Getter encapsulation structure, getter processing equipment, and getter preparation method

Abstract

Embodiments of the present invention provide a getter encapsulation structure, getter processing equipment, and getter preparation method. The getter encapsulation structure includes: a shell structure comprising an integrally formed outer edge and a recessed portion within the outer edge, the recessed portion extending in a first direction and having a receiving cavity for accommodating the getter; and a cover plate structure disposed on one side of the shell structure in the first direction, and the cover plate structure being sealed to the outer edge. The stable temperature of the getter is higher than the sealing annealing temperature of the shell structure and the outer edge. In the technical solution of the present invention, through the structure and sealing method of the shell structure and cover plate structure, good sealing performance and convenient processing performance are achieved, improving production efficiency while avoiding the limitations of complex materials and high costs in traditional processes.

Description

Technical Field

[0001] This invention relates to the field of getter preparation technology, and more specifically, to a getter encapsulation structure, getter processing equipment, and getter preparation method. Background Technology

[0002] Currently, in scenarios where a high degree of vacuum is required, getters are typically used to maintain pressure. The manufacturing process of these getters usually utilizes a sealable casing. Related technologies typically employ metal materials for the sealable casing. However, due to the stringent requirements for both the casing and the sealing material, the shape of the sealable casing is often quite complex, reducing production efficiency. Summary of the Invention

[0003] The present invention aims to at least solve the technical problems of complex getter encapsulation structures and low production efficiency in the prior art or related technologies.

[0004] In view of this, an embodiment of the first aspect of the present invention provides a getter encapsulation structure.

[0005] A second aspect of the present invention provides a getter processing apparatus.

[0006] A third aspect of the present invention provides a method for preparing a getter.

[0007] To achieve the above objectives, embodiments of the present invention provide a getter encapsulation structure, comprising: a shell structure, the shell structure including an integrally formed outer edge and a recessed portion disposed within the outer edge, the recessed portion extending toward a first direction, and a receiving cavity for accommodating the getter formed within the recessed portion; and a cover plate structure disposed on one side of the shell structure in the first direction, and the cover plate structure being sealed to the outer edge; wherein the stable temperature of the getter is higher than the sealing annealing temperature of the shell structure and the outer edge.

[0008] The getter encapsulation structure proposed in this invention provides a highly efficient and reliable encapsulation method for improving and maintaining the vacuum level of a vacuum environment over a long period. This solution achieves excellent sealing performance and convenient processing capabilities through the structure of the outer shell and cover plate, thereby improving production efficiency while avoiding the limitations of complex materials and high costs associated with traditional processes.

[0009] Specifically, the getter encapsulation structure comprises two parts: an outer shell structure and a cover structure. The outer shell structure includes an outer edge and a recessed section. The outer edge is the peripheral extension of the outer shell, while the recessed section is located inside the outer edge, extending in a first direction (usually downwards) to form a receiving cavity. The receiving cavity formed within the recessed section is used to fix and protect the getter, ensuring its gettering function in a sealed environment. The outer edge provides sufficient contact area for the installation and sealing of the cover structure, ensuring a tight seal.

[0010] It should be emphasized that the outer shell structure is molded in one piece, which reduces complex processing steps and improves production efficiency.

[0011] It is important to emphasize that in this solution, by limiting the stable temperature of the getter to be significantly higher than the annealing temperature of the outer shell and cover structure, the getter does not decompose or melt due to high temperatures during the encapsulation process, thus maintaining its gettering performance. Furthermore, the annealing process softens the material, improving its plastic deformation capacity and facilitating mechanical compression during sealing. This allows the cover structure and the outer edge to be compressed into a single, sealed outer shell.

[0012] In some technical solutions, the cover plate structure can optionally be flat, and the shape of the cover plate structure can be adapted to the shape of the outer edge.

[0013] In this technical solution, the cover plate structure is a regular flat plate shape. The flat plate design ensures good flatness, providing a basis for uniform contact during the sealing process. In addition, the shape of the cover plate structure matches the shape of the outer edge, and can be rectangular or circular. That is, the edge size and shape of the cover plate structure are designed according to the outer contour of the outer edge, fitting it perfectly to maximize the contact area and improve the sealing effect. At the same time, it avoids gaps or sealing defects caused by shape deviations, so that the boundary between the cover plate and the outer edge is completely aligned, and an integrated seal is formed through mechanical pressure and high temperature treatment.

[0014] Because the cover plate has a flat, flat surface that is in contact with the outer edge, it ensures a consistent distribution of sealing strength and makes it less prone to leaks.

[0015] In some technical solutions, optionally, the surface of the outer edge facing the cover structure is a plane, and the surface of the cover structure facing the outer shell structure is a plane.

[0016] In this technical solution, the surfaces of the outer edge and the cover plate structure are defined as planes, so that the two planes are in contact, providing a large contact area for the entire structure and enhancing the overall mechanical strength. During the extrusion process, the two planes are directly combined into an integrated sealing structure by mechanical force, avoiding leakage that may be caused by point contact or line contact.

[0017] In some technical solutions, optionally, the projection of the trough portion onto the plane where the outer edge portion is located is rectangular or circular; and / or the projection of the outer edge of the outer edge portion onto the plane where the outer edge portion is located is rectangular or circular.

[0018] In this technical solution, the contour shapes of the sink and the outer edge are defined. Specifically, the sink is projected in a rectangular or circular shape on the plane where the outer edge is located, and the outer edge of the outer edge is projected in a rectangular or circular shape on the plane where the outer edge is located.

[0019] The rectangular design is suitable for packaging scenarios where the getter has a regular shape (such as sheet or block), making full use of internal space, facilitating positioning and stacking, and is suitable for various industrial applications. The circular design avoids stress concentration in sharp corner areas, improving overall airtightness. At the same time, the circular structure is easy to form through rotational machining during the manufacturing process, making it suitable for high-precision processing.

[0020] In some technical solutions, optionally, the outer shell structure and cover plate structure are made of copper.

