Temperature monitoring method, electronic device, computer program product, and storage medium

Abstract

Embodiments of the present application disclose a temperature monitoring method, an electronic device, a computer program product and a storage medium, and belong to the technical field of temperature monitoring. The method comprises: acquiring current temperatures of N preset temperature measuring points in a target region on a device shell, wherein N is greater than or equal to 3, and the target region is a region of a target chip on the device shell; taking the N preset temperature measuring points as an input point set, performing iterative interpolation calculation based on the input point set to obtain a region temperature of the target region; performing difference calculation based on the current temperatures of the N preset temperature measuring points and the region temperature, and comparing the calculated difference with a first preset threshold to obtain a first comparison result; and selecting one of the highest temperature in the current temperatures of the N preset temperature measuring points and the region temperature as a current shell temperature of the target region according to the first comparison result. The embodiments of the present application can accurately monitor the shell temperature of an FTTR device and avoid overheating and shell melting of the device.

Description

Technical Field

[0001] This application relates to the field of temperature monitoring technology, and in particular to temperature monitoring methods, electronic devices, computer program products, and storage media. Background Technology

[0002] Currently, thermal design for home-based FTTR (Fiber to the Room) equipment is based on the premise of normal equipment placement, such as monitoring the temperature of the most heat-prone areas. However, for abnormally placed or haphazardly positioned equipment, the temperature monitoring results from the above thermal design are inaccurate. Therefore, operators and suppliers cannot detect or correct abnormal overheating caused by prolonged improper placement. Prolonged excessively high temperatures can also cause deformation of the equipment casing. When the temperature reaches the casing's melting point, it can easily melt, potentially leading to equipment malfunction, reduced lifespan, and even fire, affecting equipment safety. Summary of the Invention

[0003] The main objective of this application is to provide a temperature monitoring method, electronic device, computer program product, and storage medium, aiming to at least solve the technical problem of how to accurately monitor the housing temperature of FTTR equipment and avoid overheating and melting of the housing.

[0004] To achieve the above objectives, embodiments of this application provide a temperature monitoring method, including: Obtain the current temperature of N preset temperature measurement points in the target area on the device housing, where N is greater than or equal to 3, and the target area is the area on the device housing corresponding to the target chip; Using the N preset temperature measurement points as the input point set, iterative interpolation calculation is performed based on the input point set to obtain the regional temperature of the target area; The difference between the current temperature of the N preset temperature measurement points and the temperature of the area is calculated, and the calculated difference is compared with a first preset threshold to obtain a first comparison result. Based on the first comparison result, select the highest temperature among the current temperatures of the N preset temperature measurement points and the area temperature as the current shell temperature of the target area.

[0005] In addition, to achieve the above objectives, this application also provides an electronic device, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the temperature monitoring method described above.

[0006] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the temperature monitoring method described above.

[0007] In addition, to achieve the above objectives, this application embodiment also provides a computer storage medium storing a computer program, which, when executed by a processor, implements the temperature monitoring method described above.

[0008] This application proposes a temperature monitoring method, electronic device, computer program product, and storage medium. By acquiring the multi-point temperature of the target area corresponding to the target chip on the device casing, and performing iterative interpolation calculations based on the multi-point temperatures, a region temperature reflecting the average temperature of the target area can be obtained. Then, the difference between the region temperature and the multi-point temperatures is calculated and a threshold is compared before determining the current casing temperature. This improves the accuracy of device casing temperature monitoring. Even under abnormal or haphazard placement of the device, the current casing temperature can accurately reflect the heating status of the target area, enhancing the robustness of device casing temperature monitoring. This overcomes the deficiency of traditional single-point temperature measurement methods in related technologies, which cannot accurately reflect the casing temperature when the device is not properly placed. When this temperature monitoring method is applied to FTTR equipment, the problem of overheating and casing melting in FTTR equipment can be effectively avoided based on the real-time monitored current casing temperature. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 A schematic flowchart of a temperature monitoring method provided in an embodiment of this application; Figure 2 A detailed flowchart of step S20 in a temperature monitoring method provided in this application embodiment; Figure 3 A schematic diagram of a simulation scenario involving the temperature of the calculation area in a temperature monitoring method provided in an embodiment of this application; Figure 4 A schematic diagram of the process for preventing shell melting involved in a temperature monitoring method provided in an embodiment of this application; Figure 5 A schematic diagram of a temperature monitoring method provided in this application embodiment, involving obtaining temperature through junction temperature detection; Figure 6 A schematic diagram illustrating the process of acquiring temperature via a thermal dipole probe and a temperature converter, provided as an embodiment of this application, for a temperature monitoring method. Figure 7 A schematic diagram of the PCB layout involved in a temperature monitoring method provided in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0011] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that the embodiments of this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the embodiments of this application with unnecessary detail.

