An automatic liquid replenishment structure for temperature control devices in the semiconductor field

Abstract

This invention relates to the field of semiconductor temperature control technology, and provides an automatic liquid replenishment structure for a temperature control device in the semiconductor field. The structure includes a housing with a liquid tank installed inside, and further includes a storage tank, a float, a contact switch, a liquid replenishment mechanism, and an exhaust mechanism. A filter plate capable of filtering impurities in the low-temperature coolant is fixedly connected inside the storage tank. The storage tank is fixedly connected to one side of the housing, and a liquid filling port is provided at the top of the storage tank. A liquid filling pipe is fixedly connected to the filling port, and a top cover is installed at the top of the liquid filling pipe. The float is slidably connected to the liquid tank via a sliding mechanism. The contact switch is installed inside the liquid tank via a height adjustment mechanism. The liquid replenishment mechanism and the exhaust mechanism are both located on the storage tank. This invention provides an automatic liquid replenishment structure for a temperature control device in the semiconductor field, solving the technical problems of cumbersome, time-consuming, and labor-intensive coolant replenishment processes and low replenishment efficiency in related technologies.

Description

Technical Field

[0001] This invention relates to the field of semiconductor temperature control technology, and more specifically to an automatic liquid replenishment structure for a temperature control device in the semiconductor field. Background Technology

[0002] Semiconductor manufacturing processes are complex and have stringent environmental requirements. As chip integration increases and process dimensions shrink, the requirements for temperature stability in production become increasingly stringent. Even minute temperature fluctuations can alter material properties, affecting chip performance and yield, and even damaging production equipment.

[0003] Early semiconductor processes were relatively simple, and basic heat dissipation was sufficient to meet temperature control requirements. However, with the development of precision processes such as photolithography, etching, and epitaxy, traditional heat dissipation methods can no longer meet the requirements. As a core process, photolithography generates a lot of heat in key components such as lenses and laser sources. If the temperature cannot be controlled in a timely and accurate manner, thermal expansion and contraction will cause pattern shifts and affect manufacturing precision. Currently, precision processes have achieved temperature control accuracy at the ±0.1℃ level.

[0004] Temperature control equipment achieves precise temperature control through circulating low-temperature coolant. However, after long-term operation, the coolant level will drop due to natural loss, thermal expansion and contraction, venting, and additive degradation, requiring periodic replenishment. Traditional replenishment methods lack automatic level detection and replenishment mechanisms, necessitating real-time manual monitoring of the coolant level. This not only increases labor costs but also increases the risk of level detection errors, leading to overfilling or underfilling of coolant and affecting the temperature control equipment's circulation and control effectiveness. Furthermore, replenishment during shutdowns can disrupt semiconductor manufacturing processes, reducing overall production efficiency. Manual venting operations are prone to incomplete venting, leaving residual air in the coolant circulation pipeline, causing uneven pressure within the pipeline, further reducing temperature control accuracy, and even causing cavitation damage to the circulation pump, shortening the equipment's lifespan. Summary of the Invention

[0005] To overcome the above-mentioned defects, embodiments of the present invention provide an automatic coolant replenishment structure for a temperature control device in the semiconductor field, which solves the technical problems of cumbersome operation, time-consuming and labor-intensive operation, and low replenishment efficiency in the related technologies.

[0006] At least one embodiment of the present invention provides an automatic liquid replenishment structure for a temperature control device in the semiconductor field, including a housing, a liquid tank for storing cryogenic coolant installed inside the housing, and further including: a storage tank, a float, a contact switch, a liquid replenishment mechanism, and an exhaust mechanism. A filter plate for filtering impurities in the cryogenic coolant is fixedly connected inside the storage tank. The storage tank is fixedly connected to one side of the housing, and a liquid filling port is provided at the top of the storage tank. A liquid filling pipe is fixedly connected to the liquid filling port, and a top cover is installed at the top of the liquid filling pipe. The float is slidably connected inside the liquid tank via a sliding mechanism, which supports the float to move smoothly up and down with the liquid level. The contact switch is installed inside the liquid tank via a height adjustment mechanism, which adjusts the contact position of the contact switch. The liquid replenishment mechanism is located on the storage tank and is used to replenish cryogenic coolant into the liquid tank. The exhaust mechanism is located on the storage tank and is used to vent air from the liquid tank.

