An automatic soldering and gold removal machine for connectors and its application method

Abstract

This invention belongs to the field of connector gold removal technology, and particularly relates to an automatic connector soldering and gold removal machine and its usage method. It includes: a base and a connector carrying mechanism mounted on the base, the connector carrying mechanism being slidably mounted on the base and used to carry and fix connectors; a soldering mechanism, mounted on the base and located above the connector carrying mechanism, the soldering mechanism being used to apply solder to the connectors on the connector carrying mechanism; a solder pushing mechanism, mounted on the base and located to one side of the connector carrying mechanism, the solder pushing mechanism being used to push liquid solder into the connector solder cups on the connector carrying mechanism; and a solder suction tape feeding mechanism, mounted on the base and located to one side of the connector carrying mechanism, the solder suction tape feeding mechanism being used to transport the solder tape past the connectors on the connector carrying mechanism. This invention solves the problems of inaccuracy and inconsistency in existing manual soldering processes, ensuring product quality.

Description

Technical Field

[0001] This invention belongs to the field of connector gold removal technology, and particularly relates to an automatic connector tinning and gold removal machine and its usage method. Background Technology

[0002] Connectors play a crucial role in fast-reflecting mirror systems. These connectors connect piezoelectric ceramic drivers or voice coil motors to the drive circuitry, especially in split-type fast-reflecting mirrors where they also connect the mirror assembly to the drive assembly. To meet the high-performance requirements of fast-reflecting mirrors, these connectors must possess high reliability to ensure stable operation under the shocks encountered during satellite launch, temperature cycling in space, and other harsh environmental conditions. Furthermore, high-precision angle sensor information needs to be transmitted to the control system via connectors, meaning the connectors must have strong anti-interference capabilities.

[0003] In the design and manufacturing of electronic connectors, gold plating is commonly used to improve conductivity and connection reliability. Gold plating refers to covering the surface of the connector connection area or component pins with a thin layer of gold, which significantly improves conductivity and corrosion resistance. However, despite the excellent conductivity of gold itself, under fast-reflective mirror (FREM) system conditions, especially when the gold layer combines with solder at the connector joint, brittle intermetallic compounds may form. These compounds reduce connection strength and increase the potential risk of interface breakage. Therefore, in FEM systems, connectors require gold removal. Currently, tinning is done manually in production processes. This traditional manual method undoubtedly has many limitations. On the one hand, the manual tinning process is extremely inefficient and cannot meet the increasingly demanding production efficiency requirements of modern industry; on the other hand, the manual insertion process is highly susceptible to the subjective differences of the operator, leading to inconsistent production quality. These defects not only directly increase production costs, but also, in high-performance applications where inconsistent quality is particularly critical, can pose serious risks. To address these problems, the purpose of this invention is to improve the production efficiency of tinning while ensuring consistent production quality through automated production equipment. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic soldering and gold removal machine for connectors, which aims to solve the technical problems of extremely low efficiency in the existing manual soldering and gold removal process and the manual insertion process being easily affected by the subjective differences of the operator, resulting in difficulty in maintaining consistent production quality.

[0005] To achieve the above objectives, an embodiment of the present invention provides an automatic soldering and gold removal machine for connectors, comprising: a base and a component disposed on the base: The connector carrier mechanism is slidably mounted on the base and is used to support and fix the connector. The tinning mechanism is mounted on the base and located above the connector carrier mechanism. The tinning mechanism is used to apply tin to the connector on the connector carrier mechanism. The solder-pushing mechanism is mounted on the base and located on one side of the connector carrier mechanism. This mechanism is used to push liquid solder into the connector solder cup on the connector carrier mechanism. The solder strip feeding mechanism is mounted on the base and located on one side of the connector carrier mechanism. The solder strip feeding mechanism is used to transport the solder strip through the connector on the connector carrier mechanism.

[0006] Furthermore, the connector carrier mechanism includes: The linear drive module is mounted on the machine base. An angle adjustment mechanism, one end of which is connected to a drive linear module, is used to move the angle adjustment mechanism closer to or further away from the tinning mechanism. The mounting base plate is located at the drive end of the angle adjustment mechanism, which drives the mounting base plate to rotate around its connection point with the mounting base plate. The mounting column is installed on the mounting base plate. A connector mounting fixture is mounted on a mounting post and is used to mount connectors.

