A computing device and an air volume distribution method

Abstract

This application relates to the field of server heat dissipation technology, and more particularly to a computing device and an airflow distribution method. The computing device includes: a flexible airflow guide located between a first fan module and a first heat source. The flexible airflow guide is movable relative to the chassis, so that a non-perforated area is located between the first fan module and the first heat source. The non-perforated area separates the spaces where the first heat source and the second heat source are located, and guides the airflow from the first fan module to the space where the first heat source is located. The flexible airflow guide is also movable relative to the chassis, so that an perforated area is located between the first fan module and the first heat source. The perforated area connects the spaces where the first heat source and the second heat source are located, and guides the airflow from the first fan module to the space where the first heat source and the second heat source are located. The computing device and airflow distribution method provided in this application can divert and guide the airflow from the fan module in the computing device, so that the fan module can flexibly adjust the temperature of the heat source in the computing device.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a computing device and a method for distributing airflow. Background Technology

[0002] With the diversification of server functions, servers often need to be equipped with many functional modules, such as central processing unit modules, graphics card modules, network card modules, and power supply modules.

[0003] During the operation of a server, the heat generated by different functional modules within the server varies, and the heat generated by the same functional module may also vary under different operating conditions. Therefore, cooling fans need to provide different airflow rates for heat dissipation.

[0004] However, currently, the airflow for cooling in various functional modules of the server may be excessive or insufficient, resulting in low cooling efficiency. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a computing device and an airflow distribution method that can divert and guide the airflow from the fan module in the computing device, enabling the fan module to flexibly adjust the temperature of the heat source in the computing device.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide a computing device, including: a chassis and a first heat source, a second heat source, a first fan module, and a first airflow guiding component disposed in the chassis; along a first direction, the first heat source and the second heat source are located on the air outlet side of the first fan module, and the first direction is the air outlet direction of the first fan module; along a second direction, the second heat source and the first heat source are arranged sequentially at intervals, and the second direction is different from the first direction; the first airflow guiding component includes: a flexible airflow guiding member located between the first fan module and the first heat source, the flexible airflow guiding member including an open area and a non-open area; the flexible airflow guiding member can move relative to the chassis, so that the non-open area is located between the first fan module and the first heat source, the non-open area separates the space where the first heat source and the second heat source are located, and guides the airflow of the first fan module to the space where the first heat source is located; the flexible airflow guiding member can also move relative to the chassis, so that the open area is located between the first fan module and the first heat source, the open area connects the space where the first heat source and the second heat source are located, and guides the airflow of the first fan module to the space where the first heat source and the second heat source are located.

[0007] Based on this solution, a movable flexible airflow guide is installed between the first fan module and the first heat source, and this flexible airflow guide has an open area and a non-open area. This allows the computing device to flexibly adjust the position of the flexible airflow guide within the chassis according to actual heat dissipation needs. When simultaneous heat dissipation is required for both the first and second heat sources, the flexible airflow guide can be moved relative to the chassis, positioning the open area between the first fan module and the first heat source. In this case, airflow can flow through the open area to both the first and second heat sources simultaneously, achieving simultaneous heat dissipation for both. Conversely, when only the first heat source needs focused cooling, or when the second heat source does not require a large airflow, the flexible airflow guide can be moved relative to the chassis, separating the spaces of the first and second heat sources by the non-open area. This directs all airflow generated by the first fan module to the space containing the first heat source, avoiding wasted airflow and effectively improving the heat dissipation efficiency for specific heat sources. This design breaks the limitation of fixed airflow allocation for cooling fans in traditional servers, enabling the airflow of a single fan module to be dynamically adjusted and precisely allocated according to the real-time cooling needs of different heat sources, thereby improving the cooling efficiency and energy utilization efficiency of the entire computing device.

[0008] In one possible implementation, the flow guiding component further includes: a power mechanism; the power mechanism is connected to both ends of the flexible flow guiding component along the extension direction; the power mechanism is used to drive the flexible flow guiding component to move so that the non-perforated area is located between the first fan module and the first heat source; the power mechanism is also used to drive the flexible flow guiding component to move so that the perforated area is located between the first fan module and the first heat source.

[0009] Based on this solution, the power mechanism can drive the flexible guide to move relative to the chassis, so that the open or non-open area of ​​the flexible guide is located between the first fan module and the first heat source.

[0010] In another possible implementation, the power mechanism includes a first rotating shaft, a first driving member, a second rotating shaft, and a second driving member. The first and second rotating shafts are respectively connected to the two ends of the flexible guide member along its extension direction. The first driving member is connected to the first rotating shaft and is used to drive the first rotating shaft to rotate, thereby causing the flexible guide member to rotate around the first rotating shaft. The second driving member is connected to the second rotating shaft and is used to drive the second rotating shaft to rotate, thereby causing the flexible guide member to rotate around the second rotating shaft. Based on this solution, the flexible guide member is moved towards the first rotating shaft by the first driving member and the first rotating shaft, and towards the second rotating shaft by the second driving member and the second rotating shaft, thereby realizing the movement of the flexible guide member within the chassis, and thus precisely adjusting the position of the perforated area and the non-perforated area.

[0011] In another possible implementation, the first airflow guiding component further includes: a first support member located between the first fan module and the first heat source, and connected to two side walls of the chassis along a third direction; the first support member located between the first and second rotating shafts, and supporting the flexible airflow guiding component, causing the extension direction of the flexible airflow guiding component to bend; the portion of the flexible airflow guiding component located between the first rotating shaft and the first support member forms a first side; the portion of the flexible airflow guiding component located between the second rotating shaft and the first support member forms a second side; the flexible airflow guiding component extends along a first direction on the first side; the flexible airflow guiding component is inclined relative to the first fan module on the second side, and the flexible airflow guiding component separates or connects the space where the first heat source and the second heat source are located on the second side.

[0012] Based on this solution, the first support not only provides stable support and guidance for the flexible guide, preventing it from wrinkling or shifting during movement, but also changes the extension path of the flexible guide, making the airflow guidance more precise and efficient. It is especially suitable for the internal space of computing devices with complex heat source layouts or specific requirements for airflow direction.

[0013] In another possible implementation, the flexible guide includes two non-perforated regions; along the extension direction of the flexible guide, the two non-perforated regions are located on both sides of the perforated region.

[0014] Based on this solution, when the flexible guide moves under the drive of the first and second drive components, more diverse airflow distribution modes can be achieved by controlling the relative positions of the two non-perforated areas with the first heat source and the first fan module, respectively.

[0015] In another possible implementation, the first rotating shaft is used to move synchronously with the second rotating shaft, so that the open area of ​​the flexible guide is on the first side and the non-open area is on the second side, so as to separate the space where the first heat source and the second heat source are located; the first rotating shaft is also used to move synchronously with the second rotating shaft, so that the non-open area of ​​the flexible guide is on the first side and the open area is on the second side, so as to connect the space where the first heat source and the second heat source are located.

[0016] Based on this scheme, the non-perforated area on the first side can once again guide the airflow that passes through the perforated area to the space where the second heat source is located, so as to prevent the airflow from being dispersed after passing through the perforated area, and thus concentrate it to the location of the second heat source.

[0017] In another possible implementation, the first flow guiding assembly further includes: a second support member connected to two side walls of the chassis along a third direction and located between the first support member and the second rotating shaft; a flexible flow guiding member wrapped around the second support member; the second support member causes the flexible flow guiding member to bend again on the second side, and the flexible flow guiding member between the second support member and the second rotating shaft extends along the first direction.

[0018] Based on this solution, the setting of the second support further optimizes the extension path of the flexible guide on the second side.

[0019] In another possible implementation, when the opening area is on the second side, the first dimension of the opening area is smaller than the second dimension of the second side along the tilt direction of the second side.

[0020] Based on this solution, the second side can be prevented from being completely covered by the opening area, thereby preventing excessive airflow from the first fan module from flowing to the second heat source through the opening area.

