electronic devices

Abstract

This application provides an electronic device, which includes a frame, a display module, a first adhesive portion, and a third adhesive portion. The frame includes a bottom wall, a side wall connected to the bottom wall, and a first receiving space formed by the bottom wall and the side wall. The display module is located in the first receiving space and includes a main body and a bent portion disposed on one side of the main body in a first direction. The first adhesive portion at least covers the side of the bent portion opposite to the main body, and is spaced apart from the frame. The third adhesive portion is bonded between the bottom wall and the display module, and is also spaced apart from the first adhesive portion. The spaced arrangement of the first adhesive portion and the frame, and the spaced arrangement of the third adhesive portion and the first adhesive portion, prevents the force of the frame from being directly transmitted to the first adhesive portion, thus mitigating mechanical failure caused by the direct transmission of force from the frame to the first adhesive portion and improving the yield of the electronic device.

Description

Technical Field

[0001] This application relates to the field of smart technology, and in particular to an electronic device. Background Technology

[0002] With continuous technological advancements, flexible displays are now used in electronic devices to reduce bezel width, and these displays are bent to minimize the bezel. To further reduce the black border, high-end models currently on the market generally employ a low-injection-pressure over-molding (LIPO) process, where adhesive is applied to the outside of the bent section. This adhesive is directly bonded to the frame to provide support to the bent section. However, this results in the force on the frame being directly transferred to the flexible display, increasing the overall risk of mechanical failure and thus affecting the yield rate of the electronic device. Summary of the Invention

[0003] This application provides an electronic device to solve the problem of low yield caused by mechanical failure in existing electronic devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide an electronic device, comprising: a frame including a bottom wall, a side wall connected to the bottom wall, and a first receiving space formed by the bottom wall and the side wall; a display module located in the first receiving space, the display module including a main body and a bent portion disposed on one side of the main body in a first direction; a first adhesive portion covering at least the side of the bent portion facing the side wall, the first adhesive portion and the frame being spaced apart; and a third adhesive portion bonded between the bottom wall and the display module, the third adhesive portion and the first adhesive portion being spaced apart.

[0005] Thus, in the electronic device provided in this application embodiment, the electronic device includes a frame, a display module, a first adhesive portion, and a third adhesive portion. The frame includes a bottom wall and a side wall, which enclose a first accommodating space. The display module is located within the first accommodating space, allowing the frame to provide protection to the display module. The display module includes a main body and a bent portion. The first adhesive portion at least covers the side of the bent portion facing the side wall, allowing the first adhesive portion to provide protection to at least a portion of the bent portion. The third adhesive portion is bonded between the bottom wall and the display module, allowing the display module to be connected to the frame through the third adhesive portion. The first adhesive portion and the frame are spaced apart, and the third adhesive portion and the first adhesive portion are also spaced apart, so that the force of the frame is not directly transmitted to the first adhesive portion, thereby making it less likely for the force of the frame to affect the bent portion. This improves the mechanical failure caused by the direct transmission of the force of the frame to the first adhesive portion, thereby improving the yield of the electronic device. Attached Figure Description

[0006] Figure 1This is one of the top views of an electronic device provided in the first aspect of this application; Figure 2 yes Figure 1 One of the sectional views at point AA; Figure 3 This is one of the top views of a display module of an electronic device in an unfolded state, according to the first aspect of this application. Figure 4 This is a second top view of a display module of an electronic device in an unfolded state, as provided in the first aspect embodiment of this application; Figure 5 yes Figure 1 Sectional view at point AA (second section); Figure 6 yes Figure 1 Sectional view at point AA (third section); Figure 7 yes Figure 1 Sectional view at point AA (4th section); Figure 8 This is a second top view of an electronic device provided in the first aspect of this application; Figure 9 yes Figure 8 Sectional view at point BB.

