Punching Die and Method for Punching Electrode Plates

Abstract

This disclosure relates to a punching die and a method for punching an electrode plate. The punching die includes: a lower plate; an upper plate disposed above the lower plate; a die; a die plate disposed on the lower plate and supporting the die; a punch plate between the upper plate and the die plate; a punch pusher between the upper plate and the die plate; a punch below the punch plate and the punch pusher and above the die plate; and a guide post connected to the die plate and the punch, wherein the die includes an opening, wherein the punch is coupled to the punch plate, wherein the punch includes a first region configured to be inserted into the opening and a second region disposed outside the opening, and wherein the guide post is configured to guide movement of the punch.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2025-0019171, filed on February 14, 2025, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to a punching die and a method for punching electrode plates. Background Technology

[0004] Unlike primary batteries, which are not designed for recharging, secondary (also known as rechargeable) batteries are designed to be discharged and recharged. Low-capacity secondary batteries are widely used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for driving motors in hybrid and electric vehicles, as well as for storing electricity (e.g., household and / or utility-scale power storage). A secondary battery typically includes an electrode assembly containing positive and negative electrodes, a housing that houses the electrode assembly, and electrode terminals connected to the electrode assembly.

[0005] This background section is intended for a general understanding of the background of this disclosure, and therefore may contain information that does not constitute related (or prior art). Summary of the Invention

[0006] Embodiments of this disclosure provide a punching die with improved clearance.

[0007] Embodiments of this disclosure provide a method for punching electrode plates, which enables the manufacture of secondary batteries with improved safety.

[0008] Embodiments of this disclosure provide a punching die, the punching die comprising: a lower plate; an upper plate on the lower plate; a die plate disposed on the lower plate and supporting the die; a punch plate, a punch pusher, and a punch between the upper plate and the die plate; and a guide post connected to the die plate and the punch, the die including an opening, the punch being coupled to the punch plate, the punch including a first region inserted into the opening and a second region disposed outside the opening, and the guide post guiding the movement of the punch.

[0009] Embodiments of this disclosure provide a punching die comprising: a lower plate; an upper plate disposed above the lower plate; a die; a die plate disposed on the lower plate and supporting the die; a punch plate between the upper plate and the die plate; a punch pusher between the upper plate and the die plate; a punch below the punch plate and the punch pusher and above the die plate; and a guide post connected to the die plate and the punch, wherein the die includes an opening, wherein the punch is coupled to the punch plate, wherein the punch includes a first region configured to be inserted into the opening and a second region disposed outside the opening, and wherein the guide post is configured to guide movement of the punch.

[0010] In some embodiments, the guide post includes 1 to 4 posts disposed in a punch.

[0011] In some embodiments, the number of guide posts disposed in one punch is 1 to 4.

[0012] In some embodiments, the punching die further includes: a stripper disposed between the lower plate and the upper plate; a main column connected to the lower plate and the upper plate; and an inner column connected to the stripper and the die plate.

[0013] In some embodiments, the punch pusher is connected to the punch plate and the upper plate.

[0014] In some embodiments, when the upper plate moves downward, the punch pusher moves downward, and the punch plate and the punch move downward by the movement of the punch pusher.

[0015] In some embodiments, as the upper plate moves downward, the punch pusher is configured to move downward, and the punch plate and the punch move downward via the punch pusher.

[0016] In some embodiments, the movement of the upper plate is guided by the main column.

[0017] In some embodiments, the main column is configured to guide the movement of the upper plate.

[0018] In some embodiments, the peeler moves downward, and the movement of the upper plate is guided by the main column.

[0019] In some embodiments, the inner column is configured to guide the movement of the peeler.

[0020] In some embodiments, the second region overlaps with a portion of the electrode plate on the mold.

[0021] In some embodiments, the second region is configured to overlap with a portion of the electrode plate to be placed on the mold.

[0022] In some embodiments, the punching die further includes an elastic member coupled to the guide post.

[0023] Embodiments of this disclosure provide a method for punching an electrode plate, the method comprising: placing the electrode plate on a mold including an opening; moving a punch; and cutting the electrode plate by the punch, the punch being moved by a movement of an upper plate, the upper plate and the punch being guided by different posts.

[0024] Embodiments of this disclosure provide a method for punching an electrode plate using a punching die, the method comprising: placing the electrode plate on a die, the die including an opening; moving a punch; and cutting the electrode plate by the punch, wherein the punch is driven by a movement of an upper plate, and wherein the movement of the upper plate and the movement of the punch are guided by different posts.

[0025] In some embodiments, a lower plate is disposed below the upper plate, the mold is supported by a mold plate, the upper plate is guided by a main column, the punch is guided by a guide column, the main column is connected to the lower plate and the upper plate, and the guide column is connected to the mold plate and the punch.

[0026] In some embodiments, a lower plate is disposed below the upper plate, wherein the mold is supported by a mold plate disposed on the lower plate, wherein the upper plate is guided by a main post connected to the lower plate and the upper plate, and wherein the punch is guided by a guide post connected to the mold plate and the punch.

