A hook-on smart sealing label and its working method

Abstract

This invention discloses a hook-on intelligent sealing label and its working method. A micro-motion triggering device closes when the hook-on strap is tightened and locked, and resets and opens when the strap is cut. The main circuit board maintains a low-power sleep mode when it receives a closed signal from the micro-motion switch, and triggers a hardware interrupt and anti-tamper alarm when it receives an open signal. It is also awakened when the state of the sample to be sealed changes, and performs rapid auxiliary positioning. An adaptive state classification algorithm based on the fusion of three-axis acceleration sliding window variance and energy time-frequency characteristics accurately identifies the current state to prevent false alarms. An anti-tamper security judgment algorithm based on micro-motion switch level filtering and adaptive thresholds prevents false alarms from the micro-motion switch. This invention effectively overcomes the shortcomings of high power consumption, inability to effectively correlate with physical binding states, and difficulty in accurately identifying multiple states.

Description

Technical Field

[0001] This invention relates to sample sealing labels, specifically to a hook-on intelligent sample sealing label and its working method. Background Technology

[0002] In the management of materials in the power industry, critical materials such as cables, fittings, and transformers are subject to tamper-proofing and substitution management during procurement, warehousing, storage, outbound transportation, and on-site installation and handover. Due to their high value and core role in infrastructure safety, these materials are crucial. Traditional sealing management methods rely primarily on disposable plastic cable ties, lead seals, and paper / plastic labels. These solutions have fundamental flaws: First, cable ties and lead seals have poor tamper-proof capabilities, are easily cut, and replaced with highly similar clones. Furthermore, damage to these seals can only be detected visually during manual inspections or warehousing handovers, failing to provide real-time status monitoring and immediate alarms. Second, traditional physical sealing labels provide no location status or operational trajectory information. If materials are stolen during storage or unauthorized unloading and substitution during transportation, management personnel have no way to trace the point of loss.

[0003] To address the limitations of traditional physical sealing tags, IoT active positioning tags (such as asset trackers with GPS and GPRS / 4G) have begun to be used in high-end logistics in recent years. However, directly applying conventional active positioning tags to the sealing of power materials faces two insurmountable technical bottlenecks: First, there is a severe conflict between power consumption and lifespan. Cables, fittings, and other materials often need to be sealed in warehouses or field storage areas for months or even years, while the normal standby power consumption of communication and positioning modules is usually in the tens of milliamps. Without external power supply, the tag's battery can generally only last for a few days to a few weeks. Frequently charging thousands of tags is completely impractical in power grid warehousing. Second, there is a lack of substantial linkage with the physical binding status. Conventional tags are simply placed in packaging with the materials. If an attacker cuts and removes the cable ties, as long as the tag is still placed in the original warehouse location (its GPS position and accelerometer sensor remain unchanged), the backend management system will not be able to detect that the physical binding has been broken, rendering the tag ineffective.

[0004] Currently, while positioning devices with individual tamper-proof microswitches exist on the market, their practicality still suffers from serious flaws. During long-distance transportation and in environments with vibration and bumps, the microswitch is prone to intermittent contact due to mechanical loosening or momentary shaking of the cable ties, leading to false alarms of "tag removed" and reducing the reliability of the alerts. Furthermore, existing tags often completely shut down the microswitch's detection circuit during periods of inactivity to conserve energy, or keep the processor in a semi-dormant state to maintain interrupt detection, resulting in persistently high standby current and failing to achieve a true multi-year battery life. Therefore, designing a smart sealing tag with tight mechanical and electronic interlocking, capable of accurately identifying multiple states and consuming extremely low power, is a pressing technical challenge in the field of power warehousing and logistics security. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a hanging smart sealing label and its working method, which can effectively overcome the defects of the existing technology, such as high power consumption, inability to effectively associate with physical binding state, and difficulty in accurately identifying multiple states.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: A hook-on smart sealing label includes the following structural components: Cable ties, extending through the inside of the casing, are used to secure the samples to be sealed. The mounting slot is a channel that runs through the inside of the housing for inserting mounting cables; The micro-trigger device is a micro switch installed inside the path of the hook-up slot. When the hook-up cable tie is tightened and locked, the micro switch is closed due to the squeezing effect of the hook-up cable tie. When the hook-up cable tie is cut, the micro switch is reset and opened. The material-fitting surface is located at the end of the housing and is used to accommodate and tightly adhere to the material to be sealed. The main circuit board maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It is also woken up when the status of the sample to be sealed changes and performs rapid auxiliary positioning. It accurately identifies the current status and prevents false alarms by running an adaptive state classification algorithm based on the fusion of three-axis acceleration sliding window variance and energy time-frequency features. It also prevents false alarms from the microswitch by running an anti-tamper safety judgment algorithm based on microswitch level filtering and adaptive threshold. The LED light will blink locally when the device is powered on, when it is abnormally removed, or when the battery is low.

[0009] Preferably, the circuit board includes a main control MCU, a 3D accelerometer, a positioning module, and a communication module; The main control MCU maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It also receives the detection signal from the 3D accelerometer and is woken up when the state of the sample to be sealed changes. It accurately identifies the current state and prevents false alarms by running an adaptive state classification algorithm based on the fusion of the variance of the three-axis acceleration sliding window and the energy time-frequency characteristics. It also prevents false alarms from the microswitch by running an anti-tamper security judgment algorithm based on microswitch level filtering and adaptive threshold. The 3D accelerometer is used to continuously monitor the three-axis acceleration changes of the sample to be sealed and send the detection signal to the main control MCU. It also supports hardware interrupt wake-up. The positioning module, in cold start / warm start mode, works with the communication module to perform A-GPS rapid assisted positioning.