[0012] Currently, thermal design solutions for home-based FTTR devices are based on normal device placement, such as monitoring the temperature of the most heat-prone areas on a normally placed device. However, different users may place FTTR devices differently. For improper or haphazard placement, the temperature monitoring results based on normal placement are inaccurate. Therefore, operators and suppliers cannot detect or correct such situations. This is because FTTR devices are small and have a compact thermal design; improper placement can significantly impact the device's casing temperature and internal chip heating. Prolonged improper placement can lead to abnormal overheating, and consistently high temperatures can cause casing deformation. When the temperature reaches the casing's melting point, it can melt, potentially causing device malfunction, reducing its lifespan, and even posing a fire risk, compromising device safety.

[0013] Based on this, embodiments of this application provide a temperature monitoring method, electronic device, computer program product, and storage medium. By acquiring the multi-point temperature of the target area corresponding to the target chip on the device casing, and performing iterative interpolation calculations based on the multi-point temperatures, a region temperature reflecting the average temperature of the target area can be obtained. Then, by combining the region temperature and the multi-point temperatures, difference calculations and threshold comparisons are performed to determine the current casing temperature. This improves the accuracy of device casing temperature monitoring. Even under abnormal or haphazard placement of the device, the current casing temperature can accurately reflect the heating status of the target area, enhancing the robustness of device casing temperature monitoring. This overcomes the deficiency of traditional single-point temperature measurement methods in related technologies, which cannot accurately reflect the device casing temperature when the device is not properly placed. When this temperature monitoring method is applied to FTTR equipment, the problem of overheating and casing melting in FTTR equipment can be effectively avoided based on the real-time monitored current casing temperature.

[0014] The temperature monitoring method, electronic device, computer program product, and storage medium provided in this application are specifically described through the following embodiments. First, the temperature monitoring method in this application is described.

[0015] Reference Figure 1 , Figure 1 This is a flowchart illustrating a temperature monitoring method provided in an embodiment of this application. This temperature monitoring method can be applied to electronic devices, such as FTTR devices, industrial control equipment, server chassis, and other electronic devices with a housing and a target chip disposed inside the housing. Figure 1 As shown, the temperature monitoring method provided in this embodiment includes steps S10 to S40.

[0016] Step S10: Obtain the current temperature of N preset temperature measurement points in the target area on the device housing, where N is greater than or equal to 3, and the target area is the area on the device housing corresponding to the target chip.

[0017] In this embodiment, the current temperature of the preset temperature measurement point can be obtained through sensor acquisition, model calculation, bus reading, etc.; the device housing is the external protective structure of the electronic device and can be made of materials such as engineering plastics, aluminum alloys, or sheet metal. The internal space of the housing can accommodate a PCB board (Printed Circuit Board). The board (printed circuit board) and the various components it carries; the target chip can be a core processor, communication chip, laser waveguide chip, etc., which generate heat when it is working and is set on the PCB. The heat generated by the chip is transferred to the device housing through contact conduction, air convection, etc., causing the temperature of the corresponding area on the device housing to rise. When the housing is overheated, it may cause the housing to deform or even melt. Therefore, it is necessary to accurately monitor the housing temperature; the preset temperature measurement points are temperature sampling positions selected in advance in the target area. They can be distributed along the boundary, center and other key positions of the target area, so as to basically cover the positions on the device housing that are at risk of overheating. This avoids the problem of inaccurate single-point temperature measurement or failure to reflect the true heating situation of the device housing. In this embodiment, N≥3 is set, that is, at least three preset temperature measurement points are set because at least three non-collinear points are needed to build a planar temperature field interpolation basis to ensure that the regional temperature of the target area can be calculated based on subsequent iterative interpolation. The current temperature of the preset temperature measurement point can also be called the point temperature.

