A leveling device, motion platform and semiconductor equipment

Abstract

This application discloses a leveling device, a motion platform, and semiconductor equipment, relating to the field of semiconductor equipment technology. The leveling device includes a lifting assembly and a base, with the base installed at the bottom of the lifting assembly. The base has at least one channel extending to the bottom surface of the base, and this channel is used to fill an anchoring agent that adheres to the ground. The anchoring agent flows along the channel and diffuses outwards upon contact with the ground, filling the tiny gaps between the base and the ground caused by uneven processing or assembly from bottom to top. This effectively displaces air from these tiny gaps, ensuring the anchoring agent's filling effect and making the leveling device a rigid body with good contact with the ground. This results in the leveling device itself having a high fundamental frequency, enabling stable load bearing on the motion mechanism and improving the problem of insufficient rigidity of the motion platform caused by uneven contact between the leveling device and the ground.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a leveling device, a motion platform, and semiconductor equipment. Background Technology

[0002] As semiconductor manufacturing technology advances towards more advanced processes, process equipment and measurement equipment place higher demands on the precision and stability of motion mechanisms. Motion deviations caused by environmental disturbances have become a significant factor. Vibration, as a core disturbance source, easily induces resonance in mechanical structures, interfering with positioning and measurement processes, thus impacting process results in multiple ways.

[0003] As the foundational platform supporting the motion mechanism, the performance of the motion platform is the cornerstone affecting the overall motion control accuracy. If the mounting surface of the motion platform is uneven, relevant technologies use leveling devices to level the platform's legs. However, if the leveling device cannot be adjusted due to uneven contact with the ground, it leads to insufficient rigidity of the motion platform, introducing vibration, error, and stability issues, thereby limiting the overall performance ceiling of the motion mechanism. Summary of the Invention

[0004] This application discloses a leveling device, a motion platform, and a semiconductor device, which improves the problem of insufficient rigidity of the motion platform caused by uneven contact between the leveling device and the ground.

[0005] In a first aspect, this application provides a leveling device, including a lifting assembly and a base, wherein the base is installed at the bottom of the lifting assembly; The base has at least one channel extending to the bottom surface of the base, and the at least one channel is used to fill the anchoring agent that is bonded to the ground.

[0006] In this embodiment, the lifting assembly of the leveling device is used to level the legs of the motion platform. The base of the leveling device is installed at the bottom of the lifting assembly and is used to contact the ground. The base has at least one channel that extends to the bottom surface of the base and is used to fill the anchoring agent that is bonded to the ground. The anchoring agent flows along the channel and diffuses to the ground after contacting the ground, filling the tiny gaps between the base and the ground caused by uneven processing or assembly from bottom to top. This effectively displaces the air in the tiny gaps, improves the filling effect of the anchoring agent on the tiny gaps, and makes the leveling device and the ground a rigid body with good contact. As a result, the leveling device itself has a high fundamental frequency, which can stably support the motion mechanism and improve the problem of insufficient rigidity of the motion platform caused by uneven contact between the leveling device and the ground.

[0007] In one possible implementation, the anchoring agent is an epoxy resin, a light-cured acrylate, or a cyanoacrylate.

[0008] In this embodiment, since the anchoring agent is liquid before it is cured, it will spread outwards after flowing along the channel to the ground, effectively displacing the air in the tiny gaps. After the anchoring agent is cured, it forms a good contact between the base and the ground, improving the overall rigidity of the leveling device.

[0009] In one possible implementation, the number of channels is multiple; At least two of the multiple channels extend in different directions; And / or, each of the multiple channels includes an outlet located on the bottom surface of the base, and at least one outlet is equidistant from at least two adjacent outlets.

[0010] In this embodiment, since there are multiple channels, anchoring agent can be injected into different areas of the base through multiple channels, improving the injection efficiency and filling range of the anchoring agent. Because at least two channels extend in different directions, the anchoring agent injected from different channels can flow and diffuse directionally towards different areas and angles inside the base. Since multiple outlets are located on the bottom surface of the base, and at least one outlet is equidistant from two adjacent outlets, the outlets are evenly distributed on the bottom surface, reducing blank areas caused by uneven outlet distribution.

[0011] In one possible implementation, the base includes a main body and an extension connected to the edge of the main body. The main body is mounted on the bottom of the lifting assembly, and the extension has mounting holes for a connector to pass through. At least one of a plurality of channels is located in the main body and at least one of the plurality of channels is located in the extension.

[0012] In this embodiment, since the outer extension of the base has mounting holes for the connector, the base can be fixed to the ground through the connector. Since at least one of the multiple channels is located in the outer extension, liquid anchoring agent can be injected into the outer extension area through the channel located in the outer extension. Since at least one of the multiple channels is located in the main body, anchoring agent can be injected into the base area through the channel in the main body, thereby improving the reliability of the fixation between the base and the ground and the vibration resistance.