[0021] In this technical solution, both the outer shell structure and the cover plate structure are made of copper. As those skilled in the art should know, copper has a high thermal conductivity, enabling it to quickly conduct heat. In getter encapsulation, thermal conductivity helps to ensure a uniform temperature distribution of the getter, thereby improving its adsorption performance and lifespan. Especially during high-temperature annealing or sealing processes, copper can achieve thermal equilibrium more quickly, avoiding thermal stress concentration.

[0022] In some technical solutions, optionally, the first direction is the direction of gravity, and the outer shell structure is located below the cover plate structure in the direction of gravity.

[0023] In this technical solution, the first direction is defined as the direction of gravity, and the outer shell structure is located below the cover plate structure in the direction of gravity. As the main structure for containing the getter, the outer shell structure is located below the cover plate structure, which can effectively utilize the effect of gravity to ensure that the getter is stably placed in the containment cavity and avoid displacement of the getter due to vibration or external force.

[0024] In some technical solutions, optionally, the wall thickness of the outer shell structure is the same as the wall thickness of the cover plate structure; wherein, the wall thickness of the cover plate structure is less than 1 mm.

[0025] In this technical solution, limiting the wall thickness of the outer shell structure and the cover plate structure to be the same helps to simplify the processing technology. Whether it is stamping, cutting, welding or annealing, the processing can be completed through unified molds and process parameters, thereby improving production efficiency and reducing manufacturing costs.

[0026] By limiting the wall thickness to less than 1 mm, the overall weight of the packaging structure can be reduced, making it suitable for applications with stringent lightweight requirements, such as aerospace equipment or portable getter devices. Simultaneously, the thinner wall thickness reduces the heat transfer path, and combined with the high thermal conductivity of copper, heat can be quickly conducted to the entire structure, thereby improving the activation efficiency of the getter.

[0027] A second aspect of the present invention provides a getter processing apparatus, comprising: a first mold having a shell structure having a plurality of the above-described getter encapsulation structures; and a second mold having a cover plate structure having a plurality of the above-described getter encapsulation structures.

[0028] This solution mainly comprises two main molds: a first mold and a second mold, used for processing the outer shell and cover structure of the getter encapsulation structure, respectively. The first and second molds are independently designed for separate processing of the outer shell and cover structure. Each mold can accommodate multiple encapsulation units, enabling mass production and improving efficiency. Specifically, the first mold, serving as the outer shell structure mold, contains multiple shell structure forming units. The units can be arranged in a matrix to fully utilize the mold area. Each unit includes a deep-drawing mold for the groove section and a forming mold for the outer edge section, ensuring the depth and flatness of the structure's outer edge.

[0029] The second mold, serving as the mold for the cover plate structure, has multiple forming units for the cover plate structure, with a layout design corresponding to the first mold. Furthermore, the second mold may include cutting or stamping structures for trimming the edges of the cover plate structure to ensure a sealing fit between the cover plate and the outer edge. With the help of the getter processing equipment, multiple outer shell structures and cover plate structures can be processed simultaneously in a single molding operation, significantly improving production efficiency and making it suitable for industrial production.

[0030] In some technical solutions, optionally, the first mold is provided with a plurality of first receiving grooves, and the plurality of first receiving grooves are arranged in an array; the second mold is provided with a plurality of mounting positions, and the plurality of mounting positions are arranged corresponding to the first receiving grooves; wherein, the first receiving groove is provided with a cover plate structure, and the mounting position is provided with a cover plate structure.

[0031] In this technical solution, the first mold is provided with multiple first receiving slots, which are arranged in an array (such as a matrix) to optimize the utilization rate of the mold area. A shell structure is provided inside each first receiving slot, and the shape and size of the first receiving slot match the outer contour of the shell structure to ensure the stable positioning of the shell structure.

[0032] The design of the first receiving slot ensures that the shell structure does not shift or tilt during processing. Through the precise arrangement of multiple first receiving slots, the consistency of each shell structure can be guaranteed during mass production.

[0033] The second mold has multiple mounting positions, which correspond one-to-one with the first receiving slot of the first mold. Each mounting position has a cover plate structure. The design of the mounting position allows the cover plate to fit securely against the outer edge of the outer shell structure.

[0034] The mounting position is consistent with the shape of the cover plate to ensure that the cover plate structure is accurately positioned during assembly and to avoid misalignment. After the mounting position of the second mold is aligned with the first receiving groove of the first mold, it facilitates the sealing connection between the cover plate and the outer shell.

[0035] An embodiment of the third aspect of the present invention provides a getter preparation method for the above-described getter encapsulation structure or for the above-described getter processing equipment. The getter preparation method includes: placing a getter in the sink portion of the outer shell structure; aligning the cover plate structure with the outer shell structure and placing it in the processing chamber; controlling the environmental parameters in the processing chamber to a preset sealing parameter; and, when the duration of the environmental parameters being at the preset sealing parameter exceeds a first duration, squeezing the sealing outer edge and the cover plate structure.

[0036] The getter preparation method is used to prepare getter encapsulation structures and can also be combined with the aforementioned processing equipment to complete batch, high-precision encapsulation tasks. Specifically, the getter is first placed in the recessed section of the outer shell structure, and the getter material (such as active metal or compound powder) is evenly distributed in the recessed section of the outer shell structure. The placement can be done using a mechanical spreading device or manually to ensure accurate placement and uniform distribution.

[0037] Then, by aligning the cover plate structure with the outer shell structure and placing it inside the machining chamber, the cover plate structure is accurately positioned above the outer edge of the outer shell structure. The entire assembly is then transferred to the sealed machining chamber, ensuring that all components are in the correct position.

[0038] Ensure that the cover plate and the housing are perfectly aligned in both the planar and vertical directions to provide a foundation for subsequent sealing. The processing chamber provides a controlled environment (such as a vacuum or inert gas atmosphere) to prevent the getter from being oxidized or contaminated during the encapsulation process.

