A hot pressing device and method for low-temperature curing formaldehyde-free boards

Abstract

This application relates to the field of hot pressing technology for boards, specifically disclosing a hot pressing device and method for low-temperature curing formaldehyde-free boards. The device includes a main body, a feeding rack, and a conveyor belt. A control panel is installed on the outer surface of the main body. A drive motor is installed inside the feeding rack, and the output end of the drive motor is connected to the conveyor belt. An adhesive application assembly is installed on the outer surface of the feeding rack. This invention uses the adhesive application assembly to pre-remove sawdust, dust, and fine impurities adhering to the surface of the board substrate, and can precisely control the amount of adhesive applied as needed to ensure uniform and stable adhesive application. The hot pressing assembly can clamp and position the board and quickly release it from the limiting position during hot pressing. Furthermore, the hot pressing device has a stable and reliable buffer pressure regulating structure, which can promptly avoid instantaneous pressure overload and issue an alarm when pressure overload occurs, reminding personnel to maintain the equipment, thereby preventing batch damage to the boards.

Description

Technical Field

[0001] This application relates to the field of hot pressing technology for sheet materials, and in particular to a hot pressing device and method for low-temperature curing formaldehyde-free sheet materials. Background Technology

[0002] The home decoration, furniture, and interior design industries are increasingly demanding stringent requirements for the environmental friendliness, safety, and molding quality of wood-based panels. Traditional panels often use formaldehyde-containing adhesives such as urea-formaldehyde resin, which continuously release formaldehyde gas during long-term use, causing indoor air pollution and harming human health. This no longer aligns with the current development philosophy of green, environmentally friendly, low-carbon, and healthy industries. Low-temperature curing formaldehyde-free panels, with their numerous advantages, are gradually replacing traditional formaldehyde-containing panels and are widely used in whole-house customization, furniture manufacturing, and building decoration, becoming the mainstream development trend in the panel industry. Hot pressing is the core process in panel manufacturing, directly determining the panel's density, bonding strength, and surface quality. However, the following problems still exist in related hot pressing technologies:

[0003] 1. The lack of a cleaning mechanism during glue application to boards makes it easy for sawdust, dust, and fine impurities to remain on the surface of the board substrate. After glue application, these impurities will mix into the glue layer, disrupting its continuity and density. This can lead to localized bonding failures, delamination, and other quality problems. It can also cause glue waste, significantly reducing the structural stability and lifespan of the board after molding. Furthermore, the amount of glue applied cannot be adjusted according to needs, resulting in poor glue application stability. Applying too little glue will lead to weak bonding, while applying too much glue will cause glue overflow and accumulation. After hot pressing and curing, glue nodules and unevenness will appear on the surface of the board, increasing the workload of subsequent sanding and finishing processes and reducing the yield and processing efficiency.

[0004] 2. After the boards are placed in the hot pressing station, they are roughly aligned and positioned manually. The boards are easily affected by pressure impact and equipment vibration, which can cause them to shift or misalign. This results in uneven pressure on different parts of the boards and inconsistent thickness of the cured adhesive layer. In addition, the buffering effect of the hot pressing device is not stable enough, and pressure overload is likely to occur when applying pressure. Excessive instantaneous pressure directly affects the board blank, which can easily cause the wood fibers inside the board to be squeezed and broken, and the substrate to undergo irreversible compression deformation, resulting in appearance defects such as indentations, dents, and uneven thickness on the board surface. Summary of the Invention

[0005] To overcome the shortcomings of hot pressing devices, such as the lack of a cleaning structure when applying glue to boards, which easily leaves sawdust, powder, and fine impurities on the surface of the board substrate, significantly reducing the structural stability and service life of the formed board, and the inability to adjust the amount of glue applied according to needs, resulting in poor glue application stability and reduced production yield and processing efficiency, the hot pressing device relies solely on manual rough alignment after the board is placed at the hot pressing station. The board is easily displaced and misaligned due to pressure impact and equipment vibration, leading to uneven pressure on different parts of the board and inconsistent glue layer thickness. In addition, the buffering effect of the hot pressing device is not stable enough, and pressure overload is prone to occur. Excessive instantaneous pressure directly affects the board blank, easily causing the internal wood fibers of the board to be squeezed and broken, and the substrate to undergo irreversible compression deformation, resulting in appearance defects such as indentations, dents, and uneven thickness on the board surface. The purpose of this invention is to provide a hot pressing device and method for low-temperature curing formaldehyde-free boards to solve the above-mentioned deficiencies.

[0006] This application provides a hot pressing device for low-temperature curing formaldehyde-free boards, including a main body, a feeding rack, and a conveyor belt. A control panel is provided on the outer surface of the main body. A drive motor is installed inside the feeding rack, and the output end of the drive motor is connected to the conveyor belt. An adhesive application assembly is provided on the outer surface of the feeding rack. A hot pressing assembly is provided on the outer surface of the main body. The hot pressing assembly includes a fixed pressure plate, which is fixedly connected to the outer surface of the main body. Four buffer mechanisms are provided on the outer surface of the fixed pressure plate. A cylinder is fixedly installed on the inner wall of the main body. A piston rod is slidably connected to the inner cavity of the cylinder. A movable pressure plate is fixedly installed at the bottom end of the piston rod. A guide rod is fixedly installed on the outer surface of the movable pressure plate, and the guide rod is slidably connected to the inner cavity of the main body. A buffer plate is fixedly installed on the outer surface of the movable pressure plate.

[0007] Furthermore, the buffer mechanism includes a base plate, a fixing rod fixedly installed on the inner wall of the base plate, slide blocks slidably connected to both ends of the fixing rod, limit rings fixedly installed at both ends of the fixing rod, the slide blocks and limit rings in close contact, a second spring sleeved on the middle part of the fixing rod, and the second spring located between the two slide blocks, a connecting strip rotatably connected to the inner cavity of the slide block, a support plate rotatably connected to the end of the connecting strip away from the slide block, alarm mechanisms provided at both ends of the base plate, a clamping mechanism provided in the middle part of the base plate, and the outer surfaces of the base plate and the pressure plate fixedly connected.

