A high-consistency ultrathin background suppression photoelectric sensor and its design and manufacturing method

Abstract

This application relates to the field of sensor technology, and more particularly to a high-consistency ultrathin background suppression photoelectric sensor and its design and manufacturing method. The structure includes a sensor and an adjustment mechanism. The sensor consists of a housing and a circuit assembly, a light-shielding sheet, and a lens assembly arranged sequentially within the housing. The circuit assembly includes a packaged substrate circuit board, a light source component attached to the circuit board with silver paste, and a dual-PD bare wafer, both of which are bare wafers. The housing consists of a mating rear housing and a front housing, with the lens assembly and positioning posts integrally fixed to the front housing. The adjustment mechanism includes a base, an adjusting member, and a contact assembly. The base has a receiving slot and adjusting slots on both sides. The receiving slot is used to place the sensor, the adjusting member passes through the adjusting slot and can adjust the position of the circuit assembly relative to the lens assembly, and the contact assembly can move to contact the circuit assembly during assembly. This application effectively improves the assembly quality of the sensor and ensures the consistency of its detection distance.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a highly consistent ultrathin background suppression photoelectric sensor and its design and manufacturing method. Background Technology

[0002] In the field of industrial automation, photoelectric sensors are key detection equipment, widely used in various production lines, undertaking functions such as accurate counting and positioning of parts. Their detection performance is directly related to the efficiency and stability of the production process.

[0003] In the design, assembly, and manufacturing process of ultra-thin background suppression photoelectric sensors, conventional multilayer PCB design and processing technology is typically employed. This results in large tolerances in circuit processing, with mechanical drilling tolerances of approximately + / -0.1mm. The materials used are standard FR-4, which has a high coefficient of thermal expansion. Furthermore, the entire board of components is manufactured using SMT (Surface Mount Technology), and the device packaging process itself introduces tolerances, leading to extremely poor consistency in the detection distance of the produced sensors. Simultaneously, for semi-finished products that do not meet detection distance standards, the lack of a dedicated adjustment mechanism makes it difficult to precisely adjust the position of the circuit components relative to the lens components. The lack of reliable and repeatable positioning and adjustment methods means that the relative position between the circuit components and the lens components cannot be corrected through secondary assembly, resulting in a persistently high product defect rate.

[0004] The aforementioned problems make it difficult to guarantee the detection accuracy, consistency, and stability of sensors after production and assembly. Especially in large-scale, high-volume industrial automation production scenarios, existing assembly methods are no longer sufficient to meet the stringent requirements for high detection accuracy, high reliability, and long-term stability of sensors. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned technical problems and provide a high-consistency ultra-thin background suppression photoelectric sensor and its design and manufacturing method. This effectively improves the assembly quality of the sensor, especially the consistency of the detection distance. It overcomes the problems of low detection accuracy and poor consistency caused by the lack of high-precision PCB, light source, dual PD and other processing technologies in the existing design and manufacturing methods, as well as the lack of a secondary assembly mechanism for precise adjustment and reliable positioning. This can meet the strict requirements of industrial automation mass production for sensor quality.

[0006] In a first aspect, one embodiment of this application discloses a highly consistent ultrathin background suppression photoelectric sensor, employing the following solution: A high-consistency ultra-thin background suppression photoelectric sensor includes: a sensor, including a housing and a circuit assembly, a light-shielding sheet, and a lens assembly sequentially located within the housing, wherein the light-shielding sheet is located between the circuit assembly and the lens assembly, and the housing includes a mating rear housing and a front housing, wherein the lens assembly is integrally fixed to the front housing; The circuit assembly includes a circuit board, a light source, and dual PD bare wafers. The circuit board is a packaging carrier board. The light source and the dual PD bare wafers are attached to one side of the circuit board and are both bare wafers, and are fixed to the circuit board with silver paste. An integrated positioning post is provided on the side of the front housing. The positioning post passes through the light shield and the circuit board in sequence and abuts against the rear housing. The adjustment mechanism includes a base, an adjusting member, and an abutting assembly. The base is provided with a receiving groove and an adjusting groove. There are two adjusting grooves, located on both sides of the receiving groove. The receiving groove is used to place the sensor. The adjusting member passes through the two adjusting grooves and is used to adjust the position of the circuit assembly relative to the lens assembly. The abutting assembly is fixed on the base and is used to movably abut the circuit assembly during the sensor assembly process.

