A high-efficiency wafer grinding and polishing processing device

Abstract

This application relates to the field of wafer grinding and polishing, and discloses a high-efficiency wafer grinding and polishing processing device, including a device body, a chassis and a polishing disc, a polishing pad under the polishing disc, an airbag system on the polishing pad, a stage on the chassis, and multiple adsorption slots for accommodating wafers on the stage. The device also includes: a rotating component located below the stage, which drives the stage to rotate; a pushing component located inside the chassis, which includes a pushing plate and a hydraulic rod responsible for moving the pushing plate, the pushing plate moving forward a predetermined distance to allow the wafers to automatically fall into the adsorption slots; and a folding component located on the pushing component. This invention, by setting a pushing plate and a baffle, allows multiple wafers to be stacked, and during the slow rotation of the stage, the pushing plate is controlled to enter a predetermined position. Under the action of the baffle, multiple wafers are automatically and quickly placed into the adsorption slots, saving time and effort, while also ensuring accurate and reliable placement.

Description

Technical Field

[0001] This invention relates to the field of wafer grinding and polishing technology, specifically to a high-efficiency wafer grinding and polishing processing device. Background Technology

[0002] A wafer is a circular thin sheet made of semiconductor materials such as single-crystal silicon, silicon carbide, and gallium arsenide. It is the core substrate material for manufacturing semiconductor products such as integrated circuits, power devices, and microelectromechanical systems (MEMS). In the semiconductor manufacturing process, wafers undergo multiple precision processing steps, including dicing, grinding, and polishing, to achieve a uniform thickness, a smooth surface, and a damage-free mirror finish. Among these, the quality of the grinding and polishing process directly determines the precision and yield of subsequent processes such as photolithography and etching, making it a crucial step in ensuring chip performance and reliability.

[0003] Wafer polishing refers to the planarization of wafer surfaces using methods such as chemical mechanical polishing (CMP) to remove residual damage layers and microcracks from grinding processes, resulting in a highly smooth and glossy surface. It is a crucial step in semiconductor manufacturing. Currently, processing equipment capable of batch polishing multiple wafers has been widely used in the industry. Its main structure typically includes a rotatable polishing disc, a carrier mechanism supporting the wafers to be polished, and a slurry supply system for supplying polishing fluid to the polishing area. Material removal and surface planarization are achieved through the relative movement between the polishing disc and the wafer.

[0004] However, existing multi-station wafer polishing equipment still largely relies on manual operation in the wafer loading and unloading process. Operators need to manually place the wafers to be polished one by one into the wafer slots of the carrier tray. This manual placement method is not only labor-intensive and time-consuming, but using program-controlled robotic arms is not only expensive, leading to higher costs, but also prone to damaging the wafers due to poor force control.

[0005] At the same time, existing wafer polishing equipment also has significant shortcomings in the way polishing slurry is added. Most equipment requires operators to manually add polishing slurry at regular intervals or in precise quantities based on experience before or during polishing. This lack of precise positioning results in some wafers initially having no polishing slurry on their surface, leading to dry polishing. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a high-efficiency wafer grinding and polishing processing device, which solves the problem of time-consuming and labor-intensive manual placement of wafers one by one during the wafer polishing process.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a high-efficiency wafer grinding and polishing processing device, comprising a device body, the device body including a chassis and a polishing disc, a polishing pad disposed under the polishing disc, an airbag system disposed on the polishing pad, a stage disposed on the chassis, and multiple adsorption grooves for accommodating wafers disposed on the stage, further comprising: a rotating component disposed below the stage, the rotating component being responsible for driving the stage to rotate; a pushing component disposed inside the chassis, the pushing component including a pushing plate and a hydraulic rod responsible for moving the pushing plate, the pushing plate moving forward a predetermined distance, causing the wafers to automatically fall into the adsorption grooves; a folding component disposed on the pushing component, the folding component including a baffle, the baffle having at least two states; initially, the pushing plate and the baffle are both in close contact with the inner wall of the chassis; when the pushing plate moves forward to any predetermined distance, the baffle is perpendicular to it, during the rotation of the stage, cocircular wafers sequentially enter the corresponding adsorption grooves; and a liquid delivery component, the liquid delivery component being responsible for injecting polishing liquid onto the wafers.

