A chip appearance inspection device and inspection method

Abstract

This invention discloses a chip appearance inspection device and method, relating to the field of chip appearance inspection technology. The device includes a moving mechanism and an inspection component. The inspection component includes an inspection camera, a first inspection light source, a second inspection light source, and a third inspection light source. Each inspection light source is arranged in a ring, with its height gradually decreasing and its inner diameter gradually increasing along the direction away from the inspection camera. The first inspection light source illuminates the top area of ​​the chip's solder ball surface, the second inspection light source illuminates the transition area, and the third inspection light source illuminates the sidewalls and edge areas. The incident angle of each inspection light source gradually increases along the direction away from the inspection camera to match the reflection characteristics of different areas of the solder ball, thereby reducing reflection blind spots. The moving mechanism drives the inspection component to move along the X and Y axes to achieve appearance inspection of the chip's solder ball surface. This invention can improve the imaging quality and inspection accuracy of the chip's solder ball surface.

Description

Technical Field

[0001] This invention relates to the field of chip appearance inspection, and more particularly to a chip appearance inspection device and inspection method. Background Technology

[0002] After chip packaging, a regularly arranged array of solder balls (i.e., solder ball surface) typically forms on the bottom of the chip for subsequent electrical connections. The size, shape, positional accuracy, and surface quality of the solder balls directly affect the soldering reliability and performance of the chip. Therefore, rigorous visual inspection of the chip's solder ball surface is required before shipment.

[0003] In existing technologies, traditional AOI (Automated Optical Inspection) equipment typically uses a single light source to illuminate the solder ball surface of the chip, and then a camera captures images of the solder ball surface. However, due to the hemispherical structure of the solder ball, it has strong reflectivity and directionality, and its surface reflection of light has a significant angle-dependent characteristic. When the light source arrangement is unreasonable or the illumination uniformity is insufficient, local highlights and shadows or reflection blind spots can easily occur on the solder ball surface, causing some areas of the image to be overexposed or underexposed, resulting in blurred solder ball outlines and uneven grayscale distribution, seriously affecting image quality. In addition, solder ball arrays are usually densely distributed, and multiple solder balls can easily block or reflect each other, further exacerbating the problem of uneven illumination. Under these circumstances, traditional single-angle or single-type light sources cannot simultaneously ensure overall illumination uniformity and detail representation, thereby reducing the accuracy of chip defect identification. For example, defects such as cold solder joints, missing balls, misalignment, or abnormal shapes are difficult to identify accurately.

[0004] Therefore, in the existing chip appearance inspection device, when it comes to the inspection of chip solder spheres, there is a problem that the chip imaging uniformity is poor and edge details are lost due to the single illumination angle and uneven illumination of traditional light sources, which in turn affects the accuracy of chip defect identification and the stability of detection. Summary of the Invention

[0005] The purpose of this invention is to provide a chip appearance inspection device and inspection method, which solves the problem that the chip imaging effect is poor due to uneven illumination from traditional light sources when the chip appearance inspection device involves the inspection of the chip solder sphere.

[0006] To achieve this objective, the present invention adopts the following technical solution: According to a first aspect, the present invention provides a chip appearance inspection device, including a moving mechanism and an inspection component. The inspection component includes an inspection camera, a first inspection light source, a second inspection light source, and a third inspection light source. The first inspection light source, the second inspection light source, and the third inspection light source are all arranged in a ring and spaced apart below the inspection camera along the Z-axis direction. The height of each inspection light source decreases in the direction away from the inspection camera, and the inner diameter of each inspection light source increases in the direction away from the inspection camera. The first detection light source is used to illuminate the top area of ​​the chip solder ball surface, the second detection light source is used to illuminate the transition area of ​​the chip solder ball surface, and the third detection light source is used to illuminate the sidewall and edge areas of the chip solder ball surface, so that the incident angle of each detection light source gradually increases in the direction away from the detection camera, respectively matching the reflection characteristics of the top area, transition area and sidewall area of ​​the chip solder ball surface, and reducing the reflection blind zone of the chip solder ball surface. The moving mechanism is used to drive the detection component to move linearly along the X-axis and Y-axis directions, so that the detection camera can perform solder ball appearance inspection on the chip at the detection position; the X-axis, Y-axis and Z-axis directions are perpendicular to each other.

[0007] Optionally, the detection assembly further includes a detection stage, the optical axis of the detection camera is arranged along the Z-axis and fixedly connected to the detection stage, and the detection stage is provided with a first carrier plate, a second carrier plate and a third carrier plate arranged sequentially along the side away from the detection camera; The first detection light source is fixedly connected to the bottom of the first carrier plate, the second detection light source is fixedly connected to the bottom of the second carrier plate, and the third detection light source is fixedly connected to the bottom of the third carrier plate, so that the detection light sources form a stepped arrangement structure.

[0008] Optionally, the testing platform is provided with a plurality of mounting holes, and the testing platform is provided with three mounting blocks for fastening with the mounting holes, and the three mounting blocks are respectively fastened to the first carrier plate, the second carrier plate and the third carrier plate in a one-to-one correspondence; One of the mounting blocks is respectively positioned and abutted against the first carrier plate and the second carrier plate, another mounting block is respectively positioned and abutted against the second carrier plate and the third carrier plate, and the remaining mounting block is installed on the side of the first carrier plate away from the second carrier plate.

[0009] Optionally, the first detection light source has a first light-emitting surface, the second detection light source has a second light-emitting surface, and the third detection light source has a third light-emitting surface; The first light-emitting surface, the second light-emitting surface, and the third light-emitting surface are all arranged in a trumpet shape so that the light gradually diverges away from the corresponding detection light source; the distance between the first light-emitting surface and the second light-emitting surface is greater than the distance between the second light-emitting surface and the third light-emitting surface.

