Low-corrosion epoxy potting compound, its preparation method and its application in water treatment filter membrane modules

Abstract

This application relates to the field of epoxy potting compounds, disclosing a low-corrosion epoxy potting compound, its preparation method, and its application in water treatment filter membrane modules. The compound includes a resin material and a curing agent. The resin material, by weight percentage, comprises 80-90% epoxy resin and 10-20% a first diluent. The curing material, by weight percentage, comprises 70-85% an amine curing agent, 10-20% a second diluent, and 5-10% additives. The preparation method of the epoxy potting compound in this application is simple and efficient, with a fast curing speed. The cured product is transparent, has few bubbles, low corrosivity to filter membrane modules, and high toughness, significantly improving the safety, treatment efficiency, and service life of wastewater treatment modules.

Description

Technical Field

[0001] This application relates to the field of epoxy potting compounds, and more specifically, to a low-corrosion epoxy potting compound, its preparation method, and its application in water treatment filter membrane assemblies. Background Technology

[0002] Currently, the most commonly used filter membranes in wastewater treatment include microfiltration (MF), ultrafiltration (UF), nanofiltration (NF), and reverse osmosis (RO). These membranes can all be used in membrane bioreactors (MBR). MBR is a wastewater treatment technology that combines membrane separation technology with biological treatment processes, and it is widely used in the water treatment field. The assembly of filter membrane modules in an MBR mainly involves cutting, aligning, and fixing the membrane (or membrane fibers). Fixing involves using potting compound to secure the filter membrane in the collection pipe. The potting compound used on the filter membrane module must meet the following requirements: 1. The potting compound must not corrode the filter membrane or cause discoloration during curing; 2. The curing process must meet the actual process requirements, i.e., the curing speed and post-curing hardness must meet the process requirements; 3. The potting compound should have moderate viscosity and few air bubbles to avoid affecting the performance or service life of the filter membrane module.

[0003] Currently, filter membrane potting compounds on the market are mainly divided into polyurethane and epoxy types. Epoxy compounds offer higher toughness, a smooth surface after curing, and are more cost-effective in potting applications without specific high or low temperature requirements. Most epoxy filter membrane module potting compounds currently available have high viscosity, requiring oven baking and presenting challenges in removing air bubbles during curing. These resins present issues related to energy consumption, product quality, and appearance that urgently need to be addressed. Furthermore, the formulation components and exothermic curing processes of some similar products can cause filter membrane corrosion, posing a significant safety hazard to water treatment.

[0004] Therefore, there is a need in the field for an epoxy potting compound that is low in corrosion, has a moderate curing speed and heat release, few bubbles, and high toughness, and can be widely used for potting water treatment filter membrane modules of different specifications. Summary of the Invention

[0005] The purpose of this invention is to provide an epoxy potting compound suitable for water treatment filter membrane modules, characterized by low corrosivity, high transparency, and room temperature preparation, so as to minimize the impact of the potting compound on the efficiency and quality of the water treatment filter membrane during use. Therefore, this application provides a low-corrosion epoxy potting compound, its preparation method, and its application in water treatment filter membrane modules.

[0006] To achieve the above-mentioned objectives, this application provides the following technical solution:

[0007] In one aspect, this application provides a low-corrosion epoxy potting compound, comprising a resin material and a curing agent; The resin material, by weight percentage, comprises 80-90% epoxy resin and 10-20% first diluent; The cured material, by mass percentage, comprises 70-85% amine curing agent, 10-20% second diluent, and 5-10% additives.

[0008] Furthermore, the epoxy resin is any one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin.

[0009] Further, the first diluent is a mixture of two or more of the following: alkylene glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, and dodecyltetradecyl glycidyl ether.

[0010] Furthermore, the amine curing agent is a mixture of two or more of the following: aliphatic amine curing agents, cycloaliphatic amine curing agents, aromatic amine curing agents, and polyamide curing agents.

[0011] Further, the second diluent is a mixture of two or more of the following: alkylene glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, and dodecyltetradecyl glycidyl ether.

[0012] Furthermore, the additive is an acid-based additive; preferably, the acid-based additive is an organic acid.

