Display panel and display device

Abstract

This application relates to a display panel and a display device. The display panel includes: a screen body having a light-emitting side and a backlight side disposed opposite to each other along the thickness direction of the display panel; a support layer disposed on the backlight side of the screen body; a conductor layer stacked on the side of the support layer facing away from the screen body, the conductor layer having a lower resistance than the support layer, and at least a portion of the edges of the conductor layer being flush with the edges of the support layer; and an electrostatic discharge layer disposed on the side of the conductor layer facing away from the support layer and electrically connected to the conductor layer, the conductor layer being configured to transfer charges located on the outer peripheral surface of the support layer to the electrostatic discharge layer. The display panel provided by this application can improve display performance and increase reliability.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] In the current display panel manufacturing process, a common step is to cut a large motherboard into multiple display panels. To improve cutting accuracy and speed, laser cutting is typically used. However, during this process, high temperatures are generated at the cut edges of the display panel, causing carbonization of some organic material layers. This results in conductive carbides forming at the edges of the finished TV panel, leading to a significant accumulation of electrical charge. This charge can easily travel along the adhesive between the screen and the support layer into the display panel, generating an unintended electric field that interferes with the switching control of transistors within the screen, ultimately reducing the reliability and display uniformity of the display panel.

[0003] Therefore, there is an urgent need for a display panel and a corresponding display device that can avoid abnormal charge accumulation and maintain good display uniformity. Summary of the Invention

[0004] This application provides a display panel and a display device, which can improve reliability and display effect.

[0005] In a first aspect, an embodiment of this application provides a display panel, comprising: a screen body having a light-emitting side and a backlight side disposed opposite to each other along the thickness direction of the display panel; a support layer disposed on the backlight side of the screen body; a conductor layer stacked on the side of the support layer facing away from the screen body, wherein the resistance of the conductor layer is lower than the resistance of the support layer, and at least a portion of the edges of the conductor layer are flush with the edges of the support layer; and an electrostatic discharge layer disposed on the side of the conductor layer facing away from the support layer and electrically connected to the conductor layer, wherein the conductor layer is configured to transfer charges located on the outer peripheral surface of the edge of the support layer to the electrostatic discharge layer.

[0006] According to one aspect of the embodiments of this application, along the thickness direction, the outer edge of the orthographic projection of the conductor layer overlaps with the outer edge of the orthographic projection of the support layer.

[0007] According to one aspect of the embodiments of this application, the conductor layer includes a composite conductive film, the composite conductive film includes a porous substrate layer and two first conductor sublayers respectively stacked on opposite sides of the porous substrate layer in the thickness direction, the porous substrate layer is provided with a plurality of connecting holes recessed in the thickness direction, and the first conductor sublayers partially extend into the connecting holes.

[0008] According to one aspect of the embodiments of this application, the connecting hole is disposed through the porous substrate layer along the thickness direction, and the two first conductor sublayers are connected to each other through the connecting hole.

[0009] According to one aspect of the embodiments of this application, a plurality of connection holes are arranged at intervals between each other, and the diameter of the connection holes is 3nm~50μm.

[0010] According to one aspect of the embodiments of this application, the composite conductive film further includes a second conductor sublayer, which is stacked on the side of the first conductor sublayer away from the porous substrate layer.

[0011] According to one aspect of the embodiments of this application, the composite conductive film includes two second conductor sublayers, which are respectively disposed on the side of the two first conductor sublayers away from the porous substrate layer; the sum of the thicknesses of the two first conductor sublayers, the two second conductor sublayers, and the porous substrate layer is 9 μm to 10 μm, and the thickness of at least one of the first conductor sublayers and the second conductor sublayers is less than or equal to 1 μm.

[0012] According to one aspect of an embodiment of this application, the first conductor sublayer comprises copper, and the second conductor sublayer comprises nickel.

[0013] According to one aspect of the embodiments of this application, the composite conductive film further includes a heat dissipation layer, which is disposed on the side of the first conductor sublayer away from the porous substrate layer and on the side of the porous substrate layer facing the screen body. The thermal conductivity of the heat dissipation layer is better than that of the porous substrate layer.

[0014] According to one aspect of the embodiments of this application, the heat dissipation layer includes graphene resin, and the thickness of the heat dissipation layer is less than or equal to 5 μm.

[0015] According to one aspect of the embodiments of this application, the conductor layer includes a conductive coating disposed on the surface of the support layer away from the screen body; the conductive coating includes a metal oxide, and / or the conductive coating includes nano-silver.

[0016] According to one aspect of an embodiment of this application, the resistance of the conductor layer is less than or equal to 0.4Ω.

[0017] According to one aspect of the embodiments of this application, along the thickness direction, the orthographic projection of the conductor layer overlaps with the orthographic projection of the support layer; or, the conductor layer is annular and encloses a central hole, and the edge of the conductor layer away from the central hole is flush with the edge of the support layer.

[0018] According to one aspect of the embodiments of this application, the conductor layer is annular and surrounds a central hole, and the display panel further includes a buffer member, which is at least partially disposed in the same layer as the conductor layer and fills the central hole; or, the electrostatic discharge layer at least partially fills the central hole.

[0019] According to one aspect of the embodiments of this application, the display panel further includes an adhesive layer, which is bonded between the conductor layer and the support layer; the adhesive layer includes a colloid and metal powder encapsulated in the colloid, and the ratio between the weight of the metal powder and the weight of the adhesive layer is less than or equal to 0.2.