[0008] Furthermore, the alarm mechanism includes a connecting plate, which is fixedly installed at both ends of the base plate. An inclined block is fixedly connected to the outer surface of the connecting plate. Alarm blocks are fixedly installed at both ends of the support plate. A first slide rod is slidably connected to the inner cavity of the alarm block. A compression ball is movably connected to the inner cavity of the first slide rod. A fixing ring is slidably connected to the inner cavity of the alarm block. An alarm is fixedly installed on the outer surface of the alarm block. A third spring is sleeved on the outer surface of the first slide rod. A button is provided on the inner wall of the alarm block. The button and the alarm are electrically connected, and pressing the button controls the alarm to sound an alarm. The fixing ring is slidably connected to the alarm block. The third spring is located between the inner wall of the alarm block and the fixing ring. The end of the first slide rod away from the compression ball is in contact with the button. The compression ball and the top outer surface of the connecting plate are in close contact.

[0009] Furthermore, the clamping mechanism includes a clamping block, a second sliding rod fixedly mounted on the outer surface of the clamping block, a guide block fixedly mounted on the end of the second sliding rod away from the clamping block, the guide block and the outer surface of the pressure plate being slidably connected, a fourth spring sleeved on the outer surface of the second sliding rod, the second sliding rod and the base plate being slidably connected, the fourth spring being located between the clamping block and the base plate, the outer surface of the guide block near the middle part of the pressure plate being an inclined surface, the side of the clamping block near the middle part of the pressure plate being rounded, a second connecting block fixedly mounted on the lower surface of the support plate, a lower pressure rod rotatably connected to the bottom end of the second connecting block, the lower pressure rod being located directly above the guide block, and the bottom end of the lower pressure rod being in close contact with the top end of the inclined surface of the guide block, the clamping block being located directly below the buffer plate, and the clamping block being able to be stored in the inner cavity of the buffer plate when the buffer plate moves down.

[0010] Furthermore, the adhesive application assembly includes a fixed frame, the outer surfaces of the fixed frame and the feeding frame are fixedly connected, a fixed plate is fixedly installed on the outer surface of the fixed frame, limit strips are fixedly installed at both ends of the fixed plate, a limit rod is rotatably connected to the outer surface of the limit strip, the bottom end of the limit rod is in contact with the upper surface of the conveyor belt, a cleaning mechanism is provided on the inner wall of the fixed frame, and an adhesive application mechanism is provided on the inner wall of the fixed frame.

[0011] Furthermore, the cleaning mechanism includes a cleaning frame, a first motor mounted on the outer surface of the cleaning frame, a gear disk rotatably connected to the middle part of the cleaning frame, half of the gear disk being hollowed out, a toothed frame slidably connected to the inner cavity of the cleaning frame, a protrusion fixedly installed on one side of the cleaning frame, a cleaning plate fixedly installed on the outer surface of the toothed frame, an elastic block slidably connected to the inner cavity of the cleaning plate, a cleaning brush fixedly installed at the bottom end of the elastic block, a limit block slidably connected to the inner cavity of the elastic block, a connecting rod fixedly installed in the inner cavity of the elastic block, a first spring sleeved on the outer surface of the connecting rod, a squeezing rod fixedly installed at one end of the elastic block, and a ball movably connected to the end of the squeezing rod away from the elastic block.

[0012] Furthermore, the output end of the first motor is sleeved with the gear disk, the gear disk meshes with the gear frame, the limit block and the cleaning plate are fixedly connected, the limit block and the connecting rod are slidably connected, the first spring is located between the elastic block and the limit block, and the rolling ball and the protrusion generate compression when the gear frame moves.

[0013] Furthermore, the glue application mechanism includes a glue application frame, an adjusting plate slidably connected to the outer surface of the glue application frame, a threaded rod threadedly connected to the inner cavity of the glue application frame, glue application rollers rotatably connected to the inner cavities of both the glue application frame and the adjusting plate, a second motor mounted on the outer surface of the glue application frame, a rotating rod rotatably connected to the inner cavity of the glue application frame, baffles fixedly mounted at both ends of the glue application frame, a first connecting block fixedly connected to one end of the adjusting plate, a connecting ring sleeved on the outer surface of the rotating rod, a first bevel gear fixedly connected to one end of the connecting ring, a second bevel gear fixedly connected to the outer surface of the rotating rod, and a third bevel gear fixedly connected to one end of each glue application roller.

[0014] Furthermore, the threaded rod and the adjusting plate are rotatably connected, the glue applicator and the fixed frame are fixedly connected, the output end of the second motor is sleeved with the rotating rod, the second bevel gear meshes with the third bevel gear in the inner cavity of the glue applicator, the first bevel gear meshes with the third bevel gear in the inner cavity of the adjusting plate, the connecting ring is rotatably connected with the inner cavity of the first connecting block, the connecting ring and the rotating rod are slidably connected, and the rotation of the rotating rod drives the connecting ring to rotate in the inner cavity of the first connecting block. The shielding plate is located at the junction of the two glue applicators.

[0015] A hot-pressing method for low-temperature curing formaldehyde-free boards, using the aforementioned hot-pressing device for low-temperature curing formaldehyde-free boards, includes the following steps:

[0016] S1. Place the sheet material to be hot-pressed into the inner cavity of the gluing component for dust removal and gluing. The feeding rack is driven by the drive motor to rotate in the inner cavity of the main body of the equipment to transport the sheet material.

[0017] S2. Place the board with the adhesive coating facing up on top of the pressure plate, then place the board to be hot-pressed, and use the buffer mechanism to center and limit the board.