[0007] By adopting the above technical solution, the sensor includes a circuit assembly, a light-shielding plate, and a lens assembly located sequentially within the housing. The light-shielding plate, situated between the circuit assembly and the lens assembly, effectively blocks stray light, reduces light interference, and improves the sensor's detection accuracy. The housing comprises a mating rear housing and a front housing, facilitating sensor assembly and maintenance. The lens assembly is integrally fixed to the front housing, ensuring its stability and guaranteeing accurate light transmission and focusing. Positioning posts are provided on the front housing, allowing the light-shielding plate and circuit board to pass through sequentially and abut against the rear housing, ensuring a tight connection between the light-shielding plate, circuit board, and rear housing, enhancing the stability and integrity of the entire sensor assembly structure. The circuit board in the circuit assembly uses a packaged carrier board, which better maintains dimensional stability under different temperature environments, ensuring high precision and stability of the sensor's internal structure. The light source and dual PD bare wafers are attached to one side of the circuit board, both using bare wafers and fixed to the circuit board with silver paste. This direct wafer bonding method eliminates the errors of traditional chip packaging and SMT placement, improving the accuracy of the light source aligning with the lens center and the consistency of the dual PD positions. The base of the adjustment mechanism is equipped with a receiving slot and an adjustment slot. The receiving slot is used to place the sensor and provide a stable installation position for the sensor. The adjustment component passes through the two adjustment slots and can precisely adjust the position of the circuit component relative to the lens component in the semi-finished product whose detection distance does not meet the standard during the production process to achieve the best adjustment effect. The abutment component is fixed on the base and can movably abut against the circuit component during the sensor assembly process, which facilitates the fixation of the circuit component during assembly, ensures the accuracy and stability of the assembly, and thus ensures that the detection distance of the produced sensors is consistent.

[0008] Optionally, the abutting component includes: a support member fixed on the base, one end of the support member having a first through hole and the other end having an abutting groove; an abutting member, one end of which movably passes through the first through hole; and a handle, one end of which is connected to the other end of the abutting member, and the handle movably abuts against the abutting groove, the other end of which is used for external force operation to rotate the handle around the abutting groove, thereby pulling the abutting member to move relative to the first through hole to abut against or disengage from the circuit component.

[0009] By adopting the above technical solution, the support of the abutment component is fixed on the base. The first through hole and abutment groove provided on the abutment component provide a movable basis for the abutment component and the handle. The abutment component can move in the first through hole, and the handle can be rotated around the abutment groove to pull the abutment component to move, so as to abut or detach from the circuit component. This facilitates the abutment and release operation of the circuit component during the sensor assembly process, and the auxiliary adjustment component can better adjust the position of the circuit component relative to the lens component.

[0010] Optionally, one end of the adjusting member is threadedly fitted to the adjusting groove, and the position of the circuit assembly relative to the lens assembly is adjusted by rotating the adjusting member.

[0011] By adopting the above technical solution, and utilizing the threaded fit structure between one end of the adjusting component and the adjusting groove, the position of the circuit component relative to the lens component can be conveniently and accurately adjusted by rotating the adjusting component. This helps to achieve precise adjustment of the relative position of the circuit component and the lens component of the semi-finished product with insufficient detection distance during the assembly process of the background suppression photoelectric sensor, so as to meet the assembly requirements and sensor performance requirements.

[0012] Optionally, the front housing is provided with a second through hole, the lens assembly is integrally formed and fixed in the second through hole, and the light shield is provided with two transmission holes opposite to the second through hole, and the two transmission holes are respectively provided for the light source and the dual PD bare wafer.

[0013] By adopting the above technical solution, a second through hole is provided on the front housing, which can fix the lens assembly in the second through hole, ensuring the accuracy and stability of the lens assembly installation and ensuring the normal transmission and focusing of light; two transmission holes are provided on the light shield, which are respectively opposite to the light source and the dual PD bare wafer, so that the light emitted by the light source can pass smoothly through the transmission holes and be received by the dual PD bare wafer, ensuring the normal operation of the sensor and the accuracy of detection.

[0014] Optionally, the rear housing is provided with multiple slots for the positioning post to abut against; the lens assembly includes a emitting lens and a receiving lens, which are respectively located in the two second through holes.

[0015] By adopting the above technical solution, multiple slots are provided in the rear housing for the positioning pins to abut, which makes the connection between the front housing and the rear housing more stable and ensures the stability of the entire sensor assembly structure; the lens assembly includes a transmitting lens and a receiving lens located in two second through holes, which can realize the function of transmitting and receiving light, ensuring that the sensor can perform photoelectric detection normally.

