Display module and its manufacturing method, display device

Abstract

This application provides a display module, its manufacturing method, and a display device. The display module includes: a heat dissipation layer; a lamp board located on one side of the heat dissipation layer, the lamp board including a circuit board and light-emitting units located on the side of the circuit board away from the heat dissipation layer; and a lens cover assembly including a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp board, the support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space, with the lamp board located within the accommodating space. This application facilitates timely heat dissipation of the lamp board, thereby improving the heat dissipation performance of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] A head-up display (HUD) projects image information onto the vehicle's windshield, allowing the user to directly view the projected image. This reduces the need for the user to look away from the instrument cluster or central control display, thus improving driving safety.

[0003] However, in HUD applications, the image displayed on the screen needs to be projected onto the vehicle's windshield. According to the principle of optical reversibility, when ambient light, especially sunlight, shines on the windshield, some of the light energy will flow back along the projection path to the display screen, causing the display screen temperature to rise and affecting display performance and device reliability.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] Based on this, the embodiments of this application provide a display module and its manufacturing method, as well as a display device, which facilitates timely heat dissipation of the lamp board, thereby improving the heat dissipation performance of the display module.

[0006] According to some embodiments, this application provides a display module, including: Heat dissipation layer; A light panel, located on one side of the heat dissipation layer, the light panel including a circuit board and a light-emitting unit located on the side of the circuit board away from the heat dissipation layer; A lens cover assembly includes a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp panel. The support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space. The lamp panel is located within the accommodating space.

[0007] According to some embodiments, this application also provides a method for manufacturing a display module, comprising: Provide a heat dissipation layer; A lamp board is provided on one side of the heat dissipation layer. The lamp board includes a circuit board and a light-emitting unit disposed on the side of the circuit board away from the heat dissipation layer. A lens cover assembly is provided on one side of the heat dissipation layer. The lens cover assembly includes a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp panel. The support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space. The lamp panel is located within the accommodating space.

[0008] According to some embodiments, this application provides another aspect of a display device, the display device including the display module provided in the foregoing embodiments; or, including a display module prepared by the preparation method of the display module provided in the foregoing embodiments.

[0009] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application.

[0010] The embodiments of this application may have, or at least have, the following advantages: The display module provided in this application includes a heat dissipation layer, a lamp panel, and a lens cover assembly. The lamp panel is disposed on one side of the heat dissipation layer, and the lens cover assembly is disposed on the heat dissipation layer via a support frame, forming an accommodating space together with the heat dissipation layer to accommodate the lamp panel. By disposing of both the lamp panel and the lens cover assembly on the heat dissipation layer, the heat dissipation layer not only provides support for the lamp panel and enables precise alignment between the lens cover assembly and the lamp panel, but also provides a heat conduction path for the lamp panel, facilitating timely heat dissipation. This improves the heat dissipation performance of the display module, prevents overheating, and enhances the reliability and stability of the display module.

[0011] Other advantages, objectives, and features of this application will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be learned from practice of this application. The objectives and other advantages of this application can be realized and obtained through the following description. Attached Figure Description