[0039] Finally, by controlling the environmental parameters within the processing chamber to the preset sealing parameters, the internal environment of the chamber is adjusted to the preset sealing parameters, either by evacuation or by filling with inert gases such as nitrogen or argon; the predetermined processing temperature is reached (suitable for the material properties of the outer edge and the cover plate); initial sealing pressure is applied to ensure a tight seal between the cover plate and the outer edge. If the environmental parameters remain at the preset sealing parameters for a duration exceeding a first time period, the outer edge and cover plate structure are compressed and sealed, maintaining the preset sealing parameters within the processing chamber for a period of time (the first time period) to ensure uniform material temperature and stable pressure distribution. Extrusion pressure is applied through a mold to press the outer edge and cover plate together. Through reasonable compression and sealing time, a gapless metal contact interface is formed between the outer edge and the cover plate, achieving the airtightness requirement.

[0040] After pressing, the outer edge and the cover plate undergo microscopic metal bonding under the combined action of pressure and temperature, which improves the overall structural strength, precisely controls the processing environment and time, and avoids damage or performance degradation of the getter.

[0041] The getter inside the settling tank is completely encapsulated, and the compression seal between the outer edge and the cover plate structure prevents gas leakage and extends the service life of the getter.

[0042] In some technical solutions, optionally, the environmental parameters within the processing chamber are controlled to preset sealing parameters, specifically including: controlling the pressure of the processing chamber to decrease to a first pressure and controlling the temperature of the processing chamber to be within a first temperature range; when the duration of the environmental parameters being preset sealing parameters exceeds a first duration, the outer edge and cover structure are extruded for sealing, specifically including: when the temperature of the processing chamber is within the first temperature range for more than a first duration, controlling the extruder to extrude the outer edge and cover structure to seal the cover structure and the outer shell structure.

[0043] In this technical solution, when adjusting environmental parameters, the pressure of the processing chamber is specifically reduced to a first pressure (e.g., set to a high vacuum or low pressure state, the specific value depending on the characteristics of the getter and encapsulation material). Air and impurity gases are removed from the chamber using a vacuum pump or other extraction device to ensure a pure atmosphere. The temperature of the processing chamber is then adjusted to a first temperature range (e.g., 450℃~600℃, the specific range determined based on the annealing characteristics of the material and the stability of the getter).

[0044] Use heating devices (such as infrared heaters or resistance heaters) to heat the material evenly and avoid damage caused by localized overheating.

[0045] The temperature in the processing chamber is maintained within a first temperature range for a first duration (e.g., 5 to 30 minutes) to ensure the material reaches thermal equilibrium and plastic enhancement. Pressure is applied by an extruder to extrude the outer edge and cover plate structure, forming a strong bond under high temperature and high pressure conditions.

[0046] The extrusion pressure needs to be precisely set (e.g., 50MPa to 150MPa) to ensure sufficient sealing while preventing excessive material deformation or breakage. After a sufficient heat treatment period, atomic diffusion occurs between the outer edge and the cover plate under the extrusion pressure, forming a dense interfacial contact.

[0047] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0048] Figure 1 A schematic diagram of a getter encapsulation structure according to an embodiment of the present invention is shown;

[0049] Figure 2 A schematic diagram of the structure of a first mold according to an embodiment of the present invention is shown;

[0050] Figure 3 A schematic diagram of the structure of a second mold according to an embodiment of the present invention is shown;

[0051] Figure 4 A schematic diagram of a getter processing apparatus according to an embodiment of the present invention is shown;

[0052] Figure 5 A schematic diagram of the structure of a first mold according to an embodiment of the present invention is shown;

[0053] Figure 6 A schematic diagram of the structure of a second mold according to an embodiment of the present invention is shown;

[0054] Figure 7 A schematic diagram of the outer shell structure according to an embodiment of the present invention is shown;

[0055] Figure 8 A schematic diagram of the outer shell structure according to an embodiment of the present invention is shown;

[0056] Figure 9 A schematic diagram of the outer shell structure according to an embodiment of the present invention is shown;

[0057] Figure 10 A schematic diagram of the outer shell structure according to an embodiment of the present invention is shown;

[0058] Figure 11 A schematic flowchart of a getter preparation method according to an embodiment of the present invention is shown.

[0059] in, Figures 1 to 10 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0060] 100: Getter encapsulation structure; 102: Shell structure; 1022: Outer edge; 1024: Recessed section; 1026: Receiving cavity; 104: Cover structure; 106: Getter;

[0061] 200: Getter processing equipment; 202: First mold; 2022: First receiving tank; 204: Second mold; 2042: Installation position. Detailed Implementation

[0062] To better understand the above-described objectives, features, and advantages of the embodiments of the present invention, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0063] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, embodiments of the invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0064] The following reference Figures 1 to 11 Some embodiments of the present invention are described.

[0065] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides a getter encapsulation structure 100, which offers an efficient and reliable encapsulation method for improving and maintaining the vacuum level of a vacuum environment over a long period. This solution achieves excellent sealing performance and convenient processing capabilities through the structure and sealing method of the outer shell structure 102 and the cover plate structure 104, improving production efficiency while avoiding the limitations of complex materials and high costs in traditional processes.

[0066] Specifically, the getter encapsulation structure 100 includes two parts: a shell structure 102 and a cover structure 104. The shell structure 102 includes an outer edge 1022 and a recessed portion 1024. The outer edge 1022 is the peripheral extension of the shell, and the recessed portion 1024 is located inside the outer edge 1022, extending in a first direction (generally downward) to form a receiving cavity 1026. The receiving cavity 1026 formed in the recessed portion 1024 is used to fix and protect the getter 106, ensuring that it can perform its gettering function in a sealed environment. The outer edge 1022 provides sufficient contact area for the installation and sealing of the cover structure 104, ensuring airtightness.

[0067] It should be emphasized that the outer shell structure 102 is integrally molded, which reduces complex processing steps and improves production efficiency.