[0027] In some embodiments, the electrode plate includes a cut area that overlaps with the opening.

[0028] In some embodiments, the punch moves downward from the first position.

[0029] In some embodiments, the punch moves within the opening.

[0030] In some embodiments, a portion of the punch moves into the opening.

[0031] In some embodiments, the punch includes a first region located in the opening and a second region located outside the opening, and the first region moves within the opening.

[0032] In some embodiments, the punch includes a first region positioned to be inserted into the opening and a second region located outside the opening.

[0033] In some embodiments, the second region overlaps with the cutting region.

[0034] In some embodiments, the punch moves from the first position to a second position located below the first position, and the cutting area is cut while the second region and the cutting area come into contact through the movement of the punch.

[0035] In some embodiments, the punch moves to a second position, and the cutting area is cut when the second region and the cutting area come into contact by the movement of the punch.

[0036] In some embodiments, when the punch is in the second position, the distance between one end of the punch and the mold is about 0 μm to about 2 μm.

[0037] In some embodiments, when the punch is in the second position, the distance between the end of the punch closest to the mold and the mold is about 0 μm to about 2 μm.

[0038] In some embodiments, the resilient member is coupled to a guide post for guiding the punch, the punch not contacting the resilient member at a first position, and the punch contacting the resilient member at a second position.

[0039] In some embodiments, the punch moves from the second position to the first position via the elastic member.

[0040] In some embodiments, the punch moves from the second position to the first position via the restoring force of the elastic member. Attached Figure Description

[0041] The accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be construed as limited to the drawings.

[0042] Figure 1 This is a side view showing a punching die according to an embodiment of the present disclosure.

[0043] Figure 2 This is a side view showing a punching die according to an embodiment of the present disclosure.

[0044] Figure 3 This is a top view of a punching die according to an embodiment of the present disclosure.

[0045] Figure 4 It is according to the embodiments of this disclosure along Figure 3 A cross-sectional view taken from section A-A'.

[0046] Figure 5 It is according to the embodiments of this disclosure along Figure 3 A cross-sectional view taken from section A-A'.

[0047] Figure 6 A secondary battery manufactured using a punching die according to an embodiment of the present disclosure is shown.

[0048] Figure 7 A secondary battery manufactured using a punching die according to an embodiment of the present disclosure is shown.

[0049] Figure 8 A secondary battery manufactured using a punching die according to an embodiment of the present disclosure is shown.

[0050] Figure 9 This is a perspective view showing a battery module including a secondary battery according to an embodiment of the present disclosure.

[0051] Figure 10 This is a perspective view showing a battery pack including a battery module according to an embodiment of the present disclosure.

[0052] Figure 11 This is a perspective view showing a vehicle including a battery pack according to an embodiment of the present disclosure.

[0053] Figure 12 This is a side view of a vehicle including a battery pack according to an embodiment of the present disclosure. Detailed Implementation

[0054] Embodiments of this disclosure are described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as having a general or dictionary meaning, but should be interpreted in a way consistent with the technical spirit of this disclosure, based on the principle that the inventor is capable of being his / her own lexicographer to appropriately define the concepts of the terms and to best describe his / her invention.

[0055] The embodiments described in this specification and the configurations shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical spirit, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications that can replace or modify the embodiments described herein may exist at the time of filing this application.

[0056] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "linked to" another element or layer, it can be directly on, directly connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected" to a second element, the first element can be directly linked to or connected to the second element, or the first element can be indirectly linked to or connected to the second element via one or more intermediary elements.

[0057] In the figures, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals denote the same elements. As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” Expressions such as “at least one of…” and “any one of…” modify the entire list of elements when following it, and not individual elements within that list. When phrases such as “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one selected from the group of A, B, and C,” or “at least one selected from A, B, and C” are used to refer to a list of elements A, B, and C, the phrase may refer to any one of A, B, and C and all suitable combinations or subsets of them, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the term “use” may be considered synonymous with the term “utilize.” As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms and not as terms of degree, and are intended to describe the inherent variations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art.

[0058] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment.

[0059] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” are used herein to describe the relationship between one element or feature illustrated in the figure and another element or feature. It will be understood that spatial relative terms are intended to cover different orientations of the device in use or operation other than the orientation depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “under” other elements or features will then be oriented as “above” or “above” other elements or features. Therefore, the term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0060] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, the singular form “a” is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including” as used in this specification specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0061] Furthermore, any numerical range disclosed and / or described herein is intended to include all subranges with the same numerical precision contained within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between the described minimum value of 1.0 and the described maximum value of 10.0 (and including both the described minimum value of 1.0 and the described maximum value of 10.0), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described herein is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification, including the claims, to explicitly describe any subranges contained within the range explicitly described herein. All such ranges are intended to be inherently described in this specification such that modifications made to explicitly describe any such subranges will comply with the applicable requirements.

