A layered stacked fixture

Abstract

This invention relates to the field of power electronics testing technology. The invention discloses a layered, stacked fixture, comprising a fixture test base for supporting and limiting the position of the module under test (DUT), and an insulating plate for electrical insulation. The fixture test base is equipped with a quick-connect aging clamp for quick clamping and connection to the module signal terminals of the DUT. A frame is connected to the upper surface of the insulating plate. Both ends of the insulating plate are respectively provided with limiting grooves for limiting the relative position of the fixture and the testing equipment, and positioning pins for positioning and fixing with the testing equipment. One side of the insulating plate is provided with a high-current probe for connecting to external equipment to transmit high-current test signals. This invention, through modular design, high-voltage and high-current compatibility, and adaptability to multiple module types, solves the shortcomings of traditional test fixtures in terms of efficiency, accuracy, and compatibility. Its application scope covers key fields such as new energy, rail transportation, and industrial automation, significantly improving the stability and reliability of power module testing.

Description

Technical Field

[0001] This invention relates to the field of power electronics testing technology, and in particular to a layered stacked fixture for high-voltage, high-current power semiconductor modules (such as IGBTs and FRDs), especially for the compatibility testing needs of ultra-large modules. Background Technology

[0002] With the rapid development of new energy vehicles, rail transit and smart grids, the voltage and current levels of power modules (such as IGBTs and SiCMOSFETs) continue to increase, and the module size also increases accordingly (such as 325mm*154mm).

[0003] Existing test fixtures face the following technical challenges: 1. Space compatibility issues: The module size is much larger than the equipment cavity (e.g., 400*200mm), making it difficult to install with traditional fixtures, and it is necessary to avoid the equipment limit blocks.

[0004] 2. Electrical and mechanical contradictions: 1700V high voltage requires a creepage distance of ≥8mm, while 8000A high current requires 20 groups of probes to be densely arranged (e.g., 11 probes / group). The total pin force and the thrust of the lifting cylinder are mismatched, which can easily lead to poor contact or overheating.

[0005] 3. Insufficient compatibility: Existing fixtures typically only support a single type of module (such as IGBT) and cannot be compatible with different package sizes, drive terminal layouts (left / right) and FRD modules.

[0006] 4. Signal test interference: Excessive length of the drive signal line introduces parasitic inductance, causing transient voltage overshoot during switching and affecting test accuracy. Summary of the Invention

[0007] The purpose of this invention is to provide a layered, stackable fixture that is compatible with ultra-large, high-voltage, high-current (1700V / 8000A) IGBT / FRD modules, solving technical problems such as space adaptation, electromechanical balance, compatibility with multiple types of modules, signal integrity, and operational efficiency.

[0008] To address the aforementioned technical problems, this invention provides a layered, stacked fixture, comprising a fixture test base for supporting and limiting the position of the module under test (DUT), and an insulating plate for electrical insulation. The fixture test base is equipped with a quick-connect aging clamp for rapid clamping and connection to the module signal terminals of the DUT. A frame is connected to the upper surface of the insulating plate. Both ends of the insulating plate are respectively provided with limiting grooves for limiting the relative position of the fixture and the test equipment, and positioning pins for positioning and fixing with the test equipment. One side of the insulating plate is provided with a connection device for connecting to external equipment to transmit high-current test signals. The insulating plate has a probe plate on its lower end face, which has power terminal crimping probes for crimping the power terminals of the module under test. One side of the probe plate has a signal terminal pin plate for crimping the signal terminals of the module under test. Support arms are provided at both ends of the frame to support the entire fixture when it is placed. One side of the frame has a handle for providing a gripping position, and the other side has a drive-end connection probe for connecting to the drive end of the test equipment. The upper end face of the insulating plate also has a signal circuit board for transmitting test signals, and the signal circuit board is electrically connected to the signal terminal pin plate.

[0009] The probe plate is made of glass fiber reinforced epoxy resin with a thickness of 6 mm, tensile strength ≥200 MPa, elastic modulus ≥15 GPa, and dielectric strength ≥20 kV / mm.

[0010] The insulating board is made of polyimide substrate and ceramic-filled epoxy resin, with a thickness of 3mm and a withstand voltage of ≥5kV / 1min.

[0011] The signal circuit board is made of polyimide substrate and ceramic-filled epoxy resin, with a total thickness of ≤2mm. The signal circuit board integrates a drive signal interface and a sampling line. The sampling line is a strip line with a width of 1.2mm and a thickness of 0.2mm.