[0068] Furthermore, the settling tank 1024 has a certain depth to ensure that the getter 106 can be completely covered, avoiding external contamination. The width and thickness of the outer edge 1022 are optimized to provide good rigidity and facilitate reliable sealing with the cover plate during high-temperature annealing and extrusion processes.

[0069] The cover structure 104 matches the shape and size of the outer edge 1022. After the cover structure 104 and the outer edge 1022 are combined, the receiving cavity 1026 is completely sealed, ensuring that the getter 106 is in a low-pressure sealed environment. Through mechanical compression, the cover becomes part of the outer shell, making the overall structure more stable.

[0070] Generally, the cover structure 104 can be made of the same or similar metal material as the outer shell (such as copper). Under the same temperature and pressure, the material properties are consistent, ensuring the airtightness and long-term stability of the sealing parts.

[0071] The sealing connection between the outer shell structure 102 and the cover plate structure 104 is mainly achieved by heating to the annealing temperature and applying mechanical pressure to compress the outer edge 1022 and the cover plate structure 104 into one piece. Under low pressure and high temperature conditions, the material undergoes plastic deformation, resulting in a tight bond at the contact surfaces and forming a glue-free seal, thus avoiding the risk of gas leakage that may be caused by traditional sealants. The sealed area formed after compression has high mechanical strength and can effectively resist physical damage from the external environment and the internal and external pressure differences under high vacuum conditions.

[0072] The cover plate structure 104 is closely attached to the upper surface of the outer edge 1022 and is completely aligned with it, thereby providing a large contact area, achieving an effective sealing connection, and facilitating mass production.

[0073] It is important to emphasize that in this solution, by limiting the stable temperature of the getter 106 to be significantly higher than the annealing temperatures of the outer shell structure 102 and the cover structure 104, the getter 106 does not decompose or melt due to high temperatures during the encapsulation process, thus maintaining its gettering performance. Furthermore, the annealing process softens the material, improving its plastic deformation capacity and facilitating mechanical compression during sealing. This allows the cover structure 104 and the outer edge 1022 to be compressed into a single, sealed outer shell.

[0074] For example, the stable temperature of getter 106 is 700℃, and the annealing temperature of shell structure 102 and cover plate structure 104 is 550℃.

[0075] In some embodiments, the cover structure 104 is optionally a regular flat plate shape. The flat plate design ensures good flatness, providing a basis for uniform contact during the sealing process. In addition, the shape of the cover structure 104 is adapted to the shape of the outer edge 1022, and can be rectangular or circular. That is, the edge size and shape of the cover structure 104 are designed according to the outer contour of the outer edge 1022, and fit it completely, maximizing the contact area and improving the sealing effect. At the same time, it avoids gaps or sealing defects caused by shape deviations, so that the boundary between the cover and the outer edge 1022 is completely aligned, and an integrated seal is formed by mechanical pressure and high temperature treatment.

[0076] Since the cover plate structure 104 is flat, its contact surface with the outer edge 1022 is flat and uniform, ensuring a consistent distribution of sealing strength and making it less prone to air leakage.

[0077] Furthermore, the edges of the cover plate are slightly chamfered to allow for a better transition and fit during sealing, preventing sharp edges from damaging the outer edge 1022.

[0078] In some embodiments, the surfaces of the outer edge 1022 and the cover structure 104 opposite each other are optionally defined as planes, so that the two planes are in contact, providing a larger contact area for the entire structure and enhancing the overall mechanical strength. During the extrusion process, the two planes are directly combined into an integrated sealing structure by mechanical force, avoiding leakage that may be caused by point contact or line contact.

[0079] Of course, planar contact avoids localized stress concentrations that might occur with other complex geometries, ensuring uniform pressure distribution and the integrity of the sealed joint. Furthermore, the double-planar structure forms a complete contact interface under pressure and high temperature, ensuring airtightness, reducing the need for sealants or other fillers, and improving long-term stability.

[0080] In some embodiments, the contour shapes of the sink 1024 and the outer edge 1022 are optionally defined. Specifically, the sink 1024 is projected in a rectangular or circular shape on the plane where the outer edge 1022 is located, and the outer edge of the outer edge 1022 is projected in a rectangular or circular shape on the plane where the outer edge 1022 is located.

[0081] The rectangular design is suitable for packaging getter 106 with regular shapes (such as sheet or block), making full use of internal space, facilitating positioning and stacking, and suitable for various industrial applications. The circular design avoids stress concentration in sharp corner areas, improving overall airtightness. At the same time, the circular structure is easy to form through rotational machining during manufacturing, making it suitable for high-precision processing.

[0082] In general, the rectangular design focuses more on space utilization and assembly regularity, and is suitable for standardized getter 106 packaging, while the round design focuses more on sealing performance and pressure resistance, and is suitable for high-strength or high-airtightness requirements.

[0083] In some embodiments, optionally, both the housing structure 102 and the cover structure 104 are made of copper. Those skilled in the art will know that copper (pure copper, typically containing more than 99.5% copper) has a high thermal conductivity (approximately 390 W / m·K - 400 W / m·K), enabling rapid heat conduction. In the encapsulation of the getter 106, this thermal conductivity helps to ensure a uniform temperature distribution, thereby improving its adsorption performance and lifespan. Especially during high-temperature annealing or sealing processes, copper can achieve thermal equilibrium more quickly, avoiding thermal stress concentration.

[0084] Copper has good plasticity and weldability, which facilitates the formation of a reliable sealing connection between the outer edge 1022 and the cover plate structure 104. Its surface is easy to form a dense oxide film during heat treatment, which further improves the sealing reliability.

[0085] It is understandable that using a copper outer shell can provide robust protection for the internal getter 106, while also resisting corrosion and mechanical impact from the external environment. The thermal conductivity of copper allows the internal getter 106 to quickly reach its operating temperature, thereby improving adsorption efficiency.

[0086] The sealing area between the outer shell structure 102 and the cover plate structure 104 can be efficiently sealed through heat treatment or welding processes, while the plasticity of copper makes the seal more uniform.

