A method, apparatus, equipment, medium, and product for thermal-fluid coupled topology optimization.

Abstract

This application discloses a method, apparatus, equipment, medium, and product for thermal-fluid coupled topology optimization, relating to the field of thermal-fluid coupled topology optimization. The method includes: constructing a geometric model of a composite material autoclave molding frame mold; filling the temperature equalization holes and ventilation holes on the supporting frame of the geometric model to obtain a thermal-fluid coupled topology optimization geometric model; meshing the geometric model, setting governing equations and boundary conditions, and using the filled supporting frame as the design domain and the mold plate as the non-design domain, with the maximum average temperature of the mold plate surface as the optimization objective, and the fluid volume fraction and energy dissipation generated by fluid flow as constraints, to obtain a thermal-fluid coupled topology optimization finite element model; performing finite element analysis on the finite element model to obtain the thermal-fluid coupled topology optimization results. This application can improve the temperature uniformity of the mold while ensuring its rigidity and strength.

Description

Technical Field

[0001] This application relates to the field of thermal-fluid coupled topology optimization, and in particular to a thermal-fluid coupled topology optimization method, apparatus, equipment, medium and product. Background Technology

[0002] Composite materials possess advantages such as high specific strength, specific modulus, and structural designability; however, their final cured quality is highly sensitive to the temperature field during molding. Autoclave molding is currently an important method for fabricating composite components in the aerospace field. Frame molds are the main tooling for autoclave molding, with large-curvature frame molds typically used for molding curved panels on composite fuselages. Under forced convection heating conditions in the autoclave, the hot gas flow first undergoes convective heat transfer with auxiliary materials and the frame mold, while the temperature rise of the composite component mainly depends on the heat conduction of the auxiliary materials (absorbent felt, breathable felt, vacuum bags, etc.) and the surface of the frame mold.

[0003] To ensure the geometric accuracy of composite material components, frame molds typically require numerous support plates to guarantee mold rigidity. However, although these support plates often incorporate temperature equalization holes and ventilation holes to create airflow channels, the complex support frame often results in uneven flow velocity distribution within these channels. Locally lower flow velocities lead to reduced local convective heat transfer intensity and uneven spatial distribution, causing temperature variations across the mold surface. This further contributes to uneven temperature distribution in the composite material components, resulting in asynchronous curing and ultimately reduced component quality. Therefore, designing a reasonable mold structure and creating suitable airflow channels to improve the temperature uniformity of the frame mold surface is crucial for enhancing the curing quality of composite material components. The temperature uniformity of frame molds used in autoclave molding of composite materials significantly impacts the molding quality. However, some existing optimization methods suffer from issues such as indirectly improving mold temperature uniformity through empirical design and sacrificing rigidity design parameters to enhance temperature uniformity. Therefore, a heat-fluid coupling topology optimization method is urgently needed to improve mold temperature uniformity while ensuring mold rigidity. Summary of the Invention

[0004] The purpose of this application is to provide a thermal-fluid coupling topology optimization method, apparatus, equipment, medium, and product that can improve the temperature uniformity of the mold while ensuring the rigidity of the mold.

[0005] To achieve the above objectives, this application provides the following solution: In a first aspect, this application provides a thermal-fluid coupling topology optimization method, including: A geometric model of a composite material autoclave molding frame mold is constructed; the geometric model includes a mold plate and a support frame, the support frame being used to support the mold plate, and the support frame having temperature equalization holes and ventilation holes.

[0006] The temperature equalization holes and ventilation holes on the support frame in the geometric model are filled to obtain the thermal-fluid coupling topology optimization geometric model.

[0007] The thermal-fluid coupled topology optimization geometric model is meshed, and the governing equations and boundary conditions are set. The filled support frame in the thermal-fluid coupled topology optimization geometric model is taken as the design domain, and the plate is taken as the non-design domain. The optimization objective is to maximize the average temperature of the plate surface, and the volume fraction of fluid and the energy dissipation generated by fluid flow are used as constraints to construct a thermal-fluid coupled topology optimization finite element model.