[0013] In one possible implementation, the lifting assembly includes a lifting platform, a first guide column, a wedge block, and a drive mechanism; The lifting platform and the base are positioned opposite each other; One end of the first guide column is sleeved with the lifting platform, and the other end is sleeved with the base; The wedge block is fitted onto the first guide post, and the wedge block is located between the base and the lifting platform; The drive mechanism is connected to the wedge block to drive the wedge block to move in a direction perpendicular to the axis of the first guide post.

[0014] In this embodiment, since the wedge block is located between the base and the lifting platform, and one end of the first guide post is sleeved with the lifting platform and the other end is sleeved with the base, after the drive mechanism moves the wedge block in a direction perpendicular to the axis of the first guide post, it can drive the lifting platform to move relative to the base in the extension direction of the first guide post, thereby driving the legs of the motion platform to move in the extension direction of the first guide post, so as to achieve leveling of the legs of the motion platform. Moreover, the first guide post can not only guide the lifting movement of the lifting platform relative to the base, but also guide the movement of the wedge block sleeved on it in a direction perpendicular to the axis of the first guide post. That is, the same first guide post can guide both the lifting platform and the wedge block, making the structure of the lifting assembly more compact.

[0015] In one possible implementation, the wedge block has a first inclined surface and a second inclined surface that are symmetrical to each other. The first inclined surface is located on the side of the wedge block facing the base, and the second inclined surface is located on the side of the wedge block facing the lifting platform. The base is provided with a third inclined surface that is adapted to the first inclined surface; The lifting platform is equipped with a fourth inclined plane that is compatible with the second inclined plane.

[0016] In this embodiment, since the wedge block has a first inclined surface and a second inclined surface that are symmetrical to each other, and the first inclined surface is adapted to the third inclined surface of the base and the second inclined surface is adapted to the fourth inclined surface of the lifting platform, when the wedge block moves in a direction perpendicular to the axis of the first guide post, a relative sliding fit is generated between the first inclined surface and the third inclined surface, and between the second inclined surface and the fourth inclined surface. The vertical components of the first inclined surface and the second inclined surface are converted into the lifting displacement of the lifting platform along the extension direction of the first guide post, thereby obtaining a larger lifting stroke under the same horizontal driving stroke, thereby improving the motion efficiency of the lifting platform.

[0017] In one possible implementation, the drive mechanism includes a worm shaft, a worm wheel, and a worm. One end of the worm gear shaft is connected to the wedge block, and the other end is fixedly connected to the worm gear. The worm gear shaft is also threadedly connected to the first guide post. The worm meshes with the worm wheel, and the lead angle of the worm is smaller than the equivalent friction angle of its meshing tooth surface.

[0018] In this embodiment, because one end of the worm gear shaft is connected to the wedge block and the other end is fixedly connected to the worm gear, and the worm gear shaft is threadedly connected to the first guide post, when the worm rotates, the rotational motion is transmitted to the worm gear shaft through the meshing of the worm and the worm gear, causing the worm gear shaft to rotate relative to the first guide post. This, in turn, causes the wedge block to move in a direction perpendicular to the axial direction of the first guide post. The worm gear mechanism can achieve high-precision, high-load fine-tuning. Because the worm and the worm gear mesh, and the lead angle of the worm is less than the equivalent friction angle of its meshing tooth surface, the frictional torque is always greater than the reverse driving torque, thereby preventing the worm gear from driving the worm to rotate, achieving reliable self-locking, and improving the safety and positioning stability of the leveling device.

[0019] In one possible implementation, a second guide post is also included; The base has a first abutting surface located on the side of the base facing the lifting platform, and the lifting platform has a second abutting surface that matches the first abutting surface.

[0020] The axis of the second guide post is parallel to the axis of the first guide post. The second guide post is located on the first abutting surface. The second abutting surface has a first guide hole corresponding to the second guide post. The first guide hole is used for the second guide post to pass through.

[0021] In this embodiment, since the base has a first abutment surface and the lifting platform has a second abutment surface adapted to the first abutment surface, the lowest position of the lifting platform can be limited by the contact between the first abutment surface and the second abutment surface. Since the axis of the second guide post is parallel to the axis of the first guide post, and the second guide post is disposed on the first abutment surface, and the second abutment surface has a first guide hole corresponding to the second guide post, the second guide post and the first guide hole form a sliding fit during the lifting process of the lifting platform, which can improve the guiding accuracy of the lifting platform's movement.

