A power semiconductor device test tray device

Abstract

This application discloses a power semiconductor device test tray device, belonging to the technical field of power semiconductor test equipment. It includes a tray body with a groove on its top surface for placing a plastic encapsulator. Several support plates are slidably mounted on the top surface of the tray body along its width. Each support plate has inclined surfaces on both its upper and lower sides near the semiconductor terminal. The support plate can move between the semiconductor terminal and the plastic encapsulator, and its top surface can abut against the bottom surface of the semiconductor terminal. The tray body is provided with a pushing member for moving the support plates towards the semiconductor terminal. This application provides reliable support and protection for the terminals.

Description

Technical Field

[0001] This application relates to the technical field of power semiconductor testing equipment, and in particular to a power semiconductor device testing tray device. Background Technology

[0002] In the testing process of power semiconductor devices, trays are typically used for the transfer, positioning, and protection of the devices under test. In existing technologies, trays are usually machined to conform to the shape of the power semiconductor device, and the device is positioned using its outline or locating pins. This solution provides effective protection and positioning for power semiconductor devices with common package structures, and allows for convenient and quick device handling.

[0003] However, for power semiconductor devices with complex packaging structures, conformal trays have significant limitations. The terminals of some power semiconductor devices are partially obscured by the molding compound or metal components, preventing the tray from effectively supporting and protecting the terminals from below. During testing, due to the lack of reliable support, the terminals are highly susceptible to bending and deformation under pressure from probes or test fixtures. This not only prevents the device from completing the test but may also cause permanent damage. Summary of the Invention

[0004] To address the issue that existing contoured trays cannot provide effective support and protection for power semiconductor devices whose terminals are obscured by plastic encapsulation, this application provides a power semiconductor device test tray device.

[0005] The power semiconductor device test tray device provided in this application adopts the following technical solution: A power semiconductor device test tray device includes a tray body. The top surface of the tray body has a groove for placing a plastic encapsulator. Several support plates are slidably mounted on the top surface of the tray body along its width. The support plates have inclined surfaces on both the upper and lower sides of the end near the semiconductor terminal. The support plates can be moved between the semiconductor terminal and the plastic encapsulator. The top surface of the support plate can abut against the bottom surface of the semiconductor terminal. The tray body is provided with a pusher for pushing the support plates toward the direction of the semiconductor terminal.

[0006] By adopting the above technical solution, after the molding compound is placed in the groove, the pusher pushes the support plate to move towards the semiconductor terminal. The support plate smoothly enters the narrow gap between the semiconductor terminal and the molding compound through the inclined guide. The top surface of the support plate abuts against the bottom surface of the semiconductor terminal, providing reliable support and protection for the terminal. This solves the problem of the terminal being unable to be effectively supported because it is blocked by the molding compound. This allows complex packaged power semiconductor devices that were originally impossible to test to be tested normally. At the same time, the terminal is less likely to be bent during the test, ensuring the reliability of the test and the yield of the product.

[0007] Preferably, a movable block is fixed to the bottom surface of the support plate, a movable groove is formed on the top surface of the tray body, the movable block is slidably installed in the movable groove, the pushing component includes a cylinder, a pushing plate is fixed to the piston rod end of the cylinder, a plurality of pushing rods are fixed to the top surface of the pushing plate, a pushing groove is formed on the bottom surface of the movable block, and the pushing rods are inserted into the pushing groove.

[0008] By adopting the above technical solution, the cylinder drives multiple push rods to move simultaneously through the push plate, thereby synchronously driving multiple moving blocks and support plates to slide along the moving groove. This achieves linkage control of multiple support plates, ensures the consistency of the actions of multiple support plates, improves the alignment accuracy between the support plates and the terminals, and the cylinder-driven method has a rapid response and precise control, making it easy to integrate with automated testing production lines and improving testing efficiency.

[0009] Preferably, a plurality of guide rods are fixed to the inner wall of the movable groove away from the plastic seal, and a guide through hole for the guide rods is provided on the side of the movable block.

