A MEMS accelerometer testing system, testing method and related devices

Abstract

This application provides a MEMS accelerometer testing system, testing method, and related apparatus. The testing system, by setting up a test sub-board, a test main board, and a host computer, enables testing of different types of MEMS accelerometers by simply replacing the corresponding test sub-board, thus reducing testing costs and improving testing efficiency. Furthermore, the test main board includes a working parameter detection module to detect the working parameters of the device under test (DUT) when generating test data, thereby determining the DUT's operating status. A data acquisition module on the test main board collects the test data generated by the DUT, enabling the detection of the DUT's working effect and process, which expands the testing range of the system. Finally, a temperature compensation module on the test main board detects the ambient temperature of the test main board to compensate for the temperature of the DUT's working parameters and test data, thereby improving the testing accuracy of the system.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a MEMS accelerometer testing system, testing method and related apparatus. Background Technology

[0002] MEMS (Micro-Electro-Mechanical System) accelerometers are miniature sensors manufactured based on micro-electro-mechanical system technology. They work by detecting changes in electrical signals such as capacitance, piezoresistive or piezoelectric signals caused by the displacement of a mass block to achieve acceleration measurement.

[0003] MEMS accelerometers come in various types in terms of working principle and packaging. Currently, testing of MEMS accelerometers only supports sequential testing of a single type of MEMS accelerometer, resulting in low testing efficiency and high testing costs.

[0004] Furthermore, in tests over a wider temperature range, the temperature drift of component parameters in the test circuit is a significant issue, affecting test accuracy. Summary of the Invention

[0005] In view of this, the purpose of this application is to propose a MEMS accelerometer testing system, testing method and related devices to solve the problems of low testing efficiency and low testing accuracy of MEMS accelerometers.

[0006] To achieve the above objectives, this application provides a MEMS accelerometer testing system, comprising:

[0007] Test subboard, used to connect the device under test; The test motherboard includes a first connection module, a second connection module, a main control module, a data acquisition module, a working parameter detection module, and a temperature compensation module. The second connection module is connected to the main control module, and the first connection module is used to connect to the test daughter board. The temperature compensation module is connected to the main control module to send the detected ambient temperature data to the main control module. Both ends of the data acquisition module and the working parameter detection module are connected to the first connection module and the main control module, respectively. The data acquisition module is used to acquire the test data of the device under test (DUT), and the working parameter detection module is used to detect the working parameters of the DUT when generating the test data. The main control module is used to receive and send the ambient temperature data, the test data, and the working parameters. The host computer is connected to the test motherboard via the second connection module to receive test data and operating parameters sent by the main control module and to control the operation of the main control module.

[0008] Furthermore, the test sub-board includes a test fixture and a third connection module connected together. The test sub-board is connected to the test motherboard through the third connection module. The test fixture is adapted to the device under test (DUT) for connecting the DUT.

[0009] Furthermore, the data acquisition module includes an operational amplifier unit and an analog-to-digital converter connected together. The operational amplifier unit is connected to the first connection module, and the analog-to-digital converter is connected to the main control unit.

[0010] Furthermore, the test system also includes a power conversion module for connecting to an external power source. The power conversion module is connected to the first connection module, the main control module, the data acquisition module, and the operating parameter detection module to supply power to the device under test, the main control module, the data acquisition module, and the operating parameter detection module. The control terminal of the power conversion module is connected to the main control module.

[0011] Furthermore, the operating parameter detection module includes an operating parameter amplification module and a signal processing module connected together. The operating parameter amplification module is connected to the first connection module, and the signal processing module is connected to the main control module.

[0012] Furthermore, the operating parameter amplification module includes a current acquisition circuit, a conversion resistor, and an operational amplifier chip connected together. The output terminal of the operational amplifier chip is connected to the signal processing module, and the current acquisition circuit is connected to the first connection module.

[0013] Based on the same inventive concept, this application also provides a MEMS accelerometer testing method, applied to the MEMS accelerometer testing system described above, the method comprising: In response to the host computer receiving ambient temperature data, test data and operating parameters sent by the main control module, the host computer determines the first compensation data for the test data and the second compensation data for the operating parameters based on the ambient temperature data and the temperature drift tracking algorithm. The test results of the device under test are determined based on the test data and the first compensation data, and the operating current of the device under test is determined based on the operating parameters and the second compensation data. If the host computer determines that the operating current is greater than the preset operating current, an alarm message is generated.

