A molding apparatus and molding method for producing sealing rings

Abstract

This invention relates to the field of sealing ring production technology, and discloses a molding apparatus and molding method for sealing ring production. The apparatus includes a mold base, on which a cooling assembly is provided. The cooling assembly includes an annular cooling pipe disposed in the middle of the inner cavity of the mold base. Multiple S-shaped cooling pipes connected to the annular cooling pipe are disposed in the inner cavity of the mold base. One end of each S-shaped cooling pipe on the same side is connected to a branch pipe, and one end of the branch pipe is connected to a circulating water tank. A main pipe connected to the annular cooling pipe is disposed at the upper end of the circulating water tank. A heat dissipation plate is disposed at the bottom of the mold base, and one end of the heat dissipation plate is provided with heat dissipation fins. This invention achieves simultaneous injection molding of sealing rings in multiple cavities through the coordinated operation of the cooling assembly, heat dissipation assembly, and vacuum assembly. By utilizing gradient cooling and a composite heat dissipation structure, the molding cycle is effectively shortened, molding defects such as bubbles and uneven shrinkage are avoided, ensuring stable dimensions and dense structure of the sealing ring, and improving the consistency and quality of mass production.

Description

Technical Field

[0001] This invention relates to the field of sealing ring production technology, specifically to a molding apparatus and molding method for sealing ring production. Background Technology

[0002] In the field of sealing ring production, injection molding is the most widely used processing method. Its core relies on the cavity structure of the molding device to complete the shaping and curing of the sealing ring. The sealing rings produced are widely used in industries with stringent sealing performance requirements, such as automobiles, chemicals, and medical devices.

[0003] In traditional molding equipment, a single cooling pipe is insufficient to achieve uniform heat dissipation across the entire mold base, leading to severe heat accumulation in the center and a significant temperature difference with the edges. Simultaneously, an inadequate cavity venting structure prevents timely expulsion of air and volatile plastic gases from the cavity, further exacerbating gas retention due to uneven heat dissipation. The combined effect of these two factors not only causes dimensional inaccuracies such as uneven shrinkage and warping during sealing ring molding, but also generates air bubbles on the surface and inside the sealing ring, disrupting the product's structural continuity, reducing its sealing performance and mechanical strength. In severe cases, this can lead to premature tearing and leakage of the sealing ring during use, ultimately causing equipment malfunctions.

[0004] According to actual test data from the sealing ring manufacturing industry, when using traditional molding equipment, the overall product failure rate reaches 16.8% due to the combined effects of uneven heat dissipation in the middle of the mold base and gas retention in the cavity. Among them, 91% of the defects are dimensional deviations and air bubbles caused by the combined effect of the two. Even among qualified products, 32% still have slight dimensional deviations and micro-air bubbles. The probability of sealing failure of such qualified products under high pressure and high temperature conditions is 24%.

[0005] To address this, the applicant proposes a molding apparatus and method for producing sealing rings, aiming to solve the combined problems of uneven heat dissipation in the middle of the mold base and gas retention in the mold cavity, thereby improving the production quality and reliability of sealing rings. Summary of the Invention

[0006] The purpose of this invention is to provide a molding apparatus and method for producing sealing rings, solving the following technical problems: In traditional molding apparatuses, a single cooling pipe is insufficient to achieve uniform heat dissipation across the entire mold base, leading to severe heat accumulation in the center of the mold base and a significant temperature difference with the edge areas. Simultaneously, an imperfect cavity venting structure prevents timely exhaust of air and volatile plastic gases from the cavity, and uneven heat dissipation further exacerbates gas retention. The combined effect of these two factors not only causes dimensional inaccuracies such as uneven shrinkage and warping during sealing ring molding, but also generates air bubbles on the surface and inside of the sealing ring, disrupting the product's structural continuity, reducing its sealing performance and mechanical strength, and in severe cases, causing premature tearing and leakage during use, leading to equipment malfunctions.

