A chip handling and positioning device and method for eSIM chip personalization

Abstract

This invention relates to a chip handling and positioning device and method for eSIM chip personalization. The chip handling and positioning device includes a support, a handling module, and a linear motor module. The handling module includes a handling base, a handling mechanism, and a positioning mechanism. The handling mechanism includes a support, a suction nozzle, and a lifting drive mechanism for driving the suction nozzle to move up and down. The positioning mechanism includes a positioning seat with several sets of positioning slots at its bottom. A clearance hole for the suction nozzle to pass through is provided at the center of each positioning slot. Multiple sets of negative pressure suction ports are arranged evenly along the circumference of the clearance hole within each positioning slot. An air suction pipe communicating with the multiple sets of negative pressure suction ports is provided within the inner cavity of the positioning seat, and this air suction pipe is connected to a negative pressure device. The chip handling and positioning device of this invention can perform chip orientation correction while handling the chip, thereby improving the efficiency of chip handling and processing.

Description

Technical Field

[0001] This invention relates to the field of chip programming, and more specifically to a chip handling and positioning device and method for personalizing eSIM chips. Background Technology

[0002] Currently, chip programming equipment on the market typically integrates multiple functional modules to achieve fully automated processing of chips from feeding, programming to output. Specifically, it generally includes a feeding module, a receiving module, a chip programming module, and a handling mechanism. Some high-end equipment will also be equipped with an information identification module (used to identify and record information about the chips) and a defective product rejection module (used to screen and separate unqualified chips). All modules work together to form a complete chip programming production line.

[0003] In terms of equipment layout design, to accommodate the independent operation requirements of each functional module, multiple processing modules (material feeding, programming, receiving, marking, rejection, etc.) are typically distributed across different locations within the equipment. Furthermore, to achieve precise chip transfer between modules, each processing module is usually equipped with an independent chip handling mechanism. When transferring chips between different processing modules, they must move along a preset transport route. Therefore, the chip handling and positioning device becomes a core component in chip programming equipment that ensures production continuity.

[0004] Existing chip handling and positioning devices are typically equipped with several handling modules. A drive mechanism drives all handling modules to move synchronously, thereby transferring the chips from the feeding module to various processing modules such as the programming module and the information identification module. After programming is completed, the chips are collected by the receiving module or the defective chip rejection module separates the defective chips.

[0005] However, in actual chip handling, due to the small size and extremely high precision requirements of chips, precise positioning is essential to ensure accurate alignment with subsequent processing stations (such as pin alignment at the programming station and positioning mark alignment at the marking station). Existing positioning processes typically employ a "two-stage handling" method: a chip handling robot first removes the chip from the current processing module and moves it to a dedicated positioning mount. After the mount completes attitude correction and position positioning, the robot removes the chip from the mount and transfers it to the next chip processing station. While this positioning method ensures chip positioning accuracy, it adds extra steps and time to chip handling, extending the transfer cycle between processing modules and significantly reducing overall chip processing efficiency. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip handling and positioning device for eSIM chip personalization. The chip handling and positioning device can perform orientation correction on the chip while handling it, thereby greatly improving the handling and processing efficiency of the chip.

[0007] A second objective of this invention is to provide a chip handling and positioning method for the aforementioned chip handling and positioning device for eSIM chip personalization.

[0008] The technical solution of the present invention to solve the above-mentioned technical problems is:

[0009] A chip handling and positioning device for eSIM chip personalization includes a bracket, a handling module mounted on the bracket, and a linear motor module for driving the movement of the handling module. The handling module includes a handling base, a handling mechanism mounted on the handling base, and a positioning mechanism for positioning the chip handled by the handling mechanism.

[0010] The conveying mechanism includes a support, a suction nozzle mounted on the support, and a lifting drive mechanism for driving the suction nozzle to rise and fall.