[0013] Secondly, this application provides a method for preparing the aforementioned low-corrosion epoxy potting compound, comprising the following steps: Step 1: Mix epoxy resin and first diluent to obtain resin material; Step 2: Mix the amine curing agent, the second diluent, and the additives to obtain the cured material; Step 3: When applying, mix and cure the resin material obtained in Step 1 and the curing material obtained in Step 2 at room temperature to obtain the low-corrosion epoxy potting compound.

[0014] Furthermore, in step 3, the ratio of resin material to curing material is 100:(45~50).

[0015] Secondly, this application provides the application of the aforementioned low-corrosion epoxy potting compound in water treatment filter membrane assemblies.

[0016] Furthermore, in application, the resin material and the curing material are mixed and cured at a weight ratio of 100:(45~50) at room temperature.

[0017] In summary, this application has the following beneficial effects: The present invention provides a simple and efficient method for preparing an epoxy potting compound for water treatment filter membrane modules. The method features rapid curing, a transparent cured product with few bubbles, low corrosivity to the filter membrane module, and high toughness, significantly improving the safety, treatment efficiency, and lifespan of wastewater treatment components. Furthermore, compared to commercially available low-corrosion curing agents that require heating during preparation, this product can be prepared at room temperature, reducing production costs and offering greater convenience and efficiency. Detailed Implementation

[0018] The technical solutions and effects of this application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely for explaining the invention and are not intended to limit the invention.

[0019] Example 1 This application provides an epoxy potting compound for water treatment filter membrane modules, comprising resin material and curing agent; the resin material, by weight percentage, comprises 90 parts of epoxy resin (bisphenol A type epoxy resin: Nanya E44), 10 parts of first diluent: Green Home AGE-6 parts and Green Home 622-4 parts; the curing material, by weight percentage, comprises 70 parts of amine curing agent (of which, modified aliphatic amine: Huntsman D230 35 parts, modified cycloaliphatic amine: Wanhua IPDA 35 parts), 20 parts of second diluent: Green Home AGE-15 parts and Green Home 632-5 parts, and 10 parts of additive: oxalic acid.

[0020] The preparation steps of this epoxy potting compound are as follows: The first step is to prepare the resin material by uniformly mixing 90% bisphenol A type epoxy resin and 10% first diluent at room temperature.

[0021] The second step is to prepare the cured material by uniformly mixing 35% modified aliphatic amine, 35% modified cycloaliphatic amine, 20% second diluent, and 10% additives at room temperature.

[0022] Performance Testing: Using the above-mentioned resin material and curing material at a weight ratio of 100:50, 100 g of exothermic reaction was carried out at room temperature (25℃), and the filter membrane was immersed in the mixed resin for observation of color change. The exothermic peak time of the resin under this preparation method was 57~63 min, and the exothermic peak temperature was 135~145℃. Under these conditions, the curing agent was colorless to light yellow, with a viscosity of 300~340 cps, and the mixed viscosity was 900~1000 cps. The cured product was almost bubble-free. The immersed filter membrane showed no color change. After 24 h, the hardness of the casting reached over 75 HD.

[0023] Comparative Example 1 The preparation method of the resin material is the same as in Example 1. The cured material is prepared by uniformly mixing 35 parts of modified aliphatic amine, 35 parts of modified cycloaliphatic amine, and 20 parts of second diluent at room temperature without adding organic acid additives.

[0024] Performance testing: Using the above-mentioned resin material and curing material at a weight ratio of 100:50, 100 g of exothermic reaction was carried out at room temperature (25℃). The exothermic peak data were 59~63 min, 135~141℃. Under these preparation conditions, the curing agent was colorless to light yellow, with a viscosity of 318~328 cps, and the cured product was free of bubbles. The filter membrane showed obvious discoloration.

[0025] The results above show that the addition of this organic acid can effectively improve the corrosiveness of the curing agent to the filter membrane and avoid damage to the filter membrane during the curing process.

[0026] Comparative Example 2 The resin material used is commercially available pure bisphenol A type epoxy resin, without the addition of a first diluent. The preparation method of the cured material is the same as in Example 1.

[0027] Performance testing: Using the above-mentioned resin material and curing material at a ratio of 100:50, 100 g of exothermic reaction was carried out at room temperature (25°C). The exothermic peak data were 68~72 min, 123~130°C. Under these preparation conditions, the mixed viscosity was 1533~1562 cps, and the cured product contained a large number of bubbles.