[0016] Optionally, the circuit board is a BT resin encapsulation substrate.

[0017] By adopting the above technical solution, the thermal expansion coefficient of the BT resin encapsulation substrate is lower than that of conventional FR-4 PCB, resulting in higher dimensional stability under temperature conditions. This helps to improve the optical path reference stability of the sensor under industrial temperature variation environments, making the detection distance less prone to drift.

[0018] Optionally, the front housing and the positioning post are integrally formed.

[0019] By adopting the above technical solution, the front housing, lens assembly, and positioning post are integrated into one unit, which can improve assembly efficiency, reduce assembly errors, and ensure the stability of the assembly structure and the high consistency of the detection distance.

[0020] Optionally, the circuit board is provided with multiple third through holes processed by laser drilling for multiple positioning posts to pass through.

[0021] By adopting the above technical solution, the circuit board is equipped with a third through hole processed by laser drilling for the positioning post to pass through. The laser drilling process has high precision, which can ensure the size and position accuracy of the hole, improve the consistency and accuracy of sensor assembly, and make the assembly of the light shield, circuit board and rear housing more stable.

[0022] Secondly, one embodiment of this application discloses a design and manufacturing method for a highly consistent ultrathin background suppression photoelectric sensor, which adopts the following scheme: A method for designing and manufacturing a high-consistency ultrathin background suppression photoelectric sensor, used to assemble the aforementioned high-consistency ultrathin background suppression photoelectric sensor, includes: placing the front housing in the receiving groove, and sequentially attaching the light-shielding sheet and the circuit assembly to the front housing, wherein the lens assembly is integrally disposed on the front housing; operating the abutting component to abut the circuit assembly; operating the adjusting component to adjust the position of the circuit assembly relative to the lens assembly; when the adjusted measurement distance reaches a predetermined standard, removing the abutting component and fixing the positioning post and the circuit assembly with adhesive; aligning the rear housing with the front housing, and operating the adjusting component to press the sensor together, thus completing the assembly of the sensor.

[0023] By adopting the above technical solution, the front housing is placed in the receiving groove, and the lens assembly, light shield, and circuit assembly are sequentially attached to the front housing. This ensures that each component is initially positioned in the correct order and location, laying the foundation for subsequent assembly. Operating the abutting component to abut the circuit assembly fixes the position of the circuit assembly during assembly, preventing displacement and ensuring the stability of the assembly process. Operating the adjusting component to adjust the position of the circuit assembly relative to the lens assembly precisely adjusts their relative positional relationship, ensuring the measurement distance reaches the predetermined standard and improving the sensor's measurement accuracy. When the adjusted measurement distance reaches the predetermined standard, removing the abutting component and applying adhesive to fix the positioning post and circuit assembly secures the adjusted components, ensuring the stability of the sensor structure. Aligning the rear housing with the front housing and pressing the sensor together using the adjusting component completes the sensor assembly, ensuring that all sensor components are tightly joined, forming a complete and stable structure and guaranteeing the normal operation of the sensor.

