computing devices

Abstract

This application provides a computing device. The computing device includes a housing, multiple nodes, cooling pipes, and a heat dissipation device. The multiple nodes are located within the housing and arranged along the height of the computing device. The cooling pipes include a main pipe and multiple sub-pipes. The main pipe extends along the height direction, and the multiple sub-pipes are arranged along the main pipe along the height direction, each sub-pipe corresponding to one of the multiple nodes. The heat dissipation device is located on at least one side of the housing along a first direction of the computing device. The heat dissipation device includes a first heat exchange component and a second heat exchange component, and the main pipe is connected to the first heat exchange component. A circulating coolant can be installed in the nodes, cooling pipes, and the first heat exchange component. The second heat exchange component is used to cool the coolant in the first heat exchange component. The computing device provided by this application can achieve both low noise and good heat dissipation, and is easy to deploy in an office environment.

Description

Technical Field

[0001] This application relates to the field of server technology, and more particularly to a computing device. Background Technology

[0002] Servers, as core devices for data storage, processing, and transmission, are widely used in various scenarios.

[0003] Servers can be deployed in data center server rooms, which are far from office environments. Therefore, the design focus for servers deployed in data centers is often on performance enhancement, with less emphasis on noise control during operation. However, with the continuous upgrading of office models, the demand for server deployment in non-server room scenarios such as office environments and meeting rooms is increasing. More and more office scenarios require direct server deployment to meet data processing needs. In office scenarios, servers are close to employees, and existing servers integrated into data centers generate significant noise, failing to meet the requirement for lower noise levels in office environments. Servers generate a large amount of heat during operation. Limited space in office environments makes it difficult to install additional cooling devices. Increasing fan speed is often necessary for cooling, but this further increases noise, and air cooling has limited effectiveness. Liquid cooling improves heat dissipation, but requires an additional liquid supply system, making the computing equipment larger and more difficult to deploy, also unsuitable for office environments.

[0004] Therefore, in related technologies, it is difficult for servers to have both low noise and good heat dissipation, and it is not conducive to the deployment of servers in office environments. Summary of the Invention

[0005] This application provides a computing device that can have both low noise and good heat dissipation, and is easy to deploy in an office environment.

[0006] In a first aspect, embodiments of this application provide a computing device, including a housing, multiple nodes, cooling pipes, and a heat dissipation device. The multiple nodes are disposed within the housing and arranged along the height direction of the computing device. The cooling pipes include a main pipe and multiple sub-pipes connected to the main pipe. The main pipe extends along the height direction, and the multiple sub-pipes are arranged along the height direction on the main pipe, with each sub-pipe corresponding to one of the multiple nodes. The heat dissipation device is disposed on at least one side of the housing along a first direction of the computing device. The heat dissipation device includes a first heat exchange component and a second heat exchange component, arranged along the first direction. The main pipe is connected to the first heat exchange component, wherein the first direction intersects the height direction. A circulating coolant can be disposed in the nodes, cooling pipes, and the first heat exchange component, and the second heat exchange component is used to cool the coolant in the first heat exchange component.

[0007] The computing device provided in this application embodiment achieves coolant distribution and collection through the cooperation of main and sub-pipes in the cooling pipeline, enabling multiple nodes in the computing device to achieve liquid cooling heat dissipation. Liquid cooling heat dissipation has good cooling effect and low noise, making the computing device easier to deploy in office environments. In addition, by placing the heat dissipation device on at least one side of the housing along the first direction X, the heat dissipation device does not need to occupy the space in the housing used for setting up nodes, saving space for the computing device and facilitating its deployment in office environments. Heat is dissipated to the coolant through heat exchange between the second heat exchange component and the first heat exchange component. The nodes, cooling pipelines, and the first heat exchange component form a closed cooling loop, without an additional liquid supply device to provide coolant to the computing device. This results in a smaller space occupied by the computing device, allowing it to have a more compact structure while maintaining low noise and good heat dissipation effect, making it more conducive to deployment in office environments.

[0008] In one possible implementation, the computing device provided in this application embodiment includes a second heat exchange component comprising multiple cooling fans arranged flatly on the side of the first heat exchange component. This flat arrangement of multiple cooling fans makes better use of the space on the side of the housing with its larger surface area, resulting in a more compact structure for the computing device. Because the cooling fans are flatly positioned on the side of the first heat exchange component, their air resistance is low, allowing for better heat dissipation with a smaller airflow, and also reducing noise during operation. The cost of the cooling fans is also lower than that of heat pipes, resulting in a heat dissipation device that combines low noise, low cost, and good heat dissipation performance.

[0009] In one possible implementation, the computing device provided in this application embodiment has a cooling fan that is an exhaust fan, and the housing has an air inlet channel on at least one side along the second direction, and / or an air inlet channel on at least one side along the height direction, wherein the first direction, the second direction, and the height direction intersect each other. By setting the cooling fan as an exhaust fan, when using negative pressure cooling to exhaust air outwards, there is no positive pressure accumulation effect inside the cabinet under the action of negative pressure, the airflow process is smoother, the wind resistance is smaller, and thus the noise of the cooling fan is smaller.

[0010] In one possible implementation, the computing device provided in this application embodiment further includes a mounting frame. The mounting frame includes a base plate and side plates surrounding the base plate. The side plates face a first heat exchange component along a first direction and are connected to the first heat exchange component. The base plate has multiple ventilation holes, and multiple cooling fans are correspondingly arranged with each ventilation hole and connected to the periphery of the ventilation holes. The area between adjacent ventilation holes on the base plate forms a first windbreak structure. The side plates form a second windbreak structure. The first and second windbreak structures can block the backflow of airflow, thereby further increasing the heat dissipation efficiency of the cooling device. Blocking the backflow of airflow also prevents airflow waste, allowing the cooling fans to achieve better heat dissipation at lower speeds, resulting in lower fan noise. Furthermore, blocking the backflow of airflow also prevents noise generated by interference between backflow and normal airflow, further reducing the noise of the cooling device.

[0011] In one possible implementation, the computing device provided in this application embodiment has a heat dissipation device whose orthographic projection area on the housing is greater than or equal to 60% of the area of ​​the side of the housing where the heat dissipation device is located. The orthographic projection area of ​​the heat dissipation device on the housing can be set to be relatively large, thereby allowing for a larger area for arranging the exhaust fan, resulting in better heat dissipation performance of the heat dissipation device.

[0012] In one possible implementation, the computing device provided in this application embodiment includes a main pipeline comprising a main inlet pipe and a main outlet pipe, and sub-pipelines comprising sub-inlet pipes and sub-outlet pipes. The sub-inlet pipes are arranged along the height direction on the main inlet pipe, and the sub-outlet pipes are arranged along the height direction on the main outlet pipe. Multiple sub-inlet pipes are connected one-to-one with multiple nodes, and multiple sub-outlet pipes are also connected one-to-one with multiple nodes. Both the main inlet pipe and the main outlet pipe are connected to a first heat exchange component in a heat dissipation device. And / or, a pump body is provided on the side of the main outlet pipe facing the heat dissipation device. The pump body, located on the side of the main outlet pipe facing the heat dissipation device, can accelerate the flow rate of the coolant that has absorbed heat from the nodes.