[0007] The objective of this invention can be achieved through the following technical solutions: A molding apparatus for producing sealing rings includes a cavity plate, the cavity plate including a mold base, the upper surface of the mold base having a plurality of molding grooves linearly arranged thereon, and a cooling assembly being provided on the mold base; The cooling assembly includes an annular cooling pipe disposed in the middle of the inner cavity of the mold base. The inner cavity of the mold base is provided with a plurality of S-shaped cooling pipes connected to the annular cooling pipe. One end of the S-shaped cooling pipes on the same side is connected to the same branch pipe. One end of the branch pipe is connected to a circulating water tank. The upper end of the circulating water tank is provided with a main pipe connected to the annular cooling pipe. The bottom of the mold base is symmetrically provided with heat dissipation grooves, and a heat dissipation plate is provided inside the heat dissipation grooves. One end of the heat dissipation plate is provided with heat dissipation fins.

[0008] As a further aspect of the present invention: multiple heat-conducting holes are linearly arrayed on both sides of the heat dissipation groove, and heat-conducting columns are provided inside the heat-conducting holes; One end of each of the multiple heat-conducting pillars extends into the heat dissipation groove and connects to the heat dissipation plate.

[0009] As a further aspect of the present invention: a cooling liquid storage tank is provided in the groove at the bottom of the mold base, and a cooling pump is provided on the cooling liquid storage tank; The bottom of the mold base is provided with a U-shaped tube, and the two sides of the U-shaped tube are respectively placed in the corresponding heat dissipation grooves, and the two ends are respectively connected to the cooling pump and the refrigeration liquid tank.

[0010] As a further aspect of the present invention: the bottom end of the mold base is provided with multiple mounting slots, and each of the multiple mounting slots is provided with a cooling fan.

[0011] As a further aspect of the present invention, a flow channel is provided between two adjacent forming grooves.

[0012] As a further aspect of the present invention: a vacuum pumping assembly is provided on the mold base; The vacuum assembly includes vacuum channels symmetrically formed in the inner cavity of the mold base. One side of each of the multiple forming grooves on the side is provided with a negative pressure drainage channel that communicates with the vacuum channels. One end of the vacuum channels is connected to a vacuum pump via a conduit.

[0013] As a further aspect of the present invention: symmetrical sliding grooves are provided in the inner cavity of the mold base, and a sliding plate is slidably arranged inside the sliding grooves, and multiple docking holes are linearly arrayed on the sliding plate; Each of the aforementioned docking holes corresponds to a plurality of negative pressure drainage channels.

[0014] As a further aspect of the present invention: a telescopic cylinder is provided at the bottom end of the mold base, and the output shaft of the telescopic cylinder is connected to the two sliding plates through a support rod.

[0015] As a further aspect of the present invention: a first annular main groove is provided in the middle of the inner cavity of the mold base, and a plurality of S-shaped side grooves communicating with the first annular main groove are provided in the inner cavity of the mold base. The annular cooling pipe and the plurality of S-shaped cooling pipes are respectively arranged in the first annular main groove and the plurality of S-shaped side grooves.

[0016] A molding method for producing sealing rings, using the aforementioned molding apparatus for producing sealing rings, comprises the following steps: S1. Mold Closure and Positioning: The upper cavity plate and the lower cavity plate are precisely aligned and locked in place by positioning guide pillars, so that the molding grooves of the upper and lower molds are aligned to form a complete and sealed molding cavity. S2, Injection feeding: Molten material is injected into the molding cavity through the injection molding equipment and then guided into each molding tank through the distribution channel; S3, Gradient Cooling: Start the cooling system and introduce cooling water into the annular cooling pipe. Adjust the water temperature according to the gradient and work with the heat dissipation system to cool the mold base and the molded parts. S4. Demolding and Part Removal: After the material has completely solidified, release the mold, separate the cavity plate, and remove the formed sealing ring to complete a single production cycle.