[0024] In summary, this application includes at least one of the following beneficial technical effects: 1. The sensor comprises a circuit assembly, a light-shielding plate, and a lens assembly, sequentially located within the housing. The light-shielding plate, situated between the circuit assembly and the lens assembly, effectively blocks stray light, reduces light interference, and improves the sensor's detection accuracy. The housing includes a mating rear housing and a front housing, facilitating sensor assembly and maintenance. The lens assembly is integrally fixed to the front housing, ensuring its stability and guaranteeing accurate light transmission and focusing. Positioning posts are provided on the front housing, allowing the light-shielding plate and circuit board to pass through sequentially and abut against the rear housing, ensuring a tight connection between the light-shielding plate, circuit board, and rear housing, enhancing the stability and integrity of the entire sensor assembly structure. The circuit board in the circuit assembly utilizes a packaged carrier board, better maintaining dimensional stability under different temperature environments, ensuring high precision and stability of the sensor's internal structure. The light source and dual PD bare wafers are attached to one side of the circuit board, both using bare wafers and fixed to the circuit board with silver paste. This direct wafer bonding method eliminates the errors of traditional chip packaging and SMT placement, improving the accuracy of the light source aligning with the lens center and the consistency of the dual PD positions. The base of the adjustment mechanism is equipped with a receiving slot and an adjustment slot. The receiving slot is used to place the sensor and provide a stable installation position for the sensor. The adjustment component passes through the two adjustment slots and can precisely adjust the position of the circuit assembly relative to the lens assembly to achieve the best adjustment effect. The abutment component is fixed on the base and can movably abut against the circuit assembly during the sensor assembly process, which facilitates the fixation of the circuit assembly during assembly, ensures the accuracy and stability of the assembly, and thus ensures that the detection distance of the produced sensors has high consistency. 2. The support of the abutment component is fixed on the base, and the first through hole and abutment groove provided thereon provide a movable base for the abutment component and the handle; the abutment component can move in the first through hole, and the handle can be rotated around the abutment groove to pull the abutment component to move, so as to abut or disengage from the circuit component, which facilitates the abutment and release operation of the circuit component during the sensor assembly process, and the auxiliary adjustment component can better adjust the position of the circuit component relative to the lens component; 3. By utilizing the threaded fit structure between one end of the adjusting component and the adjusting groove, the position of the circuit component relative to the lens component can be conveniently and accurately adjusted by rotating the adjusting component. This helps to achieve precise adjustment of the relative position of the circuit component and the lens component during the assembly of the photoelectric sensor, so as to meet the assembly requirements and sensor performance requirements. 4. A second through hole is provided on the front housing to fix the lens assembly in the second through hole, ensuring the accuracy and stability of the lens assembly installation and guaranteeing normal light transmission and focusing; a positioning post is provided on the front housing, and the positioning post can sequentially pass through the light shield and the circuit board and abut against the rear housing, which can tightly connect the light shield, the circuit board and the rear housing, enhancing the stability and integrity of the entire sensor assembly structure; two transmission holes are provided on the front housing, respectively opposite to the light source and the dual PD bare wafer, which can allow the light emitted by the light source to pass smoothly through the transmission holes and be received by the dual PD bare wafer, ensuring the normal operation of the sensor and the accuracy of detection. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of a highly consistent ultrathin background suppression photoelectric sensor disclosed in an embodiment of this application; Figure 2 for Figure 1 An exploded structural diagram of a portion of a highly consistent ultrathin background suppression photoelectric sensor disclosed in the paper; Figure 3 for Figure 1 A schematic diagram of the exploded structure of a high-consistency ultrathin background suppression photoelectric sensor disclosed in the paper; Figure 4 for Figure 1 A schematic diagram of the exploded structure of a high-consistency ultrathin background suppression photoelectric sensor disclosed in the paper; Figure 5 for Figure 1 A schematic diagram of the structure of a highly consistent ultrathin background suppression photoelectric sensor during the assembly process disclosed in the paper; Figure 6 for Figure 1 A side view of a highly consistent ultrathin background suppression photoelectric sensor disclosed in the paper; Figure 7This is a flowchart illustrating a design and manufacturing method for a highly consistent ultrathin background suppression photoelectric sensor, as disclosed in another embodiment of this application.

[0026] Explanation of reference numerals in the attached figures: 10. Sensor; 11. Housing; 111. Rear housing; 1111. Slot; 112. Front housing; 1121. Second through hole; 1122. Positioning post; 12. Circuit assembly; 121. Circuit board; 1211. Third through hole; 122. Light source; 123. Dual PD bare wafer; 13. Light shield; 131. Transmission hole; 14. Lens assembly; 20. Adjustment mechanism; 21. Base; 211. Receiving groove; 212. Adjustment groove; 22. Adjustment component; 23. Abutment assembly; 231. Support component; 2311. First through hole; 2312. Abutment groove; 232. Abutment component; 233. Handle. Detailed Implementation

[0027] The present application will be further described in detail below with reference to the accompanying drawings.

[0028] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make this application more thorough and complete, and to fully convey the scope of this application to those skilled in the art.

[0029] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a” and “the” as used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0030] It should be understood that although the terms "first," "second," etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] This application discloses a highly consistent ultrathin background suppression photoelectric sensor and its design and manufacturing method. It is applied to scenarios in which the product detection distance exceeds the preset standard during the sensor assembly process, that is, the detection distance is unqualified, and the unqualified sensor products are reassembled and corrected. This greatly improves the yield of sensor products and ensures the consistency of distance measurement.

[0032] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0033] [First Embodiment] See Figure 1 , Figure 2 and Figure 3 The first embodiment of this application discloses a high-consistency ultra-thin background suppression photoelectric sensor, including a sensor 10 and an adjustment mechanism 20. The sensor 10 is placed on the base 21 of the adjustment mechanism 20. The adjustment mechanism 20 can adjust the position of the circuit component 12 inside the sensor 10 relative to the lens component 14 to ensure the detection accuracy of the sensor 10. During assembly, it can abut against the circuit component 12 to fix the circuit component 12, avoid relative position shift, reduce assembly error, and ensure that the detection distance of the produced sensor is consistent.