[0011] The positioning mechanism includes a positioning seat mounted on a transport base. The bottom of the positioning seat is provided with several sets of positioning slots. A clearance hole for the suction nozzle to pass through is provided at the center of the positioning slot. The sidewall of the positioning slot forms a guide surface for guiding the chip's orientation. The bottom surface of the positioning slot is provided with multiple sets of negative pressure suction ports, which are evenly arranged along the circumference of the clearance hole. The inner cavity of the positioning seat is provided with a suction pipe that communicates with the multiple sets of negative pressure suction ports and is connected to a negative pressure device.

[0012] Preferably, the positioning seat is provided with an annular negative pressure chamber on the outside of each clearance hole, and the annular negative pressure chamber is coaxially arranged with the clearance hole; wherein, the multiple sets of negative pressure air inlets arranged on the outer ring of the clearance hole are all connected to the corresponding negative pressure chamber.

[0013] Preferably, the positioning seat is provided with an annular retaining ring in the negative pressure chamber; the annular retaining ring is coaxially arranged with the clearance hole, and the inner diameter of the annular retaining ring is the same as the inner diameter of the clearance hole; when the suction nozzle passes through the clearance hole, the outer wall of the suction nozzle fits against the inner wall of the annular retaining ring.

[0014] Preferably, the positioning groove is frustum-shaped, and the cross-sectional area of ​​the positioning groove gradually decreases from bottom to top.

[0015] Preferably, the positioning slots on the positioning seat are in multiple sets, and the dimensions of the multiple sets of positioning slots are different from each other; the transport seat is also provided with a linear drive component for driving the positioning seat to move so that the positioning slot of the corresponding size and specification moves to directly below the suction nozzle.

[0016] Preferably, there are two sets of conveying mechanisms, and correspondingly, there are also two sets of lifting mechanisms; the two sets of lifting mechanisms drive the two sets of conveying mechanisms to rise and fall respectively; wherein, the support is installed on the conveying seat through a vertical sliding mechanism; the lifting drive mechanism is used to drive the support to rise and fall.

[0017] Preferably, the linear motor module includes a stator in the shape of a linear guide rail and multiple movers that match the stator; the conveying module is in multiple sets, and the multiple sets of conveying modules are respectively installed on the multiple movers in the linear motor module.

[0018] A method for chip handling and positioning for eSIM chip personalization includes the following steps:

[0019] S1: The linear motor module drives the conveying module to move to the chip loading device, ensuring that the suction nozzle is directly above the chip to be conveyed;

[0020] S2: The lifting drive mechanism drives the suction nozzle to move downward, so that the suction nozzle passes through the clearance hole on the positioning seat and contacts the chip. The first negative pressure device connected to the suction nozzle works to form a first negative pressure at the suction nozzle. The suction force generated by the first negative pressure is used to adsorb the chip onto the suction nozzle.

[0021] S3: The lifting drive mechanism drives the suction nozzle to move upward; the second negative pressure device, which is connected to multiple sets of negative pressure air inlets, works to generate a second negative pressure at the multiple sets of negative pressure air inlets; after the lifting drive mechanism drives the suction nozzle and the chip on the suction nozzle to the first set position, the first negative pressure device stops working, and the chip is adsorbed by the suction force generated by the second negative pressure at the multiple sets of negative pressure air inlets; at the same time, the lifting drive mechanism drives the suction nozzle to rise to a position higher than the negative pressure air inlets; during this process, the guide surface in the positioning groove guides and positions the chip until the upper surface of the chip contacts the bottom surface of the positioning groove;

[0022] S4: The linear motor module drives the transport module to the chip processing device. During this process, the lifting drive mechanism drives the suction nozzle to move downward. When the suction nozzle moves downward to the second set position, the first negative pressure device works, and at the same time, the second negative pressure device stops working. The suction force generated by the first negative pressure at the suction nozzle adsorbs the chip to the bottom surface of the positioning groove. The lifting drive mechanism continues to drive the suction nozzle to move downward. When the suction nozzle contacts the chip, the suction nozzle drives the chip downward to the processing station of the chip processing device.

