A bare cable, a cable, a cable assembly and a system

Abstract

This application provides a bare cable, cable, cable assembly, and system. The bare cable includes a signal line and a sheath. The signal line includes an inner conductor and a first insulating layer surrounding the inner conductor. The sheath wraps around the outside of the signal line and is the outermost layer of the bare cable. At least the outer peripheral surface of the sheath is conductive. This allows the outer peripheral surface of the bare cable to be conductive, enabling adjacent bare cables to contact and connect electrically during cabling. The outer peripheral surface of the bare cable can also be electrically connected to the metal housing of the cable connector. The bare cable achieves electromagnetic shielding performance based on its conductive outer peripheral surface, eliminating the need for a separate metal braided shielding layer during cabling, thus reducing the cable's outer diameter and weight. The overall stiffness of the cable is reduced, allowing for wiring with small bending radii, facilitating cabling operations. In areas with large amounts of cabling in practical applications, the effective reduction in the cable's outer diameter further reduces the space occupied in the cabinet depth direction.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a bare cable, cable, cable assembly and system. Background Technology

[0002] With the development of computing and communication technologies, the requirements for transmission rates between devices are becoming increasingly stringent. Taking intelligent computing or interconnection clusters as an example, a large number of high-speed cables are needed for interconnection between and within server racks. Common interconnection methods include fiber optic transmission and cable transmission. Fiber optic transmission requires the conversion of optical signals to electrical signals during application, resulting in significant power consumption and cost. Cable transmission, on the other hand, does not require photoelectric conversion, thus offering lower power consumption, lower cost, and higher reliability, and is widely used in cross-rack interconnection networking in various cluster scenarios.

[0003] A typical cable assembly architecture includes multiple bare cables and a metal braided shielding layer covering the outside of these bare cables. The metal braided shielding layer mitigates the potential impact of electromagnetic interference, ensuring the signal transmission quality of the cable's internal conductors. However, the metal braided shielding layer is mostly made of tin-plated copper, which is large and heavy, making it difficult to reasonably control the overall dimensions and weight of the transmission cable. Furthermore, the high overall stiffness of the cable results in a large bending radius, which is unsuitable for applications in high-density cluster cabling scenarios. Summary of the Invention

[0004] This application provides a bare cable, cable, cable assembly and system. Through structural optimization of the bare cable architecture, the size, weight and stiffness of the cable can be effectively reduced.

[0005] The first aspect of this application provides a bare cable, which includes a signal line and a sheath. The signal line includes an inner conductor and a first insulating layer that wraps around the inner conductor. The sheath wraps around the outside of the signal line, and at least the outer peripheral surface of the sheath is conductive. This allows the outer peripheral surface of the bare cable to be conductive, enabling adjacent bare cables to contact and connect electrically during cabling. When assembling the cable end connector, the outer peripheral surface of the bare cable can also connect electrically to the metal housing of the cable end connector. Furthermore, after the cable end connector is fitted and adapted to the device side, a grounding path can be constructed through the metal housing on the device side, thereby reasonably controlling the impact of electromagnetic noise on signal transmission performance. Since multiple bare cables need to be inserted into the cable shielding layer during cable manufacturing, the cable shielding layer needs to have certain elasticity and strength requirements. While a metal braided shielding layer can meet these requirements, it is heavy and bulky. In this embodiment, the bare cable achieves electromagnetic shielding performance based on the conductive outer surface of the sheathing layer. The cable does not require a separate shielding layer. Furthermore, the requirements for the elasticity and strength of the outer surface of the sheathing layer are low, making it convenient to select a thin and lightweight structure to manufacture the outer surface, thereby effectively reducing the outer diameter and weight of the cable.

[0006] Furthermore, the absence of a metal braided shielding layer restricts cable bending, effectively reducing the overall stiffness of the cable and enabling wiring with small bending radii, while also facilitating wiring operations. This provides a technical guarantee for network interconnection in high-density cluster scenarios.

[0007] In addition, in areas with a large amount of cabling in practical application scenarios, cabling is usually carried out by bundling. Based on the effective reduction of the outer diameter of the cabling, the space occupied in the depth direction of the cabinet can be further reduced.

[0008] Based on the first aspect, this application also provides a first implementation of the first aspect: the encapsulation layer includes a base layer and a first conductive layer, the first conductive layer being located outside the base layer to form a conductive outer peripheral surface of the encapsulation layer. That is, the base layer is located inside the second conductive layer, and the constraint imposed by the base layer allows the ground line to maintain a stable relative position with respect to the signal line. Simultaneously, good electromagnetic shielding performance is achieved through the first conductive layer of the encapsulation layer.

[0009] For example, the thickness of the first conductive layer is less than 50. μ m.

[0010] In practical applications, the substrate layer is made of Mylar, and / or the first conductive layer material includes metal foil or conductive coating.

[0011] For example, the substrate layer may be made of polyethylene terephthalate (PET) Mylar sheet or polyvinyl chloride (PVC) Mylar sheet. Other examples include the first conductive layer being made of aluminum foil.

[0012] Based on the first embodiment of the first aspect, this application also provides a second embodiment of the first aspect: the metal foil includes aluminum foil or copper foil, and the material of the conductive coating includes metal or metal oxide.

[0013] In practical applications, the thickness of this conductive coating can be less than 20 mm. μ m, to reasonably control the size of the bare cable; and / or, the surface resistance of the conductive coating can be less than 0.05Ω / sq to obtain good electromagnetic shielding capability.

[0014] Based on the first embodiment of the first aspect, or the second embodiment of the first aspect, this application also provides a third embodiment of the first aspect: the substrate layer and the first conductive layer are composited into an integral structure. For example, Mylar can be used as the substrate layer, and a metal such as aluminum foil can be laminated onto the outer surface of the Mylar to form the first conductive layer, that is, the Mylar and aluminum foil are composited into an integral wrapping layer, and the aluminum foil forms the conductive outer peripheral surface of the wrapping layer. In this way, good electromagnetic shielding performance can also be obtained through the first conductive layer of this wrapping layer.