[0007] Furthermore, the connector carrier mechanism also includes: The connector flipping mechanism is mounted on the mounting post. The drive end of the connector flipping mechanism is connected to the connector mounting fixture. The connector flipping mechanism is used to drive the connector mounting fixture to flip.

[0008] Furthermore, the tinning mechanism includes: The gantry frame is mounted on the machine base. The tin-plated X-axis linear module is mounted on the crossbeam of the gantry frame and is perpendicular to the drive linear module. The tin-plated Z-axis linear module is located at the drive end of the tin-plated X-axis linear module. The soldering iron welding mechanism is located at the drive end of the soldering Z-axis linear module, which drives the soldering iron welding mechanism to rise or fall. An automatic solder dispensing mechanism is installed on the gantry frame and is used to extend the solder wire to the soldering iron mechanism.

[0009] Furthermore, it also includes: Replace the linear module. The replacement linear module is mounted on the mounting base plate and is parallel to the drive linear module. The mounting plate is located at the drive end of the replacement linear module. The solder priming mechanism and the solder strip feeding mechanism are located on the mounting plate. The replacement linear module is used to drive the linear movement of the mounting plate so that the solder priming mechanism or the solder strip feeding mechanism is located on one side of the connector mounting fixture.

[0010] Furthermore, the tin-tackling institutions include: The first push linear module is mounted on the mounting plate. The needle is located at the drive end of the first push linear module, which is used to drive the needle to move closer to or away from the connector mounting fixture.

[0011] Furthermore, the desoldering strip feeding mechanism includes: The second push linear module is mounted on the mounting plate and is parallel to the first push linear module. A desoldering tape transport assembly is disposed at the drive end of a second push linear module. The second push linear module is used to drive the desoldering tape transport assembly to move closer to or away from the connector mounting fixture. The desoldering tape transport assembly is used to extend the desoldering tape.

[0012] Furthermore, the desoldering strip feeding mechanism also includes: The cutting and recycling component is mounted on the mounting plate and located on one side of the desoldering tape transport component. It is used to cut the desoldering tape extending from the desoldering tape transport component.

[0013] Furthermore, the shredding and recycling components include: Telescopic cylinder, the telescopic cylinder is mounted on the mounting plate. A cutting cylinder, located at the drive end of a telescopic cylinder, is used to drive the cutting cylinder into or out of the space between the solder wick transport assembly and the connector mounting fixture. The cutting cylinder is used to cut the solder wick. The desoldering tape collection box is mounted on the mounting plate and located between the desoldering tape transport assembly and the connector mounting fixture, and is used to collect the cut desoldering tape.

[0014] The present invention provides a method for using an automatic soldering and gold removal machine for connectors, comprising: Step 1: Manually place the connector onto the connector carrier mechanism. The connector carrier mechanism then moves the connector to a position below the soldering mechanism. Step 2: The soldering mechanism performs the first soldering of the connector. Step 3: After one side is tinned, the tinning mechanism returns to the first solder cup and works with the tin-removing mechanism to remove solder from the solder cup. Step 4: After the soldering process is complete, the soldering mechanism feeds solder to the solder cups a second time, repeating this cycle until all solder cups on the first side have been fed solder a second time. Step 5: After the second solder feeding, the connector moves to one side of the desoldering tape feeding mechanism. The desoldering tape is automatically delivered to one side of the connector, and the soldering mechanism automatically descends to heat and absorb the solder. This process is repeated until all the solder in the first solder cup is completely absorbed. Step 6: Flip the connector over and repeat steps 1 to 5 to tin and remove gold from the second solder cup.