[0017] The beneficial effects of this invention are: (1) The present invention forms a composite heat dissipation system by setting up a cooling component that connects an annular cooling pipe and multiple sets of S-shaped cooling pipes, and cooperating with the heat dissipation component at the bottom of the mold base. This effectively expands the heat exchange contact area, extends the flow path of the cooling medium, eliminates heat accumulation in the middle of the mold base, makes the temperature of the entire mold base uniform, avoids dimensional accuracy defects such as uneven shrinkage and warping of the sealing ring due to uneven heat dissipation, and ensures that the product has a regular shape and stable dimensions. (2) The present invention can quickly extract air and plastic volatile gases inside the cavity through the vacuum pump, vacuum channel and switchable sliding plate structure of the vacuum assembly, while avoiding backflow of the colloid during injection molding, reducing the generation of air bubbles on the surface and inside of the sealing ring from the source, ensuring the product structure is dense, improving sealing performance and mechanical strength, and reducing the risk of tearing and leakage during use. (3) The cooling component and heat dissipation component of the present invention work together to achieve gradient cooling, effectively shortening the sealing ring molding cycle. At the same time, the multi-molding groove and diversion channel design realizes multi-cavity synchronous injection molding. Vacuuming and cooling heat dissipation work together to ensure the uniform molding quality of products in each cavity, greatly reducing the product defect rate, improving the stability and production efficiency of mass production, and meeting the stringent requirements of high-end industries for sealing rings.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the cooling component of the present invention; Figure 3 This is a schematic diagram of the heat dissipation component of the present invention; Figure 4 This is a partial structural schematic diagram of the heat dissipation component of the present invention; Figure 5 This is a side view of the overall structure of the present invention; Figure 6 This is a schematic diagram of the first part of the vacuum pumping assembly of the present invention; Figure 7 This is a schematic diagram of the second part of the vacuum pumping assembly of the present invention; Figure 8 This is the present invention. Figure 6 A magnified structural diagram of point A in the middle.

[0021] In the diagram: 101, mold base; 102, forming groove; 103, flow channel; 200, cooling assembly; 201, first annular main groove; 202, S-shaped side groove; 203, annular cooling pipe; 204, S-shaped cooling pipe; 205, flow channel; 206, circulating water tank; 207, main flow channel; 300, heat dissipation assembly; 301, heat dissipation groove; 302, heat conduction hole; 303, heat conduction column; 304, heat dissipation plate; 305, heat dissipation fins; 306, cooling liquid storage tank; 307, cooling pump; 308, U-shaped pipe; 309, mounting groove; 310, cooling fan; 400, vacuum assembly; 401, vacuum flow channel; 402, negative pressure drainage channel; 403, sliding groove; 404, sliding plate; 405, docking hole; 406, telescopic cylinder; 407, vacuum pump. Detailed Implementation

[0022] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar symbols denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] Example 1 Please see Figure 1 As shown, a molding device for producing sealing rings includes a cavity plate 100, which is divided into an upper cavity plate and a lower cavity plate. The two have similar structures. The upper cavity plate and the lower cavity plate are connected by positioning guide posts and guide sleeves to achieve circumferential limiting and precise alignment. At the same time, the plate surface fitting stop structure is used to fit and match each other. After the mold is closed, the two cavity plates are pressed tightly together by the mold clamping pressure of the equipment to eliminate the gap between the plates and ensure that the molding cavity is tightly closed. This not only prevents the glue from overflowing and leaking during the injection molding process, but also ensures the stable cooperation of the cooling and venting structure.

[0025] Further, please refer to Figure 1As shown, the cavity plate 100 includes a mold base 101. Multiple sets of molding grooves 102 are linearly arrayed on the upper surface of the mold base 101. The molding grooves 102 are annular. The molding grooves 102 on the upper and lower cavity plates 101 are tightly fitted to form a sealing ring molding cavity. A transversely arranged diversion channel 103 is provided between adjacent molding grooves 102. The diversion channel 103 is sequentially connected to each set of annular molding grooves 102 for conveying molten material, so that the rubber material is evenly distributed to the interior of each molding cavity, realizing multi-cavity synchronous feeding injection molding.