[0034] Specifically, the sensor 10 includes a housing 11 and a circuit assembly 12, a light-shielding plate 13, and a lens assembly 14, which are sequentially located within the housing 11. The light-shielding plate 13 is located between the circuit assembly 12 and the lens assembly 14. The housing 11 consists of a mating rear housing 111 and a front housing 112, providing protection for the internal circuit assembly 12, light-shielding plate 13, and lens assembly 14. See also... Figure 3 and Figure 4 The lens assembly 14 is fixed on the front housing 112. The front housing 112 is provided with a second through hole 1121 and a positioning post 1122. The lens assembly 14 is fixed in the second through hole 1121. The positioning post 1122 passes through a light-shielding sheet 13 and a circuit board 121 in sequence and abuts against the rear housing 111. The front housing 112, the lens assembly 14, and the positioning post 1122 are integrally formed and processed by an ultra-precision mold with a tolerance of ≤ ±0.005mm. This reduces the assembly error of the sensor 10 and ensures the stability of the assembly structure and the high consistency of the detection distance. Here, regarding the front housing (112) produced by the ultra-precision mold, its dimensional tolerance is: ±0.001~±0.005 mm (IT2~IT5), partially to submicron; surface roughness: Ra0.05~0.2μm (mirror grade); positioning / coaxiality: ≤0.002mm.

[0035] The rear housing 111 has multiple slots 1111 for the positioning posts 1122 to abut against. The main function of the positioning posts 1122 is to connect the front housing 112, the light shield 13, the circuit board 121, and the rear housing 111, ensuring accurate positional relationships between them. The outer diameter of the positioning posts 1122 is matched with the third through hole 1211 on the circuit board 121 and the slots 1111 in the rear housing 111. In actual manufacturing, machining is used to ensure dimensional accuracy. The rear housing 111 acts as a frame, providing a foundation and support for the installation of various components. It needs to have a certain strength and stability, and can be made of injection-molded plastic.

[0036] See Figure 3 and Figure 4 The circuit assembly 12 includes a circuit board 121 and a light source 122 and a dual-PD bare wafer 123 attached to one side of the circuit board 121. The light source 122 and the dual-PD bare wafer 123 are wire-bonded to the circuit board 121. In this embodiment, both the light source 122 and the dual-PD bare wafer 123 are bare wafers, fixed to the circuit board 121 with silver paste. This method of directly bonding bare wafers eliminates the errors of traditional chip packaging and SMT placement, and can improve the accuracy of the light source aligning with the center of the lens, as well as the consistency of the dual-PD positions.

[0037] The circuit board 121 has multiple third through holes 1211 (e.g., three), which are formed, for example, by laser drilling, to ensure the size and positional accuracy of the holes, for the insertion of multiple positioning posts 1122. In this embodiment, the circuit board 121 uses a BT resin (bismaleimide triazine resin) encapsulation substrate. BT resin encapsulation substrates have the characteristics of low thermal expansion coefficient and high dimensional stability. Compared with conventional FR-4 (Flame Retardant 4) PCBs, they can better maintain dimensional stability under different temperature environments, ensuring high precision and high stability of the internal structure of the sensor 10. In addition, during assembly and adjustment, the diameter of the multiple third through holes 1211 on the circuit board 121 can be enlarged (by about 0.01mm to 0.03mm) according to actual needs.

[0038] The light-shielding plate 13 is used to prevent light scattering and interference, ensuring that the sensor 10 only receives valid signals. It is made of black plastic or metal sheet, and its surface can be frosted to enhance light absorption. To allow the light source to pass through, two transmission holes 131 are also provided on the light-shielding plate 13, which are opposite to the second through hole 1121. The two transmission holes 131 are also respectively positioned opposite the light source 122 and the dual PD bare wafer 123.

[0039] The lens assembly 14 includes a emitting lens and a receiving lens, respectively located in two second through holes 1121. For example, taking the suppression photoelectric sensor 10 used on an automotive parts production line as an example, when it is working, the light source 122 emits light, which is emitted through the emitting lens, reflected back from an object, and received by the receiving lens. The dual PD bare wafer 123 receives the signal and processes it. In this process, the precise assembly structure ensures the accurate relative positions of the light source 122 and the dual PD bare wafer 123 with the lens assembly 14, thereby ensuring the accuracy of the detection.