[0014] Furthermore, the operating parameter is a voltage parameter; determining the operating current of the device under test based on the operating parameter includes: Determine the amplification factor of the amplification module; Determine the operating parameters before amplification based on the amplification factor and operating parameters; The operating current of the device under test is determined based on the pre-stored conversion resistor and the operating parameters before amplification.

[0015] Based on the same inventive concept, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0016] Based on the same inventive concept, this disclosure also provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the method described above.

[0017] Based on the same inventive concept, this disclosure also provides a computer program product, including computer program instructions that, when run on a computer, cause the computer to perform the method described above.

[0018] As can be seen from the above, the MEMS accelerometer testing system, testing method, and related apparatus provided in this application, wherein the testing system, by setting up a test sub-board, a test main board, and a host computer, enables testing of different types of MEMS accelerometers (i.e., devices under test) by simply replacing the test sub-board with one that is compatible with the device, which helps to reduce testing costs and improve testing efficiency; furthermore, the test main board is equipped with a working parameter detection module, which can detect the working parameters of the device under test when generating test data to further determine the operating status of the device under test; the test main board is also equipped with a data acquisition module, which can collect data generated by the device under test. The test data obtained enables the detection of the working effect and process of the device under test, which helps to expand the test range and improve the practicality of the test system. The test motherboard is equipped with a temperature compensation module, which can detect the temperature of the environment in which the test motherboard is located and obtain the ambient temperature data. The main control module then sends the ambient temperature data to the host computer, which can then determine the impact of the ambient temperature of the test motherboard on the working parameters and test data of the device under test based on the ambient temperature data, and compensate and correct it to avoid the test accuracy of the device under test being affected by the ambient temperature. This helps to improve the test accuracy of the test system for the device under test. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1This is a schematic diagram of the structure of a MEMS accelerometer testing system according to an embodiment of this application; Figure 2 This is a schematic diagram of the data acquisition module in an embodiment of this application; Figure 3 This is a schematic diagram of the working parameter detection module in an embodiment of this application; Figure 4 This is a schematic diagram of the working parameter amplification module in an embodiment of this application; Figure 5 This is a flowchart illustrating a MEMS accelerometer testing method according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0021] In the diagram: 100, Test sub-board; 110, Test fixture; 120, Third connection module; 200, Test main board; 210, First connection module; 220, Second connection module; 230, Main control module; 240, Data acquisition module; 241, Operational amplifier unit; 242, Analog-to-digital converter; 250, Operating parameter detection module; 251, Operating parameter amplification module; 251-1, Current acquisition circuit; 251-2, Conversion resistor; 251-3, Operational amplifier chip; 252, Signal processing module; 260, Temperature compensation module; 270, Power conversion module; 300, Host computer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] With the rapid development of MEMS technology, various types of MEMS accelerometers have flooded the market. Based on different working principles, MEMS accelerometers can be divided into capacitive, piezoresistive, and thermal convection types, with their core differences lying in the detection method. In terms of packaging, common types include LGA, QFN, and ceramic packages. Different packages directly affect the device's interface (analog / digital output), mechanical structure (such as hermeticity), and dimensions, thus requiring different test fixtures and signal processing solutions. Currently, common testing methods often design dedicated test systems for specific devices, supporting only sequential testing of single products, resulting in low resource utilization and high costs. Although some batch testing solutions exist, the following significant shortcomings remain: First, binding MEMS accelerometers, fixtures, and test boards into fixed modules requires replacing the entire module when testing different models of accelerometers, resulting in poor compatibility and significantly increasing testing costs. Second, existing evaluation methods are mostly limited to output signal detection, lacking testing and evaluation of key parameters such as operating current, making it difficult to fully reveal potential problems in practical applications, thus increasing usage risks and subsequent costs. Third, as the application scenarios of high-precision MEMS accelerometers continue to expand, the requirements for real-time detection accuracy of their output signals and operating voltage and current are increasing. Especially in reliability testing and evaluation over a wide temperature range, temperature drift of component parameters in the hardware circuit seriously affects testing accuracy, and existing systems cannot guarantee testing stability in high and low temperature environments.