[0010] Preferably, when the circuit motherboard is in low-power sleep mode, it supports three-dimensional acceleration motion detection wake-up, including: When the material to be sealed is displaced or transported, the 3D accelerometer detects acceleration fluctuations exceeding a preset threshold. At this point, it is determined that the material to be sealed is in motion, and the 3D accelerometer generates an interrupt signal, which wakes up the main control MCU through the hardware interrupt pin. The circuit motherboard then enters the operation and maintenance mode. The main control MCU starts the communication module to reconnect to the base station / network and starts the positioning module to obtain the current location information; In operation and maintenance mode, the main control MCU continuously monitors the detection signal of the 3D accelerometer. If the material to be sealed stops moving during transportation due to parking or storage, the main circuit board will not immediately return to low-power sleep mode, but will continue to run in operation and maintenance mode for a period of time. If the 3D accelerometer detects acceleration fluctuations exceeding the preset threshold again, the countdown will be reset; otherwise, the main circuit board will return to low-power sleep mode, and the main control MCU will shut down the communication module and the positioning module. In operation and maintenance mode, the main control MCU collects location information, movement speed and battery voltage every once in a while, and uploads them to the back-end server through the communication module.

[0011] Preferably, when the circuit motherboard is in low-power sleep mode, it supports vibration wake-up, including: When the material to be sealed is subjected to impact, fall or damage during static placement or transportation, the instantaneous acceleration peak detected by the 3D accelerometer will exceed the preset high-sensitivity anti-vibration threshold. At this time, it is determined that the material to be sealed is in an abnormal vibration state. The main control MCU is urgently awakened and directly starts the communication module to send a data packet carrying a high-priority strong vibration mark and location information to the background server, realizing event-triggered real-time alarm.

[0012] Preferably, when the circuit motherboard is in low-power sleep mode, it supports being woken up by a removal action, including: When someone cuts the cable ties or damages the casing to remove the label during the sample sealing and storage period, the microswitch will reset and open due to the loss of pressure. At this time, it is determined that the sample to be sealed is in an abnormal removal state. The main control MCU receives the disconnect signal from the microswitch, and the low-to-high level transition triggers a hardware interrupt in the main control MCU. The circuit board enters the removal and maintenance mode. In the removal and maintenance mode, the main control MCU uses the energy storage capacitor inside the tag and the delayed cut-off mechanism of the main power supply circuit of the battery to start the communication module and the positioning module in a very short time. It also uploads an abnormal removal alarm to the back-end server through the communication module and uploads the last location information to the back-end server to achieve evidence locking. After the abnormal removal alarm is uploaded, the main control MCU executes the shutdown process to completely cut off the power supply to the circuit board, prevent unnecessary power depletion, and achieve safe closed-loop management.

[0013] Preferably, the adaptive state classification algorithm based on the fusion of triaxial acceleration sliding window variance and energy time-frequency features specifically includes the following steps: S11. Triaxial acceleration data acquisition and gravity compensation: The main control MCU controls the 3D accelerometer to continuously collect three-axis acceleration data (a, b, c) along the X, Y, and Z axes. x ,a y ,a z ), and calculate the resultant acceleration a. total : ; Among them, a x a y a z These are the accelerations along the X, Y, and Z axes, respectively. To eliminate the constant deviation introduced by gravitational acceleration when the sample to be sealed is tilted, a first-order IIR high-pass filter is designed to filter the composite acceleration a. total Filtering is performed to separate the dynamic acceleration 'a' after eliminating gravity interference. dynamic : a dynamic =a total -gstatic ; Among them, g static The static gravity reference value represents the combined gravitational acceleration of the sample to be sealed in a static state, which is continuously iteratively output by a first-order IIR high-pass filter; S12. Sliding window feature extraction: The main control MCU sets a sliding window, and for the dynamic acceleration within each sliding window, calculates the following three characteristic indicators: 1) Variance Var reflects the overall vibration energy level of the material to be sealed: ; Among them, a dynamic (i) represents the i-th dynamic acceleration within the sliding window, a mean is the average dynamic acceleration within the sliding window, and W is the total number of samples within the sliding window; 2) Peak-to-peak value (P2P) is used to characterize instantaneous impact intensity: P2P=a dynamic,max -a dynamic,min ; Among them, a dynamic,max a dynamic,min These represent the maximum and minimum dynamic acceleration values ​​within the sliding window, respectively. 3) The low-frequency band energy density integral Espec in the frequency domain is used to characterize the vibration energy of environmental noise: The dynamic acceleration within the sliding window is subjected to FFT transformation, and the energy spectral density integral value in the low frequency band of 1Hz~10Hz is calculated to identify the characteristics of low-frequency random noise vibration in the continuous environment. S13, Multi-level state classification adaptive decision-making: The main control MCU compares the characteristic indicators with preset thresholds, executes multi-level classification decision logic, classifies the materials to be sealed into the following four states, and adopts corresponding power consumption control strategies: 1) If Var <static thr And P2P <p2p thr If the sample is in a static state, the main circuit board enters a low-power sleep mode and only performs a watchdog reset operation. Among them, static thr The static state variance threshold, p2p thr The threshold for determining the minimum peak value in a static state; 2) If static is satisfied thr ≤Var <active thrIf Espec is concentrated in a preset narrow frequency band, it is determined that the material to be sealed is in an environmental noise vibration state. At this time, the main control MCU considers the environmental noise vibration to be invalid interference, does not start the communication module and positioning module, filters the dynamic acceleration in the current sliding window, and the circuit motherboard keeps a low power sleep mode. Among them, active thr The threshold for determining the variance of motion states; 3) If the active condition is met thr If the value is less than or equal to Var, and multiple consecutive sliding windows meet this condition, it is determined that the material to be sealed is in motion. At this time, the 3D accelerometer generates an interrupt signal, which wakes up the main control MCU through the hardware interrupt pin, and the circuit motherboard enters the operation and maintenance mode. 4) If the impact condition is satisfied thr If ≤P2P, it is determined that the sample to be sealed is in an abnormal vibration or abnormal dismantling state. At this time, the main control MCU is not limited by the normal state and directly starts the communication module and positioning module through a high-priority external interrupt to report the abnormal alarm in time. Among them, impact thr The threshold for determining the variance of vibration or demolition status.