[0020] According to one aspect of the embodiments of this application, the electrostatic discharge layer includes a conductive adhesive layer and a metal grounding layer stacked together, wherein the conductive adhesive layer is bonded between the conductive layer and the metal grounding layer.

[0021] Secondly, according to embodiments of this application, a display device is provided, including the display panel in any embodiment of the first aspect.

[0022] The display panel provided in this application includes a screen body, a support layer, a conductor layer, and an electrostatic discharge layer arranged sequentially along the thickness direction. At least a portion of the edge of the conductor layer is flush with the edges of the screen body and the support layer. The conductor layer is capable of carrying charge, that is, it can smoothly conduct the charge that is easily generated at the cutting position of the edges of the screen body and the support layer to the electrostatic discharge layer for release. This can effectively reduce the possibility of charge accumulating at the position of the support layer and / or the adhesive layer between the support layer and the screen body to form an electric field, which may adversely affect the display and control of the screen body, thereby improving the reliability of the display panel and improving the display effect. Attached Figure Description

[0023] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of a composite conductive film provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 4 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 6 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0025] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale.

[0026] 100 - Display panel; 200 - Display device; 101-Carbide; 10-Screen body; 20-Support layer; 30-Conductor layer; 40-Static discharge layer; 50-Buffer; 60-Adhesive layer; 70-Cover plate; 80-Polarizing film; 11-Light-emitting side; 12-Backlight side; 31-Composite conductive film; 32-Conductive coating; 33-Center hole; 311 - Porous substrate layer; 312 - First conductor sublayer; 313 - Connecting hole; 314 - Second conductor sublayer; 315 - Heat dissipation layer; X - Thickness direction. Detailed Implementation

[0027] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0028] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the molding die and molding method of this application. It should also be noted that, unless otherwise explicitly specified and limited, "multiple" means two or more, and the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. The terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art will understand the specific meaning of these terms in this application based on the specific circumstances.

[0030] With the continuous development of display technology, existing users have placed higher demands on the display quality and reliability of display panels. Among these, display uniformity is a particularly important parameter, which is closely related to the performance and state of the transistors controlling each light-emitting unit in the display panel. Furthermore, in the manufacturing process of display panels, a large master board is typically manufactured first, and then the large master board is divided into multiple display panel units of the required size. To improve cutting accuracy and speed, and to adapt to special cutting trajectories, laser cutting is usually used in this division process.

[0031] Based on this, the applicant discovered that high temperatures are generated at the cut points during laser cutting, and multiple layers in the display panel, such as the screen body and back support layer, include films made of organic materials, such as polyimide and polyethylene terephthalate. These organic materials carbonize due to the high temperatures generated during laser cutting, forming conductive carbides on the sides of the display panel.

[0032] Consequently, these carbides are distributed on the side peripheral surfaces of the cut screen and support layer, becoming accumulation points for static charges. During actual use or testing of the display panel, static charges from the environment or generated by friction easily accumulate here. The accumulated charges migrate along the carbide paths and enter the adhesive layer used to bond the screen and support layer, forming an unintended electric field. This electric field penetrates into the interior of the screen, interfering with the movement of charge carriers in the thin-film transistors, leading to problems such as threshold voltage drift and increased leakage current. Ultimately, this manifests as display defects such as uneven brightness, flickering, or image retention, severely affecting the display panel's display effect and reliability.

[0033] To address the aforementioned issues, this application provides a display panel that improves display performance and enhances reliability.

[0034] To better understand this application, the following will be combined with... Figures 1 to 6 Provide a detailed description.

[0035] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application.

[0036] In a first aspect, an embodiment of this application provides a display panel 100, comprising: a screen body 10 having a light-emitting side 11 and a backlight side 12 disposed opposite to each other along the thickness direction X of the display panel 100; a support layer 20 disposed on the backlight side 12 of the screen body 10; a conductor layer 30 stacked on the side of the support layer 20 facing away from the screen body 10, wherein the resistance of the conductor layer 30 is lower than the resistance of the support layer 20, and at least a portion of the edges of the conductor layer 30 are flush with the edges of the support layer 20; and an electrostatic discharge layer 40 disposed on the side of the conductor layer 30 facing away from the support layer 20 and electrically connected to the conductor layer 30, wherein the conductor layer 30 is configured to transfer charges located on the outer peripheral surface of the edge of the support layer 20 to the electrostatic discharge layer 40.

[0037] This application provides a display panel 100, which includes a screen body 10, a support layer 20, a conductor layer 30, and an electrostatic discharge layer 40 arranged sequentially along its thickness direction X. The screen body 10 serves as the core component for providing display functions. The screen body 10 has a light-emitting side 11 and a backlight side 12 arranged opposite to each other along the thickness direction X, with the side facing the user and displaying the image being the light-emitting side 11.

[0038] The support layer 20 is disposed on the backlight side 12 of the screen body 10. This support layer 20 can be used to provide structural support and impact protection for the relatively flexible screen body 10, reducing the possibility of plastic deformation or damage to the screen body 10 under external force. The material of the support layer 20 can be selected from polymer films commonly used in the display field, such as polyethylene terephthalate and polyimide. Alternatively, the support layer 20 can also be made of metal sheet or glass sheet with a certain degree of rigidity. This application does not make specific limitations in this regard, as long as it can provide the screen body 10 with the required mechanical strength.