[0015] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, this application also provides a fourth implementation of the first aspect: the signal line consists of two wires used to transmit differential signals. This enables long-distance transmission of high-speed signals and effectively eliminates common-mode noise, improving signal quality.

[0016] In practical applications, there can also be only one signal line.

[0017] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, or the fourth implementation of the first aspect, this application also provides a fifth implementation of the first aspect: the bare cable further includes a ground wire for grounding, and the sheathing layer is wrapped around the outside of the signal line and the ground wire. With this configuration, based on the electromagnetic shielding performance obtained from the conductive outer surface, and based on the reference potential provided by the ground wire, the cable's anti-interference capability can be further enhanced.

[0018] Based on the fifth embodiment of the first aspect, this application also provides a sixth embodiment of the first aspect: the bare cable further includes a second insulating layer and a second conductive layer. The second insulating layer wraps around the signal lines, and the second conductive layer wraps around the second insulating layer. Two ground wires are spaced apart, and each ground wire is an exposed conductor. The ground wires are in contact with and electrically connected to the second conductive layer. This configuration, with the two signal lines wrapped by the second insulating layer, further improves electrical insulation performance and also serves to position the paired signal lines, ensuring consistent spacing and good symmetry, thus avoiding differential signal distortion. Simultaneously, the two ground wires are interconnected through the second conductive layer to achieve equipotential, avoiding signal distortion and noise interference caused by inconsistent reference potentials during signal transmission, thereby improving signal quality.

[0019] In practical applications, the two ground wires can be located on either side of the two signal lines, that is, the two signal lines are located between the two ground wires.

[0020] In other practical applications, the bare cable can also be configured with a ground wire placed between the two signal wires, and the ground wire is in contact with each of the two signal wires respectively.

[0021] For example, the second conductive layer may include aluminum foil.

[0022] Based on the second embodiment of the first aspect, this application also provides a seventh embodiment of the first aspect, wherein the wrapping layer is a metal foil, and the thickness of the metal foil is less than 50. μ In other words, the wrapping layer is a single layer of metal foil, and the entire layer (e.g., but not limited to the outer and inner circumferential surfaces of the wrapping layer) is conductive. The two ground wires are electrically connected to the metal foil to achieve equipotential. In this way, there is no need to configure a second conductive layer, which allows for further rational control of cable size and weight.

[0023] In practical applications, the bare cable may also include a second insulation layer and two ground wires. The second insulation layer wraps the signal line, and the two ground wires are spaced apart. The ground wires are bare conductors and are in contact with and electrically connected to the wrapping layer.

[0024] A second aspect of this application provides a cable comprising multiple bare cables and an outer sheath. The bare cables are disposed within the outer sheath, and the bare cables are those described above. The outer circumferential surfaces of adjacent bare cables are in contact and electrically connected. This configuration eliminates the need for a separate metal braided shielding layer when cabling, effectively reducing the cable's outer diameter and weight. Furthermore, the absence of a metal braided shielding layer restricts cable bending, effectively reducing the overall stiffness of the cable, enabling wiring with small bending radii, and facilitating cabling operations.

[0025] In practical applications, the outer peripheral surfaces of two adjacent bare cables are in contact and electrically connected. Exemplarily, the outer sheath can be a braided sheath, such as, but not limited to, a PVC braided sheath.

[0026] A third aspect of this application provides a cable assembly comprising multiple cables as described above and a cable end connector. The cable end connector includes a metal housing and a circuit board disposed within the metal housing. The ends of the multiple bare cables are connected to the cable end connector, extend into the metal housing, and are electrically connected to the circuit board. The sheathing layer of the multiple bare cables extending into the metal housing is in contact with and electrically connected to the metal housing. Based on the reduction in cable outer diameter and weight, and the ability to achieve small bending radius cabling, in areas with large cabling volumes in practical applications, bundled cabling is typically used. The effective reduction in cable outer diameter further reduces the space occupied in the cabinet depth direction.

[0027] In practical applications, compared to methods that require manual operation to fold the ends of the metal braided shielding layer outward to construct a grounding path, the embodiments of this application can electrically connect the bare cable to the connector's metal housing through the outer periphery of the cable. This can be achieved on automated assembly lines, effectively improving assembly efficiency.

[0028] For example, the cable end connector is configured as two, with the two ends of the bare cable connected to the corresponding cable end connectors respectively. That is, one end of the bare cable is connected to one of the two cable end connectors, and the other end of the bare cable is connected to the other cable end connector, so as to quickly plug and adapt to the device side.

[0029] Based on the third aspect, this application also provides a first implementation method for the third aspect: the portions of multiple bare cables extending into the metal housing are electrically connected to the metal housing through a flexible conductive element. Due to the deformable nature of the flexible conductive element, it can adapt to deformation during the cable bundling process, ensuring the electrical connection between the bare cables and the connector's metal housing, thereby achieving reliable grounding shielding capability based on the constructed grounding path.

[0030] Based on the first embodiment of the third aspect, this application also provides a second embodiment of the third aspect: the flexible conductive element is made of at least one of conductive rubber, conductive foam, conductive plastic, microwave-absorbing rubber, microwave-absorbing plastic, or metal spring sheet, and the flexible conductive element is wrapped around the outer periphery of multiple bare cables. In practical applications, taking conductive rubber as an example, it can be bundled and wound around the outer periphery of multiple bare cables, and one or more layers can be wound around the outer periphery of multiple bare cables depending on the available space between the metal shell and the bare cables.