[0015] The automatic soldering and gold removal machine for connectors provided in this invention provides at least one of the following technical effects: By incorporating four key technical features—a connector carrying mechanism, a soldering mechanism, a solder-dredging mechanism, and a solder-feeding and suction mechanism—the automatic soldering machine can efficiently and accurately perform soldering and gold removal operations on connectors. The connector carrying mechanism, slidably connected to the machine base, allows the connector to accurately reach the area below the soldering mechanism and the connector mounting position. This design ensures stability during the soldering process, thus improving operational accuracy and consistency. The soldering mechanism, through precise control of the soldering process from the introduction of liquid solder to the solder cup, improves soldering quality and avoids repetitive manual operations. The soldering mechanism operates after the soldering mechanism completes, injecting liquid solder into the solder cup. This ensures that the gold inside the cup also comes into contact with the solder, guaranteeing the quality and consistency of solder entry. The soldering mechanism then applies solder again, covering the outside of the solder cup. A desoldering tape feeding mechanism ensures precise transport of the solder tape. Through this automated desoldering tape feeding process, the desoldering tape simultaneously removes the solder and gold from the solder cup. This automatic soldering and gold removal machine for connectors provided by this invention avoids human error, thus ensuring operational efficiency and consistency. The entire process is automated, saving labor and reducing errors, thereby reducing production costs and improving efficiency. It solves the problems of inaccuracy and inconsistency in existing manual soldering processes, thus meeting the requirements of ensuring product quality and production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of an automatic soldering and gold removal machine for connectors provided in an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the internal structure of an automatic soldering and gold removal machine for connectors, provided in an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the connector carrying mechanism of an automatic tinning and gold removal machine for connectors provided in an embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the desoldering tape feeding mechanism of an automatic soldering and gold removal machine for connectors provided in an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the tin-removing mechanism of an automatic tinning and gold-removing machine for connectors provided in an embodiment of the present invention.

[0022] Reference numerals: 100, base; 200, connector carrier mechanism; 210, drive linear module; 220, angle adjustment mechanism; 230, mounting base plate; 240, mounting post; 250, connector mounting fixture; 260, connector flipping mechanism; 300, tinning mechanism; 310, gantry frame; 320, tinning X-axis linear module; 330, tinning Z-axis linear module; 340, soldering iron welding mechanism; 350, automatic solder dispensing mechanism; 400, solder wicking mechanism; 410, first pushing linear module; 420, wicking pin; 500, desoldering tape feeding mechanism; 510, second pushing linear module; 520, desoldering tape transport assembly; 530, cutting and recycling assembly; 531, telescopic cylinder; 532, cutting cylinder; 533, desoldering tape recycling box; 600, changing linear module; 610, mounting plate. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0024] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0027] In one embodiment of the present invention, reference is made to... Figures 1-5 As shown, an automatic soldering and gold removal machine for connectors is provided, including: a base 100 and components disposed on the base 100: The connector carrier mechanism 200 is slidably mounted on the base 100 and is used to support and fix the connector. A soldering mechanism 300 is mounted on the base 100 and located above the connector carrier mechanism 200. The soldering mechanism 300 is used to solder the connectors on the connector carrier mechanism 200. A solder-pushing mechanism 400 is mounted on the base 100 and located on one side of the connector carrier mechanism 200. The solder-pushing mechanism 400 is used to push liquid solder into the connector solder cup on the connector carrier mechanism 200. The solder strip feeding mechanism 500 is mounted on the base 100 and located on one side of the connector carrying mechanism 200. The solder strip feeding mechanism 500 is used to transport the connectors on the connector carrying mechanism 200 through the solder strip.

[0028] In this embodiment, by incorporating four key technical features—a connector carrying mechanism 200, a soldering mechanism 300, a solder-dipping mechanism 400, and a solder-feeding and suction mechanism 500—the automatic soldering machine can efficiently and accurately perform soldering and gold removal operations on connectors. The connector carrying mechanism 200, slidably connected to the base 100, allows the connector to accurately reach the area below the soldering mechanism 300 and the connector mounting position. This design ensures stability during the soldering process, thus improving operational accuracy and consistency. The soldering mechanism 300, by precisely controlling the process of pouring liquid solder into the solder cup, improves soldering quality and avoids repetitive manual operations. The soldering mechanism 400 operates after the soldering mechanism 300 completes, injecting liquid solder into the solder cup so that the gold inside the cup also comes into contact with the solder. This ensures the quality and consistency of solder entry into the solder cup. Subsequently, the soldering mechanism 300 performs another soldering operation, covering the outside of the solder cup with solder. Then, the solder strip feeding mechanism 500 ensures precise transport of the solder strip. Through the automated solder strip feeding process, the solder strip simultaneously absorbs the solder and gold from the solder cup. The automatic soldering and gold removal machine for connectors provided by this invention avoids human error, thereby ensuring operational efficiency and consistency. The entire process is automatically controlled and executed, saving labor and reducing operational errors, thus reducing production costs and improving production efficiency. It solves the problems of inaccuracy and inconsistency in existing manual soldering processes, thus meeting the requirements of ensuring product quality and production efficiency.