[0087] In some embodiments, optionally, the first direction is defined as the direction of gravity, and the outer shell structure 102 is located below the cover plate structure 104 in the direction of gravity. The outer shell structure 102, as the main structure for accommodating the getter 106, is located below the cover plate structure 104, which can effectively utilize the effect of gravity to ensure that the getter 106 is stably placed in the accommodating cavity 1026, and avoid displacement of the getter 106 due to vibration or external force.

[0088] The under-shell design provides a lower center of gravity, which contributes to the stability of the overall structure, making it more reliable, especially in dynamic environments such as transportation and vibration.

[0089] The settling tank extends in the direction of gravity, ensuring that the getter 106 naturally settles to the bottom of the chamber, which helps improve adsorption efficiency and material utilization. In heat-sealing or welding processes, the upper position of the cover plate facilitates process operations (such as welding and annealing), improving processing efficiency and connection reliability.

[0090] In some embodiments, optionally, limiting the wall thickness of the outer shell structure 102 and the cover plate structure 104 to the same helps simplify the manufacturing process. Whether it is stamping, cutting, welding or annealing, the processing can be completed using uniform molds and process parameters, thereby improving production efficiency and reducing manufacturing costs.

[0091] It is understandable that having the same wall thickness ensures that the heating and cooling rates of the two parts are consistent during heat treatment, thereby avoiding the accumulation of thermal stress or deformation that may be caused by the difference in thermal expansion coefficients. When under pressure (such as gas pressure inside the cavity) or heat, the stress distribution of the outer shell and cover plate is uniform, reducing the risk of local stress concentration caused by the difference in wall thickness and improving the overall strength and durability of the structure.

[0092] By limiting the wall thickness to less than 1 mm, the overall weight of the packaging structure can be reduced, making it suitable for applications with stringent lightweight requirements, such as aerospace equipment or portable getter 106 devices. Simultaneously, the thinner wall thickness reduces the heat transfer path, and combined with the high thermal conductivity of copper, heat can be quickly conducted to the entire structure, thereby improving the activation efficiency of getter 106.

[0093] This application also provides a getter processing device 200, such as... Figure 2 , Figure 3 and Figure 4 As shown, it includes: a first mold 202, on which a plurality of shell structures 102 of the aforementioned getter encapsulation structures 100 are provided; and a second mold 204, on which a plurality of cover structures 104 of the aforementioned getter encapsulation structures 100 are provided.

[0094] It mainly consists of two main molds, namely the first mold 202 and the second mold 204, which are used to process the outer shell and the cover structure 104 of the getter encapsulation structure 100, respectively. The first mold 202 and the second mold 204 are set independently, which facilitates the separate processing of the outer shell and the cover structure 104. Each mold can accommodate multiple encapsulation units, realize mass production, and improve production efficiency.

[0095] Specifically, the first mold 202 serves as the mold for the outer shell structure 102 and is provided with multiple molding units for the outer shell structure 102. The units can be arranged in a matrix to make full use of the mold area. Each unit includes a deep drawing mold for the groove portion 1024 and a molding mold for the outer edge portion 1022, ensuring the depth of the structure and the flatness of the outer edge.

[0096] Through deep drawing or stamping processes, the groove portion 1024 and the outer edge portion 1022 of the outer shell structure 102 are integrally formed. The unified processing of multi-unit molds ensures that each outer shell structure 102 has a high degree of consistency in size and shape.

[0097] The second mold 204 serves as the mold for the cover plate structure 104 and is provided with multiple forming units for the cover plate structure 104, in a layout design corresponding to the first mold 202. Furthermore, the second mold 204 may include cutting or stamping structures for trimming the edges of the cover plate structure 104 to ensure a sealing fit between the cover plate and the outer edge 1022.

[0098] With the helper processing equipment 200, multiple outer shell structures 102 and cover plate structures 104 can be processed simultaneously in a single molding process, which greatly improves production efficiency and is suitable for industrial production.

[0099] Furthermore, auxiliary supports or buffer structures can be added to the first mold 202 and the second mold 204 to reduce the risk of deformation. The first mold 202 and the second mold 204 can be made of high-strength mold materials (such as high-carbon alloy steel), and a wear-resistant coating can be added to the mold surface.

[0100] In summary, the getter processing equipment 200 achieves efficient forming of the outer shell structure 102 and the cover plate structure 104 through the cooperation of the first mold 202 and the second mold 204. The equipment design fully considers the requirements of materials, precision, sealing, and batch production, and can meet the lightweight and economical requirements of industrial production.

[0101] In some embodiments, optionally, such as Figure 5 As shown, the first mold 202 is provided with a plurality of first receiving slots 2022, which are arranged in an array (such as a matrix) to optimize the utilization rate of the mold area. The first receiving slot 2022 is provided with a shell structure 102, and the shape and size of the first receiving slot 2022 match the outer contour of the shell structure 102 to ensure the stable positioning of the shell structure 102.

[0102] The design of the first receiving slot 2022 ensures that the outer shell structure 102 does not shift or tilt during processing. Through the precise arrangement of multiple first receiving slots 2022, the consistency of each outer shell structure 102 can be guaranteed during mass production.

[0103] like Figure 6 As shown, the second mold 204 is provided with multiple mounting positions 2042, which correspond one-to-one with the first receiving groove 2022 of the first mold 202. The mounting position 2042 is provided with a cover plate structure 104. The design of the mounting position 2042 enables the cover plate to be stably attached to the outer edge 1022 of the outer shell structure 102.

[0104] The mounting position 2042 is consistent with the shape of the cover plate, ensuring that the cover plate structure 104 is accurately positioned during assembly and avoiding misalignment. After the mounting position 2042 of the second mold 204 is aligned with the first receiving groove 2022 of the first mold 202, it facilitates the sealing connection between the cover plate and the outer shell.