[0007] To support the float's vertical movement as the coolant level changes, the sliding mechanism includes a slide bar and a slide plate. There are two slide bars, both of which are fixedly connected inside the coolant tank. The slide plate is slidably connected to the two slide bars. The float is fixedly connected to the top of the slide plate, and the bottom of the slide plate is in contact with the force-bearing end of the contact switch.

[0008] To adjust the contact position of the contact switch, the height adjustment mechanism includes a guide plate, an adjusting rod, and a limiting assembly. Two guide rods are fixedly connected inside the liquid tank. The guide plate is slidably connected to the two guide rods and is slidably connected inside the liquid tank. The contact switch is installed at the bottom end of the guide plate. The adjusting rod is fixedly connected to the top end of the guide plate. A sliding hole is provided at the top end of the liquid tank, and the adjusting rod is slidably connected inside the sliding hole. The limiting assembly is located at the top end of the liquid tank and is used to limit and fix the height of the adjusting rod. The limiting assembly includes a fixed plate, a support rod, and a support spring. The fixed plate is fixedly connected to the top end of the liquid tank. The support rod is slidably connected to the fixed plate. One end of the support rod is fixedly connected to a clamping plate. The other side of the clamping plate is fixedly connected to a rubber layer. The other side of the rubber layer contacts the adjusting rod. Several anti-slip grooves are provided on the adjusting rod, and the other side of the rubber layer contacts the anti-slip grooves. The support spring is sleeved on the support rod, and both ends of the support spring elastically abut against the fixed plate and the clamping plate, respectively.

[0009] To replenish the coolant in the liquid tank, the replenishment mechanism includes a water pump and a delivery pipe. The water pump is installed at the top of the storage tank. The input end of the water pump is connected to a water inlet pipe. The bottom end of the water inlet pipe passes through the storage tank and extends into the storage tank. One end of the delivery pipe is connected to the output end of the water pump, and the other end of the delivery pipe passes through the tank body and the liquid tank and extends into the liquid tank.

[0010] In order to remove residual air from the tank after replenishment, the venting mechanism includes an air pump and an vent pipe. The air pump is installed at the top of the storage tank, one end of the vent pipe is connected to the input end of the air pump, and the other end of the vent pipe passes through the tank body and the tank and extends into the tank.

[0011] This invention provides an automatic liquid replenishment structure for a temperature control device in the semiconductor field, which, compared with existing technologies, offers the following advantages: The real-time automatic detection of coolant level in the tank is achieved by using a float and sliding mechanism. Combined with the electrical signal connection between the contact switch and the replenishment mechanism, the coolant can be automatically replenished without stopping the machine. This solves the problem of production interruption caused by machine stoppage in traditional replenishment methods, and greatly improves replenishment efficiency and production continuity. The height adjustment mechanism can flexibly adjust the installation height of the contact switch, so as to achieve precise adjustment of the liquid level and adapt to the coolant level requirements of semiconductor temperature control equipment under different operating conditions. It solves the problem of inaccurate control of liquid level by traditional manual filling and ensures the circulation temperature control effect of the temperature control equipment. The coolant replenishment mechanism uses a water pump to automatically deliver coolant. In conjunction with the filter plate in the storage tank, it can effectively filter impurities in the coolant, preventing impurities from entering the tank and temperature control circulation pipeline, thus preventing pipeline blockage and wear on components of the water pump and temperature control equipment, and extending the service life of the equipment. The exhaust mechanism works in conjunction with the liquid replenishment mechanism to achieve automatic exhaust, which can promptly remove residual air from the liquid tank after liquid replenishment, ensuring uniform pressure in the coolant circulation pipeline, avoiding the decrease in temperature control accuracy and pump cavitation problems caused by air, and ensuring that the temperature control accuracy of the semiconductor temperature control equipment is maintained within the process requirement of ±0.1℃. The limiting component uses a rubber layer to cooperate with the anti-slip groove on the adjusting rod to firmly fix the height of the contact switch, preventing the float from hitting the slide plate due to coolant level fluctuations, which would cause the contact switch position to shift, thus ensuring the stability of liquid level detection and liquid replenishment triggering. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the box provided in an embodiment of the present invention; Figure 3This is a schematic diagram of the sliding mechanism, height adjustment mechanism, and liquid replenishment mechanism provided in the embodiments of the present invention; Figure 4 This is a schematic diagram of the sliding mechanism provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the height adjustment mechanism provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the limiting component provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the fluid replenishment mechanism provided in an embodiment of the present invention.

