Wire EDM Cutting Surface Orientation Deviation Correction System and Method

Abstract

This invention provides a system and method for correcting the orientation deviation of a wire EDM cutting surface, belonging to the field of semiconductor device processing technology. It includes: a stage mechanism, a deviation detection mechanism, a deviation correction mechanism, and a control mechanism. The deviation detection mechanism is located on the front side of the stage mechanism's base plate and is on the same horizontal plane as the base plate, used to detect the orientation deviation of the stage mechanism. The deviation correction mechanism is located on the left and right sides of the stage mechanism's base plate and is connected to the left and right sides respectively, used to control the left and right deflection of the stage mechanism's base plate. The control mechanism is electrically connected to the deviation detection mechanism and the deviation correction mechanism respectively, used to acquire the orientation deviation of the stage mechanism detected by the deviation detection mechanism, and to activate the deviation correction mechanism based on the orientation deviation, controlling the left and right deflection of the stage mechanism's base plate to correct the orientation deviation. This allows for real-time detection and correction of deviations during the cutting process, avoiding batch scrap and significantly reducing production losses.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing technology, and specifically to a system and method for correcting the orientation deviation of the cutting surface of a wire EDM machine. Background Technology

[0002] In semiconductor wafer manufacturing, wire dicing is one of the key processes determining the orientation accuracy of the wafer surface. The orientation deviation between the wafer dicing path and the wafer's crystal orientation, and the preset dicing line, directly affects the chip's electrical performance and yield. Common orientation deviations include dicing surface tilt deviation, dicing angle offset, dicing path parallelism deviation, and uneven dicing depth. Currently, in semiconductor wafer wire dicing equipment, the stage mechanism that carries the wafer and controls its feed is typically fixed to the equipment frame using fasteners such as mechanical screws. During prolonged high-load operation, factors such as dicing vibration, temperature changes, and mechanical stress can cause these fasteners to gradually loosen, leading to slight displacement of the stage mechanism and consequently causing the dicing surface orientation to deviate from the preset value. Because this loosening process is gradual and not easily detected by the naked eye, equipment operators often fail to detect it during routine inspections.

[0003] To address the aforementioned issues, some improvements have been implemented in existing technologies. For example, a CCD vision alignment system can be used to identify baseline coordinates before cutting, or image recognition can be used to detect cut deviations after cutting. Additionally, some solutions group wire cutting machines and statistically analyze their cutting deviation patterns to match suitable machines for cutting. However, all of these solutions have significant shortcomings: firstly, visual inspection or post-cutting inspection is offline or semi-offline, unable to detect changes in stage displacement in real time during cutting, resulting in a lag in deviation detection; secondly, existing solutions primarily address initial alignment before cutting or quality assessment after cutting, lacking a real-time deviation feedback mechanism for orientation drift caused by factors such as mechanical loosening during cutting, making it impossible to correct deviations generated during cutting in a timely manner. Therefore, when the stage mechanism gradually shifts during cutting due to loose screws, this deviation cannot be detected in time, often only becoming apparent after the entire batch of wafers has been cut and subsequently verified. By this time, the entire batch of products has already been scrapped due to out-of-tolerance orientation, resulting in significant material waste and production losses. Summary of the Invention

[0004] In view of this, the present invention provides a wire EDM cutting surface orientation deviation correction system and method to monitor the displacement change of the stage mechanism in real time during the wafer cutting process and to automatically correct the orientation deviation in a timely manner.

[0005] The technical solution adopted by this invention to solve its technical problem is:

[0006] A wire EDM cutting surface orientation deviation correction system includes a platform mechanism, a deviation detection mechanism, a deviation correction mechanism, and a control mechanism. The deviation detection mechanism is located on the front side of the platform mechanism's base plate and is on the same horizontal plane as the platform mechanism's base plate, used to detect the orientation deviation of the platform mechanism. The deviation correction mechanism is located on the left and right sides of the platform mechanism's base plate and is connected to the left and right sides of the platform mechanism's base plate, respectively, used to control the left and right deflection of the platform mechanism's base plate. The control mechanism is electrically connected to the deviation detection mechanism and the deviation correction mechanism, respectively, used to acquire the orientation deviation of the platform mechanism detected by the deviation detection mechanism, and activate the deviation correction mechanism according to the orientation deviation to control the left and right deflection of the platform mechanism's base plate, thereby correcting the orientation deviation.