[0025] Based on this, this application proposes a MEMS accelerometer testing system, testing method and related devices, in order to improve the testing efficiency, testing accuracy and testing range of different models of MEMS accelerometers while reducing testing costs.

[0026] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0027] In some embodiments, such as Figure 1 As shown, a MEMS accelerometer testing system includes: Test board 100 is used to connect the device under test; The test motherboard 200 includes a first connection module 210, a second connection module 220, a main control module 230, a data acquisition module 240, and a working parameter detection module 250. The second connection module 220 is connected to the main control module 230. The first connection module 210 is used to connect to the test daughterboard 100. Both ends of the data acquisition module 240 and the working parameter detection module 250 are respectively connected to the first connection module 210 and the main control module 230. The data acquisition module 240 is used to acquire test data of the device under test. The working parameter detection module 250 is used to detect the working parameters of the device under test when generating the test data. The main control module 230 is used to receive and send the test data and working parameters. The host computer 300 is connected to the test motherboard 200 through the second connection module 220 to receive test data and operating parameters sent by the main control module 230 and control the operation of the main control module 230.

[0028] Specifically, the device under test (DUT) is a MEMS accelerometer. Since MEMS accelerometers come in different types, the test sub-board 100 is adapted to the DUT to connect to it. Furthermore, the test sub-board 100 has multiple types, each adapted to a specific type of MEMS accelerometer. (For example, if MEMS accelerometers include four types: ADXL1001, BM1001, H3LIS200DL, and MAX53, then the test mainboard 200 includes four types: ADXL1001 test sub-board 100, BM1001 test sub-board 100, H3LIS200DL test sub-board 100, and MAX53 test sub-board 100, each corresponding to a specific type of MEMS accelerometer.)

[0029] The test motherboard 200 is equipped with a first connection module 210 to connect the test motherboard 200 to the test daughterboard 100. The first connection module 210 includes multiple interfaces, each of which is adapted to the test daughterboard 100 with a corresponding interface, so as to enable the test motherboard 200 to detect data of different output forms of the test daughterboard 100, thereby improving the versatility of the test motherboard 200. The second connection module 220 is equipped to connect the test motherboard 200 to the host computer 300. The data acquisition module 240 is equipped to acquire the test data generated by the device under test on the test daughterboard 100 (i.e., the acceleration data generated by the MEMS accelerometer, including analog data and digital data, the analog data including voltage and current). The working parameter detection module 250 is equipped to acquire the working parameters of the device under test during the process of generating the test data (i.e., the operation of the MEMS accelerometer). The working parameters are the working electrical signals of the device under test, including current, voltage, etc. The main control module 230 is configured to control the operation of the data acquisition module 240 and the working parameter detection module 250, and to forward the data acquired by the data acquisition module 240 and the working parameter detection module 250 to the host computer 300.

[0030] The host computer 300 is used to generate test results and operating status of the device under test based on the test data and operating parameters sent by the main control module 230, so as to evaluate the test accuracy and operating status of the device under test.

[0031] For example, the operating parameter is the operating current, and the test data is the acceleration. The host computer 300 calculates the error between the test data and the acceleration of the device under test during the test, obtains the error, and determines the test result of the device under test based on the error and the pre-stored error and test result comparison table. The host computer 300 compares the operating parameter with the pre-stored normal operating parameters of the device under test to determine whether there is any abnormality in the operation of the device under test.

[0032] It should be noted that the main control module 230 may include a main control chip, an external power-on reset circuit, a crystal oscillator circuit and a power supply filter circuit, an internal serial port, an IIC interface, and an SPI interface, as well as corresponding functional pins. The main control module 230 connects to other modules through these functional pins. The first connection module 210 may be a J30J electrical connector to facilitate the connection between the test motherboard 200 and the test daughterboard 100. The second connection module 220 may be an RS422 interface to improve the anti-interference capability of the test motherboard 200 and enhance the communication efficiency between the test motherboard 200 and the host computer 300.

[0033] In this embodiment, by setting up a test subboard 100, a test mainboard 200, and a host computer 300, it is possible to test different types of MEMS accelerometers (i.e., devices under test) by simply replacing the test subboard 100 with one that is compatible with the device, which helps to reduce testing costs and improve testing efficiency. Furthermore, the test mainboard 200 is equipped with a working parameter detection module 250, which can detect the working parameters of the device under test when generating test data to further determine the operating status of the device under test. The test mainboard 200 is also equipped with a data acquisition module 240, which can collect the test data generated by the device under test, thereby realizing the detection of the working effect and working process of the device under test, which helps to expand the testing range of the testing system and improve the practicality of the testing system.

