A robot joint with active heat dissipation and a heat dissipation method

Abstract

This application provides a robot joint with active heat dissipation and a heat dissipation method. The outer periphery of the robot joint's cover assembly and / or shell can be provided with an atomizing plate. This atomizing plate can convert electrical energy into vibration to convert the heat dissipation medium into droplets, which are then sprayed onto the outer wall of the robot joint's shell. The robot joint can determine whether to power the atomizing plate to turn the heat dissipation function on or off based on temperature and / or operating status. The droplets of the heat dissipation medium sprayed by the atomizing plate can have a particle size of micrometer, submicrometer, or nanometer. The droplets can make full contact with the shell, and the heat dissipation medium adhering to the shell surface can carry away heat during evaporation, improving the heat dissipation efficiency of the robot joint.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to a robot joint capable of active heat dissipation and a heat dissipation method. Background Technology

[0002] Articulated robots, also known as articulated arm robots or multi-joint robots, mimic the structure of an animal's arm and typically include one or more robotic joints to meet the requirements for rotational and axial degrees of freedom. During operation, the motors, circuit boards, reducers, and bearings within the joints generate a significant amount of heat. For example, the high torque requirements of a robotic arm can cause a rapid increase in heat generation within a short period during operation. If the heat generated by the joints cannot dissipate in time, the motors may shut down due to overheat protection, limiting the overall performance of the robotic joints.

[0003] Patent CN121989300A discloses a thermal management system for robot joint modules based on phase change working fluid injection. This system includes multiple joint module cooling injection components, each disposed at a different joint module. These components pulse-spray liquid phase change working fluid to dissipate heat from the joint modules, reducing the risk of thermal failure. The patent does not disclose the specific structure of the cooling injection components and the joint modules, nor the connection method between them.

[0004] How to provide a robot joint with high heat dissipation efficiency is a problem worth considering. Summary of the Invention

[0005] This application provides a robot joint with active heat dissipation and a heat dissipation method to improve the heat dissipation efficiency of robot joints.

[0006] To solve the above-mentioned technical problems, this application provides the following technical solution: In a first aspect, a robot joint capable of active heat dissipation is provided, including a cover assembly, a housing, and a motor body. The cover assembly and the housing form an accommodating space, and the motor body is housed in the accommodating space. The robot joint further includes: one or more atomizing plates located inside the cover assembly and / or outside the housing, and configured to generate vibration when powered to convert the heat dissipation medium into droplets and spray them out onto the outer wall of the housing; and a delivery conduit for delivering the heat dissipation medium to the atomizing plates.

[0007] In one possible implementation, the robot joint may also include a reducer and / or a drive plate, both of which can be housed within a containment space enclosed by the cover assembly and the housing.

[0008] In one possible implementation, multiple atomizing plates can be arranged around the axis of the robot joint. As an example, the projection of the atomizing plates onto a reference plane can be located outside the projection of the housing onto the reference plane. The reference plane is perpendicular to the axis of the robot joint.

[0009] In one possible implementation, the robot joint may also include a storage device for the heat dissipation medium and a tee fitting. Multiple atomizing plates may share a storage device. The delivery pipe may include at least a supply pipe and a return pipe. The tee fitting connects the supply pipe and the return pipe. Both the supply pipe and the return pipe are connected to the storage device for the heat dissipation medium.

[0010] In one possible implementation, each atomizing plate can be individually configured with a heat dissipation medium storage device and a delivery pipe.

[0011] In one possible implementation, the heat dissipation medium can be liquid, including but not limited to water, aqueous ethylene glycol solution, a mixture of water and ethanol, a mixture of water and isopropanol, liquid nitrogen, etc.

[0012] In one possible implementation, the average diameter of the droplets is between 1 micrometer and 50 micrometers, or between 0.1 micrometers and 1 micrometer, or between 1 nanometer and 100 nanometers.

[0013] In one possible implementation, the atomizing sheet comprises a piezoelectric ceramic substrate, and the vibration frequency is between 10 kHz and 1000 kHz.

[0014] The robot joint provided by this technical solution utilizes an atomizing plate to convert electrical energy into vibration, thereby transforming the heat dissipation medium into tiny droplets. This eliminates the need for nozzles and other components and related designs in traditional atomizing cooling devices. During operation, the heat dissipation medium does not require additional pressure, simplifying the structure of the robot joint's heat dissipation module and enabling miniaturization of the entire thermal management system. The atomized heat dissipation medium can fully contact and adhere to the outer surface of the shell. When heated, the heat dissipation medium evaporates, carrying away heat and achieving cooling, thus improving the cooling efficiency of the robot joint.

[0015] In one possible implementation, the atomizing sheet is located between the upper cover and the mounting cover of the cover assembly. The annular groove body of the mounting cover includes a gasket receiving groove, in which the atomizing sheet is received and communicates with the mist outlet of the gasket receiving groove. The robot joint also includes a sealing gasket, which is at least partially received in the gasket receiving groove and abuts against the side of the atomizing sheet opposite to the bottom of the gasket receiving groove.

[0016] As an example, the mounting cover may include an interconnected annular groove body and a mounting cover connector. The mounting cover is located on the side of the cover assembly closest to the housing. The mounting cover connector can be connected to components such as a motor within the housing.

[0017] As an example, there are multiple gasket receiving slots, which are distributed at equal angles on the bottom of the annular groove body.

[0018] By sandwiching the atomizing plate between the sealing gasket and the gasket receiving groove, the atomizing plate can be relatively securely installed within the cover assembly. Furthermore, the contact between the sealing gasket and the atomizing plate facilitates a seal of the atomizing plate's receiving space, preventing leakage of the heat dissipation fluid.

[0019] In one possible implementation, the bottom of the gasket receiving groove is recessed in the middle to form a central sub-receiving groove, the second connecting portion of the sealing gasket is at least partially inserted into the central sub-receiving groove and sealed to the central sub-receiving groove, and the atomizing sheet is sandwiched between the end face of the second connecting portion and the bottom of the central sub-receiving groove; the sealing gasket also includes a first connecting portion, one end of which is connected to the second connecting portion, and the other end of which is connected to the tee fitting of the robot joint.

[0020] As an example, the outer wall of the second connecting portion is provided with an annular sealing ring, the sidewall of which may be concave in the middle and convex on both sides; that is, the sidewall of the annular sealing ring includes an annular groove. The inner wall of the central sub-receiving groove may be provided with an annular protrusion structure. When the second connecting portion of the sealing gasket is inserted into the central sub-receiving groove, the annular protrusion structure on the inner wall of the central sub-receiving groove can be embedded into the annular groove on the sidewall of the annular sealing ring. In this way, the second connecting portion can be fixedly connected to the central sub-receiving groove, and the contact area between the two is increased, which is beneficial to improving the sealing effect at the connection position.

[0021] In one possible example, the outer wall of the second connecting portion may also be provided with an annular sealing portion, the structure of which is similar to that of the aforementioned annular sealing ring. In other words, the aforementioned second connecting portion and the annular sealing ring can be an integrally formed structure, or the aforementioned annular sealing ring can be part of a sealing gasket.

[0022] As an example, the gasket receiving groove includes a left sub-receiving groove, a right sub-receiving groove, and a middle sub-receiving groove. The top of the middle sub-receiving groove is located below the bottom of the left sub-receiving groove or the bottom of the right sub-receiving groove. In this way, when the heat dissipation medium leaks, the heat dissipation medium needs to overflow the middle sub-receiving groove first before it can enter the left or right sub-receiving groove, which can play a buffering role to a certain extent.

[0023] In one possible implementation, the robot joint also includes a mounting base and a sealing cover. The mounting base is fixedly connected to the outside of the housing and includes a mist outlet facing the housing. An atomizing plate is sandwiched between the mounting base and the sealing cover and communicates with the mist outlet.

[0024] As an example, the atomizing plate, mounting base, sealing cap, and other components can together form an atomizing plate assembly. This assembly can form a functional module with heat dissipation capabilities. This module can be decoupled from the power output function of the robot joint, which helps reduce the design, manufacturing, and maintenance complexity of the robot joint. Clamping the atomizing plate between the mounting base and the sealing cap facilitates sealing of the atomizing plate and prevents leakage of the heat dissipation medium.