[0012] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0013] Figure 1 This is a schematic diagram of the structure of a display module provided in some embodiments of this application; Figure 2 This is a schematic diagram of the structure of a display module provided in some other embodiments of this application; Figure 3 This application provides a schematic diagram of the structure of a display module with a heat dissipation layer having a receiving groove, according to some embodiments of the present application. Figure 4This application provides a schematic diagram of the structure of a display module having a first positioning structure and a second positioning structure in some embodiments; Figure 5 This is a schematic diagram of the structure for display module to output electrical signals in some embodiments of this application; Figure 6 This is a schematic diagram of the structure for displaying the electrical signal output in some other embodiments of this application; Figure 7 This is a schematic diagram of a display module provided in some embodiments of the present application, in which multiple image source components are disposed on the same heat dissipation layer; Figure 8 This is a schematic diagram of a display module provided in some embodiments of the present application, in which multiple image source components are correspondingly disposed in multiple receiving slots; Figure 9 A schematic diagram illustrating the spacing between multiple image source components in a display module provided in some embodiments of this application; Figure 10 A schematic diagram of the structure in which multiple lamp panels are correspondingly arranged with the same lens cover plate body in a display module provided in some other embodiments of this application; Figure 11 This is a schematic diagram of a display module with multiple sidewalls in some embodiments of the present application; Figure 12 for Figure 11 The diagram shown is a top view of the display module. Figure 13 A schematic flowchart illustrating the manufacturing method of a display module provided in some embodiments of this application; Figure 14 This application provides schematic diagrams of the heat dissipation layer structure in the manufacturing method of the display module for some embodiments; Figure 15 This application provides schematic diagrams of the structure obtained after forming a thermally conductive medium layer in the manufacturing method of a display module for some embodiments of the present application; Figure 16 This application provides a schematic diagram of the initial lamp panel structure in the manufacturing method of the display module for some embodiments; Figure 17 This application provides a schematic diagram of the structure obtained after removing the supporting glass in the manufacturing method of the display module for some embodiments; Figure 18 This application provides a schematic diagram of the structure obtained after setting a lamp plate on one side of the heat dissipation layer in the manufacturing method of a display module in some embodiments; Figure 19 This application provides a schematic diagram of the structure obtained after mounting multiple lamp panels on the same heat dissipation layer in the manufacturing method of a display module in some embodiments; Figure 20This is a schematic diagram of the structure of a display device provided in some embodiments of this application; Figure 21 This is a schematic diagram illustrating the application of a display device provided in some embodiments of this application to a vehicle.

[0014] Explanation of reference numerals in the attached figures: 1. Display device; 10. Display module; 100. Image source component; 100a. Left exterior rearview mirror image source component; 100b. Rearview mirror image source component; 100c. Right exterior rearview mirror image source component; 100d. Instrument panel image source component; 100e. Central control screen image source component; 110. Heat dissipation layer; 111. Heat dissipation layer body; 112. Side wall; 120. Lamp panel; 121. Circuit board; 122. Light-emitting unit; 123. Supporting glass; 130. Lens cover plate assembly; 131. Lens cover plate body; 131a. Cover plate body; 131b. Lens structure; 131c. Resin layer; 132. Support frame; 132a. Outer frame; 132b. Support column; 310. Thermal conductive medium layer; 510. First positioning structure; 520. Second positioning structure; 910. Conductive circuit; 920. Conductive adhesive; 930. Insulating layer; 940. Conductive silver paste. Detailed Implementation

[0015] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0017] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first positioning structure may be referred to as a second positioning structure, and similarly, a second positioning structure may be referred to as a first positioning structure. Both the first positioning structure and the second positioning structure are positioning structures, but they are not the same positioning structure.

[0018] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0019] A head-up display (HUD) projects image information onto a vehicle's windshield, allowing the user to directly view the projected image. This reduces the need for the user to look away from the instrument cluster or central control display, improving driving safety. In HUD applications, the image projected onto the windshield is crucial. According to the principle of optical reversibility, when ambient light, especially sunlight, hits the windshield, some of the light energy is reflected back along the projection path to the display. This can cause the display temperature to rise, affecting display performance and component reliability.

[0020] Therefore, this application aims to provide a solution that can address the aforementioned technical problems, facilitating timely heat dissipation of the lamp board and thereby improving the heat dissipation performance of the display module. Details will be elaborated in subsequent embodiments.

[0021] According to some embodiments, this application provides a display module. Please refer to... Figure 1 The display module may specifically include a heat dissipation layer 110, a lamp panel 120, and a lens cover assembly 130.

[0022] like Figure 1 As shown, the lamp board 120 is located on one side of the heat dissipation layer 110. Specifically, the lamp board 120 may include a circuit board 121 and a light-emitting unit 122 located on the side of the circuit board 121 away from the heat dissipation layer 110.

[0023] like Figure 1 As shown, the lens cover assembly 130 may specifically include a lens cover body 131 and a support frame 132. The lens cover body 131 is disposed opposite to the lamp panel 120, the support frame 132 is located between the lens cover body 131 and the heat dissipation layer 110, and the support frame 132 and the heat dissipation layer 110 enclose an accommodating space A, within which the lamp panel 120 is located.