[0010] By adopting the above technical solution, the cooperation between the guide rod and the guide through hole provides precise linear motion guidance for the moving block, ensuring that the moving block and the support plate always maintain the correct direction of movement during the sliding process, avoiding the support plate jamming or misalignment caused by the skew of the moving block, improving the positional accuracy of the support plate entering the gap between the terminal and the encapsulation body, and ensuring that the support plate can accurately and smoothly reach the predetermined support position.

[0011] Preferably, a ball bushing is fixed inside the guide hole, the ball bushing is located on the outer periphery of the guide rod, and the guide rod and the ball bushing are in sliding engagement.

[0012] By adopting the above technical solution, the ball bushing transforms the sliding friction between the guide rod and the guide hole into rolling friction, which greatly reduces the frictional resistance between the guide rod and the guide hole, making the sliding of the moving block and the support plate smoother and more sensitive. At the same time, rolling friction reduces the wear of the guide rod and the guide hole, extends the service life of the device, and ensures the motion accuracy and response speed of the support plate during long-term high-frequency use.

[0013] Preferably, a connecting rod is fixed to the inner wall of the movable groove away from the plastic seal, a connecting hole is opened on the side of the movable block, the connecting rod passes through the connecting hole, a return spring is sleeved on the outer periphery of the connecting rod, one end of the return spring is fixedly connected to the inner wall of the connecting hole, and the other end of the return spring is fixedly connected to the inner wall of the movable groove.

[0014] By adopting the above technical solution, when the cylinder pushes the support plate to move away from the terminal, the reset spring is compressed and stores elastic potential energy; when the cylinder pushes the support plate to move closer to the terminal, the reset spring releases elastic potential energy, pushing the moving block and support plate to move below the terminal and maintain the support state.

[0015] Preferably, the width of the push groove is greater than the diameter of the push rod.

[0016] By adopting the above technical solution, the push rod has a certain amount of room for movement in the push groove. When the cylinder pushes the support plate to move into place towards the terminal, even if the support plate is subjected to a reverse force, the push rod will not immediately transmit the force to the cylinder, thus avoiding damage to the cylinder due to instantaneous impact.

[0017] Preferably, a plurality of positioning rods are fixed in the groove, and the positioning rods can be inserted into the through holes of the upper plastic sealant.

[0018] By adopting the above technical solution, the positioning rod cooperates with the positioning through hole on the plastic package to achieve rapid and accurate positioning of power semiconductor devices in the tray body, ensuring the accurate relative position between the support plate and the terminal, preventing the support plate from failing to enter between the terminal and the plastic package due to device placement deviation, and improving the repeatability and reliability of the test.

[0019] Preferably, a plurality of fixing blocks are fixed on the opposite inner sides of the groove, the top surface of the fixing block is provided with a fixing through hole, an abutting rod is inserted through the fixing through hole, an abutting plate is fixed on the top surface of the abutting rod, the top surface of the abutting plate can abut against the bottom surface of the plastic seal, and the tray body is provided with a driving component for driving the abutting rod to move upward.

[0020] By adopting the above technical solution, after the support plate separates from the terminal, the driving component drives the abutment rod to move upward. The abutment plate rises with the abutment rod and abuts against the bottom surface of the encapsulation body, providing an upward lifting force to the encapsulation body, causing the encapsulation body to move upward and detach from the groove. This makes it easier for operators or automated robots to remove power semiconductor devices from the tray body, improving the efficiency of picking and placing, while avoiding difficulties in picking and placing and damage to devices caused by devices getting stuck in the groove.

[0021] Preferably, the driving component includes a driving block fixed to the bottom surface of the moving block, a driving plate fixed to the bottom surface of the driving block, the top surface of the driving plate being able to abut against the bottom end of the abutting rod, the bottom end of the abutting rod being a pointed tip, the driving plate including a horizontally arranged horizontal plate, an arc-shaped plate integrally formed on the side of the horizontal plate away from the driving block, and the side of the arc-shaped plate away from the driving plate being bent upward.