[0025] In one possible implementation, the mounting base includes an atomizing plate receiving groove with a misting hole at the bottom of the groove, the atomizing plate being received in the groove, and the atomizing plate pressing portion of the sealing cover abutting against the side of the atomizing plate opposite to the misting hole.

[0026] As an example, the mounting base may include an annular seal. The annular seal may be positioned around the atomizing plate receiving groove to improve the sealing effect on the atomizing plate.

[0027] As an example, the sealing cap may include a sealing cap receiving groove and a columnar sealing portion, with the annular sealing portion of the mounting base sandwiched between the sidewall of the sealing cap receiving groove and the sidewall of the columnar sealing portion. The middle of the end face of the columnar sealing portion may protrude outward to form an atomizing sheet pressing portion. By pressing the atomizing sheet with the atomizing sheet pressing portion, the atomizing sheet can be securely installed in the atomizing sheet receiving groove, which facilitates sealing of the atomizing sheet and prevents leakage of the heat dissipation fluid.

[0028] In one possible implementation, the outer wall of the shell comprises a multi-level micro / nano structure.

[0029] As an example, multi-level micro / nanostructures exhibit a hierarchical scale characteristic, and can include microstructures with two or more spatial scales, the size of which can be nanometer-scale or micrometer-scale. For example, a multi-level micro / nanostructure can be a two-level structure of "micrometer-scale protrusions + nanometer-scale fibers". Alternatively, a multi-level micro / nanostructure can be a three-level structure of "millimeter-scale arrays + micrometer-scale pores + nanometer-scale walls".

[0030] Multi-level micro-nano structures can increase the contact area between the robot joint shell and the heat dissipation medium and air. Combined with the atomization heat dissipation method provided in this application, the heat dissipation efficiency of the robot joint can be significantly improved.

[0031] In one possible implementation, a heat dissipation coating is provided on the outer layer of the multi-layered micro / nano structure.

[0032] As an example, heat dissipation coatings may include non-metallic base coatings such as graphene coatings, ceramic base coatings such as aluminum nitride coatings, and composite coatings such as silicon carbide-epoxy resin composite coatings.

[0033] The heat dissipation coating applied to the outer surface of the shell can enhance the shell's heat radiation and heat conduction capabilities, thereby improving the heat dissipation efficiency of the robot's joints.

[0034] Secondly, a heat dissipation method for an actively heat-dissipating robot joint is provided, applied to the robot joint in the first aspect and any possible implementation thereof. The robot joint includes a detection module, a processing module, and a heat dissipation module. The heat dissipation method includes: the detection module detecting the temperature and / or operating status of the robot joint; the detection module sending first indication information, and correspondingly, the processing module receiving the first indication information, the first indication information being used to indicate the temperature and / or operating status; the processing module determining to start or stop the heat dissipation function according to the first indication information; the processing module sending second indication information, and correspondingly, the heat dissipation module receiving the second indication information, the second indication information being used to indicate to start or stop the heat dissipation function; and the heat dissipation module starting or stopping heat dissipation. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of a robot joint provided in an embodiment of this application.

[0037] Figure 2 This is a schematic diagram of the structure of an atomizing sheet provided in an embodiment of this application.

[0038] Figure 3 This is a schematic diagram of another robot joint structure provided in an embodiment of this application.

[0039] Figure 4 This is a schematic diagram of a conveying pipeline provided in an embodiment of this application.

[0040] Figure 5 yes Figure 3 A schematic diagram of the components of a robot joint.

[0041] Figure 6 This is a schematic diagram of the structure of a mounting base provided in an embodiment of this application.

[0042] Figure 7This is a schematic diagram of the structure of a sealing cap provided in an embodiment of this application.

[0043] Figure 8 This is a schematic diagram of another robot joint provided in the embodiments of this application.

[0044] Figure 9 yes Figure 8 A schematic diagram of the components of a robot joint.

[0045] Figure 10 yes Figure 8 A schematic diagram of the cover assembly of the robot joint.

[0046] Figure 11 This is a schematic diagram of the structure of an installation cover provided in an embodiment of this application.

[0047] Figure 12 yes Figure 11 A magnified view of the mounting cover.

[0048] Figure 13 This is a schematic diagram of the structure of a sealing gasket provided in an embodiment of this application.

[0049] Figure 14 This is a structural schematic diagram of a tee fitting provided in an embodiment of this application.

[0050] Figure 15 This is a schematic diagram of the structure of a cover provided in an embodiment of this application.

[0051] Figure 16 This is a schematic diagram of a multi-level micro / nano structure provided in an embodiment of this application.

[0052] Figure 17 This is a schematic diagram of a heat dissipation principle provided in an embodiment of this application.

[0053] Figure 18 This is a schematic diagram of a heat dissipation method provided in an embodiment of this application.

[0054] Explanation of reference numerals in the attached figures: Robot joint 10, front cover 111, housing 113, rear cover 115, reducer 121, motor body 122, drive board 131, encoder 133, temperature sensor 135, atomizing plate 20, piezoelectric ceramic substrate 210, upper electrode 220, lower electrode 230, vibrating diaphragm 240, robot joint 30 with active heat dissipation, first housing 310, first annular protrusion 311, annular recess 312, second annular... Protrusion 313, cover assembly 320, delivery pipe 330, atomizing plate assembly 340, atomizing plate receiving groove 401, mist outlet 402, mounting groove 403, countersunk hole 404, liquid inlet groove 405, wiring groove 406, sealing cover receiving groove 407, liquid inlet hole 408, mounting base 410, mounting base base plate 411, mounting base connecting part 412, annular sealing part 413, sealing cover 420, sealing cover base plate 421, sealing The components include: a cover connecting part 422, a tee fitting 423, an atomizing plate wiring limiting part 424, a positioning post 425, a columnar sealing part 426, an atomizing plate pressing part 427, a robot joint with active heat dissipation 50, a gasket receiving groove 501, a left sub-receiving groove 5001, a right sub-receiving groove 5002, a middle sub-receiving groove 5003, an atomizing hole 5004, a second housing 510, a cover assembly 520, an upper cover 521, and a mounting cover 522. Annular bottom surface 5221, annular outer wall 5222, annular inner wall 5223, mounting cover connecting part 5224, tee fitting 523, first port 5231, second port 5232, branch port 5233, tee left connecting lug 5234, tee right connecting lug 5235, sealing gasket 524, first connecting part 5241, second connecting part 5242, gasket left connecting lug 5243, gasket right connecting lug 5244. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the described embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] Figure 1 A robot joint 10 provided in this application embodiment may include a front cover 111, a housing 113 and a rear cover 115. The front cover 111 and the rear cover 115 may be connected to the two ends of the housing 113 respectively, and they may form an accommodating space.

[0057] The robot joint 10 may also include a motor body 122 and a reducer 121. The robot joint 10 may also include a drive board 131, an encoder 133, and a temperature sensor 135. These components can be housed in the receiving space formed by the front cover 111, the housing 113, and the rear cover 115.

[0058] The housing 113 provides physical protection for components such as the motor body 122 of the robot joint 10, protecting them from damage by dust, liquids, and external impacts. The housing 113 also serves as a mechanical interface for connecting and securing with other links or adjacent joints of the robot.

[0059] The front cover 111 can serve as the torque output end of the robot joint 10, and it can be directly connected to the next link of the robot. The front cover 111 can withstand the working load and has built-in bearings to support the output shaft.

[0060] The rear cover 115 can provide a mounting surface and protection for components such as the drive board 131, encoder 133 and temperature sensor 135, and can also provide cable outlets.

[0061] The motor body 122 can serve as the power source for the robot joint 10. It can be a high-power-density servo motor. Its internal stator and rotor rotate under the action of electromagnetic force, converting electrical energy into mechanical energy and outputting high-speed rotational motion.

[0062] The reducer 121 can be connected to the high-speed output shaft of the motor body 122. Through gear meshing, the high speed and low torque of the motor body 122 are converted into the high torque and low speed required for robot drive.

[0063] The driver board 131 can integrate circuits such as a motor driver, microcontroller, and communication interface. It can receive commands (such as position and speed commands) sent by the upper controller and drive the motor body 122 to move precisely. The driver board 131 can work with the encoder 133 to achieve closed-loop control.