[0026] Further, please refer to Figure 1 As shown, the upper cavity plate has multiple main channels along its length in the mold base 101. Injection inlets are reserved at both ends or in the middle of the main channels. The main channels are connected end-to-end to each branch channel 103 to form a continuous feeding path. The feeding end of the main channel is connected to the injection molding device of an injection molding machine. This injection feeding structure and injection pressure feeding method are existing mature technologies and will not be elaborated upon here. After the molten material is injected into the main channel through the injection port, it is transported laterally along the main channel and then diverted through each branch channel 103 into the interior of each set of annular molding grooves 102. The overall layout is compact and orderly, ensuring balanced feeding and synchronous filling of multiple cavities, and improving the consistency of batch molding of sealing rings.

[0027] Example 2 Please see Figure 2 , Figure 5 As shown, a cooling assembly 200 is provided on the mold base 101. The cooling assembly 200 is used for gradient cooling of the injection-molded sealing ring. The cooling assembly 200 uses a circulating cooling water channel arranged inside the mold base 101 to continuously circulate the cooling medium and remove the heat generated during the molding process of the mold and the product. This quickly reduces the temperature of the colloid inside the cavity and allows it to solidify rapidly, effectively shortening the molding cooling cycle. It prevents the sealing ring from generating bubbles, uneven shrinkage, and deformation defects due to localized heat accumulation, ensuring the stability of the sealing ring's dimensions and its dense structure, and significantly improving product molding quality and production efficiency. The cooling assembly 200 includes a first annular main groove 201 formed in the middle of the inner cavity of the mold base 101. Multiple S-shaped side grooves 202 are formed in the inner cavity of the mold base 101, and all of the multiple S-shaped side grooves 202 are connected to the first annular main groove 201. The first annular main groove 201 is equipped with an annular cooling pipe 203. Multiple S-shaped side grooves 202 are equipped with S-shaped cooling pipes 204 connected to the annular cooling pipes 203. One end of the S-shaped cooling pipes 204 on the same side is connected to the same branch pipe 205. The bottom end of the mold base 101 is equipped with a support frame. One end of the branch pipe 205 is connected to a circulating water tank 206. The circulating water tank 206 is mounted on the support frame. The upper end of the circulating water tank 206 is equipped with a pump body. One end of the pump body is connected to a main flow pipe 207. The end of the main flow pipe 207 away from the pump body is connected to the annular cooling pipe 203.

[0028] The circulating water tank 206, in conjunction with the upper pump body, provides circulation power. The cooling medium is transported to the annular cooling pipe 203 through the main pipe 207, and then diverted into each S-shaped cooling pipe 204. Finally, it flows back to the circulating water tank 206 through the diversion pipe 205 to complete the closed circulation, continuously removing the injection heat from the mold base 101 and the molding groove 102. By arranging multiple sets of S-shaped cooling pipes 204, the flow path of the cooling medium can be effectively extended, the heat dissipation contact area of ​​the mold can be increased, and the heat dissipation of the sealing ring molding area can be fully covered. This improves the limitations of single water cooling, avoids heat accumulation in the middle and local areas of the mold, achieves gradient uniform cooling, reduces defects such as bubbles and shrinkage deformation, and accelerates the overall cooling rate, shortens the molding cycle, and improves the molding consistency and product quality of the sealing ring in mass production.

[0029] Example 3 The cooling component 200 continuously removes the molding heat generated by the mold base 101 during the injection molding of the sealing ring, achieving basic cooling. However, the cooling water continuously absorbs heat and heats up during its flow through the pipeline. Furthermore, the fluid flow is obstructed and the heat exchange efficiency decreases at the bend of the S-shaped cooling pipe 204, which can easily cause localized heat accumulation and excessive cooling temperature differences inside the S-shaped side groove 202, affecting the product's shaping effect. To further enhance the overall heat dissipation capacity, eliminate localized high-temperature dead zones, achieve uniform cooling across the entire area, effectively improve sealing ring molding defects, and enhance finished product quality and production stability, the following measures are implemented.

