A method and system for planning the outgoing direction of a PCB pad, and a storage medium

Abstract

Embodiments of the present application provide a PCB pad wire-out direction planning method and system and a storage medium. The method comprises: acquiring in real time pad geometric parameters and wiring process constraint parameters of a pad to be wired; determining a pad type of the pad to be wired according to the pad geometric parameters and the wiring process constraint parameters; determining a set of optimal wire-out directions on the pad to be wired according to the pad type and a wiring area congestion degree; calculating a fan-out point of the pad to be wired according to the pad geometric parameters and the set of optimal wire-out directions; obtaining a target fan-out point after conflict checking of the fan-out point; and configuring a wire-out direction passing through the target fan-out point as a target wire-out direction. The method can realize fine mutual exclusion classification and differentiated wire-out constraint based on pad geometric characteristics, and can eliminate wiring acute angle defects and engineering hazards by obtaining a fan-out point after conflict checking, thereby improving PCB wiring quality.

Description

Technical Field

[0001] This invention relates to, but is not limited to, the field of electronic design automation technology, and particularly to a method, system, and storage medium for planning the outgoing line direction of PCB pads. Background Technology

[0002] PCB (Printed Circuit Board) is the core carrier of electronic devices, and its wiring quality directly determines the performance, size and reliability of electronic devices.

[0003] In existing PCB pad routing direction planning technologies, the routing logic often adopts a simplified two-point straight-line connection method, using only the center of the pad as a reference for path planning. This easily leads to sharp angle connections between the conductor and the edge of the pad, resulting in acid corner defects. Acid corner defects cause multiple engineering problems: First, sharp angles on pads are prone to electric field concentration, increasing high-frequency signal transmission loss, causing signal reflection and crosstalk, and disrupting the signal integrity of high-speed circuits. Second, electric field concentration deteriorates the electromagnetic compatibility performance of the circuit board and reduces the circuit's anti-interference capability. Third, the right-angle connection structure of thin conductors with large pads easily results in copper foil suspension, which is prone to breakage under stress and heat, failing to meet the requirements of high-precision, high-speed, and high-density PCB designs. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] The main objective of this invention is to propose a method, system, and storage medium for planning the outgoing direction of PCB pads, which can reduce the occurrence of acid corner defects in PCB wiring.

[0006] In a first aspect, embodiments of the present invention provide a method for planning the outgoing trace direction of PCB pads, including: Real-time acquisition of multi-dimensional parameters of the pads to be routed, including pad geometric parameters and routing process constraint parameters; The pad type of the pad to be routed is determined based on the pad geometry parameters and the routing process constraint parameters; The optimal set of routing directions on the pad to be routed is determined based on the pad type and the routing area congestion, wherein the routing area congestion is used to indicate the routing space margin around the pad to be routed. The fan-out point of the pad to be routed is calculated based on the pad geometry parameters and the optimal routing direction set. The fan-out point represents the position of the first via after the pad to be routed has a line out. The target fan-out point is obtained after performing conflict checking on the fan-out points. Configure the outgoing direction of the line passing through the target fan-out point as the target outgoing direction.

[0007] In some optional embodiments, the pad geometry parameters include pad center coordinates, pad width, and pad height; the routing process constraint parameters include conductor width, network class dynamic safety clearance, aspect ratio factor, process safety supplement value, area routing congestion threshold, and safety clearance amplification factor; the network class dynamic safety clearance characterizes the minimum electrical clearance for different network classes; and the aspect ratio factor characterizes a preset pad aspect ratio discrimination threshold. Determining the pad type of the pad to be routed based on the pad geometry parameters and the routing process constraint parameters includes: Configure the maximum value between the width and height of the pad to be routed as the first parameter; Configure the minimum value between the width and height of the pad to be routed as the second parameter; The pad type is determined based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor.

[0008] In some optional embodiments, determining the pad type based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor includes: If the difference between the first parameter and the second parameter is less than or equal to the conductor width, the pad type is configured as a square pad; If the ratio between the first parameter and the second parameter is greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a long strip pad. If the ratio between the first parameter and the second parameter is not greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a rectangular pad. Configure the pads to be routed that do not meet the requirements of square pads, rectangular pads, and long strip pads as non-rectangular pads.

[0009] In some optional embodiments, determining the optimal set of outgoing routes on the pad to be routed based on the pad type and the congestion of the routing area includes: When the congestion of the wiring area is less than the congestion threshold of the area wiring, the optimal outgoing direction set of the square pad is configured as 0°, 45°, 90°, 135°, 180°, 225°, 270°, 315°. When the congestion of the wiring area is greater than or equal to the wiring congestion threshold of the area, the optimal outgoing direction set of the square pad is configured as 45°, 135°, 225°, and 315°. The optimal outgoing direction set of the rectangular pad is configured as 0°, 90°, 180°, and 270°; The optimal outgoing direction set of the elongated pad is configured as 0° and 180°; Configure the optimal set of outgoing directions for non-rectangular pads as arbitrary directions.