[0018] S3. The operation of the cylinder drives the piston rod to slide in the inner cavity of the cylinder. At this time, the piston rod drives the movable pressure plate to move down. The guide rod slides in the inner cavity of the main body of the equipment to keep the movable pressure plate relatively stable when it moves down. The buffer plate is used to squeeze the buffer mechanism so that the movable pressure plate has a buffering effect when it heat-presses the plate on the fixed pressure plate.

[0019] The technical solution provided in this application has at least the following technical effects or advantages:

[0020] 1. By employing an adhesive application assembly, this method effectively solves the problem of existing hot-pressing devices lacking a cleaning structure when applying adhesive to boards. The surface of the board substrate is easily contaminated with sawdust, powder, and fine impurities. After adhesive application, these impurities become trapped within the adhesive layer, disrupting its continuity and density. This leads to localized bonding failures, delamination, and other quality issues, as well as adhesive waste. It significantly reduces the structural stability and lifespan of the formed board. Furthermore, the amount of adhesive applied cannot be adjusted according to requirements, resulting in poor consistency. Insufficient adhesive leads to weak bonding, while excessive adhesive causes overflow and accumulation, resulting in glue nodules and unevenness on the board surface after hot-pressing and curing, increasing the need for subsequent sanding and finishing processes. This invention reduces workload, lowers production yield, and decreases processing efficiency. By using an adhesive application component, it pre-removes sawdust, dust, and fine impurities from the surface of the substrate, preventing contaminants from entering the adhesive layer and ensuring a continuous and dense adhesive layer. This eliminates defects such as localized bonding failures and delamination at the source, reduces abnormal adhesive loss due to impurities, saves raw material costs, effectively improves the overall structural stability and service life of the board, and allows for precise control of adhesive application as needed, ensuring uniform and stable application. It avoids weak bonding caused by insufficient adhesive application and prevents excessive adhesive overflow and accumulation, improving the surface smoothness of the board, reducing subsequent sanding and finishing work, and significantly improving the board production yield and overall processing efficiency.

[0021] 2. By employing a hot-pressing assembly, this invention effectively solves the problems of existing hot-pressing devices where, after the sheet metal is placed at the hot-pressing station, it relies solely on manual rough alignment. This makes the sheet metal highly susceptible to displacement and misalignment due to pressure impacts and equipment vibrations, resulting in uneven pressure distribution and inconsistent adhesive layer thickness. Furthermore, the hot-pressing device's buffering effect is not stable enough, and pressure overload is prone to occur. Excessive instantaneous pressure directly impacts the sheet metal blank, easily causing the internal wood fibers to break and the substrate to undergo irreversible compression deformation, resulting in surface defects such as indentations, dents, and uneven thickness. This invention, through its hot-pressing assembly, can clamp and position the sheet metal and quickly release it during hot pressing. The positioning system effectively reduces pressure impact and equipment vibration during hot pressing, preventing board displacement and misalignment, ensuring uniform stress across all areas of the board, and preventing slight warping and deformation. It also ensures consistent adhesive layer curing thickness, significantly improving the bonding quality of the boards. In addition, the hot pressing device has a stable and reliable buffer pressure regulating structure, which can promptly avoid instantaneous pressure overload, preventing excessive pressure from squeezing the board blank and causing internal wood fiber breakage and irreversible compression deformation of the substrate. It effectively avoids appearance defects such as indentations, dents, and thickness deviations on the board surface, and issues an alarm when pressure is overloaded, reminding staff to maintain the equipment and thus avoiding mass damage to the boards. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure in Embodiment 1 of this application;

[0023] Figure 2 This is a schematic diagram of the adhesive coating component structure in Embodiment 1 of this application;

[0024] Figure 3 This is a schematic diagram of the cleaning mechanism structure in Embodiment 1 of this application;

[0025] Figure 4 This is a schematic diagram of the gear structure in Embodiment 1 of this application;

[0026] Figure 5 This is a schematic diagram of the elastic block structure in Embodiment 1 of this application;

[0027] Figure 6 This is a schematic diagram of the limiting block structure in Embodiment 1 of this application;

[0028] Figure 7 This is a schematic diagram of the adhesive application mechanism in Embodiment 1 of this application;

[0029] Figure 8 This is Example 1 of the present application. Figure 7 Enlarged structural diagram at point A;

[0030] Figure 9 This is a schematic diagram of the hot-pressing assembly structure in Embodiment 2 of this application;

[0031] Figure 10 This is a schematic diagram of the buffer mechanism structure in Embodiment 2 of this application;

[0032] Figure 11 This is a schematic diagram of the clamping mechanism structure in Embodiment 2 of this application;

[0033] Figure 12 This is a schematic diagram of the inclined block structure in Embodiment 2 of this application;

[0034] Figure 13 This is a schematic diagram of the first slide bar structure in Embodiment 2 of this application.

[0035] In the diagram: 1. Main body of the equipment; 2. Feeding rack; 3. Conveyor belt; 4. Glue application assembly; 41. Fixing frame; 42. Fixing plate; 43. Limiting strip; 44. Limiting rod; 45. Cleaning mechanism; 451. Cleaning frame; 452. First motor; 453. Gear disk; 454. Gear frame; 455. Protrusion; 456. Cleaning plate; 457. Elastic block; 458. Cleaning brush; 459. Limiting block; 451 0. Connecting rod; 4511. First spring; 4512. Extrusion rod; 4513. Ball bearing; 46. Glue application mechanism; 461. Glue application frame; 462. Adjusting plate; 463. Threaded rod; 464. Glue application roller; 465. Second motor; 466. Rotating rod; 467. Baffle plate; 468. First connecting block; 469. Connecting ring; 4610. First bevel gear; 4611. Second bevel gear; 4 612. Third bevel gear; 5. Hot pressing assembly; 51. Pressure plate; 52. Buffer mechanism; 521. Base plate; 522. Fixing rod; 523. Slide block; 524. Limiting ring; 525. Second spring; 526. Connecting bar; 527. Support plate; 528. Alarm mechanism; 5281. Connecting plate; 5282. Inclined block; 5283. Alarm block; 5284. First slide rod; 5285. Extrusion... 5286. Pressing ball; 5287. Fixing ring; 5288. Alarm; 5289. Third spring; 5280. Button; 529. Clamping mechanism; 5291. Clamping block; 5292. Second slide rod; 5293. Guide block; 5294. Fourth spring; 5295. Second connecting block; 5296. Lowering rod; 53. Cylinder; 54. Piston rod; 55. Movable pressure plate; 56. Guide rod; 57. Buffer plate. Detailed Implementation

