Resin composition and laminate comprising resin composition

Abstract

This invention discloses a resin composition and a laminate comprising the resin composition. The resin composition comprises 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate-modified epoxy resin; 16 to 20 parts by weight of phenolic resin; and 2 to 35 parts by weight of inorganic filler. The resin composition of this invention and the laminate comprising the resin composition possess high insulation, high heat resistance, and halogen-free environmental friendliness.

Description

Technical Field

[0001] This invention relates to a resin composition and a laminate comprising the resin composition, and more particularly to a resin composition and a laminate comprising the resin composition that possesses high insulation, high heat resistance and halogen-free environmental friendliness. Background Technology

[0002] With increasing societal focus on safety, improving the safety and reliability of electronic products has become increasingly important. This is especially true for insulating materials used in humid environments (such as motors and electrical appliances), where their safety and reliability are critical. Therefore, developing products with high insulation performance to ensure the stable operation of electronic equipment under various environmental conditions has become a significant development trend in recent years.

[0003] In fiberglass FR4 boards, to achieve a UL94V-O rating, the mass ratio of bromine to organic solids in the board, i.e., the total bromine content, typically needs to be 15% or higher. However, high bromine content not only contradicts environmental friendliness but also significantly reduces the material's heat resistance due to the easy breakage of C-Br bonds. Furthermore, because bromine accelerates material leakage failure between two circuits on a circuit board, high-bromine organic materials are unsuitable for use in high-temperature, high-pressure, humid, and easily polluted environments.

[0004] Therefore, for example, CN101654004A and CN102382420A both indicate that by reducing the bromine content in the resin system or by specifically modifying the epoxy resin and adding a large amount of inorganic filler (such as aluminum hydroxide), the material can remain stable in harsh environments. However, excessive aluminum hydroxide can reduce the heat resistance of the material because aluminum hydroxide has a low thermal decomposition temperature, beginning to dehydrate at around 200°C. Since the soldering temperature range of PCBs is typically between 245°C and 260°C, excessive aluminum hydroxide may cause the final board to delaminate and blister at high temperatures, thus affecting the reliability of the product.

[0005] Therefore, how to provide copper clad laminate technology that combines high insulation, high heat resistance, and halogen-free environmental protection through formula improvement has become one of the important issues that this industry seeks to solve. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a resin composition and a laminate comprising the resin composition, in order to overcome the shortcomings of the prior art.

[0007] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a resin composition comprising: 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate-modified epoxy resin; 16 to 20 parts by weight of phenolic resin; and 2 to 35 parts by weight of inorganic filler.

[0008] Furthermore, the epoxy resin is a glycidyl ester type epoxy resin.

[0009] Furthermore, the benzoxazine resin is an MDA-type benzoxazine resin, a phenolphthalein-type benzoxazine resin, or a mixture thereof.

[0010] Furthermore, the phenolic resin is selected from the group consisting of linear phenolic resins and o-cresol-formaldehyde resins.

[0011] Furthermore, the inorganic filler is selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica powder, and boron nitride.

[0012] Furthermore, the inorganic filler comprises 1 to 5 parts by weight of nano-silica and 1 to 30 parts by weight of alumina.

[0013] Furthermore, the resin composition further includes an accelerator selected from the group consisting of imidazole curing accelerators, organophosphorus curing accelerators, and tertiary amine curing accelerators.

[0014] Furthermore, the resin composition further comprises a flame retardant selected from tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide, 2,6-di(2,6-dimethylphenyl)phosphobenzene, or 10-phenyl-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide.

[0015] Furthermore, the resin composition further includes an auxiliary agent, which is an aminosilane coupling agent or an epoxysilane coupling agent.

[0016] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a laminate comprising the resin composition as described above.

[0017] One of the beneficial effects of the present invention is that the resin composition and laminate comprising the resin composition provided by the present invention can provide a resin composition and laminate that have high insulation, high heat resistance and halogen-free environmental protection by means of the technical solution of "the resin composition comprising 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate modified epoxy resin; 16 to 20 parts by weight of phenolic resin" and "the resin composition comprising 2 to 35 parts by weight of inorganic filler".

[0018] To further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention. However, the detailed description provided is for reference and illustration only and is not intended to limit the present invention. Detailed Implementation

[0019] The following specific embodiments illustrate the implementation of the "resin composition and laminate comprising the resin composition" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0020] An embodiment of the present invention provides a resin composition comprising 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate-modified epoxy resin; 16 to 20 parts by weight of phenolic resin; and 2 to 35 parts by weight of inorganic filler.