[0008] Finite element analysis was performed on the finite element model of thermal-fluid coupling topology optimization to obtain the results of thermal-fluid coupling topology optimization.

[0009] Secondly, this application provides a thermal-fluid coupling topology optimization device, comprising: A geometric model construction module is used to construct the geometric model of a composite material autoclave molding frame mold; the geometric model includes a template and a support frame, the support frame is used to support the template, and the support frame has temperature equalization holes and ventilation holes.

[0010] The geometric model construction module is used to fill the temperature equalization holes and ventilation holes opened on the support frame in the geometric model to obtain a thermal-fluid coupling topology optimization geometric model.

[0011] The finite element model construction module is used to mesh the thermal-fluid coupled topology optimization geometric model, set the governing equations and boundary conditions, and use the filled support frame in the thermal-fluid coupled topology optimization geometric model as the design domain and the plate as the non-design domain. The optimization objective is to maximize the average temperature of the plate surface, and the constraints are the volume fraction of the fluid and the energy dissipation generated by the fluid flow.

[0012] The finite element analysis module is used to perform finite element analysis on the finite element model of thermal-fluid coupling topology optimization and obtain the thermal-fluid coupling topology optimization results.

[0013] Thirdly, this application provides a computer device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the thermal-fluid coupling topology optimization method described above.

[0014] Fourthly, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the aforementioned thermal-fluid coupling topology optimization method.

[0015] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the above-described thermal-fluid coupling topology optimization method.

[0016] According to the specific embodiments provided in this application, this application has the following technical effects: This application provides a thermal-fluid coupling topology optimization method, apparatus, equipment, medium, and product. By constraining the fluid volume fraction and the energy dissipation generated by fluid flow, this application conducts thermal-fluid coupling topology optimization of the mold with the goal of improving the average temperature of the mold plate surface. This results in a novel frame mold structure with a rectifier plate, which retains the original mold support frame structure, ensuring that the rigidity of the frame mold remains unchanged, and improving the temperature uniformity of the mold while ensuring the rigidity of the mold. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating a thermal-fluid coupling topology optimization method provided in an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the geometric model structure of the frame mold in the embodiments of this application.

[0020] Figure 3 This is a schematic diagram of the thermal-fluid coupling topology optimization geometric model of the frame mold in this application embodiment.

[0021] Figure 4 This is a schematic diagram of the thermal-fluid coupling topology optimization finite element model of the frame mold in this application embodiment.

[0022] Figure 5 This is a schematic diagram of the thermal-fluid coupling topology optimization result of the frame mold in the embodiment of this application.

[0023] Figure 6 This is a schematic diagram of the reconstructed model structure of the frame mold in the embodiments of this application.

[0024] Figure 7This is a schematic diagram of a finite volume mesh model for calculating the temperature field of the autoclave-frame mold coupling model in the embodiments of this application.

[0025] Figure 8 This is a schematic diagram of the temperature field calculation model of the autoclave-frame mold coupling model in the embodiments of this application.

[0026] Figure 9 This is a schematic diagram of the functional modules of a thermal flux coupling topology optimization device provided in an embodiment of this application.

[0027] Figure 10 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application.

[0028] Reference numerals: 1-Model plate, 2-Support frame, 3-Equalizing hole, 4-Ventilation hole, 5-Support frame after filling, 6-Autoclave inlet, 7-Autoclave outlet, 8-Autoclave wall. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Currently, there are several methods for optimizing the temperature field of composite material autoclave frame molds: First, by adding heat-conducting fins with high thermal conductivity in the low-temperature region of the mold, the convective heat transfer efficiency between the mold and the hot airflow is improved, reducing the temperature gradient of the mold. However, this empirical design significantly increases auxiliary structures, making installation difficult, and it cannot achieve global optimization, resulting in limited improvement in temperature uniformity. Second, a genetic algorithm is used to parameterize the mold's geometric features to optimize the mold structure, effectively improving the temperature uniformity. However, this method is sensitive to parameter selection and has a high degree of randomness; furthermore, it does not consider the impact of parameter changes on mold stiffness. Third, a stiffness-based topology optimization method is used, taking mold stiffness as the objective function and indirectly improving mold temperature uniformity by constraining the volume fraction of the support plate to change the shape and size of the ventilation holes. However, this structural topology optimization method cannot directly use temperature uniformity as the objective function, belonging to a semi-empirical design, making it difficult to guarantee the positive impact of the optimization results on temperature uniformity. Furthermore, the optimized structure is usually complex and difficult to manufacture. Based on this, this application provides a heat-fluid coupling topology optimization method. In an exemplary embodiment, such as... Figure 1 As shown, a heat-fluid coupling topology optimization method is provided, including: Step 201: Construct the geometric model of the composite material autoclave molding frame mold; the geometric model includes a mold plate and a support frame, the support frame being used to support the mold plate, and the support frame having temperature equalization holes and ventilation holes. The mold plate is a large curvature mold plate, and the support plates of the support frame are distributed intersectingly along the length and width directions.

