A solid-state drive component and the solid-state drive thereof

Abstract

This invention provides a solid-state drive (SSD) assembly and the SSD thereof, relating to the field of SSD technology. The SSD assembly and SSD include a circuit board, a chip disposed on a first surface of the circuit board, a metal casing covering the outside of the circuit board, and a thermally conductive support. The metal casing includes a top wall and a bottom wall disposed opposite to each other. The thermally conductive support is located between the chip and the top wall of the metal casing, and includes a rigid main body that is thermally bonded to the top wall. In this invention, the flexible pressure-bearing portion utilizes an edge-suspended area to form a relief arm, generating elastic relief during chip thermal expansion to absorb displacement and prevent solder joints from shearing and breaking. Combined with protruding heat dissipation fins that directly exchange heat with external air, this achieves a synergy between efficient heat dissipation and flexible stress relief, ensuring the reliability of the hard drive under high load operation.

Description

Technical Field

[0001] This invention relates to the field of solid-state drive technology, specifically to a solid-state drive component and a solid-state drive thereof. Background Technology

[0002] As solid-state drives (SSDs) continue to improve their data transfer rates, the integration and operating frequency of their internal chips have increased significantly. This has led to a significant increase in heat generation under high loads, resulting in thermal expansion in the Z-axis direction, which is a physical phenomenon that must be addressed in the design of high-performance SSD structures.

[0003] Currently, the industry typically uses a rigid thermally conductive medium filled between the chip and the metal casing for heat dissipation and structural support. However, this traditional rigid connection method lacks deformation tolerance. When the chip expands upwards due to heat, the expansion displacement has nowhere to be released, directly applying strong shear stress to the solder joints on the bottom of the chip. With long-term high and low temperature cycling, this hard compression can easily lead to solder joint fatigue, microcracks, or even breakage, severely limiting the lifespan and reliability of solid-state drives in complex thermal environments.

[0004] Therefore, those skilled in the art provide a solid-state drive component and a solid-state drive thereof to solve the problems mentioned in the background art. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a solid-state drive (SSD) component and the SSD itself, which solves the problem that existing SSDs, under high-temperature conditions, suffer from shear force fracture of the solder joints at the bottom of the chip due to the inability of the rigid heat dissipation structure to absorb the thermal expansion displacement of the chip.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A solid-state drive (SSD) assembly and the SSD therein include a circuit board, a chip disposed on a first surface of the circuit board, a metal housing and a thermally conductive support member disposed on the outside of the circuit board, the metal housing including a top wall and a bottom wall disposed opposite to each other, and the thermally conductive support member being located between the chip and the top wall of the metal housing.

[0008] The thermally conductive support includes a rigid main body that is thermally bonded to the top wall, and a flexible pressing part that extends from the rigid main body toward the chip.

[0009] The end of the flexible pressing part presses against the top of the chip one. When the chip one is heated and expands upward, the flexible pressing part can generate an upward elastic yielding deformation to absorb the expansion displacement of the chip one.

[0010] The above technical solution constructs a basic heat conduction and support path from the chip to the metal casing. Through the elastic yielding design of the heat conduction support, the traditional rigid contact deadlock state is broken, providing dynamic release space for the upward thermal expansion of the chip. This eliminates the internal destructive stress on the chip and solder joints caused by the obstruction of expansion from the root.

[0011] Furthermore, the flexible pressing part includes an elastic cantilever, one end of which is connected to the rigid main body, and the other end is an elastic bending area that presses against the top of the chip one;

[0012] By utilizing the lever principle of the cantilever structure and the stress concentration effect in the bending zone, a small amount of high-temperature expansion can trigger the cantilever to warp upwards, significantly reducing the triggering force required for yielding deformation.

[0013] Furthermore, it also includes a stress relief layer, which is disposed between the upper surface of the first chip and the end of the flexible pressing part. The elastic cantilever has an initial pre-compression state and pre-presses the stress relief layer onto the first chip.

[0014] The above technical solution not only fills the contact gap between rigid structural components and fragile chips, preventing excessive local pressure from damaging the chip, but also ensures that the pre-pressure state maintains a tight contact with zero thermal resistance even when the chip is in a cold state without heat generation.

[0015] Furthermore, the projected area of ​​the stress relief layer on the first surface of the circuit board is larger than the projected area of ​​the chip on the first surface, and the end of the flexible pressing part presses against the area of ​​the stress relief layer that extends beyond the edge of the chip.

[0016] The above technical solution cleverly shifts the force application point of the cantilever from the center of the chip to the outer edge, thereby creating a favorable avoidance arm between the end of the cantilever and the center of the chip, further optimizing the smoothness of elastic bending.