[0105] The design of multiple mounting positions 2042 enables the equipment to process multiple getter 106 encapsulation units simultaneously, significantly improving efficiency.

[0106] The first mold 202 and the second mold 204 have a one-to-one correspondence between the first receiving groove 2022 and the mounting position 2042. Through precise alignment design, it is ensured that the cover plate can be correctly placed above the outer edge 1022 of the outer shell. During the processing, the cover plate and the outer shell are subjected to pressure by the mold to achieve a sealed connection between them.

[0107] Furthermore, the depth and shape of the first receiving groove 2022 are matched with the shapes of the sink 1024 and the outer edge 1022 of the outer shell structure 102 to achieve stable fixation.

[0108] Mounting position 2042 must be flush with the contact surface of cover structure 104 to ensure that there are no gaps when the cover fits the outer shell.

[0109] This application also provides a method for preparing a getter, such as... Figure 11 As shown, the process includes: step S102: placing a getter in the sink of the outer shell structure; step S104: aligning the cover plate structure with the outer shell structure and placing it in the processing chamber; step S106: controlling the environmental parameters in the processing chamber to the preset sealing parameters; step S108: when the duration of the environmental parameters being the preset sealing parameters exceeds a first duration, squeezing the sealing outer edge and the cover plate structure.

[0110] In this solution, the getter preparation method is used to prepare the getter encapsulation structure. It can also be combined with the aforementioned processing equipment to complete batch, high-precision encapsulation tasks. Specifically, the getter is first placed in the recessed section of the outer shell structure, and the getter material (such as active metal or compound powder) is evenly distributed within the recessed section. The placement can be achieved using a mechanical spreading device or manual operation to ensure accurate placement and uniform distribution.

[0111] Then, by aligning the cover plate structure with the outer shell structure and placing it inside the machining chamber, the cover plate structure is accurately positioned above the outer edge of the outer shell structure. The entire assembly is then transferred to the sealed machining chamber, ensuring that all components are in the correct position.

[0112] Ensure that the cover plate and the housing are perfectly aligned in both the planar and vertical directions to provide a foundation for subsequent sealing. The processing chamber provides a controlled environment (such as a vacuum or inert gas atmosphere) to prevent the getter from being oxidized or contaminated during the encapsulation process.

[0113] Finally, by controlling the environmental parameters within the processing chamber to the preset sealing parameters, the internal environment of the chamber is adjusted to the preset sealing parameters, either by evacuation or by filling with inert gases such as nitrogen or argon; the predetermined processing temperature is reached (suitable for the material properties of the outer edge and the cover plate); initial sealing pressure is applied to ensure a tight seal between the cover plate and the outer edge. If the environmental parameters remain at the preset sealing parameters for a duration exceeding a first time period, the outer edge and cover plate structure are compressed and sealed, maintaining the preset sealing parameters within the processing chamber for a period of time (the first time period) to ensure uniform material temperature and stable pressure distribution. Extrusion pressure is applied through a mold to press the outer edge and cover plate together. Through reasonable compression and sealing time, a gapless metal contact interface is formed between the outer edge and the cover plate, achieving the airtightness requirement.

[0114] After pressing, the outer edge and the cover plate undergo microscopic metal bonding under the combined action of pressure and temperature, which improves the overall structural strength, precisely controls the processing environment and time, and avoids damage or performance degradation of the getter.

[0115] The getter inside the settling tank is completely encapsulated, and the compression seal between the outer edge and the cover plate structure prevents gas leakage and extends the service life of the getter.

[0116] In some embodiments, optionally, when adjusting environmental parameters, the pressure of the processing chamber is specifically reduced to a first pressure (e.g., set to a high vacuum or low pressure state, the specific value depending on the characteristics of the getter and encapsulation material). Air and impurity gases are removed from the chamber using a vacuum pump or other evacuation device to ensure a pure atmosphere. The temperature of the processing chamber is then adjusted to a first temperature range (e.g., 450°C to 600°C, the specific range determined based on the annealing characteristics of the material and the stability of the getter).

[0117] Use heating devices (such as infrared heaters or resistance heaters) to heat the material evenly and avoid damage caused by localized overheating.

[0118] The temperature in the processing chamber is maintained within a first temperature range for a first duration (e.g., 5 to 30 minutes) to ensure the material reaches thermal equilibrium and plastic enhancement. Pressure is applied by an extruder to extrude the outer edge and cover plate structure, forming a strong bond under high temperature and high pressure conditions.

[0119] The extrusion pressure needs to be precisely set (e.g., 50MPa to 150MPa) to ensure sufficient sealing while preventing excessive material deformation or breakage. After a sufficient heat treatment period, atomic diffusion occurs between the outer edge and the cover plate under the extrusion pressure, forming a dense interfacial contact.

[0120] In one specific embodiment, a highly efficient packaging method for one-time extrusion molding of getter is provided, including a metal shell (i.e., shell structure 102) and a cap (i.e., cover structure 104).

[0121] In one embodiment, the metal outer shell can be a cap-shaped irregular copper sheet, with a bottom that is a cube with a side length of not less than 5 mm and a wall thickness of less than 1 mm, and a top that is a rectangular brim of the same thickness. The brim has a side length of not less than 15 mm.

[0122] In one embodiment, the metal outer shell can be a cap-shaped irregular copper sheet, with a cubic bottom having a side length of not less than 5 mm and a wall thickness of less than 1 mm, and a circular brim of the same thickness at the top. The diameter of the brim is not less than 15 mm.

[0123] In one embodiment, the metal outer shell can be a cap-shaped irregular copper sheet, with a cylindrical bottom having an outer diameter and height of not less than 5 mm and a wall thickness of less than 1 mm, and a rectangular brim of the same thickness at the top. The brim side length is not less than 15 mm.

[0124] In one embodiment, the metal outer shell can be a cap-shaped irregular copper sheet, with a cylindrical bottom having an outer diameter and height of not less than 5 mm and a wall thickness of less than 1 mm, and a circular brim of the same thickness at the top. The diameter of the brim is not less than 15 mm.

