Silk buffer system

Abstract

The wire buffer assembly includes a frame having a top defining a first opening and a second opening, a guide wheel disposed within the frame, a plurality of guide pins disposed within the frame and surrounding the guide wheel, and at least one sensor disposed near the guide wheel and configured to detect the position of the guide wheel within the frame.

Description

Technical Field

[0001] The information provided in this section is for the purpose of presenting the general context of this disclosure. The work of the currently named inventors, to the extent described in this section, and in respect of aspects that may not otherwise qualify as prior art at the time of filing, is neither expressly nor implicitly acknowledged as prior art to this disclosure.

[0002] This disclosure relates to the preparation of wires for feeding into machines. More specifically, it addresses the preparation of wires for feeding into automated tools, such as laser brazing tools, welding tools, or soft soldering tools, which utilize wires containing filler metal to join two or more substrate metals. Background Technology

[0003] In manufacturing applications, machines typically receive wire from a spool. These machines may include, for example, laser brazing tools, welding tools, or soft soldering tools, as well as other tools that utilize wire. Typically, the wire is wound or coiled onto a spool. However, as the wire leaves the spool, it can often become tangled, twisted, hooked, or otherwise blocked. These obstacles can cause the machine to stop abruptly. Such a sudden stop can lead to defects in the joining process, resulting in the discard of manufactured parts or raw materials. Furthermore, these stops can cause costly downtime and interruptions in the manufacturing process. Therefore, improved processes are needed to feed the wire from the spool into the machine, effectively removing obstacles and preventing sudden stops during machine operation. Summary of the Invention

[0004] In some aspects, the silk buffer assembly includes a frame having a top defining a first opening and a second opening, a guide wheel disposed within the frame, a plurality of guide pins disposed within the frame and surrounding the guide wheel, and at least one sensor disposed near the guide wheel and configured to detect the position of the guide wheel within the frame.

[0005] In some examples, the motor may be located at the first opening. Optionally, at least one sensor may include a first guide wheel sensor disposed near the bottom of the frame, the first guide wheel sensor being configured to detect a first position of a guide wheel defined above the first guide wheel sensor. Additionally or alternatively, at least one sensor may include a second guide wheel sensor disposed between the first guide wheel sensor and the top of the frame. The second guide wheel sensor may be configured to detect a second position of a guide wheel defined between the second guide wheel sensor and the top of the frame. In some configurations, at least one sensor may include a third guide wheel sensor disposed near the top of the frame. The third guide wheel sensor may be configured to detect a third position of a guide wheel defined between the third guide wheel sensor and the top of the frame. In other configurations, the at least one sensor may include a wire feed sensor disposed at the top of the frame, and the wire feed sensor may be configured to detect wire in the frame.

[0006] In some examples, each of the at least one sensor may include at least one of a photoelectric sensor, a Hall effect sensor, an inductive sensor, and an ultrasonic sensor. In other examples, a first panel may be coupled to a frame, and a second panel may be coupled to a frame. In some configurations, a plurality of guide pins may extend from the first panel to the second panel. Guide wheels may be suspended within the frame between the first and second panels, and the guide wheels may not be directly attached to the frame, the first panel, or each of the second panel. Optionally, the guide wheel may include a channel defined along the circumference of the guide wheel.

[0007] In other aspects, a silk buffer system includes a silk buffer assembly configured to receive silk. The silk buffer assembly includes a frame having a top defining a first opening and a second opening, at which the silk is received by the frame. A guide wheel is disposed within the frame and has a raised position and a lowered position, to which the silk is operatively coupled. A motor is coupled to the frame and disposed at the first opening. A first guide wheel sensor is disposed near the bottom of the frame and configured to detect one of the raised and lowered positions of the guide wheel within the frame. The silk buffer system also includes an automated tool configured to receive silk from the second opening of the frame, and a controller communicatively coupled to the automated tool. The controller includes data processing hardware and memory hardware communicating with the data processing hardware, the memory hardware storing instructions that, when executed on the data processing hardware, cause the data processing hardware to perform operations. Operation includes activating the motor in response to the first guide wheel sensor detecting that the guide wheel is in the raised position for a first predetermined time period, the raised position being defined by the guide wheel positioned above the first guide wheel sensor. Operation also includes stopping the motor when the first guide wheel sensor detects that the guide wheel is in the lowered position, the lowered position being defined by the guide wheel and positioned below the first guide wheel sensor near the bottom of the frame for a second predetermined time period.