[0039] A conductor layer 30 is stacked on the side of the support layer 20 facing away from the screen 10, and the conductor layer 30 has a lower resistance than the support layer 20, which can be adjusted by different materials. At least a portion of the edges of the conductor layer 30 are flush with the edges of the support layer 20; that is, at least a portion of the outer peripheral surface of the conductor layer 30 and at least a portion of the outer peripheral surface of the support layer 20 can be flush and coplanar. Here, the outer peripheral surface refers to the outer edge surface of the conductor layer 30 away from its central region. Therefore, in embodiments where carbides 101 are formed by cutting on the outer peripheral surfaces of the screen 10 and the support layer 20, the conductor layer 30 can contact and form an electrical connection with the carbides 101, and conduct and transfer the charge accumulated on the carbides 101 to the conductor layer 30.

[0040] Optionally, the outer edge of the conductor layer 30 can be conformally shaped and completely flush with the outer edge of the support layer 20. That is, when the display panel 100 is projected orthographically along the thickness direction X, the edge of the orthographic projection of the conductor layer 30 can completely coincide with the edge of the orthographic projection of the support layer 20. This allows the outer surface of the conductor layer 30 to contact the carbide 101 in all directions, enabling faster charge transfer. It is understood that at the edge where the conductor layer 30 is flush with the support layer 20, the edge of the conductor layer 30 may also contain carbide 101 formed by cutting. This portion of carbide 101 can be integrated with the carbide 101 on the support layer 20 and the side of the screen 10 through integral cutting, directly conducting charge to the conductor layer 30.

[0041] An electrostatic discharge layer 40 is disposed on the side of the conductor layer 30 opposite to the support layer 20 and electrically connected to the conductor layer 30. The electrostatic discharge layer 40 provides a path for releasing charge to the conductor layer 30. Exemplarily, the layer structure can be a composite structure of conductive material and adhesive material, wherein the conductive material can be metal foil or the like. The conductive material can be directly electrically connected to the conductor layer 30, or it can be indirectly electrically connected to the conductor layer 30 through conductive adhesive as an adhesive material. This application does not impose any specific limitations on this, as long as the electrostatic discharge layer 40 can provide a low-impedance discharge path for the charge transferred to the conductor layer 30.

[0042] In summary, during the testing or operation of the display panel 100, since at least a portion of the edge of the conductor layer 30 is flush with the edge of the support layer 20, when conductive carbides 101 are generated and static charges accumulate on the side peripheral surfaces of the screen 10 and / or the support layer 20 due to cutting, these charges will not migrate inward along the high-resistance support layer 20 or the adhesive layer connecting the support layer 20 and the screen 10. Instead, they will be attracted to the lower-resistance end face of the conductor layer 30. The charges entering the conductor layer 30 will then be rapidly conducted within the conductor layer 30 and eventually transferred to the electrostatic discharge layer 40 electrically connected to the conductor layer 30, where the electrostatic discharge layer 40 dissipates or guides the charges to the ground terminal.

[0043] By adopting the above structure, the display panel 100 in this embodiment can construct a low-impedance electrostatic discharge path on the side of the screen 10 and the backlight side 12, starting from the sidewall carbide 101, passing through the conductor layer 30, and finally extending to the electrostatic discharge layer 40. This path can quickly release the charge accumulated at the carbide 101, reducing the possibility of charge entering the adhesive layer and forming an interfering electric field, thereby improving the reliability of the display panel 100 and improving the display effect.

[0044] In some alternative embodiments, along the thickness direction X, the outer edge of the orthographic projection of the conductor layer 30 overlaps with the outer edge of the orthographic projection of the support layer 20.

[0045] Optionally, the conductor layer 30 in this embodiment can be further configured to have edges that are flush with the support layer 20 at all points. That is, when projected orthogonally along the thickness direction X of the display panel 100, the outer edge of the orthogonal projection of the conductor layer 30 completely overlaps with the outer edge of the orthogonal projection of the support layer 20. This allows the shape and size of the conductor layer 30 to be completely consistent with the shape and size of the support layer 20, facilitating overall cutting. At the same time, it can further shorten the path of charge transfer from the side carbide 101 to the conductor layer 30, allowing the charge to find a low-resistance discharge path without lateral migration.

[0046] By adopting the aforementioned structure in which the outer edges of the orthographic projection are completely overlapping, the receiving area and conduction efficiency of electrostatic discharge can be maximized, further reducing the possibility of electrostatic discharge causing adverse effects on the display of the screen 10.

[0047] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of a composite conductive film provided in one embodiment of this application.

[0048] In some optional embodiments, the conductor layer 30 includes a composite conductive film 31, which includes a porous substrate layer 311 and two first conductor sublayers 312 respectively stacked on opposite sides of the porous substrate layer 311 in the thickness direction X. The porous substrate layer 311 is provided with a plurality of connecting holes 313 recessed along the thickness direction X, and the first conductor sublayers 312 partially extend into the connecting holes 313.

[0049] Optionally, the conductor layer 30 may adopt the structure of a composite conductive film 31, which includes at least one porous substrate layer 311 and two first conductor sublayers 312. The two first conductor sublayers 312 are respectively sandwiched between opposite sides in the thickness direction X, with the porous substrate layer 311 between them. The porous substrate layer 311 can serve as the framework structure of the composite conductive film 31 and is provided with micropores; that is, at least one of the two surfaces of the porous substrate layer 311 in the thickness direction X is provided with multiple connecting holes 313 recessed along the thickness direction X. These connecting holes 313 may include through holes and / or blind holes. Further, multiple connecting holes 313 may be provided on both surfaces.