[0013] In one possible implementation, the computing device provided in this application includes a first cooling device and a second cooling device, which are disposed on opposite sides of a housing along a first direction. The computing device also includes a first transfer pipe, which includes a first inlet pipe and a first outlet pipe. The main outlet pipe, the first inlet pipe, the first heat exchange component in the first cooling device, the first outlet pipe, and the main inlet pipe are sequentially connected to form a first cooling circuit. The main outlet pipe, the first inlet pipe, the first heat exchange component in the second cooling device, the first outlet pipe, and the main inlet pipe are sequentially connected to form a second cooling circuit. The coolant cooled in the first and second cooling devices converges in the first outlet pipe, allowing the coolant in both devices to mix and achieve a uniform temperature. The temperature of the coolant entering each node is similar, resulting in a similar cooling effect at each node.

[0014] In one possible implementation, the computing device provided in this application embodiment has a first valve body between the first liquid inlet pipe and the first heat exchange component in the first heat dissipation device; and a second valve body between the first liquid inlet pipe and the first heat exchange component in the second heat dissipation device. This facilitates control of the operating status of the first and second heat dissipation devices in the computing device and facilitates the deployment of the computing device.

[0015] In one possible implementation, the computing device provided in this application includes a first cooling device and a second cooling device, which are disposed on opposite sides of a housing along a first direction. The computing device also includes a second transfer pipe and a third transfer pipe. The second transfer pipe includes a second inlet pipe and a second outlet pipe; the main outlet pipe, the second inlet pipe, the first heat exchange component in the first cooling device, the second outlet pipe, and the main inlet pipe are sequentially connected to form a first cooling circuit. The third transfer pipe includes a third inlet pipe and a third outlet pipe; the main outlet pipe, the third inlet pipe, the first heat exchange component in the second cooling device, the third outlet pipe, and the main inlet pipe are sequentially connected to form a second cooling circuit. The coolants in the first and second cooling devices are relatively independent, avoiding the impact on the other cooling device if the cooling effect decreases due to damage to the second heat exchange component in one cooling device.

[0016] In one possible implementation, the computing device provided in this application embodiment has a third valve body between the main liquid outlet pipe and the second liquid inlet pipe; and a fourth valve body between the main liquid outlet pipe and the third liquid inlet pipe. This facilitates the control of the operating status of the first and second heat dissipation devices in the computing device and also facilitates the deployment of the computing device.

[0017] In one possible implementation, the computing device provided in this application includes a computing node, multiple functional nodes, and a power node. The computing node is located at the top of the enclosure, the power node is located at the bottom of the enclosure, and the multiple functional nodes are arranged along the height between the computing node and the power node. The computing device also includes a backplane for electrically connecting the computing node and the multiple functional nodes. The computing device also includes a connection bar for electrically connecting the computing node and the multiple functional nodes to the power node. The node layout within the enclosure is clearly layered and easy to distinguish, improving identification and ease of operation during maintenance. And / or, the backplane, connection bar, and cooling pipes are located on the same side of the enclosure along a second direction of the computing device, resulting in a neater and more compact layout of the computing device. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a computing device provided in an embodiment of this application;

[0020] Figure 2 Another schematic diagram of the structure of the computing device provided in the embodiments of this application;

[0021] Figure 3 An exploded view of a computing device provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the piping connections of a computing device provided in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the heat dissipation device in a computing device provided in an embodiment of this application;

[0024] Figure 6 This is another schematic diagram of the heat dissipation device in the computing device provided in the embodiments of this application.

[0025] Figure 7 This is a schematic diagram of the structure of a node in a computing device provided in an embodiment of this application;

[0026] Figure 8 This is an exploded view of a heat dissipation device in a computing device provided in an embodiment of this application;

[0027] Figure 8a Another exploded view of the heat dissipation device in the computing device provided in the embodiments of this application;

[0028] Figure 9 A schematic diagram illustrating the airflow direction in a computing device provided in an embodiment of this application;

[0029] Figure 10 A schematic diagram showing the arrangement of power nodes and the first transfer circuit in a computing device provided in an embodiment of this application;

[0030] Figure 11 This is a schematic diagram of the deployment of a computing device provided in an embodiment of this application;

[0031] Figure 12 This is a schematic diagram of another pipeline connection of the computing device provided in an embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10. Computing device; 10a. First computing device; 10b. Second computing device;

[0034] 100. Box body; 100a. Front surface; 100b. Rear surface; 100c. Side surface; 100d. Top surface; 100e. Bottom surface;

[0035] 110. Front panel; 120. Rear panel; 130. Side panel; 140. Top panel; 150. Bottom panel; 160. Support structure; 170. Wheel body;

[0036] 200, node; 200a, compute node; 200b, functional node; 200c, power node;

[0037] 210. Housing; 220. Component to be cooled; 230. Cold plate;

[0038] 300. Cooling piping;

[0039] 310. Main pipe; 311. Main inlet pipe; 312. Main outlet pipe;

[0040] 320. Sub-pipeline; 321. Sub-inlet pipe; 322. Sub-outlet pipe;

[0041] 330. Pump body; 340. Injection port;

[0042] 400, Heat dissipation device; 400a, First heat dissipation device; 400b, Second heat dissipation device;

[0043] 410. First heat exchange component; 411. Heat dissipation piping; 412. First interface; 413. Second interface;

[0044] 420. Second heat exchanger assembly; 421. Cooling fan; 421a. Exhaust fan;

[0045] 430. Mounting frame; 431. Base plate; 4311. Ventilation hole; 4312. First windbreak structure; 432. Side plate; 433. Mounting plate;

[0046] 500. Back panel; 510. Connection structure;

[0047] 600. First transfer pipeline;

[0048] 610. First inlet pipe; 620. First outlet pipe; 630. First valve body; 640. Second valve body;

[0049] 700. Second transfer pipe; 710. Second inlet pipe; 720. Second outlet pipe; 730. Third valve body;

[0050] 800. Third transfer pipe; 810. Third inlet pipe; 820. Third outlet pipe; 830. Fourth valve body;

[0051] 900, Connecting strip;

[0052] X, first direction; Y, second direction; Z, altitude direction. Detailed Implementation

[0053] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0054] To better understand the computing device provided in the embodiments of this application, the terminology involved in this application will be briefly explained below.

[0055] CPU: The full English name is Central Processing Unit, and the full Chinese name is Central Processing Unit. It is the core computing and control unit of the device, responsible for overall scheduling, business calculation and instruction processing.

[0056] CPU Node: A CPU node is the smallest computing unit that integrates at least one CPU (Central Processing Unit) and is equipped with basic components such as memory and interfaces. It can independently complete calculations and instruction processing. It is the basic module that undertakes the core computing power in a rack server and can run tasks independently or work in collaboration with other nodes.

[0057] GPU: Graphics Processing Unit, also known as a graphics processor, is a large-scale parallel computing application used for computing power acceleration, image processing, AI computing, and other extended workloads.