[0031] Based on the second embodiment of the third aspect, this application also provides a third embodiment of the third aspect: the flexible conductive element is bonded to the metal shell by conductive adhesive, or the flexible conductive element and the metal shell are press-fitted together. Thus, for physically wound flexible conductive elements, the flexible conductive element and the metal shell can be bonded together by conductive adhesive. Alternatively, the outer dimensions of the wound flexible conductive element can be slightly larger than the inner wall structure dimensions of the metal shell. In this way, after the metal shell is assembled and fastened, its inner wall structure can press against the surface of the flexible conductive element, and based on the deformation of the flexible conductive element surface under pressure, a reliable electrical connection is formed between the two.

[0032] In other exemplary cases, the outer dimensions and shape of the flexible conductive element after winding can also be fully adapted to the inner wall structure of the connector's metal housing, and a reliable electrical connection can be formed after the metal housing is assembled and fastened.

[0033] Based on the first embodiment of the third aspect, this application also provides a fourth embodiment of the third aspect: the flexible conductive component is made of a conductive injection molding material, which fills the gaps between the bare cables and the gaps between the multiple bare cables and the metal housing. This enables conductivity between the conductive surfaces of all the bare cables, as well as between the bare cables and the connector's metal housing, thus forming a stable and reliable grounding path. Simultaneously, the conductive injection molding material, by filling the gaps between the bare cables, not only achieves a stable electrical connection but also serves to hold the bare cables in place.

[0034] A fourth aspect of this application provides a system comprising a first device and a second device, and a cable assembly as described above, the cable assembly being electrically connected to the first device and the second device. In practical applications, the first device and the second device can be installed within a server rack. Based on reasonable control of the cable's outer diameter and weight, and effective reduction of the overall cable stiffness, small bending radius cabling can be achieved, facilitating cabling operations. Furthermore, in areas with a large amount of cabling in practical application scenarios, the effective reduction of the cable's outer diameter can further reduce the space occupied in the depth direction of the server rack.

[0035] For example, the first device and the second device can be devices in the same cabinet, and the cabling assembly enables networking interconnection of devices within the cabinet; for other examples, the first device and the second device can be devices in different cabinets, and the cabling assembly enables networking interconnection of devices between cabinets. Attached Figure Description

[0036] Figure 1 This application provides a schematic diagram of the interconnection network of a system.

[0037] Figure 2 A schematic diagram illustrating the structure of a cable assembly provided in an embodiment of this application;

[0038] Figure 3 This is a schematic diagram of the cable assembly relationship of a typical cable assembly.

[0039] Figure 4 for Figure 3 The diagram shows a simplified electromagnetic noise shielding principle of the cable assembly in one application scenario.

[0040] Figure 5 This is a partial structural diagram of a bare cable provided in an embodiment of this application;

[0041] Figure 6 for Figure 5 View A in the middle;

[0042] Figure 7 for Figure 2 BB cross-section view in the middle;

[0043] Figure 8 for Figure 2 The diagram shows the assembly relationship between the cable end and the cable connector.

[0044] Figure 9 for Figure 8 Exploded view of the assembly;

[0045] Figure 10 for Figure 8 DD sectional view;

[0046] Figure 11 This is a partial structural diagram of another bare cable provided in an embodiment of this application;

[0047] Figure 12 A cross-sectional schematic diagram of another bare cable provided in an embodiment of this application;

[0048] Figure 13 A schematic cross-sectional view of another bare cable provided in an embodiment of this application;

[0049] Figure 14 A schematic diagram of the end face of another bare cable provided in an embodiment of this application;

[0050] Figure 15 This is a schematic diagram of the end face of another bare cable provided in an embodiment of this application. Detailed Implementation

[0051] This application provides an architecture implementation scheme for high-speed cables, which effectively reduces the size and weight of the cables and provides a good technical guarantee for reducing the stiffness of the cable.

[0052] With the development of computing and communication technologies, the requirements for transmission speeds between devices are becoming increasingly stringent. Taking cluster scenarios such as intelligent computing, general computing, and / or supercomputing as examples, a large number of high-speed cables are needed for interconnection between and within server racks. Please refer to [link / reference]. Figure 1 The figure is a schematic diagram of the interconnection network of a data transmission processing system provided in an embodiment of this application.

[0053] Figure 1 The system shown is a data transmission processing system 1000, which includes five cabinets. One cabinet is a communication cabinet 200, used for, but not limited to, a switch 201. The other four cabinets are computer cabinets 300, used for, but not limited to, servers 301. The switches 201 in the communication cabinet 200 (interconnection within the cabinet), the servers 301 in the computer cabinets 300 (interconnection within the cabinet), and the switches 201 and servers 301 (interconnection between cabinets) are interconnected via cable assemblies 100. It is understood that, in the context of intelligent computing, general computing, or supercomputing cluster scenarios, the number of cabinets and their functional configuration in this data transmission processing system 1000 are not limited to those shown in the figure and can be determined according to the actual needs of the scenario. This application embodiment does not impose limitations.

[0054] In other system application scenarios besides the data transmission processing system 1000, the supply and distribution of power between devices can also be achieved through cable assemblies (not shown in the figure).

[0055] Compared to optical fiber transmission solutions, the cable assembly 100 in this application embodiment can transmit signals through the inner conductor, resulting in lower power consumption and cost. Please also refer to... Figure 2 This figure is a schematic diagram of a cable assembly provided in an embodiment of this application. The cable assembly 100 includes a cable 10 and two end connectors 20. Multiple bare cables (not shown in the figure) are disposed within an outer sheath 2 to form the cable 10. The two end connectors 20 are located at opposite ends of the cable assembly 100 and are used for mating and connecting with corresponding devices to achieve interconnection between devices. That is, the cable assembly 100 connects a first device and a second device. The first device can be a server, switch, or router, etc., and the second device can also be a server, switch, or router, etc. Specifically, the first device can transmit signals to the second device through the cable assembly 100. The second device can also transmit signals to the first device through the cable assembly 100.