[0024] The aforementioned display module includes a heat dissipation layer 110, a lamp panel 120, and a lens cover assembly 130. The lamp panel 120 is disposed on one side of the heat dissipation layer 110, and the lens cover assembly 130 is mounted on the heat dissipation layer 110 via a support frame 132, together forming an accommodating space A to accommodate the lamp panel 120. By placing both the lamp panel 120 and the lens cover assembly 130 on the heat dissipation layer 110, the heat dissipation layer 110 not only provides support for the lamp panel 120 but also facilitates precise alignment between the lens cover assembly 130 and the lamp panel 120. Furthermore, it provides a heat conduction path for the lamp panel 120, enabling timely heat dissipation and thus improving the heat dissipation performance of the display module, preventing overheating, and enhancing its reliability and stability.

[0025] It should be noted that this application does not limit the specific structural form of the light-emitting unit 122 and the circuit board 121, as long as the light-emitting display function can be realized. In different embodiments, the light-emitting unit 122 and the circuit board 121 can adopt different configurations. The structure of the light-emitting unit 122 and the circuit board 121 will be described by way of example below with reference to specific embodiments.

[0026] In some embodiments, such as Figure 1 As shown, the light-emitting unit 122 may include a light-emitting chip, such as a micro light-emitting diode (Micro LED) chip, but is not limited thereto. In this embodiment, the circuit board 121 may include an array substrate, such as a low-temperature polysilicon (LTPS) substrate. The array substrate may include thin-film transistors electrically connected to the light-emitting chip to achieve driving control of the light-emitting chip.

[0027] In other embodiments, the light-emitting unit 122 may also include a light-emitting component. For example, such as... Figure 2 As shown, the light-emitting component may include a micro LED chip in package (MiP) device, which may specifically include multiple light-emitting chips and driver chips, with the multiple light-emitting chips and driver chips integrated into the same package.

[0028] In this embodiment, the circuit board 121 may include a wiring layer that is electrically connected to the light-emitting component and provides an electrical connection path for the light-emitting component. The switching logic function and / or drive control function are implemented by the driver chip or other semiconductor devices in the light-emitting component.

[0029] As an example, the light-emitting component can be a lamp-driver integrated chip (also known as a three-in-one chip), but it is not limited to this. A lamp-driver integrated chip is a chip that highly integrates LED beads and driver integrated circuits in the same package, which can realize the integration of driving control and light-emitting functions.

[0030] Please continue reading. Figure 1 As an example, the lens cover body 131 may include a cover body 131a and a lens structure 131b, wherein the lens structure 131b is disposed on the side of the cover body 131a facing the lamp panel 120.

[0031] For example, the cover plate body 131a can be a glass substrate, but is not limited thereto. In other embodiments, the cover plate body 131a can also be other substrates with light-transmitting properties.

[0032] The lens structure 131b can be correspondingly arranged with the light-emitting unit 122. By aligning the lens structure with the light-emitting unit 122, the lens structure 131b can regulate the light emitted by the light-emitting unit 122. For example, the lens structure 131b can guide at least a portion of the light emitted laterally from the light-emitting unit 122 to the positive viewing angle, increasing brightness and thus helping to improve the light emission efficiency and display brightness of the display module.

[0033] For example, such as Figure 1 As shown, a resin layer 131c may also be provided between the lens structure 131b and the cover plate body 131a to achieve the connection and fixation of the lens structure 131b and the cover plate body 131a, but this is not a limitation.

[0034] Please see Figure 3 In some embodiments, at least one receiving groove B may be formed on the surface of the heat dissipation layer 110 facing the lamp board 120, and the circuit board 121 may be at least partially accommodated in the receiving groove B.

[0035] In the above embodiment, by placing the circuit board 121 at least partially within the receiving groove B, the contact area between the lamp board 120 and the heat dissipation layer 110 can be increased, which is beneficial for conducting the heat at the lamp board 120 to the heat dissipation layer 110 and further improving the heat dissipation performance of the display module.

[0036] Meanwhile, since the circuit board 121 is at least partially housed within the receiving groove B, the height of the lamp board 120 relative to the heat dissipation layer 110 can be reduced. This facilitates a reduction in the distance between the lens cover assembly 130 and the heat dissipation layer 110, thereby reducing the required height of the support frame 132 and simplifying the material selection for the support frame 132. Furthermore, the reduced height of the support frame 132 helps to decrease the space required to form the support frame 132, which in turn helps to reduce the frame size of the lens cover assembly 130.

[0037] Please continue reading. Figure 1 In some embodiments, the display module may further include a thermally conductive medium layer 310, which is located between the lamp panel 120 and the heat dissipation layer 110. The lamp panel 120 is fixed to the heat dissipation layer 110 via the thermally conductive medium layer 310.