[0021] In another possible implementation, the computing device further includes a third heat source, a second fan module, and a second airflow guide assembly; along a first direction, the second fan module is located between the first heat source and the second heat source; along the first direction, the third heat source and the second heat source are located on the same side of the second fan module; along a second direction, the second heat source and the third heat source are arranged in a specific configuration; the second airflow guide assembly is located between the second fan module and the second heat source to separate or connect the spaces where the second heat source and the third heat source are located.

[0022] Based on this solution, through the collaborative operation of multiple airflow components, efficient and precise heat dissipation management of complex heat source layouts inside computing devices can be achieved with limited fan module configuration.

[0023] In another possible implementation, the space where the third heat source is located is connected to that of the first heat source.

[0024] Based on this solution, some of the airflow generated by the first fan module can continue to flow to the third heat source after passing through the first heat source, and dissipate heat from it.

[0025] In another possible implementation, a substrate management controller is also included; the substrate management controller is communicatively connected to the power mechanism; the substrate management controller is used to control the movement of the power mechanism to drive the flexible guide to move, so that the open area or the non-open area is located between the first fan module and the first heat source.

[0026] Based on this solution, the power mechanism and flexible flow guide can be controlled through the substrate management controller, thereby enabling the connection or separation of the space where the first heat source and the second heat source are located as needed.

[0027] Secondly, embodiments of this application also provide an airflow distribution method, applied to the computing device provided in the first aspect above. The method includes: obtaining a first operating temperature of a first heat source and a second operating temperature of a second heat source; when the first operating temperature is less than a first set temperature, controlling a flexible airflow guide to move relative to the chassis, so that the open area of ​​the flexible airflow guide connects the spaces where the first heat source and the second heat source are located; when the first operating temperature is greater than or equal to the first set temperature, controlling the flexible airflow guide to move relative to the chassis, so that the non-open area of ​​the flexible airflow guide separates the spaces where the first heat source and the second heat source are located.

[0028] In one possible implementation, when the first operating temperature is lower than the first set temperature, the flexible guide component is controlled to move relative to the chassis so that the opening area of ​​the flexible guide component connects the spaces where the first heat source and the second heat source are located. This includes: when the first operating temperature is lower than the first set temperature, calculating a first difference between the first set temperature and the first operating temperature, and a second difference between the second set temperature and the second operating temperature; determining a first moving distance of the flexible guide component based on the first difference, and determining a second moving distance of the flexible guide component based on the second difference; selecting the smaller of the first moving distance and the second moving distance as the first target moving distance of the flexible guide component; and controlling the movement of the flexible guide component based on the first target moving distance.

[0029] In one possible implementation, after controlling the flexible air guide to move relative to the chassis when the first operating temperature is greater than or equal to the first set temperature, so that the non-perforated area of ​​the flexible air guide separates the space where the first heat source and the second heat source are located, the method further includes: increasing the speed of the first fan module when the first operating temperature is greater than or equal to the first set temperature.

[0030] In one possible implementation, when the computing device includes a third heat source and a second fan module, and there are two airflow guiding components, the method further includes: obtaining a third operating temperature of the third heat source; when the second operating temperature is lower than a second set temperature, controlling the flexible airflow guiding component between the second fan module and the second heat source to move relative to the chassis, so that the open area of ​​the flexible airflow guiding component connects the space where the second heat source and the third heat source are located; when the second operating temperature is greater than or equal to the second set temperature, controlling the flexible airflow guiding component between the second fan module and the second heat source to move relative to the chassis, so that the non-open area of ​​the flexible airflow guiding component separates the space where the second heat source and the third heat source are located.

[0031] In one possible implementation, when the second operating temperature is lower than the second set temperature, the flexible guide between the second fan module and the second heat source is controlled to move relative to the chassis, so that the opening area of ​​the flexible guide connects the space where the second heat source and the third heat source are located. This includes: when the second operating temperature is lower than the second set temperature, calculating a second difference between the second set temperature and the second operating temperature, and a third difference between the third set temperature and the third operating temperature; determining a third moving distance of the flexible guide between the second fan module and the second heat source based on the second difference, and determining a fourth moving distance of the flexible guide between the second fan module and the second heat source based on the third difference; selecting the smaller of the third moving distance and the fourth moving distance as the second target moving distance of the flexible guide between the second fan module and the second heat source; and controlling the movement of the flexible guide between the second fan module and the second heat source based on the second target moving distance.

[0032] In one possible implementation, when the second operating temperature is greater than or equal to the second set temperature, after controlling the flexible guide between the second fan module and the second heat source to move relative to the chassis so that the non-perforated area of ​​the flexible guide separates the space where the second heat source and the third heat source are located, the method further includes: increasing the rotational speed of the second fan module when the second operating temperature is greater than or equal to the second set temperature.

[0033] Thirdly, embodiments of this application also provide a server, including: a substrate management controller and a memory; the substrate management controller and the memory are coupled; the memory is used to store program instructions; the substrate management controller is used to execute the program instructions to perform the method as described in any of the second aspects above.

[0034] Fourthly, embodiments of this application provide a substrate management controller for performing the method as described in any of the second aspects above.

[0035] Fifthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a computer, implement the method as described in any of the second aspects.

[0036] In a sixth aspect, embodiments of this application provide a program product including a computer program that, when executed by a baseboard management controller, implements the method as described in any of the second aspects. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of a computing device provided in some embodiments of this application; Figure 2 This is a schematic diagram of the internal structure of a computing device provided in some embodiments of this application; Figure 3A schematic diagram illustrating the airflow distribution process of a flexible air guide provided in some embodiments of this application; Figure 4 Another schematic diagram illustrating the airflow distribution process of the flexible guide provided in some embodiments of this application; Figure 5 A simplified schematic diagram of the flexible flow guide provided in some embodiments of this application in its deployed state; Figure 6 The side view of the computing device provided in some embodiments of this application omits a portion of the chassis structure; Figure 7 for Figure 6 Enlarged view of part A in the image; Figure 8 for Figure 6 Enlarged view of part B in the image; Figure 9 A schematic flowchart illustrating an airflow distribution method provided in some embodiments of this application; Figure 10 Another schematic flowchart illustrating an airflow distribution method provided in some embodiments of this application; Figure 11 This is an architecture diagram of a computing device provided for some embodiments of this application.

[0038] Figure label: 100 - Computing device; 110 - Chassis; 120 - First heat source; 130 - Second heat source; 140 - First fan module; 150-1 - First airflow guide assembly; 150-2 - Second airflow guide assembly; 151 - Flexible airflow guide; 1511 - Opening area; 1512 - Non-opening area; 151a - First side; 151b - Second side; 152 - Power mechanism; 1521 - First rotating shaft; 1522 - Second rotating shaft; 154 - First support member; 155 - Second support member; 160 - Third heat source; 170 - Second fan module. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0040] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0041] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0042] In the description of this application, it should be understood that the terms "inner" and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In addition, the accompanying drawings are only used to briefly illustrate the technical solutions provided by the embodiments of this application. For example, some pipes are not shown with wall thickness, but should be understood as having walls, and do not need to be understood according to the lines shown in the accompanying drawings.

[0043] In this application, unless otherwise expressly specified and limited, the term "connection" and similar terms should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities at the point of connection are not connected through a transitional structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0044] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0045] It should be noted that the illustrated structure is used to show the positional relationship of each structural feature and does not constitute a limitation on the structure and size of the computing device provided in the embodiments of this application.

[0046] Figure 1 This is a schematic diagram of the overall structure of a computing device provided in some embodiments of this application; Figure 2This is a schematic diagram of the internal structure of a computing device provided in some embodiments of this application.

[0047] Please see Figure 1 and Figure 2 This application provides a computing device 100, including a chassis 110, a first heat source 120, a second heat source 130, a first fan module 140, and a first airflow guiding component 150-1. The first heat source 120, the second heat source 130, the first fan module 140, and the first airflow guiding component 150-1 are disposed within the chassis 110 for fixation.

[0048] For example, the computing device 100 may be a server, and the embodiments of this application do not specifically limit the type of computing device 100.

[0049] In some examples, the server can be a node server, a rack server, a blade server, etc., but this application does not impose specific restrictions on the type of server.

[0050] For example, the chassis 110 of the computing device 100 may be equipped with a variety of electronic devices to realize the data processing, transmission, storage or resource coordination functions of the computing device 100.

