A chip testing device

Abstract

This invention provides a chip testing device, belonging to the field of chip testing technology. It includes a packaging and testing assembly and a T-shaped worktable, with the packaging and testing assembly installed in the center of the T-shaped worktable. This invention achieves initial bonding and positioning of the chip by setting two sets of symmetrically cooperating semi-pressure mechanisms. Subsequently, a drive motor causes the two sets of positioning rotating plates to rotate in opposite directions, cooperating with a push plate to complete precise clamping of the chip. This structure can adapt to chips of different sizes and package types, eliminating the need for manual disassembly and adjustment of the fixture structure. Furthermore, negative pressure adsorption achieves basic chip fixation. Combined with the flexible clamping of the push plate and positioning rotating plates, the chip fixing force can be precisely controlled, effectively avoiding physical damage such as chip pin bending and chip body scratching caused by rigid clamping. This solves the problems of low testing efficiency and poor testing results in existing testing devices.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip testing device. Background Technology

[0002] Chip testing is a core process in chip packaging and testing. It involves testing key performance indicators such as the conductivity and contact of chip pins and matching them with chip model parameters to complete precise testing. This directly determines the chip's yield and reliability in subsequent use, making it an indispensable and crucial step in the chip mass production process.

[0003] Currently, the chip clamping and positioning mechanisms in chip testing equipment on the market have poor adaptability. Most are designed for chips of a single specification or a few types of packages. When testing chips of different sizes and package types, manual disassembly and adjustment of the fixture structure are required, which significantly reduces testing efficiency. Moreover, errors in manual adjustment can easily lead to insufficient chip positioning accuracy, causing misalignment between the tester and the chip pins, which directly affects the accuracy of the test results. At the same time, the chip fixing method has obvious drawbacks. Traditional devices mostly use rigid mechanical clamping to fix chips, and the clamping force is difficult to control precisely, which can easily cause physical damage such as bending of chip pins and scratching of the chip body, reducing chip yield. Furthermore, during the chip testing process, it is necessary to verify the chip model and pin performance. Traditional testing devices require manual verification of the chip model in advance and manual matching of test parameters before testing, which greatly increases the testing cost.

[0004] Therefore, this application provides a chip testing apparatus to meet the requirements. Summary of the Invention

[0005] The technical problem this invention aims to solve is to provide a chip testing device. By setting two sets of symmetrically cooperating semi-pressure mechanisms, the device achieves initial bonding and positioning of the chip. Subsequently, a second drive motor causes the two sets of positioning rotating plates to rotate in opposite directions, working with a push plate to complete the precise clamping of the chip. This structure can adapt to chips of different sizes and package types without the need for manual disassembly or adjustment of the fixture structure. In addition, the negative pressure adsorption achieves basic chip fixation. Combined with the flexible clamping of the push plate and the positioning rotating plates, the chip fixing force can be precisely controlled, effectively avoiding physical damage such as chip pin bending and chip body scratching caused by rigid clamping. This solves the problems of low testing efficiency and poor testing effect of existing testing devices.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A chip testing apparatus includes a packaging and testing component and a T-shaped worktable. The packaging and testing component is installed in the middle of the T-shaped worktable. The packaging and testing component includes a semi-pressure mechanism. There are two sets of semi-pressure mechanisms, which are used symmetrically. Conical detection chambers are installed inside the two sets of semi-pressure mechanisms. The chip can be tested on the conical detection chambers. A top frame is fixedly installed at the top of the middle of the T-shaped worktable. A cylinder is fixedly installed on the inner wall of the top of the top frame. A detector is fixedly installed at the output end of the cylinder. The detector can test the chip on the conical detection chamber.

[0007] Optionally, the semi-pressing mechanism includes a press frame, a sliding groove is provided on the inner wall of the left side of the press frame, a guide rod is fixedly installed on the right end wall of the press frame, a shifting rod is fixedly installed on the bottom right side of the press frame, gears are rotatably connected to the inner walls of both ends of the press frame, and conveyor belts mesh on the two sets of gears. A cross-shaped insert is fixedly installed on the gear at the left end of the right semi-pressing mechanism, and a cross-shaped insert rod is fixedly installed on the gear at the left end of the left semi-pressing mechanism. The cross-shaped insert rod and the cross-shaped insert are inserted into each other. The guide rod slides through another press frame. A motor is fixedly installed on the outer wall of the press frame on the right semi-pressing mechanism, and the output end of the motor is fixedly connected to the corresponding gear.