[0022] In one possible implementation, a fixing plate and a fastener are also included; The fixing plate is connected to either the base or the lifting platform. The fixing plate is provided with an oblong hole, the length direction of which is parallel to the axis direction of the first guide column. The other of the base and the lifting platform is provided with a connecting round hole corresponding to the oblong hole. The fastener is detachably connected to the oblong hole and the connecting round hole.

[0023] In this embodiment, since the fixing plate is connected to either the base or the lifting platform, and the fixing plate is provided with an oblong hole whose length direction is parallel to the axis of the first guide column, while the other of the base and the lifting platform is provided with a connecting round hole corresponding to the oblong hole, the oblong hole can remain aligned with the connecting round hole when the base and the lifting platform move relative to each other along the axis of the first guide column. After the lifting platform moves into position, the base and the lifting platform can be locked by connecting the fixing member to the oblong hole and the connecting round hole, so that the entire leveling device is in a stable state.

[0024] Secondly, this application provides a motion platform, comprising: The motion mechanism and multiple legs; and As provided in any of the above embodiments, the leveling device has multiple legs supporting the motion mechanism, and the bottom of each of the multiple legs is equipped with a leveling device.

[0025] In this embodiment, since each of the multiple support legs is equipped with a leveling device at its bottom, the height of each support leg can be adjusted by the leveling device, so that the multiple support legs can work together to adjust the motion mechanism to a stable state, improve the vibration and uneven stress distribution caused by uneven ground, thereby improving the operating accuracy and overall service life of the motion mechanism.

[0026] Thirdly, this application provides a semiconductor device, comprising: Chuck; and As provided in the above embodiments, the chuck is mounted on the motion platform.

[0027] In this embodiment, the motion platform provides a stable and reliable support base for the chuck by adjusting the mounting plane with high precision through multiple leveling devices at its bottom. This effectively reduces process or quantity inspection deviations caused by the tilt of the mounting plane, thereby improving chip manufacturing yield or inspection accuracy. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of a semiconductor device according to an embodiment of this application; Figure 2 This is a schematic diagram of the motion platform according to an embodiment of this application; Figure 3This is a schematic diagram of the leveling device according to an embodiment of this application; Figure 4 This is an exploded view of the leveling device according to an embodiment of this application; Figure 5 This is a schematic diagram of the leveling device according to an embodiment of this application from another perspective; Figure 6 for Figure 5 A sectional view along line AA. Figure 7 This is a bottom view of the leveling device according to an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures: 1-Leveling device; 10-Lifting assembly; 101-Lifting platform; 102-First guide column; 103-Wedge block; 104-Drive mechanism; 105-Second guide column; 106-Third guide column; 1011 - Fourth inclined surface; 1012 - Second contact surface; 1031 - First inclined surface; 1032 - Second inclined surface; 1041 - Outer shell; 1042 - Worm gear shaft; 1043 - Worm gear; 1044 - Worm; 20 - Base; 201 - Channel; 202 - Main body; 203 - Extension; 2021 - Third inclined surface; 2022 - First abutment surface; 2031 - Mounting hole; 30 - First oil-free bushing; 40 - Second oil-free bushing; 50 - Third oil-free bushing; 60 - Fourth oil-free bushing; 70-Fixed plate; 701 - Waist-shaped hole; 80-Fasteners; 2-Motor mechanism; 3-Feet; 4-Semiconductor equipment. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] In the semiconductor manufacturing field, process equipment and measurement and testing equipment place higher demands on the precision and stability of motion mechanisms. Motion deviations caused by environmental disturbances have become a significant factor. As the foundational platform supporting the motion mechanism, the performance of the motion platform is the cornerstone of the overall motion control precision. If the motion platform's contact with the ground mounting surface is uneven, related technologies use leveling devices to level the platform's legs. However, if the leveling device cannot adjust for uneven contact with the ground, it leads to insufficient rigidity of the motion platform, introducing vibration, error, and stability issues, thus limiting the overall performance ceiling of the motion mechanism.

[0034] Based on this, this application provides a leveling device, a motion platform, and a semiconductor device to improve the problem of insufficient rigidity of the motion platform caused by uneven contact between the leveling device and the ground.

[0035] In the description of this invention, it should be understood that the terms "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this invention.

[0036] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0037] Please see Figure 1 and Figure 2 ,in, Figure 1 This is a schematic diagram of the structure of a semiconductor device according to an embodiment of this application; Figure 2 This is a schematic diagram of the motion platform according to an embodiment of this application. The semiconductor device 4 includes a motion platform and a chuck mounted on the motion platform. The motion platform includes a motion mechanism 2, multiple support legs 3 for supporting the motion mechanism 2, and a leveling device 1 disposed at the bottom of each support leg 3. The leveling device 1 can adjust the height of the support legs 3, so that multiple support legs 3 can work together to adjust the motion mechanism 2 to a stable state, improving vibration and uneven stress distribution caused by uneven ground, thereby improving the operating accuracy and overall service life of the motion mechanism 2. This also provides a stable and reliable bearing base for the chuck, effectively reducing process or quantity detection deviations caused by tilted mounting planes, thereby improving chip manufacturing yield or detection accuracy.

