Heat dissipation device with openable and closable airflow guiding structure and its usage method

Abstract

This invention relates to the field of computer heat dissipation technology and discloses a heat dissipation device with an openable and closable airflow guiding structure and its usage method. The liquid cooling head is equipped with two liquid cooling pipes and a heat dissipation assembly for auxiliary heat dissipation of the computer CPU motherboard. The heat dissipation assembly includes a connecting frame and a cooling fan. The connecting frame is fixedly connected to the top of the liquid cooling head, and the cooling fan is mounted on the top of the connecting frame. An adjustment component is provided on one side of the cooling fan. When the CPU motherboard temperature exceeds a set temperature, this invention utilizes an opening and closing control module to drive a second drive motor, which, in conjunction with gears, tooth segments, and a turntable, pushes a moving frame to move within the guide frame, causing the airflow guiding frame to automatically extend outward from the outer side of the housing to form an airflow guiding structure. Simultaneously, a lifting control module drives a first drive motor and a lead screw, causing the housing to move downward closer to the cooling fan, thereby significantly increasing the fan's air intake and further enhancing the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to the field of computer heat dissipation technology, specifically to a heat dissipation device with an openable and closable airflow guiding structure and its usage method. Background Technology

[0002] As the performance of central processing units (CPUs) continues to improve, their power consumption and heat generation are also increasing dramatically, placing higher demands on cooling systems. Currently, high-end computer systems commonly use water cooling solutions to cool the CPU core. However, traditional separate or all-in-one water cooling devices mainly rely on the water block to contact the CPU surface for heat exchange, and their heat dissipation range is limited to the top cover area of ​​the processor.

[0003] Under actual high-load operating conditions, the power supply modules on the CPU motherboard, such as capacitors, inductors, and MOSFETs, will also generate a huge amount of heat. Since these components are usually located around the water cooling block, the existing water cooling system cannot form an effective airflow coverage, resulting in severe heat accumulation in the power supply area. This local high temperature not only affects the stability and efficiency of the power supply, but also significantly shortens the lifespan of the core electronic components of the motherboard, causing system performance bottlenecks. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation device with an openable airflow structure and its usage method, in order to solve the problem mentioned in the background art that, under actual high-load operating conditions, the power supply modules on the CPU motherboard, such as capacitors, inductors, and MOSFETs, also generate huge amounts of heat. Since these components are usually arranged around the water cooling head, the existing water cooling system cannot form an effective airflow coverage, resulting in severe heat accumulation in the power supply area. This local high temperature not only affects the stability and efficiency of the power supply, but also significantly shortens the lifespan of the core electronic components of the motherboard, causing a system performance bottleneck.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation device with an openable and closable airflow guiding structure, comprising... A liquid cooling head, wherein two liquid cooling pipes are provided on the liquid cooling head, and a heat dissipation component is provided on the liquid cooling head, the heat dissipation component being used for auxiliary heat dissipation of the computer CPU motherboard; The heat dissipation assembly includes a connecting frame and a cooling fan. The connecting frame is fixedly connected to the top of the liquid cooling head, and the cooling fan is installed on the top of the connecting frame. An adjustment component is provided on one side of the cooling fan. The adjustment assembly includes a guide frame, a slide, and a fixing plate. The guide frame is fixedly connected to one side of the cooling fan. The slide is slidably connected to the inside of the guide frame. The fixing plate is fixedly connected to one end of the slide. A housing is fixedly connected to one side of the fixing plate. A connecting plate is fixedly connected to the inside of the housing above the fixing plate. A flow guiding assembly is provided on the fixing plate and the connecting plate. A control assembly is provided on the top of the housing.

[0006] Preferably, the guide frame has an internally threaded cylinder inside, and the slide has a guide hole inside, with the internally threaded cylinder inserted into the guide hole.

[0007] Preferably, a first drive motor is installed on the top side of the connecting plate, and a lead screw is fixedly connected to the output shaft of the first drive motor. One end of the lead screw passes through one side of the fixed plate and the connecting plate in sequence and is threadedly connected to the inside of the internal threaded cylinder.

[0008] Preferably, a bracket is installed on the inner side of one end of the carriage, and a first limit switch is installed on both the upper and lower ends of one side of the bracket.