[0008] In some examples, a second guide wheel sensor may be positioned between the first guide wheel sensor and the top of the frame. The second guide wheel sensor may be configured to detect the guide wheel between the second guide wheel sensor and the top of the frame. In other examples, operation may include stopping the automated tool when the second guide wheel sensor detects the guide wheel between the second guide wheel sensor and the top of the frame. Additionally or alternatively, a third guide wheel sensor may be positioned close to the top of the frame. The third guide wheel sensor may be configured to detect the guide wheel between the third guide wheel sensor and the top of the frame. Optionally, operation may include stopping the automated tool when the third guide wheel sensor detects the guide wheel between the third guide wheel sensor and the top of the frame.

[0009] In some configurations, the filament feed sensor may be positioned at the top of the frame. The filament feed sensor may be configured to detect filament received by the frame. Optionally, operation may include selectively activating a motor when the filament feed sensor detects filament. In other configurations, each of the first guide wheel sensor, second guide wheel sensor, third guide wheel sensor, and filament feed sensor may include at least one of a photoelectric sensor, a Hall effect sensor, an inductive sensor, and an ultrasonic sensor.

[0010] In another aspect, a silk buffer system includes a silk buffer assembly configured to receive silk. The silk buffer assembly includes a frame having a top defining a first opening and a second opening, at which the silk is received by the frame. A guide wheel is disposed within the frame and has a raised position and a lowered position, to which the silk is operatively coupled. A motor is coupled to the frame and disposed at the first opening. A first guide wheel sensor is disposed near the bottom of the frame and configured to detect one of the raised and lowered positions of the guide wheel within the frame. A second guide wheel sensor is disposed between the first guide wheel sensor and the top of the frame. The second guide wheel sensor is configured to detect the guide wheel between the second guide wheel sensor and the top of the frame. A third guide wheel sensor is disposed near the top of the frame. The third guide wheel sensor is configured to detect the guide wheel between the third guide wheel sensor and the top of the frame. A silk feed sensor is disposed at the top of the frame. The silk feed sensor is configured to detect silk received by the frame. The silk buffer system also includes an automated tool configured to receive silk from the second opening of the frame and a controller communicatively coupled to the automated tool. The controller includes data processing hardware and memory hardware communicating with the data processing hardware. The memory hardware stores instructions that, when executed on the data processing hardware, cause the data processing hardware to perform operations. The operations include selectively starting a motor when a yarn feed sensor detects a yarn. The operation also includes activating the motor in response to a first guide wheel sensor detecting that a guide wheel is in an elevated position for a first predetermined time period, the elevated position being defined by a guide wheel positioned above the first guide wheel sensor. The operation further includes stopping the motor when the first guide wheel sensor detects that the guide wheel is in a lowered position, the lowered position being defined by the guide wheel and positioned below the first guide wheel sensor near the bottom of the frame for a second predetermined time period. The operation also includes stopping the automated tool when a second guide wheel sensor detects a guide wheel between the second guide wheel sensor and the top of the frame. The operation further includes stopping the automated tool when a third guide wheel sensor detects a guide wheel between the third guide wheel sensor and the top of the frame. Attached Figure Description

[0011] The accompanying drawings described herein are for illustrative purposes only for the selected configurations and are not intended to limit the scope of this disclosure.

[0012] Figure 1 This is a perspective view of the filament buffer system according to this disclosure;

[0013] Figure 2A This is a perspective view of the filament buffer assembly according to this disclosure;

[0014] Figure 2B yes Figure 2A A perspective view of the filament buffer assembly, with the front panel of the filament buffer assembly removed;

[0015] Figure 3 yes Figure 2A A cross-sectional view of the guide wheel between the first and second panels of the wire buffer assembly;

[0016] Figure 4 This is a block diagram illustrating a plurality of sensors that transmit sensor data to a controller of a wire buffer system according to the present disclosure; and

[0017] Figures 5A-5C The diagram is a perspective view of the wire buffer assembly according to this disclosure, which has guide wheels in various positions during the operation of the wire buffer assembly.

[0018] Throughout the accompanying drawings, corresponding reference numerals indicate the relevant parts. Detailed Implementation

[0019] The exemplary configuration will now be described more fully with reference to the accompanying drawings. Exemplary configurations are provided so that this disclosure will be thorough and will fully communicate the scope of this disclosure to those skilled in the art. Specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the configurations of this disclosure. It will be apparent to those skilled in the art that specific details are not required, that the exemplary configurations may be implemented in many different forms, and that the specific details and exemplary configurations should not be construed as limiting the scope of this disclosure.