[0007] Explanation of reference numerals in the attached figures: 10. Electronic devices; 100. Frame; 110. Bottom wall; 111. Groove; 112. First surface; 113. Bottom surface; 120. Side wall; 200, Display module; 210, Main body; 220, Bending part; 221, First body; 222, Second body; 223, Bending area; 220a, Middle area; 220b, First partition; 220c, Second partition; 230, Elevation part; 201, Flexible display panel; 202, Support layer; 203, Polarizing film; 204, Adhesive layer; 205, Cover plate; 310, First adhesive portion; 320, Second adhesive portion; 321, Hole; 330, Third adhesive portion; 331, First adhesive segment; 332, Second adhesive segment; 340, Fourth adhesive portion; 350, Fifth adhesive portion; Q1, first gap; Q2, second gap; Z: Thickness direction; X: First direction; Y: Second direction. Detailed Implementation

[0008] To make the technical problems, technical solutions and advantages of this application clearer, a detailed description will be provided below in conjunction with the accompanying drawings and specific embodiments.

[0009] Please see Figures 1 to 3 , Figure 1 This is a top view of an electronic device 10 provided in the first aspect embodiment of this application; Figure 2 yes Figure 1 Sectional view at point AA.

[0010] like Figure 1 and Figure 2 As shown, in a first aspect, embodiments of this application provide an electronic device 10, which includes a frame 100, a display module 200, and a first adhesive portion 310. The frame 100 includes a bottom wall 110, a side wall 120 connected to the bottom wall 110, and a first receiving space formed by the bottom wall 110 and the side wall 120. The display module 200 is located in the first receiving space and includes a main body 210 and a bent portion 220 disposed on the main body 210 in a first direction X. The first adhesive portion 310 at least covers the side of the bent portion 220 away from the main body 210, and the first adhesive portion 310 and the frame 100 are spaced apart. A third adhesive portion 330 is bonded between the bottom wall 110 and the display module 200, and the third adhesive portion 330 and the first adhesive portion 310 are spaced apart.

[0011] Thus, in the electronic device 10 provided in this application embodiment, the electronic device 10 includes a frame 100, a display module 200, and a first adhesive portion 310. The frame 100 includes a bottom wall 110 and a side wall 120, which enclose a first receiving space. The display module 200 is located within the first receiving space, allowing the frame 100 to provide protection to the display module 200. The display module 200 includes a main body 210 and a bent portion 220. The first adhesive portion 310 at least covers the side of the bent portion 220 facing the side wall 120, allowing the first adhesive portion 310 to provide protection to at least a portion of the bent portion 220. A third adhesive portion is bonded between the bottom wall and the display module, allowing the display module to be connected to the frame via the third adhesive portion. The first adhesive portion 310 and the frame 100 are spaced apart, and the third adhesive portion 330 and the first adhesive portion 310 are spaced apart, so that the force of the frame 100 is not directly transmitted to the first adhesive portion 310. This can improve the mechanical failure caused by the force of the frame 100 being directly transmitted to the first adhesive portion 310, thereby improving the yield of the electronic device 10.

[0012] The first adhesive portion 310 and the frame 100 are spaced apart, meaning that the first adhesive portion 310 and the side wall 120 are spaced apart along the first direction X, and the first adhesive portion 310 and the bottom wall 110 are spaced apart along the thickness direction Z.

[0013] In related technologies, the first adhesive portion 310 is bonded to at least the bottom wall 110. This makes it easy for the stress on the frame 100 to be transmitted to the first adhesive portion 310, and then from the first adhesive portion 310 to the bending portion 220, affecting the yield of the bending portion 220 and causing signal lines within the bending portion 220 to break easily, resulting in problems such as yellowing screen. In addition, due to the inconsistent deformation of the frame 100, the support layer 202, and the various film layers within the flexible display screen at high and low temperatures, the unbalanced deformation of the frame 100, the display module 200, and the first adhesive portion 310 under temperature shock conditions generates internal stress, which can also easily lead to signal lines within the bending portion 220 breaking easily, resulting in problems such as yellowing screen.

