Epoxy resin compositions and their preparation methods, epoxy resin materials and encapsulation materials

Abstract

This invention provides an epoxy resin composition and its preparation method, as well as epoxy resin materials and encapsulation materials. The epoxy resin composition comprises an imide-modified phenolic compound and an epoxy resin; the imide-modified phenolic compound molecule contains at least two phenolic hydroxyl groups. The epoxy resin material obtained after curing this epoxy resin composition exhibits excellent heat resistance, mechanical properties, and dielectric properties.

Description

Technical Field

[0001] This invention belongs to the field of electronic packaging materials technology, specifically relating to epoxy resin compositions and their preparation methods, epoxy resin materials, and packaging materials. Background Technology

[0002] Epoxy resin materials are widely used in aerospace, electronic packaging, and machinery manufacturing due to their excellent adhesion, chemical stability, electrical insulation, and mechanical properties. Especially in electronic packaging, epoxy resin is a primary encapsulation material. With the rapid iteration and upgrading of science and technology, various application scenarios are placing increasingly stringent requirements on the comprehensive performance of epoxy resin materials. Taking third-generation semiconductor power devices as an example, their actual operating temperature can reach 200℃, and their withstand voltage can reach several thousand volts, with related performance indicators continuing to rise. This application trend poses higher challenges to the core performance of epoxy resin materials, such as heat resistance, mechanical strength, and dielectric stability. However, the heat resistance, mechanical properties, and dielectric properties of existing epoxy resin materials are relatively poor, failing to meet the high-requirement application needs of third-generation semiconductor power devices and other demanding applications. Summary of the Invention

[0003] This invention provides an epoxy resin composition and its preparation method, as well as epoxy resin materials and encapsulation materials. The epoxy resin materials formed by the epoxy resin composition have excellent heat resistance, mechanical properties and dielectric properties.

[0004] The present invention provides an epoxy resin composition comprising an imide-modified phenolic compound and an epoxy resin; wherein the imide-modified phenolic compound molecule contains at least two phenolic hydroxyl groups.

[0005] According to one embodiment of the present invention, the imide-modified phenolic compound is prepared by an addition reaction of a phenolic compound and an imide compound containing unsaturated bonds; preferably, the mass ratio of the imide-modified phenolic compound to the epoxy resin is 1:(1.02~1.08); preferably, the imide compound containing unsaturated bonds contains an aryl structure.

[0006] According to one embodiment of the present invention, the phenolic compound includes phenolic compounds and / or phenolic resins; and / or, the imide compound containing unsaturated bonds includes maleimide compounds; and / or, the epoxy resin composition further includes one or more of fillers, pigments, interface modifiers, and toughening agents.

[0007] According to one embodiment of the present invention, the maleimide compound includes one or more of N,N'-4,4'-diphenylmethane bismaleimide, 2,2'-bis[4-(4-maleiminophenoxy)phenyl]propane, N-phenylmaleimide, N-benzylmaleimide, N-cyclohexylmaleimide, and polymeric polyamine maleimide; and / or, the phenolic compound includes one or more of pyrogallol, pyrogallol, and bisphenol A; and / or, the phenolic resin includes phenolic resin, and the phenolic resin includes linear phenol-formaldehyde resin. The epoxy resin composition comprises one or more of the following: linear bisphenol A formaldehyde resin, dicyclopentadienol resin, phenol aralkyl resin, linear o-cresol formaldehyde resin, biphenyl aralkylphenol resin, and polytetraphenol ethane resin; and / or, based on 100 parts by weight of the total epoxy resin composition, the weight parts of each component are: epoxy resin 6.5-7.5 parts, imide-modified phenolic compound 6.7-8.1 parts, filler 80-82.5 parts, pigment 0.1-0.4 parts, interface modifier 0.7-1.5 parts, toughening agent 2.8-4 parts, and release agent 0.1-0.4 parts.

[0008] The present invention also provides a method for preparing the above-mentioned epoxy resin composition, comprising the following steps: mixing an imide-modified phenolic compound and an epoxy resin to obtain the epoxy resin composition.

[0009] According to one embodiment of the present invention, the method for preparing the imide-modified phenolic compound includes the following steps: subjecting the phenolic compound to an addition reaction with an imide compound containing an unsaturated bond to obtain the imide-modified phenolic compound.

[0010] According to one embodiment of the present invention, the temperature of the addition reaction is 60~150°C, the time of the addition reaction is 0.5~5h; and / or, the addition reaction is carried out under the action of a promoter; preferably, the promoter includes one or more of organophosphorus promoters, imidazole promoters, amine promoters, urea promoters, metal salt promoters, and Lewis base promoters.

[0011] According to one embodiment of the present invention, the process of mixing an imide-modified phenolic compound and an epoxy resin to obtain the epoxy resin composition includes: performing a kneading treatment on the imide-modified phenolic compound and the epoxy resin to obtain the epoxy resin composition; preferably, the temperature of the kneading treatment is 80~100°C; preferably, the time of the kneading treatment is 2~5 min.

[0012] The present invention also provides an epoxy resin material, which is prepared by curing reaction from the epoxy resin composition described above or the epoxy resin composition obtained by the preparation method described above.

[0013] The present invention also provides an encapsulation material, including the epoxy resin material described above.