[0008] Optionally, gear 2 is rotatably connected to the inner walls of both ends of the bottom of the pressure frame on the left semi-pressing mechanism, and a transmission chain meshes on the two sets of gear 2. Gear 3 is fixedly installed at the bottom of gear 2 on the right end, and gear 4 is rotatably connected to the bottom of the right end of the pressure frame, and gear 4 meshes with gear 3. Positioning plates are rotatably connected to both ends of the top of the pressure frame on the left semi-pressing mechanism, and the bottom of the two sets of positioning plates is fixedly connected to the top of the corresponding gear 2 and gear 4 respectively. Motor 2 is fixedly installed at the bottom of the pressure frame on the left semi-pressing mechanism, and the output end of motor 2 is fixedly connected to gear 2 on that side.

[0009] Optionally, the conical detection chamber is slidably connected to two sets of sliding grooves on both sides, a base plate is fixedly installed at the bottom of the conical detection chamber, a connecting plate is rotatably connected to the bottom side wall of the conical detection chamber, a connecting rod is rotatably connected to both ends of the connecting plate, the end wall of the connecting rod is rotatably connected to the corresponding shift rod, a base plate is fixedly installed at the bottom of the base plate, an electric push rod is fixedly installed on the side wall of the base plate, a push plate is fixedly installed on the outer wall of the pressure frame on the right side of the semi-pressing mechanism, and the output end of the electric push rod is fixedly connected to the push plate.

[0010] Optionally, a monitoring head and a light are fixedly installed on the inner wall of the conical detection chamber, and a reflector is fixedly installed on the inner wall of the bottom of the conical detection chamber. The reflector, monitoring head and light are all set at an angle and can be used in conjunction with each other. Negative suction holes are opened on both sides of the bottom of the conical detection chamber. The two sets of negative suction holes are sealed and connected to the same negative pressure pipe, and the input end of the negative pressure pipe is connected to an external air pump.

[0011] Optionally, a first conveying device is installed at the top front end of the T-shaped workbench, a second conveying device is installed at the top end of the T-shaped workbench, and a third conveying device is installed at the top outer side of the T-shaped workbench. The third conveying device, the second conveying device, and the first conveying device are all connected to the packaging and testing assembly, and the bottom of the substrate is fixedly connected to the inner wall of the T-shaped workbench.

[0012] Compared with the prior art, the present invention has at least the following beneficial effects:

[0013] In the above scheme, by setting up two sets of symmetrically coordinated semi-pressing mechanisms, the electric push rod on the substrate pushes the push plate, and with the transmission of the shift rod, connecting plate and connecting rod, the two sets of pressing frames can move inward synchronously to achieve the initial bonding and positioning of the chip. Subsequently, the linkage of motor two driving gear two, transmission chain, gear three and gear four causes the two sets of positioning rotating plates to rotate in opposite directions, and with the push plate, completes the precise clamping of the chip. This structure can adapt to chips of different sizes and package types, without the need for manual disassembly and adjustment of the fixture structure, completely solving the problem of poor adaptability of traditional devices. In addition, A negative suction hole is opened at the bottom of the conical detection chamber and connected to a negative pressure pipe of an external air pump. The chip is fixed in place by negative pressure adsorption. With the flexible clamping of the push plate and the positioning plate, the fixing force of the chip can be precisely controlled, which effectively avoids physical damage such as bending of chip pins and scratching of the chip body caused by rigid clamping. The entire clamping process is automated, eliminating the error of manual adjustment, ensuring the positioning accuracy of the chip, and enabling the detector and chip pins to be accurately aligned. This effectively improves the accuracy of the test results, while greatly shortening the chip clamping and debugging time and significantly improving the overall testing efficiency.