[0028] The results above show that the addition of the first diluent can effectively improve the mixing viscosity and curing speed of the resin.

[0029] Comparative Example 3 The preparation method of the resin material is the same as in Example 1. The cured material is prepared by mixing 35% modified aliphatic amine, 35% modified cycloaliphatic amine, 20% second diluent, and 10% additives under a heating condition of 40°C.

[0030] Performance Testing: Using the above-mentioned resin material and curing material at a weight ratio of 100:50, 100 g of exothermic reaction was carried out at room temperature (25℃). The exothermic peak data were 62~65 min, 131~138℃. Under these preparation conditions, the curing agent was yellow, with a viscosity of 541~560 cps, and the cured product contained some bubbles. The filter membrane showed no discoloration, and the hardness of the casting reached over 75 HD after 24 h.

[0031] Comparative Example 4 The preparation method of the resin material is the same as in Example 1. The cured material is prepared by mixing 35% modified aliphatic amine, 35% modified cycloaliphatic amine, 20% reactive diluent, and 10% additives under a heating condition of 60°C.

[0032] Performance Testing: Using the above-mentioned resin material and curing agent at a weight ratio of 100:50, 100g of exothermic reaction was carried out at room temperature (25℃). The exothermic peak data were 63~67 min, 128~133℃. Under these preparation conditions, the curing agent was dark yellow in color, with a viscosity of 744~758 cps. The cured product contained many bubbles, and the transparency decreased significantly. The filter membrane turned slightly yellow, and the hardness of the casting after 24 h was 70 HD.

[0033] The results above show that as the heating temperature increases, the color of the curing agent becomes darker and the viscosity increases significantly. Consequently, more bubbles are generated in the final cured product, resulting in losses in both appearance and curing efficiency.

[0034] Application examples The exothermic peak data of the resin material and curing material cured at the following ambient temperatures in this patent (i.e., the temperature at which the resin material and curing material are mixed and cured during application) can provide a reference for use at different ambient temperatures. The exothermic data and curing hardness are shown in the table below. The curing speed can be adapted to use at different ambient temperatures.

[0035]

[0036] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A low-corrosion epoxy potting compound, characterized in that, Includes resin materials and curing agents; The resin material, by weight percentage, comprises 80-90% epoxy resin and 10-20% first diluent. The cured material, by mass percentage, comprises 70-85% amine curing agent, 10-20% second diluent, and 5-10% additives.

2. The low-corrosion epoxy potting compound according to claim 1, characterized in that, The epoxy resin is any one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin.

3. The low-corrosion epoxy potting compound according to claim 1, characterized in that, The first diluent is a mixture of two or more of the following: alkylene glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, and dodecyltetradecyl glycidyl ether.

4. The low-corrosion epoxy potting compound according to claim 1, characterized in that, The amine curing agent is a mixture of two or more of the following: aliphatic amine curing agents, cycloaliphatic amine curing agents, aromatic amine curing agents, and polyamide curing agents.

5. The low-corrosion epoxy potting compound according to claim 1, characterized in that, The second diluent is a mixture of two or more of the following: alkylene glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, and dodecyltetradecyl glycidyl ether.

6. The low-corrosion epoxy potting compound according to claim 1, characterized in that, The additive is an acid-based additive; preferably, the acid-based additive is an organic acid.

7. The method for preparing the low-corrosion epoxy potting compound according to any one of claims 1-6, characterized in that, Includes the following steps: Step 1: Mix epoxy resin and first diluent to obtain resin material; Step 2: Mix the amine curing agent, the second diluent, and the additives to obtain the cured material; Step 3: When applying, mix and cure the resin material obtained in Step 1 and the curing material obtained in Step 2 at room temperature to obtain the low-corrosion epoxy potting compound.

8. The method for preparing the low-corrosion epoxy potting compound according to claim 7, characterized in that, In step 3, the ratio of resin material to curing material is 100:(45~50).

9. The use of the low-corrosion epoxy potting compound according to any one of claims 1-6 in water treatment filter membrane modules.

10. The application according to claim 9, characterized in that, When applying, the resin material and curing material are mixed and cured at a weight ratio of 100:(45~50) at room temperature.

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