[0050] Optionally, the porous substrate layer 311 can be a specially treated polymer film, such as a polyimide film or a polyester film. The connection holes 313 on the porous substrate layer 311 can be formed by drilling with a high-precision laser device, or these connection holes 313 can be formed by bombardment drilling with other special drilling equipment.

[0051] A first conductive sublayer 312 is stacked on each of the opposite sides of the porous substrate layer 311. These first conductive sublayers 312 can be formed on the porous substrate layer 311 by methods such as physical vapor deposition, chemical vapor deposition, or electroplating. Furthermore, in addition to the surface of the porous substrate layer 311, the first conductive sublayers 312 partially extend into the connecting holes 313 to reduce the spacing between the two first conductive sublayers 312, facilitating the formation of charge transfer pathways and improving the charge conductivity in the thickness direction X. The first conductive sublayers 312 are made of a material with good conductivity and fine shaping capabilities, such as a metal layer, to facilitate their entry into the connecting holes 313 while conducting charges.

[0052] Meanwhile, the structure of the first conductor sublayer 312 extending into the porous substrate layer 311 through the connecting hole 313 can effectively enhance the bonding force between the first conductor sublayer 312 and the porous substrate layer 311, and reduce the possibility of interlayer delamination occurring inside the composite conductive film 31 during the rolling or bending process.

[0053] By employing the aforementioned composite conductive film 31 structure with micropores and conductor sublayers extending into the micropores, good electrostatic conduction capability and high structural reliability can be provided, thereby improving the reliability of electrostatic discharge.

[0054] In some alternative embodiments, the connecting hole 313 is disposed through the porous substrate layer 311 along the thickness direction X, and the two first conductor sublayers 312 are connected to each other through the connecting hole 313.

[0055] Optionally, in an embodiment where the conductor layer 30 is a composite conductive film 31, all the connection holes 313 on the porous substrate layer 311 can be through holes that extend along the thickness direction X. In this embodiment, the two first conductor sublayers 312 respectively disposed on both sides of the porous substrate layer 311 can be physically connected to each other directly through these through connection holes 313.

[0056] Specifically, in this embodiment, the connecting holes 313 can be uniformly distributed in the porous substrate layer 311. The first conductor sub-layers 312 on both sides enter the connecting holes 313 through the openings on both sides of the connecting holes 313 and are at least partially attached to the hole walls of the connecting holes 313. This allows multiple conductor structures electrically connected along the thickness direction X to be formed between the two first conductor sub-layers 312, thereby combining the two physically separated first conductor sub-layers 312 into a conductive network directly interconnected by multiple points, that is, the two sub-layers are electrically connected as one.

[0057] By employing the aforementioned structure where the connecting holes 313 penetrate through and the first conductor sublayers 312 on both sides are directly connected, the charge conduction effect can be further improved. When charge enters the first conductor sublayer 312 near the support layer 20 from the edge, in addition to being conducted laterally within its plane, it can also be smoothly transferred to the first conductor sublayer 312 on the other side away from the support layer 20 through these penetrating conductive connecting posts. Subsequently, it is absorbed and released by the electrostatic discharge layer 40 electrically connected to it, thereby improving the response speed and efficiency of the electrostatic protection of the display panel 100.

[0058] In some optional embodiments, a plurality of connection holes 313 are spaced apart from each other, and the diameter of the connection holes 313 is 3nm~50μm.

[0059] Optionally, the porous substrate layer 311 in this embodiment is provided with a plurality of connecting holes 313. These connecting holes 313 can be spaced apart from each other on the substrate layer. The diameter of each connecting hole 313 in all directions perpendicular to the thickness direction X can be between 3nm and 50μm, for example, it can be any one of 3nm, 300nm, 600nm, 900nm, 1μm, 15μm, 30μm, 45μm, 50μm or between any two of them. Correspondingly, the number of connecting holes 313 provided per square centimeter can be tens of thousands to hundreds of millions, which can be selected according to the required electrical conductivity parameters and the processing technology of the connecting holes 313, etc., and this application does not make a specific limitation in this regard.

[0060] The connecting hole 313 is disposed on the porous substrate layer 311 and has a small pore size. By limiting its pore size to the aforementioned range, the possibility that the processing technology is difficult to achieve due to the pore size being too small, and the possibility that the first conductor sublayer 312 is difficult to enter the connecting hole 313 for electrical connection, can be reduced. At the same time, it can also reduce the possibility that the mechanical support performance and surface flatness of the porous substrate layer 311 will be severely damaged due to the pore size being too large. Thus, the microporous structure with the pore size within the aforementioned numerical range facilitates the formation of high-density, discrete conductive paths on the substrate layer, and enables the composite conductive film 31 to have both good electrical conductivity and high reliability.

[0061] In some optional embodiments, the composite conductive film 31 further includes a second conductor sublayer 314, which is stacked on the side of the first conductor sublayer 312 away from the porous substrate layer 311.

[0062] Optionally, the composite conductive film 31 may further include at least one second conductor sublayer 314, which is stacked on the side of the first conductor sublayer 312 away from the porous substrate layer 311. More preferably, the second conductor sublayer 314 is disposed on the sides of the two first conductor sublayers 312 away from the porous substrate layer 311. The two second conductor sublayers 314 may have the same thickness, area, and constituent material.