[0014] In this embodiment, the first adhesive portion 310 is spaced apart from the frame 100. The first adhesive portion 310 is not only spaced apart from the sidewall 120, but also spaced apart from the bottom wall 110. This ensures that the force on the frame 100 is not directly transmitted to the first adhesive portion 310; furthermore, the unbalanced deformation between the frame 100 and the first adhesive portion 310 is not cumulatively transmitted to the bending portion 220, thus improving the yield of the bending portion 220. The third adhesive portion 330 is bonded to the bottom wall 110, but the third adhesive portion 330 and the first adhesive portion 310 are spaced apart from each other, making it difficult for the force on the bottom wall 110 to be directly transmitted from the third adhesive portion 330 to the first adhesive portion 310. This also improves the internal stress generated in the third adhesive portion 330 and the first adhesive portion 310 under temperature rise conditions.

[0015] There are several ways to configure the bottom wall 110. For example, the bottom wall 110 can be plate-shaped, and its shape can be adapted to that of the electronic device 10. The side wall 120 is connected to the outer periphery of the bottom wall 110. Alternatively, the bottom wall 110 can include two first wall segments and two second wall segments. The first wall segments extend along a first direction X, and the second wall segments extend along a second direction Y. The two first wall segments and the two second wall segments are alternately connected end to end to form a hollow space. The side wall 120 is connected to the side of the bottom wall 110 away from the hollow space. The first direction X, the second direction Y, and the thickness direction Z intersect each other, for example, the first direction X, the second direction Y, and the thickness direction Z are perpendicular to each other.

[0016] Optionally, the electronic device 10 has a long side and a short side, the long side extending, for example, along a first direction X, and the short side extending along a second direction Y.

[0017] Optionally, the display module 200 includes a flexible display panel 201, which includes a main body 210 and a bent portion 220. A portion of the bent portion 220 is bent from the display side of the electronic device 10 to the non-display side. Optionally, signal lines are provided within the flexible display panel 201, with at least a portion of the signal lines located within the bent portion 220, so that at least a portion of the signal lines can be bent to the non-display side to electrically connect with components such as control chips. This facilitates the placement of the control chip on the non-display side and reduces the bezel width of the electronic device 10.

[0018] Optionally, the display module 200 further includes a support layer 202, which is disposed on the non-display side of the main body 210. Optionally, the display module 200 further includes a polarizer 203 and a cover plate 205, which are disposed on the display side of the main body 210, and an adhesive layer 204 is disposed between the cover plate 205 and the polarizer 203.

[0019] Optionally, the cover plate 205 extends the adhesive layer 204, polarizer 203, and bending portion 220 towards the side wall 120. The first adhesive portion 310 is bonded to the side of the cover plate 205 facing the bottom wall 110, and the first adhesive portion 310, polarizer 203, and adhesive layer 204 are bonded to each other on the side facing the side wall 120. Optionally, the projected edge of the cover plate 205 along the thickness direction Z is flush with the projected edge of the first adhesive portion 310 along the thickness direction Z, that is, the first adhesive portion 310 does not extend beyond the cover plate 205 towards the side wall 120.

[0020] Optionally, the cover plate 205 and the side wall 120 are spaced apart along the first direction X, so that the force on the side wall 120 is not directly transmitted to the cover plate 205, which better improves the problem that the force on the frame 100 is directly transmitted to the display module 200, causing it to easily fail under force.

[0021] Optionally, the bending portion 220 includes a first body 221, a second body 222, and a bending region 223. The first body 221 is connected to the main body 210, and the first body 221 and the second body 222 are spaced apart along the thickness direction Z. The bending region 223 connects the first body 221 and the second body 222. Optionally, the first body 221 and the main body 210 are integrally formed. Optionally, the area on the display module 200 that is spaced apart from the second body 222 along the thickness direction Z can be considered as the first body 221. Optionally, the bending region 223 refers to the bent and deformed portion of the bending portion 220. Optionally, the support layer 202, the polarizer 203, and the adhesive layer 204 can cover at least a portion of the first body 221.