[0023] Preferably, in step S3, the first set position is a position where the suction force generated by the second negative pressure in the negative pressure air intake is greater than or equal to the weight of the chip.

[0024] Preferably, in step S4, the second set position is a position where the suction force generated by the second negative pressure in the nozzle is greater than or equal to the weight of the chip.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] 1. This invention integrates a positioning seat into the interior of the transport module, and a positioning groove is provided within the positioning seat. During operation, the lifting drive mechanism drives the suction nozzle and the chip adsorbed by the suction nozzle to move upward. At the same time, the second negative pressure device connected to multiple sets of negative pressure suction ports is activated, creating a second negative pressure at the negative pressure suction ports. When the lifting drive mechanism drives the suction nozzle and chip to the first set position, the first negative pressure device stops operating, and the suction nozzle releases its adsorption on the chip. At this time, the suction force generated by the second negative pressure formed by the negative pressure suction ports drives the chip to continue to move upward (at this time, the chip is in a floating state). During the upward movement of the chip, the chip is guided and limited by the guide surface (e.g., the inner wall surface) on the positioning groove, and the attitude correction and position positioning of the chip are completed simultaneously.

[0027] 2. The chip handling and positioning device for eSIM chip personalization of the present invention can complete the positioning operation simultaneously during chip handling, without the need to transfer the chip to an external positioning base for secondary positioning. This can effectively simplify the operation process and greatly improve chip handling efficiency and overall processing efficiency. Attached Figure Description

[0028] Figure 1 and Figure 2 These are two perspective views of the chip handling and positioning device for eSIM chip personalization according to the present invention.

[0029] Figure 3 and Figure 4 These are two 3D views of the transport module from different perspectives.

[0030] Figure 5 and Figure 6 These are two perspective views of the positioning seat in the first specific embodiment.

[0031] Figure 7 This is a 3D view of the positioning groove.

[0032] Figure 8 This is a cross-sectional view of the positioning seat.

[0033] Figure 9 This is a schematic diagram of the internal structure of the positioning seat.

[0034] Figure 10 This is a schematic diagram before chip positioning.

[0035] Figure 11 This is a schematic diagram after the chip has been positioned.

[0036] Figure 12 and Figure 13 These are two perspective views of the positioning mechanism in the second specific embodiment. Detailed Implementation

[0037] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0038] Example 1

[0039] See Figures 1-11 The chip handling and positioning device for eSIM chip personalization of the present invention includes a bracket, a handling module 3 disposed on the bracket, and a linear motor module 2 for driving the movement of the handling module 3.

[0040] See Figures 1-11 The transport module 3 consists of multiple sets, which are installed on multiple movers of the linear motor module 2. Each set of transport module 3 includes a transport base 7, a transport mechanism disposed on the transport base 7, and a positioning mechanism for positioning the chip 14 transported by the transport mechanism.

[0041] See Figures 1-11 The conveying mechanism includes a support 8, a suction nozzle 4 mounted on the support 8, and a lifting drive mechanism 6 for driving the suction nozzle 4 to rise and fall. There are two sets of conveying mechanisms, and correspondingly, there are also two sets of lifting drive mechanisms 6. The two sets of lifting drive mechanisms 6 drive the two sets of conveying mechanisms to rise and fall respectively. The support 8 is mounted on the conveying seat 7 via a vertical sliding mechanism. The lifting drive mechanism 6 drives the support 8 to rise and fall, and this lifting drive mechanism 6 adopts a driving method combining a motor and a synchronous belt transmission mechanism. The vertical sliding mechanism adopts a combination of a slider and a slide rail.

[0042] In addition, in this embodiment, a rotary drive mechanism 5 for driving the nozzle 4 to rotate can be provided, such as a rotary cylinder or a rotary motor. By driving the nozzle 4 to rotate through the rotary drive mechanism 5, the attitude of the chip can be pre-adjusted.