[0030] Please see Figure 3 , Figure 4 As shown, heat dissipation components 300 are symmetrically arranged at the bottom of the mold base 101, forming a composite heat dissipation structure with the cooling component 200. The heat dissipation component 300 includes a heat dissipation groove 301 formed at the bottom of the mold base 101. Multiple heat conduction holes 302 connected to S-shaped side grooves 202 are linearly arrayed on both sides of the heat dissipation groove 301. Heat conduction pillars 303 are arranged inside the heat conduction holes 302. One end of the multiple heat conduction pillars 303 is connected to the same heat dissipation plate 304 within the heat dissipation groove 301. One end of the heat dissipation plate 304 is provided with heat dissipation fins 305. A cooling liquid storage tank 306 is arranged in the groove at the bottom of the mold base 101. A cooling pump 307 is arranged on the cooling liquid storage tank 306. A U-shaped tube 308 is arranged at the bottom of the mold base 101. Both sides of the U-shaped tube 308 are placed in the heat dissipation groove 301. One end of the U-shaped tube 308 is connected to the cooling pump 307, and the other end is connected to the cooling liquid storage tank 306.

[0031] The localized high temperature accumulated in the S-shaped side groove 202 inside the mold base 101 can be quickly conducted to the heat dissipation plate 304 in the heat dissipation groove 301 through the heat conduction column 303, and cooperate with the heat dissipation fins 305 to expand the heat dissipation contact area to achieve initial heat dissipation. At the same time, the low-temperature coolant inside the cooling liquid tank 306 circulates along the U-shaped tube 308 driven by the cooling pump 307. The U-shaped tube 308 is arranged close to the inside of the heat dissipation groove 301, which can continuously exchange heat and cool down the heat dissipation plate 304 and the surrounding structure, thereby quickly removing the localized residual heat accumulated in the mold. It works together with the cooling component 200 to form a composite heat dissipation system, effectively solving the problems of insufficient heat dissipation and excessively high local temperature in the bending area of ​​the S-shaped cooling pipe 204, ensuring that the overall temperature of the mold is uniform and stable, thereby improving the overall molding quality of the sealing ring.

[0032] Further, please refer to Figure 1 As shown, the bottom of the mold base 101 is provided with multiple mounting slots 309, and each mounting slot 309 is equipped with a cooling fan 310.

[0033] Example 4 Please see Figures 5-8 As shown, the mold base 101 is equipped with a vacuum component 400, which pre-extracts the air and plastic volatile gases trapped inside the molding cavity to avoid air entrapment and the generation of bubbles and molding defects. At the same time, it reduces the gas insulation resistance. The auxiliary cooling component 200 and the heat dissipation component 300 can quickly exchange heat and cool down. The three work together to achieve cavity degassing and uniform temperature control, and jointly improve the molding quality and shaping efficiency of the sealing ring.

[0034] The vacuum assembly 400 includes vacuum channels 401 symmetrically formed in the inner cavity of the mold base 101. Each of the multiple forming grooves 102 on one side has a negative pressure drainage channel 402 communicating with the vacuum channels 401. A sliding groove 403 is symmetrically formed in the inner cavity of the mold base 101, located between the vacuum channels 401 and the forming grooves 102, and extending through the multiple negative pressure drainage channels 402. A sliding plate 404 is slidably disposed inside the sliding groove 403, closely fitting and sliding within it. Multiple docking holes 405 are linearly arrayed on the sliding plate 404, each corresponding to one of the multiple negative pressure drainage channels 402. A telescopic cylinder 406 is located at the bottom of the mold base 101, and its output shaft is connected to two sliding plates 404 via a support rod. One end of the vacuum channel 401 is connected to a vacuum pump 407 via a conduit.