[0020] The terminology used herein is for the purpose of describing particular exemplary configurations only and is not intended to be restrictive. As used herein, the singular articles “a,” “an,” and “the” may be intended to include plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having” are inclusive and therefore specify the presence of features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as requiring them to be performed in the particular order discussed or shown. Additional or alternative steps may be employed.

[0021] When an element or layer is referred to as being “on,” “joined to,” “connected to,” “attached to,” or “linked to” another element or layer, it may be directly on, joined to, connected to, attached to, or linked to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as being “directly on,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly linked to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0022] The terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or sections. These elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms do not imply order or sequence. Therefore, without departing from the teachings of the example configuration, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section.

[0023] In this application, including the following definitions, the term "module" may be replaced by the term "circuit". The term "module" may refer to, be part of, or include: application-specific integrated circuits (ASICs); digital, analog, or mixed-signal analog / digital discrete circuits; digital, analog, or mixed-signal analog / digital integrated circuits; combinational logic circuits; field-programmable gate arrays (FPGAs); processors (shared, dedicated, or grouped) that execute code; memory (shared, dedicated, or grouped) that stores code executed by the processor; other suitable hardware components that provide the described functionality; or combinations of some or all of the foregoing, such as in a system-on-a-chip.

[0024] The term "code" as used above can include software, firmware, and / or microcode, and can refer to programs, routines, functions, classes, and / or objects. The term "shared processor" covers a single processor that executes some or all of the code from multiple modules. The term "group processor" covers a processor that, in combination with additional processors, executes some or all of the code from one or more modules. The term "shared memory" covers a single memory that stores some or all of the code from multiple modules. The term "group memory" covers memory that, in combination with additional memory, stores some or all of the code from one or more modules. The term "memory" can be a subset of the term "computer-readable medium." The term "computer-readable medium" does not include transient electrical and electromagnetic signals propagating through the medium, and therefore can be considered tangible and non-transitory memory. Non-limiting examples of non-transitory memory include tangible computer-readable media, which include non-volatile memory, magnetic memory, and optical memory.

[0025] The apparatus and methods described in this application can be implemented, in part or in whole, by one or more computer programs executed by one or more processors. The computer program includes processor-executable instructions stored on at least one non-transitory tangible computer-readable medium. The computer program may also include and / or depend on stored data.

[0026] A software application (i.e., a software resource) can refer to computer software that enables a computing device to perform tasks. In some examples, a software application may be referred to as an "application," "app," or "program." Example applications include, but are not limited to, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and game applications.

[0027] Non-transitory memory can be a physical device used to temporarily or permanently store programs (e.g., instruction sequences) or data (e.g., program state information) for use by a computing device. Non-transitory memory can be volatile and / or non-volatile addressable semiconductor memory. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electrically erasable programmable read-only memory (EEPROM) (e.g., commonly used in firmware, such as boot programs). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase-change memory (PCM), and magnetic disks or magnetic tapes.

[0028] These computer programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and can be implemented using high-level procedural and / or object-oriented programming languages ​​and / or assembly / machine languages. As used herein, the terms “machine-readable medium” and “computer-readable medium” refer to any computer program product, non-transitory computer-readable medium, device, and / or apparatus (e.g., disk, optical disk, memory, programmable logic device (PLD)) used to provide machine instructions and / or data to a programmable processor, including machine-readable media that receive machine instructions as machine-readable signals. The term “machine-readable signal” refers to any signal used to provide machine instructions and / or data to a programmable processor.

[0029] Various implementations of the systems and techniques described herein can be implemented in digital electronic and / or optical circuits, integrated circuits, specially designed ASICs (Application-Specific Integrated Circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include implementations in one or more computer programs executable and / or interpretable on a programmable system, which includes at least one programmable processor, which may be dedicated or general-purpose, coupled to receive data and instructions from a storage system, at least one input device, and at least one output device, and to transmit data and instructions to the storage system, at least one input device, and at least one output device.

[0030] The processes and logic described in this specification can be executed by one or more programmable processors (also known as data processing hardware) that execute one or more computer programs to perform functions by manipulating input data and generating output. The processes and logic can also be executed by special-purpose logic circuitry, such as FPGAs (Field-Programmable Gate Arrays) or ASICs (Application-Specific Integrated Circuits). Processors suitable for executing computer programs include, for example, both general-purpose microprocessors and special-purpose microprocessors, as well as any one or more processors of any kind of digital computer. Typically, the processor receives instructions and data from read-only memory or random access memory, or both. The basic elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Typically, a computer will also include one or more mass storage devices (e.g., magnetic disks, magneto-optical disks, or optical disks) for storing data, or operatively coupled to receive data from or transfer data to one or more mass storage devices, or both. However, a computer does not need to have such devices. Computer-readable media suitable for storing computer program instructions and data include all forms of non-volatile memory, media, and memory devices, including, for example, semiconductor memory devices such as EPROM, EEPROM, and flash memory devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. Processors and memory may be supplemented by or incorporated into dedicated logic circuitry.