[0034] In some embodiments, the test motherboard 200 further includes a temperature compensation module 260, which is connected to the main control module 230 to send the detected ambient temperature data to the host computer 300 through the main control module 230.

[0035] Specifically, the temperature compensation module 260 is used to detect the temperature of the environment where the test motherboard 200 is located, and obtain the ambient temperature data. This allows the main control module 230 to send the ambient temperature data to the host computer 300. The host computer 300 can then determine the impact of the ambient temperature of the test daughterboard 100 on the device under test based on the ambient temperature data, and compensate and correct the operating parameters and test data of the device under test. This avoids the ambient temperature affecting the test accuracy of the device under test, thereby improving the test accuracy of the test system for the device under test.

[0036] The host computer 300 uses a temperature drift tracking algorithm to determine the first compensation data for the test data and the second compensation data for the operating parameters under the ambient temperature data.

[0037] It should be noted that the temperature compensation module 260 can be a temperature sensor or a temperature acquisition chip (model SHT31).

[0038] In some embodiments, the test sub-board 100 includes a test fixture 110 and a third connection module 120 connected together. The test sub-board 100 is connected to the test motherboard 200 through the third connection module 120. The test fixture 110 is adapted to the device under test (DUT) for connecting the DUT.

[0039] Specifically, the test motherboard 200 is provided with the first connection module 210 for connection with the test subboard 100. The test subboard 100 is provided with the third connection module 120 to improve the connection between the third connection module 120 and the first connection module 210. The third connection module 120 is adapted to the first connection module 210 to facilitate the connection between the test subboard 100 and the test motherboard 200 and improve the connection efficiency. The test fixture 110 is adapted to the device under test to facilitate the connection between the test subboard 100 and the device under test.

[0040] It should be noted that the type of the test sub-board 100 is the same as the type of the device under test (i.e., MEMS accelerometer) it is adapted to, and consequently the type of the test fixture 110 on the test sub-board 100 is the same as the type of the device under test it is adapted to.

[0041] In some embodiments, such as Figure 2 As shown, the data acquisition module 240 includes an operational amplifier unit 241 and an analog-to-digital converter 242 connected to each other. The operational amplifier unit 241 is connected to the first connection module 210, and the analog-to-digital converter 242 is connected to the main control unit.

[0042] Specifically, the operational amplifier unit 241 may be an operational amplifier chip INA8211DGKR, and the analog-to-digital converter 242 may be an AD chip. The operational amplifier unit 241 is used to amplify the analog signal generated by the device under test, and the analog-to-digital converter 242 is used to convert the signal amplified by the operational amplifier unit 241 into a digital signal for transmission to the main control module 230.

[0043] It should be noted that if the device under test outputs a digital signal, the data acquisition module 240 transmits the digital signal to the main control module 230 so that the main control module 230 forwards the signal to the host computer 300.

[0044] In some embodiments, the test system further includes a power conversion module 270 for connection to an external power source. The power conversion module 270 is connected to the first connection module 210, the main control module 230, the data acquisition module 240, and the operating parameter detection module 250 to supply power to the device under test, the main control module 230, the data acquisition module 240, and the operating parameter detection module 250. The control terminal of the power conversion module 270 is connected to the main control module 230.

[0045] Specifically, the power conversion module 270 is used to adjust the voltage input to the first connection module 210, the main control module 230, the data acquisition module 240 and the working parameter detection module 250 under the control of the main control module 230, so that the test motherboard 200 and the test daughterboard 100 can operate normally under the power supply of the power conversion module 270.

[0046] It should be noted that the power conversion module 270 is connected to the first connection module 210 to supply power to the device under test connected to the test sub-board 100 through the first connection module 210. Therefore, when the test system performs a voltage pull-off reliability limit assessment test on the device under test, the power conversion module 270 can adjust the voltage output to the first connection module 210 under the control of the main control module 230.

[0047] In addition, the power conversion module 270 is equipped with a fuse, a reverse polarity protection (PMOS) transistor, a transient voltage suppression capacitor, and a DC-DC power chip between itself and the external power supply to protect and filter the power conversion module 270.