[0040] The emitting and receiving lenses in the lens assembly 14 are generally made of optical glass or optical plastic, materials with good optical properties that ensure light transmittance and focusing effect. The lenses are circular in shape, and their surfaces are precision ground and polished to guarantee optical performance. The emitting lens needs to focus and emit the light emitted from the light source 122, so its focal length and curvature parameters need to be precisely designed according to the actual application. For example, in scenarios requiring long detection distances, a longer focal length emitting lens may be necessary. The receiving lens needs to accurately focus the reflected light onto the dual PD bare wafer 123, and its optical parameters are also subject to strict requirements. The lens assembly 14 is integrally fixed in the second through hole 1121 of the front housing 112 to ensure secure installation and positional accuracy.

[0041] See Figure 5 and Figure 6 The adjustment mechanism 20 includes a base 21, an adjusting component 22, and an abutment assembly 23. The base 21 has a receiving groove 211 and an adjusting groove 212, with two adjusting grooves 212 located on either side of the receiving groove 211. The receiving groove 211 is used to place the sensor 10. The size of the receiving groove 211 is adapted to the shape of the sensor 10, ensuring that the sensor 10 can be stably placed on the base 21. The adjusting groove 212 provides space for the installation and movement of the adjusting component 22, and its shape and size match the adjusting component 22. The base 21 is generally made of metal, such as aluminum alloy, which has good strength and stability; however, high-strength plastic materials can also be selected depending on the actual situation.

[0042] An adjusting member 22 passes through two adjusting slots 212. One end of the adjusting member 22 is threaded into the adjusting slot 212. The position of the circuit assembly 12 relative to the lens assembly 14 is adjusted by rotating the adjusting member 22. The adjusting member 22 is a micrometer-like fine-tuning structure, with one end threaded into the adjusting slot 212. The position of the circuit assembly 12 relative to the lens assembly 14 is adjusted by rotating the adjusting member 22.

[0043] The abutment component 23 is fixed to the base 21 and is used to movably abut against the circuit component 12 during the assembly of the sensor 10. The abutment component 23 includes a support member 231, an abutment member 232, and a handle 233. The support member 231 is fixed to the base 21, and one end of the support member 231 is provided with a first through hole 2311, and the other end is provided with an abutment groove 2312. The support member 231 can be made of metal or plastic, and has a certain strength and stability, so as to reliably support the abutment member 232 and the handle 233. The size of the first through hole 2311 is adapted to the abutment member 232, and the abutment member 232 can move flexibly within it. The abutment groove 2312 is used to provide space for the handle 233 to rotate, and its shape and size are designed according to actual needs to ensure that the handle 233 can rotate smoothly around it.

[0044] One end of the abutment 232 is movably inserted through the first through hole 2311. One end of the handle 233 is connected to the other end of the abutment 232, and the end of the handle 233 is movably abutted in the abutment groove 2312. The other end of the handle 233 is used for external force operation to make the handle 233 rotate around the abutment groove 2312, thereby pulling the abutment 232 to move relative to the first through hole 2311 to abut or disengage from the circuit assembly 12.

[0045] The abutment member 232 is a cylindrical rod with a smooth surface, which reduces friction with the first through hole 2311. The handle 233, as shown in the figure, facilitates operation and can be made of plastic or rubber with an anti-slip surface.

[0046] The entire assembly structure precisely adjusts the relative positions of the circuit assembly 12 and the lens assembly 14 through the adjusting component 22, while the abutting component 23 ensures the stability of the position of the circuit assembly 12 during the assembly process. The two work together to effectively improve the assembly accuracy and product quality of the sensor 10.

[0047] The implementation principle of this embodiment is as follows: Defective sensor products can be reassembled by setting an adjustment mechanism 20. Specifically, the adjustment mechanism 20 includes a precisely adjustable adjustment component 22 and a contact component 23 that flexibly engages with the circuit assembly 12, solving the problems of existing assembly structures that struggle to precisely adjust the position of the circuit assembly 12 and lack reliable positioning support. The adjustment component 22 utilizes a threaded adapter structure to achieve precise fine-tuning of the circuit assembly 12's position, while the contact component 23 effectively fixes the circuit assembly 12 during assembly, preventing positional shifts. Furthermore, the use of a BT resin encapsulation substrate and bare wafer die bonding technologies further improves the stability and accuracy of the sensor 10's internal structure. These improvements significantly enhance the detection accuracy of the sensor 10 after production and assembly, ensuring consistent detection distances across the manufactured sensors 10. This is particularly suitable for large-scale, high-volume industrial automation production scenarios, meeting the stringent requirements for high detection accuracy, high reliability, and long-term stability of the sensor 10.