[0022] By adopting the above technical solution, when the cylinder pushes the support plate to move away from the terminal, the moving block drives the drive block and drive plate to move synchronously. After the support plate separates from the terminal, the curved surface of the arc plate gradually contacts the tip of the bottom of the abutment rod. The gradual height of the arc surface pushes the abutment rod to move upward, so that the abutment plate lifts the plastic seal. The translational motion of the support plate is converted into the lifting motion of the abutment rod, realizing the linkage between the opening of the support plate and the ejection of the plastic seal. There is no need to set a separate drive source for the ejection action, which simplifies the device structure, reduces manufacturing costs, and ensures the timing and reliability of the action.

[0023] Preferably, a pressure plate is fixedly fitted around the outer periphery of the abutting rod, and an abutting spring is fitted around the outer periphery of the abutting rod. The top end of the abutting spring is fixedly connected to the bottom surface of the fixing block, and the bottom end of the abutting spring is fixedly connected to the top surface of the pressure plate.

[0024] By adopting the above technical solution, when the drive plate pushes the abutment rod upward, the abutment spring is compressed and stores elastic potential energy; when the drive plate separates from the abutment rod, the abutment spring releases elastic potential energy, pushing the pressure plate and the abutment rod downward to reset, so that the abutment plate returns to the bottom position of the groove, preparing for the next placement of the device. This realizes the automatic reset of the abutment rod, avoiding the abutment rod being in the ejected state when the device is placed, thus preventing interference with the device's insertion. At the same time, the abutment spring provides a certain elastic buffer during the abutment process, preventing the drive plate from having too much rigid impact on the abutment rod.

[0025] In summary, this application includes at least one of the following beneficial technical effects: After the molding compound is placed in the groove, the pusher pushes the support plate to move towards the semiconductor terminal. The support plate smoothly enters the narrow gap between the semiconductor terminal and the molding compound through the inclined guide. The top surface of the support plate abuts against the bottom surface of the semiconductor terminal, providing reliable support and protection for the terminal. This solves the problem of the terminal being unable to be effectively supported because it is blocked by the molding compound. This allows complex packaged power semiconductor devices that were originally impossible to test to be tested normally. At the same time, the terminal is less likely to be bent during the test, ensuring the reliability of the test and the yield of the product. The ball bushing converts the sliding friction between the guide rod and the guide hole into rolling friction, which greatly reduces the frictional resistance between the guide rod and the guide hole, making the sliding of the moving block and the support plate smoother and more sensitive. At the same time, the rolling friction reduces the wear of the guide rod and the guide hole, extends the service life of the device, and ensures the motion accuracy and response speed of the support plate during long-term high-frequency use. When the cylinder pushes the support plate away from the terminal, the return spring is compressed and stores elastic potential energy; when the cylinder pushes the support plate closer to the terminal, the return spring releases elastic potential energy, pushing the moving block and support plate to move below the terminal and maintain the support state. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the power semiconductor device test tray device according to an embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the bottom structure of the tray body in the power semiconductor device test tray device according to an embodiment of this application.

[0028] Figure 3 This is a schematic diagram of the structure of the support plate and the tray body in the power semiconductor device test tray device according to an embodiment of this application.

[0029] Figure 4 This is a schematic diagram of the structure of the support plate and the moving block in the power semiconductor device test tray device according to an embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the structure of the fixing block and the driving block in the power semiconductor device test tray device according to an embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the structure of the contact plate and the drive plate in the power semiconductor device test tray device according to an embodiment of this application.

[0032] Reference numerals: 1. Pallet body; 11. Groove; 12. Positioning rod; 2. Support plate; 21. Inclined surface; 3. Moving block; 31. Moving groove; 32. Pushing groove; 33. Guide rod; 34. Guide through hole; 35. Ball bushing; 36. Connecting rod; 37. Connecting hole; 38. Return spring; 4. Cylinder; 41. Pushing plate; 42. Pushing rod; 5. Fixing block; 51. Fixing through hole; 52. Abutting rod; 53. Abutting plate; 54. Pressing plate; 55. Abutting spring; 6. Drive block; 61. Drive plate; 611. Horizontal plate; 612. Arc plate. Detailed Implementation

[0033] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0034] This application discloses a power semiconductor device test tray device.