[0058] GPU nodes are nodes that integrate at least one GPU (Graphics Processing Unit) along with basic components such as memory and interfaces. They primarily handle extended workloads such as computing acceleration, image processing, and AI computation, and are the core modules providing extended computing power in rack-mount servers. GPU nodes can independently undertake and complete their assigned extended workloads (such as AI computation and image processing); GPU nodes can also work in conjunction with CPU nodes to complete more complex computing tasks.

[0059] This application provides a computing device that can have both low noise and good heat dissipation, and is easy to deploy in an office environment.

[0060] Computing devices can be servers, such as high-density servers, tower servers, rack servers, and full-rack servers. Among these, full-rack servers are widely used in cloud computing, high-performance computing (HPC), big data, and artificial intelligence (AI) fields due to their high space utilization. Furthermore, full-rack servers offer flexible deployment, employ an open architecture, and can be configured with different computing nodes as needed, supporting elastic expansion and adapting to diverse office needs. The operation and maintenance of full-rack servers are also relatively simple and cost-effective. These advantages make full-rack servers particularly advantageous for deployment in office environments.

[0061] The following section uses a rack-mount server as an example to illustrate the specific structure of computing devices.

[0062] Figure 1 A schematic diagram of the structure of a computing device provided in an embodiment of this application. Figure 2 Another schematic diagram of the structure of the computing device provided in the embodiments of this application (wherein, Figure 2 The structure of the box body 100 has been omitted. Figure 3 An exploded view of a computing device provided in an embodiment of this application. Figure 4 This is a schematic diagram of the piping connections of a computing device provided in an embodiment of this application. Figure 5 This is a schematic diagram of the heat dissipation device in a computing device provided in an embodiment of this application. Figure 6 This is another schematic diagram of the heat dissipation device in the computing device provided in the embodiments of this application.

[0063] See Figures 1 to 6As shown, the computing device 10 includes a housing 100, multiple nodes 200, cooling pipes 300, and a heat dissipation device 400. The multiple nodes 200 are located within the housing 100 and arranged along the height direction Z of the computing device 10. The cooling pipes 300 include a main pipe 310 and multiple sub-pipes 320 connected to the main pipe 310. The main pipe 310 extends along the height direction Z, and the multiple sub-pipes 320 are arranged along the height direction Z on the main pipe 310. Each sub-pipe 320 is connected to one of the multiple nodes 200. The heat dissipation device 400 is located on at least one side of the housing 100 along a first direction X of the computing device 10. The heat dissipation device 400 includes a first heat exchange component 410 and a second heat exchange component 420, which are arranged along the first direction X. The main pipe 310 is connected to the first heat exchange component 410, wherein the first direction X intersects the height direction Z. The node 200, cooling pipe 300 and the first heat exchange assembly 410 may contain circulating coolant, and the second heat exchange assembly 420 is used to cool the coolant in the first heat exchange assembly 410.

[0064] The computing device 10 can be a cuboid structure, having a length direction, a width direction, and a height direction Z. The width direction is indicated by a first direction X, and the length direction by a second direction Y. A housing 100 forms the outer outline of the computing device 10. The housing 100 is a frame structure and is used to house and support other components within the computing device 10. The two sides of the housing 100 along the second direction Y can be a front surface 100a and a rear surface 100b; the two sides of the housing 100 along the first direction X are the side surfaces 100c; and the two sides of the housing 100 along the height direction Z are the top surface 100d and the bottom surface 100e. The front surface 100a of the housing 100 can be provided with a front panel 110, the rear surface 100b can be provided with a rear panel 120, the side surfaces 100c of the housing 100 are provided with side panels 130, the top surface 100d is provided with a top panel 140, and the bottom surface 100e is provided with a bottom panel 150.

[0065] Please continue reading Figure 2 As shown, a support structure 160 can be provided on the side of the bottom panel 150 of the housing 100 opposite to the top panel 140. The support structure 160 can be installed at the four corners of the bottom panel 150, and the support structure 160 abuts against the ground. The support structure 160 can support the housing 100 and the components inside the housing 100. Wheels 170 can also be provided on the side of the bottom panel 150 of the housing 100 opposite to the top panel 140. When it is necessary to move the computing device 10, the wheels 170 extend and abut against the ground, causing the support structure 160 to suspend in the air. The wheels 170 roll relative to the ground, allowing the computing device 10 to be moved easily.

[0066] The enclosure 100 has multiple mounting positions arranged Z-shaped along the height direction, where nodes 200 can be inserted. Each node 200 may include a computing node 200a, multiple functional nodes 200b, and a power node 200c. The computing node 200a is located at the top of the enclosure 100, the power node 200c is located at the bottom of the enclosure 100, and the multiple functional nodes 200b are arranged Z-shaped along the height direction between the computing node 200a and the power node 200c. The computing device 10 also includes a backplane 500 for electrically connecting the computing node 200a and the multiple functional nodes 200b. The computing device 10 also includes a connection bar 900 for electrically connecting the computing node 200a and the multiple functional nodes 200b to the power node 200c.

[0067] Computing device 10 includes multiple nodes 200, in Figure 2 and Figure 4 The diagram schematically shows six nodes 200, including one compute node 200a, four functional nodes 200b, and one power node 200c. The compute node 200a can be a CPU node 200, and the functional node 200b can be a GPU node 200, a compute acceleration node, a storage node, a memory node, an extended compute node, etc.

[0068] Taking functional node 200b as a GPU node as an example, one possible cooperation mode between computing node 200a and functional node 200b is as follows: Computing node 200a can run overall tasks such as task allocation, instruction issuance, and logical judgment, while handling serial and complex logic calculations; functional node 200b can run parallel computing-intensive tasks such as image processing, AI inference, and large-scale data computation. Functional node 200b receives parallel computing tasks allocated by computing node 200a, quickly completes data processing, and feeds the results back to computing node 200a; computing node 200a then further schedules or outputs processing results based on the feedback results, and the two work together to complete the overall computing task. The type of node 200 in the same mounting position can be changed. The backplate 500 can be located on the rear surface 100b of the enclosure 100 along the second direction Y. The backplate 500 extends along the height direction Z, and multiple connection structures 510 are provided on the backplate 500, which are spaced apart along the height direction Z. Multiple connection structures 510 are respectively plugged into computing nodes 200a and multiple functional nodes 200b, thereby enabling computing nodes 200a and functional nodes 200b to be electrically connected via a backplane 500. During the process of inserting a node 200 into the enclosure 100 from the front surface 100a side, the node 200 can be plugged into the connection structures 510 on the backplane 500. Connecting computing nodes 200a and functional nodes 200b via the backplane 500 avoids cable clutter between nodes 200, reduces the assembly difficulty and troubleshooting cost of the computing device 10, and improves the internal cleanliness of the enclosure 100, compared to cable connections. It is understandable that the connection structure 510 on the backplane 500 can be set one-to-one with the computing node 200a and the functional node 200b, and the connection structure 510 on the backplane 500 can also be set one-to-one with the functional node 200b. The backplane 500 is connected to the computing node 200a through a cable, so that it can be easily replaced when the specifications of the computing node 200a change.