[0021] As an insulating material, the resin composition of the present invention uses an epoxy resin with a high relative tracking index (CTI), toughness, and cohesiveness as the main material. Specifically, the present invention uses 24 to 47 parts by weight of epoxy resin (e.g., any positive integer between 24 and 47), and the epoxy resin can be a glycidyl ester type epoxy resin, such as diglycidyl hexahydrophthalate (trade name S-184) manufactured by Shin-Nashi New Materials Co., Ltd., whose structure is shown in Formula 1 below:

[0022]

[0023] As shown in Formula 1, the structure contains cyclohexane diglycidyl groups, which provide better resistance to tracking, while the glycidyl ester groups impart excellent electrical insulation. Therefore, the epoxy resin of this invention uses hexahydrophthalic acid diglycidyl ester, which has a saturated aliphatic hydrocarbon skeleton structure. During the electrochemical decomposition process, carbon dioxide and water are produced, and graphite is not generated, thus avoiding the risk of short circuits.

[0024] Furthermore, benzoxazine resin is a nitrogen-containing phenolic compound with excellent heat resistance and flame retardancy. The phosphorus-nitrogen synergistic effect, through the interaction between the nitrogen-containing structure and the phosphorus epoxy resin, helps to improve the flame retardant properties of the product. In one embodiment of the present invention, 5 to 9 parts by weight of benzoxazine resin (e.g., any positive integer between 5 and 9) are used. The benzoxazine resin is 4,4'-diaminodiphenylmethane type benzoxazine (MDA type benzoxazine), phenolphthalein type benzoxazine resin, or a mixture thereof. Specifically, the benzoxazine resin used in the present invention can be MDA type benzoxazine resin (trade name BZ-1201) manufactured by Shengquan Company or phenolphthalein type benzoxazine resin (trade name LZ 8270N70) manufactured by Huntsman Company.

[0025] The resin composition of the present invention comprises 30 to 53 parts by weight of isocyanate-modified epoxy resin (e.g., any positive integer between 30 and 53). The isocyanate-modified epoxy resin can improve the flexibility of the epoxy resin, mitigate the brittleness of cured epoxy resin, and enhance bond strength or peel strength. Specifically, the isocyanate-modified epoxy resin used in the present invention can be an isocyanate-modified epoxy resin manufactured by Dow Chemical Company (trade name XZ97103).

[0026] To improve the heat resistance of the resin composition of the present invention, the resin composition of the present invention comprises 16 to 20 parts by weight of phenolic resin (e.g., any positive integer between 16 and 20). In one embodiment of the present invention, the phenolic resin may be selected from the group consisting of linear phenolic resins and o-cresol-formaldehyde resins. Specifically, the phenolic resin may be a linear phenolic resin (trade name SH3098) manufactured by Shengquan Company.

[0027] Furthermore, the resin composition of the present invention may further include 0.01 to 0.07 parts by weight of an accelerator (e.g., any positive integer between 0.01 and 0.07), the accelerator being selected from the group consisting of imidazole curing accelerators, organophosphorus curing accelerators, and tertiary amine curing accelerators. Specifically, the accelerator may be diethyltetramethylimidazole (trade name 2-E-4MI) manufactured by Shikoku Chemical.

[0028] To ensure uniform dispersion of the inorganic filler in the epoxy resin and improve the bonding force between the resin and the filler, appropriate additives can be added to the epoxy resin composition. In one embodiment of the invention, the resin composition may further include 0.6 to 1 part by weight of an additive (e.g., any positive integer between 0.6 and 1), which may be an aminosilane coupling agent or an epoxysilane coupling agent. Specifically, the additive may be a silane (trade name A-1110) manufactured by Momentive, which has characteristics such as amino functional groups and exhibits rapid amino activity when used in combination with isocyanate functional group polymers, epoxy resins, phenolic resins, acrylics, etc., and can also catalyze silane activity.

[0029] In one embodiment, the resin composition may further comprise 15 to 35 parts by weight of a flame retardant (e.g., any positive integer between 15 and 35). Optionally, a phosphorus-based flame retardant insoluble in the resin system may be selected. Phosphorus-based flame retardants generally do not react with other resins and do not reduce heat resistance. The flame retardant may be selected from tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide, 2,6-di(2,6-dimethylphenyl)phosphobenzene, or 10-phenyl-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide. For example, a phosphorus-containing flame retardant (trade name SPB-100) manufactured by Otsuka Chemicals can be used as the flame retardant.