[0035] Reference Figure 1 The power semiconductor device test tray device 1 includes a tray body 1, and a groove 11 for placing a plastic encapsulation body is provided on the top surface of the tray body 1. Several positioning rods 12 are fixed in the groove 11. The positioning rods 12 can be inserted into the through holes on the plastic encapsulation body to realize the rapid and accurate positioning of the power semiconductor device in the tray body 1.

[0036] Reference Figure 2 and Figure 3 Several support plates 2 are slidably mounted on the top surface of the tray body 1 along its width. The support plates 2 have inclined surfaces 21 on both the upper and lower sides near the semiconductor terminals. The support plates 2 can move between the semiconductor terminals and the molding compound, and the top surface of the support plates 2 can abut against the bottom surface of the semiconductor terminals. A movable block 3 is fixed to the bottom surface of the support plates 2, and a movable groove 31 is formed on the top surface of the tray body 1, within which the movable block 3 is slidably mounted.

[0037] After the molding compound is placed in the groove 11, the support plate 2 is pushed to move towards the semiconductor terminal. The support plate 2 is guided by the inclined surface 21 to smoothly enter the narrow gap between the semiconductor terminal and the molding compound. The top surface of the support plate 2 abuts against the bottom surface of the semiconductor terminal, providing reliable support and protection for the terminal. This solves the problem that the terminal cannot be effectively supported because it is blocked by the molding compound, ensuring the reliability of the test and the yield of the product.

[0038] Reference Figure 1 and Figure 2 Two cylinders 4 are installed at the bottom of the pallet body 1, and a push plate 41 is fixed to the end of the piston rod of the cylinder 4. Several push rods 42 are fixed on the top surface of the push plate 41, and a push groove 32 is opened on the bottom surface of the moving block 3. The push rods 42 are inserted into the push groove 32, and the width of the push groove 32 is greater than the diameter of the push rods 42.

[0039] The cylinder 4 drives multiple push rods 42 to move simultaneously via the push plate 41, thereby synchronously driving multiple moving blocks 3 and support plates 2 to slide along the moving groove 31, realizing the linkage control of multiple support plates 2 and ensuring the consistency of the actions of multiple support plates 2; the push rods 42 have a certain amount of room for movement in the push groove 32. When the cylinder 4 pushes the support plate 2 to the terminal direction, even if the support plate 2 is subjected to a reverse force, the push rods 42 will not immediately transmit the force to the cylinder 4, thus avoiding damage to the cylinder 4 due to instantaneous impact.

[0040] Reference Figure 3 and Figure 4Several guide rods 33 are fixed to the inner wall of the moving groove 31 away from the plastic seal. The side of the moving block 3 is provided with a guide hole 34 for the guide rods 33 to pass through. A ball bushing 35 is fixed in the guide hole 34. The ball bushing 35 is located on the outer periphery of the guide rod 33, and the guide rod 33 and the ball bushing 35 are in sliding engagement.

[0041] The cooperation between the guide rod 33 and the guide through hole 34 provides precise linear motion guidance for the moving block 3, ensuring that the moving block 3 and the support plate 2 always maintain the correct direction of movement during the sliding process, and avoiding jamming or misalignment of the support plate 2 due to the skewness of the moving block 3; the ball bushing 35 converts sliding friction into rolling friction, which greatly reduces frictional resistance, making the sliding of the moving block 3 and the support plate 2 smoother and more sensitive, and extending the service life of the device.

[0042] Reference Figure 3 and Figure 4 A connecting rod 36 is fixed to the inner wall of the movable groove 31 away from the plastic seal. A connecting hole 37 is opened on the side of the movable block 3, and the connecting rod 36 passes through the connecting hole 37. A return spring 38 is sleeved on the outer periphery of the connecting rod 36. One end of the return spring 38 is fixedly connected to the inner wall of the connecting hole 37, and the other end of the return spring 38 is fixedly connected to the inner wall of the movable groove 31.