[0010] Optionally, the light-emitting end of the first detection light source is embedded in the second carrier plate and is positioned toward the second detection light source, the light-emitting end of the second detection light source is embedded in the third carrier plate and is positioned toward the third detection light source, and the light-emitting end of the third detection light source is positioned toward the chip located at the detection position, so as to reduce the light shading of the chip's solder ball surface by adjacent detection light sources.

[0011] Optionally, the detection camera is equipped with a detection lens close to the first detection light source, and the length of the detection lens along the Z-axis is greater than the length of the detection camera along the Z-axis. A first clamping block is fixedly installed on the detection platform. The first clamping block has a first clamping inclined surface that is shaped like a horn. A second clamping block is detachably connected to the first clamping block. The second clamping block has a second clamping inclined surface that is shaped like a horn. The first clamping inclined surface and the second clamping inclined surface are respectively pressed against the outer wall surface of the detection lens so that the optical axis of the detection lens is coaxial with the annular central axis of the first detection light source, the second detection light source and the third detection light source.

[0012] Optionally, the moving mechanism includes a first moving component and a second moving component connected together, and the detection component is connected to the second moving component; The first moving component is used to drive the second moving component to move linearly along the Y-axis direction, and the second moving component is used to drive the detection component to move linearly along the X-axis direction, so that the detection component moves in the X-axis and Y-axis directions and performs omnidirectional solder ball appearance inspection on the chip located at the detection position.

[0013] Optionally, the first moving component includes a first frame, a first moving rod, and a first moving motor; the second moving component is slidably connected to the first frame; and the first moving rod is arranged along the Y-axis and rotatably connected to the first frame. The first moving motor is used to drive the first moving rod to rotate around the Y-axis, so that the first moving rod drives the second moving component to move linearly along the Y-axis.

[0014] Optionally, the first moving motor is arranged along the Y-axis direction, and the height of the first moving rod along the Z-axis direction is higher than the height of the first moving motor along the Z-axis direction. The output end of the first mobile motor and the rotating end of the first mobile rod are respectively fitted with first transmission wheels. The two first transmission wheels have the same outer diameter and are wound with a first transmission belt. The axes of the two first transmission wheels are located on the same straight line along the Z-axis to reduce the off-center load torque generated during the transmission of the first transmission belt.

[0015] Optionally, the second moving component includes a second frame, a second moving rod, and a second moving motor. The detection component is slidably connected to the second frame, and the second moving rod is arranged along the X-axis and rotatably connected to the second frame. The second moving motor is used to drive the second moving rod to rotate around the X-axis, so that the second moving rod drives the detection component to move linearly along the X-axis, so that the detection component can perform continuous scanning motion along the chip feeding direction and reduce the position error caused by the start-stop process.

[0016] Optionally, the second moving motor is arranged along the X-axis direction, and the height of the second moving rod along the Z-axis direction is higher than the height of the second moving motor along the Z-axis direction. The output end of the second moving motor and the rotating end of the second moving rod are respectively fitted with second transmission wheels. The two second transmission wheels have the same outer diameter and are wound together with a second transmission belt that is set in an inclined state, so that the second transmission belt forms a force path with a Z-axis component during transmission and reduces the vibration generated during transmission.

[0017] According to a second aspect, the present invention provides a chip appearance inspection method, applied to the chip appearance inspection apparatus described in the first aspect, comprising: Step S1: Move the chip to be tested to the detection position along the X-axis direction, and drive the detection component to move linearly along the X-axis and Y-axis directions through the moving mechanism to ensure that the detection component is in the detection position; Step S2: Activate the first detection light source, the second detection light source, and the third detection light source to illuminate the top area, the transition area, and the sidewall edge area of ​​the chip solder ball surface, respectively; wherein, the first detection light source, the second detection light source, and the third detection light source are arranged in a ring in sequence, and each detection light source illuminates the chip solder ball surface according to a different incident angle; Step S3: The image of the chip's solder ball surface is acquired in real time by the detection camera to realize the appearance inspection of the chip's solder ball surface.

[0018] Compared with the prior art, the present invention has the following beneficial effects: This invention provides a chip appearance inspection device and method. By arranging a first, second, and third detection light source at intervals along the Z-axis below the inspection camera, with each light source exhibiting a specific gradient in height and inner diameter, different light sources correspond to different incident angles. This allows for matched illumination of the top, transition, and sidewall regions of the solder ball surface. This structure effectively adapts to the reflective characteristics of the hemispherical surface of the solder ball, significantly reducing highlights, shadows, and reflection blind spots caused by a single light source. The multi-layered annular first, second, and third detection light sources work synergistically to ensure more uniform illumination of the entire solder ball surface, significantly improving uneven image grayscale distribution and addressing issues of local overexposure or underexposure. This enhances the imaging quality and edge contour clarity of the solder ball surface, facilitating accurate extraction of its morphological features.