[0018] As an example, when there are N target chips, the target area can be the area on the device housing that corresponds directly to the location of each target chip, i.e., the area covered by the vertical projection of each target chip onto the inner wall of the housing. In this case, a preset temperature measurement point can be set in the vertical projection coverage area of ​​each target chip on the inner wall of the housing. Generally, the center point of the vertical projection coverage area is taken as the preset temperature measurement point, so that the N preset temperature measurement points correspond one-to-one with the N target chips, thereby enabling the measurement of the temperature at different locations on the device housing. When there is only one target chip, the target area can include not only the vertical projection coverage area on the inner wall of the housing, but also an extended area extending outwards from the vertical projection coverage area along the inner wall of the housing. In this case, N preset temperature measurement points can be set in the center, corners, or extended areas of the vertical projection coverage area, which can also enable the measurement of the temperature at different locations on the device housing.

[0019] Step S20: Take N preset temperature measurement points as the input point set, and perform iterative interpolation calculation based on the input point set to obtain the regional temperature of the target area.

[0020] In this embodiment, the input point set refers to the set of all points participating in the interpolation in the current round and their temperature values. The input point set consisting of the N preset temperature measurement points and their current temperatures obtained in the aforementioned step S10 can be regarded as the initial input point set. After each round of interpolation calculation, a new input point set will be formed. After multiple rounds of iterative interpolation calculation, the temperature field can be gradually refined, and finally the regional temperature that can reflect the overall heating situation of the target area can be obtained, which can also be called the surface temperature.

[0021] Step S30: Calculate the difference between the current temperature of N preset temperature measurement points and the regional temperature, and compare the calculated difference with a first preset threshold to obtain a first comparison result.

[0022] In this embodiment, difference calculation refers to subtracting two temperature values ​​to obtain the temperature difference. The purpose of difference calculation is to verify the reliability of the area temperature obtained through iterative interpolation, and to determine whether its deviation from the measured temperature at N preset temperature measurement points is within an acceptable range. The first preset threshold can be a pre-set allowable deviation threshold, for example, it can be set to 2℃~3℃. The first comparison result can be used to measure the consistency between the interpolation result and the measured data, and can reflect the degree of deviation between the point temperature and the surface temperature.

[0023] In some feasible embodiments, step S30 above may include: Step S31: The absolute values ​​of the two differences obtained by subtracting the highest and lowest temperatures among the current temperatures of the N preset temperature measurement points from the regional temperature are respectively denoted as the first temperature difference and the second temperature difference.

[0024] In this embodiment, the highest temperature Tmax and the lowest temperature Tmin are selected from the current temperatures of N preset temperature measurement points. The first temperature difference ΔT1 = |Tmax| is obtained by subtracting the area temperature TC from the highest temperature Tmax and taking the absolute value. The second temperature difference ΔT2 = |Tmin| is obtained by subtracting the regional temperature TC from the lowest temperature Tmin and taking the absolute value. TC|, the first temperature difference and the second temperature difference reflect the degree of deviation between the measured highest and lowest temperatures and the regional temperature, respectively.

[0025] Step S32: Compare the first temperature difference and the second temperature difference with the first preset threshold respectively to obtain the first comparison result.

[0026] In this embodiment, the first comparison result can be divided into two types: the first temperature difference ≤ the first preset threshold and the second temperature difference ≤ the first preset threshold; the first temperature difference > the first preset threshold and / or the second temperature difference > the first preset threshold.

[0027] Step S40: Based on the first comparison result, select the highest temperature and the area temperature from the current temperatures of the N preset temperature measurement points as the current shell temperature of the target area.

[0028] In this embodiment, the degree of deviation between the highest point temperature on the housing and the surface temperature of the device housing can be determined based on the first comparison result obtained in step S30 above, so as to select the most reasonable temperature value as the final output, taking into account both accuracy and safety.

[0029] In some feasible embodiments, step S40 above may include: Step S41: If the first comparison result indicates that both the first temperature difference and the second temperature difference are less than or equal to the first preset threshold, the area temperature is taken as the current shell temperature of the target area.

[0030] In this embodiment, if the first comparison result indicates that both the first temperature difference and the second temperature difference are less than or equal to the first preset threshold, it means that the interpolated area temperature is in good agreement with the measured temperature at the point and can accurately reflect the overall temperature level of the target area. Therefore, the area temperature can be used as the current shell temperature of the target area.

[0031] Step S42: If the first comparison result indicates that at least one of the first temperature difference and the second temperature difference is greater than the first preset threshold, the highest temperature is taken as the current shell temperature of the target area.