[0009] Preferably, the flow guiding assembly includes a turntable, multiple connecting shafts, and multiple movable frames. The turntable is rotatably connected to the bottom side of the connecting plate. Multiple guide grooves are provided on one side of the turntable. The multiple connecting shafts are respectively inserted into the multiple guide grooves. One end of the multiple movable frames is fixedly connected to one end of the multiple connecting shafts. The other end of the multiple movable frames is fixedly connected to the flow guiding frame on the outside of the housing. The turntable is provided with toothed sections on its outer side. A drive assembly is provided on the top of the connecting plate.

[0010] Preferably, the drive assembly includes a second drive motor, which is mounted on the top of the connecting plate. The output shaft of the second drive motor passes through the top of the connecting plate and is fixedly connected to a gear, which is meshed with the outer side of the toothed section on the turntable.

[0011] Preferably, the turntable has an elongated groove on its outer side, and the bottom of the connecting plate above the turntable has two second limit switches, one of which has a button that abuts against the top of the turntable.

[0012] Preferably, the top of the fixed plate is provided with multiple guide frames, and the multiple movable frames are slidably connected to the interior of the multiple guide frames.

[0013] Preferably, the control component includes a mounting base, a display module, and a circuit board. The mounting base is installed on the top of the housing, the display module is installed on the top side of the mounting base, and the circuit board is installed on the bottom side of the mounting base. The circuit board is respectively provided with an opening and closing control module, a first limit switch module, a lifting control module, a second limit switch module, a connection module, and a fan power supply module. The electrical signal input terminal of the first limit switch module is connected to the electrical signal output terminals of the two second limit switches respectively, and the electrical signal output terminals of the opening and closing control module and the first limit switch module are connected to the electrical signal input terminal of the second drive motor respectively. The electrical signal input terminal of the second limit switch module is connected to the electrical signal output terminals of the two first limit switches respectively, and the electrical signal output terminals of the lifting control module and the second limit switch module are connected to the electrical signal input terminal of the first drive motor respectively. The electrical output terminal of the fan power supply module is connected to the electrical input terminal of the cooling fan, and the connection module is used for connecting the computer host.

[0014] The present invention also provides a method of using a heat dissipation device with an openable and closable airflow guiding structure, comprising the following steps: S1. When the CPU motherboard temperature is low, the cooling fan blows air onto the CPU motherboard, thereby directing the cool air to the CPU motherboard and dissipating heat from components such as capacitors and inductors that generate a lot of heat on the CPU motherboard. S2. When the CPU motherboard temperature exceeds the set temperature, the speed of the cooling fan is increased by controlling the cooling fan speed. At the same time, the output shaft of the second drive motor drives the gear to rotate. The gear drives the turntable to rotate through the tooth section. The turntable pushes the moving frame to move through the connecting shaft inside the multiple guide slots. The moving frame moves inside the guide frame and drives the flow guide frame to detach from the outside of the shell. At this time, multiple flow guide frames form a flow guide structure. S3. Then, the output shaft of the first drive motor drives the lead screw to rotate, so that the lead screw drives the slide to move inside the guide frame through the internal threaded cylinder. At this time, the slide drives the housing to move downward through the fixed plate, so that multiple guide frames form a guide structure close to one side of the cooling fan, which can increase the air intake of the cooling fan and enhance the heat dissipation effect.

[0015] Compared with the prior art, the present invention, employing the above technical solution, has the following technical effects: 1. This invention blows cool air directly onto the CPU motherboard through a cooling fan, which can effectively cool components such as capacitors and inductors, making up for the shortcomings of traditional water cooling which can only remove heat from the CPU, improving the overall heat dissipation efficiency of the board and protecting core components.

[0016] 2. When the CPU motherboard temperature exceeds the set temperature, the present invention can use the opening and closing control module to drive the second drive motor, which, in conjunction with the gears, tooth segments and turntable, pushes the moving frame to move inside the guide frame, so that the guide frame automatically extends out of the outer side of the shell to form a guide structure; at the same time, the lifting control module drives the first drive motor and the lead screw to move the shell down closer to the cooling fan, thereby significantly increasing the air intake of the fan and further enhancing the heat dissipation effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a partial cross-sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the mobile frame structure of the present invention; Figure 4 This is a schematic diagram of the guide frame structure of the present invention; Figure 5 This is a schematic diagram of the circuit board structure of the present invention; Figure 6 This is a schematic diagram of the second drive motor structure of the present invention; Figure 7 This is a schematic diagram of the turntable structure of the present invention; Figure 8 This is a schematic diagram of the carriage structure of the present invention; Figure 9 This is a schematic diagram of the unfolded structure of the air guide frame of the present invention.