[0019] Furthermore, by using a zoned lighting method, mutual reflection interference and occlusion effects between adjacent solder balls can be effectively reduced, improving the adaptability to dense solder ball arrays and enhancing defect detection capabilities, making defects such as cold solder joints, missing balls, misalignment, and abnormal morphology easier to identify. By driving the detection components precisely in the X and Y axes through a moving mechanism, a comprehensive scan of the chip can be performed, further improving detection coverage and stability. Therefore, this invention solves the problem of poor chip imaging results caused by uneven illumination from traditional light sources when inspecting the solder ball surface of chips in existing chip appearance inspection devices. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of a chip appearance inspection device provided in an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of a detection component in a chip appearance inspection device provided in an embodiment of the present invention; Figure 3 This is a cross-sectional structural diagram of a detection component in a chip appearance inspection device provided in an embodiment of the present invention; Figure 4 This is an exploded view of the first clamping block and the second clamping block in a chip appearance inspection device provided in an embodiment of the present invention; Figure 5 This is a three-dimensional structural diagram of a moving mechanism in a chip appearance inspection device provided by an embodiment of the present invention, from one perspective. Figure 6 This is a three-dimensional structural diagram of the moving mechanism in a chip appearance inspection device provided by an embodiment of the present invention from another perspective; Figure 7 This is a schematic diagram of a chip solder ball structure provided in an embodiment of the present invention; Figure 8 This is a flowchart illustrating a chip appearance inspection method provided in an embodiment of the present invention.

[0023] Illustration: 10. Moving mechanism; 11. First moving assembly; 111. First frame; 112. First moving rod; 113. First moving motor; 114. First transmission wheel; 115. First transmission belt; 12. Second moving assembly; 121. Second frame; 122. Second moving rod; 123. Second moving motor; 124. Second transmission wheel; 125. Second transmission belt; 20. Detection component; 21. Detection camera; 22. First detection light source; 221. First light-emitting surface; 23. Second detection light source; 231. Second light-emitting surface; 24. Third detection light source; 241. Third light-emitting surface; 25. Detection stage; 251. Mounting hole; 261. First carrier plate; 262. Second carrier plate; 263. Third carrier plate; 27. Mounting block; 28. Detection lens; 291. First clamping block; 2911. First clamping inclined surface; 292. Second clamping block; 2921. Second clamping inclined surface; 100. Chip solder sphere. Detailed Implementation

[0024] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0025] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0026] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] The first aspect of this invention provides a chip appearance inspection device, such as... Figures 1 to 7 As shown, the device includes a moving mechanism 10 and a detection component 20. The detection component 20 includes a detection camera 21, a first detection light source 22, a second detection light source 23, and a third detection light source 24. The first detection light source 22, the second detection light source 23, and the third detection light source 24 are all arranged in a ring and spaced apart below the detection camera 21 along the Z-axis. The height of each detection light source decreases in the direction away from the detection camera 21, and the inner diameter of each detection light source increases in the direction away from the detection camera 21. The first detection light source 22 is used to illuminate the top area of ​​the chip solder ball surface 100, the second detection light source 23 is used to illuminate the transition area of ​​the chip solder ball surface 100, and the third detection light source 24 is used to illuminate the sidewall and edge areas of the chip solder ball surface 100, so that the incident angle of each detection light source gradually increases in the direction away from the detection camera 21, respectively matching the reflection characteristics of the top area, transition area and sidewall area of ​​the chip solder ball surface 100, and reducing the reflection blind zone of the chip solder ball surface 100; The moving mechanism 10 is used to drive the detection component 20 to move linearly along the X-axis and Y-axis directions so that the detection camera 21 can perform solder ball appearance inspection on the chip in the detection position; the X-axis, Y-axis and Z-axis directions are perpendicular to each other.

[0028] It should be noted that the chip appearance inspection device provided by the present invention, by arranging a first detection light source 22, a second detection light source 23, and a third detection light source 24 at intervals along the Z-axis below the inspection camera 21, with the height and inner diameter of each detection light source varying in a specific gradient, allows different light sources to correspond to different incident angles, thereby providing matched illumination for the top area, transition area, and sidewall area of ​​the solder ball surface respectively. This structure can fully adapt to the reflective characteristics of the hemispherical surface of the solder ball, effectively reducing the problems of highlights, shadows, and reflection blind spots caused by illumination from a single light source. The multi-layered annular first detection light source 22, second detection light source 23, and third detection light source 24 have a synergistic effect, making the overall illumination of the chip solder ball surface 100 more uniform, significantly improving the uneven grayscale distribution, local overexposure, or underexposure of the image, thereby improving the imaging quality and edge contour clarity of the chip solder ball surface 100, which is beneficial for accurately extracting the morphological features of the solder ball.

[0029] In this application, the chip solder spheres 100 are typically hemispherical structures arranged in a regular array. To facilitate the description of the spatial positions of different regions and their corresponding illumination methods, the chip solder spheres 100 can be divided into a top region, a transition region, and a sidewall and edge region according to the angle between their surface normal direction and the optical axis of the detection camera.

[0030] The top region is the area near the top of the solder ball, where the angle between the surface normal and the optical axis of the detection camera is small. The transition region is a curved area extending outward from the top region, where the angle between the surface normal and the optical axis of the detection camera gradually increases. The sidewall and edge regions are curved areas near the connection between the solder ball and the substrate, where the angle between the surface normal and the optical axis of the detection camera is large.

[0031] Based on the above partitioning, different regions correspond to different incident light angles. By providing matching illumination methods for each region, it is beneficial to optimize the overall illumination conditions of the tin sphere, thereby improving image quality and detection results.

[0032] Furthermore, by using a zoned lighting method, mutual reflection interference and occlusion effects between adjacent solder balls can be effectively reduced, improving the adaptability to dense solder ball arrays and enhancing defect detection capabilities, making defects such as cold solder joints, missing balls, misalignment, and abnormal morphology easier to identify. The moving mechanism 10 drives the detection component 20 to move precisely in the X and Y axes, enabling comprehensive scanning and detection of the chip, further improving detection coverage and stability. Therefore, this invention solves the problem in existing chip appearance inspection devices involving the detection of chip solder ball surfaces 100, where uneven illumination from traditional light sources leads to poor chip imaging.