[0032] In this embodiment, if the first comparison result indicates that at least one of the first temperature difference and the second temperature difference is greater than the first preset threshold, it indicates that the temperature distribution within the target area is uneven. The regional temperature obtained by interpolation calculation and averaging may mask local high temperatures, posing a risk of missed overheating detection. To avoid overheating of the equipment casing and ensure equipment safety, it is necessary to use the highest temperature among N preset temperature measurement points as the current casing temperature of the target area, ensuring that the worst temperature conditions can be effectively monitored.

[0033] This embodiment provides a temperature monitoring method that dynamically selects the output temperature through deviation verification. When the temperature distribution is uniform, it uses the temperature of a more representative area; when the distribution is uneven, it uses the highest temperature to ensure safety, balancing monitoring accuracy and reliability. When this temperature monitoring method is applied to FTTR equipment, it enables real-time monitoring of the FTTR equipment casing overheating. This allows for timely triggering of the equipment's built-in overheat protection mechanism or notification of relevant events to equipment maintenance personnel, thus helping users avoid casing meltdown issues and improving equipment safety.

[0034] Reference Figure 2In some feasible embodiments, the step S20 above, which involves iterative interpolation calculation based on the input point set to obtain the regional temperature of the target region, may include: Step S21: Perform the target operation, which includes interpolating the current temperature of any two points in the input point set and the distance between them to obtain the equilibrium point and equilibrium temperature between any two points.

[0035] In this embodiment, the target operation refers to a single-round interpolation calculation: the points in the input point set are sequentially arranged according to their spatial positions to form a closed sequence. Interpolation calculations are then performed on every two adjacent points in the sequence (including the end and beginning of the sequence) to obtain the equilibrium point and corresponding equilibrium temperature between the two points. Since the initial input point set contains N preset temperature measurement points, a total of N equilibrium points can be generated after completing the single-round interpolation calculation. The interpolation calculation needs to be based on the principle of one-dimensional heat conduction, rather than a simple linear averaging, to conform to the actual heat conduction characteristics of the device casing.

[0036] Step S22: Obtain the absolute value of the temperature difference between every two equilibrium points among the N equilibrium points, and compare the absolute value of each temperature difference with the second preset threshold to obtain the second comparison result.

[0037] In this embodiment, the second preset threshold can be a pre-set temperature convergence threshold, for example, it can be set to 0.5℃~1℃. The second comparison result can be used to determine whether the temperature field formed by the N equilibrium points obtained at the moment is smooth enough and whether the iteration meets the preset accuracy requirements.

[0038] Step S23: If the second comparison result indicates that the absolute value of the temperature difference is greater than the second preset threshold, take the N equilibrium points as a new set of input points and proceed to execute the target operation.

[0039] In this embodiment, if the second comparison result indicates that the absolute value of the temperature difference is greater than the second preset threshold, it means that the temperature distribution of the current equilibrium point is still uneven, the interpolation accuracy is insufficient, and the convergence condition is not met. Therefore, it is necessary to take the N equilibrium points obtained at the moment as a new set of input points, return to the target operation in step S21, and enter the next round of iterative calculation.

[0040] Step S24: If the second comparison result indicates that the absolute value of all temperature differences is less than or equal to the second preset threshold, the N equilibrium points obtained at present are taken as N final target points, and the average temperature of the N final target points is taken as the area temperature.

[0041] In this embodiment, when the second comparison result indicates that the absolute value of all temperature differences is less than or equal to the second preset threshold, it indicates that the temperature field within the target area has become smooth and stable, and the currently obtained N equilibrium points can adequately represent the temperature distribution within the target area. At this time, the currently obtained N equilibrium points can be used as the final target points, and the arithmetic mean of the temperatures of the N final target points can be calculated. This average value is the regional temperature of the target area, used to characterize the overall temperature level of the target area.

[0042] In some feasible embodiments, the step S21 above, which involves interpolating based on the current temperature of any two points and the distance between them to obtain the equilibrium point and equilibrium temperature between any two points, may include: Step S211: Based on the current temperature of any two points, the distance between any two points, the heat consumption of any two points, the thermal conductivity of the equipment casing, and the unit cross-sectional area of ​​the sidewall of the equipment casing, establish a set of heat conduction equations related to the equilibrium points and equilibrium temperature.