[0064] The encoder 133 can be installed on the output shaft of the motor body 122 to measure the rotation angle and speed of the motor rotor (or output shaft) in real time and with high precision, and feed this information back to the drive board 131 to form a closed-loop control to ensure the accuracy of the robot's movements.

[0065] Temperature sensor 135 can be attached to the stator winding of motor body 122 or the housing of reducer 121. It can be a thermistor and is used to monitor the temperature inside robot joint 10 in real time and send the detection data to drive board 131. When the temperature is too high, the robot's control system can issue an alarm or take protective measures such as power reduction or shutdown to prevent the motor from overheating and burning out or the reducer lubricating oil from failing.

[0066] When the robot joint 10 is in operation, electromagnetic losses caused by the rotation of the motor body 122 will generate heat. For example, the stator windings, stator core, and rotor of the motor body 122 will all generate heat. The reducer 121 will also generate heat due to gear meshing friction and bearing friction. Power devices such as thin-film transistors on the drive board 131 will also generate heat. This heat can be conducted to the surface of the robot joint 10 through the housing 113, front cover 111, and rear cover 115, and then dissipated into the environment through convection, radiation, and other means.

[0067] It should be noted that the structure of the robot joint 10 described above is only an example. In some other examples, the robot joint 10 may only include the motor body 122, or in other words, the robot joint 10 may not include the reducer 121, drive plate 131, encoder 133, or temperature sensor 135. In still other examples, the robot joint 10 may include the motor body 122 and some components of the reducer 121, drive plate 131, encoder 133, or temperature sensor 135.

[0068] It should be noted that the form of the outer shell of the robot joint 10, consisting of a shell 113, a front cover 111, and a rear cover 115, is merely an example. In some other examples, the outer shell of the robot joint 10 may have other different structures. For example, the robot joint 10 may be: multiple cylindrical segments arranged in sections along the axial direction; or two or more lobed shells arranged in opposite directions along the circumference; or a double-layered shell with inner and outer layers; or a combination of the above forms.

[0069] The heat dissipation module and method provided in this application can be applied to both rotary joints and linear joints of robots, and this application makes no limitation on either. The rotary joints of the robot may include, but are not limited to, planetary joints, harmonic joints, and rotary vector joints, while the linear joints of the robot may include, but are not limited to, linear joints based on planetary roller screws or ball screws.

[0070] To improve the heat dissipation efficiency of robot joints and reduce the probability of power limitation or even shutdown caused by overheating, this application provides a robot joint that can achieve efficient heat dissipation by converting the heat dissipation medium into tiny droplets and spraying them onto the outer surface of the robot joint.

[0071] In one possible example, the heat dissipation medium provided in this application embodiment can be liquid, including but not limited to water, aqueous ethylene glycol solution, a mixture of water and ethanol, a mixture of water and isopropanol, liquid nitrogen, etc.

[0072] In some examples, atomizing plates can be placed around the periphery of the robot joints, which can convert liquid heat dissipation fluid into tiny droplets.

[0073] As an example, the droplets of the heat dissipation medium obtained by the atomizing plate can be micrometer-sized, submicrometer-sized, or nanometer-sized droplets. For example, the average diameter of the droplets (e.g., the souter average diameter) can be 1~50μm or 10~30μm. Another example is that the average diameter of the droplets (e.g., the souter average diameter) can be 0.1~1μm. Yet another example is that the average diameter of the droplets (e.g., the souter average diameter) can be 1~100nm.

[0074] For example, the atomizing plate can be a piezoelectric ceramic atomizing plate, which can convert electrical signals into mechanical vibrations, thereby converting liquids into tiny droplets. The vibration frequency of this piezoelectric ceramic atomizing plate can be between 10kHz and 1000kHz (such as 20kHz, 100kHz, 200kHz, 500kHz, 800kHz, etc.) to ensure that the size of the droplets converted by the atomizing plate meets the requirements.

[0075] For example, the atomizing plate can be a magnetostrictive atomizing plate, which can expand and contract in an alternating magnetic field, thereby driving components such as probes to perform ultrasonic vibrations on the liquid, thus converting the liquid into tiny droplets.

[0076] Magnetostrictive atomizing sheets require coils and other components to provide an alternating magnetic field, and their operation involves the coils and other components generating heat. Compared to magnetostrictive atomizing sheets, piezoelectric ceramic atomizing sheets have a relatively simple structure and generate less heat during operation.

[0077] The atomizing plate can also be manufactured based on the principles of interdigital transducers, electrostatic atomization, etc., and this application does not impose any restrictions on this.

[0078] The embodiments of this application do not limit the specific structure of the atomizing plate. Figure 2 A schematic diagram of an atomizing plate 20 is provided as an example. The atomizing plate 20 may include an annular piezoelectric ceramic substrate 210, an upper electrode 220, a lower electrode 230, and a vibrating diaphragm 240. The upper electrode 220 and the lower electrode 230 may be connected to opposite sides of the piezoelectric ceramic substrate 210. The vibrating diaphragm 240 may cover the through hole in the middle of the piezoelectric ceramic substrate 210 and may be connected to the upper electrode 220 or the lower electrode 230. The vibrating diaphragm 240 may have a large number of micropores. The upper electrode 220 and the lower electrode 230 may be electrically connected to the two output terminals of an external driving circuit to receive driving electrical signals.

[0079] When an external driving circuit applies a high-frequency AC voltage to the upper electrode 220 and the lower electrode 230, an alternating electric field is generated inside the piezoelectric ceramic substrate 210 sandwiched between the upper and lower electrodes 220 and 230. Under the influence of the electric field, the lattice of the piezoelectric ceramic substrate 210 undergoes periodic deformation, thereby generating radial or thickness-direction stretching vibrations. The vibrating membrane 240 attached to the piezoelectric ceramic substrate 210 also vibrates as a result, and liquid (such as a heat dissipation medium) located on one side of the vibrating membrane 240 can be ejected from the micropores of the vibrating membrane 240 during the vibration process, forming droplets.

[0080] Using atomizing plates to convert the heat dissipation medium into droplets can eliminate the need for components such as nozzles and related designs in traditional atomizing cooling devices. During the operation of the atomizing plates, the heat dissipation medium does not need to be subjected to additional pressure, which helps to simplify the structure of the heat dissipation module of the robot joint and enables the miniaturization of the entire thermal management system of the robot joint.

[0081] This application does not limit the power supply method for the atomizing plate. The atomizing plate can be powered internally or externally to the robot joint. For example, the atomizing plate can be powered by the drive board inside the robot joint, which allows for higher integration of the entire robot joint module, reduces the number of external interfaces, and facilitates plug-and-play functionality for the robot system.

[0082] Figure 3 The present application provides an active heat dissipation robot joint 30 (hereinafter referred to as robot joint 30), which can be obtained by improving the robot joint 10 described above. The robot joint 30 may include a first housing 310, a cover assembly 320, and a heat dissipation module. The heat dissipation module can be configured to spray atomized heat dissipation working fluid onto the side wall of the first housing 310 to achieve efficient heat dissipation of the robot joint 30.

[0083] The first housing 310 and the cover assembly 320 can form a receiving space, in which the motor, reducer and other components of the robot joint 30 can be housed.

[0084] The outer surface of the first housing 310 may include multi-layered micro / nano structures and / or heat-dissipating coatings to improve the heat dissipation efficiency of the robot joint 30. This will be described later and will not be elaborated here. The cover assembly 320 may be provided with one or more heat dissipation sections, which may be provided with thermally conductive materials, or in other words, the thermal conductivity of the heat dissipation sections may be relatively high to facilitate heat exchange between the internal space of the robot joint 30 and the external environment.

[0085] The heat dissipation module may include a delivery pipe 330 and an atomizing plate assembly 340. The delivery pipe 330 may be used to supply heat dissipation medium to the atomizing plate assembly 340. The atomizing plate assembly 340 may be used to convert the heat dissipation medium into droplets with a particle size smaller than a preset particle size and spray them out onto the side wall of the first housing 310.

[0086] In some examples, each atomizing plate assembly 340 can be individually configured with a heat dissipation medium storage device and a delivery pipe 330. In this case, the delivery pipe 330 can be directly connected to the atomizing plate assembly 340 and the heat dissipation medium storage device.

