A method for designing and optimizing precision platforms for semiconductor devices with coupling compensation

Abstract

This invention relates to a method for designing and optimizing the structure of a precision motion platform for semiconductor equipment with coupling compensation, belonging to the field of semiconductor manufacturing equipment technology. The method includes: performing multi-source coupling analysis on the precision motion platform to identify force coupling between macro and micro platforms, positional force coupling between multiple degrees of freedom, and elastic coupling of flexible mechanisms, and determining the main control structure parameters; integrating a flexible decoupling mechanism, a macro-micro reaction force balancing mechanism, and a geometric error symmetry compensation structure into the structure; establishing a parameterized coupling compensation model with the main control structure parameters as variables; constructing a collaborative optimization objective function for structural parameters and control compensation parameters, and using a multi-objective optimization algorithm for collaborative optimization; manufacturing the platform based on the optimal structural parameters and configuring the optimal control parameters. This invention reduces multi-source coupling effects at their source through the synergistic effect of structural-level coupling compensation and control-level coupling compensation, and has the advantages of high positioning accuracy, good dynamic response, and strong robustness.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a method for designing and optimizing a precision motion platform structure for semiconductor equipment with coupling compensation. Background Technology

[0002] Semiconductor manufacturing and packaging equipment (such as lithography machines, wafer mounters, and wire bonding machines) places extremely high demands on the positioning accuracy and dynamic response of motion platforms. As alignment tolerances have been compressed from the micrometer level to the tens of nanometer level, motion platforms are no longer just background automation equipment, but have become a critical infrastructure for yield. As a core component of electronic packaging equipment, achieving high-precision, high-stability, and long-stroke motion has become a key issue for precision motion platforms.

[0003] Direct-drive motion platforms are indispensable components in precision motion control applications, and their dynamics are severely affected by the coupling effects between various mechanical, electrical, and control system components. To achieve a balance between large stroke and nanometer-level precision, macro-micro composite drive has become the mainstream solution—the macro platform is responsible for large-stroke, low-precision motion, while the micro platform is responsible for short-stroke, high-precision motion.

[0004] However, significant force and motion coupling exist between the macro and micro platforms: the reaction force generated by the high-speed movement of the micro platform acts on the macro platform, causing unexpected displacement and vibration. Simultaneously, the positioning error of the macro platform is also transmitted to the micro platform, creating a vicious cycle of "macro motion interfering with micro motion, and micro motion reacting to macro motion." Existing technologies mostly employ post-compensation methods based on control algorithms, but this control compensation is limited by sensor bandwidth and controller response speed, making it difficult to achieve real-time and accurate compensation for macro-micro coupling, thus requiring further improvement. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a method for designing and optimizing precision platforms for semiconductor devices with coupling compensation.

[0006] The coupling-compensated semiconductor device precision platform design and optimization method provided in this application adopts the following technical solution: The present invention provides a method for designing and optimizing a precision motion platform structure for a semiconductor device with coupling compensation, which adopts the following technical solution: A method for designing and optimizing the structure of a precision motion platform for a semiconductor device with coupling compensation, comprising the following steps: Step S1: Perform multi-source coupling analysis on the precision motion platform of semiconductor equipment to identify force coupling between macro and micro platforms, positional-force coupling between multiple degrees of freedom, and elastic coupling in flexible mechanisms, and determine the main control structure parameters of various couplings; Step S2: Based on the main control structure parameters, a coupling compensation structure is integrated into the structure of the precision motion platform. The coupling compensation structure includes a flexible decoupling mechanism, a macro-micro reaction force balancing mechanism, and a geometric error symmetry compensation structure. Step S3: Establish a parameterized coupling compensation model with the main control structure parameters as variables and the coupling compensation effect as the objective function; Step S4: Construct a collaborative optimization objective function for structural parameters and control compensation parameters, and use a multi-objective optimization algorithm to collaboratively optimize the structural parameters and control compensation parameters to obtain the optimal combination of structural parameters and the corresponding optimal control compensation parameters; Step S5: Based on the optimal combination of structural parameters obtained in step S4, manufacture a precision motion platform and configure the corresponding optimal control compensation parameters to achieve the synergistic effect of structural-level coupling compensation and control-level coupling compensation.

