A physical vapor deposition apparatus, an automatic shielding ring replacement mechanism, and a method thereof.

Abstract

This invention provides a physical vapor deposition (PVD) apparatus, an automatic shielding ring replacement mechanism, and a method thereof. The automatic shielding ring replacement mechanism includes a guide pin mounting ring, a base plate, a lifting assembly, a guiding structure, an auxiliary separation assembly, and an edge ring. The guide pin mounting ring is fitted around the outer periphery of the cover ring, and a shielding ring support on it carries the protective shielding ring. The base plate supports the cover ring and the guide pin mounting ring. The lifting assembly drives the base plate to rise and fall. The guiding structure is located on the guide pin mounting ring and cooperates with the base plate to provide radial positioning. The auxiliary separation assembly separates the protective shielding ring from the cover ring when the base plate descends to a preset position. The edge ring and the supporting base receive the wafer and have a deep groove located below the wafer edge. This solution enables automatic separation of the ring components, has a compact and reliable structure, and completes the replacement process entirely under vacuum, significantly improving equipment uptime and ensuring ring alignment accuracy and process consistency.

Description

Technical Field

[0001] This invention relates to the technical field of physical vapor deposition equipment, and in particular to a physical vapor deposition equipment, an automatic shielding ring replacement mechanism, and a method thereof. Background Technology

[0002] Physical vapor deposition (PVD) is a critical process in semiconductor manufacturing used to deposit thin films of metals (such as titanium, copper, and aluminum) on wafer surfaces. During deposition, undesirable deposits at wafer edges and the back side can lead to particle contamination, arcing, and compatibility issues with subsequent photolithography and etching processes. To address these issues, a multi-layered shielding ring assembly, including cover rings, protective shielding rings, and edge rings, is typically arranged within the PVD chamber to protect the wafer edges and internal components from deposit contamination.

[0003] However, as the deposition process continues, a thick film gradually accumulates on the surface of these shielding rings, requiring periodic cleaning or replacement. Currently, the industry commonly uses a manual cavity-opening replacement method: the equipment is shut down, the vacuum is broken, the cavity is opened, the old ring is manually removed and a new ring is installed, then the vacuum is re-evacuated and the process parameters are adjusted. This replacement method takes several hours each time, resulting in a significant decrease in equipment uptime (usually more than 30%). Furthermore, repeated cavity openings disrupt the clean environment of the cavity, increasing the risk of particulate contamination and affecting process consistency and yield.

[0004] For a long time, achieving automatic separation and replacement of the protective shielding rings without disrupting the vacuum environment, due to the tight fit and nesting of multiple rings within the PVD cavity, has been a difficult technical challenge in this field. It is generally believed in the industry that replacing the protective shielding rings requires manual cavity opening.

[0005] Therefore, there is an urgent need for a mechanism and method that can quickly and automatically replace protective shielding rings without breaking the vacuum or requiring manual intervention, in order to improve equipment uptime, reduce maintenance costs and ensure process consistency. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the defects in the prior art, thereby providing a physical vapor deposition device, an automatic shielding ring replacement mechanism and method thereof.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: An automatic shielding ring replacement mechanism is used in a physical vapor deposition (PVD) apparatus, the PVD apparatus including a cavity, a shielding ring disposed in the cavity, and a support base for supporting a wafer; The automatic shielding ring replacement mechanism includes: A guide pin mounting ring is sleeved on the outer periphery of the cover ring, and a shielding ring support is fixed on the guide pin mounting ring. The shielding ring support is used to support the protective shielding ring located on the upper surface of the cover ring. A base guard plate, which supports the cover ring and the guide pin mounting ring; A lifting assembly is fixedly connected to the base guard plate and is used to drive the base guard plate to lift. A guide structure is provided on the guide pin mounting ring, and the base guard plate cooperates with the guide structure to provide radial positioning for the guide pin mounting ring; An auxiliary separation component is disposed within the cavity. When the lifting component lowers the base guard plate to a preset position, the auxiliary separation component is used to separate the protective shielding ring from the covering ring. An edge ring is located above the support base. The edge ring and the support base together support the wafer. The edge ring has a deep groove located below the outer peripheral edge of the supported wafer.

[0008] In the above scheme, when the protective shielding ring needs to be replaced, the lifting assembly drives the base plate to descend, and the base plate, along with the supporting cover ring and guide pin mounting ring, descend together. During the continuous descent, when the protective shielding ring reaches the exchange position flush with the middle of the valve opening of the cavity, the axial position of the base plate within the cavity is the preset position. At this time, the auxiliary separation assembly acts on the guide pin mounting ring, restricting the guide pin mounting ring and the protective shielding ring it carries from continuing to descend with the base plate, keeping the protective shielding ring at the valve opening. The base plate continues to descend under the drive of the lifting assembly, driving the cover ring downwards as well, thereby creating relative movement with the stationary protective shielding ring and achieving separation of the protective shielding ring and the cover ring. During the lifting process, the guide structure on the guide pin mounting ring cooperates with the base plate to provide radial positioning for the guide pin mounting ring, preventing radial displacement of the protective shielding ring. After separation, the robot arm can extend horizontally into the cavity to retrieve and place the protective shielding ring from the valve opening. After replacement, the lifting assembly drives the base guard plate to rise and reset, re-lifting the guide pin mounting ring and protective shielding ring back to the process position. The edge ring and the support base jointly support the wafer. The deep groove in the edge ring is located below the outer peripheral edge of the wafer, accommodating deposits that cross the wafer edge during the deposition process and preventing the formation of conductive paths on the outer periphery of the wafer that could trigger arc discharge.

[0009] Furthermore, by continuously lowering the lifting assembly, a two-stage action can be achieved: the protective shielding ring first reaches the valve opening, and then separates from the continuing-lowering covering ring. The separation logic of this scheme is based on relative motion: the auxiliary separation assembly stops the protective shielding ring at a preset position, keeping it at a suitable position for the robot to pick up and place it at the valve opening, while the covering ring continues to descend with the base guard plate, naturally forming a separation gap. The entire mechanism requires only one drive source—the lifting assembly—with reliable timing and no need for additional lifting mechanisms. The protective shielding ring remains stationary at the valve opening during separation, maintaining a stable position, facilitating precise picking and placing by the robot, and avoiding the risk of failure to pick up the ring due to inertial displacement during movement.

[0010] Preferably, the guide structure includes a guide pin, which is fixedly disposed on the guide pin mounting ring and extends axially along the protective shielding ring toward the base guard plate; The base guard plate has a through hole, and the guide pin is inserted into the through hole.

[0011] In the above scheme, the guide pin is fixedly mounted on the guide pin mounting ring and extends downward along the axial direction of the protective shield ring towards the base guard plate. A first through hole is formed on the base guard plate, corresponding to the position of the guide pin, which is inserted into the first through hole. When the lifting assembly drives the base guard plate to rise or fall, the guide pin slides axially within the first through hole. Through the cooperation between the guide pin and the first through hole, the base guard plate provides radial positioning for the guide pin mounting ring, preventing radial displacement or circumferential deflection of the guide pin mounting ring and the protective shield ring it supports during the lifting process.