[0043] In this embodiment, the current temperatures of any two points can be set as T1 and T2; the distance between the two points can be set as D, representing the straight-line distance between the two points on the target area plane, which can be calculated in advance using the point coordinates; the heat dissipation of the two points can be set as Q1 and Q2, characterizing the heat transfer power at the corresponding points, which is related to the power consumption of the chip below the point and the heat conduction path, and can be obtained through thermal simulation or experimental calibration; the thermal conductivity of the device housing can be denoted as λ, which is an inherent parameter of the device housing material and is a fixed parameter known in advance; the unit cross-sectional area of ​​the device housing sidewall can be denoted as A, which refers to the unit cross-sectional area of ​​the device housing sidewall, taken as the cross-sectional area under the unit thickness of the housing, and is a preset parameter. According to Fourier's law of heat conduction, the heat flow between two points is continuous under steady state. Let the distance between the point with current temperature T1 and the equilibrium point be d1, and the equilibrium temperature of the equilibrium point be TX, then a set of heat conduction equations can be established based on the above parameters: .

[0044] Step S212: Solve the heat conduction equations to obtain the equilibrium point and the equilibrium temperature at the equilibrium point.

[0045] In this embodiment, by solving the aforementioned heat conduction equations, the distance d1 between the current temperature T1 point and the equilibrium point, as well as the equilibrium temperature TX, can be obtained. Based on the coordinates of the current temperature T1 point and the distance d1, the coordinates of the equilibrium point can be determined. When the heat dissipation at the two points is equal, the equilibrium point is located at the midpoint of the line connecting the two points, and the equilibrium temperature is the arithmetic mean of the two temperatures. When the heat dissipation at the two points is different, the equilibrium point shifts towards the side with higher heat dissipation, and the temperature is calculated accordingly with weighting, which conforms to the actual heat conduction law.

[0046] As an example, with N=3, combined with the above embodiments, an application example can be obtained where the average temperature of the three points within a triangular region formed by the three points is calculated based on the temperature of the three points. The difference between the average temperature and the highest temperature point is used to determine whether the point temperature or surface temperature exceeds the limit, thereby determining the current shell temperature of the target area. First, the three preset temperature measurement points are set as point1, point2, and point3, respectively. The highest temperature of point1 is set as T1, the highest temperature of point2 as T2, and the highest temperature of point3 as T3. The average temperature within the triangular region formed by these three points is set as TC. The distance between the center points of point1 and point2 is set as D1, the distance between the center points of point1 and point3 is set as D2, and the distance between the center points of point2 and point3 is set as D3. Specifically, this can be implemented as follows: S1: Let d1 be the distance from point1 to the first equilibrium point between point1 and point2, and let Tx be the equilibrium temperature of the first equilibrium point. Then, by combining the heat loss Q1 of point1, the heat loss Q2 of point2, the thermal conductivity λ of the equipment shell, and the unit cross-sectional area A of the sidewall of the equipment shell, the first set of heat conduction equations can be established: ; S2: Similarly, let d2 be the distance between point1 and the second equilibrium point between point1 and point3, and let Ty be the equilibrium temperature of the second equilibrium point. Then, by combining the heat loss Q1 of point1, the heat loss Q3 of point3, the thermal conductivity λ of the equipment shell, and the unit cross-sectional area A of the sidewall of the equipment shell, we can establish the second set of heat conduction equations: ; S3: Similarly, let d3 be the distance between point2 and the third equilibrium point between point2 and point3, and let Tz be the equilibrium temperature of the third equilibrium point. Then, by combining the heat loss Q2 of point2, the heat loss Q3 of point3, the thermal conductivity λ of the equipment shell, and the unit cross-sectional area A of the sidewall of the equipment shell, we can establish the third set of heat conduction equations: ; S4: Solving the three heat conduction equations ①②③④⑤⑥ above yields d1, d2, d3, and the temperatures at three points (Tx, Ty, Tz). Based on the positions of ponit1, ponit2, and ponit3, and d1, d2, and d3, the positions of the three equilibrium points (p1, p2, p3) are determined. Figure 3 As shown, Figure 3A schematic diagram of a simulation scenario for iterative interpolation calculation of equilibrium points on a device housing is shown. After determining the positions (p1, p2, p3) of the three equilibrium points based on the triangular region formed by ponit1, ponit2, and ponit3, further iterative calculations such as S1 to S3 can be performed based on the second triangular region formed by the three equilibrium points p1, p2, and p3 to calculate the positions (p11, p22, p33) of the three equilibrium points inside the second triangular region and their three temperatures (Txx, Tyy, Tzz). This process is repeated several times in a loop. S5: After iterating several times according to the aforementioned algorithm, if the absolute value of the difference between any two of the three equilibrium points is less than or equal to 0.5 degrees Celsius, that is, if the three equilibrium points satisfy equation ⑦|Txx..-Tyy..|&|Txx..-Tzz..|&|Tyy..-Tzz..|<=0.5℃, then stop iterating and calculate the average temperature TC based on the equilibrium temperature of the three equilibrium points. Compare TC with the highest temperature Tmax and the lowest temperature Tmin among the initial three point temperatures T1, T2 and T3 to determine whether the melting standard is reached based on the surface temperature or the point temperature. S6: When the temperature difference between the highest temperature Tmax and the lowest temperature Tmin and TC is less than 3 degrees Celsius, that is: |Tmax-TC|&|Tmin-TC|<=3℃, it means that the surface temperature has reached a uniform state. The surface temperature TC can be used to determine whether the shell melting standard has been reached. That is, TC is compared with the shell melting warning threshold to determine whether the shell melting standard has been reached. When the temperature difference between at least one of the highest temperature Tmax and the lowest temperature Tmin and TC is greater than 3 degrees Celsius, i.e. |Tmax-TC| | |Tmin-TC|>3℃, it indicates that the surface temperature is not uniform. The determination of whether the shell melt standard has been reached should be based on the highest temperature Tmax. That is, Tmax is compared with the shell melt warning threshold to determine whether the shell melt standard has been reached. S7: After obtaining the surface temperature or highest point temperature as the equipment housing temperature for determining whether the melting standard has been reached, when the equipment housing temperature reaches the melting warning threshold, the equipment processor will support periodic monitoring of the highest point temperature or surface temperature changes of the equipment housing and take corresponding measures based on the temperature rise or fall trend. For example... Figure 4 As shown, the device continuously tracks temperature changes after a drop in temperature. If the temperature continues to rise and reaches the melt temperature, the device is immediately restarted. After restarting, the device's temperature monitoring logic runs again. If the device casing temperature returns to normal after restarting, no action is taken. If the temperature rises abnormally due to chip malfunction after restarting, the device will restart again to ensure that the device casing temperature does not become too high and cause a melt.