[0014] This invention provides an epoxy resin composition and its preparation method, as well as epoxy resin materials and encapsulation materials. The epoxy resin composition includes an imide-modified phenolic compound and an epoxy resin. The imide-modified phenolic compound is prepared by an addition reaction between a phenolic compound and an imide compound containing unsaturated bonds. The imide-modified phenolic compound molecule contains at least two phenolic hydroxyl groups. In the above epoxy resin composition system, the imide group, as a strong electron-withdrawing group, can lower the electronic energy level of the epoxy resin molecule and reduce the amplitude of its molecular dipole moment change under the action of an electric field, thereby significantly reducing the dielectric constant and dielectric loss of the epoxy resin material and improving its dielectric properties. Furthermore, the imide-modified phenolic compound can undergo a cross-linking reaction with the epoxy groups in the epoxy resin composition to form a dense three-dimensional network structure. This not only increases the cross-linking density of the epoxy resin material but also enhances the interaction forces between molecular chains, thereby improving the mechanical properties and heat resistance of the epoxy resin material. Attached Figure Description

[0015] Figure 1 The infrared spectrum of the imide-modified phenolic resin in Example 1 of this invention;

[0016] Figure 2 The 1550cm of imide-modified phenolic resin in Example 1 of this invention -1 ~1650 cm -1 Infrared spectrum;

[0017] Figure 3 The 3050cm of imide-modified phenolic resin in Example 1 of this invention -1 ~3150 cm -1 Infrared spectrum;

[0018] Figure 4 This is the differential scanning calorimetry (DSC) analysis curve of the imide-modified phenolic resin in Example 1 of the present invention. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below. The specific embodiments listed below are merely descriptions of the principles and features of the present invention, and the examples are only for explaining the present invention and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In related technologies, epoxy resin materials have poor heat resistance, mechanical properties and dielectric properties, making it difficult to meet the high requirements of applications such as third-generation semiconductor power devices.

[0021] In view of this, the present invention provides an epoxy resin composition comprising an imide-modified phenolic compound and an epoxy resin; wherein the imide-modified phenolic compound molecule contains at least two phenolic hydroxyl groups.

[0022] The epoxy resin material formed by curing the above-mentioned epoxy resin composition exhibits excellent heat resistance, mechanical properties, and dielectric properties. The specific reasons are as follows: 1) The imide group, as a strong electron-withdrawing group, can effectively reduce the electronic energy level of the epoxy resin molecule. The high crosslinking density of the system and the strong electron-withdrawing characteristics of the imide group produce a synergistic effect, promoting the overall electronic structure of the epoxy resin material to tend towards stability. Under the action of an electric field, the change amplitude of the molecular dipole moment is significantly reduced, thereby significantly reducing the dielectric constant and dielectric loss of the epoxy resin material and improving dielectric properties. 2) During the curing process, the imide-modified phenolic compound, as a polyphenol curing agent, can undergo crosslinking reactions with the active sites (epoxy groups) in the epoxy resin composition to construct a dense three-dimensional network crosslinked structure, enhancing the interaction force between molecular chains, thereby improving the mechanical properties and heat resistance of the epoxy resin material.

[0023] It is understood that the epoxy resin composition of the present invention comprises an imide-modified phenolic compound and an epoxy resin. There is no need to introduce additional special bridging groups (e.g., containing double bonds or furan groups) into the molecular structure of the imide-modified phenolic compound. The imide groups can be directly anchored into the epoxy resin crosslinking network simply through the curing reaction of the imide-modified phenolic compound with the epoxy resin. This eliminates the complex intermediate synthesis steps, simplifying the preparation process, reducing production costs, and achieving highly versatile and low-cost efficient preparation of imide-modified epoxy resins.

[0024] In this embodiment of the invention, the imide-modified phenolic compound is prepared by an addition reaction between a phenolic compound and an imide compound containing an unsaturated bond.

[0025] In this embodiment of the invention, the unsaturated bonds in the imide compounds containing unsaturated bonds may include double bonds, that is, imide compounds containing unsaturated bonds include imide compounds containing double bonds.

[0026] In this embodiment of the invention, imide compounds containing unsaturated bonds refer to resins or compounds containing imide groups. A molecule of an imide compound containing unsaturated bonds may contain one, two, or more imide groups.

[0027] In this embodiment of the invention, the remaining phenolic hydroxyl groups in the imide-modified phenolic compound can react with the epoxy groups in the epoxy resin, thereby introducing the imide groups into the crosslinking network structure of the epoxy resin to obtain the imide-modified epoxy resin.

[0028] In some embodiments, the mass ratio of imide-modified phenolic compound to epoxy resin is 1:(1.02~1.08), which facilitates the full participation of phenolic hydroxyl groups in the crosslinking reaction, avoids the reduction of epoxy resin material performance due to unreacted phenolic hydroxyl groups caused by excessive curing agent, forms a dense crosslinked network structure, and further improves the heat resistance, mechanical properties and dielectric properties of epoxy resin material.

[0029] For example, the mass ratio of imide-modified phenolic compound to epoxy resin can be 1:1.02, 1:1.03, 1:1.04, 1:1.05, 1:1.06, 1:1.07 or 1:1.08, etc.

[0030] In some embodiments, the imide compounds containing unsaturated bonds contain an aryl group. As a rigid structure, the aryl group can suppress the thermal motion of the epoxy resin molecular chains at high temperatures, thereby improving the glass transition temperature (Tg) of the epoxy resin material. g Furthermore, the rigid aryl structure can effectively enhance the deformation resistance of the cross-linked network, reduce the plastic deformation of the material under external forces, and thus improve the tensile strength, flexural strength, and elastic modulus of epoxy resin materials. This further enhances the heat resistance and mechanical properties of epoxy resin materials.

[0031] In some embodiments, the aryl group includes one or more of phenyl, substituted phenyl, naphthyl, and biphenyl, which is beneficial for further improving the heat resistance and mechanical properties of epoxy resin materials.

[0032] In some embodiments, imide compounds containing unsaturated bonds, including maleimide compounds, are beneficial for further improving the heat resistance, mechanical properties, and dielectric properties of epoxy resin materials.

[0033] In some embodiments, the softening point or melting point of the imide compound containing unsaturated bonds is less than 180°C. Within the curing temperature range below 180°C, the imide compound containing unsaturated bonds can be fully melted and dispersed. The active sites such as the unsaturated bonds, imide groups, and phenolic hydroxyl groups in its molecules can achieve efficient contact and reaction with the epoxy groups and hydroxyl groups of the epoxy resin. Compared with similar compounds with high melting points or softening points, low-melting-point compounds can participate in crosslinking without breaking through higher temperature barriers, avoiding the problem of uneven crosslinking density caused by insufficient contact of local active sites. Ultimately, a dense, defect-free three-dimensional network crosslinked structure is formed, thereby further improving the heat resistance, mechanical properties, and dielectric properties of the epoxy resin material.