[0051] In some examples, the electronic components in computing device 100 may be central processing unit (CPU), graphics processing unit (GPU), data processing unit (DPU), storage components, input / output (I / O) components, power supply, and other devices.

[0052] For example, the first heat source 120 in the computing device 100 may be an electronic device capable of generating heat within the computing device 100, such as a CPU, GPU, DPU, voltage regulator down (VRD), memory module, etc.

[0053] For example, the second heat source 130 in the computing device 100 can be an electronic device capable of generating heat within the computing device 100, such as a CPU, GPU, DPU, voltage regulator down (VRD), memory module, etc.

[0054] It should be noted that the first heat source 120 and the second heat source 130 can be the same type of electronic device or different types of electronic devices, and this embodiment does not limit them.

[0055] For example, the first fan module 140 can be located on one side of the chassis 110 or in the middle of the chassis 110, and is not limited in this embodiment.

[0056] In some examples, the first fan module 140 may include multiple fans to ensure sufficient airflow for heat dissipation to meet the heat dissipation needs of the electronic components within the computing device 100.

[0057] Along the first direction (e.g.) Figure 2 (in the x-axis direction), the first heat source 120 and the second heat source 130 are located on the air outlet side of the first fan module 140. In this way, the air from the first fan module 140 can blow to the positions of the first heat source 120 and the second heat source 130, so as to dissipate heat from the first heat source 120 and the second heat source 130 at the same time.

[0058] The first direction is the air outlet direction of the first fan module 140.

[0059] For example, the first direction can be the length direction of the chassis 110.

[0060] Alternatively, in other examples, the first direction can also be the width or height direction of the chassis 110. In this embodiment, only the length direction of the chassis 110 is used as an example for illustration.

[0061] Along the second direction (e.g.) Figure 2 (in the z-axis direction), the second heat source 130 and the first heat source 120 are arranged alternately, and the second direction is different from the first direction.

[0062] For example, when the first direction is the length direction of the chassis 110, the second direction can be the height direction of the chassis 110, the width direction of the chassis 110, or other directions that are inclined relative to the first direction. In this embodiment, only the height direction of the chassis 110 is used as an example for illustration.

[0063] For example, the first airflow guiding component 150-1 includes a flexible airflow guiding element 151. The flexible airflow guiding element 151 is located between the first fan module 140 and the first heat source 120, and the flexible airflow guiding element 151 includes an open area 1511 and a non-open area 1512.

[0064] For example, the flexible airflow guide 151 can be made of a material with a certain degree of flexibility, high temperature resistance, and smooth surface, such as polyimide film or silicone sheet. These materials can not only move flexibly in the complex space inside the chassis 110 without easily getting stuck or damaged, but also effectively reduce airflow resistance and improve airflow utilization efficiency.

[0065] Furthermore, excessive thickness of the flexible guide component 151 may affect its flexibility and mobility, while excessive thinness may lead to damage or deformation during long-term use, thus affecting the guiding effect. Therefore, during the design process, it is necessary to comprehensively consider the material properties and actual application scenarios to select appropriate materials and thickness parameters for the flexible guide component 151.

[0066] In some examples, the flexible guide 151 can be a structure that can deform and guide airflow, such as a belt or a film, but this embodiment is not limited to that.

[0067] For example, the opening region 1511 of the flexible guide 151 can be formed by providing an opening structure on the structure of the flexible guide 151. In the opening region 1511, airflow can pass through the flexible guide 151, while in the non-opening region 1512, airflow cannot pass through the flexible guide 151.

[0068] It should be noted that the area ratio of the perforated area 1511 and the non-perforated area 1512 on the flexible guide 151 can be adjusted according to the actual situation, and is not limited in this embodiment.

[0069] Figure 3 A schematic diagram illustrating the airflow distribution process of the flexible air guide provided in some embodiments of this application, wherein, Figure 3 The diagram only shows the structure of the first heat source, the second heat source, the first fan module, and the airflow guiding assembly.

[0070] Combination Figure 3 As shown, in some examples, the flexible airflow guide 151 can move relative to the chassis 110, so that the non-perforated area 1512 is located between the first fan module 140 and the first heat source 120. For example, the flexible airflow guide 151 can be composed of... Figure 3 The position of (a) in the text is transformed to, for example, Figure 3 The location is shown in (b) in the diagram. In this way, the non-perforated area 1512 of the flexible airflow guide 151 can separate the spaces where the first heat source 120 and the second heat source 130 are located, thereby guiding the airflow from the first fan module 140 to the space where the first heat source 120 is located. At this time, the first fan module 140 can dissipate heat only from the first heat source 120.

[0071] Please continue reading. Figure 3 In other examples, the flexible airflow guide 151 can move relative to the chassis 110, such that the opening area 1511 is located between the first fan module 140 and the first heat source 120. For example, the flexible airflow guide 151 can be composed of... Figure 3 The position of (b) in the text is transformed to, for example, Figure 3The location is shown in (a) in the diagram. Thus, the opening area 1511 of the flexible airflow guide 151 can connect the spaces where the first heat source 120 and the second heat source 130 are located, thereby guiding the airflow from the first fan module 140 to the spaces where the first heat source 120 and the second heat source 130 are located. At this time, the first fan module 140 can simultaneously dissipate heat from the first heat source 120 and the second heat source 130.

[0072] In the computing device 100 provided in this embodiment, a movable flexible airflow guide 151 is provided between the first fan module 140 and the first heat source 120, and the flexible airflow guide 151 has an open area 1511 and a non-open area 1512. In this way, the computing device 100 can flexibly adjust the position of the flexible airflow guide 151 within the chassis 110 according to actual heat dissipation requirements. When it is necessary to simultaneously dissipate heat from the first heat source 120 and the second heat source 130, the flexible airflow guide 151 can be controlled to move relative to the chassis 110, so that the open area 1511 is located between the first fan module 140 and the first heat source 120, at which time the airflow (such as...) Figure 3 The dashed arrow (as shown in (a)) allows airflow to simultaneously flow through the opening area 1511 to the space containing the first heat source 120 and the second heat source 130, achieving simultaneous heat dissipation for both. However, when only the first heat source 120 needs to be cooled, or when the second heat source 130 does not require a large airflow, the flexible air guide 151 can be moved relative to the chassis 110, causing the non-opening area 1512 to separate the space containing the first heat source 120 and the second heat source 130, thereby controlling the flow of all air generated by the first fan module 140 (such as...) Figure 3 The dashed arrow (as shown in (b)) directs the airflow to the space where the first heat source 120 is located, avoiding wasted airflow and effectively improving the heat dissipation efficiency for a specific heat source. This design breaks the limitation of fixed airflow allocation for cooling fans in traditional servers, enabling the airflow of a single fan module to be dynamically adjusted and precisely allocated according to the real-time heat dissipation needs of different heat sources, thereby improving the heat dissipation efficiency and energy utilization efficiency of the entire computing device 100.

[0073] Please continue reading. Figure 3 In some embodiments, the first flow guiding assembly 150-1 further includes a power mechanism 152. The power mechanism 152 is connected to both ends of the flexible flow guiding member 151 along the extension direction.

[0074] For example, to facilitate the flexible airflow guide 151 in directing the airflow from the first fan module 140 to the space where the first heat source 120 is located, or to direct the airflow from the first fan module 140 to the spaces where the first heat source 120 and the second heat source 130 are located respectively, the power mechanism 152 can drive the flexible airflow guide 151 to move, so that the non-perforated area 1512 of the flexible airflow guide 151 is located between the first fan module 140 and the first heat source 120. The power mechanism 152 can also drive the flexible airflow guide 151 to move, so that the perforated area 1511 of the flexible airflow guide 151 is located between the first fan module 140 and the first heat source 120.

[0075] In some embodiments, the power mechanism 152 includes a first rotating shaft 1521 and a second rotating shaft 1522. The first rotating shaft 1521 and the second rotating shaft 1522 are respectively connected to the two ends of the flexible guide member 151 along the extension direction.