[0007] Preferably, the deviation detection mechanism includes a left-side distance sensor and a right-side distance sensor; the left-side distance sensor is located at the left end of the front side of the platform mechanism base plate, and the right-side distance sensor is located at the right end of the front side of the platform mechanism base plate; both the left-side distance sensor and the right-side distance sensor are located on the same horizontal plane as the platform mechanism base plate, and the distance between the left-side distance sensor and the right-side distance sensor and the platform mechanism base plate is the same.

[0008] Preferably, the left and right ranging sensors are mounted on the frame of the platform mechanism via brackets. The brackets are connected to the left and right ranging sensors via hinges to fine-tune the orientation angle of the probes of the left and right ranging sensors, ensuring that the probes are facing the detection surface of the platform mechanism's base plate.

[0009] Preferably, the deviation correction mechanism includes a drive motor, a transmission gear, and an arc-shaped rack; the arc-shaped rack is disposed on the left and right sides of the base plate of the platform mechanism, and the transmission gear meshes with the arc-shaped rack fixed on both sides of the base plate of the platform mechanism; the output shaft of the drive motor is connected to the transmission gear to drive the transmission gear to rotate and drive the platform mechanism to move.

[0010] Preferably, the output end of the drive motor is equipped with an electromagnetic brake, which is used to lock the output end of the drive motor after calibration to prevent the calibrated position from drifting due to cutting vibration.

[0011] Preferably, a high-flatness reference plate is fixedly installed on the front side of the stage mechanism to serve as the detection surface of the deviation detection mechanism, ensuring the flatness and consistency of the detection surface.

[0012] The present invention also provides a method for correcting the orientation deviation of the cutting surface of a wire EDM machine, which is applied to the wire EDM machine orientation deviation correction system described above, and includes the following steps:

[0013] S1. Fix the semiconductor wafer to the stage mechanism to complete the initial positioning; after the initial positioning is completed, control the stage mechanism to drive the semiconductor wafer to the dicing mechanism to dic the semiconductor wafer;

[0014] S2. During the cutting process, the control mechanism dynamically acquires the orientation deviation of the platform mechanism detected by the deviation detection mechanism.

[0015] S3. The control mechanism starts the deviation correction mechanism based on the detected orientation deviation to correct the orientation deviation of the stage mechanism in real time until the cutting is completed.

[0016] Preferably, the deviation detection mechanism includes a left-side ranging sensor and a right-side ranging sensor. The specific steps for the deviation detection mechanism to detect the orientation deviation of the platform mechanism are as follows: obtain the detection values ​​of the left-side ranging sensor and the right-side ranging sensor respectively; calculate the difference between the detection values ​​of the left-side ranging sensor and the right-side ranging sensor, which is the orientation deviation of the platform mechanism.

[0017] Preferably, the deviation correction mechanism includes a drive motor, a transmission gear, and an arc-shaped rack; the rotation angle of the output shaft of the drive motor is calculated based on the difference in the detected values, and the drive motor is controlled based on the rotation angle to correct the positional deviation.

[0018] Preferably, in step S2, the real-time detection value difference between the left and right ranging sensors is obtained, and the points are dynamically plotted to form a continuous curve to determine whether the cutting process is stable.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] This invention provides a deviation detection mechanism on the front side of the base plate of the stage mechanism and a deviation correction mechanism on the left and right sides of the base plate. During the cutting process, the deviation detection mechanism can detect whether the stage mechanism has an orientation deviation in real time, and the deviation correction mechanism can correct the orientation deviation in time when the stage mechanism has an orientation deviation, thereby avoiding batch scrapping of wafers and significantly reducing production losses. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the wire EDM cutting surface orientation deviation correction system of the present invention.

[0022] Figure 2 This is a flowchart of the wire EDM cutting surface orientation deviation correction method of the present invention.