[0010] In some optional embodiments, calculating the fan-out point of the pad to be routed based on the pad geometry parameters and the optimal routing direction set includes: Configure the center coordinates of the pad as the starting point of the outgoing line, and after the outgoing line intersects the outline boundary of the pad to be routed along the target outgoing line direction, calculate the straight-line distance between the intersection point and the center coordinates of the pad. The target outgoing line direction belongs to the set of optimal outgoing lines. The offset distance is obtained by sequentially adding the straight-line distance, the network-type dynamic safety spacing, and the process safety supplement value. The fan-out point is calculated based on the offset distance, the target outgoing line direction, and the center coordinates of the pad.

[0011] In some optional embodiments, after obtaining the target fan-out point through conflict checking of the fan-out point, the method further includes: The width of a square pad or the diameter of an arc-shaped pad is configured as the pad size. Square pads include square pads, rectangular pads, and elongated pads. Configure the teardrop parameters according to the ratio between the pad size and the conductor width.

[0012] In some optional embodiments, obtaining the target fan-out point after performing conflict checking on the fan-out point includes: Real-time detection of conflicts between fan-out points on the PCB circuit board yields conflict detection results. If the conflict detection results indicate that the fan-out point does not conflict with other components, filling areas, and keep-out areas, the fan-out point is configured as the target fan-out point. If the conflict detection result indicates that the fan-out point conflicts with other components, fill areas, and keep-out areas: within a preset number of iterations, the dynamic safety distance of the network class is amplified based on the safety distance amplification factor and the fan-out point is recalculated until the fan-out point does not conflict with other components, fill areas, and keep-out areas.

[0013] In some optional embodiments, if the fan-out point conflicts with other components, fill areas, and keep-out areas after completing a preset number of fan-out point iterations, the method further includes: The target exit direction is reselected from the set of optimal exit directions; Based on the updated target outgoing direction, the fan-out point is recalculated and conflict checks are performed until the fan-out point does not conflict with other components, filling areas, and no-fly zones.

[0014] In a second aspect, embodiments of the present invention provide a controller, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the PCB pad routing direction planning method described in the first aspect.

[0015] Thirdly, embodiments of the present invention provide a PCB pad routing direction planning system, including the controller mentioned in the second aspect above.

[0016] Fourthly, a computer storage medium stores computer-executable instructions for executing the PCB pad routing planning method described in the first aspect.

[0017] The beneficial effects of this invention include: real-time acquisition of multi-dimensional parameters of the pads to be routed, including pad geometric parameters and routing process constraint parameters; determination of the pad type based on the pad geometric parameters and the routing process constraint parameters; determination of the optimal set of outgoing routing directions on the pads to be routed based on the pad type and the routing area congestion, where the routing area congestion indicates the routing space margin around the pads to be routed; calculation of the fan-out point of the pads to be routed based on the pad geometric parameters and the optimal outgoing routing direction set, where the fan-out point represents the position of the first via after the pads to be routed; obtaining the target fan-out point after conflict verification; and configuring the outgoing routing direction passing through the target fan-out point as the target outgoing routing direction. By automatically determining the pad type and determining the specific outgoing routing direction based on the pad type, refined mutual exclusion classification and differentiated outgoing routing constraints can be achieved based on the pad geometric features; obtaining the fan-out point after conflict verification further eliminates routing acid corner defects and engineering risks, improves PCB routing quality, process reliability, and electrical performance, and can adapt to different PCB design scenarios.

[0018] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0019] Figure 1 This is a flowchart of the steps of a PCB pad trace direction planning method provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the optimized wiring of the square pad provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the wiring optimization of the rectangular pad provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a controller provided in one embodiment of the present invention.

[0020] Reference numerals: Controller 1000, Processor 1100, Memory 1200. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0022] It should be noted that although functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0023] This application provides a method, system, and storage medium for planning the outgoing direction of PCB pads, which will be described in detail in the following embodiments.

[0024] like Figure 1 As shown, this embodiment of the invention provides a method for planning the outgoing direction of PCB pads, including steps S100, S200, S300, S400, S500, and S600: Step S100: Obtain multi-dimensional parameters of the pads to be routed in real time. The multi-dimensional parameters include pad geometric parameters and routing process constraint parameters.