[0076] In this embodiment, when the power mechanism 152 includes a first rotating shaft 1521 and a second rotating shaft 1522, the rotating shaft structure can provide a stable driving force, ensuring the smoothness and positional accuracy of the flexible guide 151 during movement. Furthermore, by winding the flexible guide 151 around itself, the rotating shaft structure keeps the non-working portion of the flexible guide 151 in a wound state, saving space occupied by the non-working portion of the flexible guide 151. This effectively saves internal space in the chassis 110, making it particularly suitable for blade servers or high-density computing devices 100 with high space utilization requirements.

[0077] For example, the material of the rotating shaft structure can be a high-strength alloy to ensure structural stability during long-term winding and release, while the surface of the rotating shaft structure can be smoothed or coated with a wear-resistant coating to reduce frictional loss between the flexible guide 151 and the rotating shaft and extend its service life.

[0078] In some examples, the power mechanism 152 further includes a first drive member (not shown) connected to a first rotating shaft 1521, thereby driving the first rotating shaft 1521 to rotate, so as to drive the flexible guide member 151 around the first rotating shaft. In this way, the first drive member can drive the flexible guide member 151 to move toward the first rotating shaft 1521, so that the open area 1511 or the non-open area 1512 of the flexible guide member 151 moves toward the first rotating shaft 1521, so that the open area 1511 or the non-open area 1512 is located between the first fan module 140 and the first heat source 120.

[0079] In other examples, the power mechanism 152 further includes a second drive member (not shown) connected to the second rotating shaft 1522, thereby driving the second rotating shaft 1522 to rotate, so as to drive the flexible guide member 151 around the second rotating shaft. In this way, the second drive member can drive the flexible guide member 151 to move toward the second rotating shaft 1522, so that the open area 1511 or the non-open area 1512 of the flexible guide member 151 moves toward the second rotating shaft 1522, so that the open area 1511 or the non-open area 1512 is located between the first fan module 140 and the first heat source 120.

[0080] In other examples, the power mechanism 152 includes both a first drive member and a second drive member. The first drive member is connected to a first rotating shaft 1521, thereby driving the first rotating shaft 1521 to rotate, so that the flexible guide member 151 is wound around the first rotating shaft. The second drive member is connected to a second rotating shaft 1522, thereby driving the second rotating shaft 1522 to rotate, so that the flexible guide member 151 is wound around the second rotating shaft 1522. In this way, the first rotating shaft 1521 and the second rotating shaft 1522 can rotate in different directions, so that the flexible guide member 151 moves in different directions, so that the opening area 1511 or the non-opening area 1512 is located between the first fan module 140 and the first heat source 120.

[0081] For example, the first and second driving components move the flexible airflow guide 151 relative to the chassis 110 in different directions to control different positions of the flexible airflow guide 151. For instance, the first driving component can drive the flexible airflow guide 151 to move along one side of its extension direction, thereby covering the non-perforated area 1512 between the first heat source 120 and the first fan module 140. The second driving component can then drive the flexible airflow guide 151 to move along the other side of its extension direction, causing the perforated area 1511 to return to the space between the first heat source 120 and the first fan module 140. Thus, through the coordinated action of the first and second driving components, the working area of ​​the flexible airflow guide 151 can be quickly and accurately switched to adapt to different heat dissipation scenarios.

[0082] For example, the first driving member can drive the first rotating shaft 1521 to rotate clockwise and wind up one end of the flexible guide member 151, and drive the second rotating shaft 1522 to rotate counterclockwise through the flexible guide member 151 to release the other end of the flexible guide member 151. The flexible guide member 151 as a whole will move to one side of the first rotating shaft 1521, so that the non-perforated area 1512 gradually covers the channel between the first heat source 120 and the first fan module 140.

[0083] For example, the second drive member can drive the second rotating shaft 1522 to wind up the flexible guide member 151 and drive the first rotating shaft 1521 to release the flexible guide member 151. The flexible guide member 151 can move to one side of the second rotating shaft 1522 so that the opening area 1511 returns to the working position.

[0084] For example, the first driving component and the second driving component can be a power component such as a motor or electric motor that can drive the shaft to rotate, and are not limited in this embodiment.

[0085] In other examples, the power mechanism 152, in addition to the rotating shaft structure, can also be a cylinder drive mechanism, a lead screw slide mechanism, or an electromagnetic drive mechanism, etc.

[0086] For example, the cylinder drive mechanism can push the piston rod to extend and retract through changes in air pressure, thereby driving the flexible guide 151 to move in a straight line; the lead screw slide mechanism drives the lead screw to rotate through a motor, so that the slider that cooperates with the lead screw drives the flexible guide 151 to achieve precise displacement; the electromagnetic drive mechanism uses the effect of electromagnetic force to make the flexible guide 151 generate directional movement in a magnetic field.

[0087] These different types of power mechanisms can be selected based on factors such as the internal space layout of the computing device 100, control precision requirements, and cost budget. For example, for scenarios with relatively compact space and high control precision requirements, a ball screw slide mechanism may be more suitable; while for scenarios requiring rapid response and with strict cost control, a cylinder drive mechanism or an electromagnetic drive mechanism may be a better choice. Regardless of the power mechanism used, the core purpose is to achieve stable and precise movement of the flexible guide 151 within the chassis 110, ensuring that the perforated area 1511 and the non-perforated area 1512 can accurately switch to the target position, thereby achieving efficient heat dissipation control of the first heat source 120 and the second heat source 130.

[0088] In some examples, the extension direction of the flexible guide 151 can be determined based on the placement of the first fan module 140, the first heat source 120, and the second heat source 130.

[0089] like Figure 3 As shown, the extension direction of the flexible guide 151 can be inclined relative to the first direction, so that when the non-perforated area 1512 of the flexible guide 151 is located between the first fan module 140 and the first heat source 120, it can separate the space where the first heat source 120 and the second heat source 130 are located. Moreover, when the perforated area 1511 of the flexible guide 151 is located between the first fan module 140 and the first heat source 120, it can connect the space where the first heat source 120 and the second heat source 130 are located.

[0090] Furthermore, when the extension direction of the flexible guide 151 is as follows: Figure 3When the airflow direction of the first fan module 140 is tilted relative to the airflow direction of the first fan module 140, it is easier to direct the airflow of the first fan module 140 to the location of the first heat source 120, so that the first heat source 120 can be cooled efficiently when it is in a high temperature state.

[0091] In other examples, the extension direction of the flexible air guide 151 may also be parallel to the air cooling direction of the first fan module 140, so as to divide the internal space of the chassis 110 into two parts perpendicular to the air cooling direction, thereby facilitating the control of the connection or separation state of the space where the first heat source 120 and the second heat source 130 are located.

[0092] Figure 4 Another schematic diagram illustrating the airflow distribution process of the flexible air guide provided in some embodiments of this application, wherein, Figure 4 The diagram only shows the structure of the first heat source, the second heat source, the first fan module, and the airflow guiding assembly.

[0093] Combination Figure 4 As shown, in some embodiments, the first airflow guiding assembly 150-1 may further include a first support member 154. The first support member 154 is located between the first fan module 140 and the first heat source 120, and is connected to two side walls of the chassis 110 along a third direction. The flexible airflow guiding member 151 is wound around the first support member 154.

[0094] For example, the first support member 154 is located between the first rotating shaft 1521 and the second rotating shaft 1522, and supports the flexible guide member 151, causing the extension direction of the flexible guide member 151 to be bent.

[0095] For example, the first support member 154 can make the flexible guide member 151 V-shaped.

[0096] For example, the portion of the flexible guide 151 located between the first rotating shaft 1521 and the first support 154 forms a first side 151a; the portion of the flexible guide 151 located between the second rotating shaft 1522 and the first support 154 forms a second side 151b.

[0097] The flexible airflow guide 151 is inclined relative to the first fan module 140 on the second side 151b. The flexible airflow guide 151 separates or connects the space where the first heat source 120 and the second heat source 130 are located on the second side 151b.

[0098] like Figure 4As shown in (b), when the first rotating shaft 1521 retracts the flexible guide 151 and the second rotating shaft 1522 releases the flexible guide 151, the flexible guide 151, under the guidance of the first support member 154, causes the non-perforated area 1512 to move to the second side 151b to cover the main airflow channel between the first heat source 120 and the first fan module 140, thereby guiding the airflow of the first fan module 140 to the first heat source 120.