[0023] In the figure: platform mechanism base plate 100, left distance sensor 210, right distance sensor 220, drive motor 310, transmission gear 320, and arc rack 330. Detailed Implementation

[0024] The technical solutions and effects of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0025] Please refer to Figure 1 A wire EDM cutting surface orientation deviation correction system includes a platform mechanism, a deviation detection mechanism, a deviation correction mechanism, and a control mechanism. The deviation detection mechanism is located on the front side of the platform mechanism base plate 100 and is on the same horizontal plane as the platform mechanism base plate 100, and is used to detect the orientation deviation of the platform mechanism. The deviation correction mechanism is located on the left and right sides of the platform mechanism base plate 100 and is connected to the left and right sides of the platform mechanism base plate 100 respectively, and is used to control the left and right deflection of the platform mechanism base plate 100. The control mechanism is electrically connected to the deviation detection mechanism and the deviation correction mechanism respectively, and is used to acquire the orientation deviation of the platform mechanism detected by the deviation detection mechanism, and activate the deviation correction mechanism according to the orientation deviation to control the left and right deflection of the platform mechanism base plate 100 to correct the orientation deviation.

[0026] This invention provides a deviation detection mechanism on the front side of the base plate of the stage mechanism and a deviation correction mechanism on the left and right sides of the base plate. During the cutting process, the deviation detection mechanism can detect whether the stage mechanism has an orientation deviation in real time, and the deviation correction mechanism can correct the orientation deviation in time when the stage mechanism has an orientation deviation, thereby avoiding batch scrapping of wafers and significantly reducing production losses.

[0027] Further, please see Figure 1The deviation detection mechanism includes a left-side ranging sensor 210 and a right-side ranging sensor 220. The left-side ranging sensor 210 is located at the left end of the front side of the platform mechanism base plate 100, and the right-side ranging sensor 220 is located at the right end of the front side of the platform mechanism base plate 100. Both the left-side ranging sensor 210 and the right-side ranging sensor 220 are located on the same horizontal plane as the platform mechanism base plate 100, and the distance between the left-side ranging sensor 210 and the right-side ranging sensor 220 and the platform mechanism base plate 100 is the same. The platform mechanism, as a moving component that carries the wafer and performs the feed motion, feeds the wafer towards the position of the cutting mechanism during the cutting process. The left-side sensor 210 and the right-side sensor 220 are rigidly mounted on the fixed frame or base of the equipment using fixing screws. The front side of the platform mechanism has a flat reference surface, which is opposite to the probes of the left-side sensor 210 and the right-side sensor 220, and all three are located on the same horizontal plane. During installation, the two distance sensors are arranged symmetrically in space, with the vertical distance between the probe end faces of the two sensors and the front reference surface of the platform mechanism being equal. They need to be adjusted to maintain a distance of approximately 1mm from the platform mechanism's base plate 100. In some embodiments, the left-side distance sensor 210 and the right-side distance sensor 220 are connected to a preamplifier via extension cables to amplify the signals detected by the distance sensors. The signals are then directly connected to a display screen or PLC via the preamplifier, and the collected data curves are displayed in real time on the screen. During the cutting process, if the platform mechanism shifts left or right due to loose screws, the distance between the sensors on both sides and the edge of the platform will change. The orientation deviation of the platform mechanism is then determined based on the change in distance detected by the sensors on both sides.

[0028] Furthermore, the left-side ranging sensor 210 and the right-side ranging sensor 220 are mounted on the frame of the platform mechanism via brackets. The brackets are connected to the left-side and right-side ranging sensors 210 and 220 respectively via hinge structures, used to fine-tune the orientation angle of the probes of the left-side and right-side ranging sensors 210 and 220, ensuring that the probes are directly facing the detection surface of the platform mechanism's base plate. Specifically, a mounting base is provided at the bottom of the bracket to securely fix the mounting base to the equipment's frame or base using screws or other means. A universal ball joint is embedded in the mounting base to form a ball joint. One end of the connecting rod is connected to the universal ball joint, and the other end is connected to the ranging sensor. This allows adjustment of the orientation angle of the ranging sensor probes via the universal ball joint, ensuring that the probes are directly facing the reference surface on the front side of the platform mechanism. Additionally, after angle adjustment, the ranging sensors can be fixed in the target position using locking devices to prevent displacement due to vibration during operation. In addition, a high-flatness reference plate is fixedly installed on the front side of the stage mechanism as the detection surface of the deviation detection mechanism to ensure the flatness and consistency of the detection surface, thereby ensuring the detection accuracy of the distance sensor.