[0012] Furthermore, the insertion of the guide pin into the first through hole on the base guard plate allows the base guard plate to serve as both a lifting and supporting component and a radial positioning reference for the guide pin mounting ring. A single component achieves both load-bearing and positioning functions, simplifying the internal structure of the cavity. The axial sliding fit of the guide pin within the first through hole continuously provides radial constraint throughout the entire lifting stroke. Especially during the phase where the protective shielding ring is stopped at the valve opening while the base guard plate continues to descend, the guiding action of the guide pin ensures that the protective shielding ring maintains precise alignment even when stationary, providing the robot with a stable picking and placing posture.

[0013] Preferably, the automatic replacement mechanism for the shielding ring further includes a protective base cover, which is fixed above the base guard plate and supports the covering ring, and the protective base cover has a second through hole; The auxiliary separation component includes a top pin, which is fixedly disposed in the cavity and located below the second through hole. When the lifting component drives the base guard plate to descend, the top pin passes through the second through hole of the protective bottom cover and abuts against the bottom of the guide pin mounting ring, so that the guide pin mounting ring moves away from the protective bottom cover.

[0014] In the above scheme, the protective base cover is fixed above the base guard plate and supports the cover ring. A second through hole is provided on the protective base cover. The auxiliary separation component is specifically a top pin, which is fixedly installed inside the cavity and located directly below the second through hole. When the lifting component drives the base guard plate to descend, and the protective shield ring reaches the valve port exchange position (i.e., when the base guard plate reaches the preset position), the top tip of the top pin just passes through the second through hole of the protective base cover and abuts against the bottom of the guide pin mounting ring, thereby restricting the guide pin mounting ring from continuing to descend with the base guard plate and the protective base cover. Afterward, the base guard plate and the protective base cover continue to descend, and the guide pin mounting ring is stopped by the top pin, thus creating a separation gap with the continuing descending protective base cover.

[0015] Furthermore, the top pin is fixedly installed within the cavity, requiring no additional drive mechanism. It automatically extends and stops the guide pin mounting ring at a preset position simply through the descent of the base plate and protective cover. The top pin's fixed installation method is simple in structure, highly reliable, and eliminates the risk of jamming or failure of moving parts. The second through hole provides a passage for the top pin. In the process position, the top tip of the top pin is located below the second through hole, not contacting the guide pin mounting ring, and does not affect the component positional relationship in the process state. Only when the protective shielding ring descends to the preset position of the valve port does the top pin contact the guide pin mounting ring and perform its stopping function, ensuring reliable switching between process and replacement states.

[0016] Preferably, both the protective bottom cover and the covering ring have L-shaped cross-sections. The L-shaped cross-section of the protective bottom cover has a first horizontal side and a first vertical side, and the L-shaped cross-section of the covering ring has a second horizontal side and a second vertical side. The first vertical edge of the protective base abuts against the second horizontal surface of the cover ring on the side facing the protective base, in order to support the cover ring.

[0017] In the above scheme, the first vertical edge of the L-shaped cross-section of the protective base abuts against the second horizontal edge of the L-shaped cross-section of the covering ring on the side facing the protective base. That is, the second horizontal edge of the covering ring overlaps the top or inner side of the first vertical edge of the protective base. This abutment method allows the protective base to not only support the covering ring through the first horizontal edge, but also achieve radial and axial matching and limiting through the first vertical edge and the second horizontal edge of the covering ring.

[0018] Furthermore, the L-shaped cross-section with vertical edge contact, compared to simple planar stacking, can simultaneously restrict the displacement of the cover ring relative to the protective base in both radial and axial directions, enhancing the overall rigidity and stability of the stacked support structure. During the descent of the base plate and protective base and their separation from the stationary guide pin mounting ring, the cover ring descends smoothly along with the protective base, preventing collisions or scratches with the stationary protective shielding ring due to radial swaying, ensuring a smooth and reliable separation. Upon resetting, the cover ring accurately returns to its mating position with the protective base, requiring no manual calibration.

[0019] Preferably, the inner wall of the cavity is further provided with an internal shielding component, which is located above the protective bottom cover; Located at the process position, the protective bottom cover and the cavity shielding component are close to each other to form cavity protection during the sputtering process; When the lifting assembly lowers the base guard plate, the protective bottom cover also lowers along with the base guard plate, separating from the cavity shielding component, so that an operation channel for picking up and placing the protective shielding ring is formed between the protective bottom cover and the cavity shielding component.

[0020] In the above scheme, a fixed internal shielding component is provided on the inner wall of the cavity, located above the protective base cover. During the process position, the protective base cover and the internal shielding component are close to each other, together forming a protective barrier on the inner wall of the cavity to prevent splash deposits from contaminating the inner wall. When the protective shielding ring needs to be replaced, the lifting assembly lowers the base plate, and the protective base cover descends along with the base plate, creating a separation gap between it and the internal shielding component. This forms an operating channel above the protective base cover and below the internal shielding component, allowing a robotic arm to reach in.

[0021] It should be understood that this design gives the descent of the protective base a dual function: first, it provides a descent stroke for the top pin to pass through and stop the guide pin mounting ring; second, it separates from the internal shielding component to form an operating channel. A single action simultaneously achieves the two purposes of "stopping the separation ring" and "creating operating space," without requiring additional actions or drive components. The formation of the operating channel provides an unobstructed spatial path for the robotic arm to reach into the valve port to pick up and place the protective shielding ring, avoiding interference between the robotic arm and the internal shielding component or the protective base, thus ensuring the safe and smooth operation of the automatic pick-up and place.

[0022] Preferably, the covering ring has multiple slots evenly distributed along the circumference, and the number of shielding ring supports corresponds to the number of slots; The top of the shielding ring support is provided with a positioning surface, and the lower surface of the protective shielding ring is provided with a mating surface that is adapted to the positioning surface, so as to position the protective shielding ring when it is placed. Located at the process position, the shielding ring support is embedded in the corresponding slot, and the top surface of the shielding ring support is lower than or flush with the upper surface of the cover ring, so that the lower surface of the protective shielding ring is in contact with the upper surface of the cover ring. When the position is changed, the shielding ring support retracts from the slot and raises the protective shielding ring.

[0023] In the above scheme, the slots on the cover ring correspond in number and position to the shielding ring supports. In the process position, the shielding ring supports are embedded in the slots, with their top surfaces lower than or flush with the upper surface of the cover ring. This allows the lower surface of the protective shielding ring, supported by the shielding ring supports, to fit tightly against the upper surface of the cover ring, ensuring effective edge shielding. When changing positions, the shielding ring supports and the protective shielding ring are stopped at the valve opening by a top pin and withdrawn from the slots of the cover ring. The cover ring continues to descend with the base plate and protective cover, thus separating the protective shielding ring from the cover ring. The top of the shielding ring support has a positioning surface, and the lower surface of the protective shielding ring has a matching mating surface. When the robotic arm places a new protective shielding ring, the positioning surface and the mating surface automatically align and engage, achieving automatic positioning of the protective shielding ring during placement.

