A cooling system and control method integrating vapor compression refrigeration and liquid cooling technologies

Abstract

This invention provides a cooling system and control method integrating vapor compression refrigeration and liquid cooling technologies, comprising: a primary cooling circuit, a vapor compression refrigeration circuit, and a condenser heat dissipation unit; the primary cooling circuit is used for heat exchange with the heat-generating components of a wind turbine through a liquid cooling medium, transferring heat from the heat-generating components to the liquid cooling medium; the vapor compression refrigeration circuit is connected to the primary cooling circuit and is used to transfer heat from the liquid cooling medium through phase change heat transfer; the condenser heat dissipation unit is connected to the vapor compression refrigeration circuit and is used to discharge the heat released by the vapor compression refrigeration circuit to the external environment. Through liquid cooling technology, the primary cooling circuit and the vapor compression refrigeration circuit can actively transfer the heat generated by the heat-generating components to the condenser heat dissipation unit, which then discharges the heat to the external environment, achieving low-noise heat dissipation, eliminating environmental temperature constraints and noise effects at the heat dissipation end, and realizing quiet, efficient, and highly reliable cooling.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for wind power generation equipment, and in particular to a cooling system and control method that integrates vapor compression refrigeration and liquid cooling technologies. Background Technology

[0002] As a core component for power conversion, the wind turbine converter generates a significant amount of heat during operation through its power modules (such as IGBTs (Insulated-Gate Bipolar Transistors)). Currently, the mainstream cooling method is forced air cooling, which uses high-speed fans to dissipate the heat inside the converter cabinet to the outside air via convection. This method has the following significant drawbacks: 1. Severe noise pollution: The high-speed operation of the fans generates continuous high-frequency noise, which can easily lead to environmental complaints when the wind farm is operating at night or near residential areas, becoming an important factor restricting the site selection and operation of the project.

[0003] 2. Cooling efficiency is greatly affected by the environment: its heat dissipation capacity directly depends on the ambient air temperature. In hot summer weather or low wind speed, the heat dissipation efficiency drops sharply, causing the converter to be forced to operate at a reduced rate due to excessively high chip junction temperature, resulting in power generation loss. According to statistics, the annual power generation loss in high-temperature areas can reach 5%-10%.

[0004] 3. Reliability issues: The fan and its filter are susceptible to clogging and corrosion from pollutants such as sand, salt spray, and willow catkins, requiring frequent maintenance, increasing operation and maintenance costs, and having a high failure rate in harsh environments.

[0005] 4. Low energy efficiency: The fan power consumption increases sharply with the increase of heat dissipation demand, and it cannot actively "transfer" heat, resulting in a low overall cooling energy efficiency ratio.

[0006] To overcome the drawbacks of air cooling, liquid cooling technology has begun to be applied. Currently, most liquid cooling solutions adopt the form of "liquid cooling plate + external air-cooled heat sink". Although the main heat source is transferred to the outside of the cabinet, the final heat dissipation still depends on the fan and air, and does not fundamentally solve the problems of ambient temperature constraints and noise at the final heat dissipation end. Summary of the Invention

[0007] This invention provides a cooling system and control method that integrates vapor compression refrigeration and liquid cooling technologies to solve existing problems.

[0008] This invention provides a cooling system integrating vapor compression refrigeration and liquid cooling technologies, comprising: The primary cooling circuit is used to exchange heat with the heat-generating components of the wind turbine through a liquid cooling medium, so as to transfer the heat of the heat-generating components to the liquid cooling medium. The vapor compression refrigeration circuit is connected to the primary cooling circuit and is used to transfer the heat of the liquid cooling medium through phase change heat transfer. The condensation and heat dissipation unit is connected to the vapor compression refrigeration circuit and is used to discharge the heat released by the vapor compression refrigeration circuit to the external environment.

[0009] Furthermore, the primary cooling circuit includes: a primary circulation pipeline, and a liquid storage tank, a primary circulation pump, and a microchannel cold plate sequentially disposed on the primary circulation pipeline; The liquid storage tank contains the liquid cooling medium; The microchannel cold plate is attached to the surface of the heating element, and the microchannel cold plate has flow channels inside.

[0010] Furthermore, the primary cooling circuit also includes a three-way valve; the first end of the three-way valve is connected to the microchannel cold plate, the second end is connected to the liquid storage tank, and the third end is connected to the vapor compression refrigeration circuit.

[0011] Furthermore, the primary cooling circuit further includes: a thermal interface layer disposed between the heating component and the microchannel cold plate; the thermal interface layer is filled with a highly thermally conductive insulating material; preferably, the highly thermally conductive insulating material includes thermally conductive silicone grease, a thermally conductive phase change material, or a thermally conductive pad; Preferably, the microchannel cold plate is internally processed with a parallel microchannel array, and the hydraulic diameter of the microchannels ranges from 0.5 mm to 1 mm; Preferably, the heating element is fixed to the microchannel cold plate by fastening bolts; a sealing ring is provided around the contact area between the heating element and the microchannel cold plate.

[0012] Furthermore, the vapor compression refrigeration circuit includes: a compressor, a condenser, an expansion valve, and an evaporator connected in sequence to form a closed loop; The evaporator is used to transfer heat from the liquid cooling medium.

[0013] Furthermore, the condensation and heat dissipation unit includes: a heat dissipation fin assembly and a DC fan assembly arranged along the cooling airflow direction; The heat dissipation fins are attached to the outer surface of the condenser; The DC fan assembly is located on one side of the heat dissipation fin assembly and is used to drive airflow through the fin gaps of the heat dissipation fin assembly to discharge the heat released by the vapor compression refrigeration circuit into the cabin air.

[0014] Preferably, the operating noise of the DC fan assembly is lower than that of a conventional air-cooled fan.