[0038] Please continue reading. Figure 2 And see Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 ,in, Figure 3 This is a schematic diagram of the leveling device according to an embodiment of this application; Figure 4 This is an exploded view of the leveling device according to an embodiment of this application; Figure 5 This is a schematic diagram of the leveling device according to an embodiment of this application from another perspective; Figure 6 for Figure 5 A sectional view along line AA. Figure 7 This is a bottom view of the leveling device according to an embodiment of this application.

[0039] In embodiment 1, this application provides a leveling device 1, including a lifting assembly 10 and a base 20. The base 20 is installed at the bottom of the lifting assembly 10. At least one channel 201 is provided within the base 20, extending to the bottom surface of the base 20. The bottom surface of the base 20 is located on the side of the base 20 supported by the ground. The at least one channel 201 is used to fill an anchoring agent that adheres to the ground. The channel 201 refers to a hole or channel formed inside the base 20 to guide the flow of the anchoring agent. Each channel 201 can be a straight hole, a curved hole, or a branch hole, and the cross-sectional shape of the channel 201 can be circular, elliptical, or polygonal. The inlet of the channel 201 can be located on the side or top surface of the base 20 for easy injection of the anchoring agent, and the outlet of the channel 201 is located on the bottom surface of the base 20 to guide the anchoring agent to the contact area between the base 20 and the ground. Anchoring agent refers to the material that is filled between channel 201 and base 20 and the ground, and which bonds base 20 to the ground as a whole after curing. The anchoring agent has appropriate fluidity when injected into channel 201, can fill tiny gaps, and has high strength and rigidity after curing.

[0040] The lifting assembly 10 of the leveling device 1 is used to level the support legs 3 of the motion platform. The base 20 of the leveling device 1 is installed at the bottom of the lifting assembly 10 and is used to contact the ground. The base 20 has at least one channel 201 that extends to the bottom surface of the base 20 and is used to fill the anchoring agent that is bonded to the ground. The anchoring agent flows along the channel 201 and diffuses to the surroundings after contacting the ground. It fills the tiny gaps between the base 20 and the ground caused by uneven processing or assembly from bottom to top, thereby effectively displacing the air in the tiny gaps and improving the filling effect of the anchoring agent on the tiny gaps. This makes the leveling device 1 a rigid body with good contact with the ground, so that the leveling device 1 itself has a high fundamental frequency, which can stably support the motion mechanism 2 and improve the problem of insufficient rigidity of the motion platform caused by uneven contact between the leveling device 1 and the ground.

[0041] In one possible implementation, the anchoring agent is epoxy resin, UV-cured acrylate, or cyanoacrylate. Since the anchoring agent is liquid before curing, it flows along channel 201 to the ground and then diffuses outwards, effectively displacing air from tiny gaps. After curing, the anchoring agent creates good contact between the base and the ground, improving the continuity and overall rigidity of the contact surface, enhancing the anti-vibration capability of the leveling device 1, and enabling the motion platform to operate stably under high-precision conditions.

[0042] In one possible implementation, there are multiple channels 201. Throughout the text, "multiple" refers to at least two. Because there are multiple channels 201, anchoring agent can be injected into different areas of the base 20 through multiple channels 201, improving the injection efficiency and filling range of the anchoring agent, reducing inadequate filling problems caused by blockage or insufficient flow in a single channel 201, thereby making the connection between the base 20 and the ground more uniform and reliable. At least two of the multiple channels 201 extend in different directions. Because at least two channels 201 extend in different directions, the anchoring agent injected from different channels 201 can flow and diffuse directionally towards different areas and angles inside the base 20, effectively covering all corners of the bottom surface of the base 20, increasing the contact area between the anchoring agent and the ground, and thus improving the overall connection rigidity of the base 20. Each of the multiple channels 201 includes an outlet located on the bottom surface of the base 20, and at least one outlet is equidistant from at least two adjacent outlets. Since multiple outlets are located on the bottom surface of the base 20, and at least one outlet is equidistant from two adjacent outlets, the outlets are distributed as evenly as possible on the bottom surface, effectively reducing blank areas caused by uneven outlet distribution. The distribution of the outlets of the channel 201 on the bottom surface of the base 20 can be adjusted according to the shape of the bottom surface of the base 20. For example, when the bottom surface of the base 20 is a square or rectangular structure, the outlets of the channel 201 can be arranged in an array on the bottom surface of the base 20 to achieve full coverage; when the bottom surface of the base 20 is a circular structure, the outlets of the channel 201 can be arranged in a circle on the bottom surface of the base 20 to achieve centrally symmetrical filling.