[0024] Furthermore, the embedded fit between the shielding ring support and the slot enables a dual-state switching between process fit and replacement separation. During process, the support is embedded in the slot, and the protective shielding ring and the cover ring fit tightly together, ensuring the deposition shielding effect. During replacement, the support and the protective shielding ring are stopped at the valve opening, and the cover ring continues to descend with the base guard plate, reliably separating the protective shielding ring and the cover ring. The automatic centering function of the positioning surface and the mating surface allows the robot arm to automatically slide into the correct position without precise alignment when placing a new protective shielding ring, reducing the positioning accuracy requirements of the robot arm and preventing radial slippage or detachment of the protective shielding ring due to placement deviation during subsequent lifting and lowering processes.

[0025] Preferably, the deep groove extends continuously along the circumference of the edge ring to form an annular groove, the cross-section of the deep groove is rectangular, trapezoidal or V-shaped, and the inner surface of the edge ring is flush with the bearing surface of the bearing base.

[0026] In the above scheme, the deep groove of the edge ring extends continuously along its circumference to form a complete annular groove. The cross-sectional shape of the deep groove can be rectangular, trapezoidal, or V-shaped to adapt to the deposition containment requirements of different process conditions. The inner surface of the edge ring is flush with the bearing surface of the support platform, and the two together constitute a coplanar support surface for supporting the wafer, with the edge of the wafer suspended above the deep groove.

[0027] Furthermore, the continuously extending annular grooves ensure that the entire outer periphery of the wafer is covered by deep grooves, preventing the formation of conductive paths by deposits on the wafer's outer periphery without any blind spots, thus comprehensively suppressing arc discharge. The inner surface of the edge ring is flush with the bearing surface of the support abutment, ensuring horizontal support of the wafer on the bearing surface and preventing warping or stress concentration caused by the height difference between the edge ring and the support abutment, which is beneficial to improving deposition uniformity. The optional design of the deep groove cross-sectional shape allows the edge ring to adapt to the deposition distribution characteristics of different processes, enhancing the process adaptability of the mechanism.

[0028] Preferably, the outer edge of the protective shielding ring curves upward toward the center of the ring to form a ring-shaped shielding eave; The cover ring is located above the edge ring, and there is an assembly gap between the lower surface of the cover ring and the upper surface of the edge ring; Located in the process position, the annular obstruction completely covers the assembly gap between the covering ring and the edge ring, as well as the deep groove of the edge ring.

[0029] In the above scheme, the outer edge of the protective shielding ring curves inward to form an annular shielding eave. The cover ring is located above the edge ring, and there is an assembly gap between the two. In the process position, the annular shielding eave extends downward, completely covering the three areas from above: the groove of the inner ring of the cover ring, the assembly gap between the cover ring and the edge ring, and the deep groove of the edge ring.

[0030] It should be understood that the outer edge of the protective shielding ring curves inward towards the center, forming a continuous annular shielding eave. The cover ring is located above the edge ring; the two are independent components stacked one on top of the other, with a necessary assembly gap between the lower surface of the cover ring and the upper surface of the edge ring. In the process position, the annular shielding eave extends to completely cover and shield the assembly gap between the cover ring and the edge ring, as well as the deep groove of the edge ring. This annular shielding eave, as a passive protection structure, requires no additional drive or control; it effectively blocks deposits from sputtering to the wafer edge and back side solely through the geometry of the protective shielding ring itself. Simultaneously, the deep groove in the edge ring prevents direct contact between the wafer edge and the edge ring, preventing edge arcing during the sputtering process. Working in conjunction with the annular shielding eave, they jointly ensure the wafer's process quality.

[0031] An automatic replacement method for a shielding ring, applied to the aforementioned automatic replacement mechanism for a shielding ring, the automatic replacement method comprising: The lifting assembly drives the base guard plate to descend, while the base drive mechanism, independent of the lifting assembly, drives the supporting base to descend synchronously with the base guard plate. The lifting assembly continues to drive the base guard plate to descend, and the auxiliary separation assembly restricts the guide pin mounting ring from descending further, so that the guide pin mounting ring drives the shielding ring support and the protective shielding ring to rise relative to the base guard plate. The guide structure provides radial positioning for the guide pin mounting ring until the protective shielding ring separates from the cover ring and reaches the predetermined exchange position. When the protective shielding ring is raised to be level with the middle position of the valve port of the cavity, and the central axis of the protective shielding ring is coplanar with the central axis of the valve port, a robot arm extends horizontally into the cavity to remove the old protective shielding ring and insert the new protective shielding ring; The lifting assembly drives the base guard plate to rise, and the guide pin mounting ring and the protective shielding ring return to the process position together. At the same time, the base driving mechanism drives the bearing base and the base guard plate to rise synchronously and reset to the process height.

[0032] A physical vapor deposition apparatus includes a cavity, a cover ring disposed within the cavity, a support platform for supporting a wafer, and a protective shielding ring located above the cover ring. The physical vapor deposition apparatus also includes the aforementioned automatic shielding ring replacement mechanism, which is used to replace the protective shielding ring.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention achieves simultaneous descent of the cover ring and lifting and separation of the protective shielding ring by driving the base guard plate downwards using only a lifting assembly. When the protective shielding ring reaches the valve port exchange position, the auxiliary separation assembly stops it there, and the cover ring continues to descend with the base guard plate, automatically separating the two through relative motion. The entire separation process requires only one drive source, eliminating the need for a separate lifting mechanism for the protective shielding ring; the structure is compact, and the action sequence is simple and reliable.

[0034] 2. The entire replacement process is completed while the cavity is under vacuum or inert atmosphere, eliminating the need for machine shutdown to break the vacuum and manual cavity opening. The replacement time per cycle is reduced from several hours in existing technologies to several minutes. This also avoids the risk of damage to the cavity's clean environment and particulate contamination caused by repeated cavity opening, reduces manual operation costs and the risk of human error, and extends the cavity cleaning cycle and maintenance interval.

[0035] 3. The guide structure, located on the guide pin mounting ring, works with the base guard plate throughout the lifting stroke to provide radial positioning and prevent radial displacement of the protective shielding ring. After reaching the valve port exchange position, the protective shielding ring is stopped and held stationary, providing a stable position and a precise pick-and-place reference for the robotic arm. The alignment accuracy of each installed protective shielding ring is consistent, avoiding edge deposition defects and arc discharge phenomena caused by human installation errors. The deep groove anti-arc structure of the edge ring works in conjunction with the annular shielding eaves of the protective shielding ring to prevent deposits from entering the ring gaps, ensuring consistent edge protection before and after replacement, and improving wafer yield and process repeatability. Attached Figure Description

[0036] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the overall structure of the physical vapor deposition equipment provided by the present invention.

[0038] Figure 2 This is a schematic diagram of the protective shielding ring stacked structure provided by the present invention.

[0039] Figure 3 This is a partial cross-sectional view of the protective shielding ring located at the process position, as provided by the present invention.

[0040] Figure 4 This is a partial cross-sectional view of the protective shielding ring when the position is changed, provided by the present invention.