[0014] By installing a monitoring head, a light, and a reflector on the inclined inner wall of the conical testing chamber, the three work together. When the chip is placed face down on the conical testing chamber, turning on the light illuminates the chip area, the reflector accurately reflects the model and parameter data on the chip, and the monitoring head automatically collects the above information. There is no need for manual verification of the chip model and manual matching of test parameters in advance. It directly realizes automatic parameter matching between the tester and the chip model, saving a lot of manual operation steps, greatly reducing the cost of manual testing, and improving the automation of the testing process. Attached Figure Description

[0015] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0016] Figure 1 A three-dimensional structural diagram of a chip testing device; Figure 2This is a schematic diagram showing the connection between the three sets of transmission devices and the packaging and testing components; Figure 3 This diagram shows the installation positions of the packaging and testing components on the T-shaped workbench. Figure 4 This is a schematic diagram of the installation of the substrate and the T-shaped worktable; Figure 5 This is a schematic diagram of the packaging and testing component. Figure 6 This is a schematic diagram of the chip assembly on the packaging and testing assembly. Figure 7 This is a breakdown diagram of the packaging and testing components; Figure 8 This is a schematic diagram of the assembly of two sets of semi-pressure mechanisms with a conical detection chamber; Figure 9 This is a schematic diagram of the right-side half-pressure mechanism; Figure 10 This is a schematic diagram of the pressure frame structure; Figure 11 This is a split view of the right-side semi-pressure mechanism; Figure 12 This is a schematic diagram showing the connection between two sets of connecting rods and transposition rods; Figure 13 This is a schematic diagram of the assembly of the cross-shaped insert and the cross-shaped rod; Figure 14 This is a schematic diagram of the left-side semi-pressure mechanism; Figure 15 This is a schematic diagram of the assembly of two sets of positioning rotating plates and pressure frames; Figure 16 This is a schematic diagram showing the installation of the gears at the bottom of the pressure frame; Figure 17 This is a schematic diagram of the assembly of the conical detection chamber and the negative pressure pipe; Figure 18 This is a cross-sectional view of the conical testing chamber; Figure 19 This is a schematic diagram of the assembly of the conical testing chamber and the connecting plate.

[0017] Figure label: The package includes: a sealing and testing assembly 100, a semi-pressing mechanism 110, a pressing frame 111, a slide 112, a guide rod 113, a shifting rod 114, a gear 115, a conveyor belt 116, a cross-shaped insert 117, a cross-shaped insert rod 118, a motor 119, a push plate 120, a gear 2 130, a conveyor chain 131, a gear 3 132, a gear 4 133, a positioning rotating plate 134, a motor 2 135, a conical testing chamber 140, a base plate 141, a connecting plate 142, a connecting rod 143, a monitoring head 144, a lamp 145, a reflector 146, a negative suction hole 147, a negative pressure pipe 148, a substrate 150, an electric push rod 151, a T-shaped worktable 200, a top frame 210, a cylinder 211, a testing instrument 212, a first conveying device 220, a second conveying device 230, and a third conveying device 240.

[0018] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0019] The chip testing apparatus provided by the present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more comprehensive, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some well-known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0020] like Figures 1 to 19 As shown, an embodiment of the present invention provides a chip testing device, including a packaging and testing assembly 100 and a T-shaped workbench 200. The packaging and testing assembly 100 is installed in the middle of the T-shaped workbench 200. The packaging and testing assembly 100 includes a semi-pressing mechanism 110. There are two sets of semi-pressing mechanisms 110, which are used symmetrically. Conical detection chambers 140 are installed inside the two sets of semi-pressing mechanisms 110. Chips can be tested on the conical detection chambers 140. A top frame 210 is fixedly installed at the top of the middle of the T-shaped workbench 200. A cylinder 211 is fixedly installed on the inner wall of the top of the top of the top frame 210. A detector 212 is fixedly installed at the output end of the cylinder 211. The detector 212 can test the chip on the conical detection chamber 140. In the present invention, the cylinder 211 is driven to move the detector 212 downward, which can test the pins of the chip. With the chip model and data, the chip is determined to be qualified.