[0034] In some embodiments, maleimide compounds include N,N'-4,4'-diphenylmethane bismaleimide (as shown in Formula 1-1 below), 2,2'-bis[4-(4-maleimide-phenoxy)phenyl]propane (as shown in Formula 1-2 below), N-phenylmaleimide (as shown in Formula 1-3 below), N-benzylmaleimide (as shown in Formula 1-4 below), N-cyclohexylmaleimide (as shown in Formula 1-5 below), and polymeric polyamine maleimide (as shown in Formula 1-6 below), which are beneficial for further improving the heat resistance, mechanical properties, and dielectric properties of epoxy resin materials.

[0035] Equation 1-1,

[0036] Equation 1-2,

[0037] Equation 1-3,

[0038] Equation 1-4,

[0039] Equations 1-5

[0040] Equations 1-6.

[0041] In this embodiment of the invention, the polymeric polyamine maleimide is a type of polyimide derivative with a multifunctional structure formed by grafting multiple maleimide groups onto a polymer molecular chain through an amidation reaction using a polyamine compound as a bridging unit. Its molecular skeleton contains repeating units derived from polyamines, and its ends or side chains have two or more active maleimide groups, combining the flexible segments of polyamines with the rigid heterocyclic structure of maleimides.

[0042] In some embodiments, the phenolic compound includes phenolic compounds and / or phenolic resins.

[0043] In some embodiments, the softening point or melting point of the phenolic compound is less than 180°C.

[0044] In some embodiments, the phenolic compounds include one or more of pyrogallol, pyrogallol, and bisphenol A, which are beneficial for further improving the heat resistance, mechanical properties, and dielectric properties of epoxy resin materials.

[0045] In some embodiments, the phenolic resin includes phenolic resin, which includes one or more of the following: linear phenol-formaldehyde resin (as shown in Formula 2-1 below), dicyclopentadienol resin (as shown in Formula 2-2 below), phenol aralkyl resin (as shown in Formula 2-3 below), linear o-cresol-formaldehyde resin (as shown in Formula 2-4 below), biphenyl aralkylphenol resin (as shown in Formula 2-5 below), polytetraphenol ethane resin (as shown in Formula 2-6 below), and multifunctional phenolic resin (as shown in Formula 2-7 below), which is beneficial for further improving the heat resistance, mechanical properties, and dielectric properties of epoxy resin materials.

[0046] Equation 2-1, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0047] Equation 2-2, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0048] Equation 2-3, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0049] Equation 2-4, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0050] Equation 2-5, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0051] Equation 2-6, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0052] Equation 2-7, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0053] In some embodiments, epoxy resin refers to a substance containing epoxy groups, such as: bisphenol A type epoxy resin (as shown in Formula 3-1 below), bisphenol F type epoxy resin (as shown in Formula 3-2 below), bromine-containing epoxy resin (as shown in Formula 3-6 below), alicyclic epoxy resin (as shown in Formula 3-7 below), glycidyl ester type epoxy resin (as shown in Formula 3-9 below), glycidyl amine type epoxy resin (as shown in Formulas 3-10 and 3-11 below), heterocyclic epoxy resin (as shown in Formulas 3-12 and 3-13 below), monofunctional epoxy resin (as shown in Formula 3-14 below), polyfunctional epoxy resin (as shown in Formula 3-15 below), and polyfunctional epoxy compounds (as shown in Formulas 3-16, 3-17, and 3-18 below) or one or more of these.

[0054] Equation 3-1, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0055] Equation 3-2, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0056] Equation 3-3, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0057] Equation 3-4,

[0058] Equation 3-5, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0059] Equation 3-6, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0060] Equation 3-7,

[0061] Equation 3-8,

[0062] Equation 3-9,

[0063] Equation 3-10,

[0064] Equation 3-11,

[0065] Equation 3-12,

[0066] Equation 3-13,

[0067] Equation 3-14,

[0068] Equation 3-15, where n = 0~6 (for example, it can be 0, 1, 2, 3, 4, 5 or 6).

[0069] Equation 3-16,

[0070] Equation 3-17,

[0071] Equation 3-18.

[0072] In some embodiments, the epoxy resin composition further includes one or more of fillers, pigments, interface modifiers, toughening agents, and release agents to meet different application scenarios. Fillers can improve various properties of the cured epoxy resin composition, such as mechanical strength and thermal conductivity. Pigments are substances that can change the color of the cured epoxy resin composition. Toughening agents can improve the toughness of epoxy resin materials (such as impact toughness and crack resistance). Interface modifiers can improve the interfacial compatibility and adhesion strength between epoxy resin and fillers / pigments. Release agents can reduce the adhesion between the cured epoxy resin and the mold surface, allowing the cured product to be smoothly and completely removed from the mold.

[0073] In this embodiment of the invention, by adjusting the content of epoxy resin, imide-modified phenolic compound, filler, pigment, interface modifier, toughening agent, and release agent in the epoxy resin composition, the heat resistance, mechanical properties, and dielectric properties of the epoxy resin material can be further improved. In some embodiments, the total weight of the epoxy resin composition is 100 parts by weight, and the epoxy resin composition includes 6.5 to 7.5 parts by weight (e.g., 6.5, 6.8, 7, 7.2, or 7.5 parts, etc.) of epoxy resin, 6.7 to 8.1 parts by weight (e.g., 6.7, 7, 7.3, 7.6, 7.9, or 8.1 parts, etc.) of imide-modified phenolic compound, and 80 to 82.5 parts by weight (e.g., 80, 80.5, 81, 81.5, or... The ingredients include 82.5 parts by weight of filler, 0.1 to 0.4 parts by weight of pigment (e.g., 0.1, 0.2, 0.3, or 0.4 parts by weight), 0.7 to 1.5 parts by weight of interface modifier (e.g., 0.7, 0.9, 1.2, or 1.5 parts by weight), 2.8 to 4 parts by weight of toughening agent (e.g., 2.8, 3, 3.2, 3.5, or 4 parts by weight), and 0.1 to 0.4 parts by weight of release agent (e.g., 0.1, 0.2, 0.3, or 0.4 parts by weight).