[0099] like Figure 4 As shown in (a), when the second rotating shaft 1522 is wound up and the first rotating shaft 1521 is released, the flexible guide 151, under the guidance of the first support 154, will have its opening area 1511 move to the second side 151b, and the airflow of the first fan module 140 can flow through the opening area 1511 to both the first heat source 120 and the second heat source 130.

[0100] In this embodiment, the first support member 154 not only provides stable support and guidance for the flexible guide member 151, preventing it from wrinkling or shifting during movement, but also changes the extension path of the flexible guide member 151, making the guiding effect on the airflow more precise and efficient. It is especially suitable for the internal space of the computing device 100 where the heat source layout is relatively complex or the airflow direction has specific requirements.

[0101] For example, the flexible guide 151 may be tilted toward the second heat source 130 on the first side 151a relative to the first direction.

[0102] Alternatively, the flexible guide 151 may be extended along a first direction on the first side 151a.

[0103] For example, the first support 154 may be a support shaft to guide the flexible guide 151.

[0104] Figure 5 A simplified schematic diagram of the flexible guide provided in some embodiments of this application in its deployed state.

[0105] Combination Figure 4 and Figure 5 As shown, in some embodiments, the flexible airflow guide 151 includes two non-perforated areas 1512. Along the extension direction of the flexible airflow guide 151, the two non-perforated areas 1512 are located on either side of the perforated area 1511. Thus, when the flexible airflow guide 151 moves under the drive of the first rotating shaft 1521 and the second rotating shaft 1522, more diverse airflow distribution modes can be achieved by controlling the relative positions of the two non-perforated areas 1512 with respect to the first heat source 120 and the first fan module 140, respectively.

[0106] For example, when it is necessary to direct all the airflow of the first fan module 140 to the first heat source 120, one of the non-perforated areas 1512 can be controlled to move between the first heat source 120 and the first fan module 140 to completely block the airflow channel to the second heat source 130.

[0107] When it is necessary to direct some airflow to the first heat source 120 while retaining a small amount of airflow to the second heat source 130, the position of the flexible guide 151 can be adjusted so that the non-perforated area 1512 partially covers the channel between the first heat source 120 and the first fan module 140, while a small amount of airflow can still be allowed to pass through a portion of the perforated area 1511, thereby achieving fine adjustment of airflow.

[0108] In addition, the design of the two non-perforated areas 1512 can also limit the movement of the flexible guide 151 to its extreme position, preventing the flexible guide 151 from colliding or getting tangled with other components inside the chassis 110 due to excessive movement, thereby further improving the safety and reliability of the equipment operation.

[0109] Combination Figure 4 , Figure 5 As shown, in some embodiments, such as Figure 4 As shown in (b), the first rotating shaft 1521 can move synchronously with the second rotating shaft 1522, so that the open area 1511 of the flexible guide 151 is located on the first side 151a and the non-open area 1512 is located on the second side 151b, so as to separate the space where the first heat source 120 and the second heat source 130 are located.

[0110] like Figure 4 As shown in (a), the first rotating shaft 1521 can also move synchronously with the second rotating shaft 1522, so that the non-perforated area 1512 of the flexible guide 151 is located on the first side 151a and the perforated area 1511 is located on the second side 151b, so as to connect the space where the first heat source 120 and the second heat source 130 are located.

[0111] When the non-perforated area 1512 of the flexible guide 151 is on the first side 151a and the perforated area 1511 is on the second side 151b, the non-perforated area 1512 on the first side 151a can once again guide the airflow that passes through the perforated area 1511 to the space where the second heat source 130 is located, so as to prevent the airflow from being dispersed after passing through the perforated area 1511, and thus be able to concentrate the flow to the location of the second heat source 130.

[0112] Please continue reading. Figure 4In example (a), when the opening area 1511 is located on the second side 151b, the first dimension of the opening area 1511 is smaller than the second dimension of the second side 151b along the tilt direction of the second side 151b. In this way, it is possible to prevent the second side 151b from being completely covered by the opening area 1511, thereby preventing excessive airflow from the first fan module 140 to the second heat source 130 through the opening area 1511.

[0113] In some examples, the first dimension can be the length of the opening area 1511 along the inclined direction of the second side 151b, and the second dimension can be the length of the second side 151b as a whole along its inclined direction. By designing the first dimension of the opening area 1511 to be smaller than the second dimension of the second side 151b, the portion of the second side 151b other than the opening area 1511 remains a non-opening structure. This non-opening structure can play a certain role in blocking and guiding airflow, ensuring that most of the airflow generated by the first fan module 140 flows preferentially to the first heat source 120, while only allowing a suitable amount of airflow to enter the space where the second heat source 130 is located through the opening area 1511. This achieves a reasonable distribution of airflow and avoids the second heat source 130 from receiving too much airflow, thus affecting the heat dissipation effect of the first heat source 120. This design is particularly suitable for scenarios where the first heat source 120 is a core component of the computing device 100 (such as CPU, GPU, etc.) and has high heat dissipation requirements, while the second heat source 130 is a secondary component (such as hard drive, memory, etc.) and has relatively low heat dissipation requirements. It can take into account the basic heat dissipation requirements of the secondary components while ensuring the heat dissipation efficiency of the core components.

[0114] Figure 6 The side view of the computing device provided in some embodiments of this application omits a portion of the chassis structure.

[0115] Figure 7 for Figure 6 Enlarged view of part A in the image.

[0116] like Figure 6 and Figure 7 As shown, in some embodiments, the first flow guiding assembly 150-1 further includes a second support member 155. The second support member 155 is connected to two side walls of the chassis 110 along a third direction and is located between the first support member 154 and the second rotating shaft 1522. A flexible flow guiding member 151 is wound around the second support member 155, the second support member 155 causing the second side 151b of the flexible flow guiding member 151 to bend again, and the flexible flow guiding member 151 between the second support member 155 and the second rotating shaft 1522 extends along a first direction.

[0117] In this embodiment, the second support member 155 further optimizes the extension path of the flexible guide member 151 on the second side 151b. By bending it again, the flexible guide member 151 forms a more stable support structure between the second rotating shaft 1522 and the first support member 154, effectively preventing sagging or swaying caused by the excessive length of the flexible guide member 151 or the inherent flexibility of the material. This ensures the accuracy of the positions of the perforated area 1511 and the non-perforated area 1512 during movement. Simultaneously, the flexible guide member 151 extends along the first direction between the second support member 155 and the second rotating shaft 1522, making the winding or releasing action of the flexible guide member 151 by the second rotating shaft 1522 smoother, reducing unnecessary friction and improving power transmission efficiency. This multi-support design acts like a precise "track" for the flexible guide member 151, enabling it to move stably along a preset trajectory within the complex internal space of the chassis 110, thereby reliably achieving dynamic airflow distribution to different heat sources.

[0118] For example, the second support 155 can be a support shaft to guide the flexible guide 151.

[0119] Figure 8 for Figure 6 Enlarged view of part B in the image.

[0120] Combination Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments, the computing device 100 further includes a third heat source 160, a second fan module 170, and a second airflow guide assembly 150-2. Along a first direction, the second fan module 170 is located between the first heat source 120 and the second heat source 130. Along the first direction, the third heat source 160 and the second heat source 130 are located on the same side of the second fan module 170. Along a second direction, the second heat source 130 and the third heat source 160 are arranged in a specific configuration.

[0121] For example, the third heat source 160 in the computing device 100 may be an electronic device capable of generating heat within the computing device 100, such as a CPU, GPU, DPU, voltage regulator down (VRD), memory module, etc.

[0122] It should be noted that the third heat source 160 may be the same type of electronic device as the first heat source 120 and / or the second heat source 130, or it may be a different type of electronic device. This embodiment does not impose any limitations.

[0123] For example, the second fan module 170 may include a single fan or multiple fans.

[0124] When the second fan module 170 includes multiple fans, the multiple fans can be divided into one group or multiple groups, which is not limited in this embodiment.