[0062] Referring to two compared elements, features, etc., as “identical” can mean that they are “substantially identical.” Therefore, the phrase “substantially identical” can include cases where the deviation is considered low in the art (e.g., 5% or less). Additionally, when a parameter is said to be consistent in a given region, it can mean that it is consistent in terms of average value.

[0063] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0064] Arranging any element "above (or below)" or "above (below)" another element can mean that the arbitrary element can be configured to contact the upper (or lower) surface of the element, and the other element can also be located between the element and the arbitrary element disposed on (or below) the element.

[0065] Additionally, it will be understood that when a component is referred to as “connected,” “linked,” or “attached” to another component, these components can be directly “connected,” “linked,” or “attached” to each other, or another component can be “between” these components.

[0066] Throughout this specification, unless otherwise stated, the phrase "A and / or B" means A, B, or A and B. That is, "and / or" includes any one or all of the listed items. Unless otherwise stated, the phrase "C to D" means C and below D.

[0067] As used in this article, the vertical direction of the punching die refers to the thickness direction of the upper and lower plates.

[0068] refer to Figures 1 to 5 Description of punching die 10.

[0069] refer to Figures 1 to 5 The punching die 10 may include a lower plate 110, an upper plate 120, a main column 200, an inner column 300, a die plate 410, a die 420, a punch plate 510, a punch 520, a punch pusher 530, a stripper 600, and a guide column 700.

[0070] The lower plate 110 and the upper plate 120 can form the shape of the punching die. The lower plate 110 is disposed at the bottom of the punching die. The lower plate 110 can support the die plate 410 and the die 420. The lower plate 110 can be formed into a flat plate geometry with a predetermined thickness.

[0071] The upper plate 120 is disposed on the upper part of the punching die. The die plate 410, the die 420, the punch plate 510, the punch 520, the punch pusher 530, and the stripper 600 can be disposed between the lower plate 110 and the upper plate 120. The upper plate 120 can be formed into a flat plate geometry with a predetermined thickness.

[0072] The main post 200 is inserted into the lower plate 110 and the upper plate 120. The lower plate 110 and the upper plate 120 each include a hole. The holes in the lower plate 110 and the upper plate 120 can overlap in the vertical direction of the punching die 10. The vertical direction can be the thickness direction of the lower plate 110 and the upper plate 120.

[0073] The main post 200 is inserted into the holes in the lower plate 110 and the upper plate 120 and connected to the holes in the lower plate 110 and the upper plate 120. Accordingly, the lower plate 110 and the upper plate 120 can be connected via the main post 200.

[0074] The main column 200 may include multiple columns. For example, the main column 200 may be located at each corner of the lower plate 110 and the upper plate 120. For example, the main column 200 may include four columns.

[0075] Mold plate 410 and mold 420 are mounted on lower plate 110. Mold plate 410 can be supported by lower plate 110. Mold 420 can be supported by mold plate 410.

[0076] An electrode plate (not shown) is mounted on the die 420. The electrode plate can be cut into the desired geometry by a punch 520.

[0077] Mold 420 includes an opening.

[0078] Punch plate 510, punch 520 and punch pusher 530 can be disposed on mold plate 410 and mold 420. Punch plate 510, punch 520 and punch pusher 530 can be disposed between upper plate 120 and mold plate 410.

[0079] The punch plate 510 and the punch 520 are connected. The punch plate 510 and the punch pusher 530 are connected or linked. The punch pusher 530 is connected or linked to the upper plate 120.

[0080] The punch 520 moves vertically via the punch plate 510 and the punch pusher 530. The punch plate 510 receives a force in one direction via the punch pusher 530. The punch plate 510 moves in one direction due to this force. Accordingly, the punch 520, which is connected to the punch plate 510, moves in one direction.

[0081] The punch 520 can have various geometries.

[0082] The punch 520 can be inserted into the opening of the mold 420 through the punch pusher 530.

[0083] A stripper 600 is mounted on a die 420. The stripper 600 is movable. The stripper 600 can move vertically. The stripper 600 can hold the electrode plate in place. The stripper 600 can move downwards to contact the electrode plate. Subsequently, the electrode plate is cut by a punch 520. Accordingly, the waste generated during the cutting of the electrode plate can be minimized.

[0084] The inner column 300 is inserted into the die plate 410 and the stripper 600. Each of the die plate 410 and the stripper 600 includes a hole. The holes in the die plate 410 and the stripper 600 may overlap in the vertical direction of the punching die 10.

[0085] The inner column 300 is inserted into and connected to the holes in the mold plate 410 and the peeler 600. Accordingly, the mold plate 410 and the peeler 600 can be connected to each other through the inner column 300.

[0086] The movement of the peeler 600 can be guided by the inner column 300.

[0087] The inner pillar 300 may include multiple pillars. For example, the inner pillars 300 may be respectively located at the corners of the mold plate 410 and the peeler 600. For example, the inner pillar 300 may include four pillars.