[0033] like Figures 1 to 3As shown, the detection assembly 20 also includes a detection stage 25. The optical axis of the detection camera 21 is set along the Z-axis and fixedly connected to the detection stage 25. The detection stage 25 is provided with a first carrier plate 261, a second carrier plate 262 and a third carrier plate 263 arranged sequentially along the side away from the detection camera 21. The first detection light source 22 is fixedly connected to the bottom of the first carrier plate 261, the second detection light source 23 is fixedly connected to the bottom of the second carrier plate 262, and the third detection light source 24 is fixedly connected to the bottom of the third carrier plate 263, so that the detection light sources form a stepped arrangement structure.

[0034] In practice, a detection stage 25 is set up, and a first carrier plate 261, a second carrier plate 262, and a third carrier plate 263 are sequentially arranged on the detection stage 25 in a direction away from the detection camera 21. Each detection light source is fixed to the bottom of its corresponding carrier plate, thus forming a stable stepped arrangement structure. This structure can precisely define the height position and relative spacing of each detection light source in space, ensuring an orderly change in the incident angle of each light source, which is beneficial for targeted illumination of different areas of the solder ball surface.

[0035] By using a tiered carrier board arrangement, the installation accuracy and structural stability of the multi-light source system are improved, preventing light source displacement or angular changes during use. This also facilitates independent installation, adjustment, and maintenance of different detection light sources, thereby enhancing the reliability and maintainability of the equipment. Furthermore, the stepped arrangement helps reduce mutual obstruction and light interference between the detection light sources, resulting in a more rational light distribution and further enhancing the uniformity and layering of the overall illumination of the solder ball surface. This, in turn, improves the imaging quality and detail resolution of the chip's solder ball surface 100.

[0036] In summary, by setting up the detection stage 25 and the stepped carrier plate structure, the layout of the multi-light source system is made more reasonable and stable, effectively improving the imaging consistency, detection accuracy and operational stability of the detection device.

[0037] like Figure 2 and Figure 3 As shown, the testing platform 25 is provided with a plurality of mounting holes 251, and the testing platform 25 is provided with three mounting blocks 27 for fastening with the mounting holes 251. The three mounting blocks 27 are respectively fastened with the first carrier plate 261, the second carrier plate 262 and the third carrier plate 263. One mounting block 27 is respectively positioned and abutted against the first carrier plate 261 and the second carrier plate 262, another mounting block 27 is respectively positioned and abutted against the second carrier plate 262 and the third carrier plate 263, and the remaining mounting block 27 is mounted on the side of the first carrier plate 261 away from the second carrier plate 262. In this embodiment, the carrier plates and the mounting blocks 27 are all fastened together by screws.

[0038] In practical implementation, multiple mounting holes 251 are provided on the testing stage 25, and three mounting blocks 27 are provided in conjunction with them. The mounting blocks 27 are respectively and fastened to the first carrier plate 261, the second carrier plate 262, and the third carrier plate 263, forming a modular and positionable assembly structure. This structure can improve the installation accuracy of each carrier plate on the testing stage 25 and ensure the stability and consistency of the overall position of the multi-layer light source assembly.

[0039] Furthermore, by limiting and abutting one of the mounting blocks 27 with the first carrier plate 261 and the second carrier plate 262 respectively, and limiting and abutting the other mounting block 27 with the second carrier plate 262 and the third carrier plate 263 respectively, a reliable relative position constraint relationship is formed between the adjacent carrier plates, which effectively prevents the carrier plates from being misaligned or shifted during use, thereby ensuring the stability of the spatial position relationship of each detection light source and ensuring the accuracy and repeatability of the illumination angle.

[0040] like Figure 2 and Figure 3 As shown, the first detection light source 22 is provided with a first light-emitting surface 221, the second detection light source 23 is provided with a second light-emitting surface 231, and the third detection light source 24 is provided with a third light-emitting surface 241. The first light-emitting surface 221, the second light-emitting surface 231, and the third light-emitting surface 241 are all arranged in a trumpet shape so that the light gradually diverges away from the corresponding detection light source; the distance between the first light-emitting surface 221 and the second light-emitting surface 231 is greater than the distance between the second light-emitting surface 231 and the third light-emitting surface 241.

[0041] In specific implementation, by setting the first light-emitting surface 221, the second light-emitting surface 231, and the third light-emitting surface 241 all as trumpet-shaped structures, the light emitted by each detection light source can gradually diverge in the direction away from the light source, thereby expanding the effective illumination range of a single light source, reducing the highlight phenomenon caused by local light concentration, and improving the uniformity of overall illumination of the solder ball surface. At the same time, the trumpet-shaped light-emitting structure can guide and shape the light to a certain extent, making the light from different angles transition more smoothly, which helps to enhance the adaptability to areas with varying curvature on the solder ball surface, thereby improving the detail rendering effect of the top, transition area, and sidewall area.

[0042] Furthermore, by setting the distance between the first light-emitting surface 221 and the second light-emitting surface 231 to be greater than the distance between the second light-emitting surface 231 and the third light-emitting surface 241, the illumination coverage between high-position light sources is more sufficient, while the coordination between low-position light sources is closer. This helps optimize the superposition relationship of illumination in each layer, reduces illumination gaps and redundant interference areas, and thus makes the overall light field distribution more continuous and balanced. In addition, this differentiated spacing design can further match the requirements of different regions for incident light angle and light intensity, so that each detection light source forms a more reasonable illumination gradient distribution in space, thereby effectively reducing the reflection blind zone of the chip tin sphere 100 and improving the chip imaging quality and edge recognition capability.

[0043] In summary, this invention, through its trumpet-shaped light-emitting surface and differentiated spacing design, enables uniform light dispersion and reasonable superposition, further improving the illumination uniformity and detail representation capabilities of chip tin sphere 100 detection, thereby enhancing detection accuracy and stability.