[0012] The probe board has 20 sets of probes arranged on it, and each set of probes contains 11 power terminal crimping probes. The power terminal crimping probes are made of beryllium copper substrate and have a gold plating layer. Their contact resistance at 25°C is ≤0.5mΩ.

[0013] The quick-connect aging clamp includes a flame-retardant black plastic shell with four rectangular holes arranged side by side at the front for inserting drive signal lines; a circular hole with a diameter of 3.5 mm on the side for fixing to the clamp test base with screws; and a handle that can be moved up and down in the center of the shell, which is connected to the internal clamping mechanism.

[0014] The size of the fixture test base is adapted to the test module with a length of 325mm and a width of 154mm.

[0015] The fixture test base is also provided with a clearance groove, which is used to avoid the limit block of the test equipment during installation.

[0016] The power terminal crimping probe is an elastic probe with a vertical floating structure. Its floating stroke is used to compensate for the terminal flatness error of the module under test, and the compensation amount is ≤0.1mm.

[0017] The clamping mechanism is a combination of jaws or metal springs that open and close.

[0018] Compared with existing technologies, this invention solves the shortcomings of traditional test fixtures in terms of efficiency, accuracy and compatibility through modular design, high voltage and high current compatibility and multi-type module adaptability. Its application scope covers key fields such as new energy, rail transit and industrial automation, and significantly improves the stability and reliability of power module testing.

[0019] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a bottom view of the present invention; Figure 3 This is a front view of the invention installed in the device cavity; Figure 4 This is a schematic diagram showing the positions of the module under test and the fixture test base.

[0022] In the diagram: 1-Support arm, 2-Positioning pin, 3-Drive end connection probe, 4-Handle, 5-Clamp test base, 6-Connecting device high current probe, 7-Probe board, 8-Power terminal crimping probe, 9-Limiting groove, 10-Insulating board, 11-Signal terminal pin board, 12-Signal circuit board, 13-Equipment test base, 14-Module under test, 15-Module power terminal, 16-Module internal thermistor, 17-Module signal terminal, 18-Quick wiring aging clip, 19-Module base plate. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of this invention. The embodiments can be combined with and referenced by each other without contradiction.

[0024] Example 1 like Figures 1-4 As shown, this invention addresses the space conflict between ultra-large power modules (e.g., 325mm*154mm) and limited equipment cavities (e.g., 400*200mm) by proposing a layered, stacked fixture structure. This structure includes a fixture test base 5 for supporting and limiting the position of the module under test (DUT) 14, and an insulating plate 10 for electrical insulation. The fixture test base 5 is equipped with a quick-connect aging clamp 18 for quick clamping and connection with the module signal terminals 17 of the DUT 14. A frame is connected to the upper surface of the insulating plate 10. Both ends of the insulating plate 10 are respectively provided with limiting grooves 9 for limiting the relative position of the fixture and the test equipment, and positioning pins 2 for positioning and fixing with the test equipment. One side of the insulating plate 10 is provided with a connection to external equipment. A high-current probe 6 is provided for connection to transmit high-current test signals; a probe plate 7 is provided on the lower end face of the insulating plate 10, and a power terminal crimping probe 8 is provided on the probe plate 7 for crimping the module power terminal 15 of the module under test 14; a signal terminal pin plate 11 is provided on one side of the probe plate 7 for crimping the module signal terminal 17 of the module under test 14; support arms 1 are provided at both ends of the frame for supporting the entire fixture when placing the fixture; a handle 4 is provided on one side of the frame for providing a gripping position, and a drive end connection probe 3 is provided on the other side for connecting to the drive end of the test equipment; a signal circuit board 12 for transmitting test signals is also provided on the upper end face of the insulating plate 10, and the signal circuit board 12 is electrically connected to the signal terminal pin plate 11.

[0025] Furthermore, the signal circuit board 12 is made of polyimide substrate and ceramic-filled epoxy resin laminated together, with a total thickness of ≤2mm. The signal circuit board 12 integrates drive signal interface and sampling line (strip line, 1.2mm wide and 0.2mm thick).