[0014] Preferably, when the circuit motherboard is in a low-power sleep mode and the watchdog reset operation is performed, an adaptive fast determination mechanism is introduced, including: Within the watchdog feeding clock time window, the main control MCU quickly reads the latest multiple dynamic accelerations from the FIFO buffer built into the 3D accelerometer and calculates the temporary variance Var. temp : If Var temp <temp thr If the signal is positive, it indicates that the sample to be sealed is still in a static state. After the main control MCU performs the dog-feeding operation, the circuit board immediately returns to the low-power sleep mode. If temp thr ≤Var temp If the sample is affected by potential movement or force fluctuations, the main circuit board will refuse to return to the low-power sleep mode. The main control MCU will collect the dynamic acceleration of a sliding window and execute S12 and S13, thereby ensuring the real-time status capture under the premise of ultra-low standby current. Among them, temp thr This is a temporary variance threshold used to determine whether the time to return to low-power sleep mode should be extended after the motherboard performs a watchdog reset operation.

[0015] Preferably, the tamper-proof security determination algorithm based on micro-switch level filtering and adaptive threshold specifically includes the following steps: S21, Micro-motion level state dejitter sampling: The main control MCU samples the level state of the GPIO pin of the micro switch at a fixed frequency. Each sample yields a binary state value s, where 0 represents closed and locked, and 1 represents open and released. S22. Smoothing process based on moving average and first-order difference filtering: To filter out the intermittent contact noise of the microswitch contact spring caused by momentary bumps, the main control MCU performs sliding mean smoothing on multiple consecutive sampled values ​​and calculates the estimated open-circuit probability P of the microswitch within the current sliding mean period. open This is used to reflect the degree of loose connection of the microswitch; simultaneously, it calculates the first-order difference value Diff of the microswitch's level state between two adjacent sampling periods. s Used to capture instantaneous level transition edges; S23. Adaptive anti-tamper detection threshold configuration based on triaxial acceleration characteristics: When the sample to be sealed is in a static state, due to the absence of external interference, the microswitch's mechanical state is stable, and the open circuit probability threshold is adaptively tightened. thr The open-circuit probability threshold is set to open. thr The value is set to 0.2, meaning that at least two out of ten consecutive sample values ​​are disconnected and remain so for a period of time before the material to be sealed is determined to be in an abnormal dismantling state. When the sample to be sealed is in motion, the microswitch becomes unstable due to severe vehicle vibration, causing the open circuit probability threshold to be adaptively released. thr The open-circuit probability threshold is set to open. thr The value is set to 0.8, meaning that at least 8 out of 10 consecutive sample values ​​are disconnected and remain so for a period of time before it is determined that the material to be sealed is in an abnormal dismantling state.

[0016] A method for using a hook-on smart sealing label includes the following three stages: Phase 1: Tag activation and power-on status detection: A cold start is performed by tightening the cable ties and squeezing the micro switch in the mounting slot. After power-on, the main control MCU configuration and watchdog clock initialization are completed. Then, the level state of the micro switch is read. After determining that the power-on is normal, the hardware configuration and protocol stack initialization of the 3D accelerometer sensor, communication module and positioning module are performed in sequence. Phase Two: Initial Power-On and Initial Information Upload After initialization, it is determined whether it is the first power-on. If it is the first power-on, the communication module and positioning module are turned on, location information is collected and the first reported binding activation information is uploaded. Then, the first power-on count flag in the EEPROM is modified, and the communication module and positioning module are controlled to enter low-power sleep mode after power-off. If it is not the first power-on, the communication module and positioning module are turned off directly and the low-power sleep mode is entered to reduce unnecessary power consumption. The third stage involves timed wake-up and dog feeding in low-power sleep mode: In low-power sleep mode, the main control MCU shuts down the communication module and the positioning module. The watchdog timer runs periodically. Every once in a while, the watchdog overflows and wakes up the main control MCU. The main control MCU performs a watchdog feeding operation to prevent a crash and performs an external test on the level of the micro switch. After confirming that there is no abnormality, it reconfigures the watchdog timer and returns to low-power sleep mode, keeping the standby power consumption at an extremely low level.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, the hanging-type smart sealing label and its working method provided by the present invention have the following beneficial effects: 1) Physical connection locking and electronic activation linkage This invention adopts a locking trigger mode in which the cable tie passes through the hook-on slot and squeezes the micro switch, ensuring that the device is activated as soon as the cable tie is locked. This breaks the drawback of traditional electronic positioning tags that only have a switch button and cannot sense the physical binding status with materials, making the physical state and logical state of tamper-proof and replacement-proof tightly bound together. 2) Micro-switch filtering assists in preventing false alarms during transportation. In complex and bumpy logistics transportation, single microswitches often experience momentary intermittent connections due to uneven force, leading to false alarms. This invention effectively filters out intermittent connection noise caused by vehicle bumps by performing high-frequency cyclic sampling and smoothing of the microswitch level state, combined with adaptive anti-tamper judgment threshold judgment logic. Combined with the adaptive anti-tamper judgment threshold configuration, it greatly reduces the false alarm rate caused by transportation bumps. 3) The self-developed adaptive state classification algorithm completely solves the problem of false wake-ups. This invention designs an adaptive state classification algorithm based on the fusion of three-axis acceleration sliding window variance and energy time-frequency features. It can accurately distinguish between real transportation movement, background engineering shaking and other low-frequency noise vibrations. When stationary, it can actively filter out environmental noise vibrations, avoiding the problem of conventional gravity sensors frequently waking up the system due to minor external vibrations, thus reducing the overall system energy consumption by more than 80%. 4) Perfect coupling of watchdog feeding and state analysis This invention achieves rapid detection of sampling points and calculation of temporary variance through FIFO while feeding the dog, realizing a dynamic mechanism of instantaneous sleep without action and adaptive extension of data acquisition and analysis with motion trend. Under the premise of ensuring that the system control logic does not deadlock and the anti-tamper detection is highly real-time, it achieves extreme compression of standby current. 5) Abnormal alarms are uploaded immediately. In the event of illegal cutting of cable ties (removal action) or strong external impact (vibration action), the system does not rely on conventional information uploads. Instead, it uses a high-priority external interrupt to instantly increase the operating frequency of the main control MCU and wake up the communication and positioning modules. It then proactively reports the abnormal alarm to the backend server with the highest priority, ensuring the timeliness and effectiveness of security. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0020] Figure 1 This is a schematic diagram of the label structure in this invention; Figure 2 This is a schematic diagram illustrating the workflow of the label in this invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] The following describes the specific structure of the hook-on smart sealing label provided by this invention with specific examples (e.g., ...). Figure 1 (as shown) and technical effects.