[0044] like Figure 2 and Figure 3 As shown, the light-emitting end of the first detection light source 22 is embedded in the second carrier plate 262 and is positioned toward the second detection light source 23. The light-emitting end of the second detection light source 23 is embedded in the third carrier plate 263 and is positioned toward the third detection light source 24. The light-emitting end of the third detection light source 24 is positioned toward the chip located at the detection position, so as to reduce the light shading of the chip solder ball surface 100 by the adjacent detection light sources.

[0045] In specific implementation, by embedding the light-emitting end of the first detection light source 22 into the second carrier plate 262 and oriented towards the second detection light source 23, and embedding the light-emitting end of the second detection light source 23 into the third carrier plate 263 and oriented towards the third detection light source 24, the light sources at each level form a nested layout structure in space, thereby effectively reducing the obstruction of the light-emitting path of the lower light source by the upper light source structure. At the same time, the light-emitting end of the third detection light source 24 is directly oriented towards the chip located at the detection position, so that the bottom light source can illuminate the sidewalls and edge areas of the solder ball without obstruction, ensuring the illumination integrity of the critical detection area.

[0046] Through the above structural design, the light propagation path between each detection light source is smoother, effectively reducing structural obstruction and light interference between adjacent light sources. This allows the light to more fully cover all areas of the tin ball surface, thereby reducing the generation of local dark areas and reflection blind spots. In addition, the embedded and directional arrangement helps to reduce the overall size of the light source assembly, making the light source structure more compact, improving the equipment integration, and enhancing the controllability and consistency of the light source illumination angle.

[0047] In summary, this invention effectively reduces light occlusion, improves light energy utilization and illumination uniformity by embedding and directionally optimizing the light-emitting ends of each detection light source, thereby further improving the imaging quality and defect detection accuracy of the chip tin sphere 100.

[0048] like Figures 2 to 4 As shown, a detection lens 28 is mounted on the detection camera 21 near the first detection light source 22, and the length of the detection lens 28 along the Z-axis is greater than the length of the detection camera 21 along the Z-axis. A first clamping block 291 is fixedly installed on the testing stage 25. The first clamping block 291 is provided with a first clamping inclined surface 2911 in the shape of a horn. The first clamping block 291 is detachably connected to a second clamping block 292. The second clamping block 292 is provided with a second clamping inclined surface 2921 in the shape of a horn. The first clamping inclined surface 2911 and the second clamping inclined surface 2921 abut against the outer wall surface of the detection lens 28, so that the optical axis of the detection lens 28 remains coaxial with the annular central axis of the first detection light source 22, the second detection light source 23 and the third detection light source 24.

[0049] In specific implementation, by installing a detection lens 28 on the detection camera 21, with the length of the detection lens 28 along the Z-axis greater than that of the detection camera 21 body, the detection lens 28 can be placed closer to the first detection light source 22. This shortens the effective optical path distance from the light source to the detection area, which is beneficial for improving image clarity and light utilization efficiency, and enhancing the ability to capture the detailed features of the solder balls. Simultaneously, by setting a first clamping block 291 and a detachably connected second clamping block 292 on the detection stage 25, and respectively setting a first clamping inclined surface 2911 and a second clamping inclined surface 2921 in a trumpet shape on both, the two clamping inclined surfaces can form surface contact with the outer wall surface of the detection lens 28 and achieve adaptive clamping. This trumpet-shaped inclined surface structure has a guiding and centering function, and can automatically correct and position the detection lens 28 during installation, improving assembly accuracy.

[0050] Furthermore, by clamping the detection lens 28 with the first clamping inclined surface 2911 and the second clamping inclined surface 2921, the optical axis of the detection lens 28 is kept coaxial with the annular central axis of the first detection light source 22, the second detection light source 23, and the third detection light source 24, effectively ensuring the coaxiality and consistency of the optical system. In addition, the second clamping block 292 and the first clamping block 291 are fastened together with screws, which ensures clamping stability while facilitating the installation, replacement, and maintenance of the detection lens 28, improving the ease of use and adaptability of the equipment.

[0051] In summary, by using the detection lens 28, the first clamping block 291, and the second clamping block 292 in cooperation, this invention not only improves the installation accuracy and stability of the detection lens 28, but also ensures the coaxiality of the optical system, thereby further improving the chip imaging quality and the consistency of the detection results.

[0052] like Figure 1 , Figure 5 and Figure 6 As shown, the moving mechanism 10 includes a first moving component 11 and a second moving component 12 connected together, and the detection component 20 is connected to the second moving component 12; The first moving component 11 is used to drive the second moving component 12 to move linearly along the Y-axis direction, and the second moving component 12 is used to drive the detection component 20 to move linearly along the X-axis direction, so that the detection component 20 moves in the X-axis and Y-axis directions and performs all-round solder ball appearance inspection on the chip located at the detection position.

[0053] In practical implementation, by setting up a first moving component 11 and a second moving component 12, and making them cooperate with each other, the detection component 20 achieves two-dimensional linkage movement in the X and Y axes, thereby constructing a stable planar scanning motion mechanism. The first moving component 11 drives the second moving component 12 to move along the Y axis, and the second moving component 12 drives the detection component 20 to move along the X axis, enabling the detection component 20 to accurately position and cover the detection area. This structure allows the detection component 20 to perform omnidirectional and multi-position scanning detection of the chip located at the detection position, effectively avoiding the detection blind zone problem caused by single-point detection and improving the detection coverage of the detection component 20.