[0047] Reference Figure 5 In some feasible embodiments, the step of obtaining the current temperature of N preset temperature measurement points in the target area on the device housing in step S10 above may include: Step S101: Obtain the current junction temperature data of N target chips.

[0048] In this embodiment, the target chip can integrate a junction temperature detection diode or a built-in temperature sensor. The main control unit of the electronic device can read the junction temperature value in the chip register in real time through the internal bus of the target chip, which is the current junction temperature data.

[0049] Step S102: In response to the validity of the current junction temperature data, substitute the current junction temperature data into the temperature coupling relationship model obtained by experimental fitting in advance to obtain the current temperature of N preset temperature measurement points in the target area on the device casing.

[0050] In this embodiment, when the junction temperature value read by the main control unit in real time is within the rated operating temperature range of the target chip, and the temperature acquisition device inside the target chip has no fault error, no data overflow or abnormal jump, it means that the junction temperature value is reliable and usable, that is, the current junction temperature data is valid; by substituting the current junction temperature data of N target chips into their respective temperature coupling relationship models for calculation, the current temperature of N preset temperature measurement points corresponding to N target chips can be obtained.

[0051] As an example, the construction process of the temperature coupling relationship model in this embodiment can be as follows: In a constant temperature experimental environment, different levels of operating power consumption are applied to the target chip, and the actual temperatures of the chip junction temperature and the corresponding preset temperature measurement points on the device housing are collected simultaneously, recording multiple sets of sample data of junction temperature and housing temperature; the sample data are fitted using a linear or nonlinear fitting algorithm to obtain the temperature coupling relationship model corresponding to each preset temperature measurement point. For example, the temperature coupling relationship model of a certain preset temperature measurement point conforms to a single-point mapping relationship and can be expressed as: Housing temperature = a Junction temperature + b, where a and b are the fitting coefficients of the preset temperature measurement point, which are determined by the relative position of the preset temperature measurement point and the corresponding target chip, and the thermal conductivity of the shell.

[0052] The temperature acquisition method provided in this embodiment does not require additional temperature acquisition devices to be placed on the device housing. It only needs to be calculated by utilizing the junction temperature detection capability of the target chip itself, which is highly efficient, low-cost, and highly feasible.