[0041] Explanation of reference numerals in the attached figures: 1. Base plate; 2. Protective bottom cover; 3. Cover ring; 4. Guide pin mounting ring; 5. Protective shielding ring; 6. Shielding ring support; 7. Guide structure; 8. Edge ring; 9. Bearing base; 10. Lifting assembly; 11. Auxiliary separation assembly; 12. Lifting device; 13. Wafer; 14. Cavity; 15. Cavity shielding component. Detailed Implementation

[0042] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] See Figures 1 to 4 This invention provides an automatic shielding ring replacement mechanism for physical vapor deposition equipment. The automatic shielding ring replacement mechanism includes a guide pin mounting ring 4, a base guard plate 1, a lifting assembly 10, a guide structure 7, an auxiliary separation assembly 11, and an edge ring 8. The guide pin mounting ring 4 is sleeved on the outer periphery of the cover ring 3. A shielding ring support 6 is fixed on the guide pin mounting ring 4, which supports the protective shielding ring 5 located on the upper surface of the cover ring. The base guard plate 1 supports the cover ring 3 and the guide pin mounting ring 4. The lifting assembly 10 is fixed to the base guard plate 1. The connection is used to drive the base guard plate 1 to rise and fall. The guide structure 7 is located on the guide pin mounting ring 4. The base guard plate 1 cooperates with the guide structure to provide radial positioning for the guide pin mounting ring 4. The auxiliary separation component 11 is located in the cavity 14. When the lifting component 10 drives the base guard plate 1 to fall to the preset position, the auxiliary separation component is used to protect the shielding ring 5 from separating from the cover ring 3. The edge ring 8 is located above the support base 9. The edge ring 8 and the support base 9 jointly support the wafer 13. The edge ring 8 has a deep groove located below the outer peripheral edge of the supported wafer 13.

[0046] Specifically, the physical vapor deposition equipment includes a cavity 14, a cover ring 3 disposed within the cavity 14, and a support platform 9 for supporting the wafer 13. The automatic cover ring replacement mechanism includes a guide pin mounting ring 4, a base guard plate 1, a lifting assembly 10, a guide structure 7, an auxiliary separation assembly 11, and an edge ring 8.

[0047] The guide pin mounting ring 4 is an annular component, fitted around the outer circumference of the cover ring 3, and arranged concentrically with the cover ring 3. A shielding ring support 6 is fixed to the guide pin mounting ring 4, which supports the protective shielding ring 5, ensuring that the protective shielding ring 5 is located on the upper surface of the cover ring 3. In the process position, the lower surface of the protective shielding ring 5 is in contact with the upper surface of the cover ring 3, providing shielding protection for the cover ring 3 and its underlying edge ring 8.

[0048] The base guard plate 1 is located below the cover ring 3 and supports the cover ring 3 and the guide pin mounting ring 4. The base guard plate 1 indirectly supports the cover ring 3 through the protective bottom cover provided above it, and the base guard plate 1 is fixedly connected to the protective bottom cover. In the process position, the base guard plate 1 supports all the ring components above it.

[0049] The lifting assembly 10 is fixedly connected to the base guard plate 1 and is used to drive the base guard plate 1 to rise and fall along the axial direction of the cavity 14. The lifting assembly 10 includes multiple lifting columns evenly distributed circumferentially. The upper end of each lifting column is fixedly connected to the base guard plate 1 by bolts, and the lower end is driven by the lifting device. The lifting device drives each lifting column to rise and fall synchronously, thereby driving the base guard plate 1 and its supported components to rise and fall smoothly together.

[0050] The guide structure 7 is mounted on the guide pin mounting ring 4, and the base guard plate 1 cooperates with the guide structure 7 to provide radial positioning for the guide pin mounting ring 4. Specifically, the guide structure 7 is a guide pin, which is fixed to the guide pin mounting ring 4 and extends axially toward the base guard plate 1. A corresponding through hole is provided on the base guard plate 1, and the guide pin is inserted into the through hole. During lifting and lowering, the guide pin slides axially within the through hole. The radial constraint of the guide pin by the through hole achieves radial positioning of the guide pin mounting ring 4 and the protective shielding ring 5, preventing radial displacement during lifting and lowering.

[0051] An auxiliary separation component 11 is disposed within the cavity 14 to separate the protective shielding ring 5 from the covering ring 3 when the base guard plate 1 descends to a preset position. Specifically, the auxiliary separation component 11 is a top pin fixed to the bottom of the cavity 14, the position of which corresponds to the bottom of the guide pin mounting ring 4. When the lifting component 10 lowers the base guard plate 1 to the preset position, the top of the top pin abuts against the bottom of the guide pin mounting ring 4, restricting the guide pin mounting ring 4 and the protective shielding ring 5 from continuing to descend with the base guard plate 1. At this time, the protective shielding ring 5 is located at the valve opening of the cavity 14. The base guard plate 1 continues to descend under the drive of the lifting component 10, causing the covering ring 3 to descend, thereby generating relative movement with the stationary protective shielding ring 5, achieving automatic separation of the protective shielding ring 5 from the covering ring 3. The protective shielding ring 5 remains at the valve opening as a predetermined exchange position for the robotic arm to pick up and place.

[0052] An edge ring 8 is located above the support base 9, and its inner surface is flush with the support surface of the support base 9, both supporting the wafer 13. A deep groove is formed around the inner periphery of the edge ring 8, located below the outer edge of the supported wafer 13. During deposition, deposits that cross the wafer edge fall into the deep groove, preventing the formation of a conductive path on the outer periphery of the wafer and thus avoiding arc discharge.

[0053] When the protective shielding ring 5 needs to be replaced, the lifting assembly 10 drives the base guard plate 1 to descend, and the base guard plate 1 drives the cover ring 3 and the guide pin mounting ring 4 to descend together. When the protective shielding ring 5 descends to be flush with the middle position of the valve port of the cavity 14, the base guard plate 1 reaches the preset position, and the top pin abuts against the bottom of the guide pin mounting ring 4 and restricts its further descent. The base guard plate 1 continues to descend, causing the cover ring 3 to separate from the stationary protective shielding ring 5. The robot arm extends into the cavity 14 from the valve port, removes the old protective shielding ring 5, and inserts the new protective shielding ring 5. After the replacement is completed, the lifting assembly 10 drives the base guard plate 1 to rise, and the base guard plate 1 lifts the guide pin mounting ring 4 and the protective shielding ring 5 again, returning to the process position together with the cover ring 3, completing one automatic replacement process.

[0054] The aforementioned automatic shielding ring replacement mechanism effectively achieves the automatic separation and exchange of the protective shielding ring. When the protective shielding ring needs to be replaced, the lifting assembly drives the base guard plate to descend, and the protective shielding ring and cover ring descend together. When the protective shielding ring reaches the exchange position at the valve port, the auxiliary separation assembly abuts against the bottom of the guide pin mounting ring, stopping the protective shielding ring at the valve port. The base guard plate continues to descend under the drive of the lifting assembly, driving the cover ring downward, creating relative movement with the protective shielding ring stationary at the valve port, causing the two to automatically separate. After separation, the protective shielding ring remains stably at the valve port, with its central axis coplanar with the valve port axis, facilitating precise retrieval by a robotic arm extending horizontally into the cavity. The entire separation process can be completed by a single descent action of the lifting assembly, eliminating the need for a separate lifting mechanism for the protective shielding ring, resulting in a compact structure and reliable operation. The entire replacement process is completed under vacuum or inert atmosphere conditions within the cavity, eliminating the need for vacuum breaking or manual opening of the cavity, significantly reducing the replacement time per cycle and significantly improving equipment uptime. The guide structure provides radial positioning for the guide pin mounting ring throughout the entire lifting stroke, ensuring that the protective shielding ring remains precisely aligned during lifting and static separation. This avoids the risk of pick-up and drop failures caused by ring misalignment and ensures consistent installation process each time.