[0074] In some embodiments, the filler includes one or more of the following: molten spherical silica, crystalline silica, angular silica powder, fumed silica, alumina, aluminum hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, magnesium hydroxide, boron nitride, aluminum nitride, silicon nitride, and talc.

[0075] In some embodiments, the pigment includes one or more of carbon black, iron oxides, titanium dioxide, phthalocyanines, quinacridones, and benzidine yellows.

[0076] In some embodiments, the toughening agent includes one or more of the following: nitrile rubber liquid-modified epoxy resin, phenoxy-modified epoxy resin, linear glycidyl ether epoxy resin, carboxyl-terminated nitrile rubber, nitrile rubber, polysulfide rubber, core-shell rubber, and polyether compounds.

[0077] In some implementations, the core-shell rubber can be a nano-core-shell rubber.

[0078] In this embodiment of the invention, the toughening agent nano-core-shell rubber can be a commercially available nano-core-shell rubber in the art, and there is no special limitation on it, as long as it has a double-layer structure of elastic core and rigid shell, and can achieve good compatibility and dispersibility with the epoxy resin composition of the present invention.

[0079] In some embodiments, the average particle size of the nanocore-shell rubber is 200-800 nm.

[0080] For example, the average particle size of the nanocore-shell rubber can be 200nm, 300nm, 400nm, 500nm, 600nm, 700nm or 800nm, etc.

[0081] In some embodiments, the mass ratio of the core to the shell in the nanocore-shell rubber can be (60~85):(15~40).

[0082] In some embodiments, the core of the nano-core-shell rubber comprises rubber, and the outer shell comprises an acrylate polymer. In some embodiments, the release agent includes wax-based release agents and silicone-based release agents. Wax-based release agents may include one or more of palm wax, lignite wax, and carnauba wax. Silicone-based release agents may include one or more of dimethyl silicone oil, amino-modified silicone oil, and silicone resin.

[0083] In some embodiments, the interface modifier includes a silane coupling agent, such as γ-glycidoxypropyltrimethoxysilane (KH560).

[0084] In some embodiments, the epoxy resin composition further includes other additives, including one or more of defoamers, leveling agents, thixotropic agents, flame retardants, antioxidants, foaming agents, softeners, and light stabilizers.

[0085] In some embodiments, the flame retardant includes one or more of zinc borate, barium metaborate, tetrabromobisphenol A, 2,4,6-tribromophenol, decabromodiphenyl ethane, antimony oxide, ammonium polyphosphate, melamine urate, triphenyl phosphate, and red phosphorus.

[0086] The present invention also provides a method for preparing an epoxy resin composition, comprising the following steps: mixing an imide-modified phenolic compound and an epoxy resin to obtain an epoxy resin composition.

[0087] In some embodiments, the preparation method of the imide-modified phenolic compound includes the following steps: subjecting the phenolic compound to an imide compound containing an unsaturated bond through an addition reaction to obtain the imide-modified phenolic compound.

[0088] In some embodiments, the addition reaction temperature is 60~150℃ and the addition reaction time is 0.5~5h, which helps to improve the addition reaction efficiency while suppressing side reactions such as homopolymerization of unsaturated bonds and thermal decomposition of imide groups.

[0089] In some embodiments, the above-mentioned addition reaction is carried out under the action of a promoter, that is, an addition reaction is carried out on a phenolic compound or an imide compound containing an unsaturated bond under the action of a promoter to obtain an imide-modified phenolic compound. The promoter can promote the activation of the phenolic hydroxyl group in the phenolic compound, improve the reactivity of the phenolic hydroxyl group, and allow it to undergo a Michael addition reaction with the imide compound containing an unsaturated bond to generate an imide-modified phenolic compound.

[0090] In this embodiment of the invention, the gram weight of epoxy resin containing one equivalent epoxy group is the epoxy equivalent, denoted by M. EP Expressed in g / eq. The gram weight of an imide-modified phenolic compound containing one equivalent of a phenolic hydroxyl group is the phenolic hydroxyl equivalent, expressed in M. ArOH The unit is g / eq. The gram weight of an imide compound containing one equivalent imide group and an unsaturated bond is called the imide equivalent, expressed as M. MI Expressed in g / eq. The number of grams of accelerator containing one equivalent of phenolic hydroxyl group is the accelerator equivalent, expressed in M. acc The unit is g / eq. The amount of epoxy resin used is expressed in m. EP This represents the unit g and its corresponding equivalent number n. EP (Unit: eq) can be expressed by the formula n EP =m EP / M EP The amount of imide-modified phenolic compound used was calculated using m. ArOH This indicates that the unit g corresponds to the equivalent number n. ArOH (Unit: eq) can be expressed by the formula n ArOH =m ArOH / M ArOH The amount of imide compounds containing unsaturated bonds is calculated using m. MI This indicates that the unit g corresponds to the equivalent number n. MI (Unit: eq) can be expressed by the formula n MI =m MI / M MI The amount of accelerator was calculated. acc This indicates that the unit g corresponds to the equivalent number n. acc (Unit: eq) can be expressed by the formula n acc =m acc / M acc The calculated relationships between the amounts of imide-modified phenolic compounds, imide compounds containing unsaturated bonds, and accelerators are as follows: 0 <nMI <n ArOH Preferably, 0.05n ArOH <n MI <0.5n ArOH 0 <n acc <n ArOH Preferably, 0.01n ArOH <n acc <0.2n ArOH or 0.01m ArOH <m acc <0.2m ArOH .

[0091] In some embodiments, the mass ratio of phenolic compound to imide compound containing unsaturated bonds is (2.9~4.6):1, which facilitates the full cross-linking of phenolic compound, regulates the cross-linking density, constructs a dense three-dimensional network structure, reduces the residual polar hydroxyl groups in the system, and lowers the probability of dipole polarization; furthermore, it can reduce the electronic energy level of epoxy resin molecules through strong electron-withdrawing effect, thereby further improving the heat resistance, mechanical properties and dielectric properties of epoxy resin materials.