[0125] During the sealing process, a copper sheet with the same thickness and diameter (or side length) as the copper outer shell cap is used as the cap. Under certain temperature and pressure, the cap and cap are squeezed together to form an integral sealed outer shell, maintaining the vacuum inside the getter.

[0126] The getter component is a powder or granular material that has the ability to get air under low pressure, and the stable temperature (decomposition temperature or melting temperature) of the getter component is higher than the annealing heat treatment temperature of the sealed metal shell.

[0127] The metal shell is made of copper, which can be plastically processed and shaped on an extruder with a capacity of less than 2 tons. Before extrusion molding, it needs to be annealed to ensure that the copper shell is soft enough to ensure better sealing performance.

[0128] The method uses a cap-shaped, irregularly shaped copper sheet, with the getter placed inside the cap pillar. Mechanical pressure is applied to extrude the cap and rim, forming and sealing the getter in a single process. During getter activation, the copper outer shell can be pre-annealed to reduce its hardness and achieve a better seal. This method enables efficient and continuous production of getters without complex requirements for raw materials. Furthermore, the sealant-free mechanical encapsulation effectively improves production yield.

[0129] The pre-treatment process for the getter is as follows: the getter is placed inside the cubic cap post of the copper shell, and the getter is loosely covered at the bottom of the shell due to gravity; the copper shell containing the getter is placed in the lower mold for mass production; the cap with the same size as the cap brim is placed in the upper mold for mass production and aligned with the lower mold.

[0130] The encapsulation process for the getter is as follows: A copper shell containing getter components, after pre-encapsulation treatment, is placed in a vacuum chamber, and the pressure is reduced to 10... -2 Below Pa. Raise the temperature to the target temperature. Maintain the target temperature for a period of time to allow the getter components to fully release the internal gas under low pressure and high temperature. Below the target temperature, meet the annealing requirements of the copper material. Under the conditions of maintaining low pressure and high temperature, use an extruder to deform the copper cap and rim against each other, ensuring a complete seal of the getter and the space between the upper opening and the lower seal where the getter components are located. Raise the chamber pressure to atmospheric pressure and remove the prepared getter. The prepared getter can be used to break the metal tube externally to connect the sealed area within the getter with the area requiring increased vacuum, allowing the getter to function.

[0131] Example 1: In a specific embodiment, such as Figure 7 As shown, the metal casing can be a cap-shaped irregular copper sheet, with a cubic bottom (10mm side length, 0.3mm wall thickness) and a rectangular brim of the same thickness at the top. The brim width is 5mm. The gas-absorbing component is a powdered or granular material capable of gas absorption under low pressure, with a stable temperature of 700℃, higher than the annealing heat treatment temperature of 550℃ for the sealing metal casing. The metal casing is made of copper and can be plastically processed and shaped on an extrusion press with a capacity of less than 2 tons.

[0132] Before encapsulating the getter: Place the getter inside the cap pillar of the copper shell, and the getter loosely covers the lower seal due to gravity; place the copper shell containing the getter into the lower mold for mass production; place the cap with the same size as the cap brim into the upper mold for mass production, and align it with the lower mold.

[0133] Encapsulation process of getter: The copper shell containing getter components, which has undergone pre-encapsulation treatment, is placed in a vacuum chamber to reduce the pressure to 10. -2 Below Pa. Increase the temperature to 550℃. Maintain at 550℃ for a period of time to allow the getter component to fully release the internal gas under low pressure and high temperature. Under the same low pressure and high temperature conditions, use an extruder to deform the copper cap and rim against each other, ensuring a complete seal of the getter and the space between the upper opening and the lower seal where the getter component is located. Increase the chamber pressure to atmospheric pressure and remove the prepared getter.

[0134] Example 2: In another specific embodiment, such as Figure 8 As shown, the metal outer shell is a cap-shaped irregular copper sheet. The bottom is a cube with a side length of 10mm and a wall thickness of 0.3mm, and the top is a circular cap brim of the same thickness with a diameter of 20mm.

[0135] The gas-absorbing component is a powder or granular material that has the ability to absorb gas under low pressure. The stable temperature of the gas-absorbing component is 700℃, which is higher than the annealing heat treatment temperature of 550℃ for the sealed metal shell.

[0136] The metal shell is made of copper, which can be plastically processed and shaped on an extrusion press with a capacity of less than 2 tons.

[0137] Before encapsulating the getter: Place the getter inside the cap pillar of the copper shell, and the getter loosely covers the lower seal due to gravity; place the copper shell containing the getter into the lower mold for mass production; place the cap with the same size as the cap brim into the upper mold for mass production, and align it with the lower mold.

[0138] Encapsulation process of getter: The copper shell containing getter components, which has undergone pre-encapsulation treatment, is placed in a vacuum chamber to reduce the pressure to 10. -2 Below Pa. Increase the temperature to 550℃. Maintain at 550℃ for a period of time to allow the getter component to fully release the internal gas under low pressure and high temperature. Under the same low pressure and high temperature conditions, use an extruder to deform the copper cap and rim against each other, ensuring a complete seal of the getter and the space between the upper opening and the lower seal where the getter component is located. Increase the chamber pressure to atmospheric pressure and remove the prepared getter.

[0139] Example 3: In another specific embodiment, such as Figure 9 As shown, the metal outer shell is a cap-shaped irregular copper sheet. The bottom is a cylinder with an outer diameter of 10mm, a height of 10mm, and a wall thickness of 0.3mm. The top is a square of the same thickness with a side length of 20mm.

[0140] The gas-absorbing component is a powder or granular material that has the ability to absorb gas under low pressure. The stable temperature of the gas-absorbing component is 700℃, which is higher than the annealing heat treatment temperature of 550℃ for the sealed metal shell.

[0141] The metal shell is made of copper, which can be plastically processed and shaped on an extrusion press with a capacity of less than 2 tons.