[0055] The automatic shielding ring replacement mechanism provided by the present invention will be described in more detail below with reference to the accompanying drawings and specific embodiments.

[0056] In one specific implementation, please refer to Figure 1 and Figure 2The guide structure 7 includes a guide pin, which is fixedly mounted on the guide pin mounting ring 4. The guide pin extends axially along the protective shielding ring 5 toward the base guard plate 1. A first through hole is provided on the base guard plate 1, and the guide pin is inserted into the first through hole.

[0057] Specifically, there are two guide pins, symmetrically arranged on the guide pin mounting ring 4. The upper end of the guide pin is fixed to the lower surface of the guide pin mounting ring 4 by threaded connection or welding, and the lower end extends downward along the axial direction of the protective shielding ring 5. The base guard plate 1 is an annular plate component with two first through holes corresponding to the positions of the guide pins. During assembly, the lower end of the guide pin is inserted into the first through hole, and the outer circumferential surface of the guide pin and the hole wall of the first through hole are in clearance fit or sliding fit. When the lifting assembly 10 drives the base guard plate 1 to rise or fall, the guide pin slides freely along the axial direction in the first through hole, and the hole wall of the first through hole applies radial constraint to the guide pin, thereby providing radial positioning for the guide pin mounting ring 4 and the protective shielding ring 5 supported on it, preventing radial offset or circumferential deflection during the lifting process. When the guide pin mounting ring 4 is stopped at the valve port by the auxiliary separation component 11 and the base guard plate 1 continues to descend, the guide pin gradually slides upward from the first through hole. The first through hole continues to provide radial positioning for the guide pin, ensuring that the protective shielding ring 5 remains precisely aligned even when stationary. Alternatively, the number of guide pins can be three or four, evenly distributed along the circumference of the guide pin mounting ring 4, to further improve the stability of radial positioning. The lower end of the guide pin can also be provided with a tapered or rounded inlet, so that when the base guard plate 1 rises and resets and the guide pin is reinserted into the first through hole, the inlet guides the pin to ensure smooth insertion and avoid insertion jamming due to slight deviations.

[0058] In one specific implementation, please refer to Figure 1 and Figure 2 The automatic replacement mechanism for the shielding ring also includes a protective base cover 2, which is fixed above the base guard plate 1 and supports the cover ring 3. The protective base cover 2 has a second through hole. The auxiliary separation component 11 includes a top pin, which is fixedly installed in the cavity 14 and located below the second through hole. When the lifting component 10 drives the base guard plate 1 to descend, the top pin passes through the second through hole of the protective base cover 2 and abuts against the bottom of the guide pin mounting ring 4, so that the guide pin mounting ring 4 is away from the protective base cover 2.

[0059] Specifically, the protective base cover 2 is an annular cover, fixed to the upper surface of the base guard plate 1 by bolts. The upper end face of the protective base cover 2 supports the cover ring 3, keeping the cover ring 3 stable in the process position. A second through hole is provided through the protective base cover 2, the position and number of which correspond to the top pin. The top pin is fixedly set on the bottom surface of the cavity 14, the axis of the top pin extends along the axial direction of the cavity 14, and the top tip of the top pin is located below the second through hole in the process position, maintaining a certain distance from the lower surface of the protective base cover 2, and does not contact the guide pin mounting ring 4. When the lifting assembly 10 drives the base guard plate 1 to descend, the protective base cover 2 descends together with the base guard plate 1, and the second through hole gradually approaches the top tip of the top pin. When the protective shielding ring 5 descends to the valve port exchange position, the top tip of the top pin just passes through the second through hole and abuts against the bottom of the guide pin mounting ring 4, restricting the guide pin mounting ring 4 and the protective shielding ring 5 from further descent. Subsequently, the base guard plate 1 and the protective bottom cover 2 continue to descend. The top of the top pin supports the guide pin mounting ring 4, creating a separation gap between the guide pin mounting ring 4 and the continuing downward-moving protective bottom cover 2, thereby achieving the separation of the protective shielding ring 5 and the covering ring 3. The top pin achieves the stop separation through its own fixed height, requiring no additional drive, resulting in a simple and reliable structure. As an alternative method, the driving method of the top pin is not limited to passive contact; it can also use an independently driven ejector pin or a miniature cylinder. When the base guard plate 1 descends to the preset position, the controller triggers the cylinder to actively push the top pin upward, thereby more precisely controlling the stopping timing and lifting height. The number of top pins can also be set to multiple according to the cavity size and the size of the guide pin mounting ring 4 to ensure a uniform distribution of the stopping force.

[0060] In one specific implementation, please refer to Figure 1 and Figure 2 Both the protective base cover 2 and the covering ring 3 have L-shaped cross sections. The L-shaped cross section of the protective base cover 2 has a first horizontal side and a first vertical side. The L-shaped cross section of the covering ring 3 has a second horizontal side and a second vertical side. The first vertical side of the protective base cover 2 abuts against the side of the second horizontal surface of the covering ring 3 facing the protective base cover 2 to support the covering ring 3.

[0061] Specifically, in the L-shaped cross-section of the protective base cover 2, the first horizontal edge extends radially inward along the cavity 14 for connection and fixation with the base guard plate 1; the first vertical edge extends axially upward along the cavity 14 and is located on the side of the protective base cover 2 near the center of the cavity 14. In the L-shaped cross-section of the cover ring 3, the second horizontal edge extends radially outward along the cavity 14, and the second vertical edge extends axially downward along the cavity 14. During assembly, the cover ring 3 is stacked on top of the protective base cover 2, with the lower surface of the second horizontal edge facing the protective base cover 2, and the top or inner side of the first vertical edge of the protective base cover 2 abuts against the lower surface or side of the second horizontal edge of the cover ring 3. This abutting fit ensures that the cover ring 3 is limited both radially and axially by the protective base cover 2: the first vertical edge restricts the radial displacement of the cover ring 3 towards the center of the cavity 14, and the top of the first vertical edge supports the second horizontal edge, restricting the downward axial displacement of the cover ring 3. Compared to simple planar stacking, this L-shaped cross-section with vertical edge contact enhances the connection rigidity and positioning accuracy between the cover ring 3 and the protective base 2, preventing radial swaying of the cover ring 3 during the lifting and lowering of the base guard plate 1. Alternatively, the protective base 2 and cover ring 3 can also have other irregular cross-sectional shapes with mating surfaces, as long as they can achieve bidirectional radial and axial positioning.

[0062] In one specific implementation, please refer to Figure 1 and Figure 2 The inner wall of the cavity 14 is also provided with an inner cavity shield 15. The inner cavity shield 15 is located above the protective bottom cover 2 and at the process position. The protective bottom cover 2 and the inner cavity shield 15 are close to each other to form cavity protection during the sputtering process. When the lifting assembly 10 drives the base guard plate 1 to descend, the protective bottom cover 2 descends together with the base guard plate 1 and separates from the inner cavity shield 15, so that an operation channel for picking up and placing the protective shield ring 5 is formed between the protective bottom cover 2 and the inner cavity shield 15.