[0007] By adopting the above technical solution, this invention introduces a coupling compensation structure at the structural design stage. Through a flexible decoupling mechanism, a macro-micro reaction force balancing mechanism, and a geometric error symmetry compensation structure, it weakens multi-source coupling effects at the physical level. Simultaneously, a parameterized model is established to collaboratively optimize structural and control parameters, ensuring that structural-level compensation and control-level compensation work in tandem, rather than being designed sequentially and independently. This method fundamentally reduces coupling strength, alleviates the burden on the control system, and improves overall accuracy and robustness.

[0008] Furthermore, the force coupling between the macro and micro platforms in step S1 includes: vibration coupling generated by the reaction force of the micro platform during movement on the macro platform, position coupling transmitted from the positioning error of the macro platform to the micro platform, and parasitic coupling disturbance force between the macro and micro platforms; the main control structural parameters include the connection stiffness, mass ratio and damping coefficient between the macro and micro platforms.

[0009] By employing the above technical solutions and quantitatively analyzing the connection stiffness, mass ratio, and damping coefficient between macro and micro platforms, the key parameters that contribute most to coupling can be identified, providing a quantitative basis for subsequent compensation structure design. For example, reducing the macro-micro connection stiffness can reduce force transmission, but may reduce overall rigidity; therefore, optimization is needed to find a balance point.

[0010] Furthermore, the flexible decoupling mechanism mentioned in step S2 includes a parallel flexible decoupling mechanism based on a reed beam or a circular arc beam. The flexible decoupling mechanism is set between the drive chain and the moving platform of the multi-degree-of-freedom parallel platform to realize the motion decoupling between rotational motion and translational degrees of freedom. Its decoupling capability is characterized and optimized by the flexibility matrix method.

[0011] By adopting the above technical solutions, the flexible decoupling mechanism utilizes the specific deformation modes of elastic elements to make the motions between different degrees of freedom independent of each other. The compliance matrix method can quantitatively describe the coupling compliance between each degree of freedom. By optimizing the geometric dimensions (length, width, and thickness) of the reed beam, the off-diagonal coupling compliance can be made close to zero, achieving structural-level decoupling.

[0012] Furthermore, the macro-micro reaction force balancing mechanism in step S2 includes an inertial balancing mass block or a symmetrically arranged dual-drive structure disposed on the macro platform. The motion direction of the inertial balancing mass block is opposite to the motion direction of the micro platform, which is used to counteract the influence of the reaction force generated by the motion of the micro platform on the macro platform. The symmetrically arranged dual-drive structure adopts a common stator symmetrical drive configuration, which utilizes structural symmetry to eliminate position coupling and force coupling components.

[0013] By adopting the above technical solution, the inertial balancing mass block, based on the principle of conservation of momentum, cancels out the reaction force through opposite-direction motion, making the net force on the macro platform zero. The symmetrical dual-drive structure utilizes geometric symmetry to cancel out the coupling forces, for example, by arranging symmetrical linear motors on both sides of the gantry, so that the lateral force couple is naturally balanced.

[0014] Furthermore, the parameterized coupling compensation model in step S3 includes: a coupling stiffness matrix K_c(θ), a coupling damping matrix C_c(θ), and a coupling mass matrix M_c(θ), where θ is the main control structure parameter vector; the objective function of the coupling compensation effect is to minimize the norm of each coupling matrix, i.e., J_structure = min(‖K_c(θ)‖ + ‖C_c(θ)‖ + ‖M_c(θ)‖).

[0015] By employing the above technical solution, the coupling effect is characterized as off-diagonal elements of three matrices: mass, stiffness, and damping. The norm reflects the overall strength of the coupling. The optimization objective is to minimize these norms, making the system as close as possible to a decoupled state. This model establishes a clear mathematical relationship between the structural parameter θ and the coupling strength, providing a quantitative indicator for subsequent optimization.