[0043] See Figures 1-11The linear motor module 2 includes a stator in the shape of a linear guide rail and multiple movers matched with the stator. In this embodiment, there are four groups of movers, each group of movers is equipped with one or two sets of transport modules 3; wherein, in this embodiment, the transport modules 3 on three groups of movers are all one set, and the transport modules 3 on the other group of movers are two sets. By using the linear motor module 2 to drive multiple movers to move on the stator, and each mover is equipped with a transport module 3, each transport module 3 can move independently, without waiting for the chip processing device with the longest processing time to complete processing before driving multiple transport modules 3 to move at the same time, thereby greatly improving the chip transport efficiency and thus improving the chip programming efficiency.

[0044] In addition, the linear motor module 2 can be implemented with reference to the specific structure of the "multi-movement linear motor module" disclosed in the utility model patent with authorization announcement number CN221614819U, and the principle can also be implemented with reference to it.

[0045] See Figures 1-11 The positioning mechanism includes a positioning seat 9 mounted on a transport seat 7. The bottom of the positioning seat 9 is provided with several sets of positioning grooves 11. Each positioning groove 11 is frustum-shaped, with its cross-sectional area gradually decreasing from bottom to top. The inner wall of the positioning groove 11 forms the guiding surface, used to guide and limit the chip 14. A clearance hole 13 is provided at the center of the positioning groove 11 for the suction nozzle 4 to pass through. Multiple sets of negative pressure suction ports 12 are provided within the positioning groove 11, evenly arranged along the circumference of the clearance hole 13. An annular negative pressure cavity is provided outside each clearance hole 13 of the positioning seat 9, coaxially arranged with the clearance hole 13. Each set of negative pressure suction ports 12 located on the outer ring of the clearance hole 13 communicates with its corresponding negative pressure cavity. An air suction pipe 10, communicating with the negative pressure cavity, is provided inside the positioning seat 9, and the air suction pipe 10 is connected to the negative pressure device.

[0046] Furthermore, the positioning seat 9 is provided with an annular retaining ring 15 inside the negative pressure chamber; the annular retaining ring 15 is coaxially arranged with the clearance hole 13, and the inner diameter of the annular retaining ring 15 is the same as the inner diameter of the clearance hole 13; when the suction nozzle 4 passes through the clearance hole 13, the outer wall of the suction nozzle 4 fits against the inner wall of the annular retaining ring 15, and there is no gap at the fitting position, i.e., a sealed connection. Thus, when the linear motor module 2 drives the conveying module 3 to move to the chip processing device, the lifting drive mechanism 6 drives the suction nozzle 4 to move downward. When the suction nozzle 4 moves downward to the second set position (the second... When the position is set at a location where the suction force generated by the second negative pressure in the suction nozzle 4 is greater than or equal to the weight of the chip, the first negative pressure device operates, and at the same time, the second negative pressure device stops operating, so that a negative pressure cavity is formed in the area of ​​the annular retaining ring 15 located below the suction nozzle 4. The suction force generated by the first negative pressure at the suction nozzle 4 adsorbs the chip to the bottom surface of the positioning groove 11. Subsequently, the lifting drive mechanism 6 continues to drive the suction nozzle 4 to continue to move downward. When the suction nozzle 4 contacts the chip, the suction nozzle 4 drives the chip downward to the processing station of the chip processing device.

[0047] See Figures 1-11 The chip handling and positioning method of the present invention includes the following steps:

[0048] S1: The linear motor module 2 drives the conveying module 3 to move to the chip loading device 1, and ensures that the suction nozzle 4 is directly above the chip 14 to be conveyed;

[0049] S2: The lifting drive mechanism 6 drives the suction nozzle 4 to move downward, so that the suction nozzle 4 passes through the clearance hole 13 on the positioning seat 9 and contacts the chip 14. The first negative pressure device connected to the suction nozzle 4 works, forming a first negative pressure at the suction nozzle 4. The suction force generated by the first negative pressure is used to adsorb the chip 14 onto the suction nozzle 4.