[0023] The hook-on smart sealing label includes the following structural components: Cable ties, extending through the inside of the casing, are used to secure the samples to be sealed. The mounting slot is a channel that runs through the inside of the housing for inserting mounting cables; The micro-trigger device is a micro switch installed inside the path of the hook-up slot. When the hook-up cable tie is tightened and locked, the micro switch is closed due to the squeezing effect of the hook-up cable tie. When the hook-up cable tie is cut, the micro switch is reset and opened. The material-fitting surface is located at the end of the housing and is used to accommodate and tightly adhere to the material to be sealed. The main circuit board maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It is also woken up when the status of the sample to be sealed changes and performs rapid auxiliary positioning. It accurately identifies the current status and prevents false alarms by running an adaptive state classification algorithm based on the fusion of three-axis acceleration sliding window variance and energy time-frequency features. It also prevents false alarms from the microswitch by running an anti-tamper safety judgment algorithm based on microswitch level filtering and adaptive threshold. The LED light will blink locally when the device is powered on, when it is abnormally removed, or when the battery is low.

[0024] The main circuit board includes a main control MCU, a 3D accelerometer sensor, a positioning module, and a communication module; The main control MCU maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It also receives the detection signal from the 3D accelerometer and is woken up when the state of the sample to be sealed changes. It accurately identifies the current state and prevents false alarms by running an adaptive state classification algorithm based on the fusion of the variance of the three-axis acceleration sliding window and the energy time-frequency characteristics. It also prevents false alarms from the microswitch by running an anti-tamper security judgment algorithm based on microswitch level filtering and adaptive threshold. The 3D accelerometer is used to continuously monitor the three-axis acceleration changes of the sample to be sealed and send the detection signal to the main control MCU. It also supports hardware interrupt wake-up. The positioning module, in cold start / warm start mode, works with the communication module to perform A-GPS rapid assisted positioning.

[0025] In the technical solution of this application, the communication module adopts the EC600N communication module, which is a 4G LTE Cat.1 communication chip used for long-distance, low-power mobile network connection; the positioning module adopts the L76K positioning module, which is a high-precision satellite positioning chip that supports GPS / BeiDou dual-mode.

[0026] When the circuit board is in low-power sleep mode, it supports multi-dimensional external event wake-up, mainly including the following three scenarios: 1) When the circuit board is in low-power sleep mode, it supports three-dimensional acceleration motion detection wake-up, including: When the sample to be sealed is displaced or transported, the 3D accelerometer detects acceleration fluctuations exceeding a preset threshold (e.g., acceleration exceeding 0.15g in any of the X, Y, or Z axes for 200ms). At this point, it is determined that the sample is in motion, and the 3D accelerometer generates an interrupt signal, waking up the main control MCU via a hardware interrupt pin. The circuit board then enters operation and maintenance mode. The main control MCU starts the communication module to reconnect to the base station / network and starts the positioning module to obtain the current location information; In operation and maintenance mode, the main control MCU continuously monitors the detection signal of the 3D accelerometer. If the material to be sealed stops moving during transportation due to parking or storage (e.g., the acceleration in any direction of the X, Y, or Z axis is continuously below 0.05g), the circuit board will not immediately return to low-power sleep mode, but will continue to run in operation and maintenance mode for a period of time (3 minutes). If the 3D accelerometer detects acceleration fluctuations exceeding the preset threshold again, the countdown will be reset; otherwise, the circuit board will return to low-power sleep mode, and the main control MCU will shut down the communication module and the positioning module. In operation and maintenance mode, the main control MCU collects location information, movement speed and battery voltage every once every 15 seconds and uploads them to the backend server through the communication module.

[0027] 2) When the mainboard is in low-power sleep mode, it supports vibration wake-up, including: When the sample to be sealed is subjected to impact, fall or damage during static placement or transportation, the instantaneous acceleration peak detected by the 3D accelerometer will exceed the preset high-sensitivity anti-vibration threshold (e.g., the instantaneous vibration acceleration peak is greater than 2.0g). At this time, it is determined that the sample to be sealed is in an abnormal vibration state. The main control MCU is urgently awakened and directly starts the communication module to send a data packet carrying a high-priority strong vibration mark and location information to the background server, realizing event-triggered real-time alarm.