[0092] For example, the mass ratio of the phenolic compound to the imide compound containing unsaturated bonds can be 2.9:1, 3:1, 3.2:1, 3.4:1, 3.6:1, 4:1, 4.2:1, 4.4:1, or 4.6:1, etc. In some embodiments, the mass ratio of the accelerator to the imide compound containing unsaturated bonds is (0.05~0.15):1.

[0093] For example, the mass ratio of the accelerator to the imide compound containing unsaturated bonds can be 0.05:1, 0.07:1, 0.09:1, 0.11:1, 0.13:1, or 0.15:1, etc.

[0094] In some embodiments, the accelerator includes one or more of organophosphorus accelerators, imidazole accelerators, amine accelerators, urea accelerators, metal salt accelerators, and Lewis base accelerators. For example, the accelerator may include one or more of 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 1,8-diaza-bicyclo(5,4,0)-7-undecene (DBU), 2-phenyl-4,5-dihydroxymethylimidazolium (2PHZ-PW), triphenylphosphine, triphenylphosphine-1,4-benzoquinone complex (TPP-BQ, as shown in Formula 4-1 below), tetraphenylphosphine-tetraphenylborone complex (as shown in Formula 4-2 below), tetrabutylphosphine-tetraphenylborone complex (as shown in Formula 4-3 below), and stannous chloride.

[0095] Equation 4-1,

[0096] Equation 4-2,

[0097] Equation 4-3.

[0098] In some embodiments, the preparation method of imide-modified phenolic compounds includes the following steps: mixing a phenolic compound, an imide compound containing unsaturated bonds, and a accelerator, then heating and stirring until all the materials are completely melted, continuing heating and stirring to carry out a Michael addition reaction. During the Michael addition reaction, the residual amount of the imide compound containing unsaturated bonds in the reaction system is monitored. When the imide compound containing unsaturated bonds has essentially disappeared, the Michael addition reaction is complete, and the imide-modified phenolic compound is obtained. After cooling, it is crushed into powder, dried, and stored for later use.

[0099] In this embodiment of the invention, during the Michael addition reaction, the reaction process and the reaction endpoint can be determined by methods such as thin-layer chromatography (TLC), titration of the phenolic hydroxyl content in phenolic compounds, titration of the double bond content in imide compounds containing unsaturated bonds, and gas chromatography.

[0100] In some implementations, TLC can visually determine the extent of the reaction by tracking the disappearance of characteristic spots of the raw materials (phenolic compounds, imide compounds containing unsaturated bonds) and the appearance and concentration changes of product spots; when the raw material spots completely disappear and the position and concentration of the product spots tend to stabilize, the reaction can be determined to have reached its endpoint.

[0101] In some embodiments, the content of phenolic hydroxyl groups in phenolic compounds is determined by potassium bromide-potassium bromate titration or potentiometric titration, with periodic sampling to measure changes in the content of phenolic hydroxyl groups in the reaction system. Based on the stoichiometric ratio of the addition reaction between phenolic hydroxyl groups and imide unsaturated bonds, the reaction conversion rate is quantitatively calculated by the proportion of phenolic hydroxyl groups consumed, thereby determining the reaction progress.

[0102] In some embodiments, chemical titration methods such as iodometric titration are used to detect the residual amount of carbon-carbon double bonds in imide compounds containing unsaturated bonds. As the addition reaction proceeds, the double bond content continuously decreases. When the residual amount of double bonds tends to stabilize and reaches a preset threshold, the reaction can be determined to be complete.

[0103] In some implementations, the relative content changes of raw materials and products are quantitatively detected by sampling and analyzing the reaction system; when the chromatographic peak area of ​​the raw material drops below the detection limit or no longer changes, and the peak area of ​​the product tends to be constant, the reaction endpoint can be determined.

[0104] In this embodiment of the invention, there are no special requirements for the mixing process of the imide-modified phenolic compound and the epoxy resin. For example, the mixture can be made by direct stirring of the liquid, direct high-speed dispersion of the powder, or by mixing after melting using a mixer, open mill, or extruder, or by a combination of multiple processes. There are also no special requirements for the order in which the materials are added during mixing, and the mixing methods for conventional products are equally applicable.

[0105] In this embodiment of the invention, the process of mixing an imide-modified phenolic compound and an epoxy resin to obtain an epoxy resin composition includes: performing a kneading process on the imide-modified phenolic compound and the epoxy resin to obtain the epoxy resin composition.

[0106] In some embodiments, the mixing temperature is 80-100°C, and the mixing time is 2-5 minutes. This facilitates the thorough softening of the imide-modified phenolic compound and the epoxy resin, reduces the melt viscosity of both raw materials, prevents solid particle agglomeration, and promotes the uniform dispersion of the imide-modified phenolic compound in the epoxy resin matrix at the molecular or micron scale, laying the foundation for the subsequent curing to form a dense cross-linked network.

[0107] For example, the mixing temperature can be 80°C, 85°C, 90°C, 95°C or 100°C, etc.

[0108] For example, the mixing time can be 2 min, 3 min, 4 min or 5 min, etc.

[0109] This invention also provides an epoxy resin material, prepared by curing a curing reaction from the epoxy resin composition described above or the epoxy resin composition obtained by the preparation method described above. This epoxy resin material has advantages corresponding to the epoxy resin compositions described above, which will not be elaborated further.

[0110] When the phenolic compound includes linear phenol-formaldehyde resin and the imide compound containing unsaturated bonds includes maleimide compounds, the linear phenol-formaldehyde resin and the maleimide compound first undergo a Michael addition reaction to generate an imide-modified phenolic compound. The remaining phenolic hydroxyl groups in the imide-modified phenolic compound react with the epoxy groups in the epoxy resin, thereby introducing the imide groups into the crosslinked network structure of the epoxy resin to obtain the epoxy resin material.