[0069] Power node 200c supplies power to computing nodes 200a and functional nodes 200b in computing device 10 via connector 900. Specifically, connector 900 extends along the height direction Z, and can electrically connect both computing nodes 200a and functional nodes 200b to power node 200c. Connecting computing nodes 200a and functional nodes 200b to power node 200c via connector 900 simplifies the power supply chain of computing device 10, avoids messy cables between nodes 200, further reduces the assembly difficulty and troubleshooting cost of computing device 10, and simultaneously improves the internal cleanliness of enclosure 100.

[0070] The computing node 200a is located at the top along the height direction Z, the functional node 200b is located in the middle area along the height direction Z, and the third node 200 is located at the bottom of the enclosure 100 along the height direction Z. The layout of the nodes 200 in the enclosure 100 is clear and easy to distinguish, which can improve the identification and operation convenience during operation and maintenance.

[0071] Please continue reading Figure 3 As shown, in one possible implementation, the back panel 500, the connecting bar 900, and the cooling pipes 300 are located on the same side of the housing 100 along the second direction Y of the computing device 10.

[0072] For example, please continue to see Figure 2 As shown, the back plate 500, the connecting bar 900 and the cooling pipe 300 are arranged on the rear surface 100b of the housing 100 along the second direction Y of the computing device 10, thereby making the layout of the computing device 10 more neat and compact.

[0073] Please continue reading Figure 3 and Figure 4 As shown, the cooling pipe 300 includes a main pipe 310 and multiple sub-pipes 320 connected to the main pipe 310. The multiple sub-pipes 320 are all connected to the main pipe 310. The multiple sub-pipes 320 on the main pipe 310 can be aligned with different nodes 200 along the height direction Z in order to connect with the cold plate 230 in the node 200.

[0074] Figure 7 This is a schematic diagram of the structure of a node in a computing device provided in an embodiment of this application.

[0075] See Figure 7 As shown, node 200 includes a housing 210, within which a heat-dissipating component 220 is disposed. The heat-dissipating component 220 can be a processor, memory, hard drive, or other components that generate heat during operation. Node 200 includes a cold plate 230, which contacts the heat-dissipating component 220 in node 200. The end of sub-pipe 320 opposite to the main pipe 310 can be connected to the cold plate 230 in node 200.

[0076] The computing device 10 also includes a heat dissipation device 400. The heat dissipation device 400 can be located on one side of the computing device 10 along the first direction X, or it can be located on opposite sides of the computing device 10 along the first direction X. When the heat dissipation device 400 is located on one side of the computing device 10 along the first direction X, two computing devices 10 can be arranged side by side, and the sides of the computing devices 10 without the heat dissipation device 400 can face each other. The heat dissipation device 400 can be connected to the side panel 130 of the enclosure 100. The heat dissipation device 400 can be installed in the space of the side 100c with a larger surface area of ​​the enclosure 100, without occupying the space originally occupied by the node 200 in the enclosure 100, thus making higher space utilization within the enclosure 100 and more conducive to the deployment of the computing device 10 in an office environment. The heat dissipation device 400 includes a first heat exchange component 410 and a second heat exchange component 420. One end of the main pipe 310 can be connected to the first heat exchange component 410 in the heat dissipation device 400. For example, the end of the main pipe 310 facing the bottom panel 150 of the housing 100 can be connected to the first heat exchange component 410 in the heat dissipation device 400. The first heat exchange component 410 can be a radiator, and the first heat exchange component 410 is provided with a heat dissipation pipe 411 for the flow of coolant.

[0077] The node 200, cooling pipe 300, and first heat exchange component 410 contain circulating coolant. The node 200, cooling pipe 300, and first heat exchange component 410 form a closed cooling loop. The second heat exchange component 420 can remove the heat from the coolant in the closed loop, thus eliminating the need for an additional coolant supply device to provide cooled coolant to the cooling pipe 300. This makes the computing device 10 simple and compact in structure, making it more suitable for deployment in an office environment.

[0078] Specifically, the heat generated by the heat-dissipating component 220 of node 200 during operation is absorbed by the coolant in the cold plate 230, which then flows from the corresponding sub-pipe 320 into the main pipe 310 and from the main pipe 310 into the first heat exchange assembly 410. Heat exchange occurs between the first heat exchange assembly 410 and the second heat exchange assembly 420. Heat is transferred from the first heat exchange assembly 410 to the second heat exchange assembly 420, causing the coolant in the first heat exchange assembly 410 to cool down and re-enter the main pipe 310. From the main pipe 310, the coolant flows into different sub-pipes 320, and then from the sub-pipes 320 into the corresponding cold plate 230 of node 200. This cycle continues to dissipate heat from node 200.

[0079] Please continue reading Figure 4 As shown, it can be understood that a liquid injection port 340 can also be provided in the closed cooling circuit. When the coolant is lost due to evaporation or when the amount of coolant decreases after a certain node 200 is removed, coolant can be injected through the liquid injection port 340 to replenish it.

[0080] The cooling fluid is distributed and collected through the cooperation of the main pipe 310 and sub-pipes 320 in the cooling pipe 300, enabling multiple nodes 200 in the computing device 10 to achieve liquid cooling. Liquid cooling has a good cooling effect and low noise, making the computing device 10 easier to deploy in an office environment. In addition, by placing the heat dissipation device 400 on at least one side of the enclosure 100 along the first direction X, the heat dissipation device 400 does not need to occupy the space in the enclosure 100 used to house the nodes 200, saving space for the computing device 10 and facilitating its deployment in an office environment. The heat exchange between the second heat exchange component 420 and the first heat exchange component 410 dissipates heat from the coolant. The nodes 200, cooling pipes 300, and the first heat exchange component 410 form a closed cooling loop, without an additional coolant supply device to the computing device 10. This results in a smaller space occupied by the computing device 10, allowing it to have a more compact structure while maintaining low noise and good heat dissipation, making it more suitable for deployment in an office environment.

[0081] In one possible implementation, the second heat exchange component 420 can be a heat pipe. One end of the heat pipe is attached to or close to the first heat exchange component 410, and the other end extends to the outside of the side panel 130 of the housing 100. The heat pipe utilizes the phase change (evaporation-condensation) of the internal working fluid to rapidly transfer heat. The heat from the coolant in the first heat exchange component 410 is transferred to the heat pipe, and then the heat is dissipated to the environment through the end of the heat pipe located outside the housing 100. This method has a compact structure, high heat dissipation efficiency, and low noise during operation, which is beneficial for the deployment of the computing device 10 in office environments.

[0082] Figure 8 An exploded view of a heat dissipation device in a computing device provided in an embodiment of this application. Figure 8a Another exploded view of the heat dissipation device in the computing device provided in the embodiments of this application.

[0083] See Figure 6 , Figure 8 and Figure 8a As shown, in one possible implementation, the second heat exchange component 420 includes a plurality of cooling fans 421, which are arranged in a flat manner on the side of the first heat exchange component 410.