[0087] In some examples, multiple atomizing plate assemblies 340 may share the same heat dissipation medium storage device. In this case, the delivery pipeline may include multiple pipe segments, which can be connected to the atomizing plate assemblies 340 via tee fittings.

[0088] like Figure 4 The diagram shows a structural schematic of a delivery pipe 330. The delivery pipe 330 may include at least a supply pipe 331 and a return pipe 332. One end of the supply pipe 331 can be connected to a storage device for the heat dissipation medium, and the other end can be connected to an atomizing plate assembly 340. The heat dissipation medium in the storage device can be input into the atomizing plate assembly 340 through the supply pipe 331. One end of the return pipe 332 can be connected to the atomizing plate assembly 340, and the other end can be connected to the aforementioned storage device for the heat dissipation medium. A portion of the heat dissipation medium flowing through the atomizing plate assembly 340 can be returned to the storage device through the return pipe 332. In other words, the atomizing plate assembly 340 can be connected between the supply pipe 331 and the return pipe 332.

[0089] When there are multiple atomizing plate assemblies 340, the delivery pipe 330 may further include a first pipe section 333 and / or a second pipe section 334. The first pipe section 333 and the second pipe section 334 may be connected between the liquid supply pipe 331 and the return pipe 332, and are used to transfer the heat dissipation working fluid among the multiple atomizing plate assemblies 340. For example, if there are three atomizing plate assemblies 340, one atomizing plate assembly 340 may be connected between the liquid supply pipe 331 and the first pipe section 333, one atomizing plate assembly 340 may be connected between the first pipe section 333 and the second pipe section 334, and one atomizing plate assembly 340 may be connected between the second pipe section 334 and the return pipe 332.

[0090] Figure 5 This illustrates one connection method between the atomizing plate assembly 340, the delivery pipe 330, and the first housing 310. Figure 5 The components of the atomizing plate assembly 340 are also roughly shown.

[0091] In some examples, the atomizing plate assembly 340 may include a mounting base 410, a sealing cap 420, and an atomizing plate 20, wherein the atomizing plate 20 may be sandwiched between the mounting base 410 and the sealing cap 420.

[0092] As an example, Figure 6 This is a structural schematic diagram of the mounting base 410. The left side of the schematic diagram mainly shows the side of the mounting base 410 facing the atomizing plate 20, while the right side of the schematic diagram mainly shows the side of the mounting base 410 away from the atomizing plate 20.

[0093] The mounting base 410 may include a mounting base substrate 411 and a mounting base connecting portion 412, which can be used to achieve a fixed connection between the mounting base 410 and the first housing 310. (See reference) Figure 5 The first shell 310, which is roughly cylindrical, is thicker at both ends and thinner in the middle. Alternatively, the middle portion of the first shell 310 forms an annular recess 312 in the circumferential direction; or, the two ends of the first shell 310 respectively form a first annular protrusion 311 and a second annular protrusion 313 in the circumferential direction. Figure 5 and Figure 6 To ensure a more secure connection between the mounting base 410 and the first housing 310, the mounting base connecting portion 412 may correspond to the annular recess 312 of the first housing 310. For example, the mounting base connecting portion 412 may be located in the middle of the mounting base substrate 411 and may be a protruding structure. When the mounting base 410 is connected to the first housing 310, refer to... Figure 5 The two ends of the mounting base plate 411 can overlap the first annular protrusion 311 and the second annular protrusion 313, and the mounting base connecting part 412 can at least partially sink into the annular recess 312.

[0094] Please refer to Figure 6 The mounting base connection part 412 can have a misting hole 402, from which a mist-like heat dissipation medium can be ejected. Combined with... Figures 3 to 5 The mist outlet 402 can be positioned facing the annular recess 312 so that the heat dissipation medium, after being ejected from the mist outlet 402, falls onto the first housing 310. To prevent the mist-like heat dissipation medium from directly accumulating during ejection and limiting the contact area between the heat dissipation medium and the first housing 310, the minimum distance dm between the sidewall of the first housing 310 (or the bottom surface of the annular recess 312) and the mist outlet 402 should be greater than or equal to a preset distance. Alternatively, in combination with... Figure 3 , Figure 5 and Figure 6 The side of the mounting base connecting part 412 facing the annular recess 312 and the bottom surface of the annular recess 312 can be spaced apart, and the size of the gap 3120 between them can be greater than or equal to the aforementioned preset distance.

[0095] Understandably, while ensuring that the mounting base connection part 412 can partially sink into the annular recess 312, the minimum distance dm between the mist outlet 402 and the side wall of the first housing 310 can be as large as possible, so that the mist-like heat dissipation medium can fully diffuse and fully contact the first housing 310 when it is sprayed out from the mist outlet 402.

[0096] Continue to refer to Figure 6 The mounting base substrate 411 may include an atomizing plate receiving groove 401. The atomizing plate receiving groove 401 may be located on the side of the mounting base substrate 411 opposite to the mounting base connecting portion 412 and communicate with the mist outlet 402. The atomizing plate receiving groove 401 may be used to receive the atomizing plate 20, or in other words, the atomizing plate 20 may be at least partially received in the atomizing plate receiving groove 401. When the atomizing plate 20 converts the liquid heat dissipation working fluid into a mist, the mist-like heat dissipation working fluid may be ejected from the mist outlet 402.

[0097] The mounting base plate 411 may also include an annular sealing portion 413, which may be disposed around the atomizing plate receiving groove 401 and located on the side of the mounting base plate 411 opposite to the mounting base connection portion 412. In this way, the heat dissipation working fluid overflowing from near the atomizing plate 20 can be blocked by the annular sealing portion 413 to prevent leakage from the atomizing plate assembly 340 and causing a short circuit in the robot joint 30.

[0098] The mounting base substrate 411 may also include a mounting groove 403, which can mate with the sealing cover 420 to form a receiving space for accommodating the power supply lines of the atomizing plate 20. Figure 6 As shown, the mounting slot 403 can communicate with the atomizing plate receiving slot 401. In this way, the power supply line of the atomizing plate 20 housed in the atomizing plate receiving slot 401 can extend through the mounting slot 403, thereby being electrically connected to an external circuit.

[0099] The mounting base plate 411 may also have one or more countersunk holes 404. For example, as shown... Figure 6 As shown, there can be four countersunk holes 404, which can be distributed at the four corners of the mounting base plate 411. The countersunk holes 404 can be used for the fixed connection between the mounting base plate 411 and the first housing 310. For example, the atomizing plate assembly 340 can be equipped with four screws, which can pass through the four countersunk holes 404 respectively and connect to the threaded holes on the first annular protrusion 311 and the second annular protrusion 313, so as to fix the mounting base plate 411 to the first housing 310.

[0100] As an example, Figure 7The diagram shows the structure of the sealing cover 420. The left side mainly shows the side of the sealing cover 420 facing away from the mounting base 410, while the right side mainly shows the side of the sealing cover 420 facing the mounting base 410.

[0101] The sealing cap 420 may include a sealing cap base plate 421, a sealing cap connecting portion 422, and a tee fitting 423. Figures 5 to 7 The sealing cap substrate 421 can be located on the side of the atomizing sheet 20 opposite to the mounting base substrate 411, or in other words, the sealing cap substrate 421 and the mounting base substrate 411 are located on opposite sides of the atomizing sheet 20. In the atomizing sheet assembly 340, the atomizing sheet 20 can be sandwiched between the mounting base 410 and the sealing cap 420 and communicate with the mist outlet 402. For example, the atomizing sheet 20 can be sandwiched between the sealing cap substrate 421 and the mounting base substrate 411.

[0102] Combination Figures 3 to 5 and Figure 7 The tee fitting 423 can be used to connect the conveying pipe 330 and the atomizing plate 20 in the atomizing plate assembly 340, or in other words, the heat dissipation working fluid in the conveying pipe 330 can be input into the atomizing plate 20 through the tee fitting 423.