[0026] Furthermore, the probe plate 7 is 6mm thick and made of glass fiber reinforced epoxy resin, which has high strength (tensile strength ≥200MPa) and rigidity (elastic modulus ≥15GPa), and can withstand the thrust of the lifting cylinder and the vertical floating stress of the probe. Its dielectric strength is ≥20kV / mm, which meets the creepage distance requirements under 1700V high voltage.

[0027] Furthermore, for the target module (e.g., 325mm*154mm) with specific module power terminal 15 positions and current capabilities, 20 sets of probes (11 probes / set) are optimized for arrangement. The power terminal crimping probes 8 use beryllium copper substrate and gold plating process to reduce contact resistance to ≤0.5mΩ (25℃). In addition, the total pin force of the power terminal crimping probes 8 is dynamically matched with the cylinder thrust to ensure reliable contact between the module power terminal 15 and the power terminal crimping probes 8, avoiding deformation or unstable contact due to excessive force.

[0028] Furthermore, the insulation board 10 is approximately 3 mm thick and is made of polyimide substrate laminated with ceramic-filled epoxy resin, providing high insulation performance (withstand voltage ≥5 kV / 1 min).

[0029] As described above, this invention achieves compatibility with IGBT and FRD modules and different drive terminal layouts (left / right) through the probe board 7, drive terminal switching, and Kelvin sampling dual-mode design. The probe board achieves reliable contact between the module power terminal 15 and the power terminal crimping probe 8 through 20 integrated probes, and adapts to the differences between IGBT and FRD modules. The quick-connect aging clamp 18 is made of flame-retardant black plastic to provide insulation protection and mechanical strength. The front of the housing has four parallel rectangular holes (supporting 2~10 square millimeter wire diameter) for inserting drive signal lines. The side has a 3.5mm diameter circular hole for fixing to the clamp test base 5 with screws. The operating handle is located in the center of the housing and can be moved up and down to control the opening and closing of the internal clamping mechanism. The wires can be quickly clamped or released by manual operation without the need for tools. The insertion and removal life is ≥5000 times.

[0030] Example 2 The specific functions of each component in this invention are as follows: Support arm 1: Located on the side of the fixture, it provides support when the fixture is placed, preventing damage to the probe and ensuring structural stability.

[0031] Positioning tip 2: Used for precise positioning and fixing of fixtures and testing equipment during testing.

[0032] Driver end connection probe 3: As a connection component of the driver end, it is used to conduct test signals and realize the test of the entire circuit.

[0033] Handle 4: Provides a gripping position for the operator to facilitate the installation and removal of the test fixture.

[0034] The fixture test base 5 carries the module under test 14 and limits its movement, ensuring that the fixture probes (power terminal crimping probe 8, signal terminal crimping probe 11) are accurately aligned with the leads of the module under test (module power terminal 15, module signal terminal 17).

[0035] High-current probe 6 for connecting devices: The metal probe on the upper part of the fixture is used to connect to external devices and transmit high-current test signals. It is the core interface for realizing high-power testing.

[0036] Probe board 7: Distributed integrated probes, which ensure stable contact between the probes and the terminals under test through probe elasticity, reducing contact resistance.

[0037] Power terminal crimping probe 8: Used to fix the power terminal 15 of the module under test by crimping to ensure the reliability of electrical connection during high current testing.

[0038] Limiting groove 9: Used to limit the relative position of the fixture and the test equipment, ensuring the alignment accuracy of the fixture during installation, and avoiding poor contact or damage to the high current probe 6 of the connected equipment due to positional deviation.

[0039] Insulating board 10: Used for electrical insulation, blocking electrical conduction between circuit layers and preventing short circuits.

[0040] Signal terminal pin plate 11: The probe plate reserved in the design can be used to transmit circuit signals to the signal terminal 17 of the module under test by crimping probes.

[0041] Signal circuit board 12: As the core carrier of the circuit, it integrates various electronic components to ensure effective signal transmission, realize status monitoring of the test process, and can integrate protection circuits to prevent abnormal current.

[0042] Equipment test base 13: The test equipment has its own structure with an integrated temperature sensor, which can support the fixture test base 5.

[0043] Module under test 14: Module product (IGBT / FRD module) used for testing.

[0044] Module power terminal 15: Used to transmit high-power, high-current signals, and is the core lead-out interface for module electrical performance testing.

[0045] Internal thermistor (NTC) 16: Embedded inside the module, it monitors the temperature changes of the internal chip in real time to ensure temperature control safety during the testing process.