[0028] 3) When the circuit board is in low-power sleep mode, it supports waking up by removal actions, including: When someone cuts the cable ties or damages the casing to remove the label during the sample sealing and storage period, the microswitch will reset and open due to the loss of pressure. At this time, it is determined that the sample to be sealed is in an abnormal removal state. The main control MCU receives the disconnect signal from the microswitch, and the low-to-high level transition triggers a hardware interrupt in the main control MCU. The circuit board enters the removal and maintenance mode. In the removal and maintenance mode, the main control MCU uses the energy storage capacitor inside the tag and the delayed cut-off mechanism of the main power supply circuit of the battery to start the communication module and the positioning module in a very short time. It also uploads an abnormal removal alarm to the back-end server through the communication module and uploads the last location information to the back-end server to achieve evidence locking. After the abnormal removal alarm is uploaded, the main control MCU executes the shutdown process to completely cut off the power supply to the circuit board, prevent unnecessary power depletion, and achieve safe closed-loop management.

[0029] To address the problem of high-frequency false wake-ups and false alarms caused by vibrations during long-distance transportation and in harsh power storage environments, this invention designs an adaptive state classification algorithm based on the fusion of triaxial acceleration sliding window variance and energy time-frequency features, specifically including the following steps: S11. Triaxial acceleration data acquisition and gravity compensation: The main control MCU controls the 3D accelerometer to continuously acquire (sampling frequency of 50Hz) three-axis acceleration data (a) along the X, Y, and Z axes. x ,a y ,a z ), and calculate the resultant acceleration a. total : ; Among them, a x a y a z These are the accelerations along the X, Y, and Z axes, respectively. To eliminate the constant deviation introduced by gravitational acceleration when the sample to be sealed is tilted, a first-order IIR high-pass filter is designed to filter the composite acceleration a. total Filtering is performed to separate the dynamic acceleration 'a' after eliminating gravity interference. dynamic : a dynamic =a total -g static ; Among them, g static The static gravity reference value represents the composite acceleration due to gravity of the material to be sealed in a static state, and is continuously iteratively output by a first-order IIR high-pass filter (cutoff frequency of 0.5Hz); S12. Sliding window feature extraction: The main control MCU sets up a sliding window (the main control MCU allocates a sliding window with a time span of 1.28s in its internal RAM, corresponding to a total number of samples W=64 within the sliding window, and an overlap rate of 50% between adjacent sliding windows). For the dynamic acceleration within each sliding window, the following three dimensions of feature indicators are calculated: 1) Variance Var reflects the overall vibration energy level of the material to be sealed: ; Among them, a dynamic (i) represents the i-th dynamic acceleration within the sliding window, a meanis the average dynamic acceleration within the sliding window, and W is the total number of samples within the sliding window; 2) Peak-to-peak value (P2P) is used to characterize instantaneous impact intensity: P2P=a dynamic,max -a dynamic,min ; Among them, a dynamic,max a dynamic,min These represent the maximum and minimum dynamic acceleration values ​​within the sliding window, respectively. 3) The low-frequency band energy density integral Espec in the frequency domain is used to characterize the vibration energy of environmental noise (random noise vibration parameters): The dynamic acceleration within the sliding window is subjected to FFT transformation, and the energy spectral density integral value in the low frequency band of 1Hz~10Hz is calculated to identify the characteristics of low-frequency random noise vibration in the continuous environment. S13, Multi-level state classification adaptive decision-making: The main control MCU compares the characteristic indicators with preset thresholds, executes multi-level classification decision logic, classifies the materials to be sealed into the following four states, and adopts corresponding power consumption control strategies: 1) If Var <static thr And P2P <p2p thr If the sample is in a static state, the main circuit board enters a low-power sleep mode and only performs a watchdog reset operation. Among them, static thr The static state variance threshold, p2p thr The threshold for determining the minimum peak value in a static state; 2) If static is satisfied thr ≤Var <active thr If Espec is concentrated in a preset narrow frequency band, it is determined that the sample to be sealed is in an environmental noise and vibration state. At this time, the main control MCU recognizes the environmental noise and vibration as invalid interference, does not start the communication module and positioning module, filters the dynamic acceleration in the current sliding window, and the circuit motherboard keeps a low power sleep mode. This step can filter out more than 95% of environmental noise and vibration false wake-up, which greatly protects the battery life. Among them, active thr The threshold for determining the variance of motion states; 3) If the active condition is met thr If the value is ≤Var and multiple (preferably 3) consecutive sliding windows meet this condition, it is determined that the material to be sealed is in motion. At this time, the 3D accelerometer generates an interrupt signal, which wakes up the main control MCU through the hardware interrupt pin, and the circuit motherboard enters the operation and maintenance mode. 4) If the impact condition is satisfiedthr If ≤P2P, it is determined that the sample to be sealed is in an abnormal vibration or abnormal dismantling state. At this time, the main control MCU is not limited by the normal state and directly starts the communication module and positioning module through a high-priority external interrupt to report the abnormal alarm in time. Among them, impact thr The threshold for determining the variance of vibration or demolition status.