[0019] Explanation of reference numerals in the attached drawings: 1. Liquid cooling head; 21. Connecting bracket; 22. Cooling fan; 23. Guide bracket; 24. Internal threaded cylinder; 25. Slide; 26. Guide hole; 27. Fixing plate; 28. Housing; 29. ​​Connecting plate; 210. First drive motor; 211. Lead screw; 212. First limit switch; 31. Turntable; 32. Guide groove; 33. Connecting shaft; 34. Moving frame; 35. Flow guide; 36. Toothed section; 37. Gear; 38. Second drive motor; 39. Long groove; 310. Second limit switch; 311. Guide bracket; 41. Fixing base; 42. Display module; 43. Circuit board; 44. Opening and closing control module; 45. First limit switch module; 46. Lifting control module; 47. Second limit switch module; 48. Connecting module; 49. Fan power supply module; 5. Liquid cooling pipe. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this application can produce, should still fall within the scope of the technical content disclosed in this application.

[0022] Example Please see Figure 1-9 The present invention provides a technical solution: a heat dissipation device with an openable and closable airflow guiding structure, including a liquid cooling head 1, two liquid cooling pipes 5 disposed on the liquid cooling head 1, and a heat dissipation component disposed on the liquid cooling head 1, the heat dissipation component being used for auxiliary heat dissipation of a computer CPU motherboard.

[0023] The heat dissipation assembly includes a connecting bracket 21 and a cooling fan 22. The connecting bracket 21 is fixedly connected to the top of the liquid cooling head 1, and the cooling fan 22 is installed on the top of the connecting bracket 21. When the cooling fan 22 is turned on, it blows air onto the CPU motherboard, thereby guiding the cool air to the CPU motherboard. This can dissipate heat from components such as capacitors and inductors on the CPU motherboard that generate a lot of heat, making up for the insufficiency of general water cooling which can only remove heat from the CPU. It can improve the efficiency of CPU motherboard heat dissipation and protect core components. An adjustment component is provided on one side of the cooling fan 22. By setting an adjustment component, the airflow guiding structure is made closer to one side of the cooling fan 22, which increases the air intake of the cooling fan 22 and thus enhances the heat dissipation effect. The adjustment component includes a guide frame 23, a slide 25, and a fixing plate 27. The guide frame 23 is fixedly connected to one side of the cooling fan 22, the slide 25 is slidably connected to the inside of the guide frame 23, and the fixing plate 27 is fixedly connected to one end of the slide 25. A housing 28 is fixedly connected to one side of the fixing plate 27, and a connecting plate 29 is fixedly connected to the inside of the housing 28 above the fixing plate 27. An internally threaded cylinder 24 is provided inside the guide frame 23, and a guide hole 26 is provided inside the slide 25. The internally threaded cylinder 24 is inserted into the guide hole. Inside 26, a first drive motor 210 is installed on the top side of the connecting plate 29. The output shaft of the first drive motor 210 is fixedly connected to a lead screw 211. One end of the lead screw 211 passes through one side of the fixed plate 27 and the connecting plate 29 and is threaded to the inside of the internal threaded cylinder 24. The output shaft of the first drive motor 210 drives the lead screw 211 to rotate, so that the lead screw 211 drives the slide 25 to move inside the guide frame 23 via the internal threaded cylinder 24. At this time, the slide 25 drives the housing 28 to move downward via the fixed plate 27, thereby driving the flow guiding structure to move. The fixed plate 27 and the connecting plate 29 are provided with flow guiding components, and the top of the housing 28 is provided with control components.

[0024] By setting up a flow guiding component and a drive component in cooperation, a flow guiding structure can be formed to increase airflow and improve heat dissipation efficiency. The flow guiding component includes a turntable 31, multiple connecting shafts 33, and multiple movable frames 34. The turntable 31 is rotatably connected to the bottom side of the connecting plate 29. Multiple guide grooves 32 are opened on one side of the turntable 31, and the multiple connecting shafts 33 are respectively inserted into the multiple guide grooves 32. One end of the multiple movable frames 34 is fixedly connected to one end of the multiple connecting shafts 33, and the other end of the multiple movable frames 34 is fixedly connected to a flow guiding frame 35 on the outside of the housing 28. Toothed sections 36 are provided on the outside of the turntable 31. Multiple guide frames 311 are provided on the top of the fixed plate 27, and the multiple movable frames 34 are slidably connected to the inside of the multiple guide frames 311. A drive assembly is provided on the top of the connecting plate 29. The drive assembly includes a second drive motor 38, which is mounted on the top of the connecting plate 29. The output shaft of the second drive motor 38 passes through the top of the connecting plate 29 and is fixedly connected to a gear 37. The gear 37 is meshed with the outer side of the tooth section 36 on the turntable 31. The output shaft of the second drive motor 38 drives the gear 37 to rotate, and the gear 37 drives the turntable 31 to rotate through the tooth section 36. The turntable 31 then pushes the moving frame 34 to move through the connecting shaft 33 inside the multiple guide grooves 32. The moving frame 34 moves inside the guide frame 311 and drives the flow guide frame 35 to disengage from the outer side of the housing 28. Then, the second drive motor 38 is controlled to stop running. At this time, the multiple flow guide frames 35 form a flow guide structure.