[0054] In summary, by setting up a cooperative motion structure between the first moving component 11 and the second moving component 12, the present invention enables the detection component 20 to move with high precision in the X and Y axes, which not only improves the detection range and coverage of the detection component 20, but also enhances the stability of the detection process and the reliability of the detection results.

[0055] like Figure 1 , Figure 5 and Figure 6 As shown, the first moving component 11 includes a first frame 111, a first moving rod 112 and a first moving motor 113. The second moving component 12 is slidably connected to the first frame 111. The first moving rod 112 is arranged along the Y-axis and rotatably connected to the first frame 111. The first moving motor 113 drives the first moving rod 112 to rotate around the Y-axis, so that the first moving rod 112 drives the second moving assembly 12 to move linearly along the Y-axis. In this embodiment, the rotational movement of the first moving rod 112 drives the second frame 121 to move linearly along the Y-axis.

[0056] In practical implementation, by setting up a first frame 111, a first moving rod 112, and a first moving motor 113, the second moving component 12 is slidably connected to the first frame 111 and driven by the first moving rod 112 along the Y-axis, thus realizing a linear motion mechanism with a clear structure and stable transmission. The first moving motor 113 drives the first moving rod 112 to rotate around its own axis, converting the rotational motion into linear movement of the second moving component 12 along the Y-axis, which facilitates smooth and continuous displacement output. Simultaneously, the arrangement of the first moving rod 112 along the Y-axis makes the overall structural layout compact and reasonable, reducing the space occupied by the equipment, improving the rigidity and vibration resistance of the mechanism, and reducing the impact of vibrations generated during movement on image acquisition quality.

[0057] like Figure 1 , Figure 5 and Figure 6 As shown, the first moving motor 113 is arranged along the Y-axis direction, and the height of the first moving rod 112 along the Z-axis direction is higher than the height of the first moving motor 113 along the Z-axis direction. First transmission wheels 114 are respectively fitted on the output end of the first moving motor 113 and the rotating end of the first moving rod 112. The two first transmission wheels 114 have the same outer diameter and are wound together with the first transmission belt 115. The axes of the two first transmission wheels 114 are located on the same straight line along the Z-axis to reduce the off-center load torque generated during the transmission of the first transmission belt 115.

[0058] In specific implementation, by arranging the first moving motor 113 along the Y-axis and making the height of the first moving rod 112 in the Z-axis direction higher than that of the first moving motor 113, a layered transmission structure is formed, which helps to optimize the overall spatial layout, avoid structural interference, and improve the compactness and structural rationality of the device. Furthermore, by setting first transmission wheels 114 with the same outer diameter at the output end of the first moving motor 113 and the rotating end of the first moving rod 112 respectively, and connecting them via a first transmission belt 115, the power transmission is made smoother, effectively reducing impact and vibration during the transmission process, and improving the smoothness and reliability of the system operation.

[0059] Meanwhile, the shafts of the two first transmission pulleys 114 are located on the same straight line along the Z-axis, which makes the transmission belt evenly stressed during operation. This can effectively reduce the generation of off-center load torque and avoid problems such as belt misalignment, increased wear, or decreased transmission efficiency caused by uneven stress, thereby extending the service life of the transmission components.

[0060] like Figure 1 , Figure 5 and Figure 6As shown, the second moving component 12 includes a second frame 121, a second moving rod 122 and a second moving motor 123. The detection component 20 is slidably connected to the second frame 121, and the second moving rod 122 is arranged along the X-axis and rotatably connected to the second frame 121. The second moving motor 123 drives the second moving rod 122 to rotate around the X-axis, causing the second moving rod 122 to move the detection component 20 linearly along the X-axis, so that the detection component 20 can perform continuous scanning motion along the chip feeding direction and reduce positional errors caused by the start-up and stop process. In this embodiment, the detection stage 25 is slidably connected to the second frame 121.

[0061] In specific implementation, by setting up a second frame 121, a second moving rod 122, and a second moving motor 123, the detection component 20 is slidably connected to the second frame 121 and driven by the second moving rod 122 along the X-axis, achieving stable linear motion of the detection component 20 in the X-axis direction. The second moving motor 123 drives the second moving rod 122 to rotate around the X-axis, converting the rotational motion into linear movement of the detection component 20, which facilitates a smooth and continuous transmission process. This structure enables the detection component 20 to perform continuous scanning motion along the chip feeding direction, avoiding the inertial impact and positional deviation caused by frequent starts and stops in traditional intermittent movement methods, thereby significantly reducing positioning errors during movement and improving the continuity and consistency of the detection position.

[0062] Meanwhile, this continuous scanning method helps improve detection efficiency, enabling image acquisition and detection of the solder ball surface to be completed during chip movement, reducing detection cycle time and improving overall production line efficiency. Furthermore, the sliding guide constraint of the detection component 20 by the second frame 121 effectively ensures the straightness of its movement trajectory, avoiding deviation or shaking, thereby further improving the stability of image acquisition and the reliability of detection results.

[0063] In summary, the present invention achieves high-precision continuous scanning motion of the detection component 20 along the X-axis by optimizing the design of the second moving component 12. This not only reduces start-stop errors but also improves detection efficiency and stability, further enhancing the overall performance of appearance inspection of the chip tin ball surface 100.

[0064] like Figure 1 , Figure 5 and Figure 6 As shown, the second moving motor 123 is arranged along the X-axis, and the height of the second moving rod 122 along the Z-axis is higher than the height of the second moving motor 123 along the Z-axis. Second transmission wheels 124 are respectively fitted onto the output end of the second moving motor 123 and the rotating end of the second moving rod 122. The two second transmission wheels 124 have the same outer diameter and are wound together with a second transmission belt 125 that is set in an inclined state, so that the second transmission belt 125 forms a force path with a Z-axis component during transmission and reduces the vibration generated during transmission.