[0029] The deviation correction mechanism is the execution terminal of the wire EDM cutting surface orientation deviation correction system of this invention. It is responsible for converting the compensation commands calculated by the control unit into actual mechanical actions to eliminate orientation deviations during the cutting process. Further details can be found in the following sections. Figure 1 The deviation correction mechanism includes a drive motor 310, a transmission gear 320, and an arc-shaped rack 330. The arc-shaped rack 330 is disposed on the left and right sides of the base plate 100 of the stage mechanism. The transmission gear 320 meshes with the arc-shaped rack 330 fixed on both sides of the base plate 100 of the stage mechanism. The output shaft of the drive motor 310 is connected to the transmission gear 320 to drive the transmission gear 320 to rotate, thereby moving the stage mechanism. When the deviation detection mechanism detects an azimuth deviation in the stage mechanism, the control mechanism calculates the angle, direction, and displacement to be compensated based on the azimuth deviation. The control mechanism converts the calculation results into pulse signals and sends them to the drive motor 310, driving the transmission gear 320 on its output shaft to rotate by a precise angle. The transmission gear 320 meshes with the arc-shaped rack 330 fixedly connected to the left and right sides of the stage mechanism. When the transmission gear 320 rotates, it drives the arc-shaped rack 330 to produce a linear displacement along its arc trajectory, thereby causing the stage mechanism to rotate left and right along the arc trajectory, thus changing the azimuth angle of the wafer cutting surface relative to the cutting mechanism. The deviation detection mechanism immediately feeds back the adjusted position information to the control mechanism. If the deviation is not completely eliminated, the system will repeat the above steps, making multiple fine adjustments until the deviation value is within the allowable range. Through the precise combination of a stepper motor and an arc rack, the rotational motion of the processing motor is converted into the arc oscillation of the stage mechanism through gear-rack meshing, forming a real-time, dynamic closed-loop correction under the command of the control system, thereby accurately adjusting the cutting angle and ensuring the precision of wafer cutting.

[0030] In some embodiments, the output end of the drive motor 310 is connected to a synchronous transmission shaft via a reducer, and transmission gears 320 are respectively installed at both ends of the synchronous transmission shaft; arc-shaped racks 330 are fixed on the left and right sides of the platform mechanism base plate 100, and the two transmission gears 320 mesh with the corresponding arc-shaped racks 330. When the control mechanism drives the drive motor 310 to rotate, the synchronous transmission shaft drives the transmission gears 320 on both sides to rotate synchronously, thereby driving the arc-shaped racks 330 on both sides to swing the platform mechanism around its central axis, thereby correcting the orientation deviation of the cutting surface. The drive motor of this invention is a stepper motor, which can accurately convert electrical pulse signals into angular displacement, making it very suitable for scenarios requiring precise positioning. The drive motor is connected to a motor driver, which receives instructions from the control mechanism and amplifies and converts them into the current and voltage required for the drive motor to operate. As another embodiment, the operator can also manually fine-tune the operation using a handwheel pulse generator based on the data on the display screen, providing flexibility for manual intervention.

[0031] Furthermore, a micro-motion rotating chassis is provided directly below the stage mechanism. The bottom of the micro-motion rotating chassis is fixed to the frame or base of the equipment, and its upper part is fixedly connected to the bottom of the stage mechanism. When the drive motor 310 drives the transmission gear 320 to rotate, thereby rotating the arc-shaped rack 330, the stage mechanism can rotate at a small angle around the vertical axis of the micro-motion rotating chassis to accurately compensate for the orientation deviation of the cutting surface.

[0032] Furthermore, the output end of the drive motor 310 is equipped with an electromagnetic brake. When the system determines that the correction is complete and the deviation is within the allowable range, the system will lock the current position by using the brake or tightening the fixing screws to prevent the corrected position from drifting due to cutting vibration and ensure the stability of the cutting process.

[0033] Please refer to Figure 2 The present invention also provides a method for correcting the orientation deviation of the cutting surface of a wire EDM machine, which is applied to the wire EDM machine orientation deviation correction system described above, and includes the following steps:

[0034] S1. Fix the semiconductor wafer to the stage mechanism to complete the initial positioning; after the initial positioning is completed, control the stage mechanism to drive the semiconductor wafer to the dicing mechanism to dic the semiconductor wafer;

[0035] S2. During the cutting process, the control mechanism dynamically acquires the orientation deviation of the platform mechanism detected by the deviation detection mechanism.