[0031] To provide interaction with a user, one or more aspects of this disclosure can be implemented on a computer having a display device for displaying information to the user, such as a CRT (cathode ray tube), LCD (liquid crystal display) monitor, or touchscreen, and optionally a keyboard and pointing device, such as a mouse or trackball, through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, voice, or tactile input. Furthermore, the computer can interact with the user by sending documents to and receiving documents from the device used by the user; for example, by sending a web page to a web browser on the user's client device in response to a request received from a web browser.

[0032] refer to Figure 1-4The wire feed buffer system 10 includes a wire feed assembly 100 that supplies wire 12 to an automated tool 14. The automated tool 14 may include a tool head 16, such as a laser brazing apparatus, welding apparatus, or brazing device. In some examples, the automated tool 14 may be stationary or operated by a human operator. In the illustrated example, the automated tool 14 includes a robotic arm 18 that manipulates the tool head 16. The wire feed buffer system 10 receives wire 12 from a distributor 20 (e.g., a spool or roller). The wire 12 retracted from the distributor 20 into the wire feed buffer system 10 may be referred to as wire feed. The wire 12 may be drawn into the wire feed assembly 100 via a motor 22. For example, an initial portion of the wire 12 may be manually fed into the motor 22, which is configured to selectively draw the wire 12 into the wire feed assembly 100 during operation of the wire feed buffer system 10, as described in more detail below.

[0033] The wire buffer system 10 also includes a controller 24, which is communicatively connected to the automation tool 14 and the wire buffer assembly 100, as described in detail below. The controller 24 includes data processing hardware 26 and memory hardware 28 communicating with the data processing hardware 26. The memory hardware 28 stores instructions that, when executed by the data processing hardware 26, cause the data processing hardware 26 to perform the operations described herein. The controller 24 can be configured to operate software 30, which is executed by the data processing hardware 26 and corresponds to the operations performed by the data processing hardware 26. The controller 24 is configured to control the selective extraction of wire 12 from the distributor 20 and the speed at which wire 12 is fed to the automation tool 14.

[0034] The wire 12 is fed from the distributor 20 into the frame 102 of the wire buffer assembly 100 via a motor 22. For example, the motor 22 may be positioned at the top 102a of the frame 102. The top 102a of the frame 102 defines a first opening 104 and a second opening 106. The motor 22 may be positioned near or otherwise coupled to the frame 102, and the wire 12 is fed into the frame 102 through the first opening 104. The motor 22 may also be coupled to or positioned near the distributor 20, such that the motor 22 can be disengaged from the frame 102 in other configurations. The wire 12 is configured to pass through the first opening 104, through the frame 102, and exit the frame 102 toward the automated tool 14 at the second opening 106.

[0035] The filament buffer assembly 100 also includes a plurality of sensors 108 communicatively coupled to the controller 24. The plurality of sensors 108 may include, but are not limited to, at least one of photoelectric sensors, Hall effect sensors, inductive sensors, or ultrasonic sensors. The plurality of sensors 108 includes guide wheel sensors 108a-108c and a filament feed sensor 108d, as described below. The filament feed sensor 108d may be arranged along the top 102a of the frame 102 near the first opening 104 of the frame 102. The filament feed sensor 108d is configured to detect the filament 12 when it is fed from the distributor 20 into the frame 102. For example, the controller 24 may activate the motor 22 to feed the filament 12 from the distributor 20, and the filament feed sensor 108d may detect the filament 12 when it passes through the first opening 104 into the frame 102. If the filament feed sensor 108d does not detect the filament 12 (i.e., the filament 12 is absent or the filament feed sensor 108d is faulty), the controller 24 may stop the operation of the motor 22.

[0036] Further reference Figure 1-4 The wire buffer assembly 100 also includes a guide wheel 110 disposed within a frame 102 and a plurality of guide pins 112 disposed around the guide wheel 110 within the frame 102. Once the wire 12 is received in the frame 102, the wire 12 passes around a portion of the circumference of the guide wheel 12. For example, the guide wheel 110 has a channel 116 defined along the circumference of the guide wheel 110. Width W 116 The shape of the channel 116 may correspond to the diameter or specification of the wire 12. A guide wheel 110 receives the wire 12 within the channel 116, such that the wire 12 is operatively coupled to the guide wheel 110. As the wire 12 travels from the first opening 104 to the second opening 106, the wire 12 passes over a portion of the guide wheel 110. The guide wheel 110 is rotatable such that the relative movement between the guide wheel 110 and the wire 12 within the channel 116 is minimal or negligible as the wire 12 moves about the guide wheel 110.