[0030] Specifically, when the circuit board is in low-power sleep mode and the watchdog reset operation is performed, an adaptive fast determination mechanism is introduced, including: Within the watchdog feeding clock's time window (20 seconds), the main control MCU quickly reads the latest multiple (10) dynamic accelerations from the 3D accelerometer's built-in FIFO buffer and calculates the temporary variance Var. temp : If Var temp <temp thr If the signal is positive, it indicates that the sample to be sealed is still in a static state. After the main control MCU performs the dog-feeding operation, the circuit board immediately returns to the low-power sleep mode. If temp thr ≤Var temp If the sample is affected by potential movement or force fluctuations, the main circuit board will refuse to return to the low-power sleep mode. The main control MCU will collect the dynamic acceleration of a sliding window and execute S12 and S13, thereby ensuring the real-time status capture under the premise of ultra-low standby current. Among them, temp thr This is a temporary variance threshold used to determine whether the time to return to low-power sleep mode should be extended after the motherboard performs a watchdog reset operation.

[0031] To prevent false alarms and abnormal removal of microswitches due to mechanical loosening and poor connection during long-distance transportation, this invention designs a microswitch level filtering and adaptive threshold anti-tampering safety judgment algorithm, which specifically includes the following steps: S21, Micro-motion level state dejitter sampling: The main control MCU samples the level state of the GPIO pin of the micro switch at a fixed frequency (sampling frequency of 100Hz). Each sampling yields a binary state value s, where 0 represents closed and locked, and 1 represents open and released. S22. Smoothing process based on moving average and first-order difference filtering: To filter out the noise caused by intermittent contact of the microswitch contact spring due to sudden bumps, the main control MCU performs sliding mean smoothing on multiple (10) consecutive sample values ​​and calculates the estimated open-circuit probability P of the microswitch within the current sliding mean period. openThis is used to reflect the degree of loose connection of the microswitch; simultaneously, it calculates the first-order difference value Diff of the microswitch's level state between two adjacent sampling periods. s Used to capture instantaneous level transition edges; S23. Adaptive anti-tamper detection threshold configuration based on triaxial acceleration characteristics: When the sample to be sealed is in a static state, due to the absence of external interference, the microswitch's mechanical state is stable, and the open circuit probability threshold is adaptively tightened. thr The open-circuit probability threshold is set to open. thr The value is set to 0.2, meaning that at least two out of ten consecutive sample values ​​are disconnected and remain so for a period of time (100ms) before it is determined that the material to be sealed is in an abnormal dismantling state. When the sample to be sealed is in motion, the microswitch becomes unstable due to severe vehicle vibration, causing the open circuit probability threshold to be adaptively released. thr The open-circuit probability threshold is set to open. thr The value is set to 0.8, meaning that at least 8 out of 10 consecutive sample values ​​are disconnected and remain disconnected for a period of time (500ms) before it is determined that the material to be sealed is in an abnormal dismantling state.

[0032] The aforementioned anti-tampering security judgment algorithm perfectly eliminates false alarms during transportation at the physical level, while ensuring extremely high sensitivity anti-tampering security defense capabilities during static storage.

[0033] Based on the above-disclosed hook-on smart sealing label, this invention also discloses a method for operating the hook-on smart sealing label, such as... Figure 2 As shown, it includes the following three stages: Phase 1: Tag activation and power-on status detection: A cold start is performed by tightening the cable ties and squeezing the micro switch in the mounting slot. After power-on, the main control MCU configuration and watchdog clock initialization are completed. Then, the level state of the micro switch is read. After determining that the power-on is normal, the hardware configuration and protocol stack initialization of the 3D accelerometer sensor, communication module and positioning module are performed in sequence. Phase Two: Initial Power-On and Initial Information Upload After initialization, it is determined whether it is the first power-on. If it is the first power-on, the communication module and positioning module are turned on, location information is collected and the first reported binding activation information is uploaded. Then, the first power-on count flag in the EEPROM is modified, and the communication module and positioning module are controlled to enter low-power sleep mode after power-off. If it is not the first power-on, the communication module and positioning module are turned off directly and the low-power sleep mode is entered to reduce unnecessary power consumption. The third stage involves timed wake-up and dog feeding in low-power sleep mode: In low-power sleep mode, the main control MCU shuts down the communication module and the positioning module. The watchdog timer runs according to the period (20s). Every once in a while, the watchdog overflows and wakes up the main control MCU. The main control MCU performs a watchdog feeding operation to prevent a crash and performs an external test on the level of the micro switch. After confirming that there is no abnormality, the watchdog timer is reconfigured and the system returns to low-power sleep mode (this process is completed within 5ms), so that the standby power consumption is kept at an extremely low level.

[0034] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A hook-on intelligent sample sealing label, characterized in that: Includes the following structural components: Cable ties, extending through the inside of the casing, are used to secure the samples to be sealed. The mounting slot is a channel that runs through the inside of the housing for inserting mounting cables; The micro-trigger device is a micro switch installed inside the path of the hook-up slot. When the hook-up cable tie is tightened and locked, the micro switch is closed due to the squeezing effect of the hook-up cable tie. When the hook-up cable tie is cut, the micro switch is reset and opened. The material-fitting surface is located at the end of the housing and is used to accommodate and tightly adhere to the material to be sealed. The main circuit board maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It is also woken up when the status of the sample to be sealed changes and performs rapid auxiliary positioning. It accurately identifies the current status and prevents false alarms by running an adaptive state classification algorithm based on the fusion of three-axis acceleration sliding window variance and energy time-frequency features. It also prevents false alarms from the microswitch by running an anti-tamper safety judgment algorithm based on microswitch level filtering and adaptive threshold. The LED light will blink locally when the device is powered on, when it is abnormally removed, or when the battery is low.