[0008] Preferably, the chassis has a movable hole, and a top rod is slidably connected to the inner wall of the movable hole. The hydraulic rod is connected to the top rod, and the hydraulic rod is electrically connected to a controller. The controller is responsible for driving the hydraulic rod to extend to multiple set lengths.

[0009] Preferably, the folding component includes a connecting piece, a storage shaft is rotatably connected to the connecting piece, a rotating shaft is fixedly connected to the end of the baffle, the storage shaft extends movably through the interior of the rotating shaft, a push shaft is fixedly connected to the push plate, the connecting piece is movably sleeved on the outside of the push shaft, and the baffle moves with the push plate through the connecting piece.

[0010] Preferably, a torsion spring is sleeved on the receiving shaft, one end of the torsion spring is fixedly connected to the receiving shaft, and the other end is fixedly connected to the rotating shaft. When the torsion spring is not charged, the baffle and the pusher plate are perpendicular to each other.

[0011] Preferably, the inner wall of the chassis is provided with a contact rod, and the outer wall of the rotating shaft is fixedly connected with a driven plate. When the rotating shaft moves to the inner wall of the chassis, the contact rod squeezes and pushes the driven plate to rotate, forcing the baffle to rotate and fit against the inner wall of the chassis.

[0012] Preferably, the infusion component includes an injection tube, one end of which is connected to a polishing fluid input tube, and the other end of which is connected to an infusion pump. A support rod connected to a baffle is provided at the outer end of the injection tube.

[0013] Preferably, the support rod is a telescopic structure, the support rod includes a threaded rod connected to the baffle and a threaded sleeve connected to the injection tube, the threaded rod and the threaded sleeve are threadedly connected, and the dripping position of the injection tube is adjusted according to the size of the wafer.

[0014] Preferably, the rotating component includes a driven gear ring fixedly connected to the bottom of the platform, a drive motor is provided at the bottom of the chassis, and a drive gear is fixedly sleeved at the output end of the drive motor, with the drive gear meshing with the driven gear ring.

[0015] Preferably, a liquid replenishment component is provided under the platform. The liquid replenishment component includes a liquid storage cylinder. A piston plate is slidably disposed on the inner wall of the liquid storage cylinder. A push rod is disposed at the bottom of the piston plate. A lifting component is disposed at the bottom of the push rod. Multiple slag discharge holes are opened on the platform. The lifting component is responsible for intermittently pushing the piston plate up to compensate for the liquid on the platform.

[0016] Preferably, the lifting component includes a drive motor, the output end of which is fixedly connected to an eccentric wheel, the eccentric wheel abutting against the push rod component, and the inner wall of the liquid storage cylinder is provided with a filter screen plate located above the piston plate, which is responsible for preventing debris from flowing back to the top of the platform.

[0017] This invention provides a high-efficiency wafer grinding and polishing apparatus. It has the following beneficial effects:

[0018] 1. This invention uses a pusher plate and a baffle to stack multiple wafers. As the stage rotates slowly, the pusher plate is controlled to enter the set position. Under the action of the baffle, multiple wafers are automatically and quickly placed in the adsorption tank, saving time and effort, while also ensuring accurate and reliable placement.

[0019] 2. By setting a balance between the contact rod, the driven plate, and the torsion spring, in the initial process of the pusher plate moving the baffle forward, the driven plate loses the resistance of the contact rod, and the elastic force of the torsion spring causes the baffle to rotate automatically, helping the wafers of the same circle to fall into the corresponding adsorption tank automatically; when the pusher plate returns to the initial position, under the pressure of the contact rod, the driven plate carries the baffle to rotate automatically in the opposite direction, completing the purpose of automatically storing the baffle and the pusher plate, without affecting the subsequent polishing.