[0015] Furthermore, it also includes: a control system; the control system includes a temperature sensor, a pressure sensor, and a controller; The temperature sensor is used to detect the relevant temperatures of the cooling system; The pressure sensor is used to detect the refrigeration pressure of the cooling system; The controller is used to perform refrigeration control based on the relevant temperature and the refrigeration pressure.

[0016] This invention also provides a control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies, comprising: The load power of the heat-generating components, the relevant temperature of the cooling system, and the refrigeration pressure are obtained; the relevant temperature includes the temperature of the heat-generating components of the wind turbine, the temperature of the external environment, and the temperature of the primary cooling circuit. The operating mode of the cooling system is determined based on the load power of the heat-generating component, the relevant temperature, and the cooling pressure. Based on the aforementioned operating mode, the cooling system is refrigeration controlled with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective.

[0017] Furthermore, if the operating mode is an active cooling mode, then the cooling control of the cooling system based on the operating mode, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective, includes: In the active cooling mode, the cooling demand is calculated based on the relevant temperature and the cooling pressure; Based on the aforementioned cooling requirements, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, a collaborative optimization algorithm is used to generate a control strategy that includes compressor frequency, expansion valve opening, and DC fan reference speed. If the current period is a quiet period, the speed of the DC fan assembly will be reduced based on the DC fan's reference speed. If the system is not currently in a quiet period, the operation of the primary circulation pump and the connection between the three-way valve and the evaporator are controlled, and the compressor, expansion valve, and DC risk are controlled based on the control strategy.

[0018] Furthermore, if the operating mode is a natural cooling mode, then the cooling control of the cooling system based on the operating mode, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective, includes: In the natural cooling mode, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, the compressor is controlled to stop and the expansion valve is closed; then the primary circulation pump is controlled to run. If the temperature of the current heating component is within the set temperature range, the DC fan group will be turned off; otherwise, the DC fan group will be turned on.

[0019] This application also provides an electronic device, which includes at least a processor and a memory, wherein the processor is used to execute a computer program stored in the memory to implement the steps of a control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies as described above.

[0020] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of a control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies as described above.

[0021] This application also provides a computer program product, which includes: computer program code, and steps for the computer to execute the control method of the cooling system integrating vapor compression refrigeration and liquid cooling technology described above when the computer program code is run on a computer.

[0022] In this embodiment of the invention, the cooling system integrating vapor compression refrigeration and liquid cooling technologies includes: a primary cooling circuit, a vapor compression refrigeration circuit, and a condenser heat dissipation unit. The primary cooling circuit is used to exchange heat with the heat-generating components of the wind turbine through a liquid cooling medium, transferring the heat from the heat-generating components to the liquid cooling medium. The vapor compression refrigeration circuit is connected to the primary cooling circuit and is used to transfer the heat from the liquid cooling medium through phase change heat transfer. The condenser heat dissipation unit is connected to the vapor compression refrigeration circuit and is used to discharge the heat released by the vapor compression refrigeration circuit to the external environment. In this invention, the primary cooling circuit and the vapor compression refrigeration circuit, through liquid cooling technology, can actively transfer the heat generated by the heat-generating components to the condenser heat dissipation unit, which then discharges the heat to the external environment. This achieves low-noise heat dissipation, eliminates environmental temperature constraints and noise effects at the final heat dissipation end, and realizes quiet, efficient, and highly reliable cooling. Attached Figure Description

[0023] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 A schematic diagram illustrating the overall structural principle of a cooling system integrating vapor compression refrigeration and liquid cooling technologies provided in an embodiment of the present invention; Figure 2 A schematic cross-sectional view of the installation structure of the microchannel cold plate and the heating element provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the condensation and heat dissipation unit structure provided by the present invention; Figure 4 A schematic flowchart illustrating a control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies, provided in an embodiment of the present invention; Figure 5 A logic flowchart of a cooling system control method provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0025] The following detailed description is exemplary and intended to provide further detailed explanation of the invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention.

[0026] Example 1: This invention provides a cooling system integrating vapor compression refrigeration and liquid cooling technologies. See [link to relevant documentation]. Figure 1 As shown, it includes: a primary cooling circuit, a vapor compression refrigeration circuit, and a condensation heat dissipation unit; A primary cooling circuit is used to exchange heat with the heat-generating components of the wind turbine through a liquid cooling medium, thereby transferring the heat from the heat-generating components to the liquid cooling medium. The vapor compression refrigeration circuit is connected to the primary cooling circuit and is used to transfer the heat of the liquid cooling medium through phase change heat transfer. The condenser heat dissipation unit is connected to the vapor compression refrigeration circuit and is used to dissipate the heat released by the vapor compression refrigeration circuit to the external environment.

[0027] In this embodiment of the invention, the primary cooling circuit and the vapor compression refrigeration circuit utilize liquid cooling technology to actively transfer the heat generated by the heat-generating components to the condensation heat dissipation unit, which then discharges the heat to the external environment. This achieves low-noise heat dissipation, eliminates environmental temperature constraints and noise impacts at the final heat dissipation end, and realizes quiet, efficient, and highly reliable cooling.

[0028] The cooling system provided in this embodiment of the invention is an integrated cabinet design, suitable for heat dissipation of heat-generating components in wind turbine generators. Generally, the IGBT converter in a wind turbine generator is the core heat-generating component; therefore, this embodiment of the invention mainly focuses on the heat-generating components including several IGBT power modules of the converter.

[0029] In a primary cooling loop, heat is absorbed by exchanging heat with the heat-generating component through a cooling medium. Since the primary cooling loop is in direct contact with the heat-generating component, it can also be called a load hot-end circulation system. In one implementation, the primary cooling loop includes: a primary circulation pipeline, and a liquid storage tank, a primary circulation pump, and a microchannel cold plate sequentially arranged on the primary circulation pipeline; the liquid storage tank stores a liquid cooling medium; the microchannel cold plate is attached to the surface of the heat-generating component, and the microchannel cold plate has (micro)flow channels inside. In this implementation, the microchannel cold plate is in direct contact with the heat-generating component and can serve as a mounting substrate for the heat-generating component, improving mechanical stability and thermal uniformity. Preferably, the main body of the microchannel cold plate can be made of a high thermal conductivity metal (such as aluminum or copper) through precision machining or diffusion welding. The microchannel cold plate has a parallel microchannel array processed inside, with the hydraulic diameter of the microchannels ranging from 0.1 mm to 2 mm, preferably 0.5 mm to 1 mm, ensuring tight contact with the power module substrate (filled with thermally conductive silicone grease). The microchannel cold plate has coolant inlets and coolant outlets at both ends, which are connected to the pipelines of the primary cooling circuit.

[0030] In this embodiment, by tightly integrating the microchannel cold plate with the power module in a manner with extremely low thermal resistance, the waste heat generated by the chip can be instantly captured and carried away by the flowing coolant with the shortest path and the largest area. This is the prerequisite for the entire system to achieve efficient heat dissipation, thus allowing the use of smaller cooling units. This design enables efficient direct cooling, unlike traditional air cooling (indirect, through air convection) and ordinary liquid cooling (which may use larger flow channel cold plates).

[0031] Taking heat-generating components, including IGBTs, as an example, Figure 2 As shown, the primary cooling circuit also includes a thermal interface layer disposed between the heat-generating component and the microchannel cold plate; specifically, the thermal interface layer is located between the bottom of the heat-generating component and the top of the microchannel cold plate. The heat-generating component is located in the power module packaging layer, which includes IGBTs and diode dies and is the main heat source. The thermal interface layer is filled with a highly thermally conductive insulating material; preferably, the highly thermally conductive insulating material includes thermally conductive silicone grease, thermally conductive phase change material, or thermally conductive pads, typically only a few millimeters in size. As a thermally conductive insulating layer, the thermal interface layer allows for direct contact between the heat-generating component die and the microchannel cold plate.

[0032] Preferably, the heating element is fixed to the microchannel cold plate by fastening bolts (with a certain pressure). The mounting structure also includes a mounting and sealing layer, such as a sealing ring provided around the contact area between the heating element and the microchannel cold plate to achieve a seal and prevent coolant leakage to the electrical components.

[0033] In one possible approach, the primary cooling circuit also includes a bypass pipe and bypass valve connected in parallel with the vapor compression refrigeration circuit. When the primary cooling circuit does not require refrigeration (e.g., in a low-temperature environment), the liquid cooling medium can bypass the vapor compression refrigeration circuit and circulate directly, reducing losses. For example, the bypass valve includes a three-way valve; that is, the primary cooling circuit also includes a three-way valve. The first end of the three-way valve is connected to the microchannel cold plate, the second end is connected to the liquid storage tank, and the third end is connected to the vapor compression refrigeration circuit.

[0034] The liquid cooling medium may include insulating fluorinated liquids, more specifically highly insulating fluorinated liquids with high dielectric constants to prevent leakage from causing short circuits.

[0035] Optionally, the primary cooling circuit may also include a deionization unit. Figure 1 The primary cooling loop flow path shown includes: liquid receiver tank → primary circulation pump → three-way valve → microchannel cold plate → plate evaporator → return to liquid receiver tank, forming a closed loop. The insulating coolant (such as fluorinated liquid) circulates in this loop, acting as a "heat collector" to directly absorb the waste heat generated by the converter power module and carry it to the heat exchange node. In one possible implementation, the vapor compression refrigeration circuit includes a compressor, a condenser, an expansion valve, and an evaporator connected in sequence to form a closed loop. In this implementation, the vapor compression refrigeration circuit can actively transfer heat through phase change heat exchange. The evaporator, as a coupled heat exchange module, is the coupling node for heat exchange between the two circuits and is the core of the active refrigeration function. The evaporator is used to transfer heat from the liquid cooling medium. Specifically, the evaporator is thermally coupled with the primary cooling circuit for heat exchange, transferring heat from the cooling medium in the primary cooling circuit to the refrigerant.

[0036] In this implementation, a bypass pipe and bypass valve (or three-way valve) connected in parallel with the evaporator are set on the primary cooling circuit. When the primary circuit does not need refrigeration (such as in a low-temperature environment), i.e. when the refrigeration circuit needs to be shut down, the bypass valve is opened, and the coolant can flow through the bypass pipe, bypassing the evaporator and circulating directly, thus reducing losses.

[0037] like Figure 1As shown, the compressor can include a variable frequency compressor, such as a variable frequency scroll compressor. Fully enclosed scroll compressors have a vibration-resistant design and a lifespan exceeding 100,000 hours. The expansion valve can include an electronic expansion valve. The condenser can include a plate condenser, located at the center of the unit and part of the refrigeration circuit. Its exterior is made of metal plates, and its interior contains refrigerant channels. The evaporator can include a plate evaporator. Both the evaporator and condenser can be brazed plates, ensuring compactness and high efficiency. Vapor compression refrigeration actively "pumps" heat from the low-temperature side to the high-temperature side, allowing the primary cooling medium temperature to remain stably below the ambient temperature. This ensures that the converter will not derating due to insufficient heat dissipation even in extreme high-temperature weather, significantly increasing annual power generation, especially in high-temperature regions, overcoming environmental temperature limitations.

[0038] This system features an integrated cabinet design, with the plate evaporator installed outside the tower (tower base), and the remaining system cabinets installed near the converter cabinet (tower base). The system can be flexibly adjusted during installation based on the unit capacity and actual site conditions.

[0039] Figure 1 The vapor compression refrigeration circuit shown is a vapor compression refrigeration system. The process path includes: compressor → plate condenser → electronic expansion valve → plate evaporator → return to compressor, forming a closed loop. This circuit acts as a "heat transfer pump." The refrigerant evaporates in the plate evaporator, absorbing the heat carried by the coolant in the primary cooling circuit; after being compressed by the compressor, it condenses in the plate condenser, releasing the heat.

[0040] The primary cooling circuit and vapor compression refrigeration circuit of this invention feature a dual-cycle coupling design, including a primary cycle (inverter cooling): Insulating coolant (such as fluorinated liquid or water-glycol) is driven by a circulating pump, flows through a microchannel cold plate, and directly contacts power devices such as IGBTs and diodes for heat exchange. After heating, it enters the plate evaporator. A secondary cycle (refrigeration cycle): In the evaporator, the heat from the primary cycle is absorbed by the refrigerant (R134a or R410A recommended). After being compressed by the variable frequency compressor, the refrigerant condenses and releases heat in the plate condenser, finally completing the cycle through throttling by an electronic expansion valve. This completely enclosed design prevents environmental pollutants from entering; the refrigerant and coolant are separated, ensuring safety and reliability, stable component operating temperatures, and an expected reduction in inverter failure rate of over 40%.

[0041] In one implementation, the condenser cooling unit includes: a heat dissipation fin assembly arranged along the cooling airflow direction and a DC fan assembly (optional); the heat dissipation fin assembly is attached to the outer surface of the condenser; the DC fan assembly is located on one side (e.g., side or rear) of the heat dissipation fin assembly to drive airflow through the fin gaps of the heat dissipation fin assembly, thereby dissipating the heat released from the vapor compression refrigeration circuit into the cabin air. In this implementation, the heat dissipation fin assembly can be a large-area heat dissipation fin assembly tightly connected to the outer surface of the condenser, specifically tightly fitted or welded to the outer surface of the plate condenser; the fins have a corrugated or window-like design to turbulent airflow and enhance heat transfer. The dense fin spacing (e.g., 1.5mm - 3mm) achieves a large expanded heat dissipation area within a limited volume. The DC fan assembly is used to drive the airflow.

[0042] Preferably, the operating noise of the DC fan assembly is lower than that of traditional air-cooled fans. In implementation, the DC fan assembly can be a low-speed fan assembly, typically consisting of 1-2 large-diameter, low-speed axial fans or airfoil centrifugal fans. The fan assembly is installed on one side or behind (the exhaust side) of the heat sink fin assembly, forming a "suction" or "blowing" layout. By controlling the maximum speed design value of the low-speed fan assembly, its operating noise is kept below 50 dB (50 dB is an example; the actual setting can be adjusted according to the specific scenario). Replacing traditional high-speed forced fans with low-speed fans (or even natural convection) reduces the sound pressure level of the main noise source from above 75 dB(A) in traditional air cooling to below 45 dB(A), fundamentally solving the noise pollution problem caused by wind farms and achieving revolutionary noise reduction. Miniaturizing and reducing the speed of the traditional noise source (fans) and combining it with large-area passive heat sink fins significantly reduces the noise level.

[0043] The condenser uses extra-large surface area aluminum fins to reduce heat flux density. The cooling fan uses a large-diameter, low-speed (<800rpm) brushless DC fan, with noise levels even below 35dB(A). The system can intelligently adjust the fan speed according to the condensing pressure, requiring only natural convection or low-speed operation most of the time. An optional natural cooling mode is available: when the ambient temperature is below the set value, the refrigeration cycle is shut down, the circulation pump is activated only once, and the bypass valve is opened, achieving zero-energy cooling.

[0044] Figure 1 The condenser cooling unit shown ultimately dissipates the heat "transferred" from the inverter by the cooling circuit into the cabin air via convection (forced or natural convection). The low-speed fan is the main external noise source of this system, and its design speed is much lower than that of traditional air-cooled fans.

[0045] Figure 1An integrated cooling solution combining vapor compression refrigeration cycle and microchannel cold plate direct cooling technology is adopted. The closed-loop circulation system isolates pollutants such as sand and salt spray, ensuring stable and controllable operating temperature of core heat-generating components. This reduces failures caused by thermal cycling and pollution, extends the service life of the converter, improves reliability, and lowers the total life cycle maintenance cost.

[0046] Figure 3 A specific condensing and heat dissipation unit is shown, comprising a plate condenser, heat dissipation fins (assemblies), multiple cooling fans (i.e., DC fan assemblies), air ducts, automatically adjusting louvers, and vibration damping brackets along the cooling airflow direction. For example, the cooling fan speed can be 500-800 RPM (revolutions per minute), and the diameter can be 400 mm. The condensing and heat dissipation unit adopts a combination of "large-area heat dissipation fin assembly" and "low-speed fan assembly" to achieve coordinated noise reduction through "large-area passive heat dissipation as the primary method, supplemented by low-speed active ventilation." Optionally, the condensing and heat dissipation unit also includes an openable and closable air duct valve; when the ambient temperature is below a first set threshold and the inverter load is below a second set threshold, the air duct valve is controlled to open and close the low-speed fan assembly, allowing the heat dissipation fin assembly to dissipate heat through natural convection, while simultaneously controlling the cooling circuit to shut down or operate at low frequency.

[0047] Optionally, the condenser cooling unit also includes an airflow channel and housing. This structure surrounds the heat dissipation fins and fan assembly, forming a closed airflow channel. This guides airflow to be concentrated and evenly distributed throughout the fin area, preventing airflow short-circuiting and turbulence, and improving heat dissipation efficiency. An automatically adjustable louvered damper is included at the air inlet or outlet of the airflow channel. In "natural cooling mode," the damper opens fully under controller command to maximize natural convection. In "active cooling mode," the damper opening can be adjusted to optimize airflow. When the system is shut down, the damper can be closed to prevent dust and moisture from entering.

[0048] The energy flow direction of the cooling system provided in this embodiment of the invention includes: heat is generated from the inverter heating unit, efficiently conducted through the thermal interface layer, and enters the solid metal part of the microchannel cold plate; in the primary cooling circuit and the refrigeration circuit, the heat is transferred sequentially: heating unit → coolant → refrigerant; finally, the heat is discharged into the external ambient air at the condensation heat dissipation unit.

[0049] In one possible implementation, the cooling system may further include: an intelligent control system for coordinating and controlling the operation of the entire cooling system; the control system includes (multi-channel) temperature sensors, pressure sensors, a variable frequency drive (optional), and a (main) controller; the temperature sensors are used to detect relevant temperatures of the cooling system, such as the junction temperature (or case temperature) of the power module, the temperature of the primary cooling medium, and the ambient temperature; the pressure sensors are used to detect the refrigeration pressure of the cooling system, such as the refrigeration circuit pressure; the controller is used to perform refrigeration control based on the relevant temperatures and refrigeration pressures, i.e., the controller is configured to dynamically adjust the compressor frequency, expansion valve opening, fan speed, and circulation pump start / stop based on the data collected by the sensors.

[0050] In this implementation, the controller has the following control functions: The controller's input signals include, but are not limited to: power module junction temperature sensor (or case temperature sensor) signals (represented by Tjunc or Tj), ambient temperature sensor signals (represented by Tamb), and converter load power signals (obtained via communication) (represented by Pload). Based on the built-in algorithm, the controller outputs control commands to each actuator, including but not limited to: adjusting the compressor frequency (represented by To Compressor), adjusting the electronic expansion valve opening (represented by To EXV), adjusting the low-speed fan speed (represented by To Fan), and controlling the flow of coolant through the evaporator or bypass pipeline (represented by To 3-WayValve).

[0051] The controller controls the operating status of the compressor, expansion valve and low-speed fan group based on the temperature of the heat-generating power module and / or the ambient temperature. The controller executes a model-predictive control algorithm whose control objective is to minimize the total energy consumption of the cooling system (compressor + fan + pump) while meeting the maximum junction temperature limit of the power module. The control variables of the control algorithm include compressor frequency, expansion valve opening, and low-speed fan speed. The controller features "intelligent decision-making based on multi-parameter sensing and seamless switching between multiple modes." It not only achieves basic closed-loop temperature control, but also achieves dynamic balance and optimization among multiple objectives such as "ultimate heat dissipation," "ultimate quietness," and "ultimate energy efficiency" by introducing multiple dimensions such as ambient temperature, load power, and time strategy. The controller employs a multi-parameter collaborative intelligent control strategy to ensure the system always operates at its optimal energy efficiency point. This reduces its own energy consumption while creating the best operating temperature environment for the converter, thereby improving overall power generation efficiency. The specific control process for the controller to implement the above control functions is described in the following embodiments, and will not be explained here.

[0052] This invention relates to a cooling system for wind turbine generator converters, specifically a quiet and efficient cooling system integrating vapor compression refrigeration cycle and liquid cooling technology. This system completely eliminates environmental temperature limitations, achieves extreme quiet operation, and meets the high-efficiency and reliable cooling requirements of wind power converters under harsh operating conditions. Specifically, this cooling system can completely replace traditional air-cooled fans, achieving extreme quietness in converter heat dissipation. It allows the converter to maintain stable full-power operation within a wide environmental temperature range of -30℃ to +50℃, avoiding high-temperature derating losses (especially in high-temperature regions, it can increase annual power generation by 3%-8%). It also features high reliability and low maintenance, adapting to the harsh operating conditions of wind power, including high vibration and high-pollutant environments.

[0053] Example 2: Based on the same inventive concept Figure 4 and Figure 5 This is a schematic flowchart illustrating a control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies, provided in an embodiment of the present invention. The process includes the following steps: S401: Obtain the load power of the heat-generating components, the relevant temperatures of the cooling system, and the refrigeration pressure; the relevant temperatures include the temperature of the heat-generating components of the wind turbine, the temperature of the external environment, and the temperature of the primary cooling circuit.

[0054] S402: Determine the operating mode of the cooling system based on the load power, relevant temperature, and cooling pressure of the heat-generating components.

[0055] S403: Based on the operating mode, the cooling system is refrigeration controlled with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective.

[0056] The control method provided in this embodiment of the invention is applied to a controller in a control system. The controller is an electronic device, such as a PC or a server.

[0057] Prior to S401, there is a startup process in which the converter is powered on and the control system performs a self-test.

[0058] The load power of the heat-generating component in S401 above can be the inverter load power, denoted as Pload, obtained through communication with the inverter; the relevant temperature includes the temperature of the power module (an example of a heat-generating component) or the measured junction temperature or the estimated junction temperature, denoted as Tj, and also includes the ambient temperature, denoted as Tamb, which is collected by a temperature sensor; the cooling pressure includes the condensing pressure of the cooling circuit, denoted as Pcond, which is collected by a pressure sensor.

[0059] In one implementation, in step S402 above, the future heat load can be predicted based on the collected real-time data. This heat load can be used in subsequent steps to generate and send control commands to coordinately adjust the compressor frequency, the expansion valve opening, and the low-speed fan speed. When a preset quiet operation condition is met, the speed of the low-speed fan is preferentially reduced until it is turned off. This coordinated control process will be explained in subsequent steps. For example, it is determined whether Tamb is greater than the corresponding set threshold, or whether Tj is greater than the warning threshold, or whether Pload is greater than the corresponding set threshold. If any of these are true, the operating mode is determined to be active cooling mode; otherwise, the operating mode is determined to be natural cooling mode, also known as quiet mode. Using intelligent control in different control modes can reduce the cooling system's energy consumption by 20%-30% and improve the overall converter efficiency by approximately 0.5%.

[0060] In active cooling mode, the cooling cycle is initiated. Under normal operating conditions, the coolant in the cooling system absorbs heat from the IGBTs and transfers this heat to the refrigerant in the evaporator; the refrigerant then dissipates the heat to the cabin air in the condenser; the controller dynamically optimizes the parameters of each actuator. Even under extreme high-temperature conditions, such as when the Tamb reaches 50°C, the system can still maintain the coolant temperature below 35°C, ensuring the converter operates at full power. In one implementation, if the operating mode is active cooling mode, S403 may include the following steps: In active cooling mode, the cooling demand is calculated based on the relevant temperature and cooling pressure; Based on cooling requirements, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, a collaborative optimization algorithm is used to generate a control strategy that includes compressor frequency (represented as Fcomp), expansion valve opening (represented as OEXV), and DC fan base speed (represented as Nfan base). If the current period is a quiet period, the quiet priority sub-mode will be activated, which will reduce the speed of the DC fan group or control the DC fan group to run intermittently based on the DC fan's reference speed. If the current period is not a quiet period, maintain the speed of the Nfan base, output execution commands to control the operation of the primary circulation pump and the conduction between the three-way valve and the evaporator, and control the compressor, expansion valve and DC risk based on the control strategy.

[0061] After the control cycle is completed, we can wait for the next control cycle to return the acquisition results and continue the collaborative control of the next control cycle.

[0062] In natural cooling mode, the system is operating at low temperature or low load, under which natural cooling can maximize energy savings. In one implementation, if the operating mode is natural cooling mode, step S403 may include the following steps: In natural cooling mode, with the highest junction temperature of the heat-generating components as a constraint and the goal of minimizing the total energy consumption of the cooling system, the compressor is controlled to stop and the expansion valve is closed (i.e., the refrigeration core is shut down); the three-way valve is controlled to switch the bypass circuit (if the three-way valve exists); and then the primary circulation pump is controlled to run (at low speed). If the temperature Tj of the current heating component is within the set temperature range (safe temperature range), the DC fan group is turned off to achieve zero noise; otherwise, the DC fan group is started (at low speed).

[0063] After the control cycle is completed, we can wait for the next control cycle to return the acquisition results and continue the collaborative control of the next control cycle.

[0064] In this embodiment of the invention, the controller collects real-time data on IGBT junction temperature (estimated through a thermal model), coolant temperature, ambient temperature, and converter load power. Employing a model predictive control algorithm, it dynamically adjusts the compressor frequency, expansion valve opening, and fan speed to stabilize the IGBT junction temperature at its optimal value (e.g., 90℃±2℃), while maximizing the system's overall energy efficiency ratio. Furthermore, it automatically enters a "silent mode" at night or under low load, prioritizing operation at the lowest fan speed and compressor frequency. Therefore, this embodiment of the invention, based on intelligent decision-making with multi-parameter sensing and seamless multi-mode switching, not only achieves basic temperature closed-loop control but also achieves dynamic balance and optimization among multiple objectives such as "ultimate heat dissipation," "ultimate quietness," and "ultimate energy efficiency" by introducing multiple dimensions including ambient temperature, load power, and time strategies. This ensures that the system can select the most reasonable and economical operating strategy under any operating condition. Furthermore, during the control process, the concept of "active cooling, dual-loop coupling, and intelligent regulation" is utilized. Heat is collected through a primary loop, and the heat is actively enhanced through a vapor compression refrigeration loop to facilitate heat dissipation in high-temperature environments. Finally, heat is discharged through an optimized low-noise heat dissipation unit, and the entire process is coordinated by an intelligent brain to ultimately achieve the goal of quiet, efficient, and reliable cooling.

[0065] The following description combines embodiments 1 and 2 with a specific example. Figure 1 For example, the cooling system is applied to the generator-side converter of a 3MW doubly-fed wind turbine. The system mainly consists of a primary cooling circuit A, a vapor compression refrigeration circuit B, and an intelligent control system C. Compared to the traditional attempts to introduce TEC (thermal refrigeration) in some high-end scenarios, but whose cooling efficiency and power density are difficult to meet the heat dissipation requirements of MW (megawatt) level converters, this embodiment can fully demonstrate the applicability of this solution to MW-level converters.

[0066] In the primary cooling circuit A, insulating fluorinated liquid (model: 3M™ Fluorinert™ FC-770) is driven by a primary circulation pump and flows through a microchannel cold plate welded to the bottom of the IGBT module. The flow channels inside the cold plate are parallel microchannels with a hydraulic diameter of 0.8 mm. The fluorinated liquid, which absorbs heat and heats up, flows into a plate evaporator.

[0067] In vapor compression refrigeration circuit B, refrigerant R410A absorbs heat from the fluorinated liquid and evaporates in the evaporator. The low-temperature, low-pressure gaseous refrigerant is drawn into the variable frequency scroll compressor and compressed into a high-temperature, high-pressure gas, which then enters the plate condenser. In the condenser, the refrigerant releases heat to the air flowing outside and condenses into a high-pressure liquid. It then passes through an electronic expansion valve for throttling and pressure reduction, returning to a low-temperature, low-pressure two-phase gas-liquid state before returning to the evaporator to complete the cycle.

[0068] The condenser cooling unit includes a large-area aluminum fin heatsink brazed to the condenser and two 300mm diameter axial-flow low-speed fans. The fans use PWM speed control, have a rated speed of 600rpm, and the noise level at a distance of 1 meter from the fan when running at full speed is 42dB(A).

[0069] The core of the intelligent control system C is the PLC controller. The controller receives signals from temperature sensors attached near the IGBT modules, a fluorinated liquid temperature sensor at the evaporator outlet, an ambient temperature sensor in the tower, and high and low pressure sensors in the refrigeration circuit. The controller's built-in MPC algorithm predicts the heat load over a future period based on the current inverter load power (obtained from the main control system via communication) and ambient temperature, calculates the optimal control parameters in advance, and outputs control signals to the compressor's inverter, electronic expansion valve, primary circulation pump, and low-speed fan.

[0070] Work process: Normal cooling mode: The system starts when the ambient temperature is >25℃ or the predicted IGBT junction temperature is >80℃. The controller starts the circulation pump, starts the compressor to the base frequency, opens the electronic expansion valve to its initial opening, and adjusts the fan speed according to the condensing pressure. The system dynamically adjusts each component through real-time feedback to stably control the IGBT junction temperature within the optimal range of 90℃±5℃.

[0071] Silent / Natural Cooling Mode: At night or under low load (<30%) and with an ambient temperature <20℃, the controller enters "Silent Mode". First, the fan speed is reduced to the minimum maintenance speed (200rpm). If the condensing pressure remains below the set value, the fan is further shut off, and the compressor frequency is reduced. If heat can be completely dissipated through natural convection of the heat sink fins, the controller closes refrigeration circuit B and opens the bypass valve, allowing primary circuit A to circulate through the bypass pipe, achieving zero-noise cooling.

[0072] High-Temperature Full-Load Challenge: When the ambient temperature reaches 45℃ and the inverter is running at 100% load, traditional air cooling can no longer meet the heat dissipation requirements, and the inverter will derating. However, this system increases the compressor frequency through the controller to enhance the cooling capacity, while still keeping the refrigerant temperature below 40℃, ensuring that the inverter continues to operate at full capacity.

[0073] The results are verified as follows: Comparative tests were conducted on the same 3MW wind turbine platform using the converter of this invention: 1. The operating noise measured at a distance of 50 meters from the cabin was reduced by approximately 30 decibels.

[0074] 2. It can maintain full power output at an ambient temperature of 40℃, while air-cooled converters on the same platform need to be derated by 15%.

[0075] 3. The average annual failure rate (AFR) is expected to decrease by more than 40%.

[0076] This invention proposes a technical concept of "active cooling, dual-loop coupling, and intelligent control." The system includes a primary cooling loop, a vapor compression refrigeration loop, a condenser heat dissipation unit, and an intelligent control system. The primary loop absorbs heat from the converter power module through a microchannel cold plate; the refrigeration loop is coupled to the primary loop through an evaporator, actively "pumping" heat to the condenser; the condenser heat dissipation unit uses large-area fins and a low-speed fan to achieve low-noise heat dissipation; the intelligent control system coordinates the adjustment of the compressor, expansion valve, and fan according to the heat load and environmental conditions to achieve precise temperature control and energy efficiency optimization. This invention completely solves the core pain points of traditional air-cooled systems, such as high noise and poor high-temperature heat dissipation, achieving quieter, more efficient, and more reliable converter cooling, making it particularly suitable for wind power projects in noise-sensitive areas and high-temperature environments.

[0077] Example 3: Based on the same concept, embodiments of the present invention provide a schematic diagram of the control system of a cooling system integrating vapor compression refrigeration and liquid cooling technologies, including: The acquisition module is used to acquire the load power of the heat-generating component, the relevant temperature of the cooling system, and the refrigeration pressure; the relevant temperature includes the temperature of the heat-generating component of the wind turbine, the temperature of the external environment, and the temperature of the primary cooling circuit; The operating mode determination module is used to determine the operating mode of the cooling system based on the load power of the heating component, the relevant temperature, and the cooling pressure. The intelligent control module is used to perform refrigeration control of the cooling system based on the operating mode, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective.

[0078] In one possible implementation, the intelligent control module is specifically used to calculate the cooling demand based on the relevant temperature and the cooling pressure if the operating mode is an active cooling mode. Based on the aforementioned cooling requirements, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, a collaborative optimization algorithm is used to generate a control strategy that includes compressor frequency, expansion valve opening, and DC fan reference speed. If the current period is a quiet period, the speed of the DC fan assembly will be reduced based on the DC fan's reference speed. If the system is not currently in a quiet period, the operation of the primary circulation pump and the connection between the three-way valve and the evaporator are controlled, and the compressor, expansion valve, and DC risk are controlled based on the control strategy.

[0079] In one possible implementation, the intelligent control module is specifically configured to, if the operating mode is a natural cooling mode, control the compressor to stop and close the expansion valve, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as an objective; and then control the primary circulation pump to run. If the temperature of the current heating component is within the set temperature range, the DC fan group will be turned off; otherwise, the DC fan group will be turned on.

[0080] Example 4: Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Based on the above embodiments, this embodiment of the present invention also provides an electronic device, including a processor 601, a communication interface 602, a memory 603 and a communication bus 604, wherein the processor 601, the communication interface 602 and the memory 603 communicate with each other through the communication bus 604. The memory 603 stores a computer program, which, when executed by the processor 601, causes the processor 601 to perform the steps in the control method of the cooling system integrating vapor compression refrigeration and liquid cooling technology shown in the above embodiment.

[0081] The communication bus mentioned in the above electronic devices can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus can be divided into address bus, data bus, control bus, etc. For ease of illustration, only one thick line is used to represent it in the diagram, but this does not mean that there is only one bus or one type of bus.

[0082] The communication interface 602 is used for communication between the above-mentioned electronic device and other devices.

[0083] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device. Optionally, the memory may also be at least one storage device located remotely from the aforementioned processor.

[0084] The processors mentioned above can be general-purpose processors, including central processing units, network processors (NPs), etc.; they can also be digital signal processors (DSPs), application-specific integrated circuits, field-programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0085] Example 5: Based on the above embodiments, this invention also provides a computer-readable storage medium storing a computer program, which is processed by a processor to control the cooling system integrating vapor compression refrigeration and liquid cooling technologies described above.

[0086] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this invention or its equivalents are included in this invention.

[0087] The embodiments described in this invention are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or apparatuses.

[0088] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0089] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0090] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0091] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A cooling system integrating vapor compression refrigeration and liquid cooling technologies, characterized in that, include: Primary cooling circuit, vapor compression refrigeration circuit, and condenser heat dissipation unit; The primary cooling circuit is used to exchange heat with the heat-generating components of the wind turbine through a liquid cooling medium, so as to transfer the heat of the heat-generating components to the liquid cooling medium. The vapor compression refrigeration circuit is connected to the primary cooling circuit and is used to transfer the heat of the liquid cooling medium through phase change heat transfer. The condensation and heat dissipation unit is connected to the vapor compression refrigeration circuit and is used to discharge the heat released by the vapor compression refrigeration circuit to the external environment.

2. The system as described in claim 1, characterized in that, The primary cooling circuit includes: a primary circulation pipeline, and a liquid storage tank, a primary circulation pump, and a microchannel cold plate sequentially disposed on the primary circulation pipeline; The liquid storage tank contains the liquid cooling medium; The microchannel cold plate is attached to the surface of the heating element, and the microchannel cold plate has flow channels inside.

3. The system as described in claim 2, characterized in that, The primary cooling circuit also includes a three-way valve; the first end of the three-way valve is connected to the microchannel cold plate, the second end is connected to the liquid storage tank, and the third end is connected to the vapor compression refrigeration circuit.

4. The system as described in claim 2 or 3, characterized in that, The primary cooling circuit further includes: a thermal interface layer disposed between the heating component and the microchannel cold plate; the thermal interface layer is filled with a highly thermally conductive insulating material; the highly thermally conductive insulating material includes thermally conductive silicone grease, thermally conductive phase change material, or thermally conductive pad; The microchannel cold plate has a parallel microchannel array inside, and the hydraulic diameter of the microchannels ranges from 0.5mm to 1mm. The heating element is fixed to the microchannel cold plate by fastening bolts; a sealing ring is provided around the contact area between the heating element and the microchannel cold plate.

5. The system as described in claim 1, characterized in that, The vapor compression refrigeration circuit includes: a compressor, a condenser, an expansion valve, and an evaporator connected in sequence to form a closed loop; The evaporator is used to transfer heat from the liquid cooling medium.

6. The system as described in claim 5, characterized in that, The condensation and heat dissipation unit includes: a heat dissipation fin assembly and a DC fan assembly arranged along the cooling airflow direction; The heat dissipation fins are attached to the outer surface of the condenser; The DC fan assembly is located on one side of the heat dissipation fin assembly and is used to drive airflow through the fin gaps of the heat dissipation fin assembly to discharge the heat released by the vapor compression refrigeration circuit into the cabin air. The operating noise of the DC fan assembly is lower than that of a traditional air-cooled fan.

7. The method as described in claim 1, characterized in that, Also includes: Control system; the control system includes a temperature sensor, a pressure sensor, and a controller; The temperature sensor is used to detect the relevant temperatures of the cooling system; The pressure sensor is used to detect the refrigeration pressure of the cooling system; The controller is used to perform refrigeration control based on the relevant temperature and the refrigeration pressure.

8. A control method for a cooling system integrating vapor compression refrigeration and liquid cooling technologies, characterized in that, The method includes: The load power of the heat-generating components, the relevant temperature of the cooling system, and the refrigeration pressure are obtained; the relevant temperature includes the temperature of the heat-generating components of the wind turbine, the temperature of the external environment, and the temperature of the primary cooling circuit. The operating mode of the cooling system is determined based on the load power of the heat-generating component, the relevant temperature, and the cooling pressure. Based on the aforementioned operating mode, the cooling system is refrigeration controlled with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective.

9. The method as described in claim 8, characterized in that, If the operating mode is active cooling mode, then the cooling control of the cooling system based on the operating mode, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective, includes: In the active cooling mode, the cooling demand is calculated based on the relevant temperature and the cooling pressure; Based on the aforementioned cooling requirements, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, a collaborative optimization algorithm is used to generate a control strategy that includes compressor frequency, expansion valve opening, and DC fan reference speed. If the current period is a quiet period, the speed of the DC fan assembly will be reduced based on the DC fan's reference speed. If the system is not currently in a quiet period, the operation of the primary circulation pump and the connection between the three-way valve and the evaporator are controlled, and the compressor, expansion valve, and DC risk are controlled based on the control strategy.

10. The method as described in claim 8 or 9, characterized in that, If the operating mode is natural cooling mode, then the cooling control of the cooling system based on the operating mode, with the highest junction temperature of the heat-generating component as a constraint and minimizing the total energy consumption of the cooling system as the objective, includes: In the natural cooling mode, with the highest junction temperature of the heat-generating components as a constraint and minimizing the total energy consumption of the cooling system as the objective, the compressor is controlled to stop and the expansion valve is closed; then the primary circulation pump is controlled to run. If the temperature of the current heating component is within the set temperature range, the DC fan group will be turned off; otherwise, the DC fan group will be turned on.

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