[0065] In specific implementation, by arranging the second moving motor 123 along the X-axis and making the height of the second moving rod 122 in the Z-axis direction higher than that of the second moving motor 123, a staggered transmission structure is formed, which helps to optimize the spatial layout, avoid interference between components, and improve the compactness and stability of the overall structure. Furthermore, by setting second transmission wheels 124 with the same outer diameter at the output end of the second moving motor 123 and the rotating end of the second moving rod 122 respectively, and connecting them with a second transmission belt 125 set in an inclined state, the power transmission path is no longer limited to a single plane, but forms a spatial force path with a Z-axis component, thereby dispersing and buffering vibrations during transmission.

[0066] The inclined arrangement of the second transmission belt 125 effectively reduces resonance and impact loads during transmission, minimizes periodic vibrations caused by single-plane transmission, and improves the smoothness of the transmission system. Simultaneously, it helps improve the stress state of the second transmission belt 125, making the stress more uniform, reducing local stress concentration, and extending the service life of the transmission structure. Furthermore, this structure enhances the stability of the second moving rod 122's rotation, thereby improving the smoothness and positioning accuracy of the detection component 20's movement along the X-axis, which is beneficial for ensuring image stability during continuous scanning detection.

[0067] In summary, the present invention effectively reduces transmission vibration and impact by spatially optimizing the design of the second moving component 12, thereby improving the stability and durability of the motion system and further enhancing the accuracy and reliability of the chip appearance inspection process.

[0068] A second aspect of this invention provides a chip appearance inspection method, applied to the chip appearance inspection apparatus of the first aspect, such as... Figure 8 As shown, it includes: Step S1: Move the chip to be tested to the detection position along the X-axis direction, and drive the detection component 20 to move linearly along the X-axis and Y-axis directions through the moving mechanism 10 to ensure that the detection component 20 is in the detection position; Step S2: Activate the first detection light source 22, the second detection light source 23, and the third detection light source 24 to illuminate the top area, transition area, and sidewall edge area of ​​the chip solder ball surface 100, respectively; wherein, the first detection light source 22, the second detection light source 23, and the third detection light source 24 are arranged in a ring in sequence, and each detection light source illuminates the chip solder ball surface 100 according to a different incident angle. Step S3: The image of the chip solder ball surface 100 is acquired in real time by the inspection camera 21 to realize the appearance inspection of the chip solder ball surface.

[0069] It should be noted that in step S1, the moving mechanism 10 drives the detection component 20 to move precisely in the X and Y axes, enabling the detection component 20 to accurately perform a full-coverage scan of the chip located at the detection position, avoiding detection blind spots and improving detection coverage. In step S2, the first detection light source 22, the second detection light source 23, and the third detection light source 24 provide targeted illumination to the top area, transition area, and sidewall edge area of ​​the solder ball surface from different incident angles, which can effectively match the reflection characteristics of different areas of the solder ball, significantly reduce the problems of highlights, shadows, and reflection blind spots, thereby improving the overall illumination uniformity and image quality. In step S3, the detection camera 21 performs real-time image acquisition of the solder ball surface, so that the image acquired under optimized lighting conditions has clearer edge contours and more uniform grayscale distribution, which is beneficial for the accurate identification of defects such as cold solder joints, missing balls, misalignment, and abnormal morphology.

[0070] Furthermore, this detection method combines multi-source zone illumination with continuous scanning detection, which not only improves the detection accuracy of the detection device but also enhances its detection efficiency and stability, making it suitable for the rapid detection needs of high-density solder ball arrays. In summary, the chip appearance inspection method provided by this invention can significantly improve the imaging quality of solder ball surfaces, increase the accuracy and efficiency of chip defect identification, and has good application value.

[0071] Working Principle: The chip appearance inspection device and method provided by this invention, by arranging a first detection light source 22, a second detection light source 23, and a third detection light source 24 at intervals along the Z-axis below the inspection camera 21, with the height and inner diameter of each detection light source varying in a specific gradient, different light sources correspond to different incident angles, thereby providing matched illumination for the top area, transition area, and sidewall area of ​​the solder ball surface respectively. This structure can fully adapt to the reflective characteristics of the hemispherical surface of the solder ball, effectively reducing the problems of highlights, shadows, and reflection blind spots caused by illumination from a single light source. The multi-layered annular first detection light source 22, second detection light source 23, and third detection light source 24 have a synergistic effect, making the overall illumination of the chip solder ball surface 100 more uniform, significantly improving the uneven grayscale distribution, local overexposure, or underexposure of the image, thereby improving the imaging quality and edge contour clarity of the chip solder ball surface 100, which is beneficial for accurately extracting the morphological features of the solder ball.

[0072] Furthermore, by using a zoned lighting method, mutual reflection interference and occlusion effects between adjacent solder balls can be effectively reduced, improving the adaptability to dense solder ball arrays and enhancing defect detection capabilities, making defects such as cold solder joints, missing balls, misalignment, and abnormal morphology easier to identify. The moving mechanism 10 drives the detection component 20 to move precisely in the X and Y axes, enabling comprehensive scanning and detection of the chip, further improving detection coverage and stability. Therefore, this invention solves the problem in existing chip appearance inspection devices involving the detection of chip solder ball surfaces 100, where uneven illumination from traditional light sources leads to poor chip imaging.