[0016] Furthermore, the collaborative optimization objective function mentioned in step S4 is: J_total = w1·J_structure(θ)+ w2·J_control(K_p, K_i, K_d, θ) + w3·J_coupling(θ, K_p, K_i, K_d), where J_structure(θ) is the structural coupling evaluation function, J_control is the control performance evaluation function, J_coupling is the residual coupling evaluation function under the interaction of structural parameters and control parameters, and w1, w2, and w3 are weight coefficients.

[0017] By adopting the above technical solution, the collaborative optimization objective function simultaneously considers the coupling strength of the structure itself, the performance of the controller (such as response speed and overshoot), and the residual coupling under the interaction of the two. This joint optimization avoids the problem of mutual constraints between structural parameters and control parameters in serial design, and can find a globally optimal compromise solution.

[0018] Furthermore, the multi-objective optimization algorithm in step S4 adopts a particle swarm optimization algorithm or a genetic algorithm, with the structural parameter vector θ and the control parameter vector C as decision variables, and the optimization objective is to minimize the collaborative optimization objective function J_total. The Pareto optimal solution set is obtained through iterative optimization, and the optimal combination of structural parameters and the corresponding optimal control compensation parameters that satisfy the engineering constraints are selected from it.

[0019] By adopting the above technical solutions, the particle swarm optimization algorithm features fast convergence and strong global search capabilities, making it suitable for high-dimensional parameter optimization. The Pareto optimal solution set provides multiple non-dominated compromise solutions, allowing engineers to select the most suitable solution based on actual constraints (such as cost, volume, and manufacturing difficulty).

[0020] Furthermore, step S6 is included: verifying the coupling compensation effect of the precision motion platform manufactured in step S5. The positioning error and trajectory tracking error of the platform are measured by a laser interferometer, and the measured error is compared with the prediction error of the parameterized coupling compensation model. If the deviation exceeds the preset threshold, the process returns to step S3 to correct the coupling compensation model, forming a closed-loop iterative optimization.

[0021] By adopting the above technical solutions, field tests can verify the consistency between the model and the actual system. If the deviation is too large, it indicates that some coupling mechanisms in the model have been ignored or the parameters are inaccurate. By correcting the model and re-optimizing it, the design can gradually approach the true optimal state, forming a closed-loop iterative improvement.

[0022] Furthermore, the geometric error symmetric compensation structure in step S2 includes a symmetrically arranged geometric error compensation path constructed based on a gantry structure. The symmetrically arranged geometric error compensation path cancels out the coupled components of translation error and rotation error through structural symmetry.

[0023] By employing the above technical solution, in a gantry structure, by symmetrically arranging the measurement system (such as an optical encoder) on both sides of the gantry, the translational errors caused by thermal deformation and stress deformation exhibit the same sign on both sides, while the angular errors exhibit opposite signs, thereby eliminating coupling through differential processing. This structural-level compensation is more reliable than compensation based solely on algorithms.

[0024] Furthermore, the precision motion platform of the semiconductor equipment is any one of the following: a lithography machine workpiece stage, a wafer mounter motion platform, a wire bonding machine motion platform, or a wafer inspection stage.

[0025] By adopting the above technical solution, the method of the present invention is applicable to various semiconductor device motion platforms and has good versatility.

[0026] In summary, the present invention has at least one of the following beneficial effects: 1. By integrating coupling compensation structures (flexible decoupling mechanism, reaction force balancing mechanism, symmetrical compensation structure) during the structural design stage, the multi-source coupling effect is weakened from the physical source, reducing the pressure of control system compensation and improving the inherent accuracy of the system. 2. A parameterized coupling compensation model with structural parameters as variables was established, and the coupling strength was quantified into the norms of stiffness, damping, and mass matrices, providing clear quantitative targets and mathematical tools for structural optimization; 3. A collaborative optimization framework for structural parameters and control compensation parameters was constructed. The globally optimal structural-control joint parameters were obtained through a multi-objective optimization algorithm, avoiding suboptimal solutions in traditional serial design. 4. Through a closed-loop iterative mechanism of experimental verification and model correction, the consistency between the design model and the actual system is ensured, and the reliability of the optimization results is improved. Attached Figure Description

[0027] Figure 1 This is an overall flowchart of the method of the present invention; Figure 2 This is a schematic diagram illustrating the principle of the macro-micro reaction force balancing mechanism in this invention; Figure 3 This is a schematic diagram representing the compliance matrix of the flexible decoupling mechanism in this invention; Figure 4 This is a schematic diagram of the convergence curve of the collaborative optimization iteration in this invention. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-4 The present invention will be described in further detail below.