[0036] S3. The control mechanism starts the deviation correction mechanism based on the detected orientation deviation to correct the orientation deviation of the stage mechanism in real time until the cutting is completed.

[0037] In this invention, before the dicing process begins, a deviation detection mechanism is installed on the front of the stage mechanism, and then deviation correction mechanisms are installed on the left and right sides of the stage mechanism. After installation, the semiconductor wafer is fixed to the stage mechanism, completing the initial positioning, ensuring that the deviation detection mechanism and the stage mechanism are parallel and on the same plane. After initial positioning, the stage mechanism is controlled to move the semiconductor wafer towards the dicing mechanism for dicing. During the dicing process, the control mechanism dynamically acquires the orientation deviation of the stage mechanism detected by the deviation detection mechanism. Based on the detected orientation deviation, the control mechanism activates the deviation correction mechanism to correct the orientation deviation of the stage mechanism in real time until dicing is completed. This allows for real-time detection and correction of deviations during the dicing process, avoiding batch scrap and significantly reducing production losses.

[0038] Furthermore, the deviation detection mechanism includes a left-side distance sensor 210 and a right-side distance sensor 220. The specific steps for the deviation detection mechanism to detect the orientation deviation of the stage mechanism are as follows: The detection values ​​of the left-side distance sensor 210 and the right-side distance sensor 220 are acquired respectively; the difference between the detection values ​​of the left-side distance sensor 210 and the right-side distance sensor 220 is calculated, which is the orientation deviation of the stage mechanism. During the cutting process, the stage mechanism carries the wafer in a feed motion. The left-side distance sensor 210 and the right-side distance sensor 220 continuously measure the real-time distance from the probe to the front reference surface of the stage mechanism's base plate 100 in a non-contact manner, and convert the physical distance into an analog electrical signal (such as voltage or current) and transmit it to the control mechanism. The control mechanism reads the distance values ​​of the two distance sensors in real time and calculates the difference in detection values. When the distance measured by the left-side distance sensor 210 is the same as the distance measured by the right-side distance sensor 220, the difference in detection values ​​is zero, indicating that the stage mechanism is balanced on both sides and the orientation of the cutting surface is correct without deviation. If the stage mechanism shifts left or right due to loose screws, one side of the stage mechanism's base plate 100 will move closer to the sensor on that side (distance decreases), while the other side will move further away from the sensor on that side (distance increases). At this time, a positive or negative difference in the left and right distances will appear, and this difference is a direct quantitative indicator of the deviation of the cutting surface orientation from the preset path.

[0039] Furthermore, the deviation correction mechanism includes a drive motor 310, a transmission gear 320, and an arc-shaped rack 330. The rotation angle of the output shaft of the drive motor 310 is calculated based on the difference in detected values. The drive motor 310 is controlled based on this rotation angle to correct the positional deviation. The difference in detected values ​​measured by the deviation detection mechanism serves as the preliminary basis for drive correction. The control mechanism calculates the required reverse compensation amount based on the magnitude and direction of the left-right distance difference. The control mechanism sends a command to the drive motor 310 based on the reverse compensation amount. The drive motor 310 drives the reducer and the transmission gear 320, which meshes with the arc-shaped rack 330 fixed on both sides of the platform mechanism base plate 100. The drive motor 310 rotates in the opposite direction according to the deviation direction, driving the platform mechanism to move horizontally, compensating for the offset, and restoring the distance on both sides to equilibrium. When the left and right distances are restored to equality, the correction is considered complete, and the system returns to a balanced state. The entire process does not interrupt the cutting operation; it involves cutting, measuring, and correcting simultaneously, always keeping the platform displacement within the allowable range.