[0046] Module signal terminal 17 (IGBT module): Embedded inside the module, it is connected to the lead wire of quick-connect aging clip 18 or crimped to the reserved spare signal terminal pin plate 11 to provide feedback test signal.

[0047] Quick-connect aging clip 18: Clamping design for quick connection of test circuits to module signal terminals 17, improving test efficiency.

[0048] Module base plate 19: The base of the module under test 14, providing mechanical support and assisting in heat dissipation, and facilitating the installation of the module under test 14.

[0049] Those skilled in the art will understand that the above embodiments can be modified in form and detail in practical applications without departing from the spirit and scope of the invention.

Claims

1. A layered, overlapping clamp, characterized in that: The device includes a fixture test base (5) for supporting and limiting the module under test (14) and an insulating plate (10) for electrical insulation. The fixture test base (5) is provided with a quick-connect aging clamp (18) for quick clamping and connecting with the module signal terminal (17) of the module under test (14). The upper end face of the insulating plate (10) is connected to a frame. The two ends of the insulating plate (10) are respectively provided with a limiting groove (9) for limiting the relative position of the fixture and the test equipment and a positioning pin (2) for positioning and fixing with the test equipment. One side of the insulating plate (10) is provided with a high-current probe (6) for connecting with external equipment to transmit high-current test signals. The lower end face of the insulating plate (10) is provided with a high-current probe (6) for connecting with external equipment to transmit high-current test signals. There is a probe plate (7), and the probe plate (7) is provided with a power terminal crimping probe (8) for crimping the module power terminal (15) of the module under test (14); one side of the probe plate (7) is provided with a signal terminal pin plate (11) for crimping the module signal terminal (17) of the module under test (14); both ends of the frame are provided with support arms (1) for supporting the entire fixture when placing the fixture; one side of the frame is provided with a handle (4) for providing a gripping position, and the other side is provided with a drive end connection probe (3) for connecting to the drive end of the test equipment; the upper surface of the insulating plate (10) is also provided with a signal circuit board (12) for transmitting test signals, and the signal circuit board (12) is electrically connected to the signal terminal pin plate (11).

2. The layered overlapping fixture as described in claim 1, characterized in that: The probe plate (7) is made of glass fiber reinforced epoxy resin with a thickness of 6 mm, tensile strength ≥200 MPa, elastic modulus ≥15 GPa, and dielectric strength ≥20 kV / mm.

3. The layered overlapping fixture as described in claim 1, characterized in that: The insulating board (10) is made of polyimide substrate and ceramic-filled epoxy resin, with a thickness of 3mm and a withstand voltage of ≥5kV / 1min.

4. The layered overlapping fixture as described in claim 1, characterized in that: The signal circuit board (12) is made of polyimide substrate and ceramic-filled epoxy resin, with a total thickness of ≤2mm; the signal circuit board (12) integrates a drive signal interface and a sampling line, the sampling line is a strip line with a width of 1.2mm and a thickness of 0.2mm.

5. The layered overlapping fixture as described in claim 1, characterized in that: The probe plate (7) has 20 sets of probes arranged on it, and each set of probes includes 11 power terminal crimping probes (8); the power terminal crimping probes (8) are made of beryllium copper substrate and have a gold plating layer, and their contact resistance at 25°C is ≤0.5mΩ.

6. The layered overlapping fixture as described in claim 1, characterized in that: The quick-connect aging clip (18) includes a flame-retardant black plastic shell with four rectangular holes arranged side by side at the front end for inserting drive signal lines; a circular hole with a diameter of 3.5 mm on the side of the shell for fixing to the clamp test base (5) by screws; and a handle that can be moved up and down in the center of the shell, which is connected to the internal clamping mechanism.

7. The layered overlapping fixture as described in claim 1, characterized in that: The size of the fixture test base (5) is adapted to the test module (14) with a length of 325mm and a width of 154mm.

8. The layered overlapping fixture as described in claim 1, characterized in that: The fixture test base (5) is also provided with a clearance groove, which is used to avoid the limit block of the test equipment during installation.

9. The layered overlapping fixture as described in claim 1, characterized in that: The power terminal crimping probe (8) is an elastic probe with a vertical floating structure. Its floating stroke is used to compensate for the terminal flatness error of the module under test (14). The compensation amount is ≤0.1mm.

10. The layered overlapping fixture as described in claim 6, characterized in that: The clamping mechanism is a combination of jaws or metal springs that open and close.

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