[0025] By setting up a control component, the start and stop of the first drive motor 210 and the second drive motor 38 can be controlled. The control component includes a mounting base 41, a display module 42, and a circuit board 43. The mounting base 41 is installed on the top of the housing 28, the display module 42 is installed on the top side of the mounting base 41 and can be used for data display, and the circuit board 43 is installed on the bottom side of the mounting base 41. The circuit board 43 is respectively provided with an opening and closing control module 44, a first limit switch module 45, a lifting control module 46, a second limit switch module 47, a connection module 48, and a fan power supply module 49. The opening and closing control module 44 on the circuit board 43 controls the second drive motor 38 to start, and the output shaft of the second drive motor 38 drives the gear 37 to rotate, so as to facilitate the opening and closing of the flow guide structure. The lifting control module 46 controls the first drive motor 210 to start, and the output shaft of the first drive motor 210 drives the lead screw 211 to rotate, so as to facilitate the adjustment of the position of the flow guide structure. A bracket is installed on the inner side of one end of the slide 25. First limit switches 212 are installed on the upper and lower ends of one side of the bracket. The slide 25 drives the housing 28 to move downward via the fixing plate 27. When the guide frame 23 abuts against the buttons of the two first limit switches 212, the second limit switch module 47 controls the first drive motor 210 to stop running. The outer side of the turntable 31 is provided with a long groove 39. The bottom of the connecting plate 29 is located above the turntable 31 and is provided with two second limit switches 310. The button of one of the second limit switches 310 abuts against the top of the turntable 31. When the turntable 31 moves above the other second limit switch 310 and presses the button, the other second limit switch 310 transmits an electrical signal to the first limit switch module 45, so that the first limit switch module 45 controls the second drive motor 38 to stop running. The electrical signal input terminal of the first limit switch module 45 is connected to the electrical signal output terminals of the two second limit switches 310 respectively. The electrical signal output terminals of the opening and closing control module 44 and the first limit switch module 45 are connected to the electrical signal input terminal of the second drive motor 38 respectively. The electrical signal input terminal of the second limit switch module 47 is connected to the electrical signal output terminals of the two first limit switches 212 respectively. The electrical signal output terminals of the lifting control module 46 and the second limit switch module 47 are connected to the electrical signal input terminals of the first drive motor 210 respectively. The electrical output terminal of the fan power supply module 49 is connected to the electrical input terminal of the cooling fan 22. The connection module 48 is used for connecting the computer host.

[0026] Working principle or structural principle: When the CPU motherboard temperature is low, the cooling fan 22 is activated and blows air onto the CPU motherboard, thereby guiding the cool air to the CPU motherboard, which can dissipate heat from components such as capacitors and inductors that generate a lot of heat on the CPU motherboard. This makes up for the insufficiency of general water cooling, which can only remove heat from the CPU, and can improve the heat dissipation efficiency of the CPU motherboard and protect core components. When the CPU motherboard temperature exceeds the set temperature, the speed of the cooling fan 22 is increased by controlling the opening and closing control module 44 on the circuit board 43. At the same time, the second drive motor 38 is started by controlling the opening and closing control module 44 on the circuit board 43. The output shaft of the second drive motor 38 drives the gear 37 to rotate. The gear 37 drives the turntable 31 to rotate through the tooth section 36. At this time, the button of one of the second limit switches 310 is disengaged from the top of the turntable 31 and moves into the interior of the long groove 39 and resets. The turntable 31 is then pushed by the connecting shaft 33 inside the multiple guide grooves 32 to move the moving frame 34. The moving frame 34 moves inside the guide frame 311 and drives the flow guide frame 35 to disengage from the outside of the housing 28. When the turntable 31 moves above another second limit switch 310 and presses the button, the other second limit switch 310 transmits an electrical signal to the first limit switch module 45, causing the first limit switch module 45 to control the second drive motor 38 to stop running. At this time, the multiple flow guide frames 35 form a flow guide structure. Then, the lifting control module 46 controls the first drive motor 210 to start. The output shaft of the first drive motor 210 drives the lead screw 211 to rotate, so that the lead screw 211 drives the slide 25 to move inside the guide frame 23 via the internal threaded cylinder 24. At this time, the slide 25 drives the housing 28 to move downward via the fixing plate 27. When the guide frame 23 touches the buttons of the two first limit switches 212, the second limit switch module 47 controls the first drive motor 210 to stop running, so that the multiple guide frames 35 form a guide structure close to one side of the cooling fan 22, which can increase the air intake of the cooling fan 22 and thus enhance the heat dissipation effect.