[0030] In this invention, the resin composition may further include 2 to 35 parts by weight of inorganic filler (e.g., any positive integer between 2 and 35). In this invention, the inorganic filler may be selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica powder, and boron nitride. Optionally, the inorganic filler may be silica, nano-silica, or alumina. For example, nano-silica (trade name A380) manufactured by Evonik Industries, Ltd., alumina (trade name DCA-02S) manufactured by Tosho New Materials Co., Ltd., and silica (trade name 925) manufactured by SXS. More specifically, the inorganic filler used in this invention may include 1 to 5 parts by weight of nano-silica and 1 to 30 parts by weight of alumina.

[0031] Example 1

[0032] Dissolve 5.3g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 17.7g of phenolic resin. After stirring and dissolving, add 46.2g of epoxy resin and 30.8g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0033] Example 2

[0034] Dissolve 8.5g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 16.5g of phenolic resin. After stirring and dissolving, add 34.6g of epoxy resin and 40.4g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0035] Example 3

[0036] Dissolve 5g of phenolphthalein-type benzoxazine resin in an appropriate amount of acetone, then add 18g of phenolic resin. After stirring and dissolving, add 24.7g of epoxy resin and 52.3g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0037] Example 4

[0038] Dissolve 8.5g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 16.5g of phenolic resin. After stirring and dissolving, add 34.6g of epoxy resin and 40.4g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0039] Example 5

[0040] Dissolve 5g of phenolphthalein-type benzoxazine resin in an appropriate amount of acetone, then add 18g of phenolic resin. After stirring and dissolving, add 24.7g of epoxy resin and 52.3g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 30g of alumina, and 45g of silica.

[0041] Comparative Example 1

[0042] Dissolve 5.1g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 16.9g of phenolic resin. After stirring and dissolving, add 45.5g of dicyclopentadiene-type phenolic epoxy resin and 32.5g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0043] Comparative Example 2

[0044] Dissolve 5.2g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 17.8g of phenolic resin. After stirring and dissolving, add 46g of epoxy resin and 31g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, and 75g of silica.

[0045] Comparative Example 3

[0046] Dissolve 8.5g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 16.5g of phenolic resin. After stirring and dissolving, add 34.6g of epoxy resin and 40.4g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 25g of alumina, and 55g of silica.

[0047] Comparative Example 4

[0048] Dissolve 8.5g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 16.5g of phenolic resin. After stirring and dissolving, add 34.6g of epoxy resin and 40.4g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 8g of nano-silica, 25g of alumina, and 47g of silica.

[0049] Comparative Example 5

[0050] Dissolve 5g of phenolphthalein-type benzoxazine resin in an appropriate amount of acetone, then add 18g of phenolic resin. After stirring and dissolving, add 24.7g of epoxy resin and 52.3g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 33g of alumina, and 42g of silica.

[0051] Comparative Example 6

[0052] Dissolve 5g of phenolphthalein-type benzoxazine resin in an appropriate amount of acetone, then add 18g of phenolic resin. After stirring and dissolving, add 24.7g of epoxy resin and 52.3g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 42g of silica, and 30g of aluminum hydroxide.

[0053] Comparative Example 7

[0054] After dissolving 23g of phenolic resin in an appropriate amount of acetone, add 24.7g of epoxy resin and 52.3g of isocyanate-modified epoxy resin. After the resin components are stirred and dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 30g of alumina, and 45g of silica.

[0055] Comparative Example 8

[0056] Dissolve 5.3g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 17.7g of phenolic resin. After stirring and dissolving, add 50.2g of epoxy resin and 26.8g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0057] Comparative Example 9

[0058] Dissolve 5g of phenolphthalein-type benzoxazine resin in an appropriate amount of acetone, then add 18g of phenolic resin. After stirring and dissolving, add 20.7g of epoxy resin and 56.3g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0059] Comparative Example 10

[0060] Dissolve 9.3g of MDA-type benzoxazine resin in an appropriate amount of acetone, then add 13.7g of phenolic resin. After stirring and dissolving, add 46.2g of epoxy resin and 30.8g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0061] Comparative Example 11

[0062] Dissolve 1.2g of MDA-type benzoxazine in an appropriate amount of acetone, then add 21.8g of phenolic resin. After stirring and dissolving, add 46g of epoxy resin and 31g of isocyanate-modified epoxy resin. After the aforementioned resin components have dissolved, add 0.04g of accelerator, 0.76g of additive, 23g of flame retardant, 5g of nano-silica, 20g of alumina, and 55g of silica.