[0021] In this embodiment, as Figures 9 to 13As shown, the semi-pressing mechanism 110 includes a pressing frame 111. A groove 112 is formed on the inner left side of the pressing frame 111. A guide rod 113 is fixedly installed on the right end wall of the pressing frame 111. A shifting rod 114 is fixedly installed on the bottom right side of the pressing frame 111. Gears 115 are rotatably connected to the inner walls of both ends of the pressing frame 111. A conveyor belt 116 meshes with the two sets of gears 115. A cross-shaped insert 117 is fixedly installed on the gear 115 at the left end of the right semi-pressing mechanism 110, and a cross-shaped insert rod 118 is fixedly installed on the gear 115 at the left end of the left semi-pressing mechanism 110. The insert rod 118 and the cross insert 117 are inserted into each other. The guide rod 113 slides through another pressure frame 111. The outer wall of the pressure frame 111 on the right side of the semi-pressure mechanism 110 is fixedly installed with a motor 119. The output end of the motor 119 is fixedly connected to the corresponding gear 115. In this invention, the motor 119 is driven to drive the gear 115 to mesh with the conveyor belt 116. At the same time, through the cooperation of the cross insert 117 and the cross insert rod 118, the other set of conveyor belts 116 can be driven to rotate. The two sets of conveyor belts 116 have the same conveying direction.

[0022] As one implementation method in this embodiment, such as Figures 14 to 16 As shown, gears 130 are rotatably connected to the inner walls of both ends of the bottom of the pressure frame 111 on the left side of the semi-pressing mechanism 110. A conveyor chain 131 meshes with the two sets of gears 130. Gear 132 is fixedly installed at the bottom of the gear 130 on the right side. Gear 133 is rotatably connected to the bottom of the right end of the pressure frame 111, and gear 133 meshes with gear 132. Positioning plates 134 are rotatably connected to both ends of the top of the pressure frame 111 on the left side of the semi-pressing mechanism 110. The bottoms of the two sets of positioning plates 134 are fixedly connected to the tops of the corresponding gears 130 and 133, respectively. A second motor 135 is fixedly installed at the bottom, and the output end of the second motor 135 is fixedly connected to the second gear 130 on the same side. In this invention, when the chip sidewall on the conical detection chamber 140 contacts the push plate 120, the second motor 135 drives the second gear 130 to mesh with the conveyor chain 131, thereby driving the second gear 130 and the third gear 132 on the other side to rotate, so that the third gear 132 meshes with the fourth gear 133. At this time, the fourth gear 133 and the second gear 130 on the other side can both drive the positioning rotating plate 134 at the top to rotate in opposite directions. With the help of the push plate 120, chips of different specifications can be clamped.

[0023] As one implementation method in this embodiment, such as Figure 8 , Figure 12 and Figure 19As shown, the conical detection chamber 140 is slidably connected to two sets of sliding grooves 112 on both sides. The conical detection chamber 140 is the stationary end, and the two sets of pressure frames 111 are the moving ends. A base plate 141 is fixedly installed at the bottom of the conical detection chamber 140. A connecting plate 142 is rotatably connected to the bottom side wall of the conical detection chamber 140. Connecting rods 143 are rotatably connected to both ends of the connecting plate 142. The end walls of the connecting rods 143 are rotatably connected to the corresponding shift rods 114. A base plate 150 is fixedly installed at the bottom of the base plate 141. An electric push rod 151 is fixedly installed on the side wall of the base plate 150. The half-pressure mechanism 1 on the right side... A push plate 120 is fixedly installed on the outer wall of the upper pressure frame 111. The output end of the electric push rod 151 is fixedly connected to the push plate 120. In this invention, the electric push rod 151 is driven to push the push plate 120 inward, causing the pressure frame 111 on that side to move inward. At this time, the shift rod 114 at the bottom of the pressure frame 111 pushes the connecting plate 142 inward through the connecting rod 143, causing the connecting plate 142 to rotate. This forces the connecting rod 143 on the other side of the connecting plate 142 to pull the shift rod 114 on the pressure frame 111 on that side inward, achieving the effect that both sets of pressure frames 111 move inward.