[0050] S3: The lifting drive mechanism 6 drives the suction nozzle 4 to move upward; the second negative pressure device, which is connected to multiple sets of negative pressure suction ports 12, works to generate a second negative pressure at the multiple sets of negative pressure suction ports 12; after the lifting drive mechanism 6 drives the suction nozzle 4 and the chip 14 on the suction nozzle 4 to a first set position (the first set position is the position where the suction force generated by the second negative pressure in the negative pressure suction port 12 is greater than or equal to the weight of the chip), the first negative pressure device stops working, and the chip 14 is adsorbed by the suction force generated by the second negative pressure at the multiple sets of negative pressure suction ports 12; at the same time, the lifting drive mechanism 6 drives the suction nozzle 4 to rise to a position higher than the negative pressure suction port 12; during this process, the inner wall of the positioning groove 11 guides and positions the chip 14 until the upper surface of the chip 14 contacts the bottom surface of the positioning groove 11;

[0051] S4: The linear motor module 2 drives the transport module 3 to move to the chip processing device. During this process, the lifting drive mechanism 6 drives the suction nozzle 4 to move downward. When the suction nozzle 4 moves downward to the second set position (the second set position is the position where the suction force generated by the second negative pressure in the suction nozzle 4 is greater than or equal to the weight of the chip 14), the first negative pressure device works, and at the same time, the second negative pressure device stops working. The suction force generated by the first negative pressure at the suction nozzle 4 adsorbs the chip 14 to the bottom surface of the positioning groove 11. The lifting drive mechanism 6 continues to drive the suction nozzle 4 to continue to move downward. When the suction nozzle 4 contacts the chip 14, the suction nozzle 4 drives the chip 14 downward to the processing station of the chip processing device.

[0052] Example 2

[0053] See Figure 12 and Figure 13 The difference between this embodiment and embodiment 1 is that the positioning slots 11 on the positioning seat 9 are in multiple sets, and the dimensions of the multiple sets of positioning slots 11 are different. This embodiment has three sets of positioning slots with different dimensions, namely 2×2mm, 3×3mm, and 5×6mm. The transport seat 7 is also provided with a linear drive component 16 for driving the positioning seat 9 to move so that the positioning slots 11 of the corresponding dimensions move directly below the corresponding suction nozzle 4. The positioning seat 9 can be slidably connected to the support through a sliding mechanism (such as a slide rail and a slider). The positioning seat 9 is driven to move by the linear drive component 16 (such as a linear motor), thereby causing the positioning slots 11 of different dimensions to move directly below the corresponding suction nozzle 4, thus completing the positioning and transport of different types of chips 14.

[0054] The above are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above content. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A chip handling and positioning device for eSIM chip personalization, characterized in that, The device includes a support, a transport module mounted on the support, and a linear motor module for driving the transport module. The transport module includes a transport base, a transport mechanism mounted on the transport base, and a positioning mechanism for positioning the chip transported by the transport mechanism. The conveying mechanism includes a support, a suction nozzle mounted on the support, and a lifting drive mechanism for driving the suction nozzle to rise and fall. The positioning mechanism includes a positioning seat mounted on a transport base. The bottom of the positioning seat is provided with several sets of positioning slots. A clearance hole for the suction nozzle to pass through is provided at the center of the positioning slot. The sidewall of the positioning slot forms a guide surface for guiding the chip's orientation. The bottom surface of the positioning slot is provided with multiple sets of negative pressure suction ports, which are evenly arranged along the circumference of the clearance hole. The inner cavity of the positioning seat is provided with a suction pipe that communicates with the multiple sets of negative pressure suction ports and is connected to a negative pressure device.

2. The chip handling and positioning device for eSIM chip personalization according to claim 1, characterized in that, The positioning seat is provided with an annular negative pressure chamber on the outside of each clearance hole, and the annular negative pressure chamber is coaxially arranged with the clearance hole; wherein, the multiple sets of negative pressure air inlets arranged on the outer ring of the clearance hole are all connected to the corresponding negative pressure chamber.