[0063] Specifically, the cavity shielding component 15 is an annular shielding plate fixed to the inner wall of the cavity 14, with an inner diameter slightly larger than the outer diameter of the protective base 2. In the process position, the upper end face or outer wall of the protective base 2 is close to the inner wall of the cavity shielding component 15, forming a continuous protective surface in the inner wall region of the cavity 14, preventing sputtered deposits from diffusing into the inner wall of the cavity 14. When the protective shielding ring 5 needs to be replaced, the lifting assembly 10 drives the base guard plate 1 to descend, and the protective base 2 descends along with the base guard plate 1. The upper end face of the protective base 2 gradually separates from the lower end face of the cavity shielding component 15, forming an operating channel extending axially along the cavity 14. This operating channel is located above the protective base 2 and below the cavity shielding component 15, communicating with the valve port of the cavity 14, providing an unobstructed horizontal operating space for a robotic arm to reach into the cavity 14 from the valve port to retrieve and place the protective shielding ring 5. The distance the protective base cover 2 descends determines the height of the operating channel, which must be at least greater than the sum of the thickness of the protective shielding ring 5 and the operating margin required for the robotic arm to pick up and place items. After replacement, the base guard plate 1 rises, and the protective base cover 2 moves upward to reset, once again coming into close contact with the cavity shielding component 15, restoring the cavity's protective state.

[0064] In one specific implementation, please refer to Figure 1 and Figure 2 The cover ring 3 has multiple slots evenly distributed along the circumference. The number of shielding ring supports 6 corresponds to the number of slots. The top of the shielding ring support 6 has a positioning surface. The lower surface of the protective shielding ring 5 has a mating surface that matches the positioning surface, so that the protective shielding ring 5 is positioned when placed. When it is in the process position, the shielding ring support 6 is embedded in the corresponding slot, and the top surface of the shielding ring support 6 is lower than or flush with the upper surface of the cover ring 3, so that the lower surface of the protective shielding ring 5 is in contact with the upper surface of the cover ring 3. When it is in the replacement position, the shielding ring support 6 is withdrawn from the slot and the protective shielding ring 5 is lifted.

[0065] Specifically, three slots are evenly distributed circumferentially on the cover ring 3, extending radially outward from the inner edge of the cover ring 3. There are three corresponding shielding ring supports 6, each with its upper end fixed to the guide pin mounting ring 4 and its lower end extending downward to the plane of the cover ring 3. The top of each shielding ring support 6 has a positioning surface, which is either a stepped surface or a conical surface. The lower surface of the protective shielding ring 5 has a mating surface that matches the positioning surface; this mating surface is also either a stepped surface or a conical surface. When the robotic arm places a new protective shielding ring 5 onto the shielding ring support 6, the positioning surface and the mating surface automatically align through the conical or stepped surface, guiding the protective shielding ring 5 into the correct position, achieving automatic positioning during placement. In the process position, the lower end of the shielding ring support 6 is embedded in the corresponding slot of the cover ring 3, and the top surface of the shielding ring support 6 is lower than or flush with the upper surface of the cover ring 3, so that the lower surface of the protective shielding ring 5 can directly fit against the upper surface of the cover ring 3, ensuring that the protective shielding ring 5 effectively shields the cover ring 3. When changing positions, the guide pin mounting ring 4 is stopped at the valve port by the auxiliary separation component 11, and the shielding ring support 6 is withdrawn from the slot of the cover ring 3 along with the guide pin mounting ring 4. The cover ring 3 continues to descend with the base guard plate 1, separating the protective shielding ring 5 from the cover ring 3. As an alternative, the positioning surface can also be an arc surface or a spherical surface, as long as it can achieve automatic centering and limiting during placement. The number of slots and shielding ring supports 6 can also be set to two, four or more depending on the size of the cover ring 3.

[0066] In one specific implementation, please refer to Figure 1 , Figure 3 and Figure 4 The deep groove extends continuously along the circumference of the edge ring 8 to form an annular groove. The cross-section of the deep groove is rectangular, trapezoidal, or V-shaped. The inner surface of the edge ring 8 is flush with the bearing surface of the bearing base 9.

[0067] Specifically, the edge ring 8 is an annular component located above the support platform 9. A deep trench is formed on the upper surface of the edge ring 8, extending continuously along its entire circumference to form a complete annular trench. The cross-section of the deep trench is rectangular, trapezoidal, or V-shaped to accommodate the deposit containment requirements of different deposition processes. A rectangular cross-section has vertical walls and a large capacity; a trapezoidal cross-section is wider at the top and narrower at the bottom, or vice versa, facilitating deposit entry and preventing overflow; a V-shaped cross-section has an automatic deposit collection effect. The depth of the deep trench is 1 mm to 5 mm, and the width is 2 mm to 10 mm, with the specific dimensions determined based on the film thickness and deposition rate of the deposition process. The inner surface of the edge ring 8 is flush with the support surface of the support platform 9, and both support the wafer 13 on the same horizontal plane. The outer peripheral edge of the wafer 13 is suspended above the deep trench. Deposits that cross the wafer edge during deposition fall into the deep trench, preventing the formation of a conductive path on the outer periphery of the wafer and thus avoiding arc discharge. As an alternative, deep trenches can also be discontinuous, segmented trenches arranged in sections along the circumference of the edge ring 8, forming multiple independent deposit-containing areas below the outer periphery of the wafer, which can also play the role of preventing arc discharge.

[0068] In one specific implementation, please refer to Figure 3 and Figure 4 The outer edge of the protective shielding ring 5 curves up towards the center of the ring to form an annular shielding eave. The covering ring 3 is located above the edge ring 8, and there is an assembly gap between the lower surface of the covering ring 3 and the upper surface of the edge ring 8. It is located in the process position, and the annular shielding eave completely covers the assembly gap between the covering ring 3 and the edge ring 8 as well as the deep groove of the edge ring 8.

[0069] Specifically, the outer edge of the protective shielding ring 5 bends or extends obliquely towards the inner center of the ring, forming a continuous annular shielding eave. This annular shielding eave is integrally formed with the body of the protective shielding ring 5, or is fixedly connected by welding, riveting, or other methods.

[0070] The cover ring 3 is located above the edge ring 8. An assembly gap is reserved between the lower surface of the cover ring 3 and the upper surface of the edge ring 8 due to assembly tolerances and thermal expansion. In the process position, the protective shielding ring 5 is supported on the shielding ring support 6, and the annular shielding eaves completely cover and shield the assembly gap between the cover ring 3 and the edge ring 8, as well as the deep groove of the edge ring 8 from above.

[0071] During the sputtering deposition process, the annular shielding eaves act as a physical barrier to prevent deposits from entering the assembly gap between the cover ring 3 and the edge ring 8, thus preventing deposits from sputtering onto the edge and back of the wafer 13.