[0040] In some embodiments, the left distance measuring sensor 210 and the right distance measuring sensor 220 respectively measure in real time the distances from the end faces of their probes to the reference surface on the front side of the bottom plate 100 of the stage mechanism, denoted as D1 (left distance) and D2 (right distance). Initial zero position state: D1 = D2 = D0 (for example, both are 1.00 mm), and the difference = 0. When the stage undergoes a horizontal deflection due to screw loosening, assuming that the left side of the bottom plate 100 of the stage mechanism is close to the left distance measuring sensor and the right side is far from the right distance measuring sensor, then D1 < D2, and the difference is negative, and its absolute value represents the degree of deflection. The two distance measuring sensors convert the distance values into analog electrical signals, which are sent to the analog input module of the control mechanism after being processed by the amplifier. The control mechanism converts the electrical signals into actual distance values, calculates the real-time difference, and converts the difference into the angle that the drive motor 310 needs to rotate. If the detected difference value is less than zero, indicating that the left distance < the right distance and the stage mechanism is deflected to the left, the control mechanism controls the drive motor 310 to rotate counterclockwise to correct the stage mechanism to the right; if the detected difference value is greater than zero, indicating that the left distance > the right distance and the stage mechanism is deflected to the right, the control mechanism controls the drive motor 310 to rotate clockwise to correct the stage to the left to restore it to the intermediate balance position. During the process of the drive motor 310 performing the correction, the two distance measuring sensors continue to work and update the values of D1 and D2 in real time.

[0041] After the wire EDM machine starts working, the platform mechanism will be affected by cutting force, thermal expansion and contraction, or mechanical vibration, resulting in slight tilting or up-and-down fluctuations. The left-side distance sensor 210 monitors the distance change between the left side of the platform mechanism's base plate 100 and the probe in real time; the right-side distance sensor 220 simultaneously monitors the distance change on the right side of the platform mechanism's base plate 100. The control mechanism calculates the difference between the detection values ​​of the two distance sensors in real time. If the difference is zero, it indicates that the platform mechanism's base plate 100 is horizontal and not tilted; if the difference fluctuates continuously, it indicates that the cutting surface is undergoing azimuth shift (such as tilting or rotation). Further, in step S2, the real-time difference between the detection values ​​of the left and right distance sensors is obtained and dynamically plotted into a continuous curve to determine whether the cutting process is stable. Specifically, for each cutting stroke, the control mechanism plots a continuous curve with time or cutting feed length as the abscissa and the calculated real-time difference as the ordinate. The operator only needs to observe the curve's direction and fluctuation amplitude to intuitively determine whether the cutting process is stable. Each point on the curve represents the current instantaneous deviation value (i.e., the difference in distance between the left and right sides). The control mechanism reads this curve data in real time. When the curve deviates from the "zero baseline," the control mechanism calculates the number of pulses required for compensation based on the magnitude of the deviation (Y-axis value), determines the correction direction based on the trend of the curve (rising or falling), and thus controls the drive motor 310 to perform reverse compensation. Furthermore, the curve not only reflects the current deviation but also the pattern of deviation changes, helping to predict faults. For example, a slow drift in the curve indicates that the fixing screws are gradually loosening, reminding maintenance personnel to tighten them in a timely manner. High-frequency vibration of the curve indicates that the equipment may have mechanical resonance or a sudden change in cutting force. A step jump in the curve may indicate a sudden change in material hardness or a momentary jam. This allows operators to intervene or arrange for maintenance before the deviation leads to scrap.

[0042] Based on this, the present invention addresses the problem of azimuth drift of the cutting surface caused by mechanical loosening of the stage mechanism. By setting two ranging sensors on the front side of the stage mechanism's base plate to monitor the azimuth deviation of the stage mechanism in real time, and using a control mechanism to control the drive motor-transmission gear-arc gear for closed-loop reverse compensation, online correction is achieved during the cutting process, avoiding the scrapping of the entire batch of wafers. Furthermore, the structure is simple, the modification cost is low, and it does not rely on complex vision or laser measurement systems, making it suitable for upgrading and modifying existing equipment.

[0043] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the invention. Those skilled in the art will understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A wire EDM cutting surface orientation deviation correction system, characterized in that, The system includes a platform mechanism, a deviation detection mechanism, a deviation correction mechanism, and a control mechanism. The deviation detection mechanism is located on the front side of the platform mechanism's base plate and is on the same horizontal plane as the base plate, used to detect the orientation deviation of the platform mechanism. The deviation correction mechanism is located on the left and right sides of the platform mechanism's base plate and is connected to the left and right sides of the base plate, respectively, used to control the left and right deflection of the platform mechanism's base plate. The control mechanism is electrically connected to the deviation detection mechanism and the deviation correction mechanism, respectively, used to acquire the orientation deviation of the platform mechanism detected by the deviation detection mechanism, and to activate the deviation correction mechanism based on the orientation deviation, controlling the left and right deflection of the platform mechanism's base plate to correct the orientation deviation.