[0073] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip appearance inspection device, characterized in that, The device includes a moving mechanism and a detection component. The detection component includes a detection camera, a first detection light source, a second detection light source, and a third detection light source. The first, second, and third detection light sources are all arranged in a ring and spaced apart below the detection camera along the Z-axis. The height of each detection light source decreases in the direction away from the detection camera, and the inner diameter of each detection light source increases in the direction away from the detection camera. The first detection light source is used to illuminate the top area of ​​the chip solder ball surface, the second detection light source is used to illuminate the transition area of ​​the chip solder ball surface, and the third detection light source is used to illuminate the sidewall and edge areas of the chip solder ball surface, so that the incident angle of each detection light source gradually increases in the direction away from the detection camera, respectively matching the reflection characteristics of the top area, transition area and sidewall area of ​​the chip solder ball surface, and reducing the reflection blind zone of the chip solder ball surface. The moving mechanism is used to drive the detection component to move linearly along the X-axis and Y-axis directions, so that the detection camera can perform solder ball appearance inspection on the chip at the detection position.

2. The chip appearance inspection device according to claim 1, characterized in that, The detection assembly further includes a detection stage, the optical axis of the detection camera is set along the Z-axis and fixedly connected to the detection stage, and the detection stage is provided with a first carrier plate, a second carrier plate and a third carrier plate distributed sequentially along the side away from the detection camera; The first detection light source is fixedly connected to the bottom of the first carrier plate, the second detection light source is fixedly connected to the bottom of the second carrier plate, and the third detection light source is fixedly connected to the bottom of the third carrier plate, so that the detection light sources form a stepped arrangement structure.

3. The chip appearance inspection device according to claim 2, characterized in that, The testing platform is provided with multiple mounting holes, and the testing platform is provided with three mounting blocks for fastening with the mounting holes. The three mounting blocks are respectively fastened to the first carrier plate, the second carrier plate and the third carrier plate. One of the mounting blocks is respectively positioned and abutted against the first carrier plate and the second carrier plate, another mounting block is respectively positioned and abutted against the second carrier plate and the third carrier plate, and the remaining mounting block is installed on the side of the first carrier plate away from the second carrier plate.

4. The chip appearance inspection device according to claim 2 or 3, characterized in that, The first detection light source has a first light-emitting surface, the second detection light source has a second light-emitting surface, and the third detection light source has a third light-emitting surface; The first light-emitting surface, the second light-emitting surface, and the third light-emitting surface are all arranged in a trumpet shape so that the light gradually diverges away from the corresponding detection light source; the distance between the first light-emitting surface and the second light-emitting surface is greater than the distance between the second light-emitting surface and the third light-emitting surface.

5. The chip appearance inspection device according to claim 4, characterized in that, The light-emitting end of the first detection light source is embedded in the second carrier plate and is positioned toward the second detection light source. The light-emitting end of the second detection light source is embedded in the third carrier plate and is positioned toward the third detection light source. The light-emitting end of the third detection light source is positioned toward the chip located at the detection position, so as to reduce the light blockage of the chip's solder ball surface by adjacent detection light sources.

6. The chip appearance inspection device according to claim 2, characterized in that, The detection camera is equipped with a detection lens close to the first detection light source, and the length of the detection lens along the Z-axis is greater than the length of the detection camera along the Z-axis. A first clamping block is fixedly installed on the detection platform. The first clamping block has a first clamping inclined surface that is shaped like a horn. A second clamping block is detachably connected to the first clamping block. The second clamping block has a second clamping inclined surface that is shaped like a horn. The first clamping inclined surface and the second clamping inclined surface are respectively pressed against the outer wall surface of the detection lens so that the optical axis of the detection lens is coaxial with the annular central axis of the first detection light source, the second detection light source and the third detection light source.

7. The chip appearance inspection device according to claim 1, characterized in that, The moving mechanism includes a first moving component and a second moving component connected together, and the detection component is connected to the second moving component; The first moving component is used to drive the second moving component to move linearly along the Y-axis direction, and the second moving component is used to drive the detection component to move linearly along the X-axis direction, so that the detection component moves in the X-axis and Y-axis directions and performs omnidirectional solder ball appearance inspection on the chip located at the detection position.

8. The chip appearance inspection device according to claim 7, characterized in that, The first moving component includes a first frame, a first moving rod, and a first moving motor. The second moving component is slidably connected to the first frame. The first moving rod is arranged along the Y-axis and rotatably connected to the first frame. The first moving motor is used to drive the first moving rod to rotate around the Y-axis, so that the first moving rod drives the second moving component to move linearly along the Y-axis.

9. The chip appearance inspection device according to claim 8, characterized in that, The first moving motor is arranged along the Y-axis, and the height of the first moving rod along the Z-axis is higher than the height of the first moving motor along the Z-axis. The output end of the first mobile motor and the rotating end of the first mobile rod are respectively fitted with first transmission wheels. The two first transmission wheels have the same outer diameter and are wound with a first transmission belt. The axes of the two first transmission wheels are located on the same straight line along the Z-axis to reduce the off-center load torque generated during the transmission of the first transmission belt.

10. A method for inspecting the appearance of a chip, applied to the chip appearance inspection apparatus according to any one of claims 1 to 9, characterized in that, include: Step S1: Move the chip to be tested along the X-axis to the detection position, and drive the detection component to move linearly along the X-axis and Y-axis through the moving mechanism so that the detection component is in the detection position; Step S2: Activate the first detection light source, the second detection light source, and the third detection light source to illuminate the top area, the transition area, and the sidewall edge area of ​​the chip solder ball surface, respectively; wherein, the first detection light source, the second detection light source, and the third detection light source are arranged in a ring in sequence, and each detection light source illuminates the chip solder ball surface according to a different incident angle; Step S3: The image of the chip's solder ball surface is acquired in real time by the detection camera to realize the appearance inspection of the chip's solder ball surface.

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