[0084] The heat dissipation device 400 may include a mounting frame 430, which includes a base plate 431 and side plates 432 surrounding the base plate 431. The side plates 432 face the first heat exchange assembly 410 along a first direction X and are connected to the first heat exchange assembly 410. The base plate 431 has multiple ventilation holes 4311. Multiple cooling fans 421 are correspondingly arranged with each ventilation hole 4311 and connected to the periphery of the ventilation holes 4311. The area between adjacent ventilation holes 4311 on the base plate 431 forms a first windbreak structure 4312; the side plates 432 form a second windbreak structure.

[0085] The mounting frame 430 includes a base plate 431, on which multiple ventilation holes 4311, each corresponding to a cooling fan 421, can be formed. The projected area of ​​the ventilation holes 4311 along the first direction X on the cooling fan 421 is approximately equal to the outer contour area of ​​the cooling fan 421. The cooling fan 421 can be connected to the periphery of the ventilation holes 4311 by fasteners. The cooling fan 421 can be aligned with the ventilation holes 4311 along the first direction X. The airflow generated by the cooling fan 421 can flow through the ventilation holes 4311 to the first heat exchange component 410 or from the first heat exchange component 410 to the cooling fan 421 through the ventilation holes 4311. The area between adjacent ventilation holes 4311 can effectively block backflow, and the area between adjacent ventilation holes 4311 can form a first windbreak structure 4312. By opening ventilation holes 4311 on the base plate 431 of the mounting frame 430 and forming a first windbreak structure 4312 in the area between the holes, the first windbreak structure 4312 can be well matched with the irregular area between the cooling fan 421, thereby effectively blocking backflow. In addition, the processing cost of the heat dissipation device 400 is also lower.

[0086] Side plates 432 are arranged around the periphery of the base plate 431, and the shape of the side plates 432 matches that of the base plate 431. The side plates 432 extend from the base plate 431 along the first direction X to the first heat exchange assembly 410, and one end of the side plates 432 facing the first heat exchange assembly 410 is connected to the first heat exchange assembly 410. The side plates 432 of the mounting frame 430 form a second windbreak structure, which can better match the periphery of the first heat exchange assembly 410 and can more effectively block backflow.

[0087] The mounting frame 430 is provided with a mounting plate 433 on the side opposite to the first heat exchange component 410. The mounting frame 430 can be connected to the housing 100 through the mounting plate 433.

[0088] When airflow moves from the first heat exchanger 410 to the second heat exchanger 420, the side of the second heat exchanger 420 facing away from the first heat exchanger 410 is under positive pressure, while the side facing the first heat exchanger 420 is under negative pressure. This pressure difference makes it possible for the airflow to flow back. Conversely, when airflow moves from the second heat exchanger 420 to the first heat exchanger 410, the side of the second heat exchanger 420 facing away from the first heat exchanger 410 is under negative pressure, while the side facing the first heat exchanger 420 is under positive pressure. This pressure difference also makes it possible for the airflow to flow back. The returning airflow absorbs heat from the coolant in the first heat exchanger 410, resulting in a higher temperature.

[0089] A first windbreak structure 4312 is formed in the area between adjacent ventilation holes 4311 on the base plate 431, and a second windbreak structure is formed on the side plate 432. The first and second windbreak structures can block the recirculating airflow, preventing it from reducing the cooling rate of the coolant in the first heat exchange component 410, thereby further increasing the heat dissipation efficiency of the heat dissipation device 400. The first and second windbreak structures also prevent airflow waste, allowing the cooling fan 421 to achieve good heat dissipation at a lower speed, resulting in lower noise from the cooling fan 421. Furthermore, the first and second windbreak structures prevent noise generation caused by interference between the recirculating and normal airflow, further reducing the noise of the heat dissipation device 400.

[0090] Multiple cooling fans 421 in the first heat exchange assembly 410 and the second heat exchange assembly 420 are connected to the mounting frame 430. The multiple cooling fans 421 are arranged flat on the side of the first heat exchange assembly 410. The multiple cooling fans 421 can be arranged on the side of the first heat exchange assembly 410 facing node 200, or on the side panel 130 of the first heat exchange assembly 410 facing the housing 100. In this embodiment, the multiple cooling fans 421 are arranged on the side panel 130 of the first heat exchange assembly 410 facing the housing 100. The multiple cooling fans 421 are arranged in a matrix on the side of the first heat exchange assembly 410 facing the housing 100. When the cooling fans 421 are started, the airflow generated by the cooling fans 421 can remove heat from the coolant in the first heat exchange assembly 410. Understandably, the side panel 130 of the enclosure 100 is provided with multiple ventilation openings, and the position of the ventilation openings can be set according to the airflow direction of the cooling fan 421.

[0091] By including multiple cooling fans 421 in the second heat exchange component 420, the space of the side 100c with a larger surface area of ​​the housing 100 can be more fully utilized, making the structure of the computing device 10 more compact. The cooling fans 421 are laid flat on the side of the first heat exchange component 410. Compared to placing the fans inside the nodes, there are fewer structural components obstructing airflow, resulting in lower wind resistance during operation. Therefore, a smaller airflow from the cooling fans 421 can achieve better heat dissipation, and the noise generated during operation is also lower. The cost of the cooling fans 421 is also lower than that of heat pipes, allowing the heat dissipation device 400 to achieve low noise, low cost, and good heat dissipation performance simultaneously.

[0092] In one possible implementation, the cooling fan 421 is an exhaust fan 421a, and the housing 100 has an air inlet channel on at least one side along the second direction Y.

[0093] The front panel 110 of the enclosure 100 can be a hollow structure, and the rear panel 120 of the enclosure 100 can also be a hollow structure. Some nodes 200 have a hollow structure on the side facing the front panel 110, and the gaps in the hollow structure form an air intake channel.

[0094] Figure 9 This is a schematic diagram of the airflow direction in a computing device provided in an embodiment of this application.

[0095] See Figure 9 As shown, under the negative pressure of the exhaust fan 421a, the airflow from the external environment enters the housing 100 through the air inlet channel of the front panel 110 or the rear panel 120, flows along the gaps or other areas where airflow can flow to the first heat exchange component 410 located on the side panel 130, and after flowing through the first heat exchange component 410, it is discharged by the exhaust fan 421a. With the flow of air, the heat of the coolant in the first heat exchange component 410 can be carried away.

[0096] By setting the cooling fan 421 as an exhaust fan 421a, negative pressure cooling with outward air extraction eliminates the positive pressure buildup effect inside the cabinet under negative pressure, resulting in smoother airflow, lower air resistance, and consequently, lower noise from the cooling fan 421. Furthermore, the small surface area difference between the side panel 130 and the front panel 110 (or rear panel 120) ensures that the intake and exhaust volumes are more similar, further enhancing airflow.

[0097] In another possible implementation, the housing 100 has an air inlet channel on at least one side along the height direction Z. For example, an air inlet channel can be provided on the top panel 140 of the housing 100, and an air inlet channel can also be provided on the bottom panel 150 of the housing 100. For example, air inlet channels can also be provided on the top panel 140 and the bottom panel 150. Thus, when the heat dissipation of the computing device 10 is large, the power of the exhaust fan 421a can be increased, and the air intake volume can be increased through the air inlet channels on the bottom panel 150 and the top panel 140, thereby increasing the heat dissipation capacity of the heat dissipation device 400.