[0038] In the above embodiment, the thermally conductive medium layer 310 can fix the lamp board 120 onto the heat dissipation layer 110. At the same time, the thermally conductive medium layer 310 can also conduct heat from the lamp board 120 to the heat dissipation layer 110 so that heat can be dissipated through the heat dissipation layer 110, thereby improving the heat dissipation performance of the display module.

[0039] In some embodiments, the thermally conductive medium layer 310 may include a thermally conductive adhesive (TIM) layer or a thermally conductive silicone grease layer.

[0040] Please see Figure 4 In some embodiments, the lamp panel 120 is provided with a first positioning structure 510; correspondingly, the lens cover assembly 130 is provided with a second positioning structure 520 that cooperates with the first positioning structure 510.

[0041] During the manufacturing process of the above-mentioned display module, the lamp board 120 and the heat dissipation layer 110 do not need to be precisely aligned. Instead, during the installation of the lens cover assembly 130 onto the heat dissipation layer 110, the first positioning structure 510 set on the lamp board 120 is used as the alignment reference. The position of the lens cover assembly 130 is adjusted according to the first positioning structure 510 so that the second positioning structure 520 on the lens cover assembly 130 corresponds accurately to the first positioning structure 510 on the lamp board 120. This achieves the alignment between the lens cover assembly 130 and the lamp board 120, ensuring the optical performance of the display module.

[0042] It should be noted that the specific shape, quantity and setting position of the first positioning structure 510 and the second positioning structure 520 are not limited, as long as they can achieve the alignment between the lens cover assembly 130 and the lamp plate 120.

[0043] In some embodiments, such as Figure 4As shown, the first positioning structure 510 includes a slot, and the second positioning structure 520 includes a protrusion. The slot is located on the side of the lamp plate 120 facing the lens cover plate body 131, and the protrusion is located on the side of the lens cover plate body 131 facing the slot. The protrusion engages with the slot.

[0044] In the above embodiment, by providing a slot on the lamp panel 120 and a protrusion corresponding to the slot on the lens cover plate body 131, the protrusion can engage with the slot when the lens cover plate assembly 130 is installed on the lamp panel 120, helping to reduce misalignment and thus achieving alignment between the lens cover plate assembly 130 and the lamp panel 120. This alignment structure is simple, easy to manufacture and assemble, and helps simplify the manufacturing process of the display module.

[0045] It should be noted that this application does not limit the method of extracting electrical signals, as long as the electrical signals can be transmitted to the lamp board 120. The extraction method of electrical signals is illustrated below with reference to specific embodiments.

[0046] Please see Figure 5 In some embodiments, the lens cover assembly 130 is provided with a conductive line 910, that is, the conductive line 910 can be disposed on the lens cover assembly 130 and electrically connected to the lamp board 120 to transmit electrical signals to the lamp board 120.

[0047] As an example, conductive line 910 can be an indium tin oxide (ITO) conductive line, but is not limited to this.

[0048] For example, the conductive line 910 can be disposed on the lens cover plate body 131 and electrically connected to the lamp board 120 via conductive adhesive 920. Specifically, when the lens cover plate assembly 130 is installed on the heat dissipation layer 110, the conductive adhesive 920 can contact the pads on the lamp board 120, thereby realizing the electrical connection between the conductive line 910 and the lamp board 120 to transmit electrical signals to the lamp board 120.

[0049] Please see Figure 6 In some other embodiments, the heat dissipation layer 110 is provided with conductive lines, that is, the conductive lines 910 can also be provided on the heat dissipation layer 110. The conductive lines 910 are electrically connected to the lamp board 120 to transmit electrical signals to the lamp board 120.

[0050] As an example, an insulating layer 930 may be provided between the heat dissipation layer 110 and the conductive line 910 to prevent conductivity between the conductive line 910 and the heat dissipation layer 110. Further, the conductive line 910 may be an ITO conductive line and electrically connected to the pads on the lamp board 120 via conductive silver paste 940, thereby achieving electrical connection between the conductive line 910 and the lamp board 120 to transmit electrical signals to the lamp board 120.

[0051] It should be noted that, in some embodiments, the lens cover assembly 130 may also be provided with a flexible printed circuit (FPC). The FPC may be electrically connected to the conductive line 910 to provide drive signals and / or power supply signals to the conductive line 910, thereby realizing the electrical connection between the lamp board 120 and the external circuit.