[0048] In some embodiments, such as Figure 3 As shown, the working parameter detection module 250 includes a working parameter amplification module 251 and a signal processing module 252 connected to each other. The working parameter amplification module 251 is connected to the first connection module 210, and the signal processing module 252 is connected to the main control module 230.

[0049] Specifically, the operating parameter detection module 250 collects and amplifies the operating parameters of the device under test through the operating parameter amplification module 251, and improves the accuracy of the operating parameters through the signal processing module 252, thereby improving the detection accuracy of the operating parameter detection module 250 and the testing accuracy of the test system.

[0050] The operating parameter detection module 250 sends the obtained operating parameters to the main control module 230, so that the main control module 230 can send the operating parameters to the host computer 300, so that the host computer 300 can determine the operating status of the device under test based on the operating parameters.

[0051] In some embodiments, such as Figure 4 As shown, the working parameter amplification module 251 includes a current acquisition circuit 251-1, a conversion resistor 251-2, and an operational amplifier chip 251-3 connected to each other. The output terminal of the operational amplifier chip 251-3 is connected to the signal processing module 252, and the current acquisition circuit 251-1 is connected to the first connection module 210.

[0052] Specifically, the operating parameter amplification module 251 acquires the operating current of the device under test, i.e., the operating parameter, through the current acquisition circuit 251-1. The conversion resistor 251-2 is used to convert the acquired operating current into an acquisition voltage. The operational amplifier chip 251-3 is used to amplify the acquisition voltage to obtain the amplified acquisition voltage. The amplified acquisition voltage is sent to the main control module 230 through the signal processing module 252, thereby realizing the transmission of the amplified acquisition voltage to the host computer 300 after precision conditioning.

[0053] It should be noted that the current acquisition circuit 251-1 acquires the working circuit of the device under test located on the test sub-board 100 through the first connection module 210. One end of the current acquisition circuit 251-1 is connected to the first connection module 210, and the other end is grounded. The two ends of the conversion resistor 251-2 are respectively connected to the two ends of the current acquisition circuit 251-1. The input terminal of the operational amplifier chip 251-3 is connected to the two ends of the conversion resistor 251-2 to obtain the voltage across the conversion resistor 251-2.

[0054] For example, the operational amplifier chip 251-3 is an SGM8552XS8G / TR, and the signal processing module 252 is a programmable gain precision operational amplifier chip 251-3, model PGA281AIPWR.

[0055] In some embodiments, a MEMS accelerometer testing method is applied to the MEMS accelerometer testing system described above, such as... Figure 5 As shown, the method includes: Step S101: In response to the host computer receiving the ambient temperature data, test data and operating parameters sent by the main control module, the host computer determines the first compensation data for the test data and the second compensation data for the operating parameters based on the ambient temperature data and the temperature drift tracking algorithm.

[0056] Specifically, when the host computer 300 receives the ambient temperature data sent by the main control module 230, it determines the impact of the ambient temperature data on the test data and the working parameters based on the ambient temperature data and the temperature drift tracking algorithm, and then obtains the first compensation data and the second compensation data.

[0057] For example, taking the operating parameters as an example, the host computer 300 pre-stores the second compensation data and the functional relationship between temperature. Then, when the host computer 300 receives the ambient temperature data, it can calculate the second compensation data based on the ambient temperature data and the functional relationship.

[0058] It should be noted that when the host computer 300 determines the functional relationship between the second compensation data and temperature, 1) a constant current source is used as a reference to test the current at -45~125℃, and the operating parameters are collected; the error between the operating parameters and the constant current source is calculated (this error is the second compensation data); 2) the temperature is collected synchronously, and the functional relationship between temperature and error is fitted using Matlab (the error gradually increases with increasing temperature; if it is a linear relationship, then error = A). Temperature + B, calculate the compensation coefficients A and B of the fitting function); 3) In subsequent work parameter acquisition, calculate the error based on the known compensation coefficients and the acquired real-time temperature.

[0059] Step S102: Determine the test result of the device under test based on the test data and the first compensation data, and determine the operating current of the device under test based on the operating parameters and the second compensation data.

[0060] Specifically, after determining the first compensation data, the host computer 300 corrects the test data according to the type of the first compensation data to obtain the corrected test data. By determining the first compensation data and correcting the test data according to the first compensation data, the accuracy of the test system can be avoided due to changes in the ambient temperature of the test system, which is beneficial to improving the accuracy of the test system.