[0072] Meanwhile, the deep groove in the edge ring 8 prevents the edge of wafer 13 from directly contacting the edge ring 8, thus avoiding the formation of a conductive path between the edge of wafer 13 and the edge ring 8 during the sputtering process and preventing edge arcing. The annular shielding eaves and the deep grooves work together to prevent deposits from entering the gap area, while the latter eliminates the conditions for edge arcing, jointly ensuring the process quality of wafer 13. As an alternative, the annular shielding eaves can also be a segmented structure, with multiple eaves segments intermittently arranged along the circumference of the protective shielding ring 5, as long as they can completely shield the assembly gaps and deep grooves below.

[0073] This application further discloses a physical vapor deposition apparatus, including a cavity 14, a cover ring 3 disposed within the cavity 14, a support base 9 for supporting a wafer 13, and a protective shielding ring 5 located above the cover ring 3. It also includes the aforementioned automatic shielding ring replacement mechanism for replacing the protective shielding ring 5.

[0074] Specifically, this physical vapor deposition (PVD) equipment has a support platform 9 for supporting wafers 13 inside the cavity 14. An edge ring 8 is located above the support platform 9, and the edge ring 8 and support platform 9 together support the wafers 13. A cover ring 3 is located above the edge ring 8, and a protective shielding ring 5 is located above the cover ring 3. An automatic shielding ring replacement mechanism is integrated inside the cavity 14. Its base plate 1 is connected to the cavity 14 via a lifting assembly 10. A guide pin mounting ring 4 is fitted around the outer periphery of the cover ring 3, and a shielding ring support 6 is fixed to the guide pin mounting ring 4 and supports the protective shielding ring 5. An auxiliary separation assembly 11 is fixed to the bottom of the cavity 14. When the deposition process runs for a certain period and the accumulated film thickness on the surface of the protective shielding ring 5 reaches a preset threshold requiring replacement, the equipment control system controls the automatic shielding ring replacement mechanism to perform an automatic replacement process while the cavity 14 is kept under vacuum or inert atmosphere. This completes the separation, exchange, and reset of the protective shielding ring 5. After replacement, the equipment can continue to be used for the deposition process without breaking the vacuum or opening the cavity.

[0075] This application further discloses an automatic replacement method for a shielding ring, applied to the aforementioned automatic replacement mechanism for a shielding ring. The automatic replacement method includes the following steps: S1. The lifting assembly 10 drives the base guard plate 1 to descend, and at the same time, the base drive mechanism, which is independent of the lifting assembly 10, drives the bearing base 9 to descend synchronously with the base guard plate 1. S2, the lifting assembly 10 continues to drive the base guard plate 1 to descend, the auxiliary separation assembly 11 restricts the guide pin mounting ring 4 to continue to descend, so that the guide pin mounting ring 4 drives the shielding ring support 6 and the protective shielding ring 5 to rise relative to the base guard plate 1, and the guide structure 7 provides radial positioning for the guide pin mounting ring 4 until the protective shielding ring 5 separates from the cover ring 3 and reaches the predetermined exchange position. S3. When the protective shielding ring 5 is raised to be flush with the middle position of the valve port of the cavity 14 and the central axis of the protective shielding ring 5 is coplanar with the central axis of the valve port, the robot arm extends into the cavity 14 in the horizontal direction to remove the old protective shielding ring 5 and put in the new protective shielding ring 5. S4. The lifting assembly 10 drives the base guard plate 1 to rise, and the guide pin mounting ring 4 and the protective shield ring 5 return to the process position together. At the same time, the base drive mechanism drives the bearing base 9 and the base guard plate 1 to rise and reset to the process height synchronously.

[0076] Specifically, the entire automatic replacement method is performed while the cavity 14 is kept under vacuum or inert atmosphere. In step S1, the equipment control system simultaneously sends a descent command to the lifting assembly 10 and the base drive mechanism. The lifting assembly 10 drives the base guard plate 1 to descend, and the base guard plate 1 drives the protective bottom cover 2, the cover ring 3, the guide pin mounting ring 4, and the protective shielding ring 5 to descend together. At the same time, the base drive mechanism drives the supporting base 9 to descend synchronously at the same speed, maintaining the relative positional relationship between the supporting base 9 and the base guard plate 1. During the descent, the protective bottom cover 2 gradually separates from the cavity shielding member 15, preparing for the formation of the subsequent operation channel.

[0077] In step S2, the lifting assembly 10 continues to drive the base guard plate 1 to descend. When the protective shielding ring 5 descends to be flush with the middle position of the valve opening of the cavity 14, the base guard plate 1 reaches the preset position. At this time, the top pin of the auxiliary separation assembly 11 fixed to the bottom of the cavity 14 passes through the second through hole of the protective bottom cover 2 and abuts against the bottom of the guide pin mounting ring 4, restricting the guide pin mounting ring 4 and the protective shielding ring 5 from descending further. The protective shielding ring 5 is stopped and stops at the valve opening. The lifting assembly 10 continues to drive the base guard plate 1 to descend, causing the protective bottom cover 2 and the cover ring 3 to continue to descend, so that the cover ring 3 and the protective shielding ring 5 stationary at the valve opening generate relative movement, and the upper surface of the cover ring 3 gradually moves away from the lower surface of the protective shielding ring 5. At the same time, the shielding ring support 6 retracts from the slot of the cover ring 3 along with the guide pin mounting ring 4. Throughout the descent of the base guard plate 1, the guide pin of the guide structure 7 remains inserted and slides within the first through hole of the base guard plate 1, providing continuous radial positioning for the guide pin mounting ring 4 and the protective shielding ring 5, ensuring that the protective shielding ring 5 remains precisely aligned and does not experience radial offset when stationary. When the base guard plate 1 descends to the point where the protective shielding ring 5 and the cover ring 3 are completely separated and the distance between them is sufficient for the robotic arm to perform pick-and-place operations, the lifting assembly 10 stops operating.

[0078] In step S3, the protective shielding ring 5 is stably positioned at the valve port of the cavity 14, with its upper surface higher than the lower edge of the valve port and its lower surface lower than the upper edge of the valve port, and its central axis coplanar with the central axis of the valve port. A robotic arm extends horizontally into the cavity 14 from the valve port, with its end effector inserted below the protective shielding ring 5 or gripping its edge. The robotic arm removes the old protective shielding ring 5 from the shielding ring support 6 and moves it out of the cavity 14 through the valve port. Subsequently, the robotic arm grips the new protective shielding ring 5 and inserts it into the cavity 14 through the valve port, placing it on the shielding ring support 6. The positioning surface at the top of the shielding ring support 6 and the mating surface of the lower surface of the new protective shielding ring 5 are automatically aligned through a conical or stepped surface, guiding the new protective shielding ring 5 into the correct position, achieving automatic positioning during placement. After placement, the robotic arm exits the cavity 14 through the valve port.

[0079] In step S4, the lifting assembly 10 drives the base guard plate 1 to rise, and the base guard plate 1 drives the protective cover 2 and the cover ring 3 to rise together. During the rise of the base guard plate 1, its first through hole slides upward along the guide pin, and the upper surface of the base guard plate 1 gradually approaches and finally re-supports the guide pin mounting ring 4. The guide pin mounting ring 4 and the new protective shielding ring 5 supported on the shielding ring support 6 rise together with the base guard plate 1. At the same time, the base drive mechanism drives the supporting base 9 to rise synchronously at the same speed. When the base guard plate 1 rises to the process position, the protective cover 2 and the cavity shielding member 15 re-apply to each other, the cover ring 3 returns to the process height, the shielding ring support 6 re-embeds into the corresponding slot of the cover ring 3, and the lower surface of the new protective shielding ring 5 is in contact with the upper surface of the cover ring 3. The supporting base 9 synchronously returns to the process height, and its bearing surface is flush with the inner surface of the edge ring 8. At this point, a complete automatic replacement process of the protective shielding ring 5 is completed, and the equipment returns to a state where the deposition process can be performed.