[0052] For ease of description, in some embodiments of this application, the lamp panel 120 and the corresponding lens cover assembly 130 may be collectively referred to as an image source assembly 100. However, it should be noted that the name "image source assembly 100" is used only for ease of description and does not constitute a limitation on the scope of protection of this application.

[0053] Please see Figure 7 and Figure 8 , Figure 7 A schematic diagram of a structure in which multiple image source components 100 are spaced apart on the same heat dissipation layer 110 is shown. Figure 8 A schematic diagram is shown showing multiple image source components 100 correspondingly disposed within multiple receiving slots B of the same heat dissipation layer 110. In some embodiments, the display module includes multiple lamp panels 120 and multiple lens cover plate assemblies 130. The multiple lamp panels 120 are spaced apart on the same heat dissipation layer 110, and the multiple lens cover plate assemblies 130 are disposed one-to-one with the multiple lamp panels 120. In other words, each lamp panel 120 and its corresponding lens cover plate assembly 130 can constitute an image source component 100, and multiple image source components 100 are jointly disposed on the same heat dissipation layer 110.

[0054] In the above embodiments, since multiple image source components 100 are independently disposed on the same heat dissipation layer 110, when one of the image source components 100 malfunctions, the corresponding image source component 100 can be replaced without replacing all the image source components 100, which helps to reduce losses caused by process defects and subsequent maintenance costs.

[0055] For example, please refer to Figure 9 Multiple image source components 100 are arranged at intervals. The spacing between adjacent image source components 100 includes a first spacing d1, a second spacing d2, and a third spacing d3. Among them, the third spacing d3 is greater than the second spacing d2, and the second spacing d2 is greater than the first spacing d1.

[0056] Please combine Figure 9 It is understood that the third spacing d3 corresponds to the spacing between adjacent image source components 100 in the central region, and the first spacing d1 corresponds to the spacing between adjacent image source components 100 in the edge region. By making the third spacing d3 greater than the second spacing d2 and the second spacing d2 greater than the first spacing d1, the heat dissipation space in the central region can be increased, preventing heat from concentrating in the central region and causing higher temperatures in the central region, thus reducing the degree of heat accumulation in the central region and helping to further improve the heat dissipation performance of the display module.

[0057] Please see Figure 10 In other embodiments, the display module includes at least two lamp panels 120. The at least two lamp panels 120 are spaced apart on the same heat dissipation layer 110 and are correspondingly disposed with respect to the same lens cover body 131.

[0058] In the above embodiments, multiple lamp panels 120 can be pre-installed on the heat dissipation layer 110, and then aligned and installed with the same lens cover body 131. This reduces the number of times the lens cover body 131 can be installed, simplifies the manufacturing process of the display module, and thus helps to reduce manufacturing costs.

[0059] Please see Figure 11 In some embodiments, the heat dissipation layer 110 includes a heat dissipation layer body 111 and a plurality of sidewalls 112, the plurality of sidewalls 112 being disposed on the heat dissipation layer body 111 and arranged at intervals.

[0060] like Figure 11 As shown, multiple side walls 112 are located within the accommodating space A and divide the accommodating space A into multiple sub-accommodating spaces A', and at least one sub-accommodating space A' is provided with a light panel 120.

[0061] As an example, such as Figure 12 As shown, the support frame 132 may include an outer frame 132a surrounding a plurality of sub-accommodating spaces A', and a plurality of support columns 132b located within the outer frame. The outer frame 132a may be a closed shape, and the support columns 132b are located between at least two sub-accommodating spaces A'.

[0062] It should be noted that the embodiments of this application may also include other structures, such as an optically clear (OC) layer and a black matrix (BM), which work together to realize the display function of the display module. The optically clear layer OC can be disposed on the light-emitting side of the light-emitting unit 122 to improve the optical performance of the display module; the black matrix BM can be disposed between adjacent light-emitting units 122 to reduce the impact of stray light on the display effect. It is understood that the specific structures of the optically clear layer OC and the black matrix BM can be understood by referring to existing technology and are not the focus of this application, and will not be further elaborated here.

[0063] Based on the same inventive concept, this application also provides a method for manufacturing the aforementioned display module. Please refer to [link to relevant documentation]. Figure 13 The method for manufacturing the display module may specifically include the following steps S100 to S300: S100: Provides a heat dissipation layer.