[0032] Step 202: Fill the temperature equalization holes and ventilation holes opened on the support frame in the geometric model to obtain the thermal-fluid coupling topology optimization geometric model.

[0033] Step 203: Mesh the thermal-fluid coupled topology optimization geometric model, set the governing equations and boundary conditions, and take the filled support frame in the thermal-fluid coupled topology optimization geometric model as the design domain and the plate as the non-design domain. Take the maximum average temperature of the plate surface as the optimization objective, and take the volume fraction of fluid and the energy dissipation generated by fluid flow as constraints to construct a thermal-fluid coupled topology optimization finite element model.

[0034] Step 204: Perform finite element analysis on the thermal-fluid coupled topology optimization finite element model to obtain the thermal-fluid coupled topology optimization results.

[0035] In another exemplary embodiment of this application, after performing finite element analysis on the thermal-fluid coupling topology optimization finite element model to obtain the thermal-fluid coupling topology optimization result, the method further includes: reconstructing the geometric model based on the thermal-fluid coupling topology optimization result to obtain a reconstructed geometric model; and manufacturing a composite material autoclave molding frame mold based on the reconstructed geometric model.

[0036] In practical applications, step 203 specifically involves: dividing the thermal-fluid coupled topology optimization geometric model into a finite element hexahedral mesh; using the mold plate as the non-design domain for topology optimization and the filled support frame as the design domain for topology optimization; selecting the average temperature of the mold plate surface as the optimization objective, and selecting the energy dissipation generated by fluid flow and the fluid volume fraction in the filled support frame region as constraints; setting boundary conditions based on the fluid flow and temperature distribution during the heating process of the frame mold; and finally performing thermal-fluid coupled topology optimization.

[0037] In another exemplary embodiment of this application, the governing equations are: the Navier-Stokes equations and the energy conservation equations.

[0038] In another exemplary embodiment of this application, the boundary conditions include: boundary conditions of the inlet of the composite material autoclave molding frame mold, boundary conditions of the outlet, boundary conditions of the template, and boundary conditions of the remaining outer wall surfaces of the mold. Setting the boundary conditions specifically includes: given the temperature and velocity of the inlet of the composite material autoclave molding frame mold, obtaining the boundary conditions of the inlet of the composite material autoclave molding frame mold.

[0039] The wall condition of the outlet of the composite material autoclave molding frame mold is set to be adiabatic, i.e. the heat flux is zero, and the pressure of the outlet of the composite material autoclave molding frame mold is given to obtain the boundary condition of the outlet of the composite material autoclave molding frame mold.

[0040] Given the heat source distribution of the composite material autoclave molding frame mold plate, the boundary conditions of the composite material autoclave molding frame mold plate are obtained.

[0041] Given the flow velocity and heat flux of the outer wall surface of the composite material autoclave molding frame mold, excluding the outer wall surface corresponding to the mold inlet and outlet, the boundary conditions of the remaining outer wall surface of the mold are obtained.

[0042] In another exemplary embodiment of this application, the pressure at the outlet is 0.

[0043] In another exemplary embodiment of this application, the temperature equalization hole is semi-circular.