2. The hanging-type intelligent sealing label according to claim 1, characterized in that: The main circuit board includes a main control MCU, a 3D accelerometer sensor, a positioning module, and a communication module; The main control MCU maintains a low-power sleep mode when it receives a closed signal from the microswitch. When it receives an open signal from the microswitch, the level transition triggers a hardware interrupt and an anti-tamper alarm. It also receives the detection signal from the 3D accelerometer and is woken up when the state of the sample to be sealed changes. It accurately identifies the current state and prevents false alarms by running an adaptive state classification algorithm based on the fusion of the variance of the three-axis acceleration sliding window and the energy time-frequency characteristics. It also prevents false alarms from the microswitch by running an anti-tamper security judgment algorithm based on microswitch level filtering and adaptive threshold. The 3D accelerometer is used to continuously monitor the three-axis acceleration changes of the sample to be sealed and send the detection signal to the main control MCU. It also supports hardware interrupt wake-up. The positioning module, in cold start / warm start mode, works with the communication module to perform A-GPS rapid assisted positioning.

3. The hanging-type intelligent sealing label according to claim 2, characterized in that: When the circuit board is in low-power sleep mode, it supports three-dimensional acceleration motion detection wake-up, including: When the material to be sealed is displaced or transported, the 3D accelerometer detects acceleration fluctuations exceeding a preset threshold. At this point, it is determined that the material to be sealed is in motion, and the 3D accelerometer generates an interrupt signal, which wakes up the main control MCU through the hardware interrupt pin. The circuit motherboard then enters the operation and maintenance mode. The main control MCU starts the communication module to reconnect to the base station / network and starts the positioning module to obtain the current location information; In operation and maintenance mode, the main control MCU continuously monitors the detection signal of the 3D accelerometer. If the material to be sealed stops moving during transportation due to parking or storage, the main circuit board will not immediately return to low-power sleep mode, but will continue to run in operation and maintenance mode for a period of time. If the 3D accelerometer detects acceleration fluctuations exceeding the preset threshold again, the countdown will be reset; otherwise, the main circuit board will return to low-power sleep mode, and the main control MCU will shut down the communication module and the positioning module. In operation and maintenance mode, the main control MCU collects location information, movement speed and battery voltage every once in a while, and uploads them to the back-end server through the communication module.

4. The hanging-type intelligent sealing label according to claim 3, characterized in that: When the circuit board is in low-power sleep mode, it supports vibration wake-up, including: When the material to be sealed is subjected to impact, fall or damage during static placement or transportation, the instantaneous acceleration peak detected by the 3D accelerometer will exceed the preset high-sensitivity anti-vibration threshold. At this time, it is determined that the material to be sealed is in an abnormal vibration state. The main control MCU is urgently awakened and directly starts the communication module to send a data packet carrying a high-priority strong vibration mark and location information to the background server, realizing event-triggered real-time alarm.

5. The hook-on intelligent sealing label according to claim 4, characterized in that: When the circuit board is in low-power sleep mode, it supports being woken up by removal actions, including: When someone cuts the cable ties or damages the casing to remove the label during the sample sealing and storage period, the microswitch will reset and open due to the loss of pressure. At this time, it is determined that the sample to be sealed is in an abnormal removal state. The main control MCU receives the disconnect signal from the microswitch, and the low-to-high level transition triggers a hardware interrupt in the main control MCU. The circuit board enters the removal and maintenance mode. In the removal and maintenance mode, the main control MCU uses the energy storage capacitor inside the tag and the delayed cut-off mechanism of the main power supply circuit of the battery to start the communication module and the positioning module in a very short time. It also uploads an abnormal removal alarm to the back-end server through the communication module and uploads the last location information to the back-end server to achieve evidence locking. After the abnormal removal alarm is uploaded, the main control MCU executes the shutdown process to completely cut off the power supply to the circuit board, prevent unnecessary power depletion, and achieve safe closed-loop management.

6. The hook-on intelligent sample sealing label according to claim 5, characterized in that: The adaptive state classification algorithm based on the fusion of triaxial acceleration sliding window variance and energy time-frequency features specifically includes the following steps: S11. Triaxial acceleration data acquisition and gravity compensation: The main control MCU controls the 3D accelerometer to continuously collect three-axis acceleration data (a, b, c) along the X, Y, and Z axes. x ,a y ,a z ), and calculate the resultant acceleration a. total : ； Among them, a x a y a z These are the accelerations along the X, Y, and Z axes, respectively. To eliminate the constant deviation introduced by gravitational acceleration when the sample to be sealed is tilted, a first-order IIR high-pass filter is designed to filter the composite acceleration a. total Filtering is performed to separate the dynamic acceleration 'a' after eliminating gravity interference. dynamic : a dynamic =a total -g static ; Among them, g static The static gravity reference value represents the combined gravitational acceleration of the sample to be sealed in a static state, which is continuously iteratively output by a first-order IIR high-pass filter; S12. Sliding window feature extraction: The main control MCU sets a sliding window, and for the dynamic acceleration within each sliding window, calculates the following three characteristic indicators: 1) Variance Var reflects the overall vibration energy level of the material to be sealed: ； Among them, a dynamic (i) represents the i-th dynamic acceleration within the sliding window, a mean is the average dynamic acceleration within the sliding window, and W is the total number of samples within the sliding window; 2) Peak-to-peak value (P2P) is used to characterize instantaneous impact intensity: P2P=a dynamic,max -a dynamic,min ; Among them, a dynamic,max a dynamic,min These represent the maximum and minimum dynamic acceleration values ​​within the sliding window, respectively. 3) The low-frequency band energy density integral Espec in the frequency domain is used to characterize the vibration energy of environmental noise: The dynamic acceleration within the sliding window is subjected to FFT transformation, and the energy spectral density integral value in the low frequency band of 1Hz~10Hz is calculated to identify the characteristics of low-frequency random noise vibration in the continuous environment. S13, Multi-level state classification adaptive decision-making: The main control MCU compares the characteristic indicators with preset thresholds, executes multi-level classification decision logic, classifies the materials to be sealed into the following four states, and adopts corresponding power consumption control strategies: 1) If Var <static thr And P2P <p2p thr If the sample is in a static state, the main circuit board enters a low-power sleep mode and only performs a watchdog reset operation. Among them, static thr The static state variance threshold, p2p thr The threshold for determining the minimum peak value in a static state; 2) If static is satisfied thr ≤Var <active thr If Espec is concentrated in a preset narrow frequency band, it is determined that the material to be sealed is in an environmental noise vibration state. At this time, the main control MCU considers the environmental noise vibration to be invalid interference, does not start the communication module and positioning module, filters the dynamic acceleration in the current sliding window, and the circuit motherboard keeps a low power sleep mode. Among them, active thr The threshold for determining the variance of motion states; 3) If the active condition is met thr If the value is less than or equal to Var, and multiple consecutive sliding windows meet this condition, it is determined that the material to be sealed is in motion. At this time, the 3D accelerometer generates an interrupt signal, which wakes up the main control MCU through the hardware interrupt pin, and the circuit motherboard enters the operation and maintenance mode. 4) If the impact condition is satisfied thr If the value is ≤P2P, it is determined that the sample to be sealed is in an abnormal vibration or abnormal dismantling state. At this time, the main control MCU is not limited by the normal state and directly starts the communication module and positioning module through a high-priority external interrupt to report the abnormal alarm in time. Among them, impact thr The threshold for determining the variance of vibration or demolition status.