[0036] For hot pressing devices that lack a cleaning structure when applying glue to boards, this invention uses a glue application component to pre-remove sawdust, dust, and fine impurities adhering to the surface of the board substrate, preventing contaminants from mixing into the glue layer, ensuring a continuous and dense glue layer, and eliminating defects such as localized adhesion failure and delamination of the board from the root. For hot pressing devices that rely solely on manual rough alignment after placing the board at the hot pressing station, this invention uses a hot pressing component to clamp and position the board and quickly release it from the limiting position during hot pressing, effectively reducing pressure impact and equipment vibration during the hot pressing process.

[0037] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods. Example 1:

[0038] Please see Figure 1As shown, a hot pressing device for low-temperature curing formaldehyde-free boards includes a main body 1, a feeding rack 2, and a conveyor belt 3. A control panel is installed on the outer surface of the main body 1 to control the operation of the equipment. A drive motor is installed inside the feeding rack 2, and the output end of the drive motor is connected to the conveyor belt 3. An adhesive application assembly 4 is installed on the outer surface of the feeding rack 2, and a hot pressing assembly 5 is installed on the outer surface of the main body 1. The board to be hot-pressed is placed in the inner cavity of the adhesive application assembly 4 for adhesive application. The drive motor drives the feeding rack 2 to rotate within the inner cavity of the main body 1 to transport the board. The adhesive application assembly 4 cleans the board during adhesive application, removing surface dust and impurities, and allows for setting the amount of adhesive applied as needed. The hot pressing assembly 5 is used to hot-press the board and position it during the hot pressing process, thereby ensuring uniform stress on the board during hot pressing.

[0039] Please see Figure 2 As shown, the gluing assembly 4 includes a fixed frame 41, which is fixedly connected to the outer surface of the feeding rack 2. A fixed plate 42 is fixedly installed on the outer surface of the fixed frame 41. Limiting strips 43 are fixedly installed at both ends of the fixed plate 42. Limiting rods 44 are rotatably connected to the outer surface of the limiting strips 43. The bottom end of the limiting rods 44 is in contact with the upper surface of the conveyor belt 3. A cleaning mechanism 45 and a gluing mechanism 46 are provided on the inner wall of the fixed frame 41. When conveying and gluing the board, the board is placed between the limiting rods 44, so that the limiting rods 44 rotate in the inner cavity of the limiting strips 43. At this time, the limiting rods 44 are used to assist in conveying and also to keep the two sides of the board relatively stable, so that the board will not shake when cleaning. The cleaning mechanism 45 on the fixed frame 41 is used to clean the board, and the gluing mechanism 46 is used to apply glue evenly and quantitatively.

[0040] Please see Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the cleaning mechanism 45 includes a cleaning frame 451. A first motor 452 is installed on the outer surface of the cleaning frame 451. A gear disk 453 is rotatably connected to the middle part of the cleaning frame 451. Half of the gear disk 453 is hollowed out. A gear frame 454 is slidably connected to the inner cavity of the cleaning frame 451. A protrusion 455 is fixedly installed on one side of the cleaning frame 451. A cleaning plate 456 is fixedly installed on the outer surface of the gear frame 454. An elastic block 457 is slidably connected to the inner cavity of the cleaning plate 456. A cleaning brush 458 is fixedly installed at the bottom end of the elastic block 457. The bottom end of the cleaning brush 458 is bristles. A limit block 459 is slidably connected to the inner cavity of the elastic block 457. A connecting rod 4510 is fixedly installed in the inner cavity of the elastic block 457. A first motor 452 is sleeved on the outer surface of the connecting rod 4510. A spring 4511 and a spring block 457 are fixedly mounted with a pressing rod 4512 at one end. A ball bearing 4513 is movably connected to the end of the pressing rod 4512 away from the spring block 457. The output end of the first motor 452 is sleeved with a gear disk 453, which meshes with a gear frame 454. Due to the partial hollowing out of the gear disk 453, it can only mesh with one side of the gear frame 454, allowing the gear frame 454 to reciprocate within the cleaning frame 451. A limiting block 459 is fixedly connected to the cleaning plate 456, and a sliding connection is made between the limiting block 459 and the connecting rod 4510. The first spring 4511 is located between the spring block 457 and the limiting block 459. When the gear frame 454 moves, the ball bearing 4513 and the protrusion 455 exert pressure, causing the cleaning mechanism 45 to press against the plate. During cleaning, the operation of the first motor 452 drives the gear disk 453 to rotate in the cleaning frame 451. The rotation of the gear disk 453 drives the gear frame 454 to reciprocate within the cleaning frame 451. The movement of the gear frame 454 drives the cleaning plate 456 to move. The movement of the cleaning plate 456 drives the elastic block 457 to move. The movement of the elastic block 457 causes the ball 4513 and the protrusion 455 to compress, causing the compression rod 4512 to press towards the elastic block 457. At this time, the elastic block 457 slides within the cleaning plate 456. The sliding of the elastic block 457 causes the limiting block 459 to slide on the connecting rod 4510 and compress the first spring 4511. Under the elastic force of the first spring 4511, the elastic block 457 returns to its original position, thereby making... The cleaning brush 458 moves back and forth below the cleaning plate 456, working in conjunction with the reciprocating movement of the toothed frame 454 for bidirectional, staggered cleaning. When the board moves below the cleaning brush 458, the limiting rod 44 stops the board. The cleaning brush 458 can clean the outer surface of the board from all directions. The bidirectional, cross-sweeping motion can fully cover the dead corners of the board surface, allowing the bristles to fully adhere to the board surface, avoiding problems such as incomplete cleaning and stain residue. It effectively removes dust and particulate impurities from the board surface, ensuring a uniform cleanliness. It can pre-remove sawdust, dust, and fine impurities attached to the board substrate surface, preventing dirt from mixing into the adhesive layer, ensuring a continuous and dense adhesive layer, and eliminating defects such as localized bonding failure, delamination, and other defects from the root, reducing abnormal adhesive loss due to impurities.This saves on raw material costs and effectively improves the overall structural stability and service life of the boards.