[0025] Specifically, during the PCB pad routing direction planning process, the geometric parameters and routing process constraint parameters of all pads on the PCB to be routed are acquired in real time. The pad geometric parameters include the pad center coordinates and length and width dimensions; the routing process constraint parameters include conductor width, network class safety spacing, aspect ratio factor, safety supplement value, and area routing congestion. The process parameters of the current routing network are dynamically matched through the Design Constraint Manager (DCM). The network class dynamic safety spacing represents the minimum electrical clearance for different network classes, which is the minimum isolation distance threshold that dynamically changes with network attributes, voltage level, and signal type; the aspect ratio factor represents the preset pad aspect ratio discrimination threshold.

[0026] Step S200: Determine the pad type of the pad to be routed based on the pad geometry parameters and the routing process constraint parameters; Specifically, based on pad size parameters and routing process constraints, all pads to be routed are divided into four categories: non-rectangular pads, square pads, rectangular pads, and long strip pads, with no classification dead zones and no conditional overlaps. This allows for matching the dedicated routing lines corresponding to different pads, avoiding unreasonable routing caused by a uniform algorithm adapting to various types of pads.

[0027] Step S300: Determine the optimal set of routing directions on the pad to be routed based on the pad type and the routing area congestion, wherein the routing area congestion is used to indicate the routing space margin around the pad to be routed. Specifically, a dedicated compliant routing angle is matched according to the pad type, while adaptive optimization is performed based on the area's congestion: square pads typically have eight-way routing, while high-density scenarios have four diagonal routing directions; ordinary rectangular pads prioritize routing along their four orthogonal long sides; long strip pads have bidirectional routing along their long sides; and non-rectangular pads have radially balanced routing. Among these, the routing area congestion is a core indicator used to quantify the available routing space around the pads, accurately reflecting whether there are device obstructions, existing traces occupying space, insufficient spacing, or other space constraints around the pads. Based on the congestion level, invalid routing directions with limited space or obstructions are avoided, and all effective and optimal routing directions with sufficient space and conforming to routing specifications are selected, forming a set of selectable directions.

[0028] Step S400: Calculate the fan-out point of the pad to be routed based on the pad geometry parameters and the optimal routing direction set. The fan-out point represents the position of the first via after the pad to be routed exits. Specifically, based on the selected set of optimal routing directions, and combined with the actual geometric dimensions, shape, center position, and other geometric parameters of the pads, the fan-out point position corresponding to the pad to be routed is automatically calculated. This fan-out point is the first via location on the trace extension path after the pad has completed routing. It is the reference point for realizing pad signal fan-out and inter-layer trace transition. Each optimal routing direction corresponds to a dedicated initial fan-out point.

[0029] Step S500: After performing conflict verification on the fan-out points, the target fan-out point is obtained; Specifically, the system detects obstacles and conflicts at the fan-out points in real time. If a conflict exists, it switches to a suboptimal angle or dynamically corrects the fan-out point, while also adapting the routing configuration based on the area's congestion level. By systematically checking for issues such as interference between the fan-out vias and surrounding pads, traces, device bodies, and prohibited routing areas, as well as overlapping positions and process violations, all invalid fan-out points that conflict or do not meet production routing requirements are eliminated. Ultimately, the system obtains valid points that are free from spatial interference and fully meet process constraints, which are then identified as the target fan-out points.

[0030] Step S600: Configure the outgoing direction of the line passing through the target fan-out point as the target outgoing direction.

[0031] Specifically, the final compliant and conflict-free target fan-out point is set as the necessary node for routing, driving the automatic router to route along the compliant path, ensuring that the minimum access angle of the conductor is ≥90°, eliminating geometric and process acid corner defects in all aspects, and completing PCB routing optimization.

[0032] In some optional embodiments, the pad geometry parameters include pad center coordinates, pad width, and pad height; the routing process constraint parameters include conductor width, network dynamic safety spacing, aspect ratio factor, process safety supplement value, area routing congestion threshold, and safety spacing amplification factor; determining the pad type of the pad to be routed based on the pad geometry parameters and the routing process constraint parameters includes: S210. Configure the maximum value between the width and height of the pad to be routed as the first parameter; S220. Configure the minimum value between the width and height of the pad to be routed as the second parameter; S230. Determine the pad type based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor.

[0033] Specifically, multi-dimensional parameters corresponding to the pads to be routed are collected in real time. These parameters include pad geometric parameters such as pad center coordinates, pad width, and pad height; and routing process constraint parameters such as conductor width, network dynamic safety spacing, aspect ratio factor, process safety supplement value, area routing congestion threshold, and safety spacing amplification factor. Based on the collected pad geometric parameters and routing process constraint parameters, the type of the pad to be routed is determined. The specific execution process is as follows: First, the width and height values ​​of the current pad to be routed are extracted. The larger of the two values ​​is set as the first parameter, and the smaller of the two values ​​is set as the second parameter. Then, the first parameter, the second parameter, the conductor width, and the aspect ratio factor are combined and compared. Based on the comparison results, the pad type of the current pad to be routed is classified and determined.