[0020] 3. By setting up an infusion component, the present invention can automatically drip polishing liquid during the automatic wafer loading process. Since the baffle can help the wafer to be automatically positioned, the position of each drip is accurate, eliminating the need for subsequent liquid addition. The time can be well coordinated, and the positioning is perfectly achieved by the cooperation of the pusher plate and the baffle.

[0021] 4. By setting up a liquid replenishment component, the polishing liquid is used less and less after multiple polishing processes during the initial liquid replenishment process. At this time, the piston plate is lifted to push the liquid onto the stage through the slag discharge hole, so as to achieve the purpose of replenishing the liquid multiple times on time. At the same time, the polishing debris can also fall into the liquid storage cylinder to avoid staying on the stage and affecting the polishing. Attached Figure Description

[0022] Figure 1This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall bottom view of the present invention;

[0024] Figure 3 This is a top view of the platform structure of the present invention;

[0025] Figure 4 This is a bottom view of the rotating component of the present invention;

[0026] Figure 5 This is a bottom view of the infusion component of the present invention;

[0027] Figure 6 This is a top view of the infusion component of the present invention;

[0028] Figure 7 For the present invention Figure 6 A magnified structural diagram at point A;

[0029] Figure 8 This is a schematic diagram of the fluid replenishment component of the present invention.

[0030] The components include: 1. Equipment body; 11. Chassis; 12. Polishing disc; 13. Polishing pad; 14. Platform; 15. Adsorption tank; 16. Support ring; 17. Airbag system; 2. Rotating component; 21. Driven gear ring; 22. Drive motor; 23. Drive gear; 3. Pushing component; 31. Pushing plate; 32. Hydraulic rod; 33. Top rod; 4. Folding component; 41. Baffle; 42. Connecting piece; 43. Storage shaft; 44. Rotating shaft; 45. Push shaft; 46. Torsion spring; 47. Contact rod; 48. Driven piece; 5. Infusion component; 51. Injection pipe; 52. Support rod; 521. Threaded rod; 522. Threaded sleeve; 53. Polishing fluid input pipe; 54. Collar; 6. Replenishment component; 61. Storage cylinder; 62. Piston plate; 63. Push rod component; 64. Lifting component. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example 1, please refer to the appendix. Figure 1 - Appendix Figure 3This invention provides a high-efficiency wafer grinding and polishing apparatus, comprising a device body 1, which includes a chassis 11 and a polishing disc 12. A polishing pad 13 is disposed under the polishing disc 12, and an airbag system 17 is disposed on the polishing pad 13. A stage 14 is disposed on the chassis 11, and a support ring 16 is fixedly connected to the bottom of the chassis 11. The stage 14 is provided with a plurality of adsorption grooves 15 for accommodating wafers. The apparatus also includes: a rotating component 2 disposed below the stage 14, which drives the stage 14 to rotate; and a pushing component 3 disposed inside the chassis 11, which includes a pushing mechanism. The pusher plate 31 and the hydraulic rod 32 responsible for moving the pusher plate 31 move forward a set distance so that the wafers automatically fall into the adsorption tank 15; the folding component 4 is set on the pusher component 3, the folding component 4 includes a baffle 41, the baffle 41 has at least two states; initially, the pusher plate 31 and the baffle 41 are both in close contact with the inner wall of the chassis 11; when the pusher plate 31 moves forward to any set distance, the baffle 41 is perpendicular to it, and during the rotation of the stage 14, the cocircular wafers enter the corresponding adsorption tank 15 in sequence; the liquid delivery component 5 is responsible for injecting polishing liquid onto the wafers.

[0033] For ease of understanding, this case briefly describes the prior art involved, namely the airbag system 17 and the mechanism for adsorbing the wafer.