[0125] For example, the first airflow guiding component 150-1 is located between the first fan module 140 and the first heat source 120 to separate or connect the spaces where the first heat source 120 and the second heat source 130 are located. The second airflow guiding component 150-2 is located between the second fan module 170 and the second heat source 130 to separate or connect the spaces where the second heat source 130 and the third heat source 160 are located.

[0126] In this embodiment, when there are many heat sources and fan modules in the computing device 100, the number of airflow guiding components can also be multiple, thereby enabling independent heat dissipation control of multiple heat sources and further improving the flexibility and targeting of the overall heat dissipation system.

[0127] For example, when the first heat source 120 is operating under high load, while the second heat source 130 and the third heat source 160 are operating under low load, the first airflow guiding component 150-1 located between the first fan module 140 and the first heat source 120 can switch the non-perforated area 1512 between the first fan module 140 and the first heat source 120, so that the airflow of the first fan module 140 is concentrated and directed to the first heat source 120. At the same time, the second airflow guiding component 150-2 located between the second fan module 170 and the second heat source 130 can switch the perforated area 1511 between the second fan module 170 and the second heat source 130, allowing some of the airflow of the second fan module 170 to flow to the third heat source 160 to meet its basic heat dissipation requirements.

[0128] Alternatively, when the load on the second heat source 130 increases while the loads on the first heat source 120 and the third heat source 160 are lower, the position of the opening area 1511 of the second airflow guiding component 150-2 can be adjusted to prioritize the airflow of the second fan module 170 to the second heat source 130. This multi-airflow guiding component collaborative working mode can dynamically allocate the airflow of the fan module according to the real-time temperature and load of each heat source, avoiding the problems of fixed airflow allocation, insufficient heat dissipation of some heat sources, or wasted airflow in traditional heat dissipation methods. Thus, with a limited fan module configuration, efficient and precise heat dissipation management of the complex heat source layout inside the computing device 100 can be achieved.

[0129] Combination Figure 6 , Figure 7 and Figure 8As shown, in some embodiments, the third heat source 160 is spatially connected to the first heat source 120, and the third heat source 160 can be located downstream of the first heat source 120 in the air-cooling direction of the first fan module 140. In this way, some of the airflow generated by the first fan module 140, after passing the first heat source 120, can continue to flow to the third heat source 160 for heat dissipation. This design fully utilizes the residual airflow after passing the first heat source 120, improving the heat dissipation capacity of the third heat source 160 without increasing the number of fan modules, and is particularly suitable for scenarios where the heat generated by the third heat source 160 is relatively small and the heat dissipation efficiency requirement is not high. At the same time, since the third heat source 160 is spatially connected to the first heat source 120, it also simplifies the airflow design inside the chassis 110, reduces airflow resistance caused by complex airflow channels, and helps improve the overall energy efficiency ratio of the cooling system.

[0130] For example, when the first heat source 120 is the CPU and the third heat source 160 is the DPU, the airflow after the CPU dissipates heat still has a certain cooling capacity, which can continue to cool the DPU, realize the cascade utilization of heat, thereby optimizing the temperature distribution inside the computing device 100 and ensuring that each component operates stably in a suitable temperature environment.

[0131] In some embodiments, the computing device further includes a substrate management controller (not shown). The substrate management controller is communicatively connected to the power mechanism 152 and controls the movement of the power mechanism 152 to move the flexible air guide 151, so that the open area 1511 or the non-open area 1512 is located between the first fan module 140 and the first heat source 120. In this way, the substrate management controller can control the power mechanism 152 and the flexible air guide 151, thereby enabling the connection or separation of the space where the first heat source 120 and the second heat source 130 are located as needed.

[0132] Combination Figure 6 , Figure 7 and Figure 8 As shown, in this embodiment, taking the first heat source 120 as the CPU, the second heat source 130 as the GPU, and the third heat source 160 as the DPU as an example, and the first fan module 140 including a set of fans and the second fan module 170 including three sets of fans arranged along the second direction as examples, the airflow distribution method provided in this application embodiment is introduced. The airflow distribution method provided in this application embodiment can be deployed in the baseboard management controller (BMC), and the BMC can be integrated into the CPU.

[0133] Figure 9 This is a flowchart illustrating an airflow distribution method provided in some embodiments of this application.

[0134] Combination Figure 6 and Figure 9 As shown, the airflow distribution method provided in this application embodiment includes: Step S110: Obtain the first operating temperature of the first heat source and the second operating temperature of the second heat source.

[0135] For example, BMC can acquire in real time the first operating temperature of a first heat source (such as the CPU) and the second operating temperature of a second heat source (such as the GPU) through temperature sensors integrated inside the computing device.

[0136] Step S120: When the first operating temperature is lower than the first set temperature, control the flexible guide between the first fan module and the first heat source to move relative to the chassis, so that the opening area of ​​the flexible guide connects the space where the first heat source and the second heat source are located.

[0137] For example, the first set temperature can be the safe temperature or warning temperature of the first heat source (such as the CPU). If the first operating temperature is lower than the first set temperature, it means that the first heat source (such as the CPU) is currently at a low temperature and does not require excessive airflow for cooling.

[0138] At this point, BMC controls the first shaft to release the flexible air guide and the second shaft to retract it. Guided by the first and second supports, the opening area of ​​the flexible air guide moves to the second side of the V-shape. This allows some airflow to pass through the opening area to the space where the second heat source is located, providing the necessary cooling airflow for the second heat source (such as the GPU). This airflow distribution in a connected state takes into account the cooling needs of both heat sources under low load, avoiding the waste caused by a single heat source monopolizing fan airflow and improving the utilization efficiency of the fan module.

[0139] Step S130: When the first operating temperature is greater than or equal to the first set temperature, control the flexible air guide between the first fan module and the first heat source to move relative to the chassis, so that the non-perforated area of ​​the flexible air guide separates the space where the first heat source and the second heat source are located.

[0140] For example, when the first operating temperature is greater than or equal to the first set temperature, it indicates that the first heat source (such as the CPU) may be operating under high load, and its heat generation has increased significantly, requiring priority to ensure sufficient cooling airflow. At this time, the BMC controls the first shaft to retract the flexible air guide and the second shaft to release the flexible air guide, causing the non-perforated area of ​​the flexible air guide to move to the second side of the V-shape, completely covering the main airflow channel between the first heat source and the first fan module. In this way, the airflow generated by the first fan module will be directed to the first heat source by the non-perforated area, ensuring that it can be cooled down quickly and maintained within the safe operating temperature range. This separation state can concentrate the fan airflow to the core components with high heat load, avoiding the decrease in heat dissipation efficiency caused by airflow dispersion, and effectively ensuring the stable operation of the computing device under high load conditions.

[0141] In some embodiments, step S120 includes: Step S121: When the first operating temperature is lower than the first set temperature, calculate the first difference between the first set temperature and the first operating temperature, and the second difference between the second set temperature and the second operating temperature.

[0142] For example, the first difference ΔT1 = the first set temperature T_s1 - the first operating temperature T_a1.

[0143] For example, the second difference ΔT2 = the second set temperature T_s2 - the second operating temperature T_a2.

[0144] Step S122: Determine the first moving distance of the flexible guide between the first fan module and the first heat source based on the first difference, and determine the second moving distance of the flexible guide between the first fan module and the first heat source based on the second difference.

[0145] The first moving distance and the second moving distance can be the size of the opening area on the second side, i.e., the first size in the above description, so as to determine how much of the second side should be the opening area by the first moving distance and the second moving distance.

[0146] For example, the first moving distance D1 = e1 × the first difference ΔT1, where e1 is the first heat source adjustment coefficient.

[0147] For example, the second moving distance D2 = e2 × the second difference ΔT2, where e2 is the second heat source adjustment coefficient.

[0148] Step S123: Select the smaller of the first moving distance and the second moving distance as the first target moving distance of the flexible guide between the first fan module and the first heat source.

[0149] For example, the first target moves a distance D1 = min(D1, D2).

[0150] For example, the first target moving distance D1 is less than the second dimension of the second side described above, so as to avoid the second side being completely covered by the opening area and to prevent the air from the first fan module from flowing too much to the second heat source.