[0037] The wire cushioning assembly 100 also includes a first panel 120 and a second panel 122 coupled to the frame 102. The first panel 120 and the second panel 122 may each comprise one or more panels. Panels 120 and 122 may be coupled to the frame 102 via fasteners (such as screws or nuts and bolts) using adhesives and / or any other feasible fastening mechanism. In an alternative example where the frame 102 and panels 120 and 122 are metal, panels 120 and 122 may be coupled to the frame 102 by welding panels 120 and 122 to the frame 102. As described below... Figures 5A to 5CFurther discussion reveals that the guide wheel 110 is suspended within the frame 102 between the first panel 120 and the second panel 122, such that the guide wheel 110 is not directly attached to any of the frame 102, the first panel 120, or the second panel 122. For example, the guide wheel 110 is positioned within the frame 102 between the first panel 120 and the second panel 122 while remaining unattached or otherwise not directly connected to the panels 120, 122, and the frame 102. As described in more detail below, the guide wheel 110 is suspended via a wire 12. The wire 12 is fed into the frame 102 and is arranged along at least a portion of the guide wheel 110 within the boundary of a guide pin 112. The guide pin 112 generally surrounds the guide wheel 110 and extends from the first panel 120 to the second panel 122. The guide pin 112 also restricts the movement of the guide wheel 110 within the frame 102 while providing a wire path 12a for the wire 12. For example, when the guide wheel 110 is located near the bottom 102b of the frame 102, the guide pin 112 near the bottom 102b of the frame 102 may optionally support the guide wheel 110.

[0038] The first panel 120 and the second panel 122 are separated by a distance of 124, and the width of the distance 124 is W. 124 Thickness T greater than guide wheel 110 110 The distance 124 is large enough to provide clearance for the guide wheel 110 while containing the guide wheel 110 within the space 126 defined by the frame 102. The distance 124 between the first panel 120 and the second panel 122 provides clearance such that the guide wheel 110 is not directly attached to each of the first panel 120 and the second panel 122. In some non-limiting examples, panels 120, 122 may comprise acrylic, vinyl or other plastic materials, metal, glass, or wood. Additionally or alternatively, panels 120, 122 may comprise a transparent material so that the operator of the silk cushioning system 10 can easily observe the guide wheel 110 and the silk 12 within the frame 102.

[0039] Now for reference Figures 5A-5C The diagram illustrates the yarn buffer assembly 100 in various operating states. As described above, a guide wheel 110 is suspended within a frame 102 between a first panel 120 and a second panel 122 via yarn 12. A guide pin 112 extends from the first panel 120 to the second panel 122 to define a yarn path 12a between the top 102a and the bottom 102b of the frame 102. The guide wheel 110 is configured to move upward and downward (i.e., between a raised position 110a and a lowered position 110b) in response to the length and / or tension of the yarn 12, such that the guide wheel 110 can move within the frame 102 along the yarn path 12a.

[0040] The wire path 12a can be defined from the first opening 104 (within a portion of the channel 116 of the guide wheel 12) to the second opening 106. As described above, the guide pin 112 defines the wire path 12a. For example, the wire 12 is fed from the first opening 104 along the wire path 12a defined by the guide pin 112 into the channel 116 of the guide wheel 110, reaching the second opening 106 following the guide pin 112. During operation of the wire buffer system 10, segments of the wire 12 are continuously drawn from the distributor 20, pass through the wire buffer assembly 100, and reach the tool head 16 of the automated tool 14. For example, the motor 22 draws the wire 12 from the distributor 20 through the first opening 104 at a predetermined rate, and the guide wheel 110 assists in feeding the wire 12 to the tool head 16. The guide wheel 110 maintains the wire path 12a of the wire 12 and is used by the wire buffer system 10 to detect errors or other potential problems with the wire 12 within the distributor 20, as will be described in more detail below. When the feed of wire 12 is unimpeded, the gravity acting on the guide wheel 110 pulls wire 12 to near the bottom 102b of frame 102, as shown. Figure 5A As shown. The weight of the guide wheel 110 may be based at least in part on the specifications, tensile strength, and / or ductility of the filament 12. For example, the weight of the guide wheel 110 may be heavy enough to draw the filament 12 to near the bottom 102b of the frame 102, and light enough to prevent the guide wheel 110 from cutting the filament 12.