[0034] The airbag system 17 is a computer-controlled, compressed air-filled "smart tire" that applies pressure very evenly to the wafer. Its working principle relies on the airbag's core components and the diaphragm that directly contacts the wafer. A precise pressure control device regulates the air pressure within the airbag, causing it to expand. The force is then evenly transmitted through the diaphragm to the back of the wafer, pressing it against the rotating polishing pad 13. Its key advantage lies in the extremely uniform pressure applied.

[0035] The adsorption tank 15 is equipped with an adsorption mechanism, which can optionally be a vacuum adsorption mechanism. Its principle is to use a vacuum pump to create negative pressure on the back of the wafer, making it adhere tightly to the carrier. The advantages are stable adsorption, fast speed, and it can meet most process requirements.

[0036] In the initial stage of this invention, multiple wafers are placed on the outer edge of the stage 14. The diameter of the wafers is generally 10-20 cm. The wafers can be stacked. When the pusher plate 31 extends inward, multiple wafers are on the first circumference. Then, the stage 14 is slowly rotated. Under the action of the baffle 41, the wafers enter the adsorption tank 15 in sequence. Then, the pusher continues to move. Thus, each wafer can be placed in the corresponding adsorption tank 15 in sequence. Then, the vacuum pump is turned on to adsorb and fix the wafers. The adsorption tank 15 serves as an auxiliary fixation. The inner side of the adsorption tank 15 is provided with a discharge hole, and the grinding debris flows downward from the discharge hole.

[0037] Please see the appendix Figure 4The rotating component 2 includes a driven gear ring 21 fixedly connected to the bottom of the platform 14. A drive motor 22 is provided at the bottom of the chassis 11. A drive gear 23 is fixedly sleeved at the output end of the drive motor 22. The drive gear 23 and the driven gear ring 21 are meshed together.

[0038] When the drive motor 22 is turned on, the drive motor 22 drives the drive gear 23 to rotate. The drive gear 23 meshes with the driven gear ring 21, which in turn drives the driven gear ring 21 to rotate. Finally, the stage 14 rotates at a set speed. A wafer is placed on the stage 14. During the rotation of the wafer, the polishing pad 13 above it moves downwards with a set pressure to help polish the wafer and keep it flat.

[0039] Please see the appendix Figure 5 The chassis 11 has a movable hole, and a top rod 33 is slidably connected to the inner wall of the movable hole. The hydraulic rod 32 is connected to the top rod 33, and the hydraulic rod 32 is electrically connected to a controller. The controller is responsible for driving the hydraulic rod 32 to extend to multiple set lengths.

[0040] As shown in the figure, there are two rings of wafers distributed on two circles of different diameters. Therefore, the pusher plate 31 needs to move to the first distance and the second distance, which correspond to the two circles of different diameters respectively. The controller controls the extension of the hydraulic rod 32, so that it carries the pusher rod 33 to push the pusher plate 31 to the first distance and the second distance in turn. Under the action of the baffle 41, the remaining wafers automatically fall onto the corresponding adsorption tank 15.

[0041] Specifically, there is a certain gap between the baffle 41 and the pusher plate 31 and the stage 14, so that they can both push the wafers to move and smoothly sweep over the top surface of the wafers after they fall into the adsorption tank 15.

[0042] For example, if the wafer thickness is 8mm and the adsorption groove 15 depth is 7mm, then the gap between the baffle 41 and the pusher plate 31 and the stage 14 is greater than 1mm and less than 8mm.

[0043] Please see the appendix Figure 5 - Appendix Figure 7 The folding component 4 includes a connecting piece 42, a storage shaft 43 rotatably connected to the connecting piece 42, a rotating shaft 44 fixedly connected to the end of the baffle 41, the storage shaft 43 movably passing through the interior of the rotating shaft 44, a push shaft 45 fixedly connected to the push plate 31, the connecting piece 42 movably sleeved on the outside of the push shaft 45, and the baffle 41 moving with the push plate 31 through the connecting piece 42.

[0044] When the pusher plate 31 moves inward, it moves the connecting piece 42 through the push shaft 45, and the receiving shaft 43 and the rotating shaft 44 through the connecting piece 42, so that the baffle 41 moves synchronously.