[0017] Furthermore, the upper surface of the rigid main body is provided with a grid-like heat dissipation fin, and the top wall of the metal shell is provided with ventilation holes corresponding to the positions of the grid-like heat dissipation fins. The grid-like heat dissipation fins pass through the ventilation holes and protrude from the outer surface of the metal shell.

[0018] The above technical solution breaks through the thermal resistance barrier of the enclosed shell, allowing the thermally conductive support component to directly transform into an external heat sink, greatly increasing the contact surface area with external cold air and improving heat dissipation efficiency.

[0019] Furthermore, a thermal bridge is provided between the chip and the rigid body, with the bottom surface of the thermal bridge attached to the upper surface of the chip and the top surface of the thermal bridge being thermally connected to the rigid body.

[0020] Through the above technical solution, a dedicated low thermal resistance heat conduction bridge is built without interfering with the lateral elastic yielding motion of the cantilever, ensuring that the chip's heat can be vertically conducted to the top heat dissipation fins with the most efficient efficiency.

[0021] Furthermore, a second chip is provided on the second surface of the circuit board, and a compression buffer pad is provided on the bottom wall of the metal casing corresponding to the position of the second chip, the compression buffer pad being sandwiched between the second surface of the second chip and the bottom wall;

[0022] The above technical solution achieves a three-dimensional heat dissipation layout for double-sided chips. At the same time, the extrusion buffer pad absorbs the assembly gap caused by manufacturing tolerances or slight bending under the circuit board, ensuring the compactness of the structure.

[0023] Furthermore, the compression buffer pad is a thermally conductive buffer pad, and the heat of the second chip can be conducted to the external environment in sequence through the compression buffer pad and the bottom wall;

[0024] The above technical solution endows the thermal pad with the dual functions of heat conduction and shock absorption, enabling the heat of the bottom chip 2 to be effectively dissipated, avoiding local heat accumulation, and realizing comprehensive thermal management of the entire solid-state drive.

[0025] This invention provides a solid-state drive (SSD) component and the SSD thereof. It has the following beneficial effects:

[0026] 1. This invention provides a solid-state drive (SSD) component and the SSD thereof. By setting a thermally conductive support with a flexible pressure-bearing part, it can generate an upward elastic yielding deformation when the chip expands due to heat, thereby absorbing the expansion displacement of the chip. This significantly improves the connection reliability of the chip solder joints under high temperature and high load conditions, and effectively avoids the problem of solder joint breakage and hard drive scrapping caused by thermal warping.

[0027] 2. The present invention provides a solid-state drive assembly and the solid-state drive thereof. By setting the area of ​​the stress relief layer to be larger than the chip area and pressing the flexible pressing part against the area beyond the chip edge, an effective avoidance arm is formed between the cantilever end and the chip expansion center. This realizes the transformation of the chip's upward rigid push into the elastic upward bending of the cantilever end, which significantly improves the absorption efficiency of thermal expansion and effectively prevents the chip bottom solder joint from breaking under shear force.

[0028] 3. The present invention provides a solid-state drive component and a solid-state drive thereof. By setting a grid-shaped heat dissipation fin on the rigid body and making it protrude from the outer surface through the ventilation holes on the top wall of the metal shell, it breaks through the heat dissipation barrier of the traditional closed shell of solid-state drives, realizes the direct heat exchange between the heat dissipation fin and the external air at zero distance, significantly improves the heat dissipation rate inside the hard drive, and ensures the performance stability of the chip when it is working at high power continuously. Attached Figure Description

[0029] Figure 1 This is an overall isometric view of the present invention;

[0030] Figure 2 This is an exploded view of the internal structure of the metal casing of the present invention;

[0031] Figure 3 This is an overall sectional view of the present invention;

[0032] Figure 4 This is a diagram of the unheated deformation of the present invention;

[0033] Figure 5 This is a diagram showing the thermal deformation of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Circuit board; 11. First surface; 12. Second surface; 2. Chip 1; 3. Chip 2; 4. Thermally conductive support; 41. Rigid main body; 411. Mesh-shaped heat dissipation fins; 42. Flexible pressure-bearing part; 421. Elastic cantilever; 422. Elastic bending area; 5. Stress relief layer; 6. Metal shell; 611. Ventilation hole; 61. Top wall; 62. Bottom wall; 7. Thermal bridge; 8. Compression buffer pad. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1:

[0038] like Figure 1-5As shown, this embodiment of the invention provides a solid-state drive (SSD) assembly and the SSD itself, mainly including a circuit board 1 serving as a carrier substrate, a main controller and storage chip 2 mounted on the first surface 11 of the circuit board 1, a metal shell 6 covering the periphery of the circuit board 1 to form a protective cavity, and a thermally conductive support 4 disposed inside the cavity. The metal shell 6 has a top wall 61 and a bottom wall 62, and the thermally conductive support 4 is securely clamped and positioned between the chip 2 and the top wall 61, constituting the core heat dissipation and stress relief module of the SSD.