[0022] Optional, such as Figures 1 to 3 As shown, the display module 200 also includes a flattened state, in which the bent portion 220 is planar and the bent portion 220 and the main body portion 210 are coplanar. Figure 3 The boundary line between the bent portion 220 and the main body portion is indicated by a dashed line. This dashed line does not constitute a limitation on the results of the embodiments of this application. Optionally, at least a portion of the bent portion 220 has a width in the second direction Y that is smaller than the width of the main body portion 210 in the second direction Y. For example, when the bent portion 220 includes a first body 221, a second body 222, and a bending region 223, the width of the bending region 223 and the second body 222 in the second direction Y is smaller than the width of the main body portion 210 in the second direction Y.

[0023] In some alternative embodiments, such as Figure 1 and Figure 2 As shown, when the display module 200 includes the first body 221, the second body 222, and the bending area 223 described above, the first adhesive portion 310 can cover the bending area 223 and at least a portion of the first body 221 and at least a portion of the second body 222. For example, the first body 221 extends toward the sidewall 120 relative to the adhesive layer 204 and the polarizer 203 described above, and the first adhesive portion 310 can cover the portion of the first body 221 that extends out of the adhesive layer 204 and the polarizer 203. For example, the first adhesive layer 204 also covers at least a portion of the second body 222 that is connected to the bending area 223.

[0024] In these alternative embodiments, the first adhesive portion 310 not only covers the easily damaged bending area 223, but also covers at least a portion of the first and second parts connected to the bending area 223. The area of ​​the bending portion 220 covered by the first adhesive portion 310 is large, and the first adhesive portion 310 can provide better protection for the bending portion 220.

[0025] In some alternative embodiments, such as Figure 1 and Figure 2 As shown, the electronic device 10 also includes a second adhesive portion 320, which is disposed on the side of the bending area 223 away from the sidewall 120. The elastic modulus of the second adhesive portion 320 is less than that of the first adhesive portion 310.

[0026] In these optional embodiments, a second adhesive portion 320 is provided within the bending region 223. The second adhesive portion 320 has a low elastic modulus and is prone to deformation. When the bending portion 220 is subjected to external force, the deformation of the second adhesive portion 320 can absorb the influence of the external force, allowing the second adhesive portion 320 to better play a buffering and absorption role.

[0027] In addition, the second adhesive portion 320 has a smaller modulus and its modulus changes less under high and low temperatures. When internal stress is generated due to unbalanced deformation of the display module 200, the first adhesive portion 310, and the second adhesive portion 320 under temperature shock conditions, the second adhesive portion 320 can better absorb these stresses and improve problems such as the signal line in the bending portion 220 being prone to breakage and resulting in a yellow screen.

[0028] Optionally, the display module 200 may also include a raised portion 230, which is connected between the first body 221 and the second body 222 to improve the problem of deformation of the display module 200 caused by the second body 222 easily bending toward the first body 221.

[0029] Optionally, the raised portion 230 and the bending area 223 are spaced apart, and the raised portion 230, the first body 221, the second body 222 and the bending area 223 enclose a second receiving space, and the second adhesive portion 320 can fill the second receiving space.

[0030] There are several ways to set the second adhesive part 320. For example, the material of the second adhesive part 320 can be a glue with a small elastic modulus.

[0031] In some alternative embodiments, a plurality of holes 321 are provided in the second adhesive portion 320, and the distance between two adjacent holes 321 is less than 2.5 mm.

[0032] In these alternative embodiments, the cushioning and absorption capacity of the second adhesive portion 320 can be further improved by forming holes 321 within the second adhesive portion 320. The distance between two adjacent holes 321 is less than 2.5 mm, resulting in a smaller distance between the holes 321 and a denser distribution of the holes 321, which can better improve the cushioning and absorption capacity of the second adhesive portion 320.

[0033] Optionally, in the flattened state, the distance between two adjacent holes 321 along the first direction X is less than 2.5 mm, and / or the distance between two adjacent holes 321 along the second direction Y is less than 2.5 mm. This results in a smaller distance between the holes 321 and a denser distribution of the holes 321, which can better improve the buffering and absorption capacity of the second adhesive portion 320.