[0111]

[0112] The present invention does not impose special requirements on the curing process of the epoxy resin composition. Conventional epoxy product curing processes can be used, and a suitable curing temperature gradient and time can be determined based on the selected curing agent, accelerator system, and application scenario.

[0113] This invention also provides an encapsulation material, including the epoxy resin material described above. This encapsulation material has advantages corresponding to the epoxy resin material described above, which will not be elaborated further.

[0114] The packaging material of the present invention can be a conventional packaging material in the art, such as semiconductor chip packaging material, power electronic device packaging material, new energy battery packaging material, optoelectronic / LED packaging material, etc., and there is no particular limitation thereto.

[0115] The present invention will be further described below through specific embodiments.

[0116] The nano-core-shell rubbers used in the following examples and comparative examples are all elastic core-acrylate polymer rigid shell structures, with a core of rubber and an outer shell of acrylate polymer. The mass ratio of the core to the outer shell is 75:25, and the average particle size of the nano-core-shell rubber is 200 nm.

[0117] Example 1

[0118] In this embodiment, the epoxy resin composition is prepared by the following steps:

[0119] Multifunctional phenolic resin SH-6080, N,N'-4,4'-diphenylmethane bismaleimide (BMI), and accelerator TPP were mixed and heated while stirring. When the mixture reached approximately 100°C, it was completely melted. Heating was continued at 100°C, and stirring was maintained for 2 hours to initiate a Michael addition reaction. During the Michael addition reaction, the residual amount of maleimide resin (BMI) in the reaction system was monitored in real time using thin-layer chromatography (TLC). When the BMI was almost completely eliminated, the Michael addition reaction was complete, yielding an imide-modified phenolic resin. After cooling, the resin was crushed into powder, dried, and stored for later use.

[0120] Imide-modified phenolic resin, multifunctional epoxy resin XY676, crystalline epoxy resin XY641, and all other solid materials (including nano-core-shell rubber, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in an internal mixer at 90°C for 3 minutes to obtain the epoxy resin composition. The mixture was then rapidly cooled, removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 1.

[0121] Table 1

[0122]

[0123] Infrared spectroscopy was performed on the imide-modified phenolic resin prepared in Example 1 above, as well as the reaction raw materials BMI, multifunctional phenolic resin SH-6080, and TPP. Figures 1-3 As shown, at 1602cm -1 and 1585cm -1 The characteristic peak of C=C bond in the nearby BMI, and 3106 cm⁻¹ -1 and 3096 cm -1 The stretching vibration peak of the CH bond on the C=C bond in the nearby BMI disappeared. This proves that all the C=C bonds in the BMI have successfully undergone the Michael addition reaction with the phenolic hydroxyl groups in the multifunctional phenolic resin SH-6080.

[0124] like Figure 4 As shown, when the multifunctional phenolic resin SH-6080 (hereinafter referred to as phenolic resin) was mixed with BMI (hereinafter referred to as bismaleimide resin) alone, only the melting endothermic peak of the phenolic resin appeared at 117.4℃, and no reaction occurred. This indicates that the hydrogen reactivity of the phenolic hydroxyl groups in the phenolic resin is low, and it is not easy to undergo a Michael addition reaction with the carbon-carbon double bond in the bismaleimide resin. The self-polymerization activity of bismaleimide is also low, with an exothermic peak temperature of 159℃. When the phenolic resin was mixed with the accelerator triphenylphosphine, not only did the melting endothermic peak of the phenolic resin appear at 117.6℃, but an endothermic peak at 250.0℃ also appeared indicating that the coordination bond between the phenolic hydroxyl group and the triphenylphosphine was opened. This indicates that the phenolic hydroxyl groups of the phenolic resin readily react with the accelerator to form a reversible coordination bond. The reactivity of the phenolic hydroxyl groups activated by the accelerator increases, and they can undergo a Michael addition reaction with the carbon-carbon double bond of the bismaleimide resin. When phenolic resin, maleimide resin, and the accelerator triphenylphosphine are mixed, an exothermic peak of the Michael addition reaction occurs at 89.6℃. This can be interpreted as the polyphenol curing agent (i.e., phenolic resin) being modified by maleimide through this Michael addition reaction. Subsequently, this maleimide-modified polyphenol curing agent (i.e., imide-modified phenolic resin) continues to react with epoxy resin to generate imide-modified epoxy resin.

[0125] Example 2

[0126] In this embodiment, the epoxy resin composition is prepared by the following steps:

[0127] Multifunctional phenolic resin EMTP110, maleimide resin BMP-BMI, and accelerator TPP-BQ were mixed and heated while stirring. When all the materials were completely melted at approximately 140°C, heating and stirring continued for about 0.5 hours to initiate a Michael addition reaction. During the Michael addition reaction, the residual amount of BMP-BMI in the reaction system was monitored in real time using thin-layer chromatography. When BMP-BMI had essentially disappeared, the Michael addition reaction was complete, yielding an imide-modified phenolic resin. After cooling, the resin was crushed into powder, dried, and stored for later use.

[0128] The aforementioned imide-modified phenolic resin, multifunctional epoxy resin SQTN333, crystalline epoxy resin XY641, and all other solid materials (including nano-core-shell rubber, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed at 100°C for 6 minutes in a twin-screw extruder to obtain the epoxy resin composition. The mixture was rapidly cooled and removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 2.

[0129] Table 2

[0130]

[0131] Example 3

[0132] In this embodiment, the epoxy resin composition is prepared by the following steps:

[0133] Linear phenol-formaldehyde resin PF8011, polymeric polyamine maleimide resin PFB401, and accelerator 2-ethyl-4-methylimidazole were mixed and heated while stirring. When all the materials were melted at approximately 90°C, heating and stirring continued for about 2 hours to initiate a Michael addition reaction. During the Michael addition reaction, samples were taken every 0.5 hours and titrated. When the content of phenolic hydroxyl groups or double bonds no longer decreased significantly, the Michael addition reaction was complete, yielding an imide-modified phenolic resin. After cooling, the resin was crushed into powder, dried, and stored for later use.