[0088] The guide post 700 is inserted into the die plate 410 and the punch 520. Each of the die plate 410 and the punch 520 includes a hole. The holes in the die plate 410 and the punch 520 may overlap in the vertical direction of the punching die 10.

[0089] The guide post 700 is inserted into the holes of the mold plate 410 and the punch 520 and is connected to the holes of the mold plate 410 and the punch 520. Accordingly, the mold plate 410 and the punch 520 can be connected to each other via the guide post 700.

[0090] The movement of the punch 520 can be guided by the guide post 700.

[0091] refer to Figure 1 and Figure 2 The electrode plate is cut by moving the punch 520. Figure 1 This is a view of the punch 520 in the first position, and Figure 2 This is a view of punch 520 in the second position.

[0092] refer to Figure 1 and Figure 2 The punch 520 moves vertically. The punch pusher 530 moves downward. The upper plate 120 moves downward, and the punch pusher 530 connected to the upper plate 120 also moves downward. The movement of the upper plate 120 can be guided by the main column 200.

[0093] The punch pusher 530 is movable and can contact the punch plate 510. The punch pusher 530 can then transmit force to the punch plate 510. The punch plate 510 can then move downwards by this force. Accordingly, the punch 520, connected to the punch plate 510, moves downwards.

[0094] The electrode plate CP on the mold 420 and the punch 520 can contact each other. Accordingly, the electrode plate CP can be cut into a geometry set by the punch 520.

[0095] The electrode plate CP can be cut into various geometries depending on the position of the punch 520. For example, a gap G can be formed between one end of the punch 520 and one end of the die 420. The gap G can be the distance between the end of the punch 520 closest to the die 420 and the die 420 when the punch 520 is in the second position. The gap G should be maintained between about 0 μm and about 2 μm to accurately cut the electrode plate CP. When the gap G is about 0 μm, one end of the punch 520 and one end of the die 420 are in contact with each other. The clearance of the punching die 10 is defined as the size of the gap G. When the size of the gap G exceeds about 2 μm, the electrode plate CP is cut to a size different from the desired size. Therefore, the safety of the secondary battery manufactured using the electrode plate CP may be reduced. For example, in the secondary battery, a short circuit may occur between the positive and negative electrodes due to the reduced cutting accuracy of the electrode plate CP.

[0096] Typically, the punch is connected to the upper plate. Accordingly, the punch moves with the movement of the upper plate. Since the movement of the upper plate is guided by the main post, the main post may wear down due to the repeated movement of the upper plate. Consequently, the upper plate may become misaligned. As a result, the punch, which moves with the movement of the upper plate, may become misaligned.

[0097] The clearance of the punching die may be altered, and the size of the gap may increase. Consequently, the cutting accuracy of the electrode plate may decrease.

[0098] On the other hand, the punching die 10 includes a punch 520 connected to the punch plate 510. The punch 520 is inserted into an opening OP, which is a hole formed in the die 420. While inserted into the opening OP of the die 420, the punch 520 moves downward by a force applied from the punch pusher 530. Therefore, the alignment of the punch 520 is not affected by the wear of the main post 200, thereby improving the clearance of the punching die 10. That is, the size of the clearance G can be maintained from approximately 0 μm to approximately 2 μm.

[0099] The punch 520 is guided by the guide post 700. Accordingly, the punch 520 can move vertically at a predetermined position.

[0100] refer to Figure 3 and Figure 4 The mold 420 includes an opening OP. A punch 520 is inserted into the opening OP. The punch 520 can be inserted into the opening OP at a first position. The first position is the position of the punch 520 before it moves.

[0101] The punch 520 may include a first region 1A and a second region 2A. The first region 1A and the second region 2A may be formed as a single piece.

[0102] The first region 1A can be inserted into the opening OP. The guide post 700 can be connected to the first region 1A and the mold plate 410. The second region 2A can be located outside the opening OP. The second region 2B can overlap with a portion of the electrode plate CP in the vertical direction. The area where the electrode plate CP overlaps with the second region 2A can be the area cut by the punch 520.

[0103] The guide post 700 can be set in the opening OP. The guide post 700 can be connected to the first area 1A and the mold plate 410 in the opening OP.

[0104] The guide post 700 may include at least one post. For example, the guide post 700 may include 1 to 4 posts. 1 to 4 guide posts may be provided in a punch. The number of guide posts 700 can be determined by taking into account the movement of the punch 520 and the size of the opening OP.

[0105] The elastic member 750 may be disposed on or attached to the guide post 700. The elastic member 750 may surround the outer peripheral surface of the guide post 700. For example, the elastic member 750 may include a spring.

[0106] The punch 520 may not contact the elastic member 750 at the first position.

[0107] refer to Figure 3 and Figure 5 The force can be transmitted to the punch 520. This force can be transmitted to the punch plate 510 via the punch pusher 530. Accordingly, the punch 520 can move downward.

[0108] The stripper 600 can move first before the punch 520 moves. The stripper 600 can move downward to contact the electrode plate CP. Accordingly, the electrode plate CP can be fixed by the stripper 600.