3. The chip handling and positioning device for eSIM chip personalization according to claim 2, characterized in that, The positioning seat is provided with an annular retaining ring in the negative pressure chamber; the annular retaining ring is coaxially arranged with the clearance hole, and the inner diameter of the annular retaining ring is the same as the inner diameter of the clearance hole; when the suction nozzle passes through the clearance hole, the outer wall of the suction nozzle fits against the inner wall of the annular retaining ring.

4. The chip handling and positioning device for eSIM chip personalization according to claim 1, characterized in that, The positioning groove is frustum-shaped, and its cross-sectional area gradually decreases from bottom to top.

5. The chip handling and positioning device for eSIM chip personalization according to claim 1, characterized in that, The positioning seat has multiple sets of positioning slots, and the dimensions of the multiple sets of positioning slots are different from each other; the transport seat is also provided with a linear drive component for driving the positioning seat to move so that the positioning slot of the corresponding size and specification moves to directly below the suction nozzle.

6. The chip handling and positioning device for eSIM chip personalization according to claim 1, characterized in that, The transport mechanism consists of two sets, and correspondingly, the lifting mechanism also consists of two sets; the two sets of lifting mechanisms drive the two sets of transport mechanisms to rise and fall respectively; wherein, the support is installed on the transport seat through a vertical sliding mechanism; the lifting drive mechanism is used to drive the support to rise and fall.

7. The chip handling and positioning device for eSIM chip personalization according to claim 1, characterized in that, The linear motor module includes a stator in the shape of a linear guide rail and multiple movers that match the stator; the conveying module is in multiple sets, and the multiple sets of conveying modules are respectively installed on the multiple movers in the linear motor module.

8. A chip handling and positioning method for eSIM chip personalization, characterized in that, Includes the following steps: S1: The linear motor module drives the conveying module to move to the chip loading device, ensuring that the suction nozzle is directly above the chip to be conveyed; S2: The lifting drive mechanism drives the suction nozzle to move downward, so that the suction nozzle passes through the clearance hole on the positioning seat and contacts the chip. The first negative pressure device connected to the suction nozzle works to form a first negative pressure at the suction nozzle. The suction force generated by the first negative pressure is used to adsorb the chip onto the suction nozzle. S3: The lifting drive mechanism drives the suction nozzle to move upward; the second negative pressure device, which is connected to multiple sets of negative pressure air inlets, works to generate a second negative pressure at the multiple sets of negative pressure air inlets; after the lifting drive mechanism drives the suction nozzle and the chip on the suction nozzle to the first set position, the first negative pressure device stops working, and the chip is adsorbed by the suction force generated by the second negative pressure at the multiple sets of negative pressure air inlets; at the same time, the lifting drive mechanism drives the suction nozzle to rise to a position higher than the negative pressure air inlets; during this process, the guide surface in the positioning groove guides and positions the chip until the upper surface of the chip contacts the bottom surface of the positioning groove; S4: The linear motor module drives the transport module to the chip processing device. During this process, the lifting drive mechanism drives the suction nozzle to move downward. When the suction nozzle moves downward to the second set position, the first negative pressure device works, and at the same time, the second negative pressure device stops working. The suction force generated by the first negative pressure at the suction nozzle adsorbs the chip to the bottom surface of the positioning groove. The lifting drive mechanism continues to drive the suction nozzle to move downward. When the suction nozzle contacts the chip, the suction nozzle drives the chip downward to the processing station of the chip processing device.

9. The chip handling and positioning method for eSIM chip personalization according to claim 8, characterized in that, In step S3, the first set position is the position where the suction force generated by the second negative pressure in the negative pressure air intake is greater than or equal to the weight of the chip.

10. The chip handling and positioning method for eSIM chip personalization according to claim 8, characterized in that, In step S4, the second set position is the position where the suction force generated by the second negative pressure in the nozzle is greater than or equal to the weight of the chip.

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