7. The hook-on intelligent sealing label according to claim 6, characterized in that: When the circuit board is in low-power sleep mode and the watchdog reset operation is performed, an adaptive fast determination mechanism is introduced, including: Within the watchdog feeding clock time window, the main control MCU quickly reads the latest multiple dynamic accelerations from the FIFO buffer built into the 3D accelerometer and calculates the temporary variance Var. temp : If Var temp <temp thr If the signal is positive, it indicates that the sample to be sealed is still in a static state. After the main control MCU performs the dog-feeding operation, the circuit board immediately returns to the low-power sleep mode. If temp thr ≤Var temp If the sample is affected by potential movement or force fluctuations, the main circuit board will refuse to return to the low-power sleep mode. The main control MCU will collect the dynamic acceleration of a sliding window and execute S12 and S13, thereby ensuring the real-time status capture under the premise of ultra-low standby current. Among them, temp thr This is a temporary variance threshold used to determine whether the time to return to low-power sleep mode should be extended after the motherboard performs a watchdog reset operation.

8. The hook-on intelligent sealing label according to claim 6, characterized in that: The tamper-proof security determination algorithm based on microswitch level filtering and adaptive threshold specifically includes the following steps: S21, Micro-motion level state dejitter sampling: The main control MCU samples the level state of the GPIO pin of the micro switch at a fixed frequency. Each sample yields a binary state value s, where 0 represents closed and locked, and 1 represents open and released. S22. Smoothing process based on moving average and first-order difference filtering: To filter out the intermittent contact noise of the microswitch contact spring caused by momentary bumps, the main control MCU performs sliding mean smoothing on multiple consecutive sampled values ​​and calculates the estimated open-circuit probability P of the microswitch within the current sliding mean period. open This is used to reflect the degree of loose connection of the microswitch; simultaneously, it calculates the first-order difference value Diff of the microswitch's level state between two adjacent sampling periods. s Used to capture instantaneous level transition edges; S23. Adaptive anti-tamper detection threshold configuration based on triaxial acceleration characteristics: When the sample to be sealed is in a static state, due to the absence of external interference, the microswitch's mechanical state is stable, and the open circuit probability threshold is adaptively tightened. thr The open-circuit probability threshold is set to open. thr The value is set to 0.2, meaning that at least two out of ten consecutive sample values ​​are disconnected and remain so for a period of time before the material to be sealed is determined to be in an abnormal dismantling state. When the sample to be sealed is in motion, the microswitch becomes unstable due to severe vehicle vibration, causing the open circuit probability threshold to be adaptively released. thr The open-circuit probability threshold is set to open. thr The value is set to 0.8, meaning that at least 8 out of 10 consecutive sample values ​​are disconnected and remain so for a period of time before it is determined that the material to be sealed is in an abnormal dismantling state.

9. A method for operating a hook-on smart sealing label, applicable to the hook-on smart sealing label as described in claim 1, characterized in that: It includes the following three stages: Phase 1: Tag activation and power-on status detection: A cold start is performed by tightening the cable ties and squeezing the micro switch in the mounting slot. After power-on, the main control MCU configuration and watchdog clock initialization are completed. Then, the level state of the micro switch is read. After determining that the power-on is normal, the hardware configuration and protocol stack initialization of the 3D accelerometer sensor, communication module and positioning module are performed in sequence. Phase Two: Initial Power-On and Initial Information Upload After initialization, it is determined whether it is the first power-on. If it is the first power-on, the communication module and positioning module are turned on, location information is collected and the first reported binding activation information is uploaded. Then, the first power-on count flag in the EEPROM is modified, and the communication module and positioning module are controlled to enter low-power sleep mode after power-off. If it is not the first power-on, the communication module and positioning module are turned off directly and the low-power sleep mode is entered to reduce unnecessary power consumption. The third stage involves timed wake-up and dog feeding in low-power sleep mode: In low-power sleep mode, the main control MCU shuts down the communication module and the positioning module. The watchdog timer runs periodically. Every once in a while, the watchdog overflows and wakes up the main control MCU. The main control MCU performs a watchdog feeding operation to prevent a crash and performs an external test on the level of the micro switch. After confirming that there is no abnormality, it reconfigures the watchdog timer and returns to low-power sleep mode, keeping the standby power consumption at an extremely low level.

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