[0041] Please see Figure 2 , Figure 7 and Figure 8As shown, the glue application mechanism 46 includes a glue application frame 461. An adjusting plate 462 is slidably connected to the outer surface of the glue application frame 461. A threaded rod 463 is threadedly connected to the inner cavity of the glue application frame 461. Glue application rollers 464 are rotatably connected to the inner cavities of both the glue application frame 461 and the adjusting plate 462. A second motor 465 is installed on the outer surface of the glue application frame 461. A rotating rod 466 is rotatably connected to the inner cavity of the glue application frame 461. A baffle plate 467 is fixedly installed at both ends of the glue application frame 461. A first connecting block 468 is fixedly connected to one end of the adjusting plate 462. A connecting ring 469 is sleeved on the outer surface of the rotating rod 466. A first bevel gear 4610 is fixedly connected to one end of the connecting ring 469. A second bevel gear 4611 is fixedly connected to the outer surface of the rotating rod 466. One end of each coating roller 464 is fixedly connected to a third bevel gear 4612. A threaded rod 463 and an adjusting plate 462 are rotatably connected. A coating frame 461 and a fixed frame 41 are fixedly connected. The output end of the second motor 465 is sleeved with a rotating rod 466. The second bevel gear 4611 meshes with the third bevel gear 4612 inside the coating frame 461. The first bevel gear 4610 meshes with the third bevel gear 4612 inside the adjusting plate 462. A connecting ring 469 is rotatably connected to the inner cavity of the first connecting block 468. The connecting ring 469 and the rotating rod 466 are slidably connected, and the rotation of the rotating rod 466 drives the connecting ring 469 to rotate inside the first connecting block 468. A shielding plate 467 is located at the junction of the two coating rollers 464. This shielding plate is used to coat the substrate. During the application of adhesive, rotating the threaded rod 463 causes the adjusting plate 462 to move on the outer surface of the coating frame 461, adjusting the gap between the coating rollers 464. A certain amount of adhesive is then poured between the two coating frames 461. The baffle plate 467 prevents adhesive from flowing out from both sides of the coating rollers 464. The second motor 465 drives the rotating rod 466 to rotate within the coating frame 461. The rotation of the rotating rod 466 drives the first bevel gear 4610 and the second bevel gear 4611 to rotate. The rotation of the first bevel gear 4610 and the second bevel gear 4611 drives the two third bevel gears 4612 to rotate. At this time, the two coating rollers 464 rotate inwards towards each other, facilitating the coating rollers 464 to pick up the adhesive from the gap grooves and evenly transfer the adhesive to the roller surface, i.e., the coating rollers. When the 464 rollers rotate, they remain in continuous contact with the adhesive, ensuring that the adhesive is evenly applied to the surface of the roller body. When adjusting the gap of the adhesive rollers 464, the movement of the adjusting plate 462 drives one of the adhesive rollers 464 to move. At this time, the adjusting plate 462 drives the first connecting block 468 to move, and the movement of the first connecting block 468 drives the connecting ring 469 to move, so that the first bevel gear 4610 and the corresponding third bevel gear 4612 always remain in a meshing state. This allows for precise control of the amount of adhesive applied as needed, ensuring uniform and stable adhesive application. It avoids the problem of weak adhesion caused by insufficient adhesive application and prevents excessive adhesive overflow and accumulation, which can form glue nodules. This improves the surface flatness of the board, reduces the amount of subsequent sanding and finishing work, and significantly improves the yield rate of board production and overall processing efficiency. Example 2:

[0042] Please see Figure 1 and Figure 9 As shown, the hot pressing assembly 5 includes a fixed pressure plate 51, which is fixedly connected to the outer surface of the equipment body 1. A buffer mechanism 52 is provided on the outer surface of the fixed pressure plate 51, and there are four buffer mechanisms 52. A cylinder 53 is fixedly installed on the inner wall of the equipment body 1. A piston rod 54 is slidably connected to the inner cavity of the cylinder 53. A movable pressure plate 55 is fixedly installed at the bottom end of the piston rod 54. Both the fixed pressure plate 51 and the movable pressure plate 55 integrate a constant temperature heating structure to provide a stable heat source for the hot pressing process of the sheet metal. A guide rod 56 is fixedly installed on the outer surface of the movable pressure plate 55, and the guide rod 56 is slidably connected to the inner cavity of the equipment body 1. A buffer plate 57 is fixedly installed on the outer surface of the movable pressure plate 55 to buffer the sheet metal during the hot pressing process. During hot pressing, the adhesive-coated board is placed face up on top of the fixed pressure plate 51, and then the board to be hot pressed is placed on it. The buffer mechanism 52 centers and limits the board. The operation of the cylinder 53 drives the piston rod 54 to slide in the inner cavity of the cylinder 53. At this time, the piston rod 54 drives the movable pressure plate 55 to move down. The guide rod 56 slides in the inner cavity of the main body 1 to keep the movable pressure plate 55 relatively stable when it moves down. The buffer plate 57 is used to squeeze the buffer mechanism 52, so that the movable pressure plate 55 has a buffering effect when hot pressing the board on the fixed pressure plate 51. The two high-temperature pressure plates are directly attached to the upper and lower surfaces of the board, and the heat is quickly transferred to the board and the adhesive layer through heat conduction to achieve hot pressing of the board.