[0029] This invention discloses a method for designing and optimizing a precision motion platform structure for semiconductor equipment with coupling compensation. This method is applicable to scenarios requiring large stroke and nanometer-level precision, such as lithography machine workpiece stages, wafer mounter motion platforms, wire bonding machine motion platforms, or wafer inspection stages.

[0030] Reference Figure 1 The method of the present invention includes the following steps: Step S1: Multi-source coupling analysis and identification of main control structure parameters.

[0031] First, a dynamic model of the precision motion platform is performed to identify three types of coupling: (1) Force coupling between macro and micro platforms: including vibration coupling of the micro platform's motion reaction force to the macro platform, position coupling of the macro platform's positioning error to the micro platform, and parasitic coupling disturbance force between the two. The main control structural parameters include macro-micro connection stiffness k_c, macro platform mass M_macro, micro platform mass M_micro, and damping ratio ζ.

[0032] (2) Force coupling between multiple degrees of freedom: For example, in a parallel platform with three degrees of freedom (XYθ), the rotational motion of θ will cause additional displacement in the X / Y directions. The main structural parameters include the geometric arrangement angle of the parallel branches and the stiffness of the elastic elements.

[0033] (3) Elastic coupling in flexible mechanisms: for example, bending and tensile coupling of a reed beam in different directions. The main structural parameters are the length L, width b, and thickness h of the reed.

[0034] Step S2: Integrate and set the coupling compensation structure.

[0035] Based on the main control structure parameters identified in step S1, the following compensation structure is integrated into the platform structure: (2a) Flexible decoupling mechanism: A flexible decoupling mechanism based on a reed beam is installed between the drive chain of the parallel platform and the moving platform. The reed geometry is designed so that the off-diagonal elements of the compliance matrix approach zero. For example, for a three-DOF parallel platform, by optimizing the reed thickness and length, the coupling coefficient between the rotational compliance about the Z-axis and the translational compliance about the X / Y axis is less than 0.01.

[0036] (2b) Macro-micro reaction force balancing mechanism: An inertial balancing mass block is installed on the macro platform. Its motion is driven by an independent linear motor in the opposite direction to the motion direction of the micro platform. The mass ratio satisfies M_balance·v_balance = M_micro·v_micro, thereby canceling out the reaction force. Alternatively, a symmetrical dual-drive structure can be adopted, such as arranging the same linear motor and grating ruler on both sides of the gantry, using symmetry to eliminate lateral coupling force and angular error.

[0037] (2c) Geometric error symmetric compensation structure: The grating ruler reading head is symmetrically arranged on both sides of the gantry so that the translation error caused by thermal deformation and force deformation has the same sign in the readings on both sides, while the corner error has the opposite sign. The influence of corner error on positioning can be separated and eliminated through differential calculation.

[0038] Step S3: Establish a parameterized coupling compensation model.

[0039] The multibody dynamics equations of the system are established as: M(θ)·q̈ + C(θ)·q̇ + K(θ)·q = F + F_coupling, where q is the generalized coordinate vector. The coupling effect is separated, yielding the coupling stiffness matrix K_c(θ), the coupling damping matrix C_c(θ), and the coupling mass matrix M_c(θ). The off-diagonal elements of these matrices represent the coupling strength between different degrees of freedom. The objective function for the coupling compensation effect is defined as J_structure = ‖K_c(θ)‖_F + ‖C_c(θ)‖_F + ‖M_c(θ)‖_F, where ‖·‖_F is the Frobenius norm. The goal is to minimize J_structure by adjusting the structural parameter vector θ (including k_c, M_balance, reed dimensions, etc.).

[0040] Step S4: Co-optimization of structural parameters and control compensation parameters.

[0041] Construct the co-optimization objective function: J_total = w1·J_structure(θ) + w2·J_control(K_p, K_i, K_d, θ) + w3·J_coupling(θ, K_p, K_i, K_d). Where: J_control evaluates control performance, such as integral absolute error (IAE) or overshoot, and the control parameters themselves are related to the structural parameters (because the controlled object model depends on θ).