[0034] There are several ways to form the holes 321. For example, multiple holes 321 can be formed within the second bonding portion 320 using 3D printing technology. For instance, a pre-prepared adhesive material can be prepared using 3D printing, and multiple 3D holes 321 can be arranged within the pre-prepared adhesive material. Then, as... Figure 3As shown, the pre-applied adhesive is applied to a designated position on the unfolded display module 200. Finally, the bending portion 220 is bent, so that the display module 200 is in a bent state, and the pre-applied adhesive forms the second adhesive portion 320 located inside the bending area 223 as described above.

[0035] In some alternative embodiments, the elastic modulus of the first adhesive portion 310 is greater than 1 GPa. The larger elastic modulus of the first adhesive portion 310 provides better protection to the bending portion 220 on its outer side.

[0036] In some alternative embodiments, the elastic modulus of the second adhesive portion 320 is less than 10 MPa. The lower elastic modulus of the second adhesive portion 320 makes it more prone to deformation, and gives it better cushioning and absorption capabilities.

[0037] In some alternative embodiments, such as Figure 3 and Figure 4 As shown, the bending portion 220 includes a middle area 220a, a first partition 220b, and a second partition 220c. The first partition 220b and the second partition 220c are respectively located on one side of the middle area 220a in the second direction Y. When the display module 200 includes the above-described display panel, the wiring density of the signal lines in the first partition 220b and the second partition 220c is usually relatively high.

[0038] Optionally, the second adhesive portion 320 is located at least in the first partition 220b and the second partition 220c, for example, as Figure 4 As shown, the two second adhesive portions 320 are located in the first partition 220b and the second partition 220c, respectively, or as... Figure 3 As shown, the first partition 220b, the second partition 220c and the middle partition 220a are all provided with a second adhesive, that is, the second adhesive part 320 can extend from one side of the bending part 220 in the second direction Y to the other side.

[0039] In these alternative embodiments, the second adhesive portion 320 is located at least in the first partition 220b and the second partition 220c, that is, in areas with a high signal line wiring density, so that the second adhesive portion 320 can provide better protection for the signal line and improve the problem of the signal line being easily broken under force.

[0040] In some alternative embodiments, such as Figure 1 and Figure 2 As shown, the electronic device 10 also includes a third adhesive portion 330, which is located between the bottom wall 110 and the main body portion 210.

[0041] In these alternative embodiments, the third adhesive portion 330 is located between the bottom wall 110 and the main body portion 210. The third adhesive portion 330 does not directly exert force on the bending portion 220, making it difficult for the force of the bottom wall 110 to be transmitted to the bending portion 220 through the third adhesive portion 330, thereby further improving the yield of the bending portion 220.

[0042] Optionally, the first adhesive portion 310 can be prepared by LIPO method so that the first adhesive portion 310 has a suitable thickness and can better cover the bent portion 220.

[0043] Optionally, the third adhesive part 330 can be double-sided tape, foam adhesive, etc. Double-sided tape or foam adhesive makes the bonding operation between the display module 200 and the bottom wall 110 more convenient and faster, and can improve the assembly efficiency of the electronic device 10.

[0044] Optionally, the third adhesive portion 330 and the first adhesive portion 310 are spaced apart along the first direction X, with the third adhesive portion 330 located on the side of the first adhesive portion 310 away from the sidewall 120.

[0045] In some optional embodiments, the first adhesive portion 310 and the bottom wall 110 are spaced apart, with a first gap Q1 between the first adhesive portion 310 and the bottom wall 110, and the third adhesive portion 330 is located on the side of the first gap Q1 away from the side wall 120. Optionally, the first adhesive portion 310 and the side wall 120 have a second gap Q2.

[0046] In these optional embodiments, the third adhesive portion 330 not only serves to bond the display module 200 and the bottom wall 110, making the relative position between the display module 200 and the bottom wall 110 more stable, but also, since the third adhesive portion 330 is located on the side of the first gap Q1 away from the side wall 120, the third adhesive portion 330 can act as a barrier, which can improve the defects caused by impurities such as water and oxygen entering the electronic device 10 from the second gap Q2 and the first gap Q1.