[0024] In this embodiment, as Figures 17 to 19 As shown, a monitoring head 144 and a light 145 are fixedly installed on the inner wall of the conical detection chamber 140. A reflector 146 is fixedly installed on the bottom inner wall of the conical detection chamber 140. The reflector 146, monitoring head 144, and light 145 are all angled and can be used together. When the chip is above the conical detection chamber 140, turning on the light 145 can illuminate the conical detection chamber 140. At this time, the reflector 146 can reflect the data marked on the chip. The user can observe the data from the reflector 146 through the monitoring head 144. 46. ​​The data on the chip can be obtained. Negative suction holes 147 are provided on both sides of the bottom of the conical detection chamber 140. The two sets of negative suction holes 147 are sealed and connected to the same negative pressure pipe 148. The input end of the negative pressure pipe 148 is connected to an external air pump. In this invention, the negative pressure is generated in the conical detection chamber 140 by the external air pump using the negative pressure pipe 148, thereby fixing the chip. The light 145 in the conical detection chamber 140 is turned on, and the model and data of the chip can be viewed by using the monitoring head 144 and the reflector 146.

[0025] In this embodiment, as Figures 1 to 4As shown, a first conveying device 220 is installed at the top front end of the T-shaped workbench 200, which can transport out the unqualified chips after testing. A second conveying device 230 is installed at the top end of the T-shaped workbench 200, which can transport out the qualified chips after testing. A third conveying device 240 is installed at the top outer side of the T-shaped workbench 200, which can input chips of different specifications for testing. The third conveying device 240, the second conveying device 230 and the first conveying device 220 are all connected to the packaging and testing assembly 100. The bottom of the substrate 150 is fixedly connected to the inner wall of the T-shaped workbench 200, and the T-shaped workbench 200 can support the packaging and testing assembly 100 through the substrate 150.

[0026] The working principle of the technical solution provided by this invention is as follows: Chips of different specifications are placed on the third conveying device 240, with the test surface (pin surface) of the chip facing upwards and the marked surface facing downwards. The third conveying device 240 transports the chip to the conical detection chamber 140. The electric push rod 151 is driven to push the push plate 120 inwards, causing the pressure frame 111 on that side to move inwards. At this time, the shifting rod 114 at the bottom of the pressure frame 111 pushes the connecting plate 142 inwards through the connecting rod 143, causing the connecting plate 142 to rotate. The movement forces the connecting rod 143 on the other side of the connecting plate 142 to pull the shifting rod 114 on the pressure frame 111 inward, achieving the effect that both pressure frames 111 move inward. When the chip sidewall on the conical detection chamber 140 contacts the push plate 120, the drive motor 135 drives the gear 130 to mesh with the transmission chain 131, thereby driving the gear 130 and gear 132 on the other side to rotate, causing the gear 132 to mesh with the gear 133. At this time, the gear 133 and the gear 130 on the other side are both... The device can rotate the top positioning plate 134 in the opposite direction, and together with the push plate 120, it can clamp chips of different specifications. Simultaneously, an external air pump uses a negative pressure pipe 148 to generate negative pressure within the conical detection chamber 140, thereby fixing the chip. After the chip is clamped and fixed, the light 145 inside the conical detection chamber 140 is turned on, and the model and data of the chip can be viewed using the monitoring head 144 and the reflector 146. Then, the drive cylinder 211 moves the detector 212 downwards, which can detect the pins of the chip. The chip is tested, and its model and data are used to determine whether the chip is qualified. After the test is completed, the drive motor 119 drives the gear 115 to mesh with the conveyor belt 116. At the same time, through the cooperation of the cross-shaped insert 117 and the cross-shaped insert rod 118, another set of conveyor belts 116 can be driven to rotate. The two sets of conveyor belts 116 convey in the same direction, so that qualified chips are conveyed to the second conveyor device 230 for transportation, and unqualified chips are conveyed to the first conveyor device 220 for transportation.

[0027] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0028] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A chip testing apparatus, comprising a packaging and testing component (100) and a T-shaped worktable (200), wherein the packaging and testing component (100) is installed in the middle of the T-shaped worktable (200), characterized in that, The packaging and testing assembly (100) includes a semi-pressure mechanism (110), which has two sets and is used symmetrically. The two sets of semi-pressure mechanisms (110) are equipped with conical detection chambers (140). The chip can be tested on the conical detection chambers (140). A top frame (210) is fixedly installed at the top of the middle part of the T-shaped workbench (200). A cylinder (211) is fixedly installed on the inner wall of the top of the top of the top frame (210). A detector (212) is fixedly installed at the output end of the cylinder (211), and the detector (212) can test the chip on the conical detection chamber (140).