[0029] Specifically, refer to Figures 1-5 As shown, the connector carrier mechanism 200 includes: The linear drive module 210 is mounted on the base 100. An angle adjustment mechanism 220 is provided, with one end connected to a drive linear module 210. The drive linear module 210 is used to drive the angle adjustment mechanism 220 closer to or further away from the tinning mechanism 300. Mounting base plate 230 is disposed at the drive end of angle adjustment mechanism 220. Angle adjustment mechanism 220 is used to drive mounting base plate 230 to rotate around its connection point with mounting base plate 230. Mounting post 240 is mounted on mounting base plate 230. A connector mounting fixture 250 is provided on a mounting post 240 and is used to mount connectors.

[0030] In this embodiment, the driving linear module 210 drives the mounting base plate 230 to move closer to or further away from the tinning mechanism 300. When it moves away from the tinning mechanism 300, it facilitates the installation of the connector in the connector mounting fixture 250 by the worker. When it moves closer to the tinning mechanism 300, it facilitates the tinning mechanism 300 to tin the connector. The angle adjustment mechanism 220 is used to drive the mounting base plate 230 to rotate, thereby driving the mounting post 240 and the connector mounting fixture 250 to rotate, adjusting the angle between the connector on the connector mounting fixture 250 and the tinning mechanism 300, thereby making the tinning of the connector by the tinning mechanism 300 smoother. Through mechanical automated tinning, manual operation is saved and operational errors are reduced, improving production efficiency and tinning accuracy.

[0031] Specifically, refer to Figures 1-5 As shown, the connector carrier mechanism 200 also includes: A connector flipping mechanism 260 is mounted on a mounting post 240. The drive end of the connector flipping mechanism 260 is connected to the connector mounting fixture 250. The connector flipping mechanism 260 is used to drive the connector mounting fixture 250 to flip.

[0032] In this embodiment, after the first side of the connector is processed, the connector flipping mechanism 260 flips the connector to process the second side of the connector, avoiding manual flipping, improving the accuracy of flipping, and saving manual operation.

[0033] Specifically, refer to Figures 1-5 As shown, the tinning mechanism 300 includes: Gantry 310 is mounted on base 100. A tin-plated X-axis linear module 320 is mounted on the crossbeam of the gantry 310, and is perpendicular to the drive linear module 210. The tin-plated Z-axis linear module 330 is located at the drive end of the tin-plated X-axis linear module 320. Soldering iron welding mechanism 340 is located at the drive end of soldering Z-axis linear module 330, which is used to drive soldering iron welding mechanism 340 to rise or fall. An automatic solder dispensing mechanism 350 is mounted on a gantry frame 310 and is used to extend solder wire to the soldering iron soldering mechanism 340.

[0034] In this embodiment, the tinning X-axis linear module 320, the tinning Z-axis linear module 330, and the drive linear module 210 cooperate with each other to enable the soldering iron welding mechanism 340 to reach each solder cup of the connector, achieving precise tinning. The automatic solder dispensing mechanism 350 provides solder wire to the soldering iron welding mechanism 340, and the soldering iron welding mechanism 340 provides a heating function. After the solder wire is heated, it melts into the solder cup, achieving tinning.

[0035] Specifically, refer to Figures 1-5 As shown, it also includes: Replace the linear module 600. The linear module 600 is mounted on the mounting base plate 230 and is parallel to the drive linear module 210. Mounting plate 610 is set on the drive end of replacement linear module 600. Solder shoveling mechanism 400 and solder strip feeding mechanism 500 are set on mounting plate 610. Replacement linear module 600 is used to drive the linear movement of mounting plate 610 so that solder shoveling mechanism 400 or solder strip feeding mechanism 500 is located on one side of connector mounting fixture 250.