[0047] In some alternative embodiments, when the display module 200 includes the first body 221, the second body 222 and the bending area 223 described above, the third adhesive portion 330 is located on the side of the second body 222 away from the bending area 223.

[0048] In these alternative embodiments, the third adhesive portion 330 is not bonded between the second body 222 and the bottom wall 110. The third adhesive portion 330 is located on the side of the second body 222 away from the bending area 223, which can improve the direct transmission of the force of the third adhesive portion 330 to the easily deformable bending portion 220, and can further improve the yield of the electronic device 10.

[0049] Optionally, the third adhesive portion 330 may contact the end face of the second body 222 opposite to the bending area 223, or the third adhesive portion 330 and the second body 222 may be spaced apart along the first direction X.

[0050] In some alternative embodiments, such as Figure 1 and Figure 2 As shown, when the display module 200 includes the aforementioned raised portion 230, the raised portion 230 can extend out of the second body 222 in a direction away from the bending area 223, and the third adhesive portion 330 is adhesively bonded between the raised portion 230 and the bottom wall 110.

[0051] In these alternative embodiments, a portion of the raised portion 230 extends out of the second body 222 in a direction away from the bending area 223, and a third adhesive portion 330 can connect the raised portion 230 extending out of the second body 222 and the bottom wall 110. Since the distance between the raised portion 230 and the bottom wall 110 is relatively short, a thinner third adhesive portion 330 can be used to achieve the connection between the raised portion 230 and the bottom wall 110.

[0052] In some other alternative embodiments, such as Figure 1 and Figure 5 As shown, the third adhesive portion 330 is located on the side of the raised portion 230 away from the bending area 223.

[0053] In these alternative embodiments, compared to the solution where the third adhesive portion 330 is directly bonded to the raised portion 230, the force on the third adhesive portion 330 is less likely to be directly transmitted to the bending portion 220 through the raised portion 230, and the force on the third adhesive portion 330 is less likely to be transmitted to the bending portion 220, which can further improve the yield of the electronic device 10.

[0054] Optionally, when the display module 200 includes the support layer 202 described above, the third adhesive portion 330 is located on the side of the raised portion 230 away from the bending area 223, and the third adhesive portion 330 is bonded between the support layer 202 and the bottom wall 110.

[0055] In some alternative embodiments, such as Figure 1 and Figure 6 As shown, a groove 111 and a first surface 112 located on the side of the bottom wall 110 facing the display module 200 are provided. A first adhesive part 310 and the bottom surface 113 of the groove 111 are spaced apart. A third adhesive part 330 is bonded between the first surface 112 and the display module 200.

[0056] In these optional embodiments, by providing a groove 111 on the bottom wall 110, with the bottom surface 113 of the groove 111 being further away from the display module 200 relative to the first surface 112, it is possible to ensure that the first adhesive portion 310 and the bottom surface 113 of the groove 111 are spaced apart. The third adhesive portion 330 is bonded between the first surface 112 and the display module 200. Since the first surface 112 is closer to the display module 200, the thickness of the third adhesive portion 330 can be reduced, and the bonding between the display module 200 and the bottom wall 110 can be achieved using a thinner third adhesive portion 330.

[0057] Optional, such as Figure 1 and Figure 6 As shown, when the display module 200 includes the aforementioned raised portion 230, a portion of the raised portion 230 overlaps with the first surface 112, and the third adhesive portion 330 is adhered between the raised portion 230 and the first surface 112. Alternatively, as... Figure 1 and Figure 7 As shown, the raised portion 230 can be located on the side of the first surface 112 facing the side wall 120, and the third adhesive portion 330 is bonded between the support layer 202 and the first surface 112.

[0058] Optionally, the first surface 112 and the first adhesive portion 310 are spaced apart along the first direction X. This can improve the situation where the force on the frame 100 is transmitted to the first adhesive portion 310 through the first surface 112.