2. The chip testing device according to claim 2, characterized in that, The semi-pressing mechanism (110) includes a pressing frame (111). A groove (112) is provided on the inner wall of the left side of the pressing frame (111). A guide rod (113) is fixedly installed on the right end wall of the pressing frame (111). A shifting rod (114) is fixedly installed on the bottom right side of the pressing frame (111). Gears (115) are rotatably connected to the inner walls of both ends of the pressing frame (111). A conveyor belt (116) meshes on the two sets of gears (115). The gears (115) on the left end of the semi-pressing mechanism (110) on the right side are connected to the gears (116). 5) A cross-shaped insert (117) is fixedly installed on the upper part. A cross-shaped insert rod (118) is fixedly installed on the gear one (115) at the left end of the half-pressing mechanism (110) on the left side. The cross-shaped insert rod (118) is inserted into the cross-shaped insert (117). The guide rod (113) slides through another press frame (111). A motor one (119) is fixedly installed on the outer wall of the press frame (111) on the right side of the half-pressing mechanism (110). The output end of the motor one (119) is fixedly connected to the corresponding gear one (115).

3. The chip testing device according to claim 2, characterized in that, On the left half-pressing mechanism (110), the inner walls of the bottom ends of the press frame (111) are rotatably connected to gear 2 (130), and the two sets of gear 2 (130) are meshed with a transmission chain (131). Gear 3 (132) is fixedly installed at the bottom of the right end of gear 2 (130). Gear 4 (133) is rotatably connected at the bottom of the right end of the press frame (111), and gear 4 (133) meshes with gear 3 (132). On the left half-pressing mechanism (110), the top ends of the press frame (111) are rotatably connected to positioning plates (134). The bottoms of the two sets of positioning plates (134) are fixedly connected to the tops of the corresponding gear 2 (130) and gear 4 (133), respectively. Motor 2 (135) is fixedly installed at the bottom of the press frame (111) on the left half-pressing mechanism (110), and the output end of motor 2 (135) is fixedly connected to gear 2 (130) on this side.

4. The chip testing device according to claim 2, characterized in that, The conical detection chamber (140) is slidably connected to two sets of sliding grooves (112) on both sides. A base plate (141) is fixedly installed at the bottom of the conical detection chamber (140). A connecting plate (142) is rotatably connected to the bottom side wall of the conical detection chamber (140). A connecting rod (143) is rotatably connected to both ends of the connecting plate (142). The end wall of the connecting rod (143) is rotatably connected to the corresponding shift rod (114). A base plate (150) is fixedly installed at the bottom of the base plate (141). An electric push rod (151) is fixedly installed on the side wall of the base plate (150). A push plate (120) is fixedly installed on the outer wall of the pressure frame (111) on the right side of the semi-pressing mechanism (110). The output end of the electric push rod (151) is fixedly connected to the push plate (120).

5. The chip testing apparatus according to claim 4, characterized in that, The inner wall of the conical detection chamber (140) is fixedly equipped with a monitoring head (144) and a lamp (145). The inner wall of the bottom of the conical detection chamber (140) is fixedly equipped with a reflector (146). The reflector (146), the monitoring head (144) and the lamp (145) are all set at an angle and can be used in conjunction with each other. Negative suction holes (147) are opened on both sides of the bottom of the conical detection chamber (140). The two sets of negative suction holes (147) are sealed and connected to the same negative pressure pipe (148), and the input end of the negative pressure pipe (148) is connected to an external air pump.

6. The chip testing apparatus according to claim 4, characterized in that, A first conveying device (220) is installed at the top front end of the T-shaped workbench (200), a second conveying device (230) is installed at the top end of the T-shaped workbench (200), and a third conveying device (240) is installed at the top outer side of the T-shaped workbench (200). The third conveying device (240), the second conveying device (230) and the first conveying device (220) are all connected to the packaging and testing assembly (100). The bottom of the substrate (150) is fixedly connected to the inner wall of the T-shaped workbench (200).

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