[0056] Of course, in other specific implementations, the cable assembly 100 may also have a wire end connector 20 (not shown in the figure) at only one end of the cable 10, which can be plugged into and connected to the device on the adapter side. The other end of each bare cable can be directly soldered to the corresponding interface of the device on the adapter side, which can also achieve electrical connection and meet the functional requirements of signal transmission. The specific choice can be made according to the actual application scenario, and this application embodiment does not limit it.

[0057] In related technologies, a typical cable assembly 100' includes multiple bare cables 10', a metal braided shielding layer 20', and an outer sheath 30'. See also... Figure 3 This diagram illustrates the assembly relationship of a typical cable assembly. During cabling, the bare cable 10' is inserted into a metal braided shielding layer 20', which has a certain degree of elasticity. The braided metal shielding layer is relatively heavy. Figure 3 As shown, the metal braided shielding layer 20' wraps around the outside of multiple bare cables 10' to avoid the potential impact of electromagnetic noise on signal quality; the outer sheath 30' is fitted over the metal braided shielding layer 20', providing good abrasion resistance. For the sake of simplicity, Figure 3 The cable assembly 100' shown uses two bare cables 10' as an example. Typically, the cable assembly 100' may include four, eight, or sixteen bare cables 10'. Here, "bare wire" refers to the smallest independent unit that can realize signal transmission, and "cabbaging" refers to a cable assembly with wire-end connectors assembled at the ends of the cables.

[0058] Please see also Figure 4 The image is Figure 3 The diagram shows a simplified electromagnetic noise shielding principle for the cable assembly 100' in one application scenario. During assembly with the cable connector, the conductors of each bare cable 10' are soldered to the interface pads of the PCB 40'. Simultaneously, the end of the metal braided shielding layer 20' is turned outwards (not shown) away from the PCB 40', and electrically connected to the metal housing 50' of the cable connector through the turned-out portion of the metal braided shielding layer 20'. The metal housing 50' is electrically connected to the metal outer casing 60' on the device side via a metal spring 60', thus forming a grounding path. Thus, as... Figure 4 The dashed arrow indicates that electromagnetic noise inside the equipment can be discharged through the metal braided shielding layer 20′, the metal spring 60′, and the metal outer casing 70′, such as... Figure 4 The dashed arrow in the middle indicates that electromagnetic noise from outside the equipment can also be discharged through the metal braided shielding layer 20′, the metal spring 60′, and the metal casing 70′.

[0059] However, the metal braided shielding layer 20' covering each bare cable 10' prevents an effective reduction in the cable's outside diameter (OD), and the metal braided shielding layer 20' is mostly made of tin-plated copper, resulting in a relatively heavy cable. Furthermore, the high overall stiffness of the cable leads to a large bending radius, which is unsuitable for high-density cluster cabling applications. Additionally, the assembly process with the cable connectors requires manual operation to fold the ends of the metal braided shielding layer 20' outwards, resulting in relatively low work efficiency.

[0060] Based on this, this application provides a bare cable including a signal line and a sheath. The signal line includes an inner conductor and a first insulating layer surrounding the inner conductor. The signal line is used to transmit signals. The sheath wraps around the outside of the signal line and is the outermost layer of the bare cable. At least the outer peripheral surface of the sheath is conductive. Here, "the sheath is the outermost layer of the bare cable" means the outermost structure of the bare cable in its usage state (e.g., when used in a cable). As the raw material for making cables, the bare cable may be covered with a protective layer as needed at the factory to provide protection during relocation or storage, and this protective layer is removed during cable manufacturing. It should be understood that this protective layer is not the outermost layer of the bare cable. Based on the conductivity of the outer peripheral surface of the bare cable, adjacent bare cables can contact and be electrically connected to each other during cabling. Furthermore, when assembling the connector, the outer peripheral surface of the bare cable can also be electrically connected to the metal shell of the connector, establishing a grounding path through the metal shell on the device side, thereby reasonably controlling the impact of electromagnetic noise on signal transmission performance. This configuration allows the bare cable to achieve electromagnetic shielding based on its conductive outer surface, eliminating the need for a separate metal braided shielding layer during cabling and effectively reducing the cable's outer diameter and weight. Furthermore, the overall cable stiffness is significantly reduced, allowing for smaller bending radii during cabling operations without the constraints of a metal braided shielding layer. This facilitates cabling operations and is beneficial for applications in high-density cluster cabling scenarios. In addition, in areas with a large volume of cabling in practical applications, bundled cabling is typically used. The reduced outer diameter and stiffness of the bundled cabling further minimize the space occupied in the cabinet's depth direction (i.e., the front-to-back direction).

[0061] To better understand the technical solution and effects of this application, and without loss of generality, specific embodiments will be described in detail below with reference to the accompanying drawings. Please refer to the accompanying drawings for further details. Figure 5 and Figure 6 ,in, Figure 5 This is a partial structural diagram of a bare cable provided in an embodiment of this application. Figure 6 for Figure 5 View A in the diagram.

[0062] like Figure 5As shown, the bare cable 1 includes two signal lines 11, a second insulation layer 12, a second conductive layer 13, two ground lines 14, and a wrapping layer 15.

[0063] Two signal lines 11 are used to transmit differential signals. Each signal line 11 includes an inner conductor 111 and a first insulating layer 112. The first insulating layer 112 wraps around the peripheral side 1111 of the inner conductor 111, meaning the inner conductor 111 is located inside the first insulating layer 112. In this embodiment, the inner conductor 111 of the signal line 11 is composed of a single wire, such as, but not limited to, a silver-plated copper core wire.