[0103] Combination Figure 5 and Figure 7 The sealing cap connecting portion 422 can be located on the side of the sealing cap substrate 421 facing away from the atomizing plate 20. The sealing cap 420 can include a liquid inlet groove 405. One end of the liquid inlet groove 405 can be connected to a tee fitting 423, and the other end can be connected to the atomizing plate 20. For example, the liquid inlet groove 405 can be formed on the sealing cap connecting portion 422 and located on the side of the sealing cap connecting portion 422 adjacent to the sealing cap substrate 421. For example, the liquid inlet groove 405 can be formed on the sealing cap substrate 421 and located on the side of the sealing cap substrate 421 adjacent to the sealing cap connecting portion 422. For another example, the liquid inlet groove 405 can be partially formed on the sealing cap connecting portion 422 and partially formed on the sealing cap substrate 421. Alternatively, the adjacent surfaces of the sealing cap substrate 421 and the sealing cap connecting portion 422 can be grooved respectively, and the two parts of the groove are connected to form the liquid inlet groove 405.

[0104] In one possible example, the tee fitting 423 may be located on the side of the sealing cap base plate 421 near the delivery pipe 330, and the sealing cap connecting portion 422 is also used to fix the sealing cap base plate 421 and the tee fitting 423.

[0105] Continue to refer to Figure 7The sealing cap 420 may also include a sealing cap receiving groove 407. The sealing cap receiving groove 407 may be formed on the sealing cap base plate 421 and located on the side of the sealing cap base plate 421 opposite to the sealing cap connecting portion 422. The sealing cap receiving groove 407 may be used to receive the annular sealing portion 413 on the mounting base 410. When the mounting base 410, the atomizing plate 20 and the sealing cap 420 are assembled, the annular sealing portion 413 may be inserted into the sealing cap receiving groove 407.

[0106] The sealing cap receiving groove 407 may include a columnar sealing portion 426. The sidewall of the columnar sealing portion 426 may be spaced apart from the sidewall of the sealing cap receiving groove 407, or in other words, a gap exists between the sidewall of the columnar sealing portion 426 and the sidewall of the sealing cap receiving groove 407. The width of the gap may match the wall thickness of the annular sealing portion 413 of the mounting base 410, allowing the annular sealing portion 413 to be inserted into the gap. An atomizing sheet pressing portion 427 may protrude from the end face of the columnar sealing portion 426 in a direction away from the bottom of the sealing cap receiving groove 407. When the mounting base 410, the atomizing sheet 20, and the sealing cap 420 are assembled, this atomizing sheet pressing portion 427 can press against the surface of the atomizing sheet 20, allowing the atomizing sheet 20 to be securely installed within the atomizing sheet receiving groove 401. Alternatively, the atomizing sheet pressing portion 427 may abut against the side of the atomizing sheet 20 facing away from the mist outlet 402.

[0107] A liquid inlet hole 408 can be formed inside the columnar sealing part 426. One end of the liquid inlet hole 408 can communicate with the liquid inlet groove 405 of the sealing cover 420, and the other end can communicate with the atomizing plate 20. In this way, the heat dissipation working fluid can flow into the atomizing plate 20 through the liquid inlet groove 405 and the liquid inlet hole 408 for subsequent conversion into droplets and spraying. In one possible example, the opening of the liquid inlet hole 408 can be located in the middle of the atomizing plate pressing part 427 and aligned with the hole in the middle of the annular atomizing plate 20.

[0108] The sealing cap 420 may also include an atomizing plate wiring limiting portion 424. The atomizing plate wiring limiting portion 424 may be a groove structure, which may be formed by protruding from the area on the sealing cap base plate 421 corresponding to the mounting groove 403 on the mounting base 410. The atomizing plate wiring limiting portion 424 may have a wiring groove 406, the opening of which may face the mounting groove 403. When the mounting base 410, the atomizing plate 20 and the sealing cap 420 are assembled, the atomizing plate wiring limiting portion 424 may be inserted into the mounting groove 403. The top surface of the side wall of the wiring groove 406 may fit and / or abut against the bottom of the mounting groove 403. In this way, the wiring groove 406 may form a tubular channel with open ends and closed sides. The power supply line of the atomizing plate 20 may be housed in the tubular channel to prevent the intrusion of heat dissipation working fluid and to prevent short circuit of the power supply line of the atomizing plate 20 located in the wiring groove 406. In one possible example, the extending direction of the wiring groove 406 and the extending direction of the mounting groove 403 can be parallel. In another possible example, the width of the atomizing plate wiring limiting portion 424 can match the width of the mounting groove 403 so that the atomizing plate wiring limiting portion 424 can fit snugly within the mounting groove 403.

[0109] The sealing cover substrate 421 may also include one or more positioning posts 425. During the assembly of the sealing cover 420 and the mounting base 410, the positioning posts 425 can engage with the countersunk holes 404 on the mounting base substrate 411 to align the sealing cover 420 and the mounting base 410. In one possible example, the number of positioning posts 425 is four. The four positioning posts 425 can be located at the four corners of the sealing cover substrate 421, and all are located on the side of the sealing cover substrate 421 facing the mounting base substrate 411. The size and position of the positioning posts 425 can correspond to the size and position of the countersunk holes 404, so that the positioning posts 425 can be inserted into the countersunk holes 404. In one possible example, the axial direction of the positioning post 425 can be provided with a through hole, which can cooperate with the countersunk hole 404 and the connecting holes on the first annular protrusion 311 and the second annular protrusion 313. When the screw passes through the aforementioned three connecting holes and is tightened, the mounting base 410 and the sealing cover 420 can be fixedly connected to the first housing 310, that is, the atomizing plate assembly 340 can be fixedly connected to the first housing 310.

[0110] In some examples, reference Figure 5 The atomizing plate assembly 340 may further include a diaphragm 430, which may be located between the atomizing plate 20 and the sealing cap 420. The diaphragm 430 is water-permeable, allowing the heat dissipation medium to enter the atomizing plate 20 after passing through the diaphragm 430 and be converted into droplets. For example, the diaphragm 430 may include multiple micropores through which the heat dissipation medium can enter the atomizing plate 20.

[0111] In one possible example, the diaphragm 430 may have the ability to adsorb the heat dissipation medium, or in other words, the heat dissipation medium may be partially stored on the diaphragm 430. Thus, in the event of a brief interruption in the supply of heat dissipation medium within the delivery pipe 330, the heat dissipation medium stored on the diaphragm 430 can continue to enter the atomizing plate 20, and the atomizing plate 20 will not immediately stop dispensing heat dissipation medium. In practical heat dissipation engineering, the diaphragm 430 can play a certain buffering role in the supply of heat dissipation medium.

[0112] like Figure 8 and Figure 9 As shown, another actively heat-dissipating robot joint 50 (hereinafter referred to as robot joint 50) provided in this application embodiment can be obtained based on the robot joint 10 described above. The robot joint 50 may include a second housing 510, a cover assembly 520, and a heat dissipation module. The heat dissipation module can be configured to spray atomized heat dissipation fluid onto the sidewalls of the second housing 510 to achieve efficient heat dissipation of the robot joint 50.

[0113] The second housing 510 can form an accommodating space with the cover assembly 520, in which the motor, reducer and other components of the robot joint 50 can be housed.

[0114] Unlike the robot joint 30 mentioned above, whose heat dissipation module is located on the outer side of the housing, the heat dissipation module in the robot joint 50 can be located at the end and can be housed or integrated into the cover assembly 520.

[0115] like Figure 8 and Figure 9 As shown, the cover assembly 520 can cover one end of the second housing 510. The following description focuses on the structure of the cover assembly 520, and explains the relevant structure of the heat dissipation module of the robot joint 50.

[0116] The cover assembly 520 may include a delivery conduit 330, which may be housed within a receiving cavity of the cover assembly 520. The delivery conduit 330 may include at least a supply conduit 331 and a return conduit 332. Further details regarding the delivery conduit 330 can be found in the preceding text. Figure 4 Related information.

[0117] refer to Figure 9 and Figure 10 The cover assembly 520 may include a tee fitting 523. The function of the tee fitting 523 is similar to that of the tee fitting 423 mentioned above. It can be used to connect the delivery pipe 330 and the atomizing plate 20. The heat dissipation working fluid in the delivery pipe 330 can be input into the atomizing plate 20 through the tee fitting 523.

[0118] The cover assembly 520 may further include an upper cover 521 and a mounting cover 522. The mounting cover 522 may be located on the side of the cover assembly 520 near the second housing 510 and may be connected to the end of the second housing 510. The upper cover 521 may be located on the side of the mounting cover 522 opposite to the second housing 510. The upper cover 521 may be fitted onto the mounting cover 522, and a gap may be provided between the two, in which the delivery pipe 330, the tee fitting 523, and the atomizing plate 20 may be installed.