[0109] The first region 1A can be moved downward by force. The first region 1A can be guided by the guide post 700.

[0110] The first region 1A can contact the elastic member 750. The elastic member 750 can be compressed while the first region 1A moves downward. When the punch 520 moves downward, the first region 1A can avoid contact with the die plate 410 due to the presence of the elastic member 750. Therefore, damage to the punch 520 or the die plate 410 can be prevented.

[0111] The second region 2A can be moved downwards by force. The second region 2A can move together with the first region 1A. The second region 2A can come into contact with the electrode plate CP. Accordingly, a portion of the electrode plate CP can be cut by the punch 520. After cutting the electrode plate CP, the second region 2A can be positioned outside the opening OP or inserted into the opening OP, depending on the magnitude of the force.

[0112] Accordingly, the punch 520 can move from the first position to the second position. After the cutting of the electrode plate CP is completed, the punch 520 can move back to the first position by the restoring force of the elastic member 750.

[0113] The punch 520 is inserted into the opening OP of the mold 420 at the first and second positions. That is, the punch 520 can move vertically while being inserted into the opening OP.

[0114] The punch 520 is guided by the guide column 700. Therefore, the anti-aircraft capability of the punch 520 can be maintained within a predetermined range.

[0115] The punch 520 is connected to the punch plate 510 and moves via the punch pusher 530. The alignment of the upper plate 120 may shift due to wear on the main post 200. However, the punch 520 moves via the punch plate 510 and the punch pusher 530. Therefore, the alignment of the punch 520 is not affected by the alignment of the upper plate 120. That is, the punch 520 moves (e.g., is driven) by the movement of the upper plate 120, but its alignment is not affected by the alignment of the upper plate 120. Accordingly, the clearance of the punch 520 can be maintained within a predetermined range.

[0116] Accordingly, the punching die 10 can have improved clearance. Even with repeated use, the punching die 10 can maintain improved clearance. Consequently, the cutting accuracy of the electrode plate CP cut by the punching die 10 can be improved. Consequently, the safety of the secondary battery manufactured from the electrode plate CP can be improved.

[0117] The punching die 10 can be used to manufacture secondary batteries. The punching die 10 can be used to punch electrode plates CP. For example, the punching die 10 can be used to punch current collectors.

[0118] refer to Figures 1 to 5 Describe a method for punching electrode plates.

[0119] A method for punching an electrode plate may include setting the electrode plate CP on a mold 420, moving a punch 520, and cutting the electrode plate CP by the punch 520. These steps may be performed sequentially.

[0120] An electrode plate CP can be disposed on a mold 420. The electrode plate CP may include a conductive material. For example, the electrode plate CP may include a metal. For example, the electrode plate CP may include aluminum, copper, or nickel. The electrode plate may be a current collector for a secondary battery. The mold 420 may include an opening OP. The electrode plate CP may include a cut area. The cut area may overlap with the opening OP.

[0121] The punch 520 moves downward from the first position. The punch 520 can move via the punch pusher 530. The punch pusher 530 can move downward via the upper plate 120. The upper plate 120 can move while being guided by the main post 200. Accordingly, the punch pusher 530 connected to the upper plate 120 can move downward. While the punch pusher 530 moves downward, the punch plate 510 transmits force in a downward direction. Accordingly, the punch plate 510 can move downward. Accordingly, the punch 520 connected to the punch plate 510 can move downward from the first position. The first position can be located in the opening OP. That is, the punch 520 can move in the opening OP. A portion of the punch 520 can move in the opening OP. The movement of the punch 520 can be guided. The movement of the punch 520 can be guided by the guide post 700. That is, the upper plate 120 and the punch 520 are guided by different posts.

[0122] The cutting area of ​​the electrode plate CP can be cut.

[0123] The punch 520 may include a first region 1A and a second region 2A. The first region 1A is located within the opening OP, and the second region 2A is located outside the opening OP. The second region 1A may overlap with a portion of the electrode plate CP. The second region 2A may overlap with the cutting area.

[0124] The punch 520 moves from a first position to a second position located below the first position. The cutting area can be cut by the movement of the punch 520. The first region 1A moves from the first position to the second position. The second region 2A comes into contact with the cutting area by the movement of the punch 520, and the cutting area can be cut by the second region 2A.

[0125] After cutting the electrode plate CP, the punch 520 can be moved from the second position back to the first position by the elastic member 750, and the next electrode plate can be cut by repeating these steps.

[0126] The method for punching electrode plates CP is performed by punching die 10. Therefore, the cutting areas of multiple electrode plates can be consistent. This improves the alignment of the multiple electrode plates. Consequently, short circuits due to misalignment between the positive and negative electrodes of the secondary battery can be prevented. Therefore, the secondary battery to which the method for punching electrode plates is applied can have improved safety and reliability.

[0127] The punching die 10 includes a punch 520 for cutting the electrode plate CP.