[0053] Reference Figure 6 In some feasible embodiments, the step of obtaining the current temperature of N preset temperature measurement points in the target area on the device housing in step S10 above may further include: Step S103: The vertical projection points of the temperature measuring ends of the N thermal dipole probes set inside the equipment housing onto the equipment housing are taken as the N preset temperature measuring points in the target area on the equipment housing.

[0054] In this embodiment, the thermal dipole probe can be fixed to the PCB board inside the device by a bracket. A small gap, such as 0.5 mm, can be maintained between its temperature measuring end and the inner wall of the device housing. The thermal dipole probe will not directly contact the device housing to avoid interfering with the heat conduction path of the device housing. Its vertical projection point falls within the target area to ensure that the temperature collected by the thermal dipole probe can reflect the housing temperature level at the corresponding preset temperature measuring point.

[0055] Step S104: The real-time temperature of the fluid inside the device housing collected by N thermal dipole probes is thermoelectrically converted by a temperature converter set on the device PCB board to obtain the current temperature of N preset temperature measurement points.

[0056] In this embodiment, a temperature converter mounted on the device's PCB board is electrically connected to N thermocouple probes. It receives the thermoelectric potential signal output from the thermocouple probes detecting the temperature of the fluid (such as air) inside the casing. This signal is then used for cold junction temperature compensation, signal amplification, analog-to-digital conversion, and linearization correction, ultimately outputting a digital temperature value to achieve thermoelectric conversion. Since the fluid inside the casing is in thermal equilibrium with the casing wall, the fluid temperature can directly represent the temperature at the corresponding casing location, i.e., the preset temperature measurement point. Furthermore, the accuracy can be further improved through fine-tuning using pre-calibrated correction coefficients.

[0057] As an example, taking N=3 as an example, refer to... Figure 7 , Figure 7 A schematic diagram of the layout of a thermal dipole probe on a PCB board is provided. Figure 7 It can be seen that the preset temperature measurement points 1, 2, and 3 on the device housing correspond to point1, point2, and point3 on the PCB board, respectively. Thermocouple probe 1, thermocouple probe 2, and thermocouple probe 3 are used to collect the temperature of the three preset temperature measurement points and provide the collected temperature to the temperature converter. The temperature converter can be connected to the restart switch on the PCB board, so that the device can be restarted in time when the temperature reaches or is about to reach the melting standard, thus avoiding melting.

[0058] The temperature acquisition method provided in this embodiment can directly acquire temperature through a built-in probe and temperature converter, without relying on the junction temperature detection capability of the target chip. It can be implemented as long as the corresponding device can be deployed inside the casing of the electronic device. Even if the junction temperature detection of the target chip is inaccurate due to a fault, the current temperature of the preset temperature measurement point can still be obtained normally, which is more robust and applicable to more scenarios.

[0059] Furthermore, embodiments of this application also provide an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the temperature monitoring method in any of the above embodiments.

[0060] The following is for reference. Figure 8 The diagram illustrates a structural schematic of an electronic device suitable for implementing embodiments of this application. The electronic device in these embodiments may be an FTTR device, or other mobile or fixed terminal comprising a device housing and an internal chip. Figure 8 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0061] like Figure 8 As shown, the electronic device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory 1002 or a program loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the electronic device. The processing unit 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems can be connected to the input / output interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. The communication device 1009 allows the electronic device to communicate wirelessly or wiredly with other devices to exchange data. Although the diagrams show electronic devices with various systems, it should be understood that it is not required to implement or have all of the systems shown. More or fewer systems may be implemented alternatively.

[0062] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer storage medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from read-only memory 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0063] The beneficial effects of the electronic device provided in this application are the same as those of the temperature monitoring method provided in the above embodiments, and other technical features of the electronic device are the same as those disclosed in the above method embodiments, and will not be repeated here.

[0064] Furthermore, this application also provides a computer storage medium, which can be a non-volatile computer storage medium, storing a computer program that, when executed by a processor, implements the temperature monitoring method provided in any of the above embodiments.

[0065] The computer storage medium provided in this application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0066] The aforementioned computer storage medium may be included in an electronic device; or it may exist independently and not be assembled into an electronic device.

[0067] The aforementioned computer storage medium carries one or more programs, which, when executed by an electronic device, enable the electronic device to implement the aforementioned temperature monitoring method.

[0068] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0069] The beneficial effects of the computer storage medium provided in this application are the same as those of the temperature monitoring method provided in the above embodiments, and will not be repeated here.