[0063] The composition and physical property measurement results of Examples 1 to 3 of this case, as well as Comparative Examples 1 and 2, are shown in Table 1.

[0064] Table 1

[0065]

[0066]

[0067] As shown in Table 1 above, comparing Example 1 and Comparative Example 2, the epoxy resin used in this embodiment of the invention has a higher CTI value than the epoxy resin used in Comparative Example 1. A comparison of Example 1 and Comparative Example 2 shows that the high thermal conductivity filler alumina helps to improve the CTI value by increasing thermal conductivity.

[0068] The composition and physical property measurement results of Example 4, Comparative Example 3 and Comparative Example 4 are shown in Table 2.

[0069] Table 2

[0070] Material Product Name Example 4 Comparative Example 3 Comparative Example 4 A S-184 34.6 34.6 34.6 A1 DNE260 / / / B BZ-1201 8.5 8.5 8.5 B1 LZ 8270N70 / / / C XZ97103 40.4 40.4 40.4 D SH3098 16.5 16.5 16.5 E 2-E-4MI 0.04 0.04 0.04 F A-1100 0.76 0.76 0.76 G SPB-100 23 23 23 H A380 5 0 8 H1 DCA-02S 25 25 25 H2 925 50 55 47 H3 H42M / / / characteristic unit Tg ℃ 148 149 149 CTI V 600 500 600 thermal conductivity W / (m·K) 0.43 0.44 0.43 Drill bit wear / Pass Pass Pass T288 min >60 >60 41 Flame retardant V0 V0 V0 V0 Laminate toughness / Pass Pass Pass

[0071] As shown in Table 2 above, comparative examples 4, 3 and 4 demonstrate that an appropriate amount of nano-silica can improve the CTI value of the resin, but excessive addition will affect the heat resistance T288.

[0072] The composition and physical property measurement results of Example 5, Comparative Example 5, Comparative Example 6 and Comparative Example 7 are shown in Table 3.

[0073] Table 3

[0074]

[0075]

[0076] As shown in Table 3 above, the results from Example 5 and Comparative Examples 5 and 6 indicate that excessive alumina leads to higher material hardness and severe drill bit wear during drilling. Although adding aluminum hydroxide improves CTI, it deteriorates the heat resistance T288. The difference between Example 5 and Comparative Example 7 is that Example 5 shows that adding benzoxazine helps improve the heat resistance of the material.

[0077] The composition and physical property measurement results of Comparative Examples 8 to 11 are shown in Table 4.

[0078] Table 4

[0079]

[0080]

[0081] According to Table 4 above, comparing Example 1 and Comparative Example 8, excessive epoxy resin content leads to decreased toughness of the laminate. Comparative Example 3 and Comparative Example 9, insufficient epoxy resin content results in a lower Tg of the material. Comparative Examples 1, 10, and 11 show that reducing the amount of phenolic resin decreases the heat resistance T288, and reducing the amount of benzoxazine affects the flame retardant properties of the material.

[0082] In the materials column of Tables 1 to 4, A represents diglycidyl hexahydrophthalate S-184 manufactured by Xinnashi New Materials Co., Ltd.; A1 represents dicyclopentadiene-type phenolic epoxy resin DNE260 manufactured by Jining Fangyu Chemical Co., Ltd.; B represents MDA-type benzoxazine resin BZ-1201 manufactured by Shengquan Co., Ltd.; B1 represents phenolphthalein-type benzoxazine resin LZ8270N70 manufactured by Huntsman Co., Ltd.; C represents isocyanate-modified epoxy resin XZ97103 manufactured by Dow Co., Ltd.; D represents resin manufactured by Shengquan Co., Ltd. The linear phenolic resin SH3098; E represents diethyltetramethylimidazolium 2-E-4MI manufactured by Shikoku Chemical; F represents silane A-1110 manufactured by Momentive; G represents phosphorus-containing flame retardant SPB-100 of phosphorus nitrogen nitrile additive manufactured by Otsuka Chemical; H represents nano silica A380 manufactured by Evonik; H1 represents alumina DCA-02S manufactured by Tocho New Materials Co., Ltd.; H2 represents silica 925 manufactured by Shibico Co., Ltd.; H3 represents aluminum hydroxide H42M manufactured by Showa Denko.