[0063] The second conductor sublayer 314 and the first conductor sublayer 312 can be made of different conductive materials, and they can have the same or different thicknesses. The second conductor sublayer 314 can work synergistically with the first conductor sublayer 312, providing additional auxiliary functions through its material or shape while conducting charge. For example, materials with good corrosion resistance and wear resistance can be used to improve the overall reliability of the composite conductive film 31; or, materials matching the layer structures connected to both sides of the composite conductive film 31 in the thickness direction X can be used to improve the bonding performance with the layer structures on both sides. This can compensate for the shortcomings that the highly conductive first conductor sublayer 312 may have due to a single material.

[0064] By employing a multilayer composite structure with a first conductor sublayer 312 and a second conductor sublayer 314 stacked together, the advantages of different conductor materials can be combined, thereby improving the conductivity, environmental resistance and connection reliability of different materials, ultimately forming a conductor layer 30 with better overall performance.

[0065] In some optional embodiments, the composite conductive film 31 includes two second conductor sublayers 314, which are respectively disposed on the side of the two first conductor sublayers 312 away from the porous substrate layer 311; the sum of the thicknesses of the two first conductor sublayers 312, the two second conductor sublayers 314 and the porous substrate layer 311 is 9 μm to 10 μm, and the thickness of at least one of the first conductor sublayers 312 and the second conductor sublayers 314 is less than or equal to 1 μm.

[0066] Optionally, the composite conductive film 31 in this embodiment may include two second conductor sub-layers 314, respectively disposed on the outer side of the two first conductor sub-layers 312 away from the porous substrate layer 311, thereby forming a five-layer symmetrical structure for the composite conductive film 31 as a whole. This provides corresponding functions such as corrosion resistance, improved bonding performance, and improved conductivity on the outer side of both first conductor sub-layers 312.

[0067] Based on this, the overall thickness of the five-layer symmetrical composite conductive film 31 can be between 9μm and 10μm, for example, it can be any one of 9μm, 9.3μm, 9.6μm, and 10μm or between any two of them. By limiting the thickness of these five layers, the requirements for the overall thinness of the display panel 100 and the mechanical strength and conductivity requirements of the composite conductive film 31 can be met, thereby improving the overall reliability of the display panel 100.

[0068] Furthermore, the thicknesses of the two first conductor sublayers 312 can be the same, and the thicknesses of the two second conductor sublayers 314 can be the same. In the first conductor sublayer 312 and the second conductor sublayer 314, the thickness of at least one of them can be less than or equal to 1 μm. It is further optional that the thicknesses of all first conductor sublayers 312 and second conductor sublayers 314 are less than or equal to 1 μm.

[0069] By setting at least a portion of the conductor sublayer to have a thinner thickness, the internal stress generated during bending or rolling can be reduced, making it less prone to breakage or delamination. Furthermore, using a thinner conductor sublayer also reduces the overall thickness of the display panel 100.

[0070] In some alternative embodiments, the first conductor sublayer 312 comprises copper and the second conductor sublayer 314 comprises nickel.

[0071] Optionally, in an embodiment where the composite conductive film 31 includes both a first conductor sublayer 312 and a second conductor sublayer 314, the first conductor sublayer 312 may be made at least partially of copper, and the second conductor sublayer 314 may be made at least partially of nickel.

[0072] Copper, a metal with low resistivity, serves as the primary material for the first conductor sublayer 312, enabling it to provide a highly conductive and fast-moving channel for charge transport. Nickel, on the other hand, possesses excellent oxidation resistance, corrosion resistance, and hardness, compensating for copper's susceptibility to oxidation and corrosion. Furthermore, nickel exhibits good lattice matching with copper, facilitating the formation of a robust interfacial bond.

[0073] Therefore, by using a combination of copper as the inner layer and nickel as the outer layer in the composite conductive film, the functions of the two materials can be complementary, so that the composite conductive film 31 has both low resistance electrical conduction function and good chemical stability and mechanical durability, thereby improving the reliability of the display panel 100.

[0074] In some optional embodiments, the composite conductive film 31 further includes a heat dissipation layer 315, which is disposed on the side of the first conductor sublayer 312 away from the porous substrate layer 311 and on the side of the porous substrate layer 311 facing the screen 10. The thermal conductivity of the heat dissipation layer 315 is better than that of the porous substrate layer 311.

[0075] Optionally, the composite conductive film 31 in this embodiment may also be provided with a heat dissipation layer 315 for providing heat conduction. The heat dissipation layer 315 is disposed on the side of the first conductor sub-layer 312 away from the porous substrate layer 311, that is, on the outer side of the aforementioned composite structure in the thickness direction X, near the edge; at the same time, the heat dissipation layer 315 is located on the side of the porous substrate layer 311 facing the screen 10, so that the heat dissipation layer 315 can be the layer closest to the support layer 20 and the screen 10 in the entire composite conductive film 31.

[0076] The heat dissipation layer 315 in this embodiment can have better thermal conductivity than the porous substrate layer 311, meaning that heat can be transferred more quickly to the edge of the layer structure or other auxiliary heat dissipation structures in the heat dissipation layer 315, thereby releasing the heat generated during the operation of the screen 10 more quickly. For example, the porous substrate layer 311 can be a polymer film, while the heat dissipation layer 315 can be a resin layer containing highly thermally conductive fillers such as graphene, carbon nanotubes, and boron nitride, or it can be a thin metal layer, or the heat dissipation layer 315 can be composed of at least some of the aforementioned layer structures stacked together.