[0142] Before encapsulating the getter: Place the getter inside the cap pillar of the copper shell, and the getter loosely covers the lower seal due to gravity; place the copper shell containing the getter into the lower mold for mass production; place the cap with the same size as the cap brim into the upper mold for mass production, and align it with the lower mold.

[0143] Encapsulation process of getter: The copper shell containing getter components, which has undergone pre-encapsulation treatment, is placed in a vacuum chamber to reduce the pressure to 10. -2 Below Pa. Increase the temperature to 550℃. Maintain at 550℃ for a period of time to allow the getter component to fully release the internal gas under low pressure and high temperature. Under the same low pressure and high temperature conditions, use an extruder to deform the copper cap and rim against each other, ensuring a complete seal of the getter and the space between the upper opening and the lower seal where the getter component is located. Increase the chamber pressure to atmospheric pressure and remove the prepared getter.

[0144] Example 4: In another specific embodiment, such as Figure 10 As shown, the metal outer shell is a cap-shaped irregular copper sheet. The bottom is a cylinder with an outer diameter of 10mm, a height of 10mm, and a wall thickness of 0.3mm. The top is a square of the same thickness with a side length of 20mm.

[0145] The gas-absorbing component is a powder or granular material that has the ability to absorb gas under low pressure. The stable temperature of the gas-absorbing component is 700℃, which is higher than the annealing heat treatment temperature of 550℃ for the sealed metal shell.

[0146] The metal shell is made of copper, which can be plastically processed and shaped on an extrusion press with a capacity of less than 2 tons.

[0147] Before encapsulating the getter: Place the getter inside the cap pillar of the copper shell, and the getter loosely covers the lower seal due to gravity; place the copper shell containing the getter into the lower mold for mass production; place the cap with the same size as the cap brim into the upper mold for mass production, and align it with the lower mold.

[0148] Encapsulation process of getter: The copper shell containing getter components, which has undergone pre-encapsulation treatment, is placed in a vacuum chamber to reduce the pressure to 10. -2 Below Pa. Increase the temperature to 550℃. Maintain at 550℃ for a period of time to allow the getter component to fully release the internal gas under low pressure and high temperature. Under the same low pressure and high temperature conditions, use an extruder to deform the copper cap and rim against each other, ensuring a complete seal of the getter and the space between the upper opening and the lower seal where the getter component is located. Increase the chamber pressure to atmospheric pressure and remove the prepared getter.

[0149] The getters generated in the four specific embodiments above were placed directly in a vacuum environment with an internal pressure of approximately 1 Pa and an internal volume of 0.4 L for getter testing. The pressure before and after the getter took effect is shown in the table below:

[0150]

[0151] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0152] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0153] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0154] The above are merely preferred embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A getter encapsulation structure, characterized in that, include: The outer shell structure includes an integrally formed outer edge and a recessed portion disposed within the outer edge, the recessed portion extending toward a first direction, and a receiving cavity for receiving a getter is formed within the recessed portion. A cover plate structure is disposed on one side of the outer shell structure in the first direction, and the cover plate structure is sealed to the outer edge. The stable temperature of the getter is higher than the sealing annealing temperature of the outer shell structure and the outer edge.

2. The getter encapsulation structure according to claim 1, characterized in that, The cover plate structure is flat, and the shape of the cover plate structure is adapted to the shape of the outer edge.

3. The getter encapsulation structure according to claim 1, characterized in that, The outer edge of the portion facing the cover structure is a plane, and the cover structure facing the outer shell structure is a plane.

4. The getter encapsulation structure according to claim 1, characterized in that, The projection of the trough portion onto the plane where the outer edge portion is located is rectangular or circular; and / or The projection of the outer edge of the outer edge onto the plane where the outer edge is located is rectangular or circular.

5. The getter encapsulation structure according to claim 1, characterized in that, The outer shell structure and the cover plate structure are made of copper.

6. The getter encapsulation structure according to claim 1, characterized in that, The first direction is the direction of gravity, and the outer shell structure is located below the cover plate structure in the direction of gravity.

7. The getter encapsulation structure according to any one of claims 1 to 6, characterized in that, The wall thickness of the outer shell structure is the same as the wall thickness of the cover plate structure; The wall thickness of the cover plate structure is less than 1 mm.

8. A getter processing device, characterized in that, include: A first mold, wherein the first mold is provided with a plurality of housing structures for getter encapsulation structures as described in any one of claims 1 to 7; The second mold is provided with a plurality of cover plate structures for getter encapsulation structures as described in any one of claims 1 to 7.

9. The getter processing equipment according to claim 8, characterized in that, The first mold is provided with a plurality of first receiving slots, and the plurality of first receiving slots are arranged in an array; The second mold is provided with multiple mounting positions, which are corresponding to the first receiving groove; The cover plate structure is provided in the first receiving groove and the cover plate structure is provided at the mounting position.

10. A method for preparing a getter, characterized in that, For use in the getter encapsulation structure according to any one of claims 1 to 7, or for use in the getter processing equipment according to claim 8 or 9, the getter preparation method comprises: Place a getter inside the recessed section of the outer shell structure; The cover plate structure is aligned with the outer shell structure and disposed within the processing chamber; The environmental parameters within the processing chamber are controlled to preset sealing parameters; If the duration of the environmental parameters being at the preset sealing parameters exceeds a first duration, the outer edge and the cover plate structure are compressed and sealed.

11. The method for preparing a getter according to claim 10, characterized in that, The environmental parameters controlled within the processing chamber are preset sealing parameters, specifically including: The pressure in the processing chamber is controlled to decrease to a first pressure, and the temperature in the processing chamber is controlled to be within a first temperature range; When the duration of the environmental parameters being at the preset sealing parameters exceeds a first duration, the method of compressing and sealing the outer edge and the cover plate structure specifically includes: If the temperature in the processing chamber remains within the first temperature range for a period of time exceeding a first duration, the extruder is controlled to press the outer edge and the cover plate structure to seal the cover plate structure and the outer shell structure.

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