[0041] Further reference Figures 5A-5C When the filament 12 is drawn from the distributor 20 by the motor 22, the filament 12 may become twisted, tangled, hooked, or otherwise obstructed. Therefore, the filament 12 may stop feeding from the distributor 20 into the filament buffer system 10. During such a stop, the automated tool 14 may continue to draw the filament 12 from the second opening 106 of the filament buffer assembly 100. Thus, as the corresponding segment of the filament 12 is drawn from the second opening 106, the corresponding segment of the filament 12 within the frame 102 pulls the guide wheel 110 upward toward the top 102a of the frame 102, as... Figure 5B and 5C As shown.

[0042] As described above, the multiple sensors 108 of the wire buffer assembly 100 include guide wheel sensors 108a-108c, which are configured to detect the position of the guide wheel 110 within the frame 102 (i.e., raised position 110a and lowered position 110b), which can inform the state of the wire 12. The operating software 30 of the controller 24 is configured to recognize sensor data 130, 130a-130c from each corresponding guide wheel sensor 108a-108c, and in response, issue a corresponding notification 32. The notification 32 can indicate an associated error. For example, the notification 32 can indicate an error in the wire 12 at the dispenser 20 and / or an error in one or more of the guide wheel sensors 108a-108c.

[0043] The first guide wheel sensor 108a is disposed near the bottom 102b of the frame 102 and is configured to detect the raised position 110a of the guide wheel 110. The raised position 110a may be defined by the guide wheel 110 positioned above the first guide wheel sensor 108a. The lowered position 110b may be defined by the guide wheel 110, which is located below the first guide wheel sensor 108a near the bottom 102b of the frame 102. The first guide wheel sensor 108a is configured to control the filling level of the yarn 12 using the auxiliary yarn buffer system 10.

[0044] The first guide wheel sensor 108a is configured to send sensor data 130, 130a associated with the positions 110a, 110b of the guide wheel 110 to the controller 24. For example, if the first guide wheel sensor 108a detects that the guide wheel 110 is in the raised position 110a for a first predetermined time period 132a, the first guide wheel sensor 108a sends sensor data 130, 130a indicating the raised position 110a of the guide wheel 110 to the controller 24. In response, the controller 24 may activate the motor 22 to feed more filaments 12 from the dispenser 20 into the frame 102. For example, depending on the configuration of the controller 24, the first predetermined time period 132a may be approximately one (1) millisecond, approximately ten (10) milliseconds, approximately 0.25 seconds, approximately 0.5 seconds, approximately one (1) second, and / or approximately two (2) seconds. The controller 24 can also be programmed and reprogrammed to adjust the first predetermined time period 132a based on the manufacturing project utilizing the wire buffer system 10, making the first predetermined time period 132a customizable. Therefore, the wire buffer assembly 100 continuously holds a section of wire 12 at least as long as the brazed joint.

[0045] When the first guide wheel sensor 108a detects that the guide wheel 110 is in the lowered position for a second predetermined time period 132b, the controller 24 stops the motor 22. For example, depending on the configuration of the controller 24, the second predetermined time period 132b can be approximately one (1) millisecond, approximately ten (10) milliseconds, approximately 0.25 seconds, approximately 0.5 seconds, approximately one (1) second, and / or approximately two (2) seconds. Similar to the first predetermined time period 132a, the second predetermined time period 132b can be customized by programming and / or reprogramming the controller 24. By stopping the motor 22 in response to the detected lowered position 110b of the guide wheel 110 during the second time period 132b, the controller 24 prevents the motor 22 from feeding excess wire 12 into the wire buffer assembly 100.

[0046] For example, excess yarn 12 in the yarn buffer assembly 100 may cause the guide wheel 110 to rest on or near the bottom 102b of the frame 102 in the lowered position 110b, resulting in loose yarn 12. Loose yarn 12 indicates that there is a sufficient amount of yarn 12 within the yarn buffer assembly 100 to retain additional yarn 12 until the first guide wheel sensor 108a detects that the guide wheel 110 is in the raised position 110a for a first time period 132a. Therefore, the first guide wheel sensor 108a provides sensor monitoring of the yarn 12 in the yarn buffer assembly 100 by monitoring the positions 110a, 110b of the guide wheels 110. The positions 110a, 110b of the guide wheels 110 are proportional to the amount of yarn 12 within the yarn buffer assembly 100, allowing for the detection of errors in the yarn 12 within the dispenser 20 based on the positions 110a, 110b of the guide wheels 110. The error may correspond to the guide wheel 110 being in the raised position 110a for a first predetermined time period 132a, and the controller 24 may issue a notification 32 in response to sensor data 130, 130a received from the first guide wheel sensor 108a to check the dispenser 20.