[0077] When the display panel 100 is working, the screen body 10 is one of the main heat sources. By setting a heat dissipation layer 315 in the composite conductive film 31 and placing the heat dissipation layer 315 closer to the screen body 10, heat can be absorbed from the heat source with a shorter path and faster speed, and spread and conducted laterally in its own plane, providing the function of uniform heat dissipation and heat dissipation, thereby improving the overall heat dissipation performance and reliability of the display panel 100, and reducing the possibility of uneven display or device lifespan degradation caused by local overheating.

[0078] In some optional embodiments, the heat dissipation layer 315 comprises graphene resin, and the thickness of the heat dissipation layer 315 is less than or equal to 5 μm.

[0079] In embodiments where a heat dissipation layer 315 is provided, the layer structure may be made entirely of graphene resin, or it may be made of other composite materials containing graphene resin. Graphene resin refers to a composite material formed by dispersing graphene powder in a resin matrix. Graphene has high in-plane thermal conductivity and stable properties. Combining it with resin can achieve good thermal conductivity while retaining the ease of film formation and flexibility of the resin.

[0080] Based on this, the thickness of the heat dissipation layer 315 can be less than or equal to 5μm, for example, it can be any one of 1μm, 2μm, 3μm, 4μm, 5μm or in between. By controlling the thickness within the aforementioned range, a lateral heat conduction channel can be formed between the screen body 10 and the support layer 20, while avoiding a significant increase in the overall thickness of the display panel 100 due to excessive film thickness or excessive bending stress during bending, which would reduce the bending life.

[0081] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application.

[0082] In some alternative embodiments, the conductor layer 30 includes a conductive coating 32 disposed on the surface of the support layer 20 away from the screen body 10; the conductive coating 32 includes a metal oxide, and / or the conductive coating 32 includes nano-silver.

[0083] Optionally, the conductor layer 30 in this embodiment may not adopt the structure of a composite film material, but may be directly set as one or more conductive coatings 32 formed on the surface of the support layer 20 away from the screen body 10.

[0084] The conductive coating 32 can be directly formed on the side of the support layer 20 away from the screen body 10 through processes such as coating, printing, or sputtering. The conductive coating 32 can be made of metal oxide, such as indium tin oxide or indium gallium zinc oxide, which have good transparency and conductivity. And / or, the conductive coating 32 can also be made of a material containing silver nanoparticles, such as a network structure formed by intersecting silver nanoparticles or a silver coating sprayed on the whole layer, which have good flexibility and conductivity.

[0085] By forming the conductive coating 32 directly on the surface of the support layer 20, the additional adhesive layer 60 between the conductor layer 30 and the support layer 20 can be eliminated, and the coating itself typically has a smaller thickness, thereby enabling the display panel 100 to have a thinner overall thickness and a simpler manufacturing process. By using metal oxides and / or nano-silver to form the conductive coating 32, the resistance of the coating can be reduced, achieving low-resistance electrostatic conduction, further improving the reliability of electrostatic conduction and release.

[0086] In some alternative embodiments, the resistance of conductor layer 30 is less than or equal to 0.4Ω.

[0087] Optionally, in the embodiments of this application, the overall resistance of the conductor layer 30 may be less than or equal to 0.4Ω, for example, it may be any one of 0.1Ω, 0.2Ω, 0.3Ω, 0.4Ω or between any two of them.

[0088] By limiting the resistance value to below 0.4Ω, static charge can be quickly and effectively conducted away from the screen 10. If the resistance of the conductor layer 30 is too high, its impedance as a charge transport channel will be large, and static charge may not be quickly conducted away, but instead choose to find other possible lower impedance paths, resulting in a decrease in the ability to improve the display effect.

[0089] In some alternative embodiments, the orthographic projection of the conductor layer 30 along the thickness direction X overlaps with the orthographic projection of the support layer 20; or, the conductor layer 30 is annular and encloses a central hole 33, with the edge of the conductor layer 30 away from the central hole 33 flush with the edge of the support layer 20.

[0090] Optionally, in this embodiment, the edge of the conductor layer 30 is at least partially flush with the edge of the support layer 20, thereby facilitating the transfer of charge in the carbide 101 cut at the edge of the support layer 20 to the conductor layer 30.

[0091] Based on this, the conductor layer 30 can adopt different structural forms. For example, the conductor layer 30 can be set as a whole layer, that is, along the thickness direction X, the orthographic projection of the conductor layer 30 can completely coincide with the orthographic projection of the support layer 20. By setting this solid film layer structure that covers the entire surface, a larger conductive volume and a shorter lateral transmission distance can be provided, thereby effectively reducing the path that the charge entering the conductor layer 30 needs to take to conduct to the electrostatic discharge layer 40.

[0092] Alternatively, the conductor layer 30 may not be a completely solid layer, but rather an annular structure with a central hole 33, which can penetrate the conductor layer 30 along the thickness direction X. In this case, the edge of the conductor layer 30 away from the central hole 33, i.e., the outer peripheral edge, can be flush with the edge of the support layer 20, and can be flush with each other everywhere, to achieve effective reception of charge at the edge carbide 101. The central hole 33 can be circular, rectangular, polygonal, or racetrack-shaped, etc., and this application does not make any specific limitation in this regard.

[0093] By providing a central hole 33 in the conductor layer 30, the overall material cost of the conductor layer 30 can be reduced, and space can be provided for other structures that need to be set in the display panel 100, such as sensors or chips.