[0064] S200: A lamp board is provided on one side of the heat dissipation layer. The lamp board includes a circuit board and a light-emitting unit disposed on the side of the circuit board away from the heat dissipation layer.

[0065] S300: A lens cover assembly is provided on one side of the heat dissipation layer. The lens cover assembly includes a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp panel. The support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space. The lamp panel is located within the accommodating space.

[0066] The above-described method for manufacturing the display module involves providing a heat dissipation layer and placing both the lamp panel and the lens cover assembly on it. This allows the heat dissipation layer to not only support the lamp panel but also serve as a common positioning reference for both the lamp panel and the lens cover assembly. The lens cover assembly, together with the heat dissipation layer and the support frame, forms an accommodating space to house the lamp panel. This method facilitates precise alignment between the lens cover assembly and the lamp panel. Furthermore, the heat dissipation layer provides a heat conduction path for the lamp panel, enabling timely heat dissipation and improving the heat dissipation performance of the display module. This prevents overheating and enhances the reliability and stability of the display module.

[0067] To provide a clearer explanation of the manufacturing method of the display module, please refer to the following... Figures 14 to 19 Understand some embodiments of this application.

[0068] In step S100, as Figure 14 As shown, a heat dissipation layer 110 is provided.

[0069] In step S200, as Figures 15 to 18As shown, a lamp board 120 is provided on one side of the heat dissipation layer 110. The lamp board 120 may specifically include a circuit board 121 and a light-emitting unit 122 disposed on the side of the circuit board 121 away from the heat dissipation layer 110.

[0070] As an example, before step S200, such as Figure 15 As shown, a thermally conductive dielectric layer 310 is formed on the side of the heat dissipation layer 110 facing the lamp panel 120. For example, the thermally conductive dielectric layer 310 may include a thermally conductive adhesive layer or a thermally conductive silicone grease layer, but is not limited thereto.

[0071] In some embodiments, the lamp panel 120 may be disposed on one side of the heat dissipation layer 110 through the following steps S210 to S220: In step S210, as Figure 16 As shown, an initial light panel is provided, which includes a supporting glass 123, a circuit board 121 formed on one side of the supporting glass 123, and a light-emitting unit 122 formed on the side of the circuit board 121 away from the supporting glass 123.

[0072] As an example, such as Figure 16 As shown, the initial lamp panel may also have a polyimide (PI) layer. The circuit board 121 and the light-emitting unit 122 may be disposed on one side of the PI layer, and the supporting glass 123 is located on the side of the PI layer away from the circuit board 121. As an example, the thickness of the PI layer may range from 5 μm to 20 μm, but is not limited thereto.

[0073] In step S220, as Figure 17 As shown, the supporting glass 123 of the initial lamp panel is removed to form the lamp panel 120.

[0074] For example, the supporting glass 123 of the initial lamp board can be removed, while the PI layer is retained to provide support and protection for the circuit board 121 and the light-emitting units 122 disposed on the circuit board 121. After removing the supporting glass 123, the PI layer can contact the thermally conductive medium layer 310 from the side away from the circuit board 121, thereby achieving... Figure 18 As shown, the lamp panel 120 is fixed on the heat dissipation layer 110.

[0075] As an example, step S220 may specifically include removing the support glass 123 of the initial lamp panel using a laser lift-off (LLO) process.

[0076] After removing the support glass 123 to form the lamp panel 120, the lamp panel 120 can be attached to the side of the thermally conductive medium layer 310 away from the heat dissipation layer 110. The thermally conductive medium layer 310 can fix the lamp panel 120 to the heat dissipation layer 110 on the one hand, and conduct heat from the lamp panel 120 to the heat dissipation layer 110 on the other hand, thereby improving the heat dissipation performance of the display module.

[0077] In the above embodiment, after removing the supporting glass 123, the lamp panel 120 is first fixed to the heat dissipation layer 110, and then the lens cover assembly 130 is installed on the heat dissipation layer 110. This facilitates precise alignment between the lens cover assembly 130 and the lamp panel 120. Simultaneously, the heat dissipation layer 110 provides a heat conduction path for the lamp panel 120, and the thermally conductive medium layer 310 further promotes heat transfer to the heat dissipation layer 110, thereby improving the heat dissipation performance of the display module.