[0045] A torsion spring 46 is fitted on the storage shaft 43. One end of the torsion spring 46 is fixedly connected to the storage shaft 43, and the other end is fixedly connected to the rotating shaft 44. When the torsion spring 46 is not charged, the baffle 41 and the pusher plate 31 are perpendicular to each other.

[0046] A contact rod 47 is fixedly connected to the inner wall of the chassis 11, and a driven piece 48 is fixedly connected to the outer wall of the rotating shaft 44. When the rotating shaft 44 moves toward the inner wall of the chassis 11, the contact rod 47 squeezes and pushes the driven piece 48 to rotate, forcing the baffle 41 to rotate and fit against the inner wall of the chassis 11.

[0047] Under the action of the torsion spring 46, when the baffle 41 moves away from the contact rod 47, the driven piece 48 loses the thrust of the contact rod 47 and is subjected to the elastic force of the torsion spring 46, causing it to rotate with the baffle 41, eventually causing the baffle 41 to rotate 90 degrees (80-110 degrees is also possible depending on actual needs). At this time, the baffle 41 and the pusher plate 31 can form a vertical angle, which pushes the wafer into the adsorption tank 15 in sequence.

[0048] When the pusher plate 31 returns to its initial position, the driven piece 48 gradually approaches the contact rod 47 and is passively squeezed between the two. The driven piece 48 is forced to rotate in the opposite direction, which eventually causes the baffle 41 to rotate outward and smoothly fit against the inner wall of the chassis 11, thus achieving the purpose of automatically storing the baffle 41 and the pusher plate 31 without affecting subsequent polishing.

[0049] The infusion component 5 includes an injection tube 51, one end of which is connected to a polishing liquid input tube 53, and the other end of which is connected to an infusion pump. The outer end of the injection tube 51 is provided with a support rod 52 connected to a baffle 41.

[0050] The injection tube 51 is responsible for applying polishing slurry to each wafer, so that it can play a role in pre-spraying or pre-wetting during subsequent polishing. Before the wafer contacts the polishing pad 13, a small amount of polishing slurry is sprayed to "wet" it, which can effectively reduce the risk of initial "dry polishing" and help the polishing slurry to spread more evenly on the polishing pad 13.

[0051] Because the adsorption tanks 15 are evenly spaced, the injection pipe 51 can regularly inject the polishing liquid onto each wafer in sequence, so that each wafer is initially covered with polishing liquid, and some wafers are not initially dry-polished.

[0052] The support rod 52 is a telescopic structure. The support rod 52 includes a threaded sleeve 522 connected to the baffle 41 and a threaded rod 521 connected to the injection tube 51. The end of the threaded rod 521 is rotatably connected to a collar 54. The injection tube 51 is snapped into the collar 54. The threaded rod 521 and the threaded sleeve 522 are threadedly connected. The dripping position of the injection tube 51 is adjusted according to the size of the wafer.

[0053] To make the device more practical, the position of the injection tube 51 can be adjusted. The optimal position of the injection tube 51 is to be suspended at the exact center of the wafer. If some data errors occur during the actual design and production of this device, the position of the injection tube 51 can be adjusted by rotating the threaded rod 521.

[0054] Working principle: The operator first places multiple wafers near the outer edge of the stage 14. The wafers are stacked, and the drive motor 22 is turned on to enter the slow speed mode. The drive motor 22 drives the drive gear 23 to rotate. The drive gear 23 meshes with the driven gear ring 21, which in turn drives the driven gear ring 21 to rotate, and finally drives the stage 14 to rotate at the set speed.

[0055] Next, the injection tube 51 is inserted into the collar 54, and the threaded rod 521 is rotated to adjust the position of the injection tube 51;

[0056] When the hydraulic rod 32 is activated, the hydraulic rod 32 moves the connecting piece 42 via the push shaft 45, and the connecting piece 42 moves the storage shaft 43 and the rotating shaft 44, ultimately causing the baffle 41 to move synchronously. As the baffle 41 moves away from the contact rod 47, the driven piece 48 loses the thrust of the contact rod 47 and is subjected to the elastic force of the torsion spring 46, causing it to rotate with the baffle 41, ultimately causing the baffle 41 to rotate 90 degrees.