[0094] Based on meeting the required charge conduction requirements, the aforementioned two structures can be selected according to the specific structure and parameter requirements of the display panel 100.

[0095] Please refer to the following: Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. Figure 5 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application.

[0096] In some alternative embodiments, the conductor layer 30 is annular and surrounds a central hole 33, and the display panel 100 further includes a buffer 50, which is at least partially disposed in the same layer as the conductor layer 30 and fills the central hole 33; or, the electrostatic discharge layer 40 is at least partially filled in the central hole 33.

[0097] As previously described, the conductor layer 30 may be annular and enclose a central hole 33 recessed along the thickness direction X. Optionally, in this embodiment, the display panel 100 may further include a buffer 50 filling the central hole 33. The buffer 50 is at least partially disposed in the same layer as the conductor layer 30 and fills the central hole 33 to compensate for step differences caused by the thickness of the conductor layer 30 itself.

[0098] Optionally, the thickness of the buffer 50 can be the same as the thickness of the conductor layer 30, so that it completely fills the central hole 33. Alternatively, the thickness of the buffer 50 can be greater than the thickness of the conductor layer 30, so that it is partially not disposed in the same layer as the conductor layer 30. This portion not disposed in the same layer as the conductor layer 30 can have a larger area than the portion extending into the central hole 33. For example, it can be integrally disposed and have an orthographic projection along the thickness direction X that coincides with the support layer 20, thereby avoiding the formation of new steps.

[0099] Optionally, the buffer 50 may be made of an elastic buffer material commonly used in the display panel 100, such as foam or gel, thereby providing additional shock protection to the central area of ​​the display panel 100 while compensating for step differences.

[0100] Alternatively, the display panel 100 may forgo the additional buffer 50 and instead utilize the existing electrostatic discharge layer 40 to compensate for the step difference in the conductor layer 30. Specifically, the electrostatic discharge layer 40 may partially fill the central hole 33. Existing electrostatic discharge layers 40 typically contain metal foil, foam, and adhesive, and inherently possess a certain ability to compensate for step differences in the thickness direction X. For example, during the lamination process, pressure and temperature can be controlled to cause the material of the electrostatic discharge layer 40 to flow or deform, filling the depression formed by the central hole 33, thereby self-compensating for the step difference.

[0101] By filling the central hole 33 with a buffer 50 or part of the static discharge layer 40, the surface difference caused by the thickness of the annular conductor layer 30 can be effectively compensated, making the display panel 100 flat and avoiding problems such as abnormal pressing noise or layer separation caused by the presence of cavities in this area.

[0102] In some optional embodiments, the display panel 100 further includes an adhesive layer 60, which is bonded between the conductor layer 30 and the support layer 20; the adhesive layer 60 includes a colloid and metal powder encapsulated in the colloid, and the ratio between the weight of the metal powder and the weight of the adhesive layer 60 is less than or equal to 0.2.

[0103] Optionally, the display panel 100 may also include an adhesive layer 60 for forming an adhesive bond between the conductor layer 30 and the support layer 20. The adhesive layer 60 may simultaneously include a colloid for providing adhesion and metal powder doped in the colloid for improving conductivity.

[0104] Specifically, the adhesive layer 60 includes a colloid as a matrix and metal powder encapsulated within the colloid. The colloid can be an optically transparent adhesive or a pressure-sensitive adhesive, and the metal powder can be conductive particles with good conductivity, such as silver powder, copper powder, or nickel powder. These metal powders can be uniformly dispersed in the colloid and form a certain conductive network inside the adhesive layer 60.

[0105] Based on this, the proportion of metal powder in the adhesive layer 60 can be controlled so that the weight percentage of metal powder in the overall adhesive layer 60 is less than or equal to 0.2, for example, it can be selected to be 0.1~0.2% by weight. If the proportion of metal powder in the adhesive layer 60 is too high, there will be too many metal particles in the colloid, which will lead to a decrease in the wettability and viscosity of the colloid, thereby weakening the bonding strength. By limiting this weight ratio to below 0.2, it is possible to ensure that the adhesive layer 60 has a certain conductivity while avoiding adverse effects on the basic adhesive bonding function of the adhesive layer 60 due to excessive addition of metal powder.

[0106] By incorporating a metal powder-doped adhesive layer 60, additional conductive penetration paths can be formed in its thickness direction X, further improving the efficiency of conducting static charge from the support layer 20 to the conductor layer 30. Furthermore, these dispersed metal particles can also serve as a reinforcing phase, improving the mechanical properties of the adhesive layer 60, such as increasing its shear strength and cohesive strength.

[0107] In some optional embodiments, the electrostatic discharge layer 40 includes a conductive adhesive layer and a metal grounding layer stacked together, with the conductive adhesive layer bonded between the conductor layer 30 and the metal grounding layer.

[0108] Optionally, the electrostatic discharge layer 40 may include a stacked conductive adhesive layer and a metal grounding layer. The conductive adhesive layer is used to bond the conductor layer 30 and the metal grounding layer. The conductive adhesive layer provides both physical bonding and electrical connection between the conductor layer 30 and the metal grounding layer, providing a continuous and reliable electrostatic discharge path while ensuring stable bonding. Optionally, in embodiments where the conductive adhesive layer has a certain thickness, this layer structure can also provide stress-absorbing buffering through its flexibility.