[0035] Vacuum pump 407 generates negative pressure through vacuum channel 401. Telescopic cylinder 406 drives sliding plate 404 to slide in sliding groove 403, so that the docking hole 405 on sliding plate 404 is aligned with negative pressure drainage channel 402. At this time, the air in each molding groove 102 flows into vacuum channel 401 through negative pressure drainage channel 402 and is extracted by vacuum pump 407, completing the evacuation operation inside the cavity. After the vacuum is completed, the cylinder drives sliding plate 404 to continue to move, and the solid area of ​​sliding plate 404 blocks and isolates negative pressure drainage channel 402, closing the evacuation passage in time to prevent the colloid from flowing back into the vacuum channel during injection molding. In conjunction with the cooling and heat dissipation structure, the cavity environment is stabilized, ensuring the injection molding quality of the sealing ring.

[0036] Example 5 Please see Figures 1-8 As shown, combining the annular main pipe and S-shaped cooling branch of the cooling component 200, the core operation of gradient injection of cooling water is to control the temperature and flow rate of the cooling medium in stages, rather than injecting cold water throughout the entire process. In the initial stage of mold closing and injection molding, medium-temperature cooling water of 30-40℃ is injected into the annular cooling pipe 203 and the S-shaped cooling branch, which, together with the heat dissipation fins 305, performs preliminary cooling to avoid the low-temperature cold water directly impacting the high-temperature rubber material and causing molding defects. At the same time, it provides a stable temperature environment for the filling of the rubber material and ensures uniform feeding.

[0037] Second section (gradient cooling process steps): Specific process steps for gradient injection of cooling water: The first step is to inject medium-temperature cooling water (30-40℃) during the initial injection molding process to ensure that the molten rubber fills the mold cavity smoothly and avoids uneven solidification due to excessive temperature difference. The second step is to gradually reduce the cooling water temperature to 15-25℃ after the rubber is filled and increase the circulation flow rate to focus on cooling the mold cavity and surrounding areas. At this time, the S-shaped cooling pipe 204 and the heat dissipation component 300 work together to achieve initial shaping. The third step is to finely adjust the cooling water temperature to 10-15℃ according to the molding status of the sealing ring and continue to circulate until the product is completely shaped. Throughout the process, the circulation system of the cooling component 200 is used to ensure uniform cooling.

[0038] The third section describes the gradient injection of cooling water, which requires coordination with cooling component 200 and heat dissipation component 300. During operation, the water temperature and flow rate must be dynamically adjusted based on the mold base temperature and the solidification progress of the rubber compound to avoid excessive temperature differences in the mold and uneven shrinkage of the rubber compound caused by injecting cold water all at once. This method not only solves the molding defects easily caused by single cold water injection but also improves cooling efficiency in conjunction with heat dissipation component 300, while reducing energy consumption. It is compatible with the overall molding process, further ensuring the molding accuracy of the sealing ring and product consistency.

[0039] A molding method for producing sealing rings includes the following steps: S1. Mold Closure and Positioning: The upper cavity plate and the lower cavity plate are precisely aligned and locked in place by positioning guide pillars, so that the molding grooves 102 of the upper and lower molds are aligned to form a complete and sealed molding cavity. S2, Injection feeding: Molten material is injected into the molding cavity through the injection molding equipment, and then guided into each molding groove 102 through the diversion channel 103 to ensure that the material fills all molding areas; S3, Gradient cooling: Start the cooling component 200, introduce cooling water into the annular cooling pipe 203, adjust the water temperature according to the gradient, and cooperate with the heat dissipation component 300 to cool down the mold base 101 and the molded part. S4. Demolding and Part Removal: After the material has completely solidified, release the mold, separate the cavity plate, and remove the formed sealing ring to complete a single production cycle.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A molding apparatus for producing sealing rings, comprising a cavity plate (100), the cavity plate (100) including a mold base (101), wherein a plurality of molding grooves (102) are linearly arrayed on the upper surface of the mold base (101), characterized in that, A cooling assembly (200) is provided on the mold base (101); The cooling assembly (200) includes an annular cooling pipe (203) disposed in the middle of the cavity of the mold base (101). The cavity of the mold base (101) is provided with a plurality of S-shaped cooling pipes (204) connected to the annular cooling pipe (203). One end of the S-shaped cooling pipe (204) on the same side is connected to the same branch pipe (205). One end of the branch pipe (205) is connected to a circulating water tank (206). The upper end of the circulating water tank (206) is provided with a main pipe (207) connected to the annular cooling pipe (203). The bottom end of the mold base (101) is symmetrically provided with heat dissipation grooves (301), and a heat dissipation plate (304) is provided inside the heat dissipation grooves (301). One end of the heat dissipation plate (304) is provided with heat dissipation fins (305).