[0048] [Second Embodiment] See Figure 7 The second embodiment of this application discloses a design and manufacturing method for a high-consistency ultrathin background suppression photoelectric sensor, which includes the following steps: S1. Place the front housing 112 in the receiving groove 211, and then attach the light shield 13 and the circuit assembly 12 to the front housing 112 in sequence.

[0049] The front housing 112 is integrally equipped with a lens assembly 14 and a positioning post 1122. The circuit assembly 12 includes a circuit board 121 and a light source 122 and a dual PD bare wafer 123 attached to one side of the circuit board 121.

[0050] During operation, first, place the front housing 112 smoothly into the receiving slot 211, ensuring its accurate positioning. Then, align the holes on the light-shielding plate 13 with the integrated positioning post 1122 on the front housing 112 and fit it onto the front housing 112, completing the assembly of the front housing 112 and the light-shielding plate 13. Finally, align the third through hole 1211 on the circuit board 121 with the positioning post 1122 and fit it onto the front housing 112, ensuring it fits snugly against the light-shielding plate 13.

[0051] This explains that during the initial assembly of sensor 10, a hot press can be used to hot press multiple positioning posts 1122 at high temperature to fix circuit board 121 to front housing 112. After hot pressing, the semi-finished product can be tested for detection distance. If the detection distance of the semi-finished product meets the standard (i.e., qualified), then an ultrasonic welding device is used to weld the front housing and rear housing together to complete the assembly. If the detection distance of the semi-finished product is found to be substandard (i.e. unqualified), a second assembly correction is started. First, the third through hole 1211 on circuit board 121 is slightly enlarged by about 0.01mm to 0.03mm. Then, the detection distance of sensor 10 is finely adjusted to the preset standard using a fine-tuning mechanism. The specific execution steps are as follows: S1 to S5.

[0052] S2. Operate the contact component 23 to make the contact component 23 contact the circuit component 12.

[0053] In this step, the diameter of the multiple third through holes 1211 on the circuit board 121 can be adjusted first. Then, the operator holds the other end of the handle 233 and uses force to rotate the handle 233 around the abutment groove 2312, thereby pulling the abutment 232 to move relative to the first through hole 2311 until the abutment 232 abuts against the circuit assembly 12, ensuring that the position of the circuit assembly 12 is stable during subsequent adjustment.

[0054] S3. Operate the adjustment element 22 to adjust the position of the circuit assembly 12 relative to the lens assembly 14.

[0055] Among them, the adjustment components 22 on both sides are rotated by external force, such as rotating screws, and the position of the circuit component 12 is slowly changed by utilizing the threaded adaptation structure between the screw and the adjustment groove 212.

[0056] S4. When the adjusted measurement distance reaches the predetermined standard, remove the abutment component 23 and fix the positioning post 1122 and the circuit component 12 with adhesive.

[0057] Specifically, by reversing the operation of handle 233, the abutment 232 is disengaged from the circuit assembly 12. Then, glue is applied to the positioning post 1122 and the circuit assembly 12 according to the preset application position and amount to ensure a firm connection between them.

[0058] S5. Align the rear housing 111 with the front housing 112, and operate the adjusting component 22 to press the sensor 10 together, thus completing the assembly of the sensor 10. Specifically, the slot 1111 on the rear housing 111 is aligned with the positioning post 1122 of the front housing 112, and the rear housing 111 and the front housing 112 are fitted together to ensure a tight fit. The adjusting component 22 is operated again to apply a certain pressure to the sensor 10 for pressing, making the assembly of the entire sensor 10 more compact and stable.

[0059] The implementation principle of this embodiment is as follows: The assembly method of this embodiment is based on the assembly structure design of the first embodiment above. First, by placing each component sequentially on the front housing 112, the foundation for subsequent assembly is laid. The operating abutment component 23 fixes the position of the circuit component 12 to prevent displacement during adjustment and ensure the accuracy of adjustment. Fine operation of the adjusting component 22 can accurately control the relative position of the circuit component 12 and the lens component 14 to ensure that the detection distance of the produced sensor is consistent. Steps such as glue fixation and aligning and pressing the rear housing 111 ensure the robustness and stability of the overall structure of the sensor 10.