[0057] The controller is used to control the extension of the hydraulic rod 32, so that it carries the push rod 33 to push the push plate 31 to the first distance and the second distance in turn. Under the action of the baffle 41, the remaining wafers automatically fall onto the corresponding adsorption tank 15.

[0058] When each adsorption tank 15 reaches below the injection tube 51, polishing liquid is automatically dripped onto the wafer, thus completing the initial dripping of each wafer and ensuring that dry polishing is not performed at the beginning.

[0059] When the hydraulic rod 32 is retracted and the pusher plate 31 returns to its initial position, the driven plate 48 gradually approaches the contact rod 47 and is passively squeezed between the contact rod 47. The driven plate 48 is forced to rotate in the opposite direction, which eventually causes the baffle 41 to rotate outward and smoothly fit against the inner wall of the chassis 11, thus achieving the purpose of automatically storing the baffle 41 and the pusher plate 31.

[0060] Example 2 differs from Example 1 in that the following technical features are added: Please refer to the appendix. Figure 8 A liquid replenishment component 6 is provided under the platform 14. The liquid replenishment component 6 includes a liquid storage cylinder 61. A piston plate 62 is slidably provided on the inner wall of the liquid storage cylinder 61. A push rod 63 is provided at the bottom of the piston plate 62. A lifting component 64 is provided at the bottom of the push rod 63. Multiple slag discharge holes are provided on the platform 14. The lifting component 64 is responsible for intermittently pushing the piston plate 62 up to compensate for the liquid on the platform 14.

[0061] The lifting component 64 includes a drive motor (obscured by an eccentric wheel in the figure and not shown), the output end of the drive motor is fixedly connected to the eccentric wheel, the eccentric wheel abuts against the push rod component 63, and a slag discharge pipe is provided on the outer side of the liquid storage cylinder 61 near the bottom end.

[0062] Specifically, the drive gear 23 in this case is a small size, so that the liquid storage cylinder 61 can just catch the polishing liquid falling from each adsorption tank 15. The bottom of the push rod 63 is fixedly connected to a telescopic rod, and a telescopic spring is sleeved on the outside of the telescopic rod.

[0063] The drive motor operates intermittently. Each time it is turned on, it rotates the eccentric wheel, which intermittently pushes the push rod 63 upward. The push rod 63 moves the piston plate 62 up and down, causing the polishing fluid above it to rise intermittently, thus intermittently replenishing the polishing fluid during the polishing process.

[0064] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency wafer grinding and polishing processing apparatus, comprising an equipment body (1), the equipment body (1) comprising a chassis (11) and a polishing disc (12), a polishing pad (13) disposed under the polishing disc (12), an airbag system (17) disposed on the polishing pad (13), a stage (14) disposed on the chassis (11), and a plurality of adsorption grooves (15) for accommodating wafers disposed on the stage (14), characterized in that, Also includes: A rotating component (2) is disposed below the platform (14), the rotating component (2) being responsible for driving the platform (14) to rotate; The pusher component (3) is located inside the chassis (11). The pusher component (3) includes a pusher plate (31) and a hydraulic rod (32) responsible for moving the pusher plate (31). The pusher plate (31) moves forward a set distance so that the wafer automatically falls into the adsorption tank (15). A folding component (4) is provided on the pushing component (3), the folding component (4) including a baffle (41), the baffle (41) having at least two states; Initially, the pusher plate (31) and the baffle (41) are both in close contact with the inner wall of the chassis (11); when the pusher plate (31) moves forward to any set distance, the baffle (41) is perpendicular to it. During the rotation of the stage (14), the cocircular wafers enter the corresponding adsorption tank (15) in sequence. The infusion component (5) is responsible for injecting polishing fluid onto the wafer.