[0128] The punch 520 moves vertically. The punch 520 is inserted into the opening OP of the mold 420 at a position before or after its movement. That is, the punch 520 can move vertically as it is inserted into the opening OP.

[0129] The punch 520 moves in conjunction with the movement of the upper plate 120. The movement of the punch 520 and the upper plate 120 is guided by different guides (e.g., posts). The punch 520 is guided by a guide post 700. The upper plate 120 is guided by a main post 200. The alignment of the punch 520 does not interfere with the alignment of the upper plate 120. Therefore, the clearance of the punch 520 can be maintained within a predetermined range.

[0130] The punch 520 is connected to the punch plate 510 and moves via the punch pusher 530. The upper plate 120 may become misaligned due to wear of the main post 200. However, the punch 520 moves via the punch plate 510 and the punch pusher 530. Accordingly, the alignment of the punch 520 is not affected by the alignment of the upper plate 120. That is, the punch 520 moves via the movement of the upper plate 120, but the alignment of the punch 520 is not affected by the alignment of the upper plate 120. Accordingly, the clearance of the punch 520 can be maintained within a predetermined range.

[0131] Therefore, the punching die 10 can have improved clearance. Even with repeated use, the punching die 10 can maintain improved clearance. Therefore, the cutting accuracy of the electrode plate CP cut by the punching die 10 can be improved.

[0132] A punching die 10 can be used when punching the electrode plates CP of the secondary battery. Therefore, multiple electrode plates CP can be cut to a uniform size. That is, the deviation of the cut areas of the electrode plates CP is reduced. Therefore, the alignment of the electrode plates CP can be improved. Correspondingly, short circuits between the positive and negative electrodes can be prevented. Therefore, the safety and reliability of the secondary battery can be improved.

[0133] The punching die 10 can be used to punch out the electrode plate CP of the electrode assembly. The punching die 10 can be used to punch out the negative electrode plate and the positive electrode plate of the secondary battery.

[0134] Figures 6 to 8 These are secondary batteries of various geometries manufactured using punching dies.

[0135] refer to Figure 6 The secondary battery 1000 may include a pouch-shaped housing 1100 and an electrode assembly 1300 housed in the housing 1100.

[0136] The electrode assembly 1300 can be connected to external terminals via electrode tabs 1400 and leads 1500. An insulating layer 1600 can be disposed on the leads 1500 for insulation from the housing 1100.

[0137] The electrode assembly 1300 may include a first electrode 1310, a second electrode 1320, and a diaphragm 1330. The first electrode 1310 may be a negative electrode, and the second electrode 1320 may be a positive electrode. The first electrode 1310 and the second electrode 1320 may each include a current collector and an active material layer on the current collector. The current collector may be punched using a die. Accordingly, multiple electrode tabs may be formed.

[0138] refer to Figure 7 The secondary battery 1000 may include a cylindrical housing 1100 and a cover plate 1200 for the sealed housing 1100. That is, the secondary battery 1000 may be a cylindrical secondary battery. The electrode assembly may be housed in the housing 1100.

[0139] The electrode assembly can be electrically connected to the housing 1100 and the cover 1200. For example, the electrode assembly can be connected to the housing 1100 via at least one of electrode tabs and leads. The electrode assembly can be connected to the cover 1200 via at least one of electrode tabs and leads.

[0140] The electrode assembly may include a negative electrode plate, a positive electrode plate, and a diaphragm. The negative and positive electrode plates may each include a current collector. The current collector can be punched out using a punching die. Accordingly, multiple electrode terminals can be formed.

[0141] refer to Figure 8 The secondary battery 1000 may include a prismatic housing 1100 and an electrode assembly disposed within the housing 1100. The electrode assembly may be connected to a terminal portion via at least one of electrode tabs and leads. The terminals may be connected to external terminals.

[0142] The electrode assembly may include a negative electrode plate, a positive electrode plate, and a diaphragm. The negative and positive electrode plates may each include a current collector. The current collector may be punched using a die. Accordingly, multiple electrode terminals may be formed.

[0143] Secondary batteries can be used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders. Battery modules and battery packs that include multiple secondary batteries can be used as power sources for motors in hybrid or electric vehicles, as well as for storing electrical energy.

[0144] refer to Figure 9 The description includes a battery module containing a secondary battery.

[0145] refer to Figure 9 The battery module 2000 includes terminal portions 810 and 820, a plurality of secondary batteries 1000 arranged in one direction, a connecting terminal piece 20 connecting a secondary battery 1000a to an adjacent secondary battery 1000b, and a protection circuit module 30 having one end connected to the connecting terminal piece 20. The protection circuit module 30 may include a battery management system (BMS). The connecting terminal piece 20 may include a main body portion that contacts the terminal portion between adjacent secondary batteries 1000a and 1000b, and an extension portion extending from the main body portion and connected to the protection circuit module 30. The connecting terminal piece 20 may be, for example, a busbar.