[0042] J_coupling evaluates the residual coupling under control compensation, which is obtained by integrating the off-diagonal element magnitudes of the frequency response function matrix of the simulated closed-loop system.

[0043] The weighting coefficients can be set to w1=0.4, w2=0.3, and w3=0.3, and can be adjusted according to actual needs.

[0044] The Particle Swarm Optimization (PSO) algorithm is employed: the particle dimension is the sum of structural parameters and control parameters (e.g., θ contains 6 parameters, and the control parameters include the PID gain for each axis, resulting in a total dimension of approximately 20). The number of particles is set to 50, and the number of iterations is 200. The fitness function is J_total. After the algorithm iterates, a Pareto front is obtained, from which a set of compromise solutions is selected, for example, a solution with a smaller J_structure and an acceptable J_control. The corresponding structural parameters θ* are the optimal combination of structural parameters, and the control parameters C* are the optimal control compensation parameters.

[0045] Step S5: Manufacturing and Configuration.

[0046] A precision motion platform is manufactured based on the optimal structural parameters θ*, and the corresponding optimal control compensation parameters C* are configured in the controller. This achieves the synergistic effect of structural-level coupling compensation (flexible decoupling mechanisms, balancing mass blocks, etc.) and control-level coupling compensation (PID feedforward, decoupling control algorithms).

[0047] Step S6: Verification and closed-loop iteration.

[0048] After the platform is manufactured, a laser interferometer is used to measure the platform's positioning error and trajectory tracking error. The measured error is compared with the error predicted by the parameterized coupling compensation model in step S3. If the deviation between the two exceeds a preset threshold (e.g., 20%), it indicates that the model has unconsidered nonlinear factors or parameter identification errors. In this case, the process returns to step S3 to correct the model (e.g., by adding additional coupling terms or re-identifying parameters), and then steps S4 and S5 are re-executed to form a closed-loop iterative optimization until the measured error matches the model prediction error well.

[0049] Reference Figure 2 The principle of the macro-micro reaction force balancing mechanism: An inertial balancing mass block is placed above the macro platform. When the micro platform accelerates to the right, the balancing mass block accelerates to the left. The momentum of the two is equal in magnitude and opposite in direction, so the net force on the macro platform is zero. The figure shows the displacement of the micro platform x_micro, the displacement of the balancing mass block x_balance, and the displacement of the macro platform x_macro (ideally zero).

[0050] Reference Figure 3 The flexibility matrix characterization of a flexible decoupling mechanism: A three-degree-of-freedom parallel flexible mechanism has a flexibility matrix C that is a 3×3 symmetric matrix. Diagonal elements C11, C22, and C33 represent the flexibility in the X, Y, and θ directions, respectively, while off-diagonal elements C12, C13, etc., represent the coupling flexibility. By optimizing the reed geometry parameters, the ratio of off-diagonal elements to diagonal elements is made less than 0.01, thus achieving decoupling.

[0051] Reference Figure 4 The collaborative optimization iterative convergence curve is shown: the horizontal axis represents the number of iterations, and the vertical axis represents the J_total value. The curve shows that the initial J_total = 2.5 converges to about 0.45 after about 80 iterations, indicating that the optimization is effective.

[0052] In this embodiment, taking the XYθ motion platform of a wafer mounter as an example, after applying the method of the present invention, the positioning accuracy of the platform is improved from ±1.5μm to ±0.12μm, the trajectory tracking error is reduced by about 70%, and the vibration amplitude caused by macro-micro coupling is reduced by 85%, achieving significant results.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation, characterized in that, Includes the following steps: Step S1: Perform multi-source coupling analysis on the precision motion platform of semiconductor equipment to identify force coupling between macro and micro platforms, positional-force coupling between multiple degrees of freedom, and elastic coupling in flexible mechanisms, and determine the main control structure parameters of various couplings; Step S2: Based on the main control structure parameters, a coupling compensation structure is integrated into the structure of the precision motion platform. The coupling compensation structure includes a flexible decoupling mechanism, a macro-micro reaction force balancing mechanism, and a geometric error symmetry compensation structure. Step S3: Establish a parameterized coupling compensation model with the main control structure parameters as variables and the coupling compensation effect as the objective function; Step S4: Construct a collaborative optimization objective function for structural parameters and control compensation parameters, and use a multi-objective optimization algorithm to collaboratively optimize the structural parameters and control compensation parameters to obtain the optimal combination of structural parameters and the corresponding optimal control compensation parameters; Step S5: Based on the optimal combination of structural parameters obtained in step S4, manufacture a precision motion platform and configure the corresponding optimal control compensation parameters to achieve the synergistic effect of structural-level coupling compensation and control-level coupling compensation.

2. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The force coupling between the macro and micro platforms in step S1 includes: vibration coupling generated by the reaction force of the micro platform on the macro platform during movement, position coupling transmitted from the positioning error of the macro platform to the micro platform, and parasitic coupling disturbance force between the macro and micro platforms; the main control structural parameters include the connection stiffness, mass ratio and damping coefficient between the macro and micro platforms.

3. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The flexible decoupling mechanism mentioned in step S2 includes a parallel flexible decoupling mechanism based on a reed beam or a circular arc beam. The flexible decoupling mechanism is set between the drive chain and the moving platform of the multi-degree-of-freedom parallel platform to realize the motion decoupling between rotational motion and translational degrees of freedom. Its decoupling capability is characterized and optimized by the flexibility matrix method.

4. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The macro-micro reaction force balancing mechanism in step S2 includes an inertial balancing mass block or a symmetrically arranged dual-drive structure set on the macro platform. The motion direction of the inertial balancing mass block is opposite to the motion direction of the micro platform, which is used to counteract the influence of the reaction force generated by the micro platform motion on the macro platform. The symmetrically arranged dual-drive structure adopts a common stator symmetrical drive configuration, which utilizes structural symmetry to eliminate position coupling and force coupling components.

5. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The parameterized coupling compensation model mentioned in step S3 includes: coupling stiffness matrix K_c(θ), coupling damping matrix C_c(θ), and coupling mass matrix M_c(θ), where θ is the main control structure parameter vector; the objective function of the coupling compensation effect is to minimize the norm of each coupling matrix, i.e., J_structure = min(‖K_c(θ)‖ + ‖C_c(θ)‖ + ‖M_c(θ)‖).

6. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The collaborative optimization objective function mentioned in step S4 is: J_total = w1·J_structure(θ) + w2·J_control(K_p, K_i, K_d, θ) + w3·J_coupling(θ, K_p, K_i, K_d), where J_structure(θ) is the structural coupling evaluation function, J_control is the control performance evaluation function, J_coupling is the residual coupling evaluation function under the interaction of structural parameters and control parameters, and w1, w2, and w3 are weight coefficients.

7. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The multi-objective optimization algorithm described in step S4 uses particle swarm optimization or genetic algorithm, with structural parameter vector θ and control parameter vector C as decision variables, and minimizing the collaborative optimization objective function J_total as the optimization objective. The Pareto optimal solution set is obtained through iterative optimization, and the optimal combination of structural parameters and the corresponding optimal control compensation parameters that satisfy the engineering constraints are selected from it.

8. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, It also includes step S6: verifying the coupling compensation effect of the precision motion platform manufactured in step S5. The positioning error and trajectory tracking error of the platform are measured by a laser interferometer. The measured error is compared with the prediction error of the parameterized coupling compensation model. If the deviation exceeds the preset threshold, the process returns to step S3 to correct the coupling compensation model and form a closed-loop iterative optimization.

9. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The geometric error symmetric compensation structure in step S2 includes a symmetrically arranged geometric error compensation path based on a gantry structure. The symmetrically arranged geometric error compensation path cancels out the coupled components of translation error and rotation error through structural symmetry.

10. The method for designing and optimizing the structure of a precision motion platform for semiconductor devices with coupling compensation according to claim 1, characterized in that, The precision motion platform of the semiconductor equipment can be any one of the following: a lithography machine workpiece stage, a wafer mounter motion platform, a wire bonding machine motion platform, or a wafer inspection stage.

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