[0064] In other specific implementations, the inner conductor 111 of the signal line 11 may also be composed of multiple wires (not shown in the figure), which may be intertwined to form a whole. In other possible implementations, the signal line 11 may also use other types of wires. This application does not limit the scope of the embodiments.

[0065] In specific implementations, the material of the first insulating layer 112 can be polytetrafluoroethylene (PTFE), polyimide (PI), polyethylene (PE), polypropylene (PP), fluorinated ethylenepropylene copolymer (FEP), thermoplastic polyurethanes (TPU), or thermoplastic elastomer (TPE).

[0066] The second insulating layer 12 wraps around the two signal lines 11 to further improve electrical insulation performance and also serves to position the paired signal lines 11. The spacing between the two signal lines 11 remains consistent, exhibiting good symmetry and preventing differential signal distortion. In specific implementations, the material of the second insulating layer 12 can be selected according to product design requirements, such as, but not limited to, FEP, TPU, or TPE.

[0067] In other possible implementations, the second insulating layer 12 may also be made of other materials. This application does not limit the scope of the embodiments.

[0068] The second conductive layer 13 encloses the second insulating layer 12, and two ground wires 14 are spaced apart. Figure 5 and Figure 6As shown, the two ground wires 14 are located on either side of the two signal lines 11, meaning the two signal lines 11 are located between the two ground wires 14. The ground wires 14 provide a relatively stable reference potential, effectively enhancing anti-interference capabilities. The ground wires 14 are exposed conductors that can contact the outer periphery of the second conductive layer 13. Thus, the two ground wires 14 are interconnected through the second conductive layer 13, achieving equipotential between them. This reduces signal distortion and noise interference caused by inconsistent reference potentials during signal transmission.

[0069] In a specific implementation, the second conductive layer 13 can be made of aluminum foil. In other specific implementations, the second conductive layer 13 used for interconnection between the two ground wires 14 can also be formed of other materials or structures. This application does not limit the scope of the embodiments.

[0070] The encapsulation layer 15 includes a base layer 151 and a first conductive layer 152. The base layer 151 is wrapped around the outside of the two ground wires 14, that is, the signal line 11, the second insulating layer 12, the second conductive layer 13 and the ground wires 14 are located inside the base layer 151.

[0071] In this embodiment, the substrate 151 is made of Mylar, such as, but not limited to, PET Mylar sheet or PVC Mylar sheet. The constraints imposed by the Mylar allow the ground wire 14 and the signal wire 11 to maintain a stable relative position. In other possible implementations, the material or structure of the substrate 151 can also be determined according to the overall product design requirements; this embodiment does not impose such limitations.

[0072] The first conductive layer 152 is made of aluminum foil, which can be wrapped around the outside of the Mylar (substrate layer 151) to form the conductive outer peripheral surface of the wrapping layer 15. In a specific implementation, the thickness of the aluminum foil forming the first conductive layer 152 can be less than 50 mm. μ m.

[0073] based on Figure 5 and Figure 6 The described bare cable 1 is wrapped with an outer sheath 30 around multiple bare cables 1, forming a cable assembly 100 without the need for a metal braided shielding layer. Preferably, the outer sheath 30 can be a PVC braided sheath. In other specific implementations, the outer sheath 30 can also be formed by winding PET film, PTFE film, etc., which is not limited in the embodiments of this application.

[0074] Please see Figure 7 The image is Figure 2 The BB section view in the diagram. To simplify the drawing, Figure 7The cable assembly 100 shown also uses two bare cables 1 as an example. In specific implementations, the number of bare cables 1 in the cable assembly 100 can be selected according to the device interconnection needs, for example, but not limited to, including four, eight, or sixteen bare cables 1. This application embodiment does not limit this.

[0075] In this embodiment, cable assembly 100 is provided with cable end connectors 20 at both ends. Please refer to [the relevant documentation / reference]. Figure 2 , Figure 8 and Figure 9 , Figure 8 for Figure 2 The diagram shows the assembly relationship between the bare cable end and the cable connector. Figure 9 for Figure 8 Exploded view of the assembly.

[0076] like Figure 8 and Figure 9 As shown, the wire-end connector 20 includes a metal housing 21, a circuit board 22, and a handle assembly 23. The circuit board 22 is located inside the metal housing 21. In this embodiment, each bare cable 1 is connected to one end of the circuit board 22, and the other end of the circuit board 22 can be plugged into and adapted to a device-side connector (not shown in the figure). Here, the wire-end connector 20 is a male connector, and correspondingly, the connector on the device-side board is a female connector. After the wire-end connector 20 is inserted into place, the electrical interface 221 at the end of the circuit board 22 interconnects with the device-side connector. In a specific implementation, the electrical interface 221 can be a gold finger structure on the circuit board 22 (not shown in the figure), which can be determined according to the overall product design requirements. This application embodiment does not limit this.

[0077] In this embodiment, the metal housing 21 includes a first housing 211 and a second housing 212 connected together, which are joined together to form a metal housing 21 capable of accommodating internal components. One side of the circuit board 22 is disposed opposite to the first housing 211, and the other side of the circuit board 22 is disposed opposite to the second housing 212.

[0078] Corresponding to the handle assembly 23, two mounting slots 2111 are provided on opposite sides of the metal housing 21. These mounting slots 2111 are located on the first housing 211. The handle assembly 23 includes a spring piece 231 and a pull ring 232. The spring piece 231 is fixed together with the pull ring 232 and is connected to the mounting slots 2111 of the metal housing 21 via the spring piece 231. It is understood that the handle assembly 23 is not limited to the structural form shown in the figure. In other specific implementations, the handle mechanism can be determined according to the matching scheme between the wire-end connector and the device-side connector. This application embodiment does not impose limitations.