[0146] Each secondary battery 1000 may include a battery casing, an electrode assembly received (or housed) within the battery casing, and an electrolyte. The electrode assembly and electrolyte undergo an electrochemical reaction to store and release (e.g., generate) energy. Terminal portions 810 and 820 electrically connected to the connecting tabs 20, and an exhaust port 850 serving as a channel for venting gases generated inside the battery casing, may be provided on one side (e.g., the upper side) of the secondary battery 1000. The terminal portions 810 and 820 of the secondary battery 1000 may be positive electrode terminals 810 and negative electrode terminals 820 having different polarities from each other, and the terminal portions 810 and 820 of adjacent secondary batteries 1000a and 1000b may be electrically connected in series or in parallel with each other via the connecting tabs 20. Although series connection has been described as an example, the connection structure is not limited thereto, and various connection structures may be adopted as desired or required. The number and arrangement of secondary batteries are not limited to... Figure 9 The structure shown can be changed as desired or as needed.

[0147] Multiple secondary batteries 1000 may be arranged in one direction (e.g., stacked in one direction) such that the wide surfaces of the secondary batteries 1000 face each other, and the multiple secondary batteries 1000 may be secured by housings 61, 62, 63, and 64. Housings 61, 62, 63, and 64 may include a pair of end plates 61 and 62 facing the wide surfaces of the secondary batteries 1000, and a side plate 63 and a bottom plate 64 connecting the pair of end plates 61 and 62 to each other. The side plate 63 may support the side surfaces of the secondary batteries 1000, and the bottom plate 64 may support the bottom surface of the secondary batteries 1000. The pair of end plates 61 and 62, the side plate 63, and the bottom plate 64 may be connected by bolts 65 and / or any other suitable fastening members and methods known to those skilled in the art.

[0148] The protection circuit module 30 may have electronic components and protection circuitry mounted thereon and may be electrically connected to the connecting tabs 20. The protection circuit module 30 includes a first protection circuit module 30a and a second protection circuit module 30b extending at different locations along the direction in which the plurality of secondary batteries 1000 are arranged. The first protection circuit module 30a and the second protection circuit module 30b may be spaced apart from each other at a suitable or desired interval (e.g., a predetermined interval) and arranged parallel to each other to be electrically connected to adjacent connecting tabs 20, respectively. For example, the first protection circuit module 30a extends along the direction in which the plurality of secondary batteries 1000 are arranged on one side of the upper portion of the plurality of secondary batteries 1000, and the second protection circuit module 30b extends along the direction in which the plurality of secondary batteries 1000 are arranged on the other upper side of the plurality of secondary batteries 1000. The second protection circuit module 30b may be spaced apart from the first protection circuit module 30a at a suitable or desired interval (e.g., a predetermined interval) with an exhaust port 850 between them, but may be arranged parallel to the first protection circuit module 30a. In this way, the two protection circuit modules are arranged side-by-side and spaced apart from each other along the direction in which the multiple secondary batteries 1000 are arranged, thereby reducing or minimizing the area of ​​the printed circuit board (PCB) constituting the protection circuit module. By configuring the protection circuit modules separately as two protection circuit modules, unnecessary PCB area can be reduced or minimized. The first protection circuit module 30a and the second protection circuit module 30b can be connected to each other via a conductive connection member 50. One side of the conductive connection member 50 is connected to the first protection circuit module 30a, and the other side is connected to the second protection circuit module 30b, so that the two protection circuit modules 30a and 30b can be electrically connected to each other.

[0149] The connection can be performed by any of the following methods: brazing, resistance welding, laser welding, projection welding, and any other suitable connection method known to those skilled in the art.

[0150] The connecting member 50 may be, or include, for example, a wire. The conductive connecting member 50 may be made of, or include, a material that is elastic or flexible. Via the connecting member 50, the voltage, temperature, and / or current of multiple secondary batteries 1000 can be checked and managed to ensure they are normal or within desired ranges. For example, information such as voltage, current, and / or temperature received by the first protection circuit module from the connecting tab adjacent to the first protection circuit module, and information such as voltage, current, and / or temperature received from the connecting tab adjacent to the second protection circuit module, can be integrated and managed by the protection circuit module through the connecting member 50.

[0151] When the secondary battery 1000 expands, the impact can be absorbed by the elasticity or flexibility of the connecting member 50, thereby preventing or avoiding damage to the first protection circuit module 30a and the second protection circuit module 30b.

[0152] The geometry and structure of the connecting member 50 are not limited to Figure 9 The shapes and structures shown in the figure.

[0153] Since the protection circuit module 30 is provided as a first protection circuit module 30a and a second protection circuit module 30b, the area of ​​the PCB constituting the protection circuit module can be reduced or minimized, and the space inside the battery module can be ensured. This improves work efficiency by facilitating the fastening work for connecting the connecting tabs 20 and the protection circuit module 30, as well as the maintenance work when an abnormality is detected in the battery module.

[0154] Secondary batteries and battery modules can be used to manufacture battery packs.