[0059] In some alternative embodiments, such as Figure 1 , Figure 6 and Figure 8 As shown, the third adhesive portion 330 extends along a bending path in the second direction Y, and the second direction Y, the first direction X, and the thickness direction Z intersect each other. For example, the third adhesive portion 330 extends along a serpentine, S-shaped, sawtooth, or wavy path.

[0060] In these alternative embodiments, the third adhesive portion 330 does not extend along a straight path in the second direction Y, so that the third adhesive portion 330 can disperse the force in different directions and better improve the problem of force failure of the electronic device 10.

[0061] Optionally, the third adhesive portion 330 includes intersecting and connected first adhesive segments 331 and second adhesive segments 332, the first adhesive segment 331 extending along a first direction X, the second adhesive segment 332 extending along a second direction Y, and a plurality of first adhesive segments 331 and a plurality of second adhesive segments 332 alternately connected.

[0062] In some alternative embodiments, such as Figure 8 and Figure 9As shown, the electronic device 10 also includes a fourth adhesive portion 340, which is bonded between the display module 200 and the bottom wall 110. The fourth adhesive portion 340 is located on at least one side of the display module 200 in the second direction Y, and the fourth adhesive portion 340 extends along the first direction X. The second direction Y, the first direction X and the thickness direction Z intersect each other.

[0063] In these alternative embodiments, by providing a fourth adhesive portion 340 on at least one side of the display module 200 in the second direction Y, and by bonding the fourth adhesive portion 340 to the bottom wall 110, the stability of the relative position of the display module 200 and the frame 100 can be improved, and the problem of impurities such as water and oxygen entering the interior of the electronic device 10 from the gap between the display module 200 and the bottom wall 110 can be mitigated.

[0064] Optionally, two fourth adhesive portions 340 are respectively disposed on both sides of the display module 200 in the second direction Y. The fourth adhesive portion 340 is located on at least one side of the display module 200 in the second direction Y, but not outside the display module 200. The fourth adhesive portion 340 is located inside the display module 200 in the region near the side wall 120 in the second direction Y, so that the fourth adhesive portion 340 can connect the display module 200 and the bottom wall 110.

[0065] Optionally, when the display module 200 includes the aforementioned support layer 202, the fourth adhesive portion 340 may be adhered between the support layer 202 and the bottom wall 110. Optionally, when the display module 200 includes the aforementioned raised portion 230, the fourth adhesive portion may be adhered between the raised portion 230 and the bottom wall 110. Alternatively, a portion of the fourth adhesive portion 340 may be adhered between the support layer 202 and the bottom wall 110, and another portion may be adhered between the raised portion 230 and the bottom wall 110.

[0066] In some alternative embodiments, such as Figure 8 As shown, the third adhesive portion 330 extends along the second direction Y, and a fifth adhesive portion 350 is provided between the fourth adhesive portion 340 and the third adhesive portion 330.

[0067] In these alternative embodiments, the third adhesive portion 330 extends along the second direction Y. There may be a gap between the end of the third adhesive portion 330 and the end of the fourth adhesive portion 340. By providing the fifth adhesive portion 350, it can be ensured that no gap is formed between the third adhesive portion 330 and the fourth adhesive portion 340, making it difficult for impurities and the like to enter the interior of the electronic device 10 from between the display module 200 and the bottom wall 110.

[0068] Optionally, the fourth adhesive portion 340 and the third adhesive portion can be made of the same material, such as double-sided tape, foam adhesive, etc. Optionally, the fifth adhesive portion 350 can be made of dispensing adhesive, so that the fifth adhesive portion 350 can better fill the gap between the third adhesive portion 330 and the fourth adhesive portion 340.