[0079] For example Figure 9As shown, the inner conductor 111 and ground wire 14 of each bare cable 1 are soldered to the signal pad 222 and ground pad 223 respectively provided on the circuit board 22 to achieve the corresponding electrical connection. In the width direction of the line connector 20, the signal pad 222 and ground pad 223 are arranged alternately. Of course, in other possible implementations, the signal pad 222 and ground pad 223 can also be arranged alternately in the length direction of the line connector 20; this embodiment does not limit this.

[0080] The portion of each bare cable 1 extending into the metal casing 21 can be bundled using a flexible conductive material 40. Please refer to [link / reference needed]. Figure 10 The image is Figure 8 The DD cross-sectional view shows the flexible conductive element 40 electrically connected to the metal housing 21 (first housing 211 and second housing 212) to form a grounding path. Specifically, the bundled bare cables 1 are based on the flexible conductive element 40, with the conductive outer peripheral surfaces of two adjacent bare cables 1 in contact and electrically connected, and electrically connected to the metal housing 21 through the flexible conductive element 40, thus obtaining reliable grounding shielding capability.

[0081] In specific implementations, the flexible conductive element 40 can be conductive rubber, conductive foam, conductive plastic, microwave-absorbing rubber, microwave-absorbing plastic, or metal spring sheet, etc. Here, "flexible" refers to the deformability of the conductive material to meet the functional requirement of adaptive deformation during the bundling process. Specifically, the flexible conductive element is wrapped around the outer periphery of multiple bare cables 1 to achieve bundling, and one or more layers can be wrapped around the outer periphery of the multiple bare cables 1 depending on the available space between the metal shell 21 and the bare cables 1. It should be understood that any method that can simultaneously meet the functional requirements of reliable bundling and good electrical connection is acceptable. This application does not limit the specific implementation.

[0082] To achieve a stable and reliable electrical connection, the physically wound flexible conductive element 40 can be bonded to the metal housing 21 using conductive adhesive. In other implementations, the flexible conductive element 40 and the metal housing 21 can also be tightly connected using an interference fit. For example, the outer dimensions formed by the winding of the flexible conductive element 40 can be slightly larger than the inner wall structure dimensions of the metal housing 21. In this way, after the first housing 211 and the second housing 212 are assembled and fastened, the inner wall structure of the metal housing 21 can press against the surface of the flexible conductive element 40, and a reliable electrical connection is formed between the two based on the deformation of the surface of the flexible conductive element 40 under pressure.

[0083] Of course, in other possible implementations, the outer dimensions and shape of the flexible conductive element 40 can also be fully adapted to the inner wall structure of the metal housing 21 (not shown in the figure), and a reliable electrical connection can be formed after the first housing 211 and the second housing 212 are assembled and fastened together. The specific choice can be made according to the overall product design requirements, and this application embodiment does not limit it.

[0084] In another specific implementation, the flexible conductive element 40 can also be made of conductive injection molding material. Specifically, injection molding can be used to bundle the bare cables together. In this way, the conductive injection molding material can fill the gaps between the bare cables 1 and the gaps between the bare cables 1 and the metal housing 21, achieving conductivity between the conductive outer surfaces of all the bare cables 1 and between the conductive outer surfaces of the bare cables 1 and the metal housing 21 of the connector. Of course, injection molding can also be performed using a mold based on the first housing 211. In other words, the first housing 211 serves as part of the bundling injection mold. After injection molding, the flexible conductive element 40 has a high degree of fit with the first housing 211. Alternatively, the first housing 211 and the second housing 212 can be used together as the injection mold. In this way, the flexible conductive element 40 has a high degree of fit with both the first housing 211 and the second housing 212, resulting in better electrical connection reliability.

[0085] In another specific implementation, the flexible conductive element 40 can be made of two different materials. For example, conductive rubber can be used to wrap each bare cable 1 to achieve bundled pretreatment, and the bundled bare cables can be installed on the first housing 211. Then, conductive injection molding material can be used for injection molding. Overall, the reliable realization of the bundled and electrical connection functions of the flexible conductive element 40 can still be guaranteed.

[0086] Furthermore, to maintain a stable relative position between each bare cable 1 and the connector 20, a limiting element can be provided between the bare cable 1 and the metal housing 21 of the connector in a specific implementation. For example... Figure 9 and Figure 10 As shown, the limiting member 50 is located at the cable passage 213 of the metal housing 21. The limiting member 50 covers and fixes each bare cable 1. The limiting member 50 includes a limiting protrusion 51, which is embedded in the limiting recess 214 of the first housing 211. The embedded cooperation between the limiting member 50 and the metal housing 21 keeps the bare cable 1 relatively fixed, which can prevent the bare cable 1 from being pulled during wiring or plugging and unplugging operations, thus avoiding direct impact on the soldering reliability between the bare cable 1 and the circuit board 22.

[0087] In a practical implementation, after the bare cable is installed in the first housing 211, the limiting member 50 can be formed by injection molding, and a limiting protrusion 51 embedded in the limiting recess 214 can also be formed. That is, the first housing 211 serves as part of the injection mold for the limiting member 50. Alternatively, the limiting member 50 can be formed by injection molding, and then the bare cable 1 covering the limiting member 50 can be installed in the first housing 211, with the limiting protrusion 51 embedded in the limiting recess 214 of the first housing 211. Compared to the former, the method of using the first housing 211 as an injection mold offers better manufacturability and lower implementation costs.

[0088] Specifically, the limiting member 50 may be made of insulating injection molding material according to process requirements, and this embodiment does not impose any limitations. Furthermore, the limiting member 50 may also include an outer sealing portion 52, which is located outside the wire passage 213 and blocks the wire passage 213. This prevents external dust or moisture from entering the wire connector 20. It is understood that the outer sealing portion 52 is an optional configuration structure, and can be selected according to the external environment of the actual application scenario; this embodiment does not impose any limitations.