[0043] Please see Figure 10 and Figure 11As shown, the buffer mechanism 52 includes a base plate 521. A fixing rod 522 is fixedly installed on the inner wall of the base plate 521. Both ends of the fixing rod 522 are slidably connected to slide seats 523. Limiting rings 524 are fixedly installed on both ends of the fixing rod 522. The slide seats 523 and the limiting rings 524 are in close contact. A second spring 525 is sleeved on the middle part of the fixing rod 522, and the second spring 525 is located between the two slide seats 523. A connecting strip 526 is rotatably connected to the inner cavity of the slide seat 523. A support plate 527 is rotatably connected to the end of the connecting strip 526 away from the slide seat 523. Alarm mechanisms 528 are provided at both ends of the base plate 521. A clamping mechanism 529 is provided in the middle part of the base plate 521. The outer surfaces of the base plate 521 and the fixed pressure plate 51 are fixedly connected. When the movable pressure plate 55 is pressed down for buffering, the movable pressure plate 55 moves down and causes the buffer plate 57 to squeeze the support plate 527. At this time, the connecting strip 526... The slide 523 rotates within its inner cavity, causing it to slide on the fixed rod 522 and exert pressure on the second spring 525. The elastic force of the second spring 525 then buffers the downward movement of the movable pressure plate 55. The limiting ring 524 limits the slide 523, ensuring a stable distance between the support plate 527 and the base plate 521. The alarm mechanism 528 sounds an alarm when the movable pressure plate 55 is under overload, reminding staff to perform maintenance. The clamping mechanism 529 limits the board material and simultaneously releases its gripper when the movable pressure plate 55 and the fixed pressure plate 51 are about to contact, preventing slight warping or deformation of the board material and affecting its flatness after hot pressing. This effectively avoids instantaneous pressure overload, preventing excessive pressure from causing internal wood fiber breakage and irreversible compression deformation of the substrate, thus effectively preventing surface defects such as indentations, dents, and thickness variations.

[0044] Please see Figure 11 Figure 12 and Figure 13As shown, the alarm mechanism 528 includes a connecting plate 5281, which is fixedly installed at both ends of the base plate 521. An inclined block 5282 is fixedly connected to the outer surface of the connecting plate 5281. Alarm blocks 5283 are fixedly installed at both ends of the support plate 527. A first slide rod 5284 is slidably connected to the inner cavity of the alarm block 5283. A compression ball 5285 is movably connected to the inner cavity of the first slide rod 5284. A fixing ring 5286 is slidably connected to the inner cavity of the alarm block 5283. An alarm 5287 is fixedly installed on the outer surface of the alarm block 5283. A third spring 5288 is sleeved on the outer surface of the first slide rod 5284. A button 5289 is provided on the inner wall of the alarm block 5283. The button 5289 and the alarm 5287 are electrically connected, and the button... The press-controlled alarm 5287 of 5289 sounds an alarm. The retaining ring 5286 and alarm block 5283 are slidably connected. The third spring 5288 is located between the inner wall of the alarm block 5283 and the retaining ring 5286. The end of the first slide rod 5284 away from the squeeze ball 5285 is in contact with the button 5289. The squeeze ball 5285 and the top outer surface of the connecting plate 5281 are in close contact. The clamping mechanism 529 includes a clamping block 5291. A second slide rod 5292 is fixedly mounted on the outer surface of the clamping block 5291. A guide block 5293 is fixedly mounted on the end of the second slide rod 5292 away from the clamping block 5291. The guide block 5293 is slidably connected to the outer surface of the pressure plate 51. A fourth spring 5294 is sleeved on the outer surface of the second slide rod 5292. Rod 5292 and base plate 521 are slidably connected. The fourth spring 5294 is located between clamping block 5291 and base plate 521. The outer surface of guide block 5293 near the middle of pressure plate 51 is inclined. The side of clamping block 5291 near the middle of pressure plate 51 is rounded, which facilitates the quick placement of the plate into clamping blocks 5291 for clamping and positioning. A second connecting block 5295 is fixedly installed on the lower surface of support plate 527. The bottom end of the second connecting block 5295 is rotatably connected to a pressing rod 5296. The pressing rod 5296 is located directly above guide block 5293, and the bottom end of pressing rod 5296 is in close contact with the top end of the inclined surface of guide block 5293. Clamping block 5291 is located directly below buffer plate 57, and when buffer plate 57 moves down, clamping block 5291... 291 can be housed within the cavity of the buffer plate 57. When the movable pressure plate 55 presses down, it will compress the support plate 527. At this time, the support plate 527 moves down and drives the second connecting block 5295 to move down. The movement of the second connecting block 5295 drives the pressing rod 5296 to compress the inclined surface of the guide block 5293. When the movable pressure plate 55 heat-presses the plate on the fixed pressure plate 51, the first sliding rod 5284 is located at the top of the inclined surface of the inclined block 5282. At this time, the guide block 5293 moves outward, causing the second sliding rod 5292 to slide within the cavity of the base plate 521 and drive the clamping block 5291 to compress the fourth spring 5294. At this time, the clamping block 5291 falls off and limits the side of the plate. Therefore, the plate is kept centered during the heat-pressing process.Before the movable pressure plate 55 approaches the fixed pressure plate 51, the clamping block 5291 disengages from the limiting position of the plate, preventing slight warping or deformation of the plate during hot pressing, which would affect the flatness of the plate and avoid the side of the plate being rigidly pressed against the clamping structure, causing edge crushing damage and burrs. When the movable pressure plate 55 is overloaded, the support plate 527 is pressed down beyond the normal displacement. At this time, the downward movement of the support plate 527 causes the alarm block 5283 to move down, causing the extrusion ball 5285 to move on the connecting plate 5281 and finally, under overload, it collidees with the inclined block 52. At contact point 82, the inclined block 5282 compresses the extrusion ball 5285, causing the first slide rod 5284 to slide within the cavity of the alarm block 5283. The sliding of the alarm block 5283 causes the fixing ring 5286 to slide within the cavity of the alarm block 5283, compressing the third spring 5288. Simultaneously, the movement of the first slide rod 5284 compresses the button 5289, causing the alarm 5287 to sound. This triggers an alarm when pressure is overloaded, reminding personnel to maintain the equipment and thus preventing mass damage to the sheet metal.