[0078] In step S300, a lens cover assembly 130 is provided on one side of the heat dissipation layer 110. The lens cover assembly 130 includes a lens cover body 131 and a support frame 132. The lens cover body 131 is disposed opposite to the lamp panel 120. The support frame 132 is located between the lens cover body 131 and the heat dissipation layer 110, and the support frame 132 and the heat dissipation layer 110 enclose an accommodating space A. The lamp panel 120 is located within the accommodating space A.

[0079] After steps S100 to S300, the display module in the aforementioned embodiment can be prepared. As an example, the prepared display module can be as follows: Figure 1 As shown.

[0080] In some embodiments, at least one receiving groove B as described in the foregoing embodiments may be formed on the surface of the heat dissipation layer 110 facing the lamp board 120, and the circuit board 121 may be at least partially accommodated within the receiving groove B. The following description uses the example of the heat dissipation layer 110 having a receiving groove B as an example to illustrate some exemplary aspects.

[0081] In some embodiments, the thermally conductive medium layer 310 may be pre-formed in the receiving tank B. As an example, the thermally conductive medium layer 310 may be applied to the receiving tank B using a dispensing process, but this is not a limitation.

[0082] After the heat-conducting medium layer 310 is disposed in the receiving groove B, the side of the lamp plate 120 facing the heat dissipation layer 110 can be brought into contact with the heat-conducting medium layer 310, and the lamp plate 120 can be installed in the receiving groove B. As an example, the lamp plate 120 can be aligned with the receiving groove B before being embedded in the receiving groove B, so that the lamp plate 120 is at least partially accommodated in the receiving groove B.

[0083] Please see Figure 19In other embodiments, multiple lamp panels 120 can be first mounted on the same heat dissipation layer 110, and then the same lens cover plate body 131 can be mounted on top of the multiple lamp panels 120 and aligned and bonded to them. As an example, the resulting display module can be manufactured as follows: Figure 11 As shown.

[0084] Using the above preparation method, the same lens cover plate body 131 and multiple lamp plates 120 can be aligned and bonded at one time, thereby simplifying the preparation process of the display module and helping to reduce manufacturing costs.

[0085] It should be noted that the methods for preparing the display modules in the embodiments of this application can all be used to prepare the corresponding display modules. Therefore, the technical features between the method embodiments and the module embodiments can be substituted and supplemented for each other without conflict, so that those skilled in the art can understand the technical content of this application.

[0086] Based on the same inventive concept, this application also provides a display device. The display device includes the display module provided in the foregoing embodiments; or, it includes a display module prepared by the method for preparing the display module provided in the foregoing embodiments.

[0087] like Figure 20 As shown, Figure 20 This is a schematic diagram of a display device provided in an embodiment of this application. The display device includes a display panel and a display module 10 provided in the foregoing embodiments. The display panel is located on the light-emitting side of the display module 10. The specific structure of the display module 10 has been described in detail in the foregoing embodiments and will not be repeated here.

[0088] certainly, Figure 20 The display device shown is merely illustrative. The display device 1 in the embodiments of this application can be any product or component with display function, such as a mobile phone, electronic paper, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc. The embodiments disclosed in this application do not limit this.

[0089] In some embodiments, the display device can be applied to a vehicle. As an example, multiple image source components 100 can be provided inside the center console of the vehicle. The multiple image source components 100 can correspond to different information sources and project information source information of different content respectively.

[0090] For example Figure 21As shown, the multiple image source components 100 may include an image source component 100a corresponding to the information of the left exterior rearview mirror, an image source component 100b corresponding to the information of the rearview mirror, an image source component 100c corresponding to the information of the right exterior rearview mirror, an image source component 100d corresponding to the information of the instrument panel, and an image source component 100e corresponding to the information of the central control screen, etc.

[0091] During normal vehicle operation, the image information projected by multiple image source components 100 can be stitched together in the driver's field of vision to form an overall display screen that includes information from the rear view, instrument panel, central control, and other aspects.

[0092] In other application scenarios, such as during automatic parking or vehicle startup, the information sources corresponding to different image source components 100 can also display environmental images of the front, rear, left, and right sides of the vehicle. By displaying image information corresponding to the vehicle's surrounding environment, it is easier for the driver to observe the surrounding environment; on the other hand, it can also provide timely warnings when pedestrians or other obstacles appear near the vehicle, thereby improving vehicle driving safety.