[0070] It should be understood that the various parts disclosed in the embodiments of this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0071] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0072] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0073] It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown in the flowchart. The terms "first," "second," etc., in the specification, claims, and drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0074] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0075] The above describes some implementation methods of the embodiments of this application. However, the embodiments of this application are not limited to the above implementation methods. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the embodiments of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of the embodiments of this application.

Claims

1. A temperature monitoring method, characterized in that, include: Obtain the current temperature of N preset temperature measurement points in the target area on the device housing, where N is greater than or equal to 3, and the target area is the area on the device housing corresponding to the target chip; Using the N preset temperature measurement points as the input point set, iterative interpolation calculation is performed based on the input point set to obtain the regional temperature of the target area; The difference between the current temperature of the N preset temperature measurement points and the temperature of the area is calculated, and the calculated difference is compared with a first preset threshold to obtain a first comparison result. Based on the first comparison result, the highest temperature among the current temperatures of the N preset temperature measurement points and the area temperature are selected as the current shell temperature of the target area. The step of performing iterative interpolation calculations based on the input point set to obtain the regional temperature of the target region includes: Perform a target operation, which includes, for any two points in the input point set, establishing a set of heat conduction equations related to the equilibrium point and equilibrium temperature between the two points, based on the current temperature of the two points, the distance between the two points, the heat dissipation of the two points, the thermal conductivity of the device housing, and the unit cross-sectional area of ​​the sidewall of the device housing; Solve the heat conduction equations to obtain the equilibrium point and the equilibrium temperature between any two points; Obtain the absolute value of the temperature difference between any two equilibrium points out of the N equilibrium points, and compare the absolute value of each temperature difference with a second preset threshold to obtain a second comparison result; If the second comparison result indicates that the absolute value of the temperature difference is greater than the second preset threshold, the N equilibrium points are used as a new set of input points, and the process is switched to execute the target operation. If the second comparison result indicates that the absolute value of all the temperature differences is less than or equal to the second preset threshold, the N equilibrium points obtained at present are taken as N final target points, and the average temperature of the N final target points is taken as the regional temperature.

2. The temperature monitoring method as described in claim 1, characterized in that, The step of calculating the difference between the current temperature of the N preset temperature measurement points and the temperature of the area, and comparing the calculated difference with a first preset threshold to obtain a first comparison result includes: The absolute values ​​of the two differences obtained by subtracting the highest and lowest temperatures among the current temperatures of the N preset temperature measurement points from the temperature of the region are respectively denoted as the first temperature difference and the second temperature difference. The first temperature difference and the second temperature difference are compared with the first preset threshold to obtain the first comparison result.

3. The temperature monitoring method as described in claim 2, characterized in that, The step of selecting the highest temperature from the region temperature and the current temperatures of the N preset temperature measurement points as the current shell temperature of the target region based on the first comparison result includes: If the first comparison result indicates that both the first temperature difference and the second temperature difference are less than or equal to the first preset threshold, the temperature of the region shall be taken as the current shell temperature of the target region. If the first comparison result indicates that at least one of the first temperature difference and the second temperature difference is greater than the first preset threshold, the highest temperature is taken as the current shell temperature of the target area.

4. The temperature monitoring method as described in claim 1, characterized in that, The acquisition of the current temperature of N preset temperature measurement points in the target area on the device housing includes: Obtain the current junction temperature data of N target chips; In response to the validity of the current junction temperature data, the current junction temperature data is substituted into the temperature coupling relationship model obtained in advance through experimental fitting to obtain the current temperature of N preset temperature measurement points in the target area on the device housing.

5. The temperature monitoring method as described in claim 1, characterized in that, The method of obtaining the current temperature of N preset temperature measurement points in the target area on the device housing also includes: The vertical projection points of the temperature measuring ends of the N thermocouple probes set inside the equipment housing onto the equipment housing are taken as the N preset temperature measuring points in the target area on the equipment housing. By using a temperature converter mounted on the device's PCB board, the real-time temperature of the fluid inside the device housing collected by the N thermocouple probes is thermoelectrically converted to obtain the current temperature of the N preset temperature measurement points.

6. An electronic device, characterized in that, The electronic device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the temperature monitoring method as described in any one of claims 1 to 5.

7. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the temperature monitoring method as described in any one of claims 1 to 5.

8. A computer storage medium, characterized in that, The computer storage medium stores a computer program, which, when executed by a processor, implements the temperature monitoring method as described in any one of claims 1 to 5.

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