[0119] Figure 11 This is a structural diagram of the mounting cover 522. Figure 12 This is a partially enlarged view of the mounting cover 522. The mounting cover 522 is generally annular and may include an annular groove body. The annular groove body includes an annular bottom surface 5221, an annular outer wall 5222, and an annular inner wall 5223. The annular outer wall 5222 and the annular inner wall 5223 can be connected to the inner and outer sides of the annular bottom surface 5221, respectively. The annular groove body is roughly an annular groove structure, and components such as the atomizing plate 20, the delivery pipe 330, and the tee fitting 523 can be housed within this annular groove structure. In this way, in the event of heat dissipation fluid leakage, the leaked heat dissipation fluid can be temporarily blocked by the annular outer wall 5222 and the annular inner wall 5223, so as to remain within the aforementioned annular groove structure and prevent it from overflowing and causing a short circuit fault in the robot joint 50.

[0120] The mounting cover 522 may also include a mounting cover connector 5224. The mounting cover connector 5224 may be connected to the inside of the annular groove body and is used to achieve relative fixation between the mounting cover 522 and other components (such as motors) of the robot joint 50.

[0121] The cover assembly 520 may also include a sealing gasket 524. The sealing gasket 524 may mate with the gasket receiving groove 501 to seal the heat dissipation medium transfer channel and prevent the heat dissipation medium from leaking out of the gasket receiving groove 501. The annular bottom surface 5221 of the annular groove body may have the gasket receiving groove 501 formed therein, which may be used to accommodate the atomizing plate 20 and the sealing gasket 524. As an example, the sealing gasket 524 may abut against the side of the atomizing plate 20 facing away from the bottom of the gasket receiving groove 501.

[0122] As an example, the gasket 524 may be composed of sealing materials such as silicone or rubber.

[0123] Figure 13This is a schematic diagram of the structure of a sealing gasket 524 provided in an embodiment of this application. The sealing gasket 524 may include a first connecting portion 5241, a second connecting portion 5242, a left connecting lug 5243, and a right connecting lug 5244. The first connecting portion 5241 and the second connecting portion 5242 can communicate with each other to form a transmission channel for the heat dissipation working fluid. The first connecting portion 5241 can be connected to a tee fitting 523, and the second connecting portion 5242 can be fixedly connected to a gasket receiving groove 501. The left connecting lug 5243 and the right connecting lug 5244 are located on both sides of the first connecting portion 5241, and both can be connected to the gasket receiving groove 501.

[0124] In one possible example, such as Figure 12 As shown, the gasket receiving groove 501 may include a left sub-receiving groove 5001, a right sub-receiving groove 5002, and a middle sub-receiving groove 5003. The middle sub-receiving groove 5003 may be located between the left sub-receiving groove 5001 and the right sub-receiving groove 5002. As an example, the middle sub-receiving groove 5003 may not be connected to either the left sub-receiving groove 5001 or the right sub-receiving groove 5002. For example, the bottom of the left sub-receiving groove 5001 and the bottom of the right sub-receiving groove 5002 may be higher than the top of the middle sub-receiving groove 5003. In this way, when the heat dissipation medium leaks, the heat dissipation medium needs to overflow the middle sub-receiving groove 5003 first before it can enter the left sub-receiving groove 5001 or the right sub-receiving groove 5002, which can play a buffering role to a certain extent.

[0125] When assembling the atomizing plate 20, sealing gasket 524, and gasket receiving groove 501, the left connecting lug 5243 and the right connecting lug 5244 of the gasket can be accommodated in the left sub-receiving groove 5001 and the right sub-receiving groove 5002, respectively. The atomizing plate 20 and the second connecting portion 5242 can both be accommodated in the middle sub-receiving groove 5003. The second connecting portion 5242 can be pressed onto the atomizing plate 20, or in other words, the atomizing plate 20 can be sandwiched between the end face of the second connecting portion 5242 and the bottom of the middle sub-receiving groove 5003. A misting hole 5004 can be formed at the bottom of the middle sub-receiving groove 5003. The hollow interior of the second connecting portion 5242 forms a transmission channel for the heat dissipation working fluid. Thus, the heat dissipation working fluid can enter the atomizing plate 20 after passing through the second connecting portion 5242, be converted into fine droplets by the atomizing plate 20, and then sprayed out from the misting hole 5004.

[0126] In one possible example, the projection of the mist outlet 5004 (or atomizing plate 20) onto the reference plane can be located on the outer side of the second housing 510. The reference plane can be the radial plane of the robot joint 50, or in other words, the reference plane can be perpendicular to the axial direction of the robot joint 50. In this way, when the heat dissipation working fluid is ejected from the mist outlet 5004, it is less likely to enter the interior of the second housing 510 of the robot joint 50, but can be sprayed onto the outer wall of the second housing 510 to achieve heat dissipation.

[0127] In one possible example, the outer wall of the second connecting portion 5242 of the sealing gasket 524 can be fitted with an annular sealing ring to seal the sealing gasket 524 and the gasket receiving groove 501. The sidewall of the annular sealing ring can be concave in the middle and convex on both sides. Alternatively, the sidewall of the annular sealing ring can include an annular groove. The inner wall of the central sub-receiving groove 5003 can be provided with an annular protrusion structure. When the second connecting portion 5242 of the sealing gasket 524 is inserted into the central sub-receiving groove 5003, the annular protrusion structure on the inner wall of the central sub-receiving groove 5003 can be embedded in the annular groove on the sidewall of the annular sealing ring. The second connecting portion 5242 can be fixedly connected to the central sub-receiving groove 5003, and the increased contact area between the two is beneficial to improving the sealing effect at the connection position.

[0128] Understandably, in some other examples, the outer wall of the second connecting portion 5242 of the sealing gasket 524 may be provided with an annular protrusion structure, and the inner wall of the central sub-receiving groove 5003 may be provided with an annular groove. The sealing gasket 524 and the central sub-receiving groove 5003 can also achieve a sealed connection through this structure.

[0129] The left connecting lug 5243 and the right connecting lug 5244 of the sealing gasket 524 can each be provided with a connecting hole. Correspondingly, the left sub-receiving groove 5001 and the right sub-receiving groove 5002 of the gasket receiving groove 501 can each be provided with a connecting hole. When the sealing gasket 524 is housed in the gasket receiving groove 501, the connecting hole of the left connecting lug 5243 can be aligned and connected with the connecting hole of the left sub-receiving groove 5001, and the connecting hole of the right connecting lug 5244 can be aligned and connected with the connecting hole of the right sub-receiving groove 5002. With the help of screws and other fasteners, the sealing gasket 524 and the mounting cover 522 can be fixedly connected.

[0130] In one possible example, the outer wall of the second connecting portion 5242 may also be provided with an annular sealing portion, the structure of which is similar to that of the annular sealing ring described above. In other words, the second connecting portion 5242 and the annular sealing ring may be an integrally formed structure, or the annular sealing ring may be part of the sealing gasket 524.

[0131] The first connecting portion 5241 of the sealing gasket 524 can be connected to the tee fitting 523. Figure 14 The diagram shows a structural schematic of a tee fitting 523 provided in an embodiment of this application. The tee fitting 523 may include a first port 5231, a second port 5232, and a branch port 5233, all three being internally interconnected. The first port 5231 can be connected to one section of the conveying pipe 330, and the second port 5232 can be connected to another section of the conveying pipe 330. The heat dissipation medium can be transferred between the first port 5231 and the second port 5232. The branch port 5233 can be connected to the first connecting portion 5241 of the sealing gasket 524. In one possible example, the opening size of the end of the branch port connected to the first connecting portion 5241 can be larger than the outer diameter of the first connecting portion 5241. Thus, the branch port 5233 can be fitted over the outside of the first connecting portion 5241, and the branch port 5233 can be connected to the sealing gasket 524. It is understandable that the opening size of the end of the branch pipe 5233 that connects to the first connecting part 5241 can also be slightly smaller than the outer diameter of the first connecting part 5241, so that the two can be interference-fitted and improve the sealing effect of the joint between them.