[0069] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0070] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: The frame (100) includes a bottom wall (110), a side wall (120) connected to the bottom wall (110), and a first accommodating space enclosed by the bottom wall (110) and the side wall (120); The display module (200) is located in the first accommodating space. The display module (200) includes a main body (210) and a bent portion (220) disposed on the main body (210) on one side of the first direction (X). The first adhesive portion (310) covers at least the side of the bent portion (220) facing the sidewall (120), and the first adhesive portion (310) and the frame (100) are spaced apart; The third adhesive part (330) is bonded between the bottom wall (110) and the display module (200), and the third adhesive part (330) and the first adhesive part (310) are spaced apart.

2. The electronic device according to claim 1, characterized in that, The bending portion (220) includes a first body (221), a second body (222), and a bending region (223). The first body (221) is connected to the main body (210). The second body (222) and the first body (221) are spaced apart along the thickness direction (Z) of the electronic device (10). The bending region (223) connects the first body (221) and the second body (222). The first adhesive portion (310) covers the bending region (223) and at least a portion of the first body (221) and at least a portion of the second body (222). The electronic device (10) further includes a second adhesive portion (320), which is disposed on the side of the bending area (223) away from the sidewall (120), and the elastic modulus of the second adhesive portion (320) is less than that of the first adhesive portion (310).

3. The electronic device according to claim 2, characterized in that, The second adhesive part (320) is provided with a plurality of holes (321), and the distance between two adjacent holes (321) is less than 2.5 mm.

4. The electronic device according to claim 2, characterized in that, The elastic modulus of the first adhesive portion (310) is greater than 1 GPa; and / or the elastic modulus of the second adhesive portion (320) is less than 10 MPa.

5. The electronic device according to claim 2, characterized in that, The bending portion (220) includes a middle area (220a), a first partition (220b) and a second partition (220c) respectively disposed on both sides of the middle area (220a) in a second direction (Y), wherein the second direction (Y) and the first direction (X) intersect. The second adhesive portion (320) is located at least in the first partition (220b) and the second partition (220c).

6. The electronic device according to claim 1, characterized in that, Also includes: The third adhesive portion (330) is located between the bottom wall (110) and the main body portion (210).

7. The electronic device according to claim 1, characterized in that, There is a first gap (Q1) between the first adhesive portion (310) and the bottom wall (110), and the third adhesive portion (330) is located on the side of the first gap (Q1) away from the side wall (120).

8. The electronic device according to claim 1, characterized in that, The bending portion (220) includes a first body (221), a second body (222), and a bending region (223). The first body (221) is connected to the main body (210). The second body (222) and the first body (221) are spaced apart along the thickness direction (Z) of the electronic device (10). The bending region (223) connects the first body (221) and the second body (222). The third adhesive portion (330) is located on the side of the second body (222) away from the bending area (223).

9. The electronic device according to claim 8, characterized in that, The display module (200) further includes a raised portion (230), which is connected between the first body (221) and the second body (222), and the raised portion (230) extends out of the second body (222) in a direction away from the bending area (223). The third adhesive portion (330) is adhesively bonded between the raised portion (230) and the bottom wall (110). Alternatively, the third adhesive portion (330) is located on the side of the raised portion (230) away from the bending area (223).

10. The electronic device according to claim 1, characterized in that, The bottom wall (110) is provided with a groove (111) on the side facing the display module (200) and a first surface (112) on the side of the groove (111) away from the side wall (120). The first adhesive part (310) and the bottom surface (113) of the groove (111) are spaced apart. The third adhesive part (330) is bonded between the first surface (112) and the display module (200).

11. The electronic device according to claim 1, characterized in that, The third adhesive portion (330) extends along a bending path in the second direction (Y), where the second direction (Y) intersects with the first direction (X).

12. The electronic device according to claim 1, characterized in that, Also includes: The fourth adhesive portion (340) is bonded between the display module (200) and the bottom wall (110). The fourth adhesive portion (340) is located on at least one side of the display module (200) in the second direction (Y), and the fourth adhesive portion (340) extends along the first direction (X). The second direction (Y) and the first direction (X) intersect.

13. The electronic device according to claim 12, characterized in that, The third adhesive portion (330) extends along the second direction (Y), and a fifth adhesive portion (350) is provided between the fourth adhesive portion (340) and the third adhesive portion (330).

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