[0061] It should be noted that when the first compensation data is error data, the correction to the test data is summation; when the first compensation data is a correction coefficient, the correction to the test data is product.

[0062] Specifically, after determining the second compensation data, the host computer 300 corrects the working parameters according to the type of the second compensation data to obtain the corrected working parameters. By determining the second compensation data and correcting the working parameters according to the second compensation data, the accuracy of the test system can be avoided due to changes in the ambient temperature of the test system, which is beneficial to improving the accuracy of the test system.

[0063] It should be noted that when the second compensation data is error data, the correction to the working parameters is a summation; when the second compensation data is a correction coefficient, the correction to the working parameters is a product.

[0064] Specifically, the host computer 300 can determine the test results of the device under test based on the corrected test data.

[0065] For example, when the test system tests the device under test, it provides the test data of the device under test as an acceleration of 1 m / s².2 Then, the difference between the corrected test data and the value is determined, and the test result of the device under test is determined based on the difference (for example, if the difference corresponds to the normal range, the test result is determined to be normal; if the difference corresponds to the abnormal range, the test result is determined to be abnormal; the difference corresponding to the abnormal range is greater than the difference corresponding to the normal range).

[0066] More specifically, the host computer 300 determines the operating current of the device under test when generating the test data based on the corrected operating parameters, and compares the operating current with the predetermined normal operating current of the device under test (i.e., the preset operating current).

[0067] It should be noted that the operating parameters received by the host computer 300 can be the operating current or other parameters related to the operating current. When the operating parameters are other parameters related to the operating current, the host computer 300 calculates the operating current based on the operating parameters.

[0068] Step S103: In response to the host computer 300 determining that the operating current is greater than the preset operating current, an alarm message is generated.

[0069] Specifically, the preset operating current is the operating current of the device under test (DUT) during normal operation, i.e., the normal operating current of the DUT. When the host computer 300 determines that the operating current is greater than the preset operating current, it determines that there is an abnormality in the DUT during operation. This abnormality can be a short circuit or other situations that can cause the operating current to increase. In order to avoid the abnormal increase in current causing the DUT to overheat or even catch fire during operation, the host computer 300 generates an alarm message to prompt the DUT to be inspected and repaired, so as to ensure the application safety of the DUT.

[0070] In this embodiment, during testing, the main control module 230 of the test motherboard 200 forwards the test data and operating parameters to the host computer 300. The host computer 300 then determines the test results of the device under test (DUT) based on the test data and the operating current of the DUT based on the operating parameters. It then determines whether there is an abnormal operating current in the DUT based on the operating current and generates an alarm message to alert the user when an abnormal operating current is detected. This allows for simultaneous testing of the DUT's operating results and its operating current, expanding the testing range and improving the practicality of the testing system. Upon receiving the ambient temperature data, the host computer 300 determines first compensation data for correcting the test data and second compensation data for correcting the operating parameters, improving the accuracy of the test data and operating parameters determined by the host computer 300, thereby enhancing the overall accuracy of the testing system.

[0071] In some embodiments, the operating parameter is a voltage parameter; determining the operating current of the device under test based on the operating parameter includes: Step S301: Determine the magnification factor of the working parameter amplification module 251.

[0072] Specifically, after receiving the working parameters, the host computer 300 determines the amplification factor of the working parameter amplification module 251 based on its control over the working parameter amplification module 251 (i.e., the amplification factor of the working parameter amplification module 251 is determined by the host computer 300).

[0073] Step S302: Determine the operating parameters before amplification based on the amplification factor and operating parameters.

[0074] Specifically, the host computer 300 determines the operating parameters before amplification based on the amplification factor and the operating parameters.

[0075] For example, if the amplification factor is 11 times and the operating parameter is 11V, then the operating parameter before amplification is determined to be 11V / 11=1V.

[0076] Step S303: Determine the operating current of the device under test based on the pre-stored conversion resistor 251-2 and the operating parameters before amplification.

[0077] Specifically, the host computer 300 can obtain the operating current based on the known conversion resistor 251-2 and the operating parameters before amplification, according to the voltage, current and resistance formulas.

[0078] For example, if the conversion resistor 251-2 is 6.8Ω and the operating parameter before amplification is 1V, then the operating current = 1V / 6.8Ω = 0.15A.