[0151] Step S124: Control the movement of the flexible guide between the first fan module and the first heat source based on the first target moving distance.

[0152] In this embodiment, by calculating the first difference and the second difference, and multiplying them by the corresponding adjustment coefficients respectively, the first moving distance and the second moving distance are obtained. This allows the temperature state of the heat source to be quantified into specific moving parameters of the flexible airflow guide. Selecting the smaller of the two values ​​as the first target moving distance reflects the priority consideration of airflow distribution, thus avoiding the impact on the heat dissipation of the first heat source due to an excessively large opening area. In this way, the basic airflow required by the second heat source based on its temperature difference can be met, while ensuring that most of the airflow from the first fan module still flows to the first heat source. This achieves more refined dynamic airflow adjustment in low-load scenarios, further improving the intelligence and energy efficiency of the heat dissipation system.

[0153] Please refer to it again. Figure 9 In some embodiments, after step S130 above, the method further includes: Step S140: When the first operating temperature is greater than or equal to the first set temperature, increase the speed of the first fan module.

[0154] In this way, when the temperature of the first heat source (such as the CPU) is high and needs to be cooled down first, the airflow of the first fan module is not only concentrated and directed to the first heat source through the non-perforated area of ​​the flexible air guide, but the speed of the first fan module is also increased at the same time, which can significantly increase the airflow through the first heat source per unit time and further enhance the heat dissipation effect.

[0155] Figure 10 This is another schematic flowchart illustrating an airflow distribution method provided in some embodiments of this application.

[0156] Combination Figure 6 and Figure 10 As shown in the embodiments of this application, the air volume distribution method further includes: Step S150: Obtain the third operating temperature of the third heat source.

[0157] For example, the BMC can acquire the third operating temperature of a third heat source (such as a DPU) in real time through a temperature sensor integrated inside the computing device.

[0158] It should be noted that steps S110 and S150 can be performed simultaneously or separately, and this embodiment does not impose any restrictions.

[0159] Step S160: When the second operating temperature is lower than the second set temperature, control the flexible guide between the second fan module and the second heat source to move relative to the chassis, so that the opening area of ​​the flexible guide connects the space where the second heat source and the third heat source are located.

[0160] For example, the second set temperature can be the safe temperature or warning temperature of the second heat source (such as the GPU). If the second operating temperature is lower than the second set temperature, it indicates that the second heat source (such as the GPU) is currently at a low temperature and does not require excessive airflow for cooling.

[0161] At this point, BMC controls the first shaft to release the flexible air guide and the second shaft to retract it. Guided by the first support, the opening area of ​​the flexible air guide moves to the second side of the V-shape. This allows some airflow to pass through the opening area to the space where the third heat source is located, providing the necessary cooling airflow for the third heat source (such as the DPU). This airflow distribution in a connected state takes into account the heat dissipation needs of both heat sources under low load, avoiding the waste caused by a single heat source monopolizing fan airflow and improving the utilization efficiency of the fan module.

[0162] Step S170: When the second operating temperature is greater than or equal to the second set temperature, control the flexible guide between the second fan module and the second heat source to move relative to the chassis, so that the non-perforated area of ​​the flexible guide separates the space where the second heat source and the third heat source are located.

[0163] For example, when the second operating temperature is greater than or equal to the second set temperature, it indicates that the second heat source (such as the GPU) may be operating under high load, and its heat generation has increased significantly, requiring priority to ensure sufficient cooling airflow. At this time, the BMC controls the first hinge to retract the flexible airflow guide and the second hinge to release it, causing the non-perforated area of ​​the flexible airflow guide to move to the second side of the V-shape, completely covering the main airflow channel between the second heat source and the second fan module. In this way, the airflow generated by the second fan module will be directed to the second heat source by the non-perforated area, ensuring that it can be rapidly cooled and maintained within a safe operating temperature range. This separation configuration concentrates fan airflow to the high-heat-load core components, avoiding a decrease in cooling efficiency due to dispersed airflow, and effectively ensuring the stable operation of the computing device under high-load conditions.

[0164] In some embodiments, step S160 includes: Step S161: When the second operating temperature is lower than the second set temperature, calculate the second difference between the second set temperature and the second operating temperature, and the third difference between the third set temperature and the third operating temperature.

[0165] For example, the second difference ΔT2 = the second set temperature T_s2 - the second operating temperature T_a2.

[0166] For example, the third difference ΔT3 = the third set temperature T_s3 - the third operating temperature T_a3.

[0167] Step S162: Determine the third moving distance of the flexible guide between the second fan module and the second heat source based on the second difference; determine the fourth moving distance of the flexible guide between the second fan module and the second heat source based on the third difference.

[0168] The third and fourth moving distances can be the dimensions of the opening area on the second side, i.e., the first dimension mentioned above, to determine how much of the second side should be designated as the opening area by using the third and fourth moving distances.

[0169] For example, the third moving distance D3 = e2 × the second difference ΔT 2, where e2 is the second heat source adjustment coefficient.

[0170] For example, the fourth moving distance D4 = e3 × the third difference ΔT 3, where e3 is the third heat source adjustment coefficient.

[0171] Step S163: Select the smaller of the third and fourth moving distances as the second target moving distance of the flexible guide between the second fan module and the second heat source.

[0172] For example, the second target moves a distance D2 = min(D3, D4).

[0173] For example, the second target movement distance D2 is less than the second dimension of the second side described above, so as to avoid the second side being completely covered by the opening area and to prevent the air from the second fan module from flowing too much to the third heat source.

[0174] Step S164: Control the movement of the flexible guide between the second fan module and the second heat source based on the second target moving distance.

[0175] In this embodiment, by calculating the second and third differences and multiplying them by the corresponding adjustment coefficients to obtain the third and fourth movement distances, the temperature state of the heat source can be quantified into specific movement parameters of the flexible airflow guide. Selecting the smaller of the two values ​​as the second target movement distance reflects the priority consideration of airflow allocation, avoiding the impact on the heat dissipation of the second heat source due to an excessively large opening area. This satisfies the basic airflow required by the third heat source based on its temperature difference while ensuring that most of the airflow from the second fan module still flows to the second heat source, achieving more refined dynamic airflow adjustment in low-load scenarios and further improving the intelligence and energy efficiency of the cooling system.

[0176] Please refer to it again. Figure 10 In some embodiments, after step S170 above, the method further includes: Step S180: When the second operating temperature is greater than or equal to the second set temperature, increase the speed of the second fan module.

[0177] In this way, when the second heat source (such as the GPU) has a high temperature and needs to be cooled down first, the airflow of the second fan module is not only concentrated and directed to the second heat source through the non-perforated area of ​​the flexible air guide, but the speed of the second fan module is also increased at the same time, which can significantly increase the airflow through the second heat source per unit time and further enhance the heat dissipation effect.

[0178] In some embodiments, after step S160, the method further includes: Step S190: When the third operating temperature is greater than or equal to the third set temperature, increase the speed of the second fan module.

[0179] Thus, when the second fan module simultaneously cools both the second and third heat sources, if the third heat source (such as the DPU) reaches or exceeds its third set temperature, it indicates that the current fan module speed and airflow distributed through the opening area are insufficient to meet the cooling requirements of the third heat source. In this case, the BMC controls and increases the second fan module speed, maintaining the basic airflow for cooling the second heat source while increasing the airflow to the third heat source. This effectively reduces the temperature of the third heat source, preventing overheating from affecting its performance or stability. This design allows the second fan module to dynamically adjust its output power based on the actual temperature of the third heat source when cooling both, further optimizing airflow distribution and cooling efficiency in multi-heat source scenarios.

[0180] Figure 11 This is an architecture diagram of a computing device provided for some embodiments of this application.

[0181] like Figure 11 As shown, the computing device 1100 includes a processor 1101 and a memory 1102. Exemplarily, the computing device 1100 may also include a communications interface 1103 and a communications bus 1104.

[0182] The processor 1101, memory 1102, and communication interface 1103 communicate with each other via communication bus 1104. The communication interface 1103 may include a transmitter and receiver for communicating with other devices or communication networks. It can be a wired interface (port), such as a fiber distributed data interface (FDDI) or a gigabit Ethernet interface (GE).