[0014] In the diagram: 1. Box body; 2. Liquid tank; 3. Storage box; 4. Float; 5. Contact switch (5); 6. Slide rod; 7. Slide plate; 8. Guide plate; 9. Adjusting rod; 10. Fixing plate; 11. Support rod; 12. Pressing plate; 13. Support spring; 14. Water pump; 15. Water inlet pipe; 16. Delivery pipe; 17. Air pump; 18. Exhaust pipe; 19. Liquid filling pipe; 20. Top cover; 21. Filter plate; 22. Guide rod; 23. Anti-slip groove. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0016] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0017] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0018] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in a sequence other than those illustrated or described herein.

[0019] To make the drawings concise and easy to understand, some drawings only show one of the components with the same structure or function, or only one of them is marked. In this article, "one" not only means "only one", but can also mean "more than one", and "several" includes "two" and "more than two".

[0020] Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus. It is understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. The embodiments of this application are described in detail below with reference to the accompanying drawings.

[0021] like Figures 1-7As shown, this invention illustrates an automatic liquid replenishment structure for a temperature control device in the semiconductor field, comprising a housing 1, a liquid tank 2 for storing cryogenic coolant installed inside the housing 1, and further comprising: a storage tank 3, a float 4, a contact switch 5, a liquid replenishment mechanism, and an exhaust mechanism. A filter plate 21 for filtering impurities in the cryogenic coolant is fixedly connected inside the storage tank 3. The storage tank 3 is fixedly connected to one side of the housing 1, and a liquid inlet is provided at the top of the storage tank 3. A liquid inlet pipe 19 is fixedly connected to the liquid inlet, and a top cover 20 is installed at the top of the liquid inlet pipe 19. The float 4 is slidably connected inside the liquid tank 2 via a sliding mechanism, which supports the float 4 to move smoothly up and down with the liquid level. The contact switch 5 is installed inside the liquid tank 2 via a height adjustment mechanism, which adjusts the contact position of the contact switch 5. The liquid replenishment mechanism is located on the storage tank 3 for replenishing cryogenic coolant into the liquid tank 2, and the exhaust mechanism is located on the storage tank 3 for venting air from the liquid tank 2.

[0022] The sliding mechanism includes: a slide rod 6 and a slide plate 7. There are two slide rods 6, both of which are fixedly connected inside the liquid tank 2. The slide plate 7 is slidably connected to the two slide rods 6. The float 4 is fixedly connected to the top of the slide plate 7. The bottom of the slide plate 7 is in contact with the force-bearing end of the contact switch 5.

[0023] When the liquid level rises or falls, the float 4 rises or falls with the liquid level due to buoyancy. At this time, the slide plate 7 slides on the slide bar 6, thereby supporting the float 4 to move vertically up and down.

[0024] The height adjustment mechanism includes: a guide plate 8, an adjusting rod 9, and a limiting assembly. Two guide rods 22 are fixedly connected inside the liquid tank 2. The guide plate 8 is slidably connected to the two guide rods 22 and is slidably connected inside the liquid tank 2. A contact switch 5 is installed at the bottom end of the guide plate 8. The adjusting rod 9 is fixedly connected to the top end of the guide plate 8. A sliding hole is opened at the top end of the liquid tank 2, and the adjusting rod 9 is slidably connected in the sliding hole. The limiting assembly is set at the top end of the liquid tank 2 to limit and fix the height of the adjusting rod 9. The limiting assembly includes: a fixing plate 10. The support rod 11 and support spring 13 are fixedly connected to the top of the liquid tank 2 by the fixing plate 10. The support rod 11 is slidably connected to the fixing plate 10. One end of the support rod 11 is fixedly connected to the abutment plate 12. The other side of the abutment plate 12 is fixedly connected to the rubber layer. The other side of the rubber layer is in contact with the adjusting rod 9. The adjusting rod 9 is provided with several anti-slip grooves 23. The other side of the rubber layer is in contact with the anti-slip grooves 23. The support spring 13 is sleeved on the support rod 11. The two ends of the support spring 13 are elastically abutting against the fixing plate 10 and the abutment plate 12, respectively.