[0036] In this embodiment, the solder removal mechanism 400 and the solder strip feeding mechanism 500 are mounted on the mounting plate 610. A linear module 600 is used to drive the mounting plate 610 in linear motion, positioning the solder removal mechanism 400 or the solder strip feeding mechanism 500 on one side of the connector mounting fixture 250. When the solder removal mechanism 400 needs to remove solder from the connector, the linear module 600 drives the solder removal mechanism 400 to one side of the connector mounting fixture 250. The soldering iron welding mechanism 340 moves to the upper end of the solder cup, heating the solder on the cup and melting it. The solder is initially in liquid state. Then, the solder-pushing mechanism 400 pushes the solder into the solder cup. After the first solder cup is spun, the driving linear module 210 moves the second solder cup below the soldering iron welding mechanism 340. The linear module 600 is then replaced, and the solder-pushing mechanism 400 is positioned to the side of the second solder cup to complete the solder-pushing process. When desoldering is required, the linear module 600 is replaced, and the desoldering tape feeding mechanism 500 is positioned to the side of the connector mounting fixture 250 to perform desoldering. This achieves fully automated processing of soldering, solder-pushing, and desoldering.

[0037] Specifically, refer to Figures 1-5 As shown, the soldering mechanism 400 includes: The first push linear module 410 is mounted on the mounting plate 610. The needle 420 is disposed at the drive end of the first push linear module 410, which is used to drive the needle 420 to move closer to or further away from the connector mounting fixture 250.

[0038] In this embodiment, the first push linear module 410 drives the push pin 420 to approach or move away from the connector mounting fixture 250, so that the molten solder on the solder cup of the connector in the connector mounting fixture 250 can be pushed into the inside of the solder cup.

[0039] Specifically, refer to Figures 1-5 As shown, the solder strip feeding mechanism 500 includes: The second push linear module 510 is mounted on the mounting plate 610 and is parallel to the first push linear module 410. The desoldering tape transport assembly 520 is disposed at the drive end of the second push linear module 510. The second push linear module 510 is used to drive the desoldering tape transport assembly 520 to approach or move away from the connector mounting fixture 250. The desoldering tape transport assembly 520 is used to extend the desoldering tape.

[0040] In this embodiment, the second push linear module 510 drives the desoldering tape transport assembly 520 to approach or move away from the connector on the connector mounting fixture 250. When desoldering is required, the desoldering tape transport assembly 520 approaches the connector, and the soldering iron welding mechanism 340 approaches the solder cup of the connector to heat the solder on the solder cup. At the same time, the desoldering tape transport assembly 520 extends the desoldering tape to one side of the solder cup, so that the solder and gold melt and adhere to the desoldering tape to complete the desoldering.

[0041] Specifically, refer to Figures 1-5 As shown, the solder strip feeding mechanism 500 also includes: A cutting and recycling component 530 is disposed on the mounting plate 610 and located on one side of the desoldering tape transport component 520, and is used to cut the desoldering tape extending from the desoldering tape transport component 520.

[0042] In this embodiment, the desoldering cup cutting and recycling component 530 cuts and recycles the desoldering strip after it has been desoldered, so as to avoid the desoldering strip remaining on the processing position and affecting the processing.

[0043] Specifically, refer to Figures 1-5 As shown, the cutting and recycling component 530 includes: Telescopic cylinder 531 is mounted on mounting plate 610. A cutting cylinder 532 is located at the drive end of a telescopic cylinder 531. The telescopic cylinder 531 drives the cutting cylinder 532 to enter or leave the space between the desoldering tape transport assembly 520 and the connector mounting fixture 250. The cutting cylinder 532 is used to cut the desoldering tape. A desoldering tape collection box 533 is disposed on the mounting plate 610 and located between the desoldering tape transport assembly 520 and the connector mounting fixture 250, for collecting the cut desoldering tape.