[0043] When cylinder 4 pushes support plate 2 to move away from the terminal, return spring 38 is compressed and stores elastic potential energy; when cylinder 4 pushes support plate 2 to move closer to the terminal, return spring 38 releases elastic potential energy, pushing moving block 3 and support plate 2 to move below the terminal and maintain the support state.

[0044] Reference Figure 5 and Figure 6 Several fixing blocks 5 are fixed to the inner sides of the groove 11, and a fixing through hole 51 is opened on the top surface of the fixing block 5. An abutment rod 52 is inserted into the fixing through hole 51, and the bottom end of the abutment rod 52 is set as a pointed tip. An abutment plate 53 is fixed to the top surface of the abutment rod 52, and the top surface of the abutment plate 53 can abut against the bottom surface of the plastic seal. A pressure plate 54 is fixedly fitted around the outer periphery of the abutment rod 52, and an abutment spring 55 is fitted around the outer periphery of the abutment rod 52. The top end of the abutment spring 55 is fixedly connected to the bottom surface of the fixing block 5, and the bottom end of the abutment spring 55 is fixedly connected to the top surface of the pressure plate 54.

[0045] Reference Figure 5 and Figure 6 A driving block 6 is fixed to the bottom surface of the moving block 3, and a driving plate 61 is fixed to the bottom surface of the driving block 6. The top surface of the driving plate 61 can abut against the bottom end of the abutment rod 52. The driving plate 61 includes a horizontally arranged horizontal plate 611, and an arc-shaped plate 612 is integrally formed on the side of the horizontal plate 611 away from the driving block 6. The side of the arc-shaped plate 612 away from the driving plate 61 is curved upward.

[0046] When cylinder 4 pushes support plate 2 to move away from the terminal, moving block 3 drives drive block 6 and drive plate 61 to move synchronously. After support plate 2 separates from the terminal, the curved surface of arc plate 612 gradually contacts the tip of bottom end of abutment rod 52. The gradual height of the arc surface pushes abutment rod 52 to move upward, causing abutment plate 53 to lift the encapsulated body. The translational motion of support plate 2 is converted into the lifting motion of abutment rod 52, realizing the linkage between opening support plate 2 and ejection of encapsulated body. There is no need to set a separate drive source for ejection action, simplifying the device structure and reducing manufacturing costs. When drive plate 61 pushes abutment rod 52 upward, abutment spring 55 is compressed and stores elastic potential energy. When drive plate 61 separates from abutment rod 52, abutment spring 55 releases elastic potential energy, pushing pressure plate 54 and abutment rod 52 to reset downward, so that abutment plate 53 returns to the bottom position of groove 11, preparing for the next device placement.

[0047] The implementation principle of a power semiconductor device test tray device 1 in this application embodiment is as follows: In the initial state, the cylinder 4 is in the extended state, the support plate 2 is opened away from the terminal, the power semiconductor device is placed in the groove 11 of the tray body 1, and the positioning rod 12 is inserted into the through hole on the plastic seal to achieve precise positioning.

[0048] Subsequently, cylinder 4 retracts, and the piston rod drives the push plate 41 and push rod 42 to move. The push rod 42, through the push groove 32, drives the moving block 3 and support plate 2 towards the terminal. The inclined surface 21 at the end of the support plate 2 acts as a guide when entering between the terminal and the encapsulation body, allowing the support plate 2 to smoothly insert into the narrow gap. The return spring 38 releases its elastic potential energy, pushing the moving block 3 and support plate 2 to remain below the terminal. The top surface of the support plate 2 abuts against the bottom surface of the terminal, providing reliable support for the terminal. After the test is completed, cylinder 4 extends, pushing the support plate 2 to open away from the terminal, and the return spring 38 is compressed, awaiting the next device placement.