[0060] The entire assembly method, through a series of orderly operations, effectively improves the assembly quality of sensor 10, overcomes the problems of low detection accuracy and poor consistency caused by the lack of precise adjustment and reliable positioning in existing assembly methods, and can meet the strict quality requirements of sensor 10 for large-scale industrial automation production.

[0061] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A highly consistent ultrathin background suppression photoelectric sensor, characterized in that, include: The sensor (10) includes a housing (11) and a circuit assembly (12), a light shield (13), and a lens assembly (14) located sequentially within the housing (11). The light shield (13) is located between the circuit assembly (12) and the lens assembly (14). The housing (11) includes a mating rear housing (111) and a front housing (112). The lens assembly (14) is integrally fixed to the front housing (112). The circuit assembly (12) includes a circuit board (121), a light source (122), and a dual PD bare wafer (123). The circuit board (121) is a package carrier board. The light source (122) and the dual PD bare wafer (123) are attached to one side of the circuit board (121) and are both bare wafers. They are fixed to the circuit board (121) with silver paste. An integrated positioning post (1122) is provided on the side of the front housing (112). The positioning post (1122) passes through the light shield (13) and the circuit board (121) in sequence and abuts against the rear housing (111). The adjustment mechanism (20) includes a base (21), an adjustment member (22), and an abutment assembly (23). The base (21) is provided with a receiving groove (211) and an adjustment groove (212). There are two adjustment grooves (212), which are located on both sides of the receiving groove (211). The receiving groove (211) is used to place the sensor (10). The adjustment member (22) passes through the two adjustment grooves (212) and is used to adjust the position of the circuit assembly (12) relative to the lens assembly (14). The abutment assembly (23) is fixed on the base (21) and is used to movably abut the circuit assembly (12) during the assembly of the sensor (10).

2. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 1, characterized in that, The abutment component (23) includes: A support member (231) is fixed on the base (21). One end of the support member (231) is provided with a first through hole (2311), and the other end is provided with an abutment groove (2312). The abutting member (232) has one end movably passing through the first through hole (2311). A handle (233) is connected at one end to the other end of the abutment (232), and the end of the handle (233) is movably abutted in the abutment groove (2312). The other end of the handle (233) is used for external force operation to make the handle (233) rotate around the abutment groove (2312), thereby pulling the abutment (232) relative to the first through hole (2311) to abut or disengage from the circuit assembly (12).

3. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 1, characterized in that, One end of the adjusting member (22) is threadedly fitted to the adjusting groove (212), and the position of the circuit assembly (12) relative to the lens assembly (14) is adjusted by rotating the adjusting member (22).

4. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 1, characterized in that, The front housing (112) is provided with a second through hole (1121), the lens assembly (14) is integrally formed and fixed in the second through hole (1121), the light shield (13) is provided with two transmission holes (131) opposite to the second through hole (1121), and the two transmission holes (131) are respectively provided for the light source (122) and the dual PD bare wafer (123).

5. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 4, characterized in that, The rear housing (111) is provided with a plurality of slots (1111) for the positioning post (1122) to abut against; The lens assembly (14) includes a transmitting lens and a receiving lens, which are respectively located in the two second through holes (1121).

6. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 4, characterized in that, The circuit board (121) is a BT resin encapsulation substrate.

7. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 4, characterized in that, The front housing (112) and the positioning post (1122) are integrally formed.

8. The high-uniformity ultrathin background suppression photoelectric sensor according to claim 4, characterized in that, The circuit board (121) is provided with a plurality of third through holes (1211) formed by laser drilling, for the plurality of positioning posts (1122) to pass through.

9. A method for designing and manufacturing a high-consistency, ultra-thin background-suppressing photoelectric sensor, characterized in that, For assembling the high-consistency ultrathin background suppression photoelectric sensor according to any one of claims 1 to 8, comprising: The front housing (112) is placed in the receiving groove (211), and the light shield (13) and the circuit assembly (12) are attached to the front housing (112) in sequence, wherein the lens assembly (14) and the positioning post (1122) are integrally provided on the front housing (112). Operate the abutting component (23) to abut the circuit component (12); Operate the adjustment member (22) to adjust the position of the circuit assembly (12) relative to the lens assembly (14); When the adjusted measurement distance reaches the predetermined standard, the abutment component (23) is removed, and the positioning post (1122) and the circuit component (12) are fixed with adhesive. The rear housing (111) is aligned with the front housing (112), and the adjusting member (22) is operated to press the sensor (10) together, thus completing the assembly of the sensor (10).

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