[0047] Further reference Figures 5A-5C The multiple sensors 108 also include a second guide wheel sensor 108b and a third guide wheel sensor 108c, which are configured as backup or fail-safe sensors for the first guide wheel sensor 108a. For example, the second guide wheel sensor 108b and the third guide wheel sensor 108c are configured to detect the guide wheel 110 and provide sensor data 130, 130b, 130c to the controller 24. Instead of detecting the raised position 110a and lowered position 110b of the guide wheel 110 as the first guide wheel sensor 108a does, the second and third guide wheel sensors 108b and 108c are configured to detect the guide wheel 110 regardless of its position. For example, the second guide wheel sensor 108b is positioned between the first guide wheel sensor 108a and the third guide wheel sensor 108c.

[0048] The second guide wheel sensor 108b is configured to detect the guide wheel 110 between the second guide wheel sensor 108b and the top 102a of the frame 102, such as Figure 5B As shown. The second guide wheel sensor 108b is located at a certain distance from the top 102a of the frame 102. Hooks, tangles, or other obstacles may prevent the yarn 12 from being fed into the yarn buffer assembly 100. Because the obstacle prevents the motor 22 from feeding the yarn 12 into the yarn buffer assembly 100, the yarn 12 pulls the guide wheel 110 upward toward the top 102a of the frame 102 as the automated tool 14 continues to pull the yarn from the second opening 106 of the yarn buffer assembly 100.

[0049] As the guide wheel 110 travels toward the top 102a of the frame 102, the second guide wheel sensor 108b detects the guide wheel 110 and sends sensor data 130, 130b to the controller 24. In response, the controller 24 signals the automated tool 14 to stop operation after completing an operating cycle but before the wire 12 in the wire buffer assembly 100 is exhausted (i.e., to complete the operating cycle currently being performed by the automated tool 14 and stop before starting a new operating cycle). The automated tool 14 can complete an operating cycle when the segment of wire 12 in the wire path 12a is long enough for the automated tool 14 to complete the operating cycle, which is determined based on the position of the guide wheel 110 within the frame 102 detected by the second guide wheel sensor 108b. Therefore, the wire buffer assembly 100 prevents sudden stops in the operation of the automated tool 14, which could lead to defects in brazing and result in the discard of parts or raw materials.

[0050] Additionally, if the first guide wheel sensor 108a fails to detect the raised position 110a of the guide wheel 110, the second guide wheel sensor 108b serves as a secondary backup monitor. If the second guide wheel sensor 108b detects the guide wheel 110, it notifies the controller 24 of an error in the wire buffer assembly 100 via sensor data 130, 130b. An error could be a result of the first guide wheel sensor 108a failing to detect the raised position 110a of the guide wheel 110, leading to the second guide wheel sensor 108a detecting the guide wheel 110. Therefore, the controller 24 signals the automation tool 14 to stop after completing an operating cycle (i.e., completing the currently executing operating cycle of the automation tool 14 and stopping before starting a new operating cycle).

[0051] For example, if there is an error in the wire 12 at dispenser 20 (i.e., hooking, tangling, etc.) or a malfunction in the first guide wheel sensor 108a, the guide wheel 110 may only be detected by the second guide wheel sensor 108b. In response, the controller 24, based on sensor data 130b received from the second guide wheel sensor 108b indicating that the guide wheel 110 has been detected, signals the automated tool 14 to stop operation after the completion of the operating cycle but before the wire 12 in the wire buffer assembly 100 is exhausted. Thus, the wire buffer assembly 100 prevents abrupt stops in the operation of the automated tool 14, which could lead to defects in brazing and result in the discard of parts or raw materials.

[0052] Still referencing Figures 5A-5C The third guide wheel sensor 108c is disposed near the top 102a of the frame 102. The third guide wheel sensor 108c is configured to detect the guide wheel 110 between the third guide wheel sensor 108c and the top 102a of the frame 102, such as... Figure 5CAs shown. By detecting when the guide wheel 110 approaches the top 102a of the frame 102, the third guide wheel sensor 108c detects that the yarn buffer assembly 100 has a yarn 12 in the yarn path 12a that is not long enough for the automated tool 14 to complete the current operating cycle. In response, the controller 24 signals the automated tool 14 to stop executing the current operating cycle.