[0049] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A power semiconductor device test tray device, characterized in that: The tray body (1) includes a groove (11) on the top surface of the tray body (1) for placing the encapsulated body. Several support plates (2) are slidably installed on the top surface of the tray body (1) along its width direction. The support plates (2) have inclined surfaces (21) on both the upper and lower sides near the semiconductor terminal. The support plates (2) can be moved between the semiconductor terminal and the encapsulated body. The top surface of the support plates (2) can abut against the bottom surface of the semiconductor terminal. The tray body (1) is provided with a pusher for pushing the support plates (2) to move toward the direction of the semiconductor terminal.

2. The power semiconductor device test tray device according to claim 1, characterized in that: The bottom surface of the support plate (2) is fixed with a movable block (3), and the top surface of the tray body (1) is provided with a movable groove (31). The movable block (3) is slidably installed in the movable groove (31). The pushing component includes a cylinder (4). The piston rod end of the cylinder (4) is fixed with a pushing plate (41). The top surface of the pushing plate (41) is fixed with several pushing rods (42). The bottom surface of the movable block (3) is provided with a pushing groove (32), and the pushing rods (42) are inserted into the pushing groove (32).

3. The power semiconductor device test tray device according to claim 2, characterized in that: The moving groove (31) has several guide rods (33) fixed on its inner wall away from the plastic seal. The moving block (3) has a guide through hole (34) on its side for the guide rods (33) to pass through.

4. The power semiconductor device test tray device according to claim 3, characterized in that: A ball bushing (35) is fixed inside the guide hole (34). The ball bushing (35) is located on the outer periphery of the guide rod (33). The guide rod (33) and the ball bushing (35) are in sliding fit.

5. The power semiconductor device test tray device according to claim 3, characterized in that: A connecting rod (36) is fixed to the inner wall of the movable groove (31) away from the plastic seal. A connecting hole (37) is provided on the side of the movable block (3). The connecting rod (36) passes through the connecting hole (37). A return spring (38) is sleeved on the outer periphery of the connecting rod (36). One end of the return spring (38) is fixedly connected to the inner wall of the connecting hole (37), and the other end of the return spring (38) is fixedly connected to the inner wall of the movable groove (31).

6. The power semiconductor device test tray device according to claim 5, characterized in that: The width of the push groove (32) is greater than the diameter of the push rod (42).

7. The power semiconductor device test tray device according to claim 1, characterized in that: A plurality of positioning rods (12) are fixed in the groove (11), and the positioning rods (12) can be inserted into the through holes of the upper plastic seal.

8. The power semiconductor device test tray device according to claim 2, characterized in that: A number of fixing blocks (5) are fixed on the opposite inner sides of the groove (11). The top surface of the fixing block (5) is provided with a fixing through hole (51). An abutting rod (52) is inserted into the fixing through hole (51). An abutting plate (53) is fixed on the top surface of the abutting rod (52). The top surface of the abutting plate (53) can abut against the bottom surface of the plastic seal. The tray body (1) is provided with a driving member for driving the abutting rod (52) to move upward.

9. A power semiconductor device test tray device according to claim 8, characterized in that: The driving component includes a driving block (6) fixed to the bottom surface of the moving block (3). A driving plate (61) is fixed to the bottom surface of the driving block (6). The top surface of the driving plate (61) can abut against the bottom end of the abutting rod (52). The bottom end of the abutting rod (52) is set as a pointed tip. The driving plate (61) includes a horizontally arranged horizontal plate (611). An arc-shaped plate (612) is integrally formed on the side of the horizontal plate (611) away from the driving block (6). The side of the arc-shaped plate (612) away from the driving plate (61) is bent upward.

10. A power semiconductor device test tray device according to claim 9, characterized in that: A pressure plate (54) is fixedly fitted around the outer periphery of the abutting rod (52), and an abutting spring (55) is fitted around the outer periphery of the abutting rod (52). The top end of the abutting spring (55) is fixedly connected to the bottom surface of the fixing block (5), and the bottom end of the abutting spring (55) is fixedly connected to the top surface of the pressure plate (54).

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