[0109] Optionally, the metal grounding layer can be a thin metal foil layer, such as a foil made of copper foil, aluminum foil, or other low-resistivity metal materials. This metal grounding layer serves as the final stage of electrostatic discharge, providing a large-area, low-impedance charge dissipation plane. Optionally, this metal grounding layer can ultimately be electrically connected to the system ground via auxiliary structures such as conductive foam, metal springs, or conductive cloth.

[0110] By configuring the electrostatic discharge layer 40 as the aforementioned double-layer structure, a stable and reliable mechanical connection and a low-impedance electrical connection can be provided, while the metal base layer can also provide a certain degree of electromagnetic shielding. Therefore, the electrostatic discharge layer 40 can safely discharge a large amount of static charge instantly, improving the overall effectiveness and reliability of electrostatic protection.

[0111] Optionally, the display panel 100 may also include other auxiliary structures, such as a cover plate 70, a polarizer 80, etc., which can be selected according to the specific functional requirements of the display panel 100. This application does not impose any specific limitations on this.

[0112] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0113] Secondly, according to embodiments of this application, a display device 200 is provided, including the display panel 100 in any embodiment of the first aspect.

[0114] The display device 200 provided in this application has all the beneficial effects of the display panel 100 provided in the first aspect. For details, please refer to the specific description of the display panel 100 in the above embodiments. This application will not repeat the details here.

[0115] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: The screen body has a light-emitting side and a backlight side that are disposed opposite to each other along the thickness direction of the display panel; A support layer is disposed on the backlight side of the screen. A conductor layer is stacked on the side of the support layer facing away from the screen body. The resistance of the conductor layer is lower than that of the support layer. At least a portion of the edges of the conductor layer are flush with the edges of the support layer. An electrostatic discharge layer is disposed on the side of the conductor layer opposite to the support layer and electrically connected to the conductor layer. The conductor layer is configured to transfer charges located on the outer peripheral surface of the edge of the support layer to the electrostatic discharge layer.

2. The display panel according to claim 1, characterized in that, Along the thickness direction, the outer edge of the orthographic projection of the conductor layer overlaps with the outer edge of the orthographic projection of the support layer.

3. The display panel according to claim 1 or 2, characterized in that, The conductor layer includes a composite conductive film, which includes a porous substrate layer and two first conductor sublayers stacked on opposite sides of the porous substrate layer in the thickness direction. The porous substrate layer is provided with a plurality of connecting holes recessed along the thickness direction, and the first conductor sublayers partially extend into the connecting holes.

4. The display panel according to claim 3, characterized in that, Along the thickness direction, the connecting hole is disposed through the porous substrate layer, and the two first conductor sublayers are connected to each other through the connecting hole.

5. The display panel according to claim 3, characterized in that, The plurality of connecting holes are spaced apart from each other, and the diameter of the connecting holes is 3nm~50μm.

6. The display panel according to claim 3, characterized in that, The composite conductive film further includes a second conductor sublayer, which is stacked on the side of the first conductor sublayer away from the porous substrate layer.

7. The display panel according to claim 6, characterized in that, The composite conductive film includes two second conductor sublayers, which are respectively disposed on the side of the two first conductor sublayers away from the porous substrate layer. The sum of the thicknesses of the two first conductor sublayers, the two second conductor sublayers, and the porous matrix layer is 9 μm to 10 μm, and the thickness of at least one of the first conductor sublayers and the second conductor sublayers is less than or equal to 1 μm.

8. The display panel according to claim 6, characterized in that, The first conductor sublayer comprises copper, and the second conductor sublayer comprises nickel.

9. The display panel according to claim 3, characterized in that, The composite conductive film further includes a heat dissipation layer, which is disposed on the side of the first conductor sublayer away from the porous substrate layer and on the side of the porous substrate layer facing the screen. The heat dissipation layer has better thermal conductivity than the porous substrate layer.

10. The display panel according to claim 9, characterized in that, The heat dissipation layer comprises graphene resin, and the thickness of the heat dissipation layer is less than or equal to 5 μm.

11. The display panel according to claim 1 or 2, characterized in that, The conductor layer includes a conductive coating disposed on the surface of the support layer away from the screen body; The conductive coating comprises a metal oxide, and / or the conductive coating comprises nano-silver.

12. The display panel according to claim 1, characterized in that, The resistance of the conductor layer is less than or equal to 0.4Ω.

13. The display panel according to claim 1 or 2, characterized in that, Along the thickness direction, the orthographic projection of the conductor layer overlaps with the orthographic projection of the support layer; Alternatively, the conductor layer is annular and encloses a central hole, with the edge of the conductor layer away from the central hole flush with the edge of the support layer.

14. The display panel according to claim 13, characterized in that, The conductor layer is annular and encloses a central hole. The display panel also includes a buffer member, which is at least partially disposed in the same layer as the conductor layer and fills the central hole. Alternatively, the electrostatic discharge layer may at least partially fill the central hole.

15. The display panel according to claim 1, characterized in that, The display panel further includes an adhesive layer, which is bonded between the conductor layer and the support layer; The adhesive layer includes a colloid and metal powder encapsulated by the colloid, wherein the ratio between the weight of the metal powder and the weight of the adhesive layer is less than or equal to 0.

2.

16. The display panel according to claim 1, characterized in that, The electrostatic discharge layer includes a conductive adhesive layer and a metal grounding layer stacked together, wherein the conductive adhesive layer is bonded between the conductor layer and the metal grounding layer.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 16.

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