[0025] When the position of the contact switch 5 needs to be adjusted, the adjusting rod 9 is moved up and down, causing the guide plate 8 to slide on the guide rod 22, thereby causing the contact switch 5 installed on the guide plate 8 to be adjusted up and down. After the position of the contact switch 5 is determined, the support spring 13 pushes against the pressing plate 12 to move. When the pressing plate 12 moves, the support rod 11 slides on the fixed plate 10, thereby causing the rubber pad on the pressing plate 12 to press against the anti-slip groove 23 opened on the adjusting rod 9, thereby limiting and fixing the position of the adjusting rod 9.

[0026] The replenishment mechanism includes a water pump 14 and a delivery pipe 16. The water pump 14 is installed at the top of the storage tank 3. The input end of the water pump 14 is connected to a water supply pipe 15. The bottom end of the water supply pipe 15 passes through the storage tank 3 and extends into the storage tank 3. One end of the delivery pipe 16 is connected to the output end of the water pump 14. The other end of the delivery pipe 16 passes through the tank body 1 and the liquid tank 2 and extends into the liquid tank 2.

[0027] The cryogenic coolant prepared in the storage tank 3 is extracted by the water pump 14 and the water supply pipe 15, and then transported to the liquid tank 2 through the delivery pipe 16 to achieve liquid replenishment.

[0028] The exhaust mechanism includes an air pump 17 and an exhaust pipe 18. The air pump 17 is installed at the top of the storage tank 3. One end of the exhaust pipe 18 is connected to the input end of the air pump 17, and the other end of the exhaust pipe 18 passes through the tank 1 and the liquid tank 2 and extends into the liquid tank 2.

[0029] After the cryogenic coolant is replenished, start the air pump 17 to purge the air from the coolant tank 2 through the air pump 17 and the exhaust pipe 18.

[0030] The working principle is as follows: when it is necessary to replenish the coolant in the liquid tank 2, first open the top cover 20 of the liquid filling pipe 19 and add the coolant into the storage tank 3 through the liquid filling port. The coolant is filtered by the filter plate 21 in the storage tank 3 and stored below the filter plate 21 to complete the removal of impurities. Then, according to the working conditions of the semiconductor temperature control equipment, the height of the contact switch 5 is adjusted by the height adjustment mechanism to set the liquid level for liquid replenishment and the liquid level for stopping. After the adjustment is completed, the contact switch 5 is firmly fixed by the limit component. When the coolant level in tank 2 decreases, float 4 descends with the level until slide plate 7 touches the force-bearing end of contact switch 5, triggering contact switch 5 to close and sending an electrical signal to water pump 14, controlling water pump 14 to start. Water pump 14 draws the filtered coolant from storage tank 3 and delivers it to tank 2 through water inlet pipe 15 and delivery pipe 16, achieving automatic coolant replenishment. When the coolant level in tank 2 rises to a set height, float 4 drives slide plate 7 to rise and disengage from contact switch 5. Contact switch 5 disconnects and sends an electrical signal to water pump 14, controlling water pump 14 to stop, and coolant replenishment stops. At the same time water pump 14 stops, the electrical signal triggers air pump 17 to start automatically. Air pump 17 and exhaust pipe 18 extract residual air from tank 2. After the set exhaust time, air pump 17 automatically stops, completing the entire automatic coolant replenishment and automatic exhaust process. The entire process requires no machine shutdown and all actions are automatically triggered without manual intervention. The accuracy of liquid level detection and replenishment is ensured by the height adjustment mechanism and the sliding mechanism. The filter plate 21 can effectively protect the water pump 14 and the temperature control pipeline, preventing impurities from clogging and wearing out.