[0044] This application also provides a more specific embodiment, which details the above-described heat-fluid coupling topology optimization method, specifically including: S1, as... Figure 2As shown, a geometric model of a composite material autoclave molding frame mold is created.

[0045] The geometric model provided in this application mainly consists of a mold plate 1 and a support frame 2. The support frame 2 is composed of multiple support plates that are evenly distributed in a cross pattern along the length and width of the frame mold. Semi-circular temperature equalization holes 3 and ventilation holes 4 are opened on the support frame 2.

[0046] S2, such as Figure 3 As shown, a thermal-fluid coupled topology optimization geometric model is created.

[0047] The thermal-fluid coupling topology optimization geometric model consists of two parts: a template 1 and a filled support frame 5. The template 1 in S1 is kept unchanged, and all holes in the envelope of the region where the support frame 2 is located are filled to obtain the filled support frame 5.

[0048] S3, such as Figure 4 As shown, a thermal-fluid coupled topology optimization finite element model is created.

[0049] Finite element hexahedral meshes were generated for the thermal-fluid coupling topology optimization geometric model in S2; plate 1 was used as the non-design domain for topology optimization, and the filled support frame 5 was used as the design domain for topology optimization. The governing equations, boundary conditions, optimization objectives, and constraints were determined based on the working environment and design requirements of the mold.

[0050] The mold is placed in an autoclave, and the main heat transfer mechanisms are forced convection and heat conduction. Due to the obstruction of the mold support frame 1, the flow velocity distribution within the channel is often uneven, resulting in uneven spatial distribution of convective heat transfer intensity and thus causing temperature distribution differences on the mold surface. This application focuses on optimizing the temperature uniformity of the mold during the heating stage, using the Navier-Stokes equation and energy conservation equation to control the flow and heat transfer performance of the mold. Maximizing the average temperature of the mold plate 1 surface is selected as the optimization objective, and convergence is considered when the change in the objective function value is less than 1%. To ensure the engineering feasibility of the optimized structure, the energy dissipation generated by the fluid flow needs to be used as a constraint. During the optimization process, the fluid volume fraction in the filled support frame 5 region also needs to be constrained.

[0051] In addition, the boundary conditions for the governing equations of this finite element model are set as follows: 1) The mold inlet is set as a velocity inlet with a given temperature (453K) and velocity (0.1m / s); the outlet is set as a pressure outlet with a given heat flux and pressure of zero.

[0052] 2) The mold plate has a non-uniformly distributed heat source. The heat source gradually decreases along the length of the mold. The mold plate is divided by the support frame, and there are non-uniform heat sources Q1:Q2:Q3:Q4:Q5:Q6:Q7=1:2:3:4:5:6:7; where Q1=1e8W / m 3 .

[0053] 3) The remaining boundaries of the mold are set to no slip and no thermal insulation boundary conditions, that is, the flow rate and heat flux are both zero.

[0054] S4. After passing through S1 to S3, the thermal-fluid coupling topology optimization result of the frame mold is as follows: Figure 5 As shown, the optimized airflow channel configuration is obtained, and the reconstructed model is obtained based on the optimization results. Figure 6 As shown, based on the obtained optimized airflow channel configuration, a novel frame-type mold structure with a "rectifier plate" is proposed. The innovation of this mold lies in stretching the dividing lines in the optimized airflow channel along the thickness direction to form a thin-walled "rectifier plate". The "rectifier plate" can be obtained by 3D printing using low-density and low-specific-heat-capacity materials.

[0055] S5. Compare the temperature uniformity of the original mold and the optimized mold during the heating stage in the autoclave.

[0056] 1) Create a mesh model of the autoclave-frame mold coupling.

[0057] like Figure 7 As shown, the commercial finite element software Fluent was used to calculate the temperature field of the frame mold. First, the finite element preprocessing software HyperMesh was used to mesh the surface of the autoclave-frame mold coupled model. The model surface mesh was divided into five parts: inlet, outlet, autoclave wall, mold surface, and other mold structures. Then, the Meshing module in Fluent was used to mesh the volume, dividing the model into solid and fluid regions. The Body of Influence (BOI) method was used to locally refine the mesh in the vicinity of the frame mold to improve the calculation accuracy.