2. The wire EDM cutting surface orientation deviation correction system according to claim 1, characterized in that, The deviation detection mechanism includes a left-side distance measuring sensor and a right-side distance measuring sensor; the left-side distance measuring sensor is located at the left end of the front side of the platform mechanism base plate, and the right-side distance measuring sensor is located at the right end of the front side of the platform mechanism base plate; both the left-side distance measuring sensor and the right-side distance measuring sensor are located on the same horizontal plane as the platform mechanism base plate, and the distance between the left-side distance measuring sensor and the platform mechanism base plate is the same.

3. The wire EDM cutting surface orientation deviation correction system according to claim 2, characterized in that, The left and right ranging sensors are mounted on the frame of the platform mechanism via brackets. The brackets are connected to the left and right ranging sensors via hinges to fine-tune the orientation angle of the probes of the left and right ranging sensors, ensuring that the probes are facing the detection surface of the platform mechanism's base plate.

4. The wire EDM cutting surface orientation deviation correction system according to claim 1, characterized in that, The deviation correction mechanism includes a drive motor, a transmission gear, and an arc-shaped rack; the arc-shaped rack is disposed on the left and right sides of the base plate of the platform mechanism, and the transmission gear meshes with the arc-shaped rack fixed on both sides of the base plate of the platform mechanism; the output shaft of the drive motor is connected to the transmission gear to drive the transmission gear to rotate and drive the platform mechanism to move.

5. The wire EDM cutting surface orientation deviation correction system according to claim 4, characterized in that, The output end of the drive motor is equipped with an electromagnetic brake, which is used to lock the output end of the drive motor after the calibration is completed, so as to prevent the calibrated position from drifting due to cutting vibration.

6. The wire EDM cutting surface orientation deviation correction system according to claim 1, characterized in that, A high-flatness reference plate is fixedly installed on the front side of the stage mechanism to serve as the detection surface of the deviation detection mechanism, ensuring the flatness and consistency of the detection surface.

7. A method for correcting the orientation deviation of a wire EDM cutting surface, applied to the wire EDM cutting surface orientation deviation correction system as described in any one of claims 1-6, comprising the following steps: S1. Fix the semiconductor wafer to the stage mechanism to complete the initial positioning; after the initial positioning is completed, control the stage mechanism to drive the semiconductor wafer to the dicing mechanism to dic the semiconductor wafer; S2. During the cutting process, the control mechanism dynamically acquires the orientation deviation of the platform mechanism detected by the deviation detection mechanism. S3. The control mechanism starts the deviation correction mechanism based on the detected orientation deviation to correct the orientation deviation of the stage mechanism in real time until the cutting is completed.

8. The method for correcting the orientation deviation of the cutting surface of a wire EDM machine according to claim 7, characterized in that, The deviation detection mechanism includes a left-side ranging sensor and a right-side ranging sensor. The specific steps for the deviation detection mechanism to detect the orientation deviation of the platform mechanism are as follows: obtain the detection values ​​of the left-side ranging sensor and the right-side ranging sensor respectively; calculate the difference between the detection values ​​of the left-side ranging sensor and the right-side ranging sensor, which is the orientation deviation of the platform mechanism.

9. The method for correcting the orientation deviation of the cutting surface of a wire EDM machine according to claim 8, characterized in that, The deviation correction mechanism includes a drive motor, a transmission gear, and an arc-shaped rack; the rotation angle of the output shaft of the drive motor is calculated based on the difference in the detected values, and the drive motor is controlled based on the rotation angle to correct the positional deviation.

10. The method for correcting the orientation deviation of the cutting surface of a wire EDM machine according to claim 9, characterized in that, In step S2, the real-time detection value difference between the left and right ranging sensors is obtained, and the points are dynamically plotted to form a continuous curve to determine whether the cutting process is stable.

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