[0027] The present invention also provides a method of using a heat dissipation device with an openable and closable airflow guiding structure, comprising the following steps: S1. When the temperature of the CPU motherboard is low, the cooling fan 22 blows air onto the CPU motherboard, thereby directing the cool air to the CPU motherboard and dissipating heat from components such as capacitors and inductors that generate a lot of heat on the CPU motherboard. S2. When the CPU motherboard temperature exceeds the set temperature, the speed of the cooling fan 22 is increased by controlling it. At the same time, the output shaft of the second drive motor 38 drives the gear 37 to rotate. The gear 37 drives the turntable 31 to rotate through the tooth section 36. The turntable 31 then pushes the moving frame 34 to move through the connecting shaft 33 inside the multiple guide grooves 32. The moving frame 34 moves inside the guide frame 311 and drives the flow guide frame 35 to detach from the outside of the housing 28. At this time, the multiple flow guide frames 35 form a flow guide structure. S3. Then, the output shaft of the first drive motor 210 drives the lead screw 211 to rotate, so that the lead screw 211 drives the slide 25 to move inside the guide frame 23 via the internal threaded cylinder 24. At this time, the slide 25 drives the housing 28 to move downward via the fixed plate 27, so that multiple guide frames 35 form a guide structure close to one side of the cooling fan 22, which can increase the air intake of the cooling fan 22 and enhance the heat dissipation effect.

[0028] Those skilled in the art will understand that the features described in the various embodiments and / or claims of the present invention can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention can be combined or combined in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

Claims

1. A heat dissipation device with an openable and closable airflow guiding structure, characterized in that, include Liquid cooling head (1), two liquid cooling pipes (5) are provided on the liquid cooling head (1), and a heat dissipation component is provided on the liquid cooling head (1), the heat dissipation component is used for auxiliary heat dissipation of computer CPU motherboard; The heat dissipation assembly includes a connecting frame (21) and a cooling fan (22). The connecting frame (21) is fixedly connected to the top of the liquid cooling head (1), and the cooling fan (22) is installed on the top of the connecting frame (21). An adjustment component is provided on one side of the cooling fan (22). The adjustment assembly includes a guide frame (23), a slide (25), and a fixing plate (27). The guide frame (23) is fixedly connected to one side of the cooling fan (22). The slide (25) is slidably connected to the inside of the guide frame (23). The fixing plate (27) is fixedly connected to one end of the slide (25). A housing (28) is fixedly connected to one side of the fixing plate (27). A connecting plate (29) is fixedly connected to the inside of the housing (28) above the fixing plate (27). A flow guiding assembly is provided on the fixing plate (27) and the connecting plate (29). A control assembly is provided on the top of the housing (28).

2. The heat dissipation device with an openable and closable airflow guiding structure according to claim 1, characterized in that, The guide frame (23) is provided with an internal threaded cylinder (24), and the slide (25) is provided with a guide hole (26). The internal threaded cylinder (24) is inserted into the guide hole (26).

3. The heat dissipation device with an openable and closable airflow guiding structure according to claim 2, characterized in that, A first drive motor (210) is installed on the top side of the connecting plate (29). The output shaft of the first drive motor (210) is fixedly connected to a lead screw (211). One end of the lead screw (211) passes through one side of the fixed plate (27) and the connecting plate (29) and is threaded to the inside of the internal threaded cylinder (24).

4. The heat dissipation device with an openable and closable airflow guiding structure according to claim 3, characterized in that, A bracket is installed on the inner side of one end of the slide (25), and a first limit switch (212) is installed on the upper and lower ends of one side of the bracket.