[0134] The imide-modified phenolic resin, multifunctional epoxy resin SQTN333, multifunctional epoxy resin Tactix742, and all other solid materials (including core-shell toughening agent, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in a twin-screw extruder at 80°C for 6 minutes to obtain the epoxy resin composition. The mixture was rapidly cooled and removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 3.

[0135] Table 3

[0136]

[0137] Example 4

[0138] In this embodiment, the epoxy resin composition is prepared by the following steps:

[0139] Linear phenolic resin 6-8021, polymeric polyamine maleimide resin PFB401, and accelerator tetraphenylphosphine-tetraphenylborone complex (TPP-TPB) were mixed in an internal mixer at 80°C for about 1 hour. Samples were taken every 0.5 hours and titrated. When the content of phenolic hydroxyl groups or double bonds no longer decreased significantly, the Michael addition reaction was complete, and the imide-modified phenolic resin was obtained. After cooling, it was crushed into powder, dried, and stored for later use.

[0140] The imide-modified phenolic resin, multifunctional epoxy resin HP-7250, multifunctional epoxy resin EMTE358, and all other solid materials (including nano-core-shell rubber, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in an open mill at 80°C for 6 minutes to obtain the epoxy resin composition. The mixture was then rapidly cooled, removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition by weight are shown in Table 4.

[0141] Table 4

[0142]

[0143] Example 5

[0144] In this embodiment, the epoxy resin composition is prepared by the following steps:

[0145] Multifunctional phenolic resin KTG-105, maleimide resin BMI, and accelerator TBP-TPB were mixed and heated while stirring. When the materials were completely melted at approximately 100°C, heating and stirring continued for about 2 hours to initiate a Michael addition reaction. During the Michael addition reaction, the residual amount of maleimide resin (BMI) in the reaction system was monitored in real time using thin-layer chromatography. When BMI was almost completely eliminated, the Michael addition reaction was complete, yielding an imide-modified phenolic resin. After cooling, the resin was crushed into powder, dried, and stored for later use.

[0146] The imide-modified phenolic resin, multifunctional epoxy resin HP4710, crystalline epoxy resin EMTE501, and all other solid materials (including core-shell toughening agent, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in an internal mixer at 100°C for approximately 4 minutes to obtain the epoxy resin composition. The mixture was then rapidly cooled, removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 5.

[0147] Table 5

[0148]

[0149] Example 6

[0150] The preparation method of the epoxy resin composition in this embodiment is basically the same as that in Example 1. The difference is that the weight parts of the multifunctional phenolic resins SH-6080, BMI, and TPP in the imide-modified phenolic resin are different.

[0151] Table 6

[0152]

[0153] Example 7

[0154] The preparation method of the epoxy resin composition in this embodiment is basically the same as that in Example 1, except that the weight parts of the multifunctional epoxy resin XY676 are different.

[0155] Table 7

[0156]

[0157] Comparative Example 1

[0158] The epoxy resin composition in this comparative example was prepared through the following steps:

[0159] Multifunctional phenolic resin SH-6080, multifunctional epoxy resin XY676, and all other solid materials (including nano-core-shell rubber, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in an internal mixer at 90°C for approximately 3 minutes to obtain the epoxy resin composition. The mixture was then rapidly cooled, removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 8.

[0160] Table 8

[0161]

[0162] Comparative Example 2

[0163] The epoxy resin composition in this comparative example was prepared through the following steps:

[0164] Multifunctional phenolic resin SH-6080, maleimide resin BMI, multifunctional epoxy resin XY676, and all other solid materials (including nano-core-shell rubber, carbon black, and palm wax) were crushed into powder. All materials were then premixed in a high-speed mixer according to the specified proportions. Subsequently, the mixture was thoroughly kneaded and mixed in an internal mixer at 90°C for approximately 3 minutes to obtain the epoxy resin composition. The mixture was then rapidly cooled, removed, crushed, dried, and stored at a low temperature (0-5°C). The components of the epoxy resin composition, by weight, are shown in Table 9.

[0165] Table 9

[0166]

[0167] The epoxy resin compositions in the above embodiments and comparative examples were subjected to the following tests:

[0168] 1. Gel Time: According to the test method in "SJ / T11197-2013 Epoxy Molding Compounds", heat the hot plate to 175℃±2℃, take 0.3~0.5g of epoxy resin composition sample and place it on the hot plate. The sample should be spread out over an area of ​​approximately 5cm². 2 Start timing when melting begins. Stir with a needle-shaped stirring tip or a flat spatula until the powder gradually becomes gel-like (the sample cannot be drawn into threads). Read the required time. Repeat the same operation twice and take the average value to measure the gel time of the epoxy resin composition. The results are shown in Table 10.

[0169] 2. Glass transition temperature (T) g According to ASTM E1640-2013, "Standard Test Method for Glass Transition Temperature Distribution Using Dynamic Mechanical Analysis," an epoxy resin composition was molded at 175°C using a transfer molding machine, followed by post-curing at 175°C for 7 hours to obtain test specimens. The test specimens were then subjected to T-tests using a dynamic thermomechanical analyzer. g The test results are shown in Table 10.

[0170] 3. Initial decomposition temperature (T) d The epoxy resin composition was molded at 175°C using a transfer molding machine and post-cured at 175°C for 7 hours to obtain the epoxy resin material (hereinafter referred to as the sample). The sample was then crushed into powder, sieved through a 100-mesh screen, dried, and approximately 5 mg of powder was taken for testing. Thermogravimetric analysis was performed using a thermogravimetric analyzer under a nitrogen atmosphere at a heating rate of 10°C per minute from room temperature to 800°C. The temperature (T0) corresponding to a sample weight loss of 1 wt% was recorded. dThe initial thermal decomposition temperature was used to evaluate the thermal stability of the epoxy resin material after curing. The results are shown in Table 10.

[0171] 4. Flexural strength and flexural modulus: The epoxy resin composition was cured at 175°C for 7 hours using a transfer molding machine to form epoxy resin material. Test specimens were prepared from the epoxy resin material, and the flexural strength and flexural modulus of the test specimens were tested according to the standard GB / T 9341 2008 "Determination of Flexural Properties of Plastics". The results are shown in Table 10.

[0172] 5. Dielectric constant and dielectric loss: Epoxy resin material was prepared by curing the epoxy resin composition at 175℃ for 7 hours using a transfer molding machine. The dielectric constant and dielectric loss of the epoxy resin material were tested according to the standard GB / T1409-2006 "Recommended method for measuring the permittivity and dielectric loss factor of electrical insulation materials at power frequency, audio frequency and high frequency (including meter wave wavelength)". The results are shown in Table 10.

[0173] Table 10

[0174]

[0175] As shown in Table 10, comparing Examples 1-7 with Comparative Examples 1-2, the epoxy resin compositions of Examples 1-7 have a longer gel time, meeting the requirements of transfer molding processes for electronic packaging (gel time > 30s). The epoxy resin materials in Examples 1-7 all exhibit excellent heat resistance. g >250℃, T d The temperature exceeds 390℃ because the imide groups in the cross-linked network, acting as strong electron-withdrawing groups, lower the energy level of the epoxy resin molecule, making it more stable. Furthermore, the rigid structure of the imide groups gives the epoxy resin material a higher Tg. g This improves the heat resistance of epoxy resin materials. Imide modification of phenolic resin increases the crosslinking density of epoxy resin materials and enhances their rigidity. The epoxy resin materials in Examples 1-7 exhibit higher flexural strength and flexural modulus. The high crosslinking density network and the strong electron-withdrawing structure of the imide in these examples make the electronic structure of the cured material more stable, resulting in smaller dipole changes under an electric field and lower dielectric constant and dielectric properties compared to the comparative example. In contrast, the epoxy resin composition in Comparative Example 1 lacks imide modification, and the Tg of the epoxy resin material is significantly lower. g and T dAll were relatively low. In Comparative Example 2, maleimide resin was added to the epoxy resin composition, but the phenolic resin and imide groups were not fully reacted beforehand to form imide-modified phenolic resin. When mixed with all other materials, the concentrations of the accelerator, phenolic resin, and maleimide resin were significantly diluted by the other materials, and the mixing time was too short, resulting in a large amount of maleimide resin not participating in the crosslinking reaction and remaining free in the cured product. Therefore, the epoxy resin material in Comparative Example 2 had poor heat resistance. In Comparative Example 2, due to the large number of unreacted maleimide groups, the crosslinking density decreased, and the flexural strength of the epoxy resin material was significantly reduced.

[0176] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0177] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An epoxy resin composition, characterized in that, It includes imide-modified phenolic compounds and epoxy resins; the imide-modified phenolic compounds contain at least two phenolic hydroxyl groups in their molecules.

2. The epoxy resin composition according to claim 1, characterized in that, The imide-modified phenolic compound is prepared by an addition reaction between a phenolic compound and an imide compound containing an unsaturated bond; Preferably, the mass ratio of the imide-modified phenolic compound to the epoxy resin is 1:(1.02~1.08). Preferably, the imide compound containing unsaturated bonds contains an aryl structure.

3. The epoxy resin composition according to claim 2, characterized in that, The phenolic compounds include phenolic compounds and / or phenolic resins; And / or, the imide compounds containing unsaturated bonds include maleimide compounds; And / or, the epoxy resin composition further includes one or more of fillers, pigments, interface modifiers, and toughening agents.

4. The epoxy resin composition according to claim 3, characterized in that, The maleimide compounds include one or more of N,N'-4,4'-diphenylmethane bismaleimide, 2,2'-bis[4-(4-maleiminophenoxy)phenyl]propane, N-phenylmaleimide, N-benzylmaleimide, N-cyclohexylmaleimide, and polymeric polyamine maleimides; And / or, the phenolic compounds include one or more of pyrogallol, pyrogallol, and bisphenol A; And / or, the phenolic resin includes phenolic resin, which includes one or more of linear phenol-formaldehyde resin, linear bisphenol A-formaldehyde resin, dicyclopentadienol resin, phenol aralkyl resin, linear o-cresol-formaldehyde resin, biphenyl aralkylphenol resin, and polytetraphenol ethane resin. And / or, based on 100 parts by weight of the total epoxy resin composition, the weight parts of each component are: 6.5-7.5 parts of epoxy resin, 6.7-8.1 parts of imide-modified phenolic compound, 80-82.5 parts of filler, 0.1-0.4 parts of pigment, 0.7-1.5 parts of interface modifier, 2.8-4 parts of toughening agent, and 0.1-0.4 parts of release agent.

5. A method for preparing the epoxy resin composition according to any one of claims 1-4, characterized in that, Includes the following steps: The epoxy resin composition is obtained by mixing an imide-modified phenolic compound with an epoxy resin.

6. The preparation method according to claim 5, characterized in that, The method for preparing the imide-modified phenolic compound includes the following steps: subjecting the phenolic compound to an imide compound containing an unsaturated bond through an addition reaction to obtain the imide-modified phenolic compound.

7. The preparation method according to claim 6, characterized in that, The addition reaction is carried out at a temperature of 60~150℃ for a duration of 0.5~5h. And / or, the addition reaction is carried out under the action of an accelerator; preferably, the accelerator includes one or more of organophosphorus accelerators, imidazole accelerators, amine accelerators, urea accelerators, metal salt accelerators, and Lewis base accelerators.

8. The preparation method according to any one of claims 5-7, characterized in that, The process of mixing an imide-modified phenolic compound and an epoxy resin to obtain the epoxy resin composition includes: performing a compounding process on the imide-modified phenolic compound and the epoxy resin to obtain the epoxy resin composition; Preferably, the mixing temperature is 80~100℃; Preferably, the mixing process takes 2 to 5 minutes.

9. An epoxy resin material, characterized in that, The epoxy resin composition prepared by any one of the epoxy resin compositions according to claims 1-4 or by any one of the preparation methods according to claims 5-8 is prepared by a curing reaction.

10. An encapsulation material, characterized in that, Includes the epoxy resin material as described in claim 9.

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