[0044] In this embodiment, after the desoldering tape completes its desoldering action, the telescopic cylinder 531 drives the cutting cylinder 532 to move between the connector mounting fixture 250 and the desoldering tape transport assembly 520. Subsequently, the cutting cylinder 532 cuts the desoldering tape that has been desoldered, and the cut desoldering tape falls into the desoldering tape recycling box 533 for recycling, so as to avoid the desoldering tape remaining on the processing position and affecting the processing.

[0045] The present invention provides a method for using an automatic soldering and gold removal machine for connectors, comprising: Step 1: Manually place the connector onto the connector carrier mechanism 200. The connector carrier mechanism 200 then moves the connector to a position below the soldering mechanism 300. Step 2: The soldering mechanism 300 performs the first soldering of the connector. Step 3: After one side is tinned, the tinning mechanism 300 returns to the first solder cup and works with the tin-removing mechanism 400 to remove solder from the solder cup. Step 4: After the soldering process is complete, the soldering mechanism 300 feeds solder to the solder cups a second time, repeating this cycle until all solder cups on the first side have been fed solder a second time. Step 5: After the second solder feeding, the connector moves to one side of the desoldering tape feeding mechanism 500. The desoldering tape is automatically delivered to one side of the connector, and the soldering mechanism 300 automatically descends to heat and absorb the solder. This process is repeated until all the solder in the first solder cup is completely absorbed. Step 6: Flip the connector over and repeat steps 1 to 5 to tin and remove gold from the second solder cup.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic soldering and gold removal machine for connectors, characterized in that: include: The base (100) and the components disposed on the base (100): Connector support mechanism (200); the connector support mechanism (200) is slidably disposed on the base (100), and the connector support mechanism (200) is used to support a fixed connector; Tinning mechanism (300); the tinning mechanism (300) is disposed on the base (100) and located above the connector carrier mechanism (200), the tinning mechanism (300) is used to tin the connector on the connector carrier mechanism (200); Soldering mechanism (400); the soldering mechanism (400) is disposed on the base (100) and located on one side of the connector carrier mechanism (200), the soldering mechanism (400) is used to push liquid solder into the connector solder cup on the connector carrier mechanism (200); Solder strip feeding mechanism (500); the solder strip feeding mechanism (500) is disposed on the base (100) and located on one side of the connector carrying mechanism (200), the solder strip feeding mechanism (500) is used to transport the solder strip through the connector on the connector carrying mechanism (200).

2. The automatic soldering and gold removal machine for connectors according to claim 1, characterized in that: The connector carrier mechanism (200) includes: A drive linear module (210) is mounted on the base (100). Angle adjustment mechanism (220); one end of the angle adjustment mechanism (220) is connected to the drive linear module (210), and the drive linear module (210) is used to drive the angle adjustment mechanism (220) to move closer to or away from the tinning mechanism (300); Mounting base plate (230); the mounting base plate (230) is disposed at the driving end of the angle adjustment mechanism (220), the angle adjustment mechanism (220) is used to drive the mounting base plate (230) to rotate around its connection with the mounting base plate (230); Mounting post (240); the mounting post (240) is disposed on the mounting base plate (230); A connector mounting fixture (250) is disposed on the mounting post (240) and is used to mount the connector.

3. The automatic soldering and gold removal machine for connectors according to claim 2, characterized in that: The connector carrier mechanism (200) further includes: Connector flipping mechanism (260); The connector flipping mechanism (260) is disposed on the mounting post (240), and the driving end of the connector flipping mechanism (260) is connected to the connector mounting fixture (250). The connector flipping mechanism (260) is used to drive the connector mounting fixture (250) to flip.

4. The automatic soldering and gold removal machine for connectors according to claim 2, characterized in that: The tinning mechanism (300) includes: Gantry (310); the gantry (310) is mounted on the base (100); Tinned X-axis linear module (320); the tinned X-axis linear module (320) is mounted on the crossbeam of the gantry (310), and the tinned X-axis linear module (320) is perpendicular to the drive linear module (210); Tinned Z-axis linear module (330); the tinned Z-axis linear module (330) is disposed at the drive end of the tinned X-axis linear module (320); Soldering iron welding mechanism (340); the soldering iron welding mechanism (340) is disposed at the drive end of the tinned Z-axis linear module (330), and the tinned Z-axis linear module (330) is used to drive the soldering iron welding mechanism (340) to rise or fall; Automatic solder dispensing mechanism (350); the automatic solder dispensing mechanism (350) is disposed on the gantry frame (310), and the automatic solder dispensing mechanism (350) is used to extend the solder wire to the soldering iron welding mechanism (340).