[0080] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. An automatic shielding ring replacement mechanism for a physical vapor deposition apparatus, the physical vapor deposition apparatus comprising a cavity (14), a shielding ring (3) disposed within the cavity (14), and a support base (9) for supporting a wafer (13). Its features are, The automatic shielding ring replacement mechanism includes: A guide pin mounting ring (4) is sleeved on the outer periphery of the cover ring (3). A shielding ring support (6) is fixed on the guide pin mounting ring (4). The shielding ring support (6) is used to support the protective shielding ring (5) located on the upper surface of the cover ring. The base guard plate (1) is used to support the cover ring (3) and the guide pin mounting ring (4). The lifting assembly (10) is fixedly connected to the base guard plate (1) and is used to drive the base guard plate (1) to lift. A guide structure (7) is provided on the guide pin mounting ring (4), and the base guard plate (1) cooperates with the guide structure to provide radial positioning for the guide pin mounting ring (4); An auxiliary separation component (11) is disposed inside the cavity (14). When the lifting component (10) drives the base guard plate (1) to descend to a preset position, the auxiliary separation component is used to separate the protective shielding ring (5) from the covering ring (3). An edge ring (8) is located above the support base (9). The edge ring (8) and the support base (9) jointly support the wafer (13). The edge ring (8) has a deep groove located below the outer peripheral edge of the supported wafer (13).

2. The automatic shielding ring replacement mechanism according to claim 1, characterized in that, The guide structure (7) includes a guide pin, which is fixedly disposed on the guide pin mounting ring (4) and extends axially toward the base guard plate (1) along the protective shield ring (5). The base guard plate (1) has a first through hole, and the guide pin is inserted into the first through hole.

3. The automatic shielding ring replacement mechanism according to claim 1, characterized in that, It also includes a protective bottom cover (2), which is fixed above the base guard plate (1) and supports the cover ring (3). The protective bottom cover (2) has a second through hole. The auxiliary separation component (11) includes a top pin, which is fixedly disposed in the cavity (14) and located below the second through hole. When the lifting component (10) drives the base guard plate (1) to descend, the top pin passes through the second through hole of the protective cover (2) and abuts against the bottom of the guide pin mounting ring (4) so ​​that the guide pin mounting ring (4) moves away from the protective cover (2).

4. The automatic shielding ring replacement mechanism according to claim 3, characterized in that, The protective bottom cover (2) and the covering ring (3) are both L-shaped in cross section. The L-shaped cross section of the protective bottom cover (2) has a first horizontal side and a first vertical side, and the L-shaped cross section of the covering ring (3) has a second horizontal side and a second vertical side. The first vertical edge of the protective base (2) abuts against the side of the second horizontal surface of the cover ring (3) facing the protective base (2) to support the cover ring (3).

5. The automatic shielding ring replacement mechanism according to claim 3, characterized in that, The inner wall of the cavity (14) is also provided with an inner cavity shielding component (15), which is located above the protective bottom cover (2); Located at the process position, the protective bottom cover (2) and the cavity shield (15) are close to each other to form cavity protection during the sputtering process; When the lifting assembly (10) lowers the base guard plate (1), the protective bottom cover (2) lowers together with the base guard plate (1) and separates from the cavity shielding member (15), so that an operation channel for taking out and putting in the protective shielding ring (5) is formed between the protective bottom cover (2) and the cavity shielding member (15).

6. The automatic shielding ring replacement mechanism according to claim 1, characterized in that, The covering ring (3) has multiple slots evenly distributed along the circumference, and the number of shielding ring supports (6) corresponds to the number of slots. The top of the shielding ring support (6) is provided with a positioning surface, and the lower surface of the protective shielding ring (5) is provided with a mating surface that is compatible with the positioning surface, so as to position the protective shielding ring (5) when it is placed. Located at the process position, the shielding ring support (6) is embedded in the corresponding slot, and the top surface of the shielding ring support (6) is lower than or flush with the upper surface of the cover ring (3), so that the lower surface of the protective shielding ring (5) is in contact with the upper surface of the cover ring (3). When the position is changed, the shielding ring support (6) exits from the slot and raises the protective shielding ring (5).

7. The automatic shielding ring replacement mechanism according to claim 1, characterized in that, The deep groove extends continuously along the circumference of the edge ring (8) to form an annular groove. The cross-section of the deep groove is rectangular, trapezoidal or V-shaped. The inner surface of the edge ring (8) is flush with the bearing surface of the bearing base (9).

8. The automatic shielding ring replacement mechanism according to claim 1, characterized in that, The outer edge of the protective shielding ring (5) curves upward toward the center of the ring to form a ring-shaped shielding eaves; The cover ring (3) is located above the edge ring (8), and there is an assembly gap between the lower surface of the cover ring (3) and the upper surface of the edge ring (8); Located in the process position, the annular shielding eaves completely cover the assembly gap between the covering ring (3) and the edge ring (8) as well as the deep groove of the edge ring (8).

9. An automatic replacement method for a shielding ring, characterized in that, The automatic replacement method, applied to the shielding ring automatic replacement mechanism as described in any one of claims 1-8, comprises: The lifting assembly (10) drives the base guard plate (1) to descend, while the base drive mechanism, independent of the lifting assembly (10), drives the bearing base (9) to descend synchronously with the base guard plate (1); The lifting assembly (10) continues to drive the base guard plate (1) to descend, and the auxiliary separation assembly (11) restricts the guide pin mounting ring (4) from descending further, so that the guide pin mounting ring (4) drives the shielding ring support (6) and the protective shielding ring (5) to rise relative to the base guard plate (1), and the guide structure (7) provides radial positioning for the guide pin mounting ring (4) until the protective shielding ring (5) separates from the cover ring (3) and reaches the predetermined exchange position; When the protective shielding ring (5) is raised to be level with the middle position of the valve port of the cavity (14) and the central axis of the protective shielding ring (5) is coplanar with the central axis of the valve port, the robot arm extends into the cavity (14) in the horizontal direction to remove the old protective shielding ring (5) and put in the new protective shielding ring (5). The lifting assembly (10) drives the base guard plate (1) to rise, and the guide pin mounting ring (4) and the protective shield ring (5) return to the process position together. At the same time, the base driving mechanism drives the bearing base (9) and the base guard plate (1) to rise and reset to the process height synchronously.

10. A physical vapor deposition apparatus, comprising a cavity (14), a cover ring (3) disposed within the cavity (14), a support platform (9) for supporting a wafer (13), and a protective shielding ring (5) located above the cover ring (3); Its features are, It also includes an automatic shielding ring replacement mechanism as described in any one of claims 1 to 8, the automatic shielding ring replacement mechanism being used to replace the protective shielding ring (5).

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