[0034] In some optional embodiments, determining the pad type based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor includes: S231. When the difference between the first parameter and the second parameter is less than or equal to the wire width, the pad type is configured as a square pad. S232. When the ratio between the first parameter and the second parameter is greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a long strip pad. S233. When the ratio between the first parameter and the second parameter is not greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a rectangular pad. S234. Configure the pads to be routed that do not meet the requirements of square pads, rectangular pads, and long strip pads as non-rectangular pads.

[0035] Specifically, the difference between the first parameter and the second parameter is calculated. If this difference is less than or equal to the conductor width, the current pad type is determined and set to a square pad. The specific formula for determining a square pad is as follows:

[0036] in, Indicates the first parameter. Indicates the second parameter. Indicates the width of the conductor.

[0037] If the ratio of the first parameter to the second parameter is greater than the aspect ratio factor, and the first parameter is also greater than the product of the conductor width and the aspect ratio factor, then the pad type is set to a rectangular pad. The specific formula for determining whether a rectangular pad is a rectangular pad is as follows: and

[0038] in, This represents the aspect ratio factor, with a default value of 3.0.

[0039] If the ratio of the first parameter to the second parameter is not greater than the aspect ratio factor, and the first parameter is greater than the value obtained by multiplying the conductor width and the aspect ratio factor, then the pad type is set to a rectangular pad.

[0040] For pads that do not meet any of the criteria for square, rectangular, or elongated pads, they are uniformly classified as non-rectangular pads. Non-rectangular pads include circular and irregularly shaped pads. There are no fixed limits on the outgoing routing angle. They support compliant routing in all directions, and fan-out routing requirements are forcibly retained. Furthermore, all inflection points of core constraint routing must not fall on the outline surface of non-rectangular pads to avoid inflection point defects in arc / irregular surface routing.

[0041] In some optional embodiments, determining the optimal set of outgoing routes on the pad to be routed based on the pad type and the congestion of the routing area includes: S310. When the congestion of the wiring area is less than the wiring congestion threshold of the area, the optimal outgoing direction set of the square pad is configured as 0°, 45°, 90°, 135°, 180°, 225°, 270°, 315°. S320. If the congestion of the wiring area is greater than or equal to the wiring congestion threshold of the area, the optimal outgoing direction set of the square pad is configured as 45°, 135°, 225°, and 315°. S330. Configure the optimal outgoing direction set of the rectangular pads as 0°, 90°, 180°, and 270°; S340. Configure the optimal outgoing direction set of the elongated pad as 0° and 180°; S350, Configure the set of optimal outgoing directions for non-rectangular pads as arbitrary directions.

[0042] Specifically, when the pad type is a square pad, the direction allocation is completed by comparing the real-time calculated routing area congestion with the preset area routing congestion threshold. If the routing area congestion value is less than the area routing congestion threshold, it means that there is sufficient routing space around the pad, and the optimal routing direction set corresponding to the square pad is set to eight directions: 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°. If the routing area congestion is greater than or equal to the area routing congestion threshold, it means that there is limited routing space around the pad, and only the diagonal direction with no risk of obstruction is retained. The optimal routing direction set corresponding to the square pad is set to four diagonal angles: 45°, 135°, 225°, and 315°.

[0043] If the current pad type is a rectangular pad, its optimal outgoing direction set is uniformly set to four orthogonal horizontal and vertical directions: 0°, 90°, 180°, and 270°.

[0044] If the current pad type is a long strip pad, only lines are allowed to extend along the long side of the pad, and the optimal set of line extension directions is set to 0° and 180°.

[0045] If the current pad is classified as a non-rectangular pad, there is no fixed limit to the outgoing line angle, and the optimal outgoing line direction set covers all arbitrary directions.

[0046] In some optional embodiments, calculating the fan-out point of the pad to be routed based on the pad geometry parameters and the optimal routing direction set includes: S410. Configure the center coordinates of the pad as the starting point of the outgoing line, and after the outgoing line intersects the outline boundary of the pad to be routed along the target outgoing line direction, calculate the straight-line distance between the intersection point and the center coordinates of the pad. The target outgoing line direction belongs to the set of optimal outgoing lines. S420. The offset distance is obtained by sequentially adding the straight-line distance, the network-type dynamic safety spacing, and the process safety supplement value. S430. The fan-out point is calculated based on the offset distance, the target outgoing line direction, and the center coordinates of the pad.