[0039] Specifically, the thermally conductive support 4 adopts a split or integrated molding design, including a rigid main body 41 that rests against the bottom of the top wall 61, and a flexible pressing part 42 that extends downward from the rigid main body 41 and points towards the chip 2. During assembly, the end of the flexible pressing part 42 presses directly or indirectly against the top of the chip 2, establishing a thermally conductive channel from the chip to the casing. To further optimize the contact, a stress-relieving layer 5 is also provided between the chip 2 and the flexible pressing part 42, and the area of ​​the stress-relieving layer 5 is larger than the chip area, with the cantilever end pressing precisely on the area beyond the chip edge. At the same time, the rigid main body 41 extends upward with mesh-like heat dissipation fins 411, which are exposed to the outside air through ventilation holes 611 on the top wall 61; in addition, thermal bridges 7 are arranged in parallel between the chip 2 and the rigid main body 41. A second chip 3 is provided on the second surface 12 on the back of the circuit board 1, and a compression buffer pad 8 is attached to the corresponding position on the inner side of the bottom wall 62 to clamp the second chip 3.

[0040] In actual processing and assembly, the flexible pressing part 42 is preferably a stamped metal elastic cantilever 421. To ensure that no loosening occurs at room temperature, the elastic cantilever 421 is pre-loaded with an initial downward pre-compression deformation during assembly, so that it is tightly pressed against the chip 2 through the stress relief layer 5. When the chip 2 expands upward due to heat, since the area of ​​the stress relief layer 5 is larger than that of the chip, the force application point at the end of the cantilever falls on the suspended area outside the chip edge. At this time, the expansion force acts on the end of the cantilever, forcing the cantilever to overcome the initial pre-compression and warp upward with its connection root with the rigid body part 41 as the fulcrum. This mechanical transformation from vertical pushing to end bending not only absorbs the displacement during upward expansion, but also makes the shear force transmitted to the solder joint at the bottom of the chip approach zero. The stress relief layer 5 can be made of thermally conductive silicone pad or thermally conductive gel with a certain deformation capability. It not only fills the microscopic unevenness between the end of the cantilever and the chip surface, but also prevents the rigid metal cantilever from scratching or crushing the fragile encapsulation layer on the chip surface under pre-pressure.

[0041] To address the heat dissipation requirements of high-power chips, this embodiment constructs a main and auxiliary dual-path system within the thermally conductive support 4. The thermal bridge 7, serving as the main heat dissipation path, is preferably made of a copper block or heat pipe vapor chamber with high thermal conductivity, and its bottom surface is bonded to the surface of chip 2 using high thermal conductivity double-sided adhesive or solder.

[0042] Specifically, to prevent the thermal bridge 7 from forming rigid interference when the chip expands due to heat, the present invention provides a thermal expansion gap between the top surface of the thermal bridge 7 and the lower surface of the rigid main body 41, which matches the maximum thermal expansion of the chip. In the room temperature assembly state, this gap can be filled with a highly flexible thermally conductive gel or an extremely thin thermally conductive silicone film to reduce contact thermal resistance, but this flexible medium does not possess rigid support.

[0043] As an auxiliary path, the elastic cantilever 421 itself also has a certain thermal conductivity, transferring edge heat to the rigid main body 41. When chip 2 expands upward due to heat, the thermal bridge 7 moves upward synchronously with the chip. During this process, the expansion force is completely absorbed by the reserved thermal expansion gap, and there is no rigid resistance between the thermal bridge 7 and the rigid main body 41; until the expansion displacement is absorbed by the elastic yielding of the aforementioned flexible pressing part 42. Finally, most of the heat gathered on the rigid main body 41 is dissipated into the air through the mesh-like heat dissipation fins 411 that penetrate the shell, and a small part is conducted to the metal shell 6 through the contact surface between the rigid main body 41 and the top wall 61 to form auxiliary heat dissipation.

[0044] The solid-state drive assembly of this invention adopts a double-sided layout. The first surface 11 of the circuit board 1 is a high-heat-generating chip 2, and the second surface 12 is a chip 3, such as a particle or cache. When the metal casing 6 is fastened, the compression buffer pad 8 on the inner side of the bottom wall 62 is clamped between the chip 3 and the bottom wall 62. Since the circuit board 1 often has slight warping after mounting, and the thickness tolerance of each chip is difficult to be absolutely consistent, the compression buffer pad 8 perfectly absorbs these manufacturing and assembly tolerances by utilizing its excellent compression deformation capability. While ensuring that the bottom wall 62 can be tightly fastened and providing reliable reaction force for the top heat-conducting support 4, the compression buffer pad 8 also conducts the heat generated by the chip 3 to the bottom wall 62 of the metal casing 6, achieving balanced heat management on both sides of the solid-state drive.