[0031] It should also be noted that the limit switch 5 establishes an electrical signal linkage control relationship with the water pump 14 and the air pump 17. The stop signal of the water pump 14 synchronously triggers the start of the air pump 17, and the air pump 17 automatically stops after working for a preset time.

[0032] After the coolant is filled, close the top cover 20 to seal the filling pipe 19 and prevent coolant from evaporating or impurities from entering the storage tank 3.

[0033] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An automatic liquid replenishment structure for a temperature control device in the semiconductor field, comprising a housing (1), wherein a liquid tank (2) for storing cryogenic coolant is installed inside the housing (1), characterized in that, Also includes: Storage box (3), the storage box (3) is fixedly connected to one side of the box body (1), and the top of the storage box (3) is provided with a liquid filling port; A float (4) is slidably connected to the liquid tank (2) by a sliding mechanism. The sliding mechanism is used to support the float (4) as it moves smoothly up and down with the liquid level. Contact switch (5), the contact switch (5) is installed in the liquid tank (2) by a height adjustment mechanism, the height adjustment mechanism is used to adjust the contact position of the contact switch (5); A replenishment mechanism is provided on the storage tank (3) for replenishing the liquid tank (2) with low-temperature coolant; The venting mechanism is installed on the storage tank (3) and is used to vent the residual air in the liquid tank (2) after the liquid replenishment is completed.

2. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, The sliding mechanism includes: Slide rod (6), two slide rods (6) are provided, and both slide rods (6) are fixedly connected inside the liquid tank (2); The slide (7) is slidably connected to two slide bars (6), the float (4) is fixedly connected to the top of the slide (7), and the bottom of the slide (7) is in contact with the force-bearing end of the contact switch (5).

3. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, The height adjustment mechanism includes: Guide plate (8), the guide plate (8) is slidably connected inside the liquid tank (2), and the contact switch (5) is installed at the bottom end of the guide plate (8); Adjusting rod (9), the adjusting rod (9) is fixedly connected to the top of the guide plate (8), the top of the liquid tank (2) is provided with a sliding hole, and the adjusting rod (9) is slidably connected in the sliding hole; A limiting component is provided at the top of the liquid tank (2) to limit and fix the height of the adjusting rod (9).

4. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 3, characterized in that, The limiting component includes: A fixing plate (10) is fixedly connected to the top of the liquid tank (2); Support rod (11), the support rod (11) is slidably connected to the fixed plate (10), one end of the support rod (11) is fixedly connected to the abutment plate (12), the other side of the abutment plate (12) is fixedly connected to the rubber layer, and the other side of the rubber layer is in contact with the adjusting rod 9; Support spring (13) is sleeved on support rod (11), and the two ends of support spring (13) are elastically abutted against fixing plate (10) and clamping plate (12) respectively.

5. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, The fluid replenishment mechanism includes: A water pump (14) is installed at the top of the storage tank (3). The input end of the water pump (14) is connected to a water supply pipe (15). The bottom end of the water supply pipe (15) passes through the storage tank (3) and extends into the storage tank (3). The delivery pipe (16) has one end connected to the output end of the water pump (14) and the other end of the delivery pipe (16) passes through the box (1) and the liquid tank (2) and extends into the liquid tank (2).

6. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, The exhaust mechanism includes: An air pump (17) is installed on top of the storage box (3); An exhaust pipe (18) is connected at one end to the input end of an air pump (17), and the other end of the exhaust pipe (18) passes through the housing (1) and the liquid tank (2) and extends into the liquid tank (2).

7. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, A liquid filling tube (19) is fixedly connected to the liquid filling port, and a top cover (20) is installed at the top of the liquid filling tube (19).

8. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 1, characterized in that, The storage box (3) is fixedly connected to a filter plate (21) that can filter impurities in the low-temperature coolant.

9. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 3, characterized in that, The liquid tank (2) is fixedly connected to two guide rods (22), and the guide plate (8) is slidably connected to the two guide rods (22).

10. The automatic liquid replenishment structure of a temperature control device in the semiconductor field according to claim 4, characterized in that, The adjusting rod (9) has several anti-slip grooves (23), and the other side of the rubber layer is in contact with the anti-slip grooves (23).

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