[0045] In summary, the sheet material to be hot-pressed is placed in the inner cavity of the gluing component 4 for gluing. The feeder 2, driven by a motor, rotates within the inner cavity of the main body 1 to transport the sheet material. The gluing component 4 cleans the sheet material during gluing, removing surface dust and impurities, and allows for setting the gluing amount as needed. The hot-pressing component 5 is used to hot-press the sheet material and positions it during the hot-pressing process, ensuring uniform stress distribution. During conveying and gluing, the sheet material is placed between the limiting rods 44, causing the limiting rods 44 to rotate within the inner cavity of the limiting strip 43. At this time, the limiting rods 44 assist in conveying while also maintaining relative stability on both sides of the sheet material, ensuring even pressure distribution. The material will not shake during cleaning. The cleaning mechanism 45 on the fixed frame 41 is used to clean the board, and the glue application mechanism 46 is used to apply glue evenly and quantitatively. The board with glue applied is placed face up on the fixed pressure plate 51, and then the board to be hot-pressed is placed. The buffer mechanism 52 centers and limits the board. The operation of the cylinder 53 drives the piston rod 54 to slide in the inner cavity of the cylinder 53. At this time, the piston rod 54 drives the movable pressure plate 55 to move down. The guide rod 56 slides in the inner cavity of the main body 1 to keep the movable pressure plate 55 relatively stable when it moves down. The buffer plate 57 is used to squeeze the buffer mechanism 52, so that the movable pressure plate 55 has a buffering effect when hot-pressing the board on the fixed pressure plate 51.

[0046] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

[0047] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present application, based on the technical solution and concept of the present application, should be covered within the scope of protection of the present application.

Claims

1. A hot pressing device for low-temperature curing formaldehyde-free boards, comprising a main body (1), a feeding rack (2), and a conveyor belt (3), wherein a control panel is provided on the outer surface of the main body (1), a drive motor is provided in the inner cavity of the feeding rack (2), and the output end of the drive motor is sleeved with the conveyor belt (3), characterized in that, The outer surface of the feeding rack (2) is provided with an adhesive coating assembly (4), and the outer surface of the main body of the equipment (1) is provided with a hot pressing assembly (5). The hot pressing assembly (5) includes a pressure plate (51), which is fixedly connected to the outer surface of the main body (1). The outer surface of the pressure plate (51) is provided with a buffer mechanism (52), and there are four buffer mechanisms (52). A cylinder (53) is fixedly installed on the inner wall of the main body (1). A piston rod (54) is slidably connected to the inner cavity of the cylinder (53). A movable pressure plate (55) is fixedly installed at the bottom end of the piston rod (54). A guide rod (56) is fixedly installed on the outer surface of the movable pressure plate (55). The guide rod (56) is slidably connected to the inner cavity of the main body (1). A buffer plate (57) is fixedly installed on the outer surface of the movable pressure plate (55).

2. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 1, characterized in that, The buffer mechanism (52) includes a base plate (521), a fixing rod (522) is fixedly installed on the inner wall of the base plate (521), both ends of the fixing rod (522) are slidably connected to a slide block (523), both ends of the fixing rod (522) are fixedly installed with a limit ring (524), the slide block (523) and the limit ring (524) are in close contact, and a second spring (525) is sleeved on the middle part of the fixing rod (522), and the second spring ( 525) is located between two slides (523). The inner cavity of the slide (523) is rotatably connected to a connecting strip (526). The end of the connecting strip (526) away from the slide (523) is rotatably connected to a support plate (527). The two ends of the base plate (521) are provided with alarm mechanisms (528). The middle part of the base plate (521) is provided with a clamping mechanism (529). The outer surface of the base plate (521) and the pressure plate (51) are fixedly connected.

3. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 2, characterized in that, The alarm mechanism (528) includes a connecting plate (5281), which is fixedly installed at both ends of the base plate (521). An inclined block (5282) is fixedly connected to the outer surface of the connecting plate (5281). Alarm blocks (5283) are fixedly installed at both ends of the support plate (527). A first sliding rod (5284) is slidably connected to the inner cavity of the alarm block (5283). A compression ball (5285) is movably connected to the inner cavity of the first sliding rod (5284). A fixing ring (5286) is slidably connected to the inner cavity of the alarm block (5283). An alarm device (5287) is fixedly installed on the outer surface of the alarm block (5283). The first sliding rod (5284)... A third spring (5288) is sleeved on the outer surface of the alarm block (5283). A button (5289) is provided on the inner wall of the alarm block (5283). The button (5289) is electrically connected to the alarm (5287), and pressing the button (5289) controls the alarm (5287) to sound an alarm. The fixing ring (5286) is slidably connected to the alarm block (5283). The third spring (5288) is located between the inner wall of the alarm block (5283) and the fixing ring (5286). The end of the first slide rod (5284) away from the squeeze ball (5285) is in contact with the button (5289). The squeeze ball (5285) is in close contact with the top outer surface of the connecting plate (5281).

4. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 2, characterized in that, The clamping mechanism (529) includes a clamping block (5291), a second slide rod (5292) is fixedly mounted on the outer surface of the clamping block (5291), a guide block (5293) is fixedly mounted on the end of the second slide rod (5292) away from the clamping block (5291), the guide block (5293) is slidably connected to the outer surface of the pressure plate (51), a fourth spring (5294) is sleeved on the outer surface of the second slide rod (5292), the second slide rod (5292) is slidably connected to the base plate (521), the fourth spring (5294) is located between the clamping block (5291) and the base plate (521), and the guide block (5293) is close to the pressure plate (51). The outer surface of the middle part is inclined. The side of the clamping block (5291) near the middle part of the pressure plate (51) is rounded. The lower surface of the support plate (527) is fixedly installed with a second connecting block (5295). The bottom end of the second connecting block (5295) is rotatably connected with a pressure rod (5296). The pressure rod (5296) is located directly above the guide block (5293), and the bottom end of the pressure rod (5296) is in close contact with the top end of the inclined surface of the guide block (5293). The clamping block (5291) is located directly below the buffer plate (57), and the clamping block (5291) can be stored in the inner cavity of the buffer plate (57) when the buffer plate (57) moves down.

5. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 1, characterized in that, The adhesive application assembly (4) includes a fixed frame (41), which is fixedly connected to the outer surface of the feeding frame (2). A fixed plate (42) is fixedly installed on the outer surface of the fixed frame (41). Limiting strips (43) are fixedly installed at both ends of the fixed plate (42). A limiting rod (44) is rotatably connected to the outer surface of the limiting strip (43). The bottom end of the limiting rod (44) is attached to the upper surface of the conveyor belt (3). A cleaning mechanism (45) is provided on the inner wall of the fixed frame (41). An adhesive application mechanism (46) is provided on the inner wall of the fixed frame (41).

6. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 5, characterized in that, The cleaning mechanism (45) includes a cleaning frame (451), a first motor (452) is provided on the outer surface of the cleaning frame (451), a gear disk (453) is rotatably connected to the middle part of the cleaning frame (451), half of the gear disk (453) is hollowed out, a gear frame (454) is slidably connected to the inner cavity of the cleaning frame (451), a protrusion (455) is fixedly installed on one side of the cleaning frame (451), a cleaning plate (456) is fixedly installed on the outer surface of the gear frame (454), and the inner cavity of the cleaning plate (456) is slidably connected to... A spring block (457) is attached, and a cleaning brush (458) is fixedly installed at the bottom end of the spring block (457). A limit block (459) is slidably connected to the inner cavity of the spring block (457). A connecting rod (4510) is fixedly installed in the inner cavity of the spring block (457). A first spring (4511) is sleeved on the outer surface of the connecting rod (4510). A pressing rod (4512) is fixedly installed at one end of the spring block (457). A ball (4513) is movably connected to the end of the pressing rod (4512) away from the spring block (457).

7. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 6, characterized in that, The output end of the first motor (452) is sleeved with the gear disk (453), the gear disk (453) meshes with the gear frame (454), the limiting block (459) is fixedly connected with the cleaning plate (456), the limiting block (459) is slidably connected with the connecting rod (4510), the first spring (4511) is located between the elastic block (457) and the limiting block (459), and the rolling ball (4513) and the protrusion (455) are squeezed when the gear frame (454) moves.

8. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 5, characterized in that, The glue application mechanism (46) includes a glue application frame (461), an adjusting plate (462) slidably connected to the outer surface of the glue application frame (461), a threaded rod (463) threadedly connected to the inner cavity of the glue application frame (461), and glue application rollers (464) rotatably connected to the inner cavities of both the glue application frame (461) and the adjusting plate (462). A second motor (465) is provided on the outer surface of the glue application frame (461), and a rotating rod (466) rotatably connected to the inner cavity of the glue application frame (461). Both ends of the glue frame (461) are fixedly installed with baffles (467), one end of the adjusting plate (462) is fixedly connected with a first connecting block (468), the outer surface of the rotating rod (466) is sleeved with a connecting ring (469), one end of the connecting ring (469) is fixedly connected with a first bevel gear (4610), the outer surface of the rotating rod (466) is fixedly connected with a second bevel gear (4611), and one end of the glue roller (464) is fixedly connected with a third bevel gear (4612).

9. The hot pressing device for low-temperature curing formaldehyde-free boards as described in claim 8, characterized in that, The threaded rod (463) and the adjusting plate (462) are rotatably connected. The glue applicator (461) and the fixed frame (41) are fixedly connected. The output end of the second motor (465) is sleeved with the rotating rod (466). The second bevel gear (4611) meshes with the third bevel gear (4612) in the inner cavity of the glue applicator (461). The first bevel gear (4610) meshes with the third bevel gear (4612) in the inner cavity of the adjusting plate (462). The connecting ring (469) and the inner cavity of the first connecting block (468) are rotatably connected. The connecting ring (469) and the rotating rod (466) are slidably connected. The rotation of the rotating rod (466) drives the connecting ring (469) to rotate in the inner cavity of the first connecting block (468). The shielding plate (467) is located at the junction of the two glue applicators (464).

10. A hot-pressing method for low-temperature curing formaldehyde-free boards, used in the hot-pressing apparatus for low-temperature curing formaldehyde-free boards as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Place the sheet material that needs to be hot-pressed into the inner cavity of the glue coating assembly (4) for dust removal and glue coating. Drive the feeding rack (2) to rotate in the inner cavity of the main body (1) of the equipment to transport the sheet material. S2. Place the plate with the adhesive coating facing up above the pressure plate (51), then place the plate to be hot-pressed, and use the buffer mechanism (52) to center and limit the plate. S3. The operation of the cylinder (53) drives the piston rod (54) to slide in the inner cavity of the cylinder (53). At this time, the piston rod (54) drives the movable pressure plate (55) to move down. The guide rod (56) slides in the inner cavity of the main body of the equipment (1) to keep the movable pressure plate (55) relatively stable when it moves down. The buffer plate (57) is used to squeeze the buffer mechanism (52) so that the movable pressure plate (55) has a buffering effect when it heat-presses the plate on the fixed pressure plate (51).

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