[0043] Please continue reading. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7In one possible implementation, the base 20 includes a main body 202 and an extension 203 connected to the edge of the main body 202. The main body 202 refers to the main load-bearing part of the base 20 and is installed at the bottom of the lifting assembly 10. The extension 203 refers to the part of the base 20 that extends outward from the edge of the main body 202. The extension 203 has mounting holes 2031 for inserting connectors. The mounting holes 2031 can be, but are not limited to, threaded holes or through holes that penetrate the extension 203. The connectors can be, but are not limited to, screws or bolts. One end of the connector passes through the mounting hole 2031 and is connected to the ground. There can be multiple mounting holes 2031, and the multiple mounting holes 2031 are spaced apart on the extension 203. The number of connectors is consistent with the number of mounting holes 2031, so as to achieve stable fixation of the base 20 while effectively dispersing stress. At least one of the multiple channels 201 is located in the main body 202. Because at least one of the multiple channels 201 is located in the main body 202, anchoring agent can be injected into the base 20 region through the channel 201 in the main body 202, improving the reliability of the fixation between the base 20 and the ground and its vibration resistance. At least one of the multiple channels 201 is located in the extension 203. Because at least one of the multiple channels 201 is located in the extension 203, liquid anchoring agent can be injected into the extension 203 region through the channel 201 located in the extension 203. The main body 202 and the extension 203 each have independent anchoring agent injection channels 201, allowing anchoring agent to be injected into the regions below the main body 202 and below the extension 203, respectively. Since the outer extension 203 of the base 20 has mounting holes 2031 for the connector to pass through, the base 20 can be fixed to the ground through the connector. The channel 201 located in the outer extension 203 can, but is not limited to, correspond to the mounting hole 2031, so that the anchoring agent not only fills the gap between the bottom surface of the outer extension 203 and the ground, but also penetrates along the inner wall of the mounting hole 2031 into the gap between the connector and the hole wall of the mounting hole 2031, thereby forming a continuous anchoring layer around the connector. By wrapping a part of the connector in the anchoring agent, the connector, the base 20 and the ground can form a three-in-one rigid connection through the anchoring agent, which significantly enhances the pull-out resistance and fretting resistance of the connector.

[0044] In one possible implementation, the lifting assembly 10 includes a lifting platform 101, a first guide post 102, a wedge block 103, and a drive mechanism 104. The lifting platform 101 and the base 20 are disposed opposite each other in the height direction. The lifting platform 101 has a first fixing hole that extends through the lifting platform 101 in the height direction, and a first oil-free bushing 30 is disposed within the first fixing hole. The base 20 has a second fixing hole that is opposite to and coaxial with the first fixing hole, extending through the base 20 in the height direction, and a second oil-free bushing 40 is disposed within the second fixing hole. The first guide post 102 extends in the height direction, with one end engaging with the first oil-free bushing 30 on the lifting platform 101 and the other end engaging with the second oil-free bushing 40 on the base 20. This allows the lifting platform 101 to slide relative to the first guide post 102, providing guidance for the lifting movement of the lifting platform 101 relative to the base 20. The wedge block 103 is provided with a first clearance hole for the first guide post 102 to pass through, so that the wedge block 103 is fitted onto the first guide post 102. The first clearance hole extends in a direction perpendicular to the axis of the first guide post 102, so as to guide the movement of the wedge block 103 in a direction perpendicular to the axis of the first guide post 102. The same first guide post 102 can be used to guide the lifting platform 101 and the wedge block 103 respectively, making the structure of the lifting assembly 10 more compact. The wedge block 103 is located between the base 20 and the lifting platform 101. The drive mechanism 104 is connected to the wedge block 103 to drive the wedge block 103 to move in a direction perpendicular to the axis of the first guide post 102. Since the wedge block 103 is located between the base 20 and the lifting platform 101, and one end of the first guide post 102 is sleeved with the lifting platform 101 and the other end is sleeved with the base 20, after the drive mechanism 104 drives the wedge block 103 to move in a direction perpendicular to the axis of the first guide post 102, it can drive the lifting platform 101 to move relative to the base 20 in the extension direction of the first guide post 102, thereby driving the support leg 3 of the motion platform to move in the extension direction of the first guide post 102, so as to achieve leveling of the support leg 3 of the motion platform.