5. The automatic soldering and gold removal machine for connectors according to claim 2, characterized in that: Also includes: Replace the linear module (600); the replacement linear module (600) is disposed on the mounting base plate (230), and the replacement linear module (600) is parallel to the driving linear module (210); Mounting plate (610); the mounting plate (610) is disposed at the drive end of the replaceable linear module (600), the solder shoveling mechanism (400) and the solder strip feeding and suction mechanism (500) are disposed on the mounting plate (610), and the replaceable linear module (600) is used to drive the mounting plate (610) to move linearly so that the solder shoveling mechanism (400) or the solder strip feeding and suction mechanism (500) is located on one side of the connector mounting fixture (250).

6. The automatic soldering and gold removal machine for connectors according to claim 5, characterized in that: The solder tapping mechanism (400) includes: First push linear module (410); the first push linear module (410) is disposed on the mounting plate (610); A needle (420); the needle (420) is disposed at the driving end of the first push linear module (410), the first push linear module (410) is used to drive the needle (420) to move closer to or away from the connector mounting fixture (250).

7. The automatic soldering and gold removal machine for connectors according to claim 6, characterized in that: The solder strip feeding mechanism (500) includes: The second push linear module (510) is disposed on the mounting plate (610) and is parallel to the first push linear module (410). Desoldering tape transport assembly (520); the desoldering tape transport assembly (520) is disposed at the drive end of the second push linear module (510), the second push linear module (510) is used to drive the desoldering tape transport assembly (520) to approach or move away from the connector mounting fixture (250), and the desoldering tape transport assembly (520) is used to extend the desoldering tape.

8. The automatic soldering and gold removal machine for connectors according to claim 7, characterized in that: The solder strip feeding mechanism (500) also includes: Cutting and recycling component (530); The cutting and recycling component (530) is disposed on the mounting plate (610) and located on one side of the desoldering tape transport component (520), and is used to cut the desoldering tape extending from the desoldering tape transport component (520).

9. An automatic soldering and gold removal machine for connectors according to claim 8, characterized in that: The cutting and recycling assembly (530) includes: Telescopic cylinder (531); the telescopic cylinder (531) is mounted on the mounting plate (610); Cutting cylinder (532); The cutting cylinder (532) is disposed at the drive end of the telescopic cylinder (531), the telescopic cylinder (531) is used to drive the cutting cylinder (532) to enter or leave between the desoldering tape transport assembly (520) and the connector mounting fixture (250), and the cutting cylinder (532) is used to cut the desoldering tape; Solder strip collection box (533); the solder strip collection box (533) is disposed on the mounting plate (610) and located between the solder strip transport assembly (520) and the connector mounting fixture (250) for collecting cut solder strip.

10. A method of using an automatic soldering and gold removal machine for connectors, used in any one of claims 1 to 9, characterized in that: include: Step 1: Manually place the connector on the connector carrier mechanism (200), and the connector carrier mechanism (200) moves the connector to below the tinning mechanism (300); Step 2: The tinning mechanism (300) performs the first soldering of the connector; Step 3: After one side is tinned, the tinning mechanism (300) returns to the first solder cup and works with the tin-removing mechanism (400) to remove tin from the solder cup; Step 4: After the soldering is completed, the soldering mechanism (300) feeds solder to the solder cup a second time, and repeats this process until all solder cups on the first side are fed solder a second time. Step 5: After the second solder delivery, the connector moves to one side of the solder suction tape mechanism (500), and the solder suction tape is automatically delivered to one side of the connector. The soldering mechanism (300) automatically comes down to heat and suction the solder, and the solder cup on the first side is circulated and the solder cup is completely suctioned out. Step 6: Flip the connector over and repeat steps 1 to 5 to tin and remove gold from the second solder cup.

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