[0089] It should be noted that, compared to Figure 3 The aforementioned solutions require manual operation to fold the ends of the metal braided shielding layer 20′ outwards to construct a grounding path. In this embodiment, the electrical connection between the outer periphery of the bare cable 1 and the connector metal housing 21 is achieved based on the flexible conductive element 40, which can be implemented on an automated assembly line, effectively improving assembly efficiency.

[0090] by Figure 3 The cable assembly 100' shown is a comparative example, demonstrating single-strand cabling (including sixteen bare cables) tested and evaluated under the same technical conditions. Details are as follows:

[0091] The test data characterizing the OD of the cable are shown in Table 1 below. The inner conductor diameters of the bare cables tested were 0.254 mm and 0.203 mm, respectively. In Table 1, the OD range of the cable is the range of its cross-sectional outer diameter.

[0092] Table 1 ：

[0093] Comparison Plan Inner conductor diameter (mm) Cable OD range (mm) Comparative Example 1 0.254 7-8.5 Example 1 0.254 5.5-7 Comparative Example 2 0.203 6.5-7.5 Example 2 0.203 5.5-6.5

[0094] As can be seen from the test results shown in Table 1, the cable OD of this embodiment is significantly reduced compared to the comparative example. Taking an inner conductor with a diameter of 0.254 mm as an example, the maximum cable OD of this embodiment is reduced by approximately 1.5 mm compared to the maximum cable OD of the comparative example.

[0095] The test data characterizing the weight of the cabling are shown in Table 2 below. The inner conductor diameter of the bare test cable is 0.254 mm. In Table 2, "1000 cablings" is used to characterize the number of cablings required for interconnection between devices in the test scenario.

[0096] The OD range of a cable is the range of its cross-sectional outer diameter.

[0097] Table 2 ：

[0098]

[0099] As shown in Table 2, the test results indicate that for an inner conductor with a diameter of 0.254 mm and a length of 2 m, the weight of a single cable in this embodiment is 67.5 g lighter than that of the comparative embodiment. For a scenario involving 1000 cables in a network interconnection, the total weight of the cable in this embodiment is 70 kg lighter than that of the comparative embodiment, representing a weight reduction of 28%.

[0100] The test data characterizing the cable stiffness are shown in Tables 3 and 4 below. The inner conductor diameters of the bare cables tested were 0.254 mm, 0.32 mm, and 0.404 mm, respectively. During the stiffness test, the cable to be formed was placed on a metal support, and a test mandrel was pressed against the cable to measure the force F required to bend it. Typically, based on the array arrangement of the internal bare cables, the cross-sectional shape of the formed cable is elliptical, i.e., it has a wide side and a narrow side. Here, the test mandrel was pressed against the wide side and the narrow side of the cable cross-section, respectively, and the force F required to bend it was measured. Table 3 shows the measurement data when the test mandrel was pressed against the wide side of the cable cross-section, and Table 4 shows the measurement data when the test mandrel was pressed against the narrow side of the cable cross-section.

[0101] Table 3 ：

[0102]

[0103]

[0104] As can be seen from the test results shown in Table 3, compared with the comparative example, the force required for measuring the cable width in this embodiment is relatively small; at the same time, the standard deviation of the force for the three effective measurements of the cable width in this embodiment is relatively small. Overall, the cable provided in this embodiment has low stiffness and high stiffness stability.

[0105] Table 4 ：

[0106]

[0107] As can be seen from the test results shown in Table 4, compared with the comparative example, the force required for measuring the narrow side of the cable in this embodiment is relatively small; at the same time, the standard deviation of the force for the three effective measurements of the narrow side of the cable in this embodiment is relatively small. Overall, the cable assembly provided in this embodiment has low stiffness and high stiffness stability.

[0108] Furthermore, in the aforementioned scenario where 1000 cables are used for network interconnection, combined with Figure 1As shown, area C, with the largest number of cablings, has over 100 bundled cables. Compared to the comparative example, using the cable assembly provided in this embodiment, based on the effective reduction of the maximum cable OD size and the reduction of cable bending and diameter changes, the dimensional gain of area C in the front-to-back direction of the cabinet (perpendicular to the direction shown in the drawing) is approximately 23.2mm.

[0109] The bare cable described in the foregoing embodiments has a first conductive layer 152 made of aluminum foil. In specific implementations, the first conductive layer 152 can also be a conductive coating. Please refer to [further details omitted]. Figure 11 This figure is a partial structural diagram of another bare cable provided in an embodiment of this application. In order to clearly show the differences or connections between this embodiment and the foregoing embodiments, the same functional components or structures are shown in the figure with the same markings.

[0110] and Figure 5 Compared to the described bare cable 1, the difference in this embodiment is that the first conductive layer 152 of the wrapping layer 15 is made of a conductive coating, and the conductive coating covers the outer peripheral surface of the base layer 151 (Mylar) to form a conductive outer peripheral surface of the wrapping layer 15.

[0111] In specific implementations, the conductive coating material can be a metallic material, such as, but not limited to, silver, copper, or nickel. In other specific implementations, the conductive coating material can be a metal oxide material, such as, but not limited to, doped tin oxide. In other possible implementations, the conductive coating can be made of different materials as needed, as long as the surface resistance of the formed conductive coating is less than 0.05 Ω / sq. This application does not limit the scope of the embodiments.

[0112] Furthermore, the method of forming this conductive coating can be selected as needed, such as, but not limited to, brushing or spraying processes. In specific implementations, the thickness of the conductive coating can be less than 20 mm. μ m, to reasonably control the outer dimensions of the bare cable; at the same time, the shielding capability against electromagnetic waves is greater than 80dB, and it has a good electromagnetic interference shielding effect.