[0132] The tee fitting 523 may also include a left connecting lug 5234 and a right connecting lug 5235, which can be connected to both sides of the branch port 5233 respectively. The left connecting lug 5234 and the right connecting lug 5235 may each have connecting holes. When the tee fitting 523 is assembled with the gasket 524, the connecting hole of the left connecting lug 5234 can be aligned and connected with the connecting hole of the left connecting lug 5243 of the gasket, and the connecting hole of the right connecting lug 5235 can be aligned and connected with the connecting hole of the right connecting lug 5244 of the gasket. With the help of screws and other fasteners, a fixed connection between the tee fitting 523 and the gasket 524 can be achieved.

[0133] When the tee fitting 523, sealing gasket 524 and gasket receiving groove 501 are assembled, the connecting holes of the left connecting lug 5234 of the tee, the connecting holes of the left connecting lug 5243 of the gasket and the connecting holes of the left sub-receiving groove 5001 can be aligned and connected, and the connecting holes of the right connecting lug 5235 of the tee, the connecting holes of the right connecting lug 5244 of the gasket and the connecting holes of the right sub-receiving groove 5002 can be aligned and connected. With the help of screws and other fasteners, the tee fitting 523, sealing gasket 524 and mounting cover 522 can be fixedly connected.

[0134] Figure 15This is a schematic diagram of a top cover 521 provided in an embodiment of this application. The left side shows the side of the top cover 521 facing away from the mounting cover 522, and the right side shows the side of the top cover 521 facing the mounting cover 522. The top cover 521 may be provided with one or more heat dissipation portions 5210, through which heat from inside the robot joint 50 can be dissipated into the environment. This application does not limit the shape, structure, size, or number of heat dissipation portions 5210. For example, compared to other parts of the top cover 521, the heat dissipation portion 5210 may have a higher thermal conductivity, which is more conducive to heat exchange.

[0135] To improve the heat dissipation efficiency of robot joints, the outer surface of the robot joint shell can include multi-level micro / nano structures. For example, the outer wall of the first shell 310 of the robot joint 30 mentioned above can include multi-level micro / nano structures, and the outer wall of the second shell 510 of the robot joint 50 can also include multi-level micro / nano structures. Multi-level micro / nano structures have a hierarchical scale characteristic, and can include microstructures of two or more spatial scales, the size of which can be nanometer-scale or micrometer-scale. For example, a multi-level micro / nano structure can be a two-level structure of "micrometer-scale protrusions + nanometer-scale fibers". Alternatively, a multi-level micro / nano structure can be a three-level structure of "millimeter-scale arrays + micrometer-scale pores + nanometer-scale walls". This application does not impose any limitations on this. Figure 16 In this case, the outer surface of the housing (such as the first housing 310 or the second housing 510) may include heat dissipation fins with multi-level micro-nano structures, which is only one example.

[0136] In one possible example, multi-level micro / nano structures can be fabricated using one or more techniques such as micro / nano lithography, micro / nano machining, micro-plastic forming, and 3D printing. Placing multi-level micro / nano structures on the shell of a robot joint can increase the contact area between the shell and the air, improving heat dissipation efficiency. This structure can be combined with the atomizing plate heat dissipation method mentioned above to significantly enhance the heat dissipation effect.

[0137] The outer surface of the robot joint's housing can be coated with a heat-dissipating coating. This heat-dissipating coating may include a non-metallic base coating, such as a graphene coating; a ceramic base coating, such as an aluminum nitride coating; or a composite coating, such as a silicon carbide-epoxy resin composite coating. This application does not impose any limitations on this. For example, the outer wall of the first housing 310 of the robot joint 30 mentioned above may be provided with a multi-layered micro / nano structure, and the outer layer of the micro / nano structure may be coated with a graphene coating. As another example, the outer wall of the second housing 510 of the robot joint 50 may be provided with a multi-layered micro / nano structure, and the outer layer of the micro / nano structure may be coated with an aluminum nitride coating.

[0138] Figure 17The diagram illustrates the heat dissipation principle of the robot joint provided in this embodiment. The heat dissipation medium can be transported to the atomizing plate via a delivery pipe. When the atomizing plate is powered, it converts electrical energy into mechanical energy, generating vibrations that transform the heat dissipation medium into a large number of droplets. These droplets can be ejected from one end of the atomizing plate and adhere to the robot joint's shell. The heat generated by the robot joint can be conducted to its shell, and the droplets adhering to the shell can evaporate upon heating, carrying away heat and thus achieving cooling.

[0139] Based on the robot joint provided in this application, such as Figure 18 As shown in the illustration, this application also provides a heat dissipation method for a robot joint. This heat dissipation method involves a processing module, a detection module, and a heat dissipation module for the robot joint. These functional modules can be implemented in hardware, software, or a combination of both; this application does not impose any limitations on this. These functional modules can cooperate to enable or disable the heat dissipation function of the robot joint.

[0140] S101, the detection module detects the temperature and / or working status of the robot joints.

[0141] The temperature of a robot joint can refer to the temperature near the end of the motor stator or motor windings, the temperature near the motor housing, or the temperature near the reducer housing or bearing housing. This is usually related to the location where the detection module is installed.

[0142] For example, a robot joint may include a temperature sensor to detect the temperature of the joint, which can serve as an example of a detection module. This temperature sensor can be mounted near the joint's motor to detect motor heat generation. Alternatively, the temperature sensor can be mounted near the joint's reducer to detect reducer heat generation.

[0143] The operational status of a robot joint can refer to whether the robot joint is in operation, or to the intensity of the workload on the robot joint. The operational status of a robot joint can include the operational status of multiple components contained within the robot joint.

[0144] For example, a robot joint may include a motor phase current sensor, which can be used to detect the actual current flowing through the motor windings and / or copper losses, thereby determining the motor's torque and / or heat generation. A larger actual current flowing through the motor windings and greater copper losses indicate greater heat generation from the robot joint's motor. In one possible example, the motor phase current sensor may include a shunt resistor and an operational amplifier; it may also include a Hall current sensor. This application does not limit this application.

[0145] For example, a detection module can determine the working state of a robot joint by detecting one or more of its position, velocity, and acceleration. Understandably, the greater the velocity and acceleration of the robot joint, the more intense the relative motion between the components inside the joint, and the more pronounced the heat generation may be. In one possible example, the robot joint may include incremental encoders and / or absolute encoders mounted on the motor ends; these can serve as another example of a detection module and can be used to detect the robot joint's position, velocity, acceleration, etc.

[0146] S102, the detection module sends the first indication information, and the processing module receives the first indication information accordingly.

[0147] The processing module can have information processing capabilities. For example, the processing module may include a microcontroller unit.

[0148] The detection module and the processing module can be connected by wireless and / or wired communication links, through which the detection module can send the aforementioned first indication information.

[0149] In some examples, the initial indication information may include the temperature and / or operating status of the robot joint.

[0150] For example, the first indication information may include the temperature of the robot joint, T1°C. For example, the first indication information may be used to indicate whether the robot joint is in an operating state or a stopped state. For example, the first indication information may be used to indicate the load intensity of the robot joint, such as the load intensity level (high, medium, low) or relative intensity (10%, 20%, 80%, etc.).

[0151] In some examples, the detection module may periodically send a first indication message to the processing module. In other examples, the detection module may send a first indication message to the processing module in response to an interrupt event. In still other examples, the processing module may send a request message to the detection module, which can be used to request the acquisition of the first indication message. In response to this request message, the detection module may send the first indication message to the processing module.

[0152] S103, the processing module determines whether to enable or disable the heat dissipation function.

[0153] The processing module can determine whether to turn the heat dissipation function on or off based on the first indication information.

[0154] For example, the processing module can determine whether to enable or disable the cooling function based on the relationship between the robot joint temperature T1 and the temperature threshold Th. Specifically, when T1 is greater than or equal to Th, the processing module can determine to enable (not disable) the cooling function; when T1 is less than Th, the processing module can determine to disable (not enable) the cooling function. It can be understood that if T1 is greater than or equal to Th, and the cooling function is already enabled, the processing module can determine not to disable the cooling function or to keep the cooling function enabled; if the cooling function is not enabled, the processing module can determine to enable the cooling function. If T1 is less than Th, and the cooling function is disabled, the processing module can determine not to enable the cooling function or to keep the cooling function disabled; if the cooling function is enabled, the processing module can determine to disable the cooling function.