2. The wafer high-efficiency grinding and polishing processing apparatus according to claim 1, characterized in that, The chassis (11) has a movable hole, and a top rod (33) is slidably connected to the inner wall of the movable hole. The hydraulic rod (32) is connected to the top rod (33), and the hydraulic rod (32) is electrically connected to a controller. The controller is responsible for driving the hydraulic rod (32) to extend to multiple set lengths.

3. The wafer high-efficiency grinding and polishing processing apparatus according to claim 2, characterized in that, The folding component (4) includes a connecting piece (42), a storage shaft (43) is rotatably connected to the connecting piece (42), a rotating shaft (44) is fixedly connected to the end of the baffle (41), the storage shaft (43) extends movably through the interior of the rotating shaft (44), a push shaft (45) is fixedly connected to the push plate (31), the connecting piece (42) is movably sleeved on the outside of the push shaft (45), and the baffle (41) moves with the push plate (31) through the connecting piece (42).

4. The wafer high-efficiency grinding and polishing processing apparatus according to claim 3, characterized in that, A torsion spring (46) is fitted on the storage shaft (43). One end of the torsion spring (46) is fixedly connected to the storage shaft (43), and the other end is fixedly connected to the rotating shaft (44). When the torsion spring (46) is not charged, the baffle (41) and the pusher plate (31) are perpendicular to each other.

5. The wafer high-efficiency grinding and polishing processing apparatus according to claim 4, characterized in that, The inner wall of the chassis (11) is provided with a contact rod (47), and the outer wall of the rotating shaft (44) is fixedly connected with a driven piece (48). When the rotating shaft (44) moves toward the inner wall of the chassis (11), the contact rod (47) squeezes and pushes the driven piece (48) to rotate, forcing the baffle (41) to rotate and fit against the inner wall of the chassis (11).

6. The wafer high-efficiency grinding and polishing processing apparatus according to claim 1, characterized in that, The infusion component (5) includes an injection tube (51), one end of which is connected to a polishing liquid input tube (53), and one end of which is connected to an infusion pump. The outer end of the injection tube (51) is provided with a support rod (52) connected to a baffle (41).

7. The wafer high-efficiency grinding and polishing processing apparatus according to claim 6, characterized in that, The support rod (52) is a telescopic structure. The support rod (52) includes a threaded sleeve (522) connected to the baffle (41) and a threaded rod (521) connected to the injection tube (51). The threaded rod (521) and the threaded sleeve (522) are threadedly connected. The dripping position of the injection tube (51) is adjusted according to the size of the wafer.

8. The wafer high-efficiency grinding and polishing processing apparatus according to claim 1, characterized in that, The rotating component (2) includes a driven gear ring (21) fixedly connected to the bottom of the platform (14). A drive motor (22) is provided at the bottom of the chassis (11). A drive gear (23) is fixedly sleeved at the output end of the drive motor (22). The drive gear (23) and the driven gear ring (21) are meshed together.

9. The wafer high-efficiency grinding and polishing processing apparatus according to claim 1, characterized in that, A liquid replenishment component (6) is provided under the platform (14). The liquid replenishment component (6) includes a liquid storage cylinder (61). A piston plate (62) is slidably provided on the inner wall of the liquid storage cylinder (61). A push rod (63) is provided at the bottom of the piston plate (62). A lifting component (64) is provided at the bottom of the push rod (63). Multiple slag discharge holes are provided on the platform (14). The lifting component (64) is responsible for intermittently pushing the piston plate (62) up to compensate for the liquid on the platform (14).

10. The wafer high-efficiency grinding and polishing processing apparatus according to claim 9, characterized in that, The lifting component (64) includes a drive motor, and the output end of the drive motor is fixedly connected to an eccentric wheel. The eccentric wheel abuts against the push rod component (63). The inner wall of the liquid storage cylinder (61) is provided with a filter screen plate located above the piston plate (62), which is responsible for preventing debris from flowing back to the platform (14).

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