[0155] Figure 10 A battery pack 3000 is shown. The battery pack 3000 may include a plurality of battery modules (not shown) and a housing 3100 for accommodating the plurality of battery modules. For example, the housing 3100 may include a first housing 3110 and a second housing 3120 coupled in opposite directions through the plurality of battery modules. The plurality of battery modules may be electrically connected to each other using busbars, and the plurality of battery modules may be electrically connected to each other in series / parallel or a hybrid series-parallel method to obtain the desired (e.g., required) electrical output. For ease of illustration, components such as busbars, cooling units, and external terminals for electrical connections to secondary batteries are omitted. In one or more example embodiments, the battery pack may be installed in a vehicle. The vehicle may be, for example, an electric vehicle, a hybrid vehicle, or a plug-in hybrid vehicle. The vehicle may include a four-wheeled vehicle or a two-wheeled vehicle.

[0156] exist Figure 11 In this configuration, the battery pack 3000 may include a battery pack cover 3010 that is part of the vehicle bottom 4100 and corresponds to a first housing, and a battery pack frame 3020 disposed below the vehicle bottom 4100 and corresponding to a second housing. The battery pack cover 3010 and the battery pack frame 3020 may, for example, be integrated with the vehicle floor 4200. The vehicle bottom 4100 separates the interior and exterior of the vehicle, and the battery pack frame 3020 may be disposed on the exterior of the vehicle.

[0157] exist Figure 12 In this embodiment, vehicle 4000 can be formed by combining additional components such as an engine hood 4300 at the front of vehicle 4000 and bumpers 4400 located at the front and rear of vehicle 4000, respectively, to the body. Vehicle 4000 may include a battery pack 3000, which includes a battery pack cover 3010 and a battery pack frame 3020, and the battery pack 3000 can be connected to the body.

[0158] Although this disclosure has been described above with reference to embodiments thereof, it is not limited thereto. Various modifications and variations can be made to it within the spirit of this disclosure by those skilled in the art.

Claims

1. A punching die, comprising: Lower board; The upper plate is positioned above the lower plate; Mold; A mold plate is disposed on the lower plate and supports the mold; A punch plate is located between the upper plate and the mold plate. A punch pusher is located between the upper plate and the mold plate; The punch is located below the punch plate and the punch pusher and above the mold plate; as well as Guide pillars, connected to the mold plate and the punch, The mold includes an opening. The punch is connected to the punch plate. The punch includes a first region configured to be inserted into the opening and a second region disposed outside the opening. The guide post is configured to guide the movement of the punch.

2. The punching die according to claim 1, wherein the number of guide pins disposed in a punch is 1 to 4.

3. The punching die according to claim 1, further comprising: A peeler is disposed between the lower plate and the upper plate; The main column is connected to the lower plate and the upper plate; as well as The inner column is connected to the peeler and the mold plate.

4. The punching die according to claim 1, wherein the punch pusher is connected to the punch plate and the upper plate.

5. The punching die according to claim 1, wherein when the upper plate moves downward, the punch pusher is configured to move downward, and the punch plate and the punch move downward via the punch pusher.

6. The punching die of claim 3, wherein the main post is configured to guide the movement of the upper plate.

7. The punching die of claim 3, wherein the inner pillar is configured to guide the movement of the stripper.

8. The punching die of claim 1, wherein the second region is configured to overlap with a portion of the electrode plate to be placed on the die.

9. The punching die according to any one of claims 1 to 8, further comprising an elastic member coupled to the guide post.

10. A method for punching electrode plates, comprising: An electrode plate is placed on a mold, the mold including an opening; Moving punch; as well as The electrode plate is cut by the punch. The punch is driven by the movement of the upper plate, and The movement of the upper plate and the movement of the punch are guided by different columns.

11. The method according to claim 10, The lower plate is located below the upper plate. The mold is supported by a mold plate disposed on the lower plate. The upper plate is guided by main columns connected to the lower plate and the upper plate, and The punch is guided by a guide post connected to the mold plate and the punch.

12. The method of claim 10, wherein the electrode plate includes a cut region overlapping the opening.

13. The method of claim 12, wherein the punch moves downward from the first position.

14. The method of claim 13, wherein a portion of the punch moves into the opening.

15. The method of claim 14, wherein the punch includes a first region positioned for insertion into the opening and a second region located outside the opening.

16. The method of claim 15, wherein the second region overlaps with the cutting region.

17. The method of claim 15, wherein the punch moves to the second position, and wherein the cutting region is cut when the second region and the cutting region come into contact by the movement of the punch.

18. The method according to claim 17, wherein when the punch is in the second position, the distance between the end of the punch near the mold and the mold is 0 μm to 2 μm.

19. The method of claim 17, wherein the resilient member is coupled to a guide post for guiding the punch, wherein the punch does not contact the resilient member at the first position, and wherein the punch contacts the resilient member at the second position.

20. The method of claim 19, wherein the punch moves from the second position to the first position via the restoring force of the elastic member.

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