[0098] In one possible implementation, the area of ​​the orthographic projection of the heat dissipation device 400 onto the housing 100 is greater than or equal to 60% of the area of ​​the side of the housing 100 on which the heat dissipation device 400 is provided.

[0099] For example, the dimension of the heat dissipation device 400 along the second direction Y can be equal to the dimension of the side panel 130 along the second direction Y, and the dimension of the heat dissipation device 400 along the height direction Z can be slightly smaller than the dimension of the side panel 130 along the second direction Y. In other words, the projected area of ​​the heat dissipation device 400 on the housing 100 can be set to be larger. As a result, the area of ​​the heat dissipation device 400 used to arrange the exhaust fan 421a is also larger, so that the heat dissipation device 400 has a better heat dissipation effect.

[0100] The specific connection method between the heat dissipation device 400 and the cooling pipe 300 will be described below.

[0101] Please continue reading Figure 4 , Figure 5 and Figure 8 As shown, in one possible implementation, the main pipeline 310 includes a main inlet pipe 311 and a main outlet pipe 312, and the sub-pipes 320 include sub-inlet pipes 321 and sub-outlet pipes 322. The sub-inlet pipes 321 are arranged along the height direction Z on the main inlet pipe 311, and the sub-outlet pipes 322 are arranged along the height direction Z on the main outlet pipe 312. The multiple sub-inlet pipes 321 are connected to multiple nodes 200 in a one-to-one correspondence, and the multiple sub-outlet pipes 322 are connected to multiple nodes 200 in a one-to-one correspondence. Both the main inlet pipe 311 and the main outlet pipe 312 are connected to the first heat exchange component 410 in the heat dissipation device 400.

[0102] The main inlet pipe 311 and the main outlet pipe 312 are arranged side by side on one side of the rear panel 120 of the housing 100. Multiple sub-inlet pipes 321 are spaced apart on the main inlet pipe 311, and all sub-inlet pipes 321 are connected to the main inlet pipe 311. Multiple sub-outlet pipes 322 are spaced apart on the main outlet pipe 312, and all sub-outlet pipes 322 are connected to the main outlet pipe 312. Sub-inlet pipes 321 and sub-outlet pipes 322 aligned along the first direction X can be connected to the same node 200.

[0103] The first heat exchange component 410 has a heat dissipation pipe 411 in its central section. The two ends of the circulation path of the heat dissipation pipe 411 are connected to a first interface 412 and a second interface 413. Fins (not shown in the figure) are also connected to the heat dissipation pipe 411. The first interface 412 and the second interface 413 are located at both ends of the flow direction of the heat dissipation pipe 411. The structure of the first heat exchange component 410 in the first heat dissipation device 400a and the first heat exchange component 410 in the second heat dissipation device 400b is the same, and will not be described in detail here. The bottom end of the main liquid inlet pipe 311 along the height direction Z can be connected to the first interface 412 of the first heat dissipation device 400a and the second heat dissipation device 400b. The bottom end of the main liquid outlet pipe 312 along the height direction Z can be connected to the second interface 413 of the heat dissipation device 400a and the second heat dissipation device 400b.

[0104] The flow path of the coolant is as follows: the coolant that has absorbed the heat of the components in node 200 flows out from the sub-outlet pipe 322, converges in the main outlet pipe 312, and then enters the heat dissipation pipe 411 of the first heat exchange component 410 from the second interface 413. After the heat of the coolant in the heat dissipation pipe 411 is transferred to the second heat exchange component 420, the coolant flows from the first interface 412 into the main inlet pipe 311. In the main inlet pipe 311, it flows into different nodes 200 through multiple sub-inlet pipes 321, and absorbs the heat of the nodes 200 again. This cycle is repeated to dissipate heat from the nodes 200.

[0105] Please continue reading Figure 4 As shown, in one possible implementation, a pump body 330 is provided on the side of the main outlet pipe 312 facing the heat dissipation device 400.

[0106] The pump body 330 provides power for the coolant in the main outlet pipe 312 to flow into the first heat exchange component 410, thereby providing power for the flow of coolant in the closed cooling circuit. The pump body 330 is located on the side of the main outlet pipe 312 facing the heat dissipation device 400, which can accelerate the flow rate of the coolant that has absorbed heat from node 200.

[0107] The dimension of the power node 200c along the second direction Y is smaller than the dimension of the enclosure 100 along the second direction Y. The pump body 330 can be set in the enclosure 100 and can be set in the same layer as the power node 200c along the height direction Z. Thus, the space in the enclosure 100 can be fully utilized, making the structure of the computing device 10 more compact.

[0108] The heat dissipation device 400 includes a first heat dissipation device 400a and a second heat dissipation device 400b, which are disposed on opposite sides of the housing 100 along a first direction X. The heat dissipation devices 400 located on opposite sides of the housing 100 along the first direction X are the first heat dissipation device 400a and the second heat dissipation device 400b, respectively. A connecting pipe can be provided between the cooling pipe 300 and the first heat dissipation device 400a and the second heat dissipation device 400b to facilitate connection between the cooling pipe 300 and the first heat dissipation device 400a and the second heat dissipation device 400b.

[0109] Figure 10 This is a schematic diagram showing the arrangement of the power node and the first transfer pipe in the computing device provided in the embodiments of this application.

[0110] See Figure 4 and Figure 10 As shown, in one possible implementation, the computing device 10 further includes a first transfer pipe 600, which includes a first inlet pipe 610 and a first outlet pipe 620. The main outlet pipe 312, the first inlet pipe 610, the first heat exchange component 410 in the first heat dissipation device 400a, the first outlet pipe 620, and the main inlet pipe 311 are connected in sequence to form a first heat dissipation circuit. The main outlet pipe 312, the first inlet pipe 610, the first heat exchange component 410 in the second heat dissipation device 400b, the first outlet pipe 620, and the main inlet pipe 311 are connected in sequence to form a second heat dissipation circuit. The first inlet pipe 610 can be connected to the main outlet pipe 312 via a flexible hose S, and the first outlet pipe 620 can be connected to the main inlet pipe 311 via a flexible hose S.

[0111] The first transfer pipe 600 can also be set along the height direction Z on the same layer as the power node 200c, thereby making full use of the space in the enclosure 100 and making the structure of the computing device 10 more compact. The first transfer pipe 600 can connect the cooling pipe 300 to the first heat exchange component 410 in the first heat dissipation device 400a and the first heat exchange component 410 in the second heat dissipation device 400b.

[0112] The cooling fluid flows through the first heat dissipation device 400a in the first heat dissipation circuit, which is the first heat dissipation circuit. The flow path of the cooling fluid in the first heat dissipation circuit is: main outlet pipe 312, first inlet pipe 610, first heat exchange component 410 in the first heat dissipation device 400a, first outlet pipe 620 and main inlet pipe 311.