[0047] Specifically, using the acquired pad center coordinates as the starting point of the trace, any target trace direction within the optimal trace direction set is selected. A straight line is extended along this target trace direction until it intersects with the outline boundary of the pad to be routed. The straight-line distance between this intersection point and the pad center coordinates is calculated. The calculated straight-line distance, the network dynamic safety distance, and the process safety supplement value are summed sequentially to calculate the outward extension offset distance of the trace. Combining this offset distance, the selected target trace direction, and the pad center coordinates, coordinate transformation is performed to finally obtain the fan-out point position coordinates under the corresponding target trace direction. The specific calculation formula includes:

[0048]

[0049]

[0050] in, The coordinates of the pad center are Let θ be the coordinates of the fan-out point, θ be the target line direction, and D be the offset distance. For network-related dynamic safety spacing, Supplemental value for process safety (fixed reserved size constant, additional clearance distance set to accommodate manufacturing process deviations such as PCB etching, drilling, solder mask, and surface mount, which is a rigid process reserve and does not change dynamically with network voltage or signal type).

[0051] In some optional embodiments, obtaining the target fan-out point after performing conflict checking on the fan-out point includes: S510: Real-time detection of conflicts between fan-out points on the PCB circuit board to obtain conflict detection results; S520. If the conflict detection result indicates that the fan-out point does not conflict with other components, filling areas and keep-out areas, configure the fan-out point as the target fan-out point. S530, if the conflict detection result indicates that the fan-out point conflicts with other components, filling areas and keep-out areas: within a preset number of iterations, the dynamic safety distance of the network class is amplified based on the safety distance amplification factor and the fan-out point is recalculated until the fan-out point does not conflict with other components, filling areas and keep-out areas.

[0052] Specifically, the system detects in real time whether each fan-out point interferes with or obstructs the PCB board space, and generates corresponding conflict detection results. If the conflict detection results show that the fan-out point does not conflict with other components, copper fill areas, or routing keep-out areas on the board, then the fan-out point is directly identified as the target fan-out point. If the conflict detection results determine that the fan-out point interferes with other components, fill areas, or keep-out areas, then within the system's preset iteration range (e.g., 5 times, the specific number is not limited here), the dynamic safety distance of the network is amplified using a safety distance amplification factor. Then, the offset distance and fan-out point coordinates are recalculated based on the updated safety distance. The verification and recalculation steps are repeated until a fan-out point position that does not conflict with components, fill areas, or keep-out areas is obtained.

[0053] The default value of the safety spacing magnification factor is 1.1 to 1.2 times. It can be adaptively configured according to PCB routing process specifications and scene congestion. Each iteration only magnifies the dynamic safety spacing of the current network class by a single ratio, and the magnified dynamic safety spacing of the network class does not exceed the maximum safety spacing threshold of the process.

[0054] In some optional embodiments, if the fan-out point conflicts with other components, fill areas, and keep-out areas after completing a preset number of fan-out point iterations, the method further includes: S540. Reselect the target exit direction from the set of optimal exit directions; S550. Based on the updated target outgoing line direction, recalculate the fan-out point and perform conflict verification until the fan-out point does not conflict with other components, filling areas, and no-fly zones.

[0055] Specifically, if after a preset number of iterations, the fan-out point still conflicts with other components, fill areas, and keep-out areas, a new target outgoing direction is selected from the set of optimal outgoing directions corresponding to the current pad. Based on the changed target outgoing direction, the fan-out point coordinate calculation and conflict verification are re-completed. The process of changing the outgoing direction, recalculating the fan-out point, and detecting conflicts is continuously repeated until a fan-out point position that does not conflict with components, fill areas, and keep-out areas is obtained.

[0056] In some optional embodiments, after obtaining the target fan-out point through conflict checking of the fan-out point, the method further includes: S560. Configure the width of the square pad or the diameter of the arc pad as the pad size. The square pad includes square pads, rectangular pads and strip pads. S570. Configure teardrop parameters according to the ratio between the pad size and the conductor width.

[0057] Specifically, after completing the fan-out point conflict verification and determining the target fan-out point, the following operations are performed: square pads, rectangular pads, and long strip pads are uniformly classified as square pads, and the width of the square pads is extracted as the pad size. If it is an arc-shaped pad, its diameter is extracted as the pad size. Then, by matching and setting the corresponding teardrop parameters through the ratio of the pad size to the conductor width, the copper coverage area at the connection between the conductor and the pad is increased, which solves the problem of copper suspension and breakage caused by insufficient physical strength, and comprehensively eliminates process-related acid corner defects.

[0058] Example 1: Optimization of Square Pad Routing Example Parameter Configuration: This example selects a standard package square pad as the optimization target. Specific parameter configurations are as follows: pad length and width w=h=2mm, conductor width track_width=0.254mm, and network dynamic safety spacing. =0.152mm, aspect ratio factor=3.0, process safety supplement value δ=0.01mm, area congestion level is normal.

[0059] Pad classification: Substitute into the formula for classifying square pads:

[0060] The pad is determined to be a square pad, and eight-directional line constraints of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° are enabled.