[0053] Similar to the second guide wheel sensor 108b, the third guide wheel sensor 108c serves as a backup or fail-safe sensor in the event of a failure of the second guide wheel sensor 108b or both the first guide wheel sensor 108a and the second guide wheel sensor 108b. Therefore, when hooking, tangling, or other resistance prevents the wire 12 from feeding into the wire buffer assembly 100, the third guide wheel sensor 108c can detect the guide wheel 110 and send sensor data 130, 130c to the controller 24. In response, the controller 24 signals the automation tool 14 to immediately stop operation, thereby preventing damage to the automation tool 14 or the wire buffer assembly 100 due to the resistance of the wire 12.

[0054] Refer again Figure 1-5C The yarn buffer system 10 provides automatic monitoring of the yarn 12 fed into the yarn buffer assembly 100. Suspended guide wheels 110 and corresponding guide wheel sensors 108a-108c provide information about the state of the yarn 12 that may affect the operational function of the automated tool 14. The controller 24 monitors sensor data 130, 130a-130c to detect whether to stop operation at the automated tool 14. The suspension of the yarn 12 to the guide wheels 110 provides direct feedback about the length of the yarn 12 and its synthesis state within the distributor 20. Therefore, the yarn buffer system 10 can automatically detect errors in the yarn 12 based on the detection of positions 110a, 110b and the guide wheels 110 within the frame 102.

[0055] Many embodiments have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of this disclosure. Therefore, other embodiments are within the scope of the appended claims.

[0056] The foregoing description has been provided for purposes of illustration and description. It is not intended to be exhaustive or limiting of this disclosure. Elements or features of a particular configuration are generally not limited to that particular configuration, but are interchangeable where applicable and can be used in selected configurations, even if not specifically shown or described. They can also be varied in many ways. Such variations should not be considered as departing from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. A silk cushioning assembly, comprising: The frame includes a top that defines the first opening and the second opening; Guide wheels are disposed within the frame; Multiple guide pins are disposed within the frame and surrounding the guide wheel; and At least one sensor is positioned near the guide wheel and configured to detect the position of the guide wheel within the frame.

2. The silk buffer assembly of claim 1, wherein the at least one sensor includes a first guide wheel sensor disposed near the bottom of the frame, the first guide wheel sensor being configured to detect a first position of a guide wheel defined above the first guide wheel sensor.

3. The wire buffer assembly of claim 2, wherein the at least one sensor includes a second guide wheel sensor disposed between the first guide wheel sensor and the top of the frame, the second guide wheel sensor being configured to detect a second position of a guide wheel defined between the second guide wheel sensor and the top of the frame.

4. The silk buffer assembly of claim 3, wherein the at least one sensor includes a third guide wheel sensor disposed near the top of the frame, the third guide wheel sensor being configured to detect a third position of a guide wheel defined between the third guide wheel sensor and the top of the frame.

5. The filament buffer assembly of claim 4, wherein the at least one sensor comprises a filament feed sensor disposed at the top of the frame, the filament feed sensor being configured to detect filaments in the frame.

6. The wire buffer assembly according to claim 1, wherein each of the at least one sensor comprises at least one of a photoelectric sensor, a Hall effect sensor, an inductive sensor, and an ultrasonic sensor.

7. The wire buffer assembly of claim 1, further comprising a first panel connected to the frame and a second panel connected to the frame, the plurality of guide pins extending from the first panel to the second panel.

8. The silk buffer assembly of claim 7, wherein the guide wheel is suspended within the frame between the first panel and the second panel, and the guide wheel is not directly attached to each of the frame, the first panel, and the second panel.

9. The wire buffer assembly of claim 1, wherein the guide wheel includes a channel defined along the circumference of the guide wheel.

10. A silk cushioning system, comprising: The wire buffer assembly according to claim 1; An automated tool is configured to receive wire from a second opening in the frame; and A controller, communicatively connected to the automation tool, the controller comprising: Data processing hardware; and A memory hardware that communicates with the data processing hardware, the memory hardware storing instructions that, when executed on the data processing hardware, cause the data processing hardware to perform operations, the operations including: The motor is activated in response to the at least one sensor detecting that the guide wheel is in a raised position for a first predetermined time period, the raised position being defined by the guide wheel located above the at least one sensor; and The motor stops when the at least one sensor detects that the guide wheel is in a lowered position, and the lowered position defined by the guide wheel is positioned below the at least one sensor near the bottom of the frame for a second predetermined time period.

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