[0113] The cooling circuit through which the coolant flows to the second heat dissipation device 400b is the second heat dissipation circuit. The flow path of the coolant in the second heat dissipation return flow is: main outlet pipe 312, first inlet pipe 610, first heat exchange component 410 in the second heat dissipation device 400b, first outlet pipe 620 and main inlet pipe 311.

[0114] The coolant in the main outlet pipe 312 flows into the first inlet pipe 610. After being buffered in the first inlet pipe 610, it is split from the first outlet pipe 620 and enters the first heat exchange component 410 of the first heat dissipation device 400a and the first heat exchange component 410 of the second heat dissipation device 400b respectively. In the first heat dissipation device 400a, the heat of the coolant in the first heat exchange component 410 is transferred to the second heat exchange component 420, and the cooled coolant enters the first outlet pipe 620. In the second heat dissipation device 400b, the heat of the coolant in the first heat exchange component 410 is transferred to the second heat exchange component 420, and the cooled coolant enters the first outlet pipe 620.

[0115] In other words, the coolant in the first heat exchange component 410 of the first heat dissipation device 400a and the first heat exchange component 410 of the second heat dissipation device 400b can converge in the first outlet pipe 620. The coolant cooled in the first heat dissipation device 400a and the second heat dissipation device 400b converges in the first outlet pipe 620, which allows the coolant in the first heat dissipation device 400a and the second heat dissipation device 400b to mix and achieve uniform temperature. The coolant enters the main inlet pipe 311 from the first outlet pipe 620, and the temperature of the coolant entering each node 200 from the main inlet pipe 311 through different sub-inlet pipes 321 is close, so that the cooling effect of each node 200 is similar.

[0116] The pump body 330 can be installed between the main outlet pipe 312 and the first inlet pipe 610, which can accelerate the flow rate of the coolant that has absorbed the heat of node 200.

[0117] Please continue reading Figure 4 As shown, in one possible embodiment, a first valve body 630 is provided between the first liquid inlet pipe 610 and the first heat exchange component 410 in the first heat dissipation device 400a. A second valve body 640 is provided between the first liquid inlet pipe 610 and the first heat exchange component 410 in the second heat dissipation device 400b.

[0118] When both the first valve body 630 and the second valve body 640 are open, the first heat dissipation circuit and the second heat dissipation circuit are connected, and both the first heat dissipation device 400a and the second heat dissipation device 400b play a heat dissipation role, so the computing device 10 has a strong cooling capacity.

[0119] When one of the first valve body 630 and the second valve body 640 is closed and the other is open, one of the first heat dissipation device 400a and the second heat dissipation device 400b plays a heat dissipation role, making it easier to deploy the computing device 10.

[0120] For example, when one side of the first heat dissipation device 400a in the computing device 10 needs to be placed against a wall or there are objects around it, the first valve body 630 can be closed, and the exhaust fan 421a in the first heat dissipation device 400a can be stopped.

[0121] For example, Figure 11 This is a schematic diagram of the deployment of a computing device provided in an embodiment of this application.

[0122] See Figure 11 As shown, when two computing devices 10 are deployed in an office environment, the two computing devices 10 are a first computing device 10a and a second computing device 10b, respectively. The side of the first computing device 10a equipped with the first heat dissipation device 400a faces the side of the second computing device 10b equipped with the second heat dissipation device 400b. The first valve body 630 in the first computing device 10a and the second valve body 640 in the second computing device 10b can be closed, and the exhaust fan 421a in the first heat dissipation device 400a of the first computing device 10a will stop running, and the exhaust fan 421a in the second heat dissipation device 400b of the second computing device 10b will also stop running.

[0123] By setting the first valve body 630 and the second valve body 640, it is convenient to control the operating status of the first heat dissipation device 400a and the second heat dissipation device 400b in the computing device 10, and it is also convenient to deploy the computing device 10.

[0124] Figure 12 This is a schematic diagram of another pipeline connection of the computing device provided in an embodiment of this application.

[0125] See Figure 12 As shown, in one possible implementation, the computing device 10 further includes a second transfer pipe 700 and a third transfer pipe 800. The second transfer pipe 700 includes a second inlet pipe 710 and a second outlet pipe 720. The main outlet pipe 312, the second inlet pipe 710, the first heat exchange component 410 in the first heat dissipation device 400a, the second outlet pipe 720, and the main inlet pipe 311 are connected in sequence to form a first heat dissipation circuit. The third transfer pipe 800 includes a third inlet pipe 810 and a third outlet pipe 820. The main outlet pipe 312, the third inlet pipe 810, the first heat exchange component 410 in the second heat dissipation device 400b, the third outlet pipe 820, and the main inlet pipe 311 are connected in sequence to form a second heat dissipation circuit.

[0126] The second transfer pipe 700 and the third transfer pipe 800 can also be arranged along the height direction Z on the same layer as the power node 200c. This allows for full utilization of the space within the enclosure 100, making the structure of the computing device 10 more compact. The second transfer pipe 700 connects the cooling pipe 300 to the first heat exchange component 410 in the first heat dissipation device 400a, and the third transfer pipe 800 connects the cooling pipe 300 to the first heat exchange component 410 in the second heat dissipation device 400b. The connection method between the second transfer pipe 700 and the cooling pipe 300 is the same as that between the first transfer pipe 600 and the cooling pipe 300, i.e., they can be connected via a flexible hose S. The connection method between the third transfer pipe 800 and the cooling pipe 300 is also the same as that between the first transfer pipe 600 and the cooling pipe 300, i.e., they can be connected via a flexible hose S. Further details will not be provided here.

[0127] The coolant flows through the first heat dissipation device 400a in a heat dissipation circuit, which is called the first heat dissipation circuit. The flow path of the coolant in the first heat dissipation circuit is: main outlet pipe 312, second inlet pipe 710, first heat exchange component 410 in the first heat dissipation device 400a, second outlet pipe 720, and main inlet pipe 311. The coolant in the main outlet pipe 312 flows into the second inlet pipe 710. After being buffered in the second inlet pipe 710, it enters the first heat exchange component 410 of the first heat dissipation device 400a. In the first heat dissipation device 400a, the heat of the coolant in the first heat exchange component 410 is transferred to the second heat exchange component 420. The cooled coolant then enters the second outlet pipe 720.

[0128] The coolant flows through the second heat dissipation device 400b in a heat dissipation circuit, which is the second heat dissipation circuit. The flow path of the coolant in the second heat dissipation return circuit is: main outlet pipe 312, third inlet pipe 810, first heat exchange component 410 in the second heat dissipation device 400b, third outlet pipe 820, and main inlet pipe 311. The coolant in the main outlet pipe 312 flows into the third inlet pipe 810. After being buffered in the third inlet pipe 810, it enters the first heat exchange component 410 of the second heat dissipation device 400b. In the second heat dissipation device 400b, the heat of the coolant in the first heat exchange component 410 is transferred to the second heat exchange component 420. The cooled coolant then enters the third outlet pipe 820.

[0129] In other words, the coolant in the first heat dissipation device 400a and the second heat dissipation device 400b is relatively independent, so as to avoid the impact on the other heat dissipation device if the second heat exchange component 420 in one heat dissipation device 400 is damaged and the heat dissipation effect decreases.