[0083] Test methods

[0084] Glass transition temperature (Tg, °C): Determined using a thermomechanical analyzer (TMA) according to section 2.4.25 of IPC-TM-650.

[0085] Tracking index (CTI) (V, 50D): Measured according to GB / T 4207-2003 standard.

[0086] Thermal conductivity (W / (m·K)): Measured according to GB / T32064 standard.

[0087] Drill bit wear: Compare images of brand new drill bits and worn drill bits to identify wear characteristics such as the cutting edge and assess the results. A smooth drill bit surface is indicated as Pass, while a deformed drill bit cutting edge is indicated as NG.

[0088] T288 test (min): The stratification time of the sample was measured using thermomechanical analysis (TMA).

[0089] Flame retardancy is determined according to the UL94 method.

[0090] Laminate toughness: An impact tester was used with a drop height of 45cm and a drop weight of 1kg. Toughness assessment: A clear crosshair indicates better toughness, indicated by the character "Pass"; a blurry crosshair indicates poor toughness and brittleness, indicated by the character "NG".

[0091] On the other hand, the present invention can be further processed into a laminate using the above-mentioned resin composition and applied to the fields of metal foil laminates and printed circuit boards to provide a laminate that combines high insulation, high heat resistance and halogen-free environmental protection.

[0092] Beneficial effects of the embodiments

[0093] One of the beneficial effects of the present invention is that the resin composition and laminate comprising the resin composition provided by the present invention can provide a resin composition and laminate that have high insulation, high heat resistance and halogen-free environmental protection by means of the technical solution that "the resin composition comprises 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate modified epoxy resin; 16 to 20 parts by weight of phenolic resin" and "the resin composition comprises 2 to 35 parts by weight of inorganic filler".

[0094] Furthermore, the epoxy resin used in this invention is diglycidyl hexahydrophthalic acid, which produces carbon dioxide and water during electrochemical decomposition but does not generate graphite, thus avoiding the risk of short circuits.

[0095] Furthermore, in the resin composition of the present invention, the epoxy resin content is preferably 24 to 47 parts by weight. Excessive epoxy resin content will lead to poor toughness of the laminate, while insufficient epoxy resin content will result in a low Tg of the material. Nano-silica is preferably 5 parts by weight or less; excessive addition of nano-silica will affect the heat resistance of the resin composition.

[0096] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification are included within the scope of protection of the claims of the present invention.

Claims

1. A resin composition, characterized in that, The resin composition comprises: 24 to 47 parts by weight of epoxy resin; 5 to 9 parts by weight of benzoxazine resin; 30 to 53 parts by weight of isocyanate-modified epoxy resin; 16 to 20 parts by weight of phenolic resin; and 2 to 35 parts by weight of inorganic filler.

2. The resin composition according to claim 1, characterized in that, The epoxy resin is a glycidyl ester type epoxy resin.

3. The resin composition according to claim 1, characterized in that, The benzoxazine resin is selected from one or two of 4,4'-diaminodiphenylmethane type benzoxazine resin and phenolphthalein type benzoxazine resin.

4. The resin composition according to claim 1, characterized in that, The phenolic resin is selected from the group consisting of linear phenolic resin and o-cresol formaldehyde resin.

5. The resin composition according to claim 1, characterized in that, The inorganic filler is selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica powder, and boron nitride.

6. The resin composition according to claim 1, characterized in that, The inorganic filler comprises 1 to 5 parts by weight of nano-silica and 1 to 30 parts by weight of alumina.

7. The resin composition according to claim 1, characterized in that, The resin composition further includes an accelerator selected from the group consisting of imidazole curing accelerators, organophosphorus curing accelerators, and tertiary amine curing accelerators.

8. The resin composition according to claim 1, characterized in that, The resin composition further comprises a flame retardant selected from tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide, 2,6-di(2,6-dimethylphenyl)phosphobenzene, or 10-phenyl-9,10-dihydro-9-oxa-10-phenanthroline-10-oxide.

9. The resin composition according to claim 1, characterized in that, The resin composition further includes an additive, which is an aminosilane coupling agent or an epoxysilane coupling agent.

10. A laminate comprising a resin composition, characterized in that, The laminate comprises the resin composition according to any one of claims 1 to 9.

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