is sprayed into the cutting area of ​​the tool through the nozzle channel.

10. The chip removal and lubrication method according to claim 9, characterized in that, The gas supply pressure to the inside of the tool holder is adjusted in real time according to the working conditions, and the gas supply pressure is determined by the following formula: P in =A×n+B×f z +C×m+P0; Among them, P in The pressure gauge for the air supply to the vacuum generation channel inlet is MPa; n is the milling cutter spindle speed in r / min; f z is the single-tooth feed rate, in mm / z; m is the average mass of a single chip, in mg; A, B, and C are experimental calibration coefficients, all of which are positive; P0 is the minimum air supply pressure that generates effective suction, in MPa.

Images