[0130] A pump body 330 is installed between the main outlet pipe 312 and the second inlet pipe 710, and a pump body 330 is also installed between the main outlet pipe 312 and the third inlet pipe 810.

[0131] In one possible implementation, a third valve body 730 is provided between the main outlet pipe 312 and the second inlet pipe 710; a fourth valve body 830 is provided between the main outlet pipe 312 and the third inlet pipe 810.

[0132] When both the third valve body 730 and the fourth valve body 830 are open, the first heat dissipation circuit and the second heat dissipation circuit are connected, and both the first heat dissipation device 400a and the second heat dissipation device 400b play a heat dissipation role, giving the computing device 10 a strong cooling capacity.

[0133] When one of the third valve body 730 and the fourth valve body 830 is closed and the other is open, one of the first heat dissipation device 400a and the second heat dissipation device 400b plays a heat dissipation role, making it easier to deploy the computing device 10.

[0134] For example, when one side of the first heat dissipation device 400a in the computing device 10 needs to be placed against a wall or there are objects around it, the third valve body 730 can be closed, and the exhaust fan 421a in the first heat dissipation device 400a can be stopped.

[0135] For example, when two computing devices 10 are deployed in an office environment, the two computing devices 10 are a first computing device 10a and a second computing device 10b. The side of the first computing device 10a equipped with the first heat dissipation device 400a faces the side of the second computing device 10b equipped with the second heat dissipation device 400b. The third valve body 730 in the first computing device 10a and the fourth valve body 830 in the second computing device 10b can be closed, and the exhaust fan 421a in the first heat dissipation device 400a of the first computing device 10a can be stopped, and the exhaust fan 421a in the second heat dissipation device 400b of the second computing device 10b can also be stopped.

[0136] By setting the third valve body 730 and the fourth valve body 830, it is convenient to control the operating status of the first heat dissipation device 400a and the second heat dissipation device 400b in the computing device 10, and it is also convenient to deploy the computing device 10.

[0137] In one possible implementation, the third valve body 730 and the fourth valve body 830 may be one-way valves, which can prevent coolant backflow and are also less expensive.

[0138] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A computing device, characterized in that, include: Box; Multiple nodes are located inside the enclosure and arranged along the height of the computing device. The cooling pipeline includes a main pipeline and a plurality of sub-pipelines connected to the main pipeline. The main pipeline extends along the height direction, and the plurality of sub-pipelines are arranged along the height direction on the main pipeline. The plurality of sub-pipelines are connected to a plurality of nodes in a one-to-one correspondence. A heat dissipation device is disposed on at least one side of the housing along a first direction of the computing device. The heat dissipation device includes a first heat exchange component and a second heat exchange component, which are arranged along the first direction. The main pipeline is connected to the first heat exchange component, wherein the first direction intersects the height direction. The node, cooling pipe and the first heat exchange component can be equipped with circulating coolant, and the second heat exchange component is used to cool the coolant in the first heat exchange component.

2. The computing device according to claim 1, characterized in that, The second heat exchange component includes multiple cooling fans, which are arranged flat on the side of the first heat exchange component.

3. The computing device according to claim 2, characterized in that, The cooling fan is an exhaust fan, and the housing has an air inlet channel on at least one side along the second direction, and / or the housing has an air inlet channel on at least one side along the height direction, wherein the first direction, the second direction and the height direction intersect each other.

4. The computing device according to claim 2, characterized in that, The heat dissipation device further includes a mounting frame, which includes a base plate and side plates surrounding the base plate. The side plates face the first heat exchange component along the first direction and are connected to the first heat exchange component. The base plate has multiple ventilation holes, and multiple cooling fans are arranged one-to-one with the multiple ventilation holes and connected to the periphery of the ventilation holes. The area between adjacent ventilation holes on the base plate forms a first windbreak structure. The side plates form a second windbreak structure.

5. The computing device according to any one of claims 1 to 4, characterized in that, The main pipeline includes a main inlet pipe and a main outlet pipe, and the sub-pipelines include sub-inlet pipes and sub-outlet pipes. The sub-inlet pipes are arranged along the height direction on the main inlet pipe, and the sub-outlet pipes are arranged along the height direction on the main outlet pipe. Multiple sub-inlet pipes are connected to multiple nodes in a one-to-one correspondence, and multiple sub-outlet pipes are connected to multiple nodes in a one-to-one correspondence. Both the main inlet pipe and the main outlet pipe are connected to the first heat exchange component in the heat dissipation device. And / or, a pump body is provided on the side of the main outlet pipe facing the heat dissipation device.

6. The computing device according to claim 5, characterized in that, The heat dissipation device includes a first heat dissipation device and a second heat dissipation device, which are disposed on opposite sides of the housing along the first direction. The computing device further includes a first transfer pipeline, which includes a first inlet pipe and a first outlet pipe. The main outlet pipe, the first inlet pipe, the first heat exchange component in the first heat dissipation device, the first outlet pipe and the main inlet pipe are connected in sequence to form a first heat dissipation circuit. The main outlet pipe, the first inlet pipe, the first heat exchange component in the second heat dissipation device, the first outlet pipe and the main inlet pipe are connected in sequence to form a second heat dissipation circuit.

7. The computing device according to claim 6, characterized in that, A first valve body is provided between the first liquid inlet pipe and the first heat exchange component in the first heat dissipation device; a second valve body is provided between the first liquid inlet pipe and the first heat exchange component in the second heat dissipation device.

8. The computing device according to claim 5, characterized in that, The heat dissipation device includes a first heat dissipation device and a second heat dissipation device, which are disposed on opposite sides of the housing along the first direction. The computing device also includes a second transfer circuit and a third transfer circuit; The second transfer pipeline includes a second inlet pipe and a second outlet pipe. The main outlet pipe, the second inlet pipe, the first heat exchange component in the first heat dissipation device, the second outlet pipe and the main inlet pipe are connected in sequence to form a first heat dissipation circuit. The third transfer pipe includes a third liquid inlet pipe and a third liquid outlet pipe; the main liquid outlet pipe, the third liquid inlet pipe, the first heat exchange component in the second heat dissipation device, the third liquid outlet pipe and the main liquid inlet pipe are connected in sequence to form a second heat dissipation circuit.

9. The computing device according to claim 8, characterized in that, A third valve body is provided between the main outlet pipe and the second inlet pipe; a fourth valve body is provided between the main outlet pipe and the third inlet pipe.

10. The computing device according to any one of claims 1 to 9, characterized in that, The node includes a computing node, multiple functional nodes, and a power node. The computing node is located at the top of the enclosure, the power node is located at the bottom of the enclosure, and the multiple functional nodes are arranged along the height direction between the computing node and the power node. The computing device also includes a backplane for electrically connecting the computing node and the multiple functional nodes. The computing device also includes a connection bar for electrically connecting the computing node and the multiple functional nodes to the power node. And / or, the back plate, the connecting bar, and the cooling pipes are located on the same side of the housing along the second direction of the computing device.

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