[0061] Fan-out parameter calculation: Taking the 0° outgoing direction as an example, the calculation is performed. The straight-line distance from the center of the square pad along the 0° direction to the pad boundary. ; Total offset distance calculation:

[0062] Coordinate Calculation: Combining the pad center coordinates (assuming x_0 = 55.374mm, y_0 = 26.416mm) and the trigonometric function values ​​of 0° angle (cos0°=1, sin0°=0), calculate the fan-out point coordinates:

[0063]

[0064] In some embodiments, the square pad routing optimization results are referenced. Figure 2 ; Figure 2 The left-side pad had a sharp-angle acid corner defect in its trace, requiring optimization of the trace direction. After optimization using the square pad trace method described above, the right-side pad trace direction was obtained. Specifically, the trace was traced at a 45° angle to the square pad, thus avoiding the acid corner defect. Figure 2 The arrow in the image indicates the direction of optimization, that is, from before optimization to after optimization; Figure 2 The red square area in the middle represents the square solder pad.

[0065] Similarly, the coordinates of the compliant fan-out points for the other seven angles can be derived, and all fan-out points are found to be unobstructed after collision detection.

[0066] Routing performance verification: The eight calculated compliant fan-out points were set as mandatory routing nodes. The autorouter prioritized routing along compliant paths, and the wires connected to the pads had no sharp or acidic corner defects. The algorithm adaptively matched the teardrop structure, increasing the copper area at the connection and eliminating the problem of copper pad breakage due to suspension. The neat routing structure effectively improved the reliability of pad soldering, while also optimizing high-frequency signal transmission performance and circuit electromagnetic compatibility.

[0067] Example 2: Optimization of Rectangular Pad Routing Example Parameter Configuration: In this example, the rectangular pin pad of the package is selected as the optimization object. The specific parameter configuration is as follows: pad length w=3.0mm, width h=1.2mm, conductor width track_width=0.254mm, network dynamic safety spacing d_safe=0.152mm, aspect ratio factor factor=3.0, process safety supplement value δ=0.01mm.

[0068] Pad classification: Calculation of size difference. The requirement for a square pad is not met; aspect ratio calculation... Minimum size verification If the condition for determining a rectangle is met, it is determined to be a rectangular pad, and the outgoing line constraints of 0°, 90°, 180°, and 270° are enabled.

[0069] Fan-out parameter calculation: Taking the 0° long side outgoing line direction as an example, the calculation is performed. Boundary distance calculation: The distance from the center of the long pad along the 0° long side to the boundary. Total offset calculation:

[0070] Coordinate calculation: Assuming the center coordinates of the pads are (x_0 = 86.59 mm, y_0 = 52.585 mm), cos0° = 1, sin0° = 0, we can obtain:

[0071]

[0072] After conflict detection, the fan-out point was found to be unobstructed and compliant. Similarly, the coordinates of the compliant fan-out point at the other angle can be derived, and all fan-out points were found to be unobstructed after conflict detection.

[0073] In some embodiments, the routing optimization results for rectangular pads can be referred to Figure 3 , Figure 3 The left-side pad's trace was located at the corner of a rectangular pad, resulting in an acid corner defect. The trace direction needed optimization. After optimization using the method described above, the trace direction for the right-side pad was obtained, specifically placing the trace at 270° on the rectangular pad, thus avoiding the acid corner defect. Figure 3 The arrows in the image indicate the direction of optimization, that is, from before optimization to after optimization. Figure 3 The red rectangular area represents the rectangular solder pad.

[0074] Routing performance verification: The rectangular pads utilize four-way routing along both the long and short sides, completely avoiding sharp angle defects caused by corner routing. The conductors are connected to the pads at a 270° angle, ensuring compliant connection angles without geometrical acid corners. Combined with an adaptive teardrop structure, the copper plating at the connection point is full and the structure is stable. Compared to traditional routing solutions, this embodiment completely solves the acid corner problem of rectangular pads, significantly improving routing compliance and process reliability.

[0075] The beneficial effects of this invention include: real-time acquisition of multi-dimensional parameters of the pads to be routed, including pad geometric parameters and routing process constraint parameters; determination of the pad type based on the pad geometric parameters and the routing process constraint parameters; determination of the optimal set of outgoing routing directions on the pads to be routed based on the pad type and the routing area congestion, where the routing area congestion indicates the routing space margin around the pads to be routed; calculation of the fan-out point of the pads to be routed based on the pad geometric parameters and the optimal outgoing routing direction set, where the fan-out point represents the position of the first via after the pads to be routed; obtaining the target fan-out point after conflict verification; and configuring the outgoing routing direction passing through the target fan-out point as the target outgoing routing direction. By automatically determining the pad type and determining the specific outgoing routing direction based on the pad type, refined mutual exclusion classification and differentiated outgoing routing constraints can be achieved based on the pad geometric features; obtaining the fan-out point after conflict verification further eliminates routing acid corner defects and engineering risks, improves PCB routing quality, process reliability, and electrical performance, and can adapt to different PCB design scenarios.