5. The heat dissipation device with an openable and closable airflow guiding structure according to claim 4, characterized in that, The flow guiding assembly includes a turntable (31), multiple connecting shafts (33) and multiple movable frames (34). The turntable (31) is rotatably connected to the bottom side of the connecting plate (29). Multiple guide grooves (32) are provided on one side of the turntable (31). The multiple connecting shafts (33) are respectively inserted into the interior of the multiple guide grooves (32). One end of the multiple movable frames (34) is fixedly connected to one end of the multiple connecting shafts (33). The other end of the multiple movable frames (34) is fixedly connected to a flow guiding frame (35) on the outside of the housing (28). A toothed section (36) is provided on the outside of the turntable (31). A drive assembly is provided on the top of the connecting plate (29).

6. The heat dissipation device with an openable and closable airflow guiding structure according to claim 5, characterized in that, The drive assembly includes a second drive motor (38), which is mounted on the top of the connecting plate (29). The output shaft of the second drive motor (38) passes through the top of the connecting plate (29) and is fixedly connected to a gear (37). The gear (37) is meshed with the outer side of the tooth section (36) on the turntable (31).

7. The heat dissipation device with an openable and closable airflow guiding structure according to claim 5, characterized in that, The turntable (31) has a long groove (39) on its outer side. The bottom of the connecting plate (29) is located above the turntable (31) and has two second limit switches (310). One of the buttons of the second limit switch (310) is in contact with the top of the turntable (31).

8. The heat dissipation device with an openable and closable airflow guiding structure according to claim 5, characterized in that, The top of the fixed plate (27) is provided with multiple guide frames (311), and multiple movable frames (34) are slidably connected to the interior of the multiple guide frames (311).

9. The heat dissipation device with an openable and closable airflow guiding structure according to claim 6, characterized in that, The control components include a mounting base (41), a display module (42), and a circuit board (43). The mounting base (41) is installed on the top of the housing (28), the display module (42) is installed on the top side of the mounting base (41), and the circuit board (43) is installed on the bottom side of the mounting base (41). The circuit board (43) is respectively provided with an opening and closing control module (44), a first limit switch module (45), a lifting control module (46), a second limit switch module (47), a connection module (48), and a fan power supply module (49). The electrical signal input terminal of the first limit switch module (45) is connected to the electrical signal output terminals of the two second limit switches (310) respectively, and the electrical signal output terminals of the opening and closing control module (44) and the first limit switch module (45) are connected to the electrical signal input terminal of the second drive motor (38) respectively. The electrical signal input terminal of the second limit switch module (47) is connected to the electrical signal output terminals of the two first limit switches (212) respectively, and the electrical signal output terminals of the lifting control module (46) and the second limit switch module (47) are connected to the electrical signal input terminal of the first drive motor (210) respectively. The electrical output terminal of the fan power supply module (49) is connected to the electrical input terminal of the cooling fan (22), and the connection module (48) is used for connecting the computer host.

10. A method of using a heat dissipation device with an openable and closable airflow guiding structure according to any one of claims 1-9, characterized in that, Includes the following steps: S1. When the temperature of the CPU motherboard is low, the cooling fan (22) blows air onto the CPU motherboard, thereby directing the cold air to the CPU motherboard and cooling the components such as capacitors and inductors that generate a lot of heat on the CPU motherboard. S2. When the CPU motherboard temperature exceeds the set temperature, the speed of the cooling fan (22) is increased by controlling the speed of the cooling fan (22). At the same time, the output shaft of the second drive motor (38) drives the gear (37) to rotate. The gear (37) drives the turntable (31) to rotate through the tooth section (36). The turntable (31) then pushes the moving frame (34) to move through the connecting shaft (33) inside the multiple guide grooves (32). The moving frame (34) moves inside the guide frame (311) and drives the flow guide frame (35) to detach from the outside of the housing (28). At this time, the multiple flow guide frames (35) form a flow guide structure. S3. Then, the output shaft of the first drive motor (210) drives the lead screw (211) to rotate, so that the lead screw (211) drives the slide (25) to move inside the guide frame (23) through the internal threaded cylinder (24). At this time, the slide (25) drives the housing (28) to move downward through the fixed plate (27), so that multiple guide frames (35) form a guide structure close to one side of the cooling fan (22), which can increase the air intake of the cooling fan (22) and enhance the heat dissipation effect.

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