[0079] In this embodiment, the host computer 300 determines the working current based on the logic of the working parameter amplification module 251 converting the working current into voltage, and on the basis of determining the voltage and the conversion resistor 251-2, realizes the reverse calculation of the working current of the device under test, which is beneficial to improving the acquisition accuracy of the test system.

[0080] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0081] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0082] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the testing method described in any of the above embodiments.

[0083] Figure 6 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0084] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0085] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0086] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0087] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0088] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0089] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0090] The electronic devices described above are used to implement the corresponding test methods in any of the foregoing embodiments and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0091] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to perform the test method as described in any of the above embodiments.

[0092] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0093] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the test method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0094] Based on the same concept, corresponding to any of the above embodiments, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0095] It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0096] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.

[0097] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0098] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.

[0099] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0100] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0101] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0102] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the claims of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A MEMS accelerometer testing system, characterized in that, include: Test subboard, used to connect the device under test; The test motherboard includes a first connection module, a second connection module, a main control module, a data acquisition module, a working parameter detection module, and a temperature compensation module. The second connection module is connected to the main control module, and the first connection module is used to connect to the test daughter board. The temperature compensation module is connected to the main control module to send the detected ambient temperature data to the main control module. Both ends of the data acquisition module and the working parameter detection module are connected to the first connection module and the main control module, respectively. The data acquisition module is used to acquire the test data of the device under test (DUT), and the working parameter detection module is used to detect the working parameters of the DUT when generating the test data. The main control module is used to receive and send the ambient temperature data, the test data, and the working parameters. The host computer is connected to the test motherboard via the second connection module to receive test data and operating parameters sent by the main control module and to control the operation of the main control module.

2. The MEMS accelerometer testing system according to claim 1, characterized in that, The test sub-board includes a test fixture and a third connection module connected together. The test sub-board is connected to the test motherboard through the third connection module. The test fixture is adapted to the device under test (DUT) for connecting the DUT.

3. The MEMS accelerometer testing system according to claim 1, characterized in that, The data acquisition module includes an operational amplifier unit and an analog-to-digital converter connected together. The operational amplifier unit is connected to the first connection module, and the analog-to-digital converter is connected to the main control unit.

4. The MEMS accelerometer testing system according to claim 1, characterized in that, It also includes a power conversion module for connecting to an external power source. The power conversion module is connected to the first connection module, the main control module, the data acquisition module, and the operating parameter detection module to supply power to the device under test, the main control module, the data acquisition module, and the operating parameter detection module. The control terminal of the power conversion module is connected to the main control module.

5. The MEMS accelerometer testing system according to claim 1, characterized in that, The operating parameter detection module includes an operating parameter amplification module and a signal processing module connected to each other. The operating parameter amplification module is connected to the first connection module, and the signal processing module is connected to the main control module.

6. The MEMS accelerometer testing system according to claim 5, characterized in that, The operating parameter amplification module includes a current acquisition circuit, a conversion resistor, and an operational amplifier chip connected together. The output terminal of the operational amplifier chip is connected to the signal processing module, and the current acquisition circuit is connected to the first connection module.

7. A method for testing MEMS accelerometers, characterized in that, The method, applied to the MEMS accelerometer testing system as described in any one of claims 1-6, comprises: In response to the host computer receiving ambient temperature data, test data and operating parameters sent by the main control module, the host computer determines the first compensation data for the test data and the second compensation data for the operating parameters based on the ambient temperature data and the temperature drift tracking algorithm. The test results of the device under test are determined based on the test data and the first compensation data, and the operating current of the device under test is determined based on the operating parameters and the second compensation data. If the host computer determines that the operating current is greater than the preset operating current, an alarm message is generated.

8. The method according to claim 7, characterized in that, The operating parameters are voltage parameters; determining the operating current of the device under test based on the operating parameters includes: Determine the amplification factor of the amplification module; Determine the operating parameters before amplification based on the amplification factor and operating parameters; The operating current of the device under test is determined based on the pre-stored conversion resistor and the operating parameters before amplification.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 7 to 8.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 7 to 8.

11. A computer program product comprising computer program instructions, characterized in that, When the computer program instructions are executed on a computer, the computer causes the computer to perform the method as described in any one of claims 7 to 8.

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