[0183] In some embodiments, the processor 1101 is used to execute program 1105, which specifically performs the relevant steps in the above-described airflow distribution method embodiments. Specifically, program 1105 may include program code, which includes computer-executable instructions.

[0184] For example, processor 1101 may be a central processing unit (CPU), a baseboard management controller (BMC), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement some embodiments of this application. Computing device 1100 may include one or more processors, which may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs. The CPU may be a single-core CPU or a multi-core CPU.

[0185] In some embodiments, memory 1102 is used to store program 1105. Memory 1102 may include high-speed random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device.

[0186] Specifically, program 1105 can be called by processor 1101 to enable computing device 1100 to perform management operations of the baseboard management controller.

[0187] Some embodiments of this application provide a computer-readable storage medium storing at least one executable instruction that, when executed on a computing device 1100, causes the computing device 1100 to perform the above-described airflow distribution method.

[0188] For example, the computer-readable storage medium can be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, a floppy disk, and an optical data storage device.

[0189] Some embodiments of this application provide a baseboard management controller applied to a server. The baseboard management controller receives signals from the server's memory via an interface circuit; these signals include computer instructions stored in the memory. When the baseboard management controller executes the computer instructions, it performs the various steps of the airflow distribution method shown in the above-described method embodiments.

[0190] The beneficial effects that the readable storage medium provided in some embodiments of this application can achieve can be referred to the beneficial effects in the corresponding task reasoning and execution methods provided above, and will not be repeated here.

[0191] The embodiments described above are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A computing device, characterized in that, include: The chassis and a first heat source, a second heat source, a first fan module, and a first airflow guiding assembly disposed in the chassis; Along the first direction, the first heat source and the second heat source are located on the air outlet side of the first fan module, and the first direction is the air outlet direction of the first fan module; Along the second direction, the second heat source and the first heat source are arranged alternately in sequence, and the second direction is different from the first direction; The first flow guiding component includes: A flexible airflow guide is located between the first fan module and the first heat source, and the flexible airflow guide includes an open area and a non-open area; The flexible airflow guide can move relative to the chassis, so that the non-perforated area is located between the first fan module and the first heat source. The non-perforated area separates the space where the first heat source and the second heat source are located, and guides the airflow of the first fan module to the space where the first heat source is located. The flexible airflow guide can also move relative to the chassis, so that the opening area is located between the first fan module and the first heat source. The opening area connects the space where the first heat source and the second heat source are located, and guides the airflow of the first fan module to the space where the first heat source and the second heat source are located.

2. The computing device according to claim 1, characterized in that, The first flow guiding component further includes: a power mechanism; The power mechanism is connected to both ends of the flexible guide along the extension direction; The power mechanism is used to drive the flexible guide to move, so that the non-perforated area is located between the first fan module and the first heat source; The power mechanism is also used to drive the flexible guide to move, so that the opening area is located between the first fan module and the first heat source.

3. The computing device according to claim 2, characterized in that, The power mechanism includes a first rotating shaft and a second rotating shaft, which are respectively connected to the two ends of the flexible guide along the extension direction. The power mechanism further includes a first driving member, which is connected to the first rotating shaft. The first driving member is used to drive the first rotating shaft to rotate and drive the flexible guide member to be arranged around the first rotating shaft. and / or The power mechanism further includes a second driving member, which is connected to the second rotating shaft. The second driving member is used to drive the second rotating shaft to rotate and drive the flexible guide member to rotate around the second rotating shaft.

4. The computing device according to claim 3, characterized in that, The first flow guiding component further includes: The first support member is located between the first fan module and the first heat source, and is connected to the two side walls of the chassis along the third direction. The first support member is located between the first rotating shaft and the second rotating shaft, and supports the flexible guide member, causing the extension direction of the flexible guide member to bend; The flexible guide component forms a first side on the portion located between the first rotating shaft and the first support component; The flexible guide component forms a second side on the portion located between the second rotating shaft and the first support component; The flexible flow guide extends along the first direction on the first side; The flexible airflow guide is inclined relative to the first fan module on the second side, and the flexible airflow guide separates or connects the space where the first heat source and the second heat source are located on the second side.

5. The computing device according to claim 4, characterized in that, The flexible flow guide includes two non-perforated areas; Along the extension direction of the flexible guide, the two non-perforated areas are located on both sides of the perforated area.

6. The computing device according to claim 5, characterized in that, The first rotating shaft is used to move synchronously with the second rotating shaft, so that the open area of ​​the flexible guide is on the first side and the non-open area is on the second side, so as to separate the space where the first heat source and the second heat source are located; The first rotating shaft is also used to move synchronously with the second rotating shaft, so that the non-perforated area of ​​the flexible guide is on the first side and the perforated area is on the second side, so as to connect the space where the first heat source and the second heat source are located.

7. The computing device according to any one of claims 4-6, characterized in that, The first flow guiding component further includes: The second support member is connected to the two side walls of the chassis along a third direction and is located between the first support member and the second rotating shaft; The flexible flow guide is wound around the second support member; The second support member causes the second side of the flexible guide member to bend again, and the flexible guide member between the second support member and the second rotating shaft extends along the first direction.

8. The computing device according to any one of claims 4-7, characterized in that, When the opening area is located on the second side Along the inclined direction of the second side, the first dimension of the opening area is smaller than the second dimension of the second side.

9. The computing device according to any one of claims 1-8, characterized in that, The computing device also includes a third heat source, a second fan module, and a second airflow guiding component; Along the first direction, the second fan module is located between the first heat source and the second heat source; Along the first direction, the third heat source and the second heat source are located on the same side of the second fan module; Along the second direction, the second heat source and the third heat source are arranged in a specific configuration; The second airflow guiding component is located between the second fan module and the second heat source to separate or connect the space where the second heat source and the third heat source are located.

10. The computing device according to claim 9, characterized in that, The third heat source is connected to the space where the first heat source is located.

11. The computing device according to any one of claims 2-10, characterized in that, It also includes a baseboard management controller; The baseboard management controller is communicatively connected to the power mechanism; The substrate management controller is used to control the movement of the power mechanism to drive the flexible guide to move, so that the open area or the non-open area is located between the first fan module and the first heat source.

12. A method for distributing air volume, characterized in that, Applied to a computing device as described in any one of claims 1-11, the method comprises: Obtain the first operating temperature of the first heat source and the second operating temperature of the second heat source; When the first operating temperature is lower than the first set temperature, the flexible guide component is controlled to move relative to the chassis so that the opening area of ​​the flexible guide component connects the space where the first heat source and the second heat source are located. When the first operating temperature is greater than or equal to the first set temperature, the flexible guide component is controlled to move relative to the chassis, so that the non-perforated area of ​​the flexible guide component separates the space where the first heat source and the second heat source are located.

13. The air volume distribution method according to claim 12, characterized in that, When the first operating temperature is lower than the first set temperature, the flexible guide component is controlled to move relative to the chassis, so that the opening area of ​​the flexible guide component connects the spaces where the first heat source and the second heat source are located, including: When the first operating temperature is lower than the first set temperature, calculate the first difference between the first set temperature and the first operating temperature, and the second difference between the second set temperature and the second operating temperature. The first moving distance of the flexible guide is determined based on the first difference, and the second moving distance of the flexible guide is determined based on the second difference. The smaller of the first moving distance and the second moving distance is selected as the first target moving distance of the flexible guide; The movement of the flexible guide is controlled based on the first target movement distance.

14. The air volume distribution method according to claim 12 or 13, characterized in that, When the computing device includes a third heat source and a second fan module, and there are two airflow guiding components, the method further includes: Obtain the third operating temperature of the third heat source; When the second operating temperature is lower than the second set temperature, the flexible air guide between the second fan module and the second heat source is controlled to move relative to the chassis, so that the opening area of ​​the flexible air guide connects the space where the second heat source and the third heat source are located. When the second operating temperature is greater than or equal to the second set temperature, the flexible air guide between the second fan module and the second heat source is controlled to move relative to the chassis, so that the non-perforated area of ​​the flexible air guide separates the space where the second heat source and the third heat source are located.

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