[0155] For example, the processing module can determine to activate the cooling function based on whether the robot joint is in operation; the processing module can determine to deactivate the cooling function based on whether the robot joint is in a stopped or stationary state.

[0156] For example, the processing module can determine whether to enable or disable the cooling function based on the load intensity level or the relationship between the relative intensity and a load intensity threshold of the robot joint. In one possible example, the load intensity threshold can be medium. When the load intensity level is medium or high, the processing module can determine to enable the cooling function; when the load intensity level is low, the processing module can determine to disable the cooling function. In another possible example, the load intensity threshold can be 60%. When the relative intensity of the load is greater than or equal to 60%, the processing module can determine to enable the cooling function; when the relative intensity of the load is less than 60%, the processing module can determine to disable the cooling function.

[0157] S104, the processing module sends the second instruction information, and the heat dissipation module receives the second instruction information accordingly.

[0158] The second instruction can be used to indicate whether the cooling function is turned on or off.

[0159] In one possible example, the atomizing plate and the delivery pipe can remain connected, and the heat dissipation medium can be continuously supplied. In this case, the second indication information can be used to indicate power supply to the atomizing plate to activate the heat dissipation function, or the second indication information can be used to indicate stopping power supply to the atomizing plate to deactivate the heat dissipation function.

[0160] In one possible example, the atomizing plate can remain powered on and vibrate continuously. In this case, the second indication information can be used to instruct the opening of the pipe valve for supplying heat dissipation medium to the atomizing plate to activate the heat dissipation function, or the second indication information can be used to instruct the closing of the pipe valve for supplying heat dissipation medium to the atomizing plate to deactivate the heat dissipation function.

[0161] In one possible example, the second instruction information can be used to instruct the atomizing plate to be powered and the pipe valve to be opened to activate the heat dissipation function, or the second instruction information can be used to instruct the atomizing plate to be powered off and the pipe valve to be closed to deactivate the heat dissipation function.

[0162] S105, the heat dissipation module starts or stops dissipating heat.

[0163] The heat dissipation module may include an atomizing plate, delivery pipes, a working fluid supply device, and a power supply device for the atomizing plate. The heat dissipation module can control these components according to the second instruction information, thereby starting or stopping heat dissipation.

[0164] It should be noted that the heat dissipation module mentioned here is not the same as or equivalent to the heat dissipation module included in robot joint 30 or robot joint 50 mentioned earlier. The heat dissipation module here can be understood as any collection of software and hardware related to heat dissipation in the robot joint.

[0165] For example, the second indication information can be used to indicate power supply to the atomizing plate. In response to the second indication information, the heat dissipation module can supply power to the atomizing plate and begin heat dissipation. Alternatively, the second indication information can be used to indicate stopping power supply to the atomizing plate. In response to the second indication information, the heat dissipation module can stop supplying power to the atomizing plate and stop heat dissipation.

[0166] For example, the second indication information can be used to instruct the opening of the pipe valve for supplying heat dissipation medium to the atomizing plate. In response to the second indication information, the heat dissipation module can open the pipe valve and begin heat dissipation. Alternatively, the second indication information can be used to instruct the closing of the pipe valve for supplying heat dissipation medium to the atomizing plate. In response to the second indication information, the heat dissipation module can close the pipe valve and stop heat dissipation.

[0167] For example, the second indication information can be used to instruct the atomizing plate to be powered and the pipeline valve to be opened. In response to the second indication information, the heat dissipation module can power the atomizing plate and open the pipeline valve, and the heat dissipation module begins to dissipate heat. Alternatively, in response to the second indication information, the heat dissipation module can stop powering the atomizing plate and close the pipeline valve, and the heat dissipation module stops dissipating heat.

[0168] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. "Above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0169] It should be noted that the components in the various embodiments of this application are interchangeable, as long as they can perform their corresponding functions. The components in the various embodiments of this application can be combined. For example, robot joint 30 and robot joint 50 can be combined to form a new robot joint with active heat dissipation. Atomizing plates can be provided at the ends of such robot joints and on the outer periphery of the housing.

[0170] The following points need to be explained: (1) Unless otherwise defined, the same reference numerals in the embodiments and drawings of this application have the same meaning.

[0171] (2) The accompanying drawings of the embodiments of this application only involve the structures associated with the embodiments of this application. Other structures can be referred to the general design.

[0172] (3) For clarity, components or areas are enlarged in the drawings used to describe embodiments of this application. It will be understood that when an element is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element, or there may be an intermediate element.

[0173] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A robot joint capable of active heat dissipation, comprising at least a cover assembly, a housing, and a motor body, wherein the cover assembly and the housing form a receiving space, and the motor body is housed within the receiving space, characterized in that, The robot joint also includes: One or more atomizing plates (20) are located inside the cover assembly and / or outside the housing, and are configured to vibrate when powered to convert the heat dissipation medium into droplets and spray them out onto the outer wall of the housing; A delivery pipe is used to deliver the heat dissipation working fluid to the atomizing plate (20).

2. The robot joint according to claim 1, characterized in that, The average diameter of the droplets is between 1 micrometer and 50 micrometers, or between 0.1 micrometers and 1 micrometer, or between 1 nanometer and 100 nanometers.

3. The robot joint according to claim 2, characterized in that, The atomizing sheet (20) comprises a piezoelectric ceramic substrate and has a vibration frequency between 10 kHz and 1000 kHz.

4. The robot joint according to claim 3, characterized in that, The atomizing plate (20) is located between the upper cover (521) and the mounting cover (522) of the cover assembly (520). The annular groove body of the mounting cover (522) includes a gasket receiving groove (501). The atomizing plate (20) is received in the gasket receiving groove (501) and communicates with the mist outlet (5004) of the gasket receiving groove (501). The robot joint also includes a sealing gasket (524), which is at least partially housed in the gasket receiving groove (501) and abuts against the side of the atomizing sheet (20) opposite to the bottom of the gasket receiving groove (501).

5. The robot joint according to claim 4, characterized in that, The bottom of the gasket receiving groove (501) is recessed to form a central sub-receiving groove (5003). The second connecting portion (5242) of the sealing gasket (524) is at least partially inserted into the central sub-receiving groove (5003) and is sealed to the central sub-receiving groove (5003). The atomizing plate (20) is sandwiched between the end face of the second connecting portion (5242) and the bottom of the central sub-receiving groove (5003). The sealing gasket (524) further includes a first connecting portion (5241), one end of which is connected to the second connecting portion (5242), and the other end is connected to the tee fitting (523) of the robot joint.

6. The robot joint according to claim 3, characterized in that, The robot joint also includes a mounting base (410) and a sealing cover (420). The mounting base (410) is fixedly connected to the outside of the housing. The mounting base (410) includes a mist outlet facing the housing. The atomizing plate (20) is sandwiched between the mounting base (410) and the sealing cover (420) and communicates with the mist outlet.

7. The robot joint according to claim 6, characterized in that, The mounting base (410) includes an atomizing plate receiving groove (401), the bottom of the atomizing plate receiving groove (401) is provided with the mist outlet hole, the atomizing plate (20) is received in the atomizing plate receiving groove (401), and the atomizing plate pressing part (427) of the sealing cover (420) abuts against the side of the atomizing plate (20) away from the mist outlet hole.

8. The robot joint according to any one of claims 1 to 7, characterized in that, The outer wall of the shell includes a multi-level micro / nano structure.

9. The robot joint according to claim 8, wherein the outer layer of the multi-layer micro / nano structure is provided with a heat dissipation coating.

10. A heat dissipation method for an actively heat-dissipating robot joint, characterized in that, The robot joint applied to any one of claims 1 to 9, the robot joint comprising a detection module, a processing module, and a heat dissipation module, the heat dissipation method comprising: The detection module detects the temperature and / or working status of the robot joint; The detection module sends a first indication message, and the processing module receives the first indication message accordingly. The first indication message is used to indicate the temperature and / or the working status. The processing module determines whether to activate or deactivate the heat dissipation function based on the first indication information; The processing module sends a second instruction message, and the heat dissipation module receives the second instruction message accordingly. The second instruction message is used to indicate whether the heat dissipation function is started or stopped. The heat dissipation module starts or stops dissipating heat.

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