[0058] 2) Create a coupled calculation model of autoclave-frame mold.

[0059] like Figure 8 As shown, a coupled model of an autoclave and frame mold was created using the Solution module in Fluent. Based on the working principle and actual process of autoclave molding, corresponding boundary conditions were set. A constant airflow velocity and inflow gas temperature were set at the autoclave inlet 6 to match the curing temperature curve. A static pressure of 0 was set at the autoclave outlet 7, and an adiabatic boundary condition was applied. The autoclave wall 8 was set to a no-slip condition and an adiabatic boundary condition.

[0060] 3) Create a temperature distribution cloud map of the mold surface at the end of the heating process.

[0061] The calculation results are post-processed using Fluent's post-processing function to obtain a temperature distribution cloud map of the mold surface at the end of the heating process. The temperature uniformity is measured based on the maximum and minimum temperature differences.

[0062] This application fills all the holes within the envelope of the support frame of the frame mold, and uses the filled support structure as a thermal-fluid coupling topology optimization design domain. By selecting appropriate governing equations and boundary conditions, the airflow state and temperature distribution of the frame mold at the moment of maximum temperature difference in the autoclave are characterized. By changing the fluid volume fraction and energy dissipation, different forms of rectifier plates can be obtained, which can improve the convective heat transfer efficiency between the frame mold and the airflow in the autoclave to varying degrees. By retaining the support frame of the frame mold and without changing the rigidity of the reconstructed mold, the temperature uniformity of the reconstructed mold is improved by 19.1% compared with the original mold, which significantly improves the temperature uniformity of the frame mold.

[0063] Based on the same inventive concept, this application also provides a thermal-fluid coupling topology optimization apparatus for implementing the thermal-fluid coupling topology optimization method described above. The solution provided by this apparatus is similar to the implementation scheme described in the above method; therefore, the specific limitations in one or more embodiments of the thermal-fluid coupling topology optimization apparatus provided below can be found in the limitations of the thermal-fluid coupling topology optimization method described above, and will not be repeated here.

[0064] In one exemplary embodiment, such as Figure 9 As shown, a heat-fluid coupling topology optimization device is provided, comprising: A geometric model construction module is used to construct the geometric model of a composite material autoclave molding frame mold; the geometric model includes a template and a support frame, the support frame is used to support the template, and the support frame has temperature equalization holes and ventilation holes.

[0065] The geometric model construction module is used to fill the temperature equalization holes and ventilation holes opened on the support frame in the geometric model to obtain a thermal-fluid coupling topology optimization geometric model.

[0066] The finite element model construction module is used to mesh the thermal-fluid coupled topology optimization geometric model, set the governing equations and boundary conditions, and use the filled support frame in the thermal-fluid coupled topology optimization geometric model as the design domain and the plate as the non-design domain. The optimization objective is to maximize the average temperature of the plate surface, and the constraints are the volume fraction of the fluid and the energy dissipation generated by the fluid flow.

[0067] The finite element analysis module is used to perform finite element analysis on the finite element model of thermal-fluid coupling topology optimization and obtain the thermal-fluid coupling topology optimization results.

[0068] In one exemplary embodiment, a computer device is provided, which may be a server or a terminal, and its internal structure diagram may be as follows. Figure 10 As shown, this computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operating system and computer programs stored in the non-volatile storage media. The database stores thermal-fluid coupling topology optimization data. The I / O interfaces are used for information exchange between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a thermal-fluid coupling topology optimization method.

[0069] Those skilled in the art will understand that Figure 10 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0070] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-described method embodiments.

[0071] In one exemplary embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, implements the above-described method embodiments.

[0072] In one exemplary embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the above-described method embodiments.

[0073] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0074] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM).