[0045] Please continue reading. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7In one possible implementation, the wedge block 103 has a first inclined surface 1031 and a second inclined surface 1032 that are symmetrically arranged. The angles between the first inclined surface 1031 and the second inclined surface 1032 and the height direction are both acute angles. The first inclined surface 1031 is located on the side of the wedge block 103 facing the base 20, and the second inclined surface 1032 is located on the side of the wedge block 103 facing the lifting platform 101. The base 20 has a third inclined surface 2021 that is adapted to the first inclined surface 1031. By sliding the first inclined surface 1031 relative to the third inclined surface 2021, the wedge block 103 can be moved relative to the base 20 in the height direction. The lifting platform 101 has a fourth inclined surface 1011 that is adapted to the second inclined surface 1032. By sliding the second inclined surface 1032 relative to the fourth inclined surface 1011, the lifting platform 101 can be moved relative to the wedge block 103 in the height direction. Since the wedge block 103 is provided with a first inclined surface 1031 and a second inclined surface 1032 that are symmetrical to each other, and the first inclined surface 1031 is adapted to the third inclined surface 2021 of the base 20, and the second inclined surface 1032 is adapted to the fourth inclined surface 1011 of the lifting platform 101, when the wedge block 103 moves in a direction perpendicular to the axis of the first guide post 102, a relative sliding fit is generated between the first inclined surface 1031 and the third inclined surface 2021, and between the second inclined surface 1032 and the fourth inclined surface 1011. The vertical components of the first inclined surface 1031 and the second inclined surface 1032 are converted into the lifting displacement of the lifting platform 101 along the extension direction of the first guide post 102, thereby obtaining a larger lifting stroke under the same horizontal driving stroke, thereby improving the motion efficiency of the lifting platform 101.

[0046] Please continue reading. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7In one possible implementation, the drive mechanism 104 includes a housing 1041, a worm gear shaft 1042, a worm gear 1043, and a worm 1044; one end of the worm gear shaft 1042 is connected to the wedge block 103. For example, the wedge block 103 has a bearing or bushing inside, and one end of the worm gear shaft 1042 is connected to the bearing, so that the worm gear shaft 1042 can rotate relative to the wedge block 103 about its own axis, and the other end of the worm gear shaft 1042 is fixedly connected to the worm gear 1043. The worm gear shaft 1042 has an external thread on its outer circumference, and the first guide post 102 has a threaded hole. The external thread is connected to the threaded hole, so that the worm gear shaft 1042 and the first guide post 102 are threadedly connected. When the worm gear shaft 1042 rotates around its own axis, it can move relative to the first guide post 102 in the axial direction of the worm gear shaft 1042. The worm gear shaft 1042 and the first guide post 102 are connected by a thread, and the thread has a self-locking characteristic. That is, the helix angle of the thread pair is less than the equivalent friction angle between their contact surfaces. When the first guide post 102 is subjected to axial thrust or vibration, the axial force cannot drive the worm gear shaft 1042 to rotate in the opposite direction relative to the first guide post 102, so that the worm gear shaft 1042 and the first guide post 102 will not loosen and disengage. The outer casing 1041 is connected to the wedge block 103. The worm 1044 is rotatably disposed inside the outer casing 1041 and meshes with the worm wheel 1043. By rotating the worm 1044 around its own axis, it can drive the worm wheel 1043 and the worm wheel shaft 1042 to rotate synchronously around the axis of the worm wheel shaft 1042. The first guide post 102 is fixed to the base 20, causing the worm wheel shaft 1042 to move relative to the first guide post 102 in the axial direction of the worm wheel shaft 1042, thereby moving the worm wheel shaft 1042 with the wedge block 103. The lead angle of the worm 1044 is smaller than the equivalent friction angle of its meshing tooth surface, resulting in the frictional torque between the tooth surfaces always being greater than the reverse driving torque, thus forming a frictional self-locking mechanism that prevents the worm wheel 1043 from driving the worm 1044 to rotate.

[0047] In this embodiment, because one end of the worm gear shaft 1042 is connected to the wedge block 103 and the other end is fixedly connected to the worm gear 1043, and the worm gear shaft 1042 is threadedly connected to the first guide post 102, when the worm 1044 rotates, the rotational motion is transmitted to the worm gear shaft 1042 through the meshing of the worm 1044 and the worm gear 1043, causing the worm gear shaft 1042 to rotate relative to the first guide post 102, thereby causing the wedge block 103 to move linearly in a direction perpendicular to the axial direction of the first guide post 102. The worm gear mechanism can achieve high-precision, high-load fine-tuning. Because the worm 1044 meshes with the worm gear 1043, and the lead angle of the worm 1044 is less than the equivalent friction angle of its meshing tooth surface, the friction torque is always greater than the reverse driving torque, thereby preventing the worm gear 1043 from driving the worm 1044 to rotate, achieving reliable self-locking and improving the safety and positioning stability of the leveling device 1. High-precision, large-load fine-tuning in the height direction can be achieved through a worm gear mechanism, a threaded connection between the worm gear shaft 1042 and the second guide post 105, and a wedge block 103 with symmetrical inclined surfaces. Load capacity parameter design. It can be done Calculations show that the vertical movement distance h of the worm gear 1044 when it rotates 1° can be achieved through... The calculation yielded the results; among which, as shown in the appendix... Figure 6 As shown, The force applied to the lifting platform 101 by the wedge block 103 N The component in the height direction, The force applied to the lifting platform 101 by the wedge block 103 N In the horizontal direction, T is the input torque of the worm 1044; i is the worm gear transmission ratio; η is the transmission efficiency; K is the torque coefficient; d is the screw diameter; S is the screw pitch; θ is the angle between the first inclined plane 1031 or the second inclined plane 1032 and the axis of the worm gear shaft 1042; and Φ is the friction angle.

[0048] Please continue reading. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7In one possible implementation, the base 20 has a first abutment surface 2022 located on the side of the base 20 facing the lifting platform 101, and the lifting platform 101 has a second abutment surface 1012 adapted to the first abutment surface 2022. Since the base 20 has the first abutment surface 2022 and the lifting platform 101 has the second abutment surface 1012 adapted to the first abutment surface 2022, the abutment between the first abutment surface 2022 and the second abutment surface 1012 can limit the lowest position of the lifting platform 101. The drive mechanism 104 also includes a second guide post 105, the axis of which is parallel to the axis of the first guide post 102. The second guide post 105 is located on the first abutment surface 2022. If the first abutment surface 2022 has a third fixing hole, the second guide post 105 and the third fixing hole are interference-fitted. The number of second guide posts 105 can be set to two. The second abutment surface 1012 has a first guide hole corresponding to the second guide post 105. A third oil-free bushing 50 is provided in the first guide hole. The first guide hole is used for the second guide post 105 to pass through, so as to realize the sliding of the lifting platform 101 relative to the second guide post 105. Since the axis of the second guide post 105 is parallel to the axis of the first guide post 102, and the second guide post 105 is set on the first abutment surface 2022, and the second abutment surface 1012 has a first guide hole corresponding to the second guide post 105, during the lifting process of the lifting platform 101, the second guide post 105 and the third oil-free bushing 50 in the first guide hole form a sliding fit, which can improve the guiding accuracy of the movement of the lifting platform 101.

[0049] In one possible implementation, a fourth fixing hole is provided on the third inclined surface 2021. The drive mechanism 104 also includes a third guide post 106, the axis of which is parallel to the axis of the first guide post 102. The third guide post 106 and the fourth fixing hole are interference-fitted to fix the third guide post 106 relative to the base 20. The wedge block 103 is provided with a second clearance hole for the third guide post 106 to pass through. The second clearance hole has a certain length in the axial direction of the worm gear shaft 1042 to reduce interference between the wedge block 103 and the third guide post 106 when the wedge block 103 moves. The fourth inclined surface 1011 of the lifting platform 101 is provided with a second guide hole corresponding to the third guide post 106. A fourth oil-free bushing 60 is provided in the second guide hole. The third guide post 106 and the fourth oil-free bushing 60 in the second guide hole form a sliding fit. During the lifting process of the lifting platform 101, the guiding accuracy of the movement of the lifting platform 101 can be improved.

[0050] Please continue reading. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7In one possible implementation, the leveling device 1 further includes a fixing plate 70 and a fixing member 80. The fixing plate 70 is connected to either the base 20 or the lifting platform 101, and this connection method can be, but is not limited to, using bolts or screws. The fixing plate 70 is provided with an oblong hole 701, the length direction of which is parallel to the axial direction of the first guide post 102. The other of the base 20 and the lifting platform 101 is provided with a connecting round hole corresponding to the oblong hole 701. The fixing member 80 is detachably connected to the oblong hole 701 and the connecting round hole. The fixing member 80 can be, but is not limited to, bolts or screws. Loosening the fixing member 80 allows the fixing plate 70 to move relative to the fixing member 80 in the axial direction of the first guide post 102. Since the fixing plate 70 is connected to either the base 20 or the lifting platform 101, and the fixing plate 70 has an oblong hole 701 whose length direction is parallel to the axis of the first guide post 102, and the other of the base 20 and the lifting platform 101 has a connecting round hole corresponding to the oblong hole 701, when the base 20 and the lifting platform 101 move relative to each other along the axis of the first guide post 102, the oblong hole 701 can remain corresponding to the connecting round hole. After the lifting platform 101 moves into place, the fixing member 80 can be connected to the oblong hole 701 and the connecting round hole to lock the base 20 and the lifting platform 101, so that the entire leveling device 1 is in a stable state.

[0051] Please continue reading. Figure 2 In embodiment two, this application provides a motion platform, including a motion mechanism 2, multiple support legs 3, and a leveling device 1 as provided in any of the above embodiments. The multiple support legs 3 support the motion mechanism 2, and the leveling device 1 is installed at the bottom of each of the multiple support legs 3. Since the leveling device 1 is installed at the bottom of each of the multiple support legs 3, the height of each support leg 3 can be adjusted by the leveling device 1, so that the multiple support legs 3 can work together to adjust the motion mechanism 2 to a stable state, improve the vibration and uneven stress distribution caused by uneven ground, thereby improving the operating accuracy and overall service life of the motion mechanism 2.

[0052] Please continue reading. Figure 1 In embodiment three, this application provides a semiconductor device 4, which can be a process equipment or a measurement and inspection equipment, specifically including a motion platform and a chuck as provided in the above embodiments; the chuck is mounted on the motion platform. Because the motion platform uses multiple leveling devices 1 at its bottom to perform high-precision adjustment of the mounting plane, it provides a stable and reliable support foundation for the chuck, effectively reducing process or measurement and inspection deviations caused by the tilt of the mounting plane, thereby improving chip manufacturing yield or inspection accuracy.

[0053] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0054] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0055] The foregoing preferred embodiments have further illustrated the objectives, technical solutions, and advantages of the present invention. It should be understood that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A leveling device, characterized in that, It includes a lifting assembly and a base, wherein the base is mounted on the bottom of the lifting assembly; The base has at least one channel extending to the bottom surface of the base, and the at least one channel is used to fill the anchoring agent that is bonded to the ground.

2. The leveling device according to claim 1, characterized in that, The anchoring agent is epoxy resin, UV-cured acrylate, or cyanoacrylate.

3. The leveling device according to claim 1 or 2, characterized in that, The number of channels is multiple; At least two of the plurality of channels extend in different directions; And / or, each of the plurality of channels includes an outlet located on the bottom surface of the base, and at least one of the outlets is equidistant from at least two adjacent outlets.

4. The leveling device according to claim 3, characterized in that, The base includes a main body and an extension connected to the edge of the main body. The main body is mounted on the bottom of the lifting assembly. The extension has a mounting hole for a connector to pass through. At least one of the plurality of channels is located in the main body, and at least one of the plurality of channels is located in the extension.

5. The leveling device according to any one of claims 1 to 4, characterized in that, The lifting assembly includes a lifting platform, a first guide column, a wedge block, and a drive mechanism; The lifting platform is positioned opposite to the base. One end of the first guide column is sleeved with the lifting platform, and the other end is sleeved with the base; The wedge block is sleeved on the first guide post, and the wedge block is located between the base and the lifting platform; The drive mechanism is connected to the wedge block to drive the wedge block to move in a direction perpendicular to the axis of the first guide post.

6. The leveling device according to claim 5, characterized in that, The wedge block has a first inclined surface and a second inclined surface that are symmetrical to each other. The first inclined surface is located on the side of the wedge block facing the base, and the second inclined surface is located on the side of the wedge block facing the lifting platform. The base is provided with a third inclined surface that is adapted to the first inclined surface; The lifting platform is provided with a fourth inclined surface that is adapted to the second inclined surface.

7. The leveling device according to claim 5 or 6, characterized in that, The drive mechanism includes a worm shaft, a worm wheel, and a worm. One end of the worm gear shaft is connected to the wedge block, and the other end is fixedly connected to the worm gear. The worm gear shaft is also threadedly connected to the first guide post. The worm meshes with the worm wheel, and the lead angle of the worm is smaller than the equivalent friction angle of its meshing tooth surface.

8. The leveling device according to any one of claims 5 to 7, characterized in that, It also includes a second guide post; The base is provided with a first abutting surface, which is located on the side of the base facing the lifting platform. The lifting platform is provided with a second abutting surface that is adapted to the first abutting surface. The axis of the second guide post is parallel to the axis of the first guide post. The second guide post is disposed on the first abutting surface. The second abutting surface has a first guide hole corresponding to the second guide post. The first guide hole is used for the second guide post to pass through.

9. The leveling device according to any one of claims 5 to 8, characterized in that, It also includes a fixing plate and fasteners; The fixing plate is connected to either the base or the lifting platform. The fixing plate is provided with an oblong hole, the length direction of which is parallel to the axial direction of the first guide column. The other of the base and the lifting platform is provided with a connecting round hole corresponding to the oblong hole. The fastener is detachably connected to the waist-shaped hole and the connecting round hole.

10. A motion platform, characterized in that, include: The motion mechanism and multiple legs; and The leveling device according to any one of claims 1-9, wherein the plurality of legs support the motion mechanism, and the leveling device is installed at the bottom of each of the plurality of legs.

11. A semiconductor device, characterized in that, include: Chuck; and The motion platform as described in claim 10, wherein the chuck is mounted on the motion platform.

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