2. The molding apparatus for producing sealing rings according to claim 1, characterized in that, Multiple heat-conducting holes (302) are linearly arrayed on both sides of the heat dissipation groove (301), and heat-conducting columns (303) are provided inside the heat-conducting holes (302). One end of each of the multiple heat-conducting pillars (303) extends into the heat dissipation groove (301) and connects to the heat dissipation plate (304).

3. The molding apparatus for producing sealing rings according to claim 1, characterized in that, A cooling liquid storage tank (306) is provided in the slot at the bottom of the mold base (101), and a cooling pump (307) is provided on the cooling liquid storage tank (306). The bottom end of the mold base (101) is provided with a U-shaped tube (308), and the two sides of the U-shaped tube (308) are respectively placed in the corresponding heat dissipation groove (301), and the two ends are respectively connected to the cooling pump (307) and the refrigeration liquid tank (306).

4. A molding apparatus for producing sealing rings according to claim 1, characterized in that, The bottom end of the mold base (101) is provided with multiple mounting slots (309), and each of the multiple mounting slots (309) is provided with a cooling fan (310).

5. A molding apparatus for producing sealing rings according to claim 1, characterized in that, A flow channel (103) is provided between two adjacent forming grooves (102).

6. A molding apparatus for producing sealing rings according to claim 1, characterized in that, The mold base (101) is provided with a vacuum pumping assembly (400). The vacuum assembly (400) includes vacuum channels (401) symmetrically opened in the cavity of the mold base (101), and a negative pressure drainage channel (402) connected to the vacuum channel (401) is opened on one side of each of the multiple molding grooves (102) on the side. One end of the vacuum channel (401) is connected to a vacuum pump (407) through a conduit.

7. A molding apparatus for producing sealing rings according to claim 1, characterized in that, The mold base (101) has symmetrical sliding grooves (403) in its inner cavity. A sliding plate (404) is slidably arranged inside the sliding groove (403). Multiple docking holes (405) are linearly arrayed on the sliding plate (404). Each of the aforementioned docking holes (405) corresponds to a plurality of negative pressure drainage channels (402).

8. A molding apparatus for producing sealing rings according to claim 7, characterized in that, The bottom end of the mold base (101) is provided with a telescopic cylinder (406), and the output shaft of the telescopic cylinder (406) is connected to the two sliding plates (404) through a support rod.

9. A molding apparatus for producing sealing rings according to claim 1, characterized in that, The mold base (101) has a first annular main groove (201) in the middle of its inner cavity, and a plurality of S-shaped side grooves (202) connected to the first annular main groove (201) are provided in the inner cavity of the mold base (101). The annular cooling pipe (203) and the plurality of S-shaped cooling pipes (204) are respectively disposed in the first annular main groove (201) and the plurality of S-shaped side grooves (202).

10. A molding method for producing sealing rings, using a molding apparatus for producing sealing rings as described in any one of claims 1-9, characterized in that, The specific steps are as follows: S1. Mold closing and positioning: The upper cavity plate and the lower cavity plate are precisely aligned and locked by positioning guide pins to make the molding grooves (102) of the upper and lower molds aligned to form a complete and sealed molding cavity. S2, Injection feeding: Molten material is injected into the molding cavity through the injection molding equipment and introduced into each molding groove (102) through the diversion channel (103). S3, Gradient cooling: Start the cooling component (200), introduce cooling water into the annular cooling pipe (203), adjust the water temperature according to the gradient, and cooperate with the heat dissipation component (300) to cool down the mold base (101) and the molded part; S4. Demolding and Part Removal: After the material has completely solidified, release the mold, separate the cavity plate, and remove the formed sealing ring to complete a single production cycle.

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