[0075] The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, etc., and are not limited to these.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A heat-fluid coupled topology optimization method, characterized in that, The thermal-fluid coupling topology optimization method, applied to a frame mold for forming composite material autoclaves, includes: A geometric model of a composite material autoclave molding frame mold is constructed; the geometric model includes a mold plate and a support frame, the support frame being used to support the mold plate, and temperature equalization holes and ventilation holes are provided on the support frame; The temperature equalization holes and ventilation holes opened on the support frame in the geometric model are filled to obtain the thermal flux coupling topology optimization geometric model; Mesh the geometric model of thermal-fluid coupling topology optimization, set the governing equations and boundary conditions, and take the filled support frame in the geometric model of thermal-fluid coupling topology optimization as the design domain and the plate as the non-design domain. Take the maximum average temperature of the plate surface as the optimization objective, and take the volume fraction of fluid and the energy dissipation generated by fluid flow as constraints to construct a finite element model of thermal-fluid coupling topology optimization. Finite element analysis was performed on the finite element model of thermal-fluid coupling topology optimization to obtain the results of thermal-fluid coupling topology optimization.

2. The heat-fluid coupling topology optimization method according to claim 1, characterized in that, After performing finite element analysis on the finite element model of the thermal-fluid coupled topology optimization and obtaining the optimization results, the following steps are also included: The geometric model is reconstructed based on the results of thermal-fluid coupling topology optimization to obtain the reconstructed geometric model. The composite material autoclave molding frame mold is manufactured based on the reconstructed geometric model.

3. The heat-fluid coupling topology optimization method according to claim 1, characterized in that, The governing equations are the Navier-Stokes equations and the energy conservation equations.

4. The heat-fluid coupling topology optimization method according to claim 1, characterized in that, Boundary conditions include: boundary conditions for the inlet and outlet of the composite material autoclave molding frame mold, boundary conditions for the mold plate, and boundary conditions for the remaining outer wall surfaces of the mold. Specifically, setting boundary conditions includes: Given the temperature and velocity at the inlet of the composite material autoclave molding frame mold, obtain the boundary conditions at the inlet of the composite material autoclave molding frame mold. The wall conditions at the outlet of the composite material autoclave molding frame mold are set to be adiabatic, i.e., the heat flux is zero, and the pressure at the outlet of the composite material autoclave molding frame mold is given to obtain the boundary conditions at the outlet of the composite material autoclave molding frame mold. Given the heat source distribution of the composite material autoclave molding frame mold plate, the boundary conditions of the composite material autoclave molding frame mold plate are obtained; Given the flow velocity and heat flux of the outer wall surface of the composite material autoclave molding frame mold, excluding the outer wall surface corresponding to the mold inlet and outlet, the boundary conditions of the remaining outer wall surface of the mold are obtained.

5. The heat-fluid coupling topology optimization method according to claim 4, characterized in that, The pressure on exports is 0.

6. The heat-fluid coupling topology optimization method according to claim 1, characterized in that, The temperature equalization hole is semi-circular.

7. A heat-fluid coupled topology optimization device, characterized in that, The heat-fluid coupling topology optimization device includes: A geometric model construction module is used to construct the geometric model of a frame mold for forming composite material autoclaves; the geometric model includes a template and a support frame, the support frame being used to support the template, and the support frame having temperature equalization holes and ventilation holes. The geometric model construction module is used to fill the temperature equalization holes and ventilation holes opened on the support frame in the geometric model to obtain a thermal flux coupling topology optimization geometric model. The finite element model building module is used to mesh the thermal-fluid coupled topology optimization geometric model, set the governing equations and boundary conditions, and take the filled support frame in the thermal-fluid coupled topology optimization geometric model as the design domain and the plate as the non-design domain. The optimization objective is to maximize the average temperature of the plate surface, and the constraints are the volume fraction of the fluid and the energy dissipation generated by the fluid flow. The finite element analysis module is used to perform finite element analysis on the finite element model of thermal-fluid coupling topology optimization and obtain the thermal-fluid coupling topology optimization results.

8. A computer device, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that the processor executes the computer program to implement the thermal-fluid coupling topology optimization method according to any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the thermal-fluid coupling topology optimization method as described in any one of claims 1-6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the thermal-fluid coupling topology optimization method as described in any one of claims 1-6.

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