[0093] In the description of this specification, references to terms such as "some embodiments," "as an example," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0094] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display module, characterized in that, include: Heat dissipation layer; A light panel, located on one side of the heat dissipation layer, the light panel including a circuit board and a light-emitting unit located on the side of the circuit board away from the heat dissipation layer; A lens cover assembly includes a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp panel. The support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space. The lamp panel is located within the accommodating space.

2. The display module according to claim 1, characterized in that, The heat dissipation layer has at least one receiving groove on its surface facing the lamp board, and the circuit board is at least partially housed in the receiving groove.

3. The display module according to claim 1, characterized in that, The display module further includes a thermally conductive medium layer, which is located between the lamp panel and the heat dissipation layer; The lamp panel is fixed to the heat dissipation layer via the thermally conductive medium layer.

4. The display module according to claim 3, characterized in that, The thermally conductive medium layer includes a thermally conductive adhesive layer or a thermally conductive silicone grease layer.

5. The display module according to claim 1, characterized in that, The lamp panel is provided with a first positioning structure, and the lens cover assembly is provided with a second positioning structure that cooperates with the first positioning structure.

6. The display module according to claim 5, characterized in that, The first positioning structure includes a slot, and the second positioning structure includes a protrusion; The slot is located on the side of the lamp plate facing the lens cover body, and the protrusion is located on the side of the lens cover body facing the slot, and the protrusion engages in the slot.

7. The display module according to claim 1, characterized in that, The light-emitting unit includes a light-emitting chip, and the circuit board includes an array substrate, the array substrate including thin-film transistors electrically connected to the light-emitting chip.

8. The display module according to claim 1, characterized in that, The light-emitting unit includes multiple light-emitting chips and a driving chip, and the multiple light-emitting chips and the driving chip are integrated into the same package to form a light-emitting component. The circuit board includes a wiring layer that is electrically connected to the light-emitting component.

9. The display module according to claim 1, characterized in that, The lens cover assembly is provided with conductive lines, which are electrically connected to the lamp panel to transmit electrical signals to the lamp panel.

10. The display module according to claim 1, characterized in that, The heat dissipation layer is provided with conductive lines, which are electrically connected to the lamp board to transmit electrical signals to the lamp board.

11. The display module according to claim 1, characterized in that, The display module includes multiple lamp panels and multiple lens cover plate assemblies; The plurality of lamp panels are spaced apart on the same heat dissipation layer, and the plurality of lens cover assemblies are arranged in a one-to-one correspondence with the plurality of lamp panels.

12. The display module according to claim 1, characterized in that, The display module includes at least two light panels; The at least two lamp panels are spaced apart on the same heat dissipation layer and are correspondingly arranged with the same lens cover plate body.

13. The display module according to claim 1, characterized in that, The heat dissipation layer includes a heat dissipation layer body and multiple sidewalls, wherein the multiple sidewalls are disposed on the heat dissipation layer body and arranged at intervals; The multiple side walls are located within the accommodating space and divide the accommodating space into multiple sub-accommodating spaces, with the light panel being installed in at least one of the sub-accommodating spaces.

14. A method for manufacturing a display module, characterized in that, include: Provide a heat dissipation layer; A lamp board is provided on one side of the heat dissipation layer. The lamp board includes a circuit board and a light-emitting unit disposed on the side of the circuit board away from the heat dissipation layer. A lens cover assembly is provided on one side of the heat dissipation layer. The lens cover assembly includes a lens cover body and a support frame. The lens cover body is disposed opposite to the lamp panel. The support frame is located between the lens cover body and the heat dissipation layer, and the support frame and the heat dissipation layer enclose an accommodating space. The lamp panel is located within the accommodating space.

15. The method for preparing a display module according to claim 14, characterized in that, The provision of a lamp panel on one side of the heat dissipation layer includes: An initial light panel is provided, the initial light panel including a supporting glass, a circuit board formed on one side of the supporting glass, and a light-emitting unit formed on the side of the circuit board away from the supporting glass; The supporting glass of the initial lamp panel is removed to form the lamp panel.

16. A display device, characterized in that, The display device includes the display module according to any one of claims 1 to 13; or, it includes a display module prepared by the method for preparing the display module according to claim 14 or 15.

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