[0045] Working Principle: When the solid-state drive (SSD) is under high load, the large amount of heat generated by chip 2 is rapidly concentrated to the rigid main body 41 through the main path of thermal bridge 7 and the auxiliary path of elastic cantilever 421, and is finally efficiently dissipated through the exposed mesh-like heat dissipation fins 411 and the metal casing 6. Simultaneously, facing the inevitable upward expansion of the chip due to heat, this component forms a dual mechanical defense through the thermal expansion gap and the yielding of the elastic cantilever 421: the thermal expansion gap ensures that the thermal bridge 7 of the main heat dissipation channel does not generate rigid interference; while the flexible pressure part 42 cleverly dissolves the upward rigid pushing force into its own elastic bending potential energy by utilizing the suspended yielding arm at its end. This structural design fundamentally cuts off the path of expansion stress to the solder joints at the bottom of the chip, greatly reducing the risk of solder joint breakage due to thermal warping, thus achieving maximum heat dissipation efficiency while completing flexible physical protection for the core chip.

[0046] The following points should be noted in this article:

[0047] 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in a general design.

[0048] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0049] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

Claims

1. A solid-state drive assembly and the solid-state drive thereof, comprising a circuit board (1), a chip (2) disposed on a first surface (11) of the circuit board (1), a metal casing (6) covering the outside of the circuit board (1), and a thermally conductive support (4), characterized in that: The metal housing (6) includes a top wall (61) and a bottom wall (62) disposed opposite to each other, and the heat-conducting support (4) is located between the chip (2) and the top wall (61) of the metal housing (6); The thermally conductive support (4) includes a rigid main body (41) that is thermally bonded to the top wall (61), and a flexible pressing part (42) that extends from the rigid main body (41) toward the chip (2). The end of the flexible pressing part (42) presses against the top of the chip (2). When the chip (2) is heated and expands upward, the flexible pressing part (42) can generate an upward elastic yielding deformation to absorb the expansion displacement of the chip (2).

2. A solid-state drive component and solid-state drive according to claim 1, characterized in that: The flexible pressing part (42) includes an elastic cantilever (421), one end of which is connected to the rigid main body (41), and the other end is an elastic bending area (422) that presses against the chip (2).

3. A solid-state drive component and solid-state drive according to claim 2, characterized in that: It also includes a stress relief layer (5), which is disposed between the upper surface of the chip (2) and the end of the flexible pressing part (42). The elastic cantilever (421) has an initial pre-pressed state and pre-presses the stress relief layer (5) onto the chip (2).

4. A solid-state drive component and solid-state drive according to claim 3, characterized in that: The positive projection area of ​​the stress relief layer (5) on the first surface (11) of the circuit board (1) is greater than the positive projection area of ​​the chip (2) on the first surface (11), and the end of the flexible pressing part (42) presses against the area of ​​the stress relief layer (5) that extends beyond the edge of the chip (2).

5. A solid-state drive component and solid-state drive according to claim 1, characterized in that: The upper surface of the rigid main body (41) is provided with a grid-shaped heat dissipation fin (411), and the top wall (61) of the metal shell (6) is provided with a ventilation hole (611) corresponding to the position of the grid-shaped heat dissipation fin (411). The grid-shaped heat dissipation fin (411) passes through the ventilation hole (611) and protrudes from the outer surface of the metal shell (6).

6. A solid-state drive component and solid-state drive according to claim 1, characterized in that: A thermal bridge (7) is provided between the chip (2) and the rigid body (41). The bottom surface of the thermal bridge (7) is attached to the upper surface of the chip (2), and the top surface of the thermal bridge (7) is thermally connected to the rigid body (41).

7. A solid-state drive component and solid-state drive according to claim 1, characterized in that: The second surface (12) of the circuit board (1) is provided with chip two (3), and the bottom wall (62) of the metal shell (6) is provided with a compression buffer pad (8) corresponding to the position of chip two (3). The compression buffer pad (8) is sandwiched between the second surface (12) of chip two (3) and the bottom wall (62).

8. A solid-state drive component and solid-state drive according to claim 7, characterized in that: The compression buffer pad (8) is a thermally conductive buffer pad, and the heat of the second chip (3) can be conducted to the external environment through the compression buffer pad (8) and the bottom wall (62) in sequence.

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