[0076] This invention addresses the core defects and shortcomings of traditional PCB automatic routing algorithms through comprehensive technical iteration and optimization. It reconstructs standardized pad classification and judgment logic, eliminating problems such as judgment dead zones and overlapping type boundaries in the original classification rules. It innovatively adds core functional modules such as dedicated routing planning logic for non-rectangular pads, iterative verification mechanism for fan-out point conflicts, quantitative assessment of routing area congestion, dynamic adaptive matching of multiple process parameters, and adaptive generation of teardrops according to size ratio. These modules address various design defects in existing traditional routing technologies from three levels: underlying algorithm logic, engineering implementation, and adaptation to multiple working scenarios.

[0077] This invention features a rigorous closed-loop algorithm with clear and quantifiable formulas for various judgment and calculation rules, along with complete and implementable examples. It is compatible with all mainstream routing applications, including standard PCBs, high-density BGA-packaged PCBs, and high-speed, high-frequency signal boards. It eliminates sharp geometric angles at the junction of traces and pads, avoids process defects caused by etching and reflow soldering, and effectively improves the solder joint strength, mechanical stability, and electrical performance of the circuit board. The overall technology is highly advanced and possesses significant practical engineering value and industrialization potential.

[0078] like Figure 4 As shown, Figure 4 A structural block diagram of a controller 1000 according to an embodiment of this application is shown. The components of the controller 1000 include, but are not limited to, a memory 1200 and a processor 1100. The processor 1100 is connected to the memory 1200 via a bus, and the memory 1200 is used to store data.

[0079] The controller 1000 also includes an access device that enables the controller 1000 to communicate via one or more networks. Examples of such networks include a Public Switched Telephone Network (PSTN), a Local Area Network (LAN), a Wide Area Network (WAN), a Personal Area Network (PAN), or a combination of communication networks such as the Internet. The access device may include one or more of any type of wired or wireless network interface (e.g., a Network Interface Card (NIC)), such as an IEEE 802.11 Wireless Local Area Network (WLAN) interface, a Wi-MAX interface, an Ethernet interface, a Universal Serial Bus (USB) interface, a cellular network interface, a Bluetooth interface, a Near Field Communication (NFC) interface, and so on.

[0080] The controller 1000 can be any type of stationary or mobile electronic device, including mobile computers or mobile electronic devices (e.g., tablet computers, personal digital assistants, laptop computers, notebook computers, netbooks, etc.), mobile phones (e.g., smartphones), wearable electronic devices (e.g., smartwatches, smart glasses, etc.) or other types of mobile devices, or stationary electronic devices such as desktop computers or PCs. The controller 1000 can also be a mobile or stationary server.

[0081] The processor 1100 is used to execute computer-executable instructions for a PCB pad routing direction planning method.

[0082] The above is a schematic diagram of a controller according to this embodiment. It should be noted that the technical solution of this controller and the technical solution of the PCB pad routing direction planning method described above belong to the same concept. For details not described in detail in the technical solution of the controller, please refer to the description of the technical solution of the PCB pad routing direction planning method described above.

[0083] According to an embodiment of this application, a PCB pad routing direction planning system is also provided. The PCB pad routing direction planning system includes a controller 1000, which automatically completes the routing direction planning of the PCB pads. It should be noted that the technical solution of this PCB pad routing direction planning system belongs to the same concept as the technical solution of the aforementioned PCB pad routing direction planning method. Details not described in detail in the technical solution of the computing device can be found in the description of the technical solution of the aforementioned PCB pad routing direction planning method.

[0084] This application embodiment also provides a storage medium, which is a computer-readable storage medium, storing a computer program that, when executed by a processor, implements the above-described PCB pad routing direction planning method.

[0085] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0086] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as processors, such as central processing units, digital signal processors, or microprocessors executing software, or as hardware, or as integrated circuits, such as application-specific integrated circuits. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0087] The above provides a detailed description of the preferred embodiments of this application. However, this application is not limited to the above-described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A method for planning the outgoing direction of PCB pads, characterized in that, include: Real-time acquisition of multi-dimensional parameters of the pads to be routed, including pad geometric parameters and routing process constraint parameters; The pad type of the pad to be routed is determined based on the pad geometry parameters and the routing process constraint parameters; The optimal set of routing directions on the pad to be routed is determined based on the pad type and the routing area congestion, wherein the routing area congestion is used to indicate the routing space margin around the pad to be routed. The fan-out point of the pad to be routed is calculated based on the pad geometry parameters and the optimal routing direction set. The fan-out point represents the position of the first via after the pad to be routed has a line out. The target fan-out point is obtained after performing conflict checking on the fan-out points. Configure the outgoing direction of the line passing through the target fan-out point as the target outgoing direction.

2. The PCB pad trace direction planning method according to claim 1, characterized in that, The pad geometric parameters include pad center coordinates, pad width, and pad height. The routing process constraint parameters include conductor width, network class dynamic safety distance, aspect ratio factor, process safety supplement value, area routing congestion threshold, and safety distance amplification factor. The network class dynamic safety distance represents the minimum electrical clearance for different network classes, and the aspect ratio factor represents the preset pad aspect ratio discrimination threshold. The step of determining the pad type of the pad to be routed based on the pad geometry parameters and the routing process constraint parameters includes: Configure the maximum value between the width and height of the pad to be routed as the first parameter; Configure the minimum value between the width and height of the pad to be routed as the second parameter; The pad type is determined based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor.

3. The PCB pad trace direction planning method according to claim 2, characterized in that, The step of determining the pad type based on the first parameter, the second parameter, the conductor width, and the aspect ratio factor includes: If the difference between the first parameter and the second parameter is less than or equal to the conductor width, the pad type is configured as a square pad; If the ratio between the first parameter and the second parameter is greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a long strip pad. If the ratio between the first parameter and the second parameter is not greater than the aspect ratio factor, and the first parameter is greater than the product of the conductor width and the aspect ratio factor, the pad type is configured as a rectangular pad. Configure the pads to be routed that do not meet the requirements of square pads, rectangular pads, and long strip pads as non-rectangular pads.

4. The PCB pad trace direction planning method according to claim 3, characterized in that, The step of determining the optimal set of routing directions on the pads to be routed based on the pad type and routing area congestion includes: When the congestion of the wiring area is less than the congestion threshold of the area wiring, the optimal outgoing direction set of the square pad is configured as 0°, 45°, 90°, 135°, 180°, 225°, 270°, 315°. When the congestion of the wiring area is greater than or equal to the wiring congestion threshold of the area, the optimal outgoing direction set of the square pad is configured as 45°, 135°, 225°, and 315°. The optimal outgoing direction set of the rectangular pad is configured as 0°, 90°, 180°, and 270°; The optimal outgoing direction set of the elongated pad is configured as 0° and 180°; Configure the optimal set of outgoing directions for non-rectangular pads as arbitrary directions.

5. The PCB pad trace direction planning method according to claim 2, characterized in that, The process of calculating the fan-out point of the pad to be routed based on the pad geometry parameters and the optimal routing direction set includes: Configure the center coordinates of the pad as the starting point of the outgoing line, and after the outgoing line intersects the outline boundary of the pad to be routed along the target outgoing line direction, calculate the straight-line distance between the intersection point and the center coordinates of the pad. The target outgoing line direction belongs to the set of optimal outgoing lines. The offset distance is obtained by sequentially adding the straight-line distance, the network-type dynamic safety spacing, and the process safety supplement value. The fan-out point is calculated based on the offset distance, the target outgoing line direction, and the center coordinates of the pad.

6. The PCB pad trace direction planning method according to claim 2, characterized in that, After obtaining the target fan-out point through conflict checking of the fan-out point, the process further includes: The width of a square pad or the diameter of an arc-shaped pad is configured as the pad size. Square pads include square pads, rectangular pads, and elongated pads. Configure the teardrop parameters according to the ratio between the pad size and the conductor width.

7. The PCB pad trace direction planning method according to claim 2, characterized in that, The process of obtaining the target fan-out point after performing conflict verification on the fan-out point includes: Real-time detection of conflicts between fan-out points on the PCB circuit board yields conflict detection results. If the conflict detection results indicate that the fan-out point does not conflict with other components, filling areas, and keep-out areas, the fan-out point is configured as the target fan-out point. If the conflict detection result indicates that the fan-out point conflicts with other components, fill areas, and keep-out areas: within a preset number of iterations, the dynamic safety distance of the network class is amplified based on the safety distance amplification factor and the fan-out point is recalculated until the fan-out point does not conflict with other components, fill areas, and keep-out areas.

8. The PCB pad trace direction planning method according to claim 7, characterized in that, After completing the fan-out point iteration update for a preset number of iterations, if the fan-out point conflicts with other components, fill areas, and keep-out areas, the method further includes: The target exit direction is reselected from the set of optimal exit directions; Based on the updated target outgoing direction, the fan-out point is recalculated and conflict checks are performed until the fan-out point does not conflict with other components, filling areas, and no-fly zones.

9. A PCB pad outgoing line direction planning system, characterized in that, The system includes a controller, which comprises a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the PCB pad routing direction planning method according to any one of claims 1-8.

10. A computer storage medium, characterized in that, The computer storage medium stores computer-executable instructions, which are used to execute the PCB pad routing planning method according to any one of claims 1-8.

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