[0113] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0114] The bare cables described in the foregoing embodiments for transmitting differential signals are all equipped with two ground wires. In a specific implementation, only one ground wire may be configured. Please refer to [link to relevant documentation]. Figure 12 This figure is a cross-sectional schematic diagram of another bare cable provided in an embodiment of this application. In order to clearly show the differences or connections between this embodiment and the foregoing embodiments, the same functional components or structures are shown in the figure with the same markings.

[0115] like Figure 12As shown, the bare cable 1 includes two signal lines 11. (The last sentence appears to be incomplete and possibly contains errors. It can be omitted from the translation.) Figure 5 and Figure 11 Compared to the described bare cable 1, the difference in this embodiment is that it includes a ground wire 14, which is placed between the two signal lines 11. The ground wire 14 is in contact with both signal lines 11 simultaneously. In this way, the ground wire 14 and the signal lines 11 can be assembled more tightly, resulting in a structure with higher space utilization.

[0116] Meanwhile, given that the ground wire 14 is configured as a single wire, a second conductive layer 13 is not provided. Furthermore, the two signal wires 11 are not wrapped with a second insulating layer 12; they are electrically insulated from each other by a first insulating layer 112 that wraps around the inner conductor 111. This further reduces the size and weight of the bare cable.

[0117] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0118] Additionally, depending on the configuration requirements of different application scenarios, only two signal lines 11 may be configured within the wrapping layer 15. Please refer to [link / reference]. Figure 13 This figure is a cross-sectional schematic diagram of another bare cable provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 12 The differences and connections between the described schemes, as well as the same functional components or structures, are illustrated in the diagram with the same markings.

[0119] like Figure 13 As shown, the bare cable 1 includes two signal lines 11, and a sheathing layer 15 covers the outside of the signal lines 11 to form a bare cable 1 for transmitting differential signals.

[0120] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0121] The sheathing layer 15 of the bare cable 1 described in the foregoing embodiments all comprises two independent physical structures. In other specific implementations, the sheathing layer 15 may also be a single-piece structure. Please refer to... Figure 14 This figure is a schematic diagram of the end face of another bare cable provided in an embodiment of this application. It is intended to clearly illustrate the difference between this embodiment and the aforementioned... Figure 6 The differences and connections between the described schemes, as well as the same functional components or structures, are illustrated in the diagram with the same markings.

[0122] like Figure 14As shown, the base layer 151 and the first conductive layer 152 of the wrapping layer 15 of the bare cable 1 are composited into an integral structure. For example, Mylar is used as the base layer 151, and a metal such as aluminum foil is laminated on the outer surface of the Mylar to form the first conductive layer 152. That is, the Mylar and the aluminum foil are composited into an integral wrapping layer 15, which is not easy to separate. This makes it convenient for the integral wrapping layer 15 to wrap around the outside of the signal line 1 and the ground line 14, and the aluminum foil forms the conductive outer peripheral surface of the wrapping layer 15.

[0123] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0124] To further reduce the size and weight of bare cables, for bare cables with two ground wires, the sheath 15 can be made of a single layer of aluminum foil. See also... Figure 15 This figure is a schematic diagram of the end face of another bare cable provided in an embodiment of this application. In order to clearly show the differences or connections between this embodiment and the foregoing embodiments, the same functional components or structures are shown in the figure with the same markings.

[0125] and Figure 5 and Figure 11 Compared to the described bare cable 1, the difference in this embodiment is that the sheathing layer 15 is an aluminum foil that wraps around the outside of the two ground wires 14. That is, the signal line 11, the second insulation layer 12, the second conductive layer 13, and the ground wires 14 are located inside the aluminum foil (sheathing layer 15). The sheathing layer 15 made of aluminum foil is conductive throughout, and the aluminum foil is simultaneously in contact with the two ground wires 14, achieving equipotentiality between the two ground wires 14. Accordingly, this embodiment does not require the second conductive layer 13. In this way, the size and weight of the bare cable can be further controlled more rationally.

[0126] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0127] Based on the aforementioned bare cable, embodiments of this application also provide a cable assembly. In specific implementations, combined with... Figure 2 As shown, this cable assembly can be a direct-attach copper cable (DAC), which connects directly to the connectors at both ends via copper conductors. This means it has no active components, resulting in lower power consumption and cost. For example, but not limited to, it can be used for interconnecting devices within a cabinet.

[0128] In other specific implementations, the cable assembly can also be an active copper cable (ACC), based on a redriver chip installed at the bare cable receiver end, enabling signal equalization and reshaping relay. For example, but not limited to, it can be used for interconnection between cabinet devices. The cable assembly can also be an active electrical cable (AEC), based on clock and data recovery (CDR) and redriver chips installed at both ends of the bare cable, capable of amplifying and equalizing transmitted signals, and also reshaping signals. For example, but not limited to, it can be used for interconnection between cabinet devices.

[0129] It should be understood that other functional components of the cable assembly can be implemented using existing technologies, so they will not be described in detail here.

[0130] Furthermore, the ordinal numbers "first" and "second," etc., used herein are only for describing the composition or structure of the same function in the technical solution. It is understood that the use of the aforementioned ordinal numbers does not constitute a limitation on the understanding of the technical solution for which protection is sought in this application.

[0131] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A bare cable, characterized in that, The bare cable includes a signal line and a sheath. The signal line includes an inner conductor and a first insulating layer that wraps around the inner conductor. The sheath wraps around the outside of the signal line and is the outermost layer of the bare cable. At least the outer peripheral surface of the sheath is conductive.

2. The bare cable according to claim 1, characterized in that, The encapsulation layer includes a base layer and a first conductive layer, the first conductive layer being located outside the base layer to form a conductive outer peripheral surface of the encapsulation layer.

3. The bare cable according to claim 2, characterized in that, The thickness of the first conