An underwater curing epoxy resin, its preparation method and application
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-15
- Publication Date
- 2026-08-14
AI Technical Summary
[0006]针对现有水下环氧树脂固化速度慢、施工窗口期长的问题,本发明提供一种水下固化环氧树脂,通过优化促进剂用量、活性稀释剂比例和胺类固化剂比例的特定组合,在保持优异力学性能的同时显著缩短水下固化时间,提高水下施工效率和抗水流冲刷能力
[0022](1)本发明通过优化三-(二甲氨基甲基)苯酚的用量至B组分的8-15%,结合聚醚胺与三乙烯四胺的特定质量比(1.2:1~1.4:1),本发明的水下固化环氧树脂胶凝时间缩短至28-42分钟,较现有水下环氧体系(50分钟以上)缩短16-44%,表干时间不超过5小时,大幅提高了水下施工效率和抗水流冲刷能力。
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Abstract
Description
Technical Field
[0001] This application relates to the field of curing materials, and more specifically, to an underwater curing epoxy resin, its preparation method, and its application. Background Technology
[0002] Epoxy resins are widely used in industrial fields such as construction, marine engineering, and water conservancy facilities due to their excellent mechanical properties, chemical resistance, and good adhesion to various substrates. However, traditional epoxy resins are difficult to cure in underwater environments. Moisture interferes with the ring-opening reaction between epoxy groups and amine curing agents, leading to incomplete curing and a significant decrease in bond strength, which limits their application in underwater engineering.
[0003] Currently, the main technical approaches to solving the problem of underwater curing of epoxy resins include: using hydrophobic curing agents to reduce the interference of water on the curing reaction; adding water-absorbing fillers to absorb surrounding moisture; and using two-component systems to reduce the influence of water through rapid reaction. However, these methods still have significant shortcomings in practical applications. Although hydrophobic curing agents can reduce water interference, they often lead to a further decrease in the curing rate, and the mechanical properties decrease significantly when curing is incomplete; the introduction of water-absorbing fillers reduces the fluidity and pumpability of the resin system, which is not conducive to construction processes such as grouting; and existing two-component underwater epoxy systems generally suffer from slow curing speed and long construction window, with gelation time typically exceeding 50 minutes and surface drying time exceeding 8 hours.
[0004] Especially in engineering scenarios such as wharf pile foundation grouting, underwater repair, and pressure grouting, the underwater curing speed is a key indicator determining construction efficiency and project quality. In underwater operating environments, water flow and tidal changes require the cured material to develop sufficient initial strength in a short time; otherwise, the material is easily carried away or diluted by the water flow, leading to compromised construction quality. At the same time, increasing the curing speed should not come at the expense of final mechanical properties; the cured resin must still meet engineering requirements such as tensile strength, bond strength, and compressive strength.
[0005] Therefore, there is an urgent need in the field for an epoxy resin system that can significantly shorten the underwater curing time while maintaining excellent mechanical properties, so as to meet the dual requirements of underwater engineering for rapid curing and high-strength adhesion. Summary of the Invention
[0006] To address the issues of slow curing speed and long construction window of existing underwater epoxy resins, this invention provides an underwater curing epoxy resin. By optimizing a specific combination of accelerator dosage, reactive diluent ratio, and amine curing agent ratio, it significantly shortens the underwater curing time while maintaining excellent mechanical properties, thereby improving underwater construction efficiency and resistance to water erosion.
[0007] To achieve the above objectives, the present invention adopts the following technical solution:
[0008] In a first aspect, the present invention provides an underwater curing epoxy resin, comprising component A and component B, in parts by mass:
[0009] Component A comprises: 100-200 parts of epoxy resin, 15-30 parts of C12-14-tetradecyl glycidyl ether, and 20-40 parts of o-tolyl glycidyl ether.
[0010] Component B comprises: 30-50 parts of polyetheramine, 25-40 parts of nonylphenol, 8-15 parts of tris-(dimethylaminomethyl)phenol, and 20-35 parts of triethylenetetramine.
[0011] The mass ratio of the C11-tetradecyl glycidyl ether to the o-tolyl glycidyl ether is 1:1 to 1:1.5.
[0012] The mass ratio of the polyetheramine to the triethylenetetramine is 1.2:1 to 1.4:1.
[0013] In some preferred embodiments of the present invention, the tris-(dimethylaminomethyl)phenol accounts for 8-15% of the total mass of component B.
[0014] In some preferred embodiments of the present invention, the mass ratio of the C12-tetradecyl glycidyl ether to the o-tolyl glycidyl ether is 1:1.2 to 1:1.4; and the mass ratio of the polyetheramine to the triethylenetetramine is 1.3:1 to 1.4:1.
[0015] In some preferred embodiments of the present invention, the mixing volume ratio of component A to component B is 2:1.
[0016] In some preferred embodiments of the present invention, component A and / or component B may further include 0.5-2 parts of silane coupling agent and 0.1-0.5 parts of defoamer. The silane coupling agent is at least one of γ-glycidoxypropyltrimethoxysilane (KH-560) and γ-aminopropyltriethoxysilane (KH-550).
[0017] In some preferred embodiments of the present invention, the epoxy resin is at least one of bisphenol A type epoxy resin E-51 and bisphenol A type epoxy resin E-44, and the epoxy value is 0.48-0.54 mol / 100g.
[0018] In some preferred embodiments of the present invention, the polyetheramine is polyetheramine D-230.
[0019] Secondly, the present invention provides a method for preparing the above-mentioned underwater curing epoxy resin, comprising the following steps: mixing the raw materials of component A evenly to obtain component A; mixing the raw materials of component B evenly to obtain component B; and mixing component A and component B at a volume ratio of 2:1 to obtain the underwater curing epoxy resin.
[0020] Thirdly, the present invention provides the application of the above-mentioned underwater curing epoxy resin in underwater engineering, wherein the underwater engineering includes at least one of wharf pile foundation grouting, underwater repair, pressure grouting and pile foundation positioning.
[0021] In summary, this application has the following beneficial effects:
[0022] (1) By optimizing the amount of tri-(dimethylaminomethyl)phenol to 8-15% of component B, and combining it with a specific mass ratio of polyetheramine to triethylenetetramine (1.2:1~1.4:1), the underwater curing epoxy resin of the present invention is shortened to 28-42 minutes, which is 16-44% shorter than the existing underwater epoxy system (more than 50 minutes), and the surface drying time is no more than 5 hours, which greatly improves the efficiency of underwater construction and the ability to resist water flow erosion.
[0023] (2) By controlling the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether to 1:1 to 1:1.5, the present invention maintains the low viscosity (750-1250 cps) and good pumpability of the system. The long chain of C12-tetradecyl provides excellent hydrophobicity, effectively blocking the interference of water on the curing reaction. The o-tolyl glycidyl ether improves the reactivity of the system. The two work together to achieve rapid curing in the underwater environment.
[0024] (3) The underwater curing epoxy resin of the present invention significantly shortens the curing time, and after 7 days of water curing, the tensile strength is ≥5000 psi, the adhesive strength is ≥1750 psi, the compressive strength is ≥8300 psi, and the Shore hardness is 85-90, which meets the requirements of ASTM D-638, ASTM C-882, ASTM D-695 and ASTM D-2240 standards, and can replace imported similar underwater epoxy products. Attached Figure Description
[0025] Figure 1 This is a flowchart of the underwater curing epoxy resin preparation method provided in Embodiment 1 of this application. Detailed Implementation
[0026] The embodiments of the present invention will be described in detail below with reference to the examples. However, those skilled in the art will understand that the following examples are only for illustrating the present invention and should not be regarded as limiting the scope of the present invention. Specific conditions not specified in the examples shall be carried out according to conventional conditions or conditions recommended by the manufacturer. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.
[0027] The sources of the reagent raw materials for this invention are shown in Table 1:
[0028] Table 1. Reagent Sources
[0029]
[0030] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.
[0031] Example 1
[0032] This embodiment provides an underwater curing epoxy resin, the preparation method of which includes:
[0033] Preparation of Component A: 190 g of bisphenol A type epoxy resin E-51, 22 g of C16-tetradecyl glycidyl ether (XY748), 30 g of o-tolyl glycidyl ether (XY691), 1 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0034] Preparation of Component B: 38 g of polyetheramine D-230, 35 g of nonylphenol, 12 g of tris-(dimethylaminomethyl)phenol (DMP-30), 28 g of triethylenetetramine, 1 g of γ-glycidoxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether-modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component B.
[0035] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0036] In this embodiment, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 22:30≈1:1.36, the mass ratio of polyetheramine D-230 to triethylenetetramine is 38:28≈1.36:1, and DMP-30 accounts for 10.5% of the total mass of component B.
[0037] Example 2
[0038] This embodiment provides an underwater curing epoxy resin, the preparation method of which includes:
[0039] Preparation of Component A: 150 g of bisphenol A type epoxy resin E-51, 25 g of C16-tetradecyl glycidyl ether (XY748), 30 g of o-tolyl glycidyl ether (XY691), 1 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0040] Preparation of Component B: 42 g of polyetheramine D-230, 35 g of nonylphenol, 10 g of tris-(dimethylaminomethyl)phenol (DMP-30), 30 g of triethylenetetramine, 1 g of γ-glycidoxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether-modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component B.
[0041] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0042] In this embodiment, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 25:30≈1:1.2, the mass ratio of polyetheramine D-230 to triethylenetetramine is 42:30=1.4:1, and DMP-30 accounts for 8.5% of the total mass of component B.
[0043] Example 3
[0044] This embodiment provides an underwater curing epoxy resin, the preparation method of which includes:
[0045] Preparation of Component A: 200 g of bisphenol A type epoxy resin E-44, 20 g of C12-tetradecyl glycidyl ether (XY748), and 25 g of o-tolyl glycidyl ether (XY691) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0046] Preparation of Component B: Add 35 g of polyetheramine D-230, 38 g of nonylphenol, 13 g of tris-(dimethylaminomethyl)phenol (DMP-30), and 25 g of triethylenetetramine to a mixing container, and stir at 500 r / min for 15 minutes at room temperature until the mixture is homogeneous to obtain Component B.
[0047] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0048] In this embodiment, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 20:25=1:1.25, the mass ratio of polyetheramine D-230 to triethylenetetramine is 35:25=1.4:1, and DMP-30 accounts for 11.7% of the total mass of component B.
[0049] Example 4
[0050] This embodiment provides an underwater curing epoxy resin, the preparation method of which includes:
[0051] Preparation of Component A: 180 g of bisphenol A type epoxy resin E-51, 20 g of C12-tetradecyl glycidyl ether (XY748), 25 g of o-tolyl glycidyl ether (XY691), 1.5 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.5 g of polyether modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0052] Preparation of Component B: 40 g of polyetheramine D-230, 38 g of nonylphenol, 11 g of tris-(dimethylaminomethyl)phenol (DMP-30), 30 g of triethylenetetramine, 1.5 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.5 g of polyether-modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component B.
[0053] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0054] In this embodiment, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 20:25 = 1:1.25, the mass ratio of polyetheramine D-230 to triethylenetetramine is 40:30 ≈ 1.33:1, and DMP-30 accounts for 9.2% of the total mass of component B.
[0055] Example 5
[0056] This embodiment provides an underwater curing epoxy resin, the preparation method of which includes:
[0057] Preparation of Component A: 170 g of bisphenol A type epoxy resin E-51, 25 g of C16-tetradecyl glycidyl ether (XY748), 25 g of o-tolyl glycidyl ether (XY691), 0.5 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.1 g of polyether modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0058] Preparation of Component B: 28 g of polyetheramine D-230, 30 g of nonylphenol, 8 g of tris-(dimethylaminomethyl)phenol (DMP-30), 20 g of triethylenetetramine, 0.5 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.1 g of polyether-modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component B.
[0059] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0060] In this embodiment, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 25:25=1:1, the mass ratio of polyetheramine D-230 to triethylenetetramine is 30:20=1.5:1, and DMP-30 accounts for 9.1% of the total mass of component B.
[0061] Comparative Example 1
[0062] This comparative example uses the corresponding formulation of commercially available EP 220 underwater epoxy resin.
[0063] Preparation of Component A: 190 g of bisphenol A type epoxy resin E-51, 20 g of C12-tetradecyl glycidyl ether (XY748), and 35 g of o-tolyl glycidyl ether (XY691) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0064] Preparation of Component B: Add 40 g of polyetheramine D-230, 35 g of nonylphenol, 5 g of tris-(dimethylaminomethyl)phenol (DMP-30), and 25 g of triethylenetetramine to a mixing container, and stir at 500 r / min for 15 minutes at room temperature until the mixture is homogeneous to obtain Component B.
[0065] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0066] In this comparative example, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 20:35≈1:1.75, which exceeds the range of 1:1~1:1.5 of the present invention; the mass ratio of polyetheramine D-230 to triethylenetetramine is 40:25=1.6:1, which exceeds the range of 1.2:1~1.4:1 of the present invention; DMP-30 accounts for 4.8% of the total mass of component B, which is lower than the range of 8-15% of the present invention.
[0067] Comparative Example 2
[0068] This comparative example provides an underwater curing epoxy resin, comprising:
[0069] Preparation of component A: Same as Comparative Example 1.
[0070] Preparation of Component B: Add 40 g of polyetheramine D-230, 35 g of nonylphenol, 12 g of tris-(dimethylaminomethyl)phenol (DMP-30), and 25 g of triethylenetetramine to a mixing container, and stir at 500 r / min for 15 minutes at room temperature until the mixture is homogeneous to obtain Component B.
[0071] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0072] This comparative example only increases the amount of DMP-30 to within the scope of this invention, but the diluent ratio (1:1.75) and amine ratio (1.6:1) still exceed the scope of this invention, and is used to verify the effect of adjusting a single parameter.
[0073] Comparative Example 3
[0074] This comparative example provides an underwater curing epoxy resin, comprising:
[0075] Preparation of Component A: 190 g of bisphenol A type epoxy resin E-51, 15 g of C11-tetradecyl glycidyl ether (XY748), 40 g of o-tolyl glycidyl ether (XY691), 1 g of γ-glycidyl etheroxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component A.
[0076] Preparation of component B: Same as in Example 1.
[0077] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0078] In this comparative example, the mass ratio of C12-tetradecyl glycidyl ether to o-tolyl glycidyl ether is 15:40 = 1:2.67, which exceeds the range of 1:1 to 1:1.5 of this invention, and is used to verify the performance changes after the diluent ratio exceeds the range.
[0079] Comparative Example 4
[0080] This comparative example provides an underwater curing epoxy resin, comprising:
[0081] Preparation of component A: Same as in Example 1.
[0082] Preparation of Component B: 50 g of polyetheramine D-230, 35 g of nonylphenol, 12 g of tris-(dimethylaminomethyl)phenol (DMP-30), 20 g of triethylenetetramine, 1 g of γ-glycidoxypropyltrimethoxysilane (KH-560) and 0.3 g of polyether-modified silicone defoamer (BYK-A530) were added to a mixing container and stirred at 500 r / min for 15 minutes at room temperature until the mixture was homogeneous to obtain Component B.
[0083] When using, mix component A and component B at a volume ratio of 2:1, stir well, and it is ready to use.
[0084] In this comparative example, the mass ratio of polyetheramine D-230 to triethylenetetramine is 50:20 = 2.5:1, which exceeds the range of 1.2:1 to 1.4:1 of this invention. This is used to verify the performance changes after the amine ratio exceeds the range.
[0085] Performance testing
[0086] I. Detection Methods / Test Methods
[0087] The underwater-curing epoxy resins prepared in each embodiment and comparative example were subjected to performance tests according to the following test methods:
[0088] 1. Viscosity: The viscosity of the mixed resin was determined at 25°C using a rotational viscometer in accordance with ASTM D-2196 standard.
[0089] 2. Gel time: According to GB / T 12007.7 standard, take 60g of uniformly mixed resin sample at 25℃ and record the time from the start of mixing until the sample loses its fluidity.
[0090] 3. Surface drying time: In accordance with GB / T 1728 standard, at 25℃ and 80% relative humidity, the mixed resin was applied to the surface of the pre-soaked concrete test block, and the time when the surface was no longer sticky to the touch was recorded.
[0091] 4. Tensile strength: The cured sample was tested after being cured in deionized water for 7 days in accordance with ASTM D-638 standard.
[0092] 5. Bond strength: In accordance with ASTM C-882 standard, underwater bonding was performed on concrete test blocks that had been pre-soaked in water for 24 hours, and the bond strength of the miter joint was tested after 7 days of curing.
[0093] 6. Compressive strength: The cured sample was tested after being cured in deionized water for 7 days in accordance with ASTM D-695 standard.
[0094] 7. Shore Hardness: The hardness of the sample after 7 days of curing was determined using a Shore D hardness tester according to ASTM D-2240 standard.
[0095] II. Test Results:
[0096] As shown in Table 2:
[0097] Table 2. Performance test results of underwater curing epoxy resin
[0098]
[0099] As can be seen from the data in Table 2:
[0100] The underwater curing time of the epoxy resins in Examples 1-5 was in the range of 32-42 minutes, which was 16-36% shorter than the 50 minutes of Comparative Example 1 (EP220 corresponding formulation); the surface drying time was in the range of 3.5-5.0 hours, which was 31-56% shorter than the 8 hours of Comparative Example 1. Meanwhile, the underwater 7-day bond strength of Examples 1-5 was 1800-2000 psi, all of which were not lower than the 1800 psi of Comparative Example 1, with Example 1 reaching 2000 psi, an increase of 11% compared to Comparative Example 1. The tensile strength and compressive strength were also better than or equal to those of Comparative Example 1.
[0101] Comparative Example 2 only increased the amount of DMP-30 to within the scope of this invention, but the diluent ratio and amine ratio remained the original ratio of Comparative Example 1. Its curing time was 43 minutes and its surface drying time was 6 hours, which was better than Comparative Example 1, but significantly worse than Example 1 (35 minutes and 4 hours). The bond strength of 1750 psi was also lower than the 2000 psi of Example 1. This indicates that simply increasing the amount of accelerator is insufficient to achieve optimal underwater curing speed and bond performance; synergistic optimization of the ranges of three key parameters is required.
[0102] In Comparative Example 3, the diluent ratio (1:2.67) exceeded the scope of this invention, resulting in a gelation time of 47 minutes, a surface drying time of 7 hours, and a bond strength of only 1600 psi, a 20% decrease compared to Example 1. This is because the excessively high proportion of o-tolyl glycidyl ether led to insufficient hydrophobicity of the system, making it more susceptible to interference with the curing reaction in an underwater environment. Simultaneously, the excessively low proportion of C12-C14-tetradecyl glycidyl ether reduced the system's ability to expel moisture from the water surface.
[0103] In Comparative Example 4, the amine ratio (2.5:1) exceeded the scope of this invention, resulting in a gelation time of up to 55 minutes, a surface drying time of up to 9 hours, a bond strength of only 1500 psi, and a Shore hardness of only 80. This was due to the excessively high proportion of polyetheramine D-230, which had relatively low reactivity, leading to a significant decrease in the overall curing rate. At the same time, the excessively low proportion of triethylenetetramine resulted in insufficient active centers during initial curing.
[0104] The above experimental results show that only when the three key parameters of accelerator dosage, diluent ratio, and amine ratio are all within the range defined by this invention can the best balance between curing speed and mechanical properties be achieved in an underwater environment, resulting in unexpected synergistic technical effects.
[0105] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.
Claims
1. An underwater curing epoxy resin, characterized in that, Including components A and B, by mass parts: Component A comprises: 100-200 parts of epoxy resin, 15-30 parts of C12-14-tetradecyl glycidyl ether, and 20-40 parts of o-tolyl glycidyl ether. Component B comprises: 30-50 parts of polyetheramine, 25-40 parts of nonylphenol, 8-15 parts of tris-(dimethylaminomethyl)phenol, and 20-35 parts of triethylenetetramine. The mass ratio of the C11-tetradecyl glycidyl ether to the o-tolyl glycidyl ether is 1:1 to 1:1.
5. The mass ratio of the polyetheramine to the triethylenetetramine is 1.2:1 to 1.4:
1.
2. The underwater curing epoxy resin according to claim 1, characterized in that, The tris-(dimethylaminomethyl)phenol accounts for 9-11% of the total mass of component B.
3. The underwater curing epoxy resin according to claim 1, characterized in that, The mass ratio of the C12-tetradecyl glycidyl ether to the o-tolyl glycidyl ether is 1:1.2 to 1:1.4; the mass ratio of the polyetheramine to the triethylenetetramine is 1.3:1 to 1.4:
1.
4. The underwater curing epoxy resin according to claim 1, characterized in that, The mixing volume ratio of component A to component B is 2:
1.
5. The underwater curing epoxy resin according to claim 1, characterized in that, The components A and / or B further include 0.5-2 parts of silane coupling agent and 0.1-0.5 parts of defoamer; the silane coupling agent is at least one of γ-glycidoxypropyltrimethoxysilane and γ-aminopropyltriethoxysilane.
6. The underwater curing epoxy resin according to claim 1, characterized in that, The epoxy resin is at least one of bisphenol A type epoxy resin E-51 and bisphenol A type epoxy resin E-44, with an epoxy value of 0.48-0.54 mol / 100g.
7. The underwater curing epoxy resin according to claim 1, characterized in that, The polyetheramine is polyetheramine D-230.
8. A method for preparing an underwater-curing epoxy resin as described in any one of claims 1-7, characterized in that, Includes the following steps: Mix all the raw materials of component A evenly to obtain component A; The raw materials of component B are mixed evenly to obtain component B; When using, the components A and B are mixed at a volume ratio of 2:1 to obtain the underwater curing epoxy resin.
9. The application of an underwater-curing epoxy resin as described in any one of claims 1-7 in underwater engineering, characterized in that, The underwater engineering includes at least one of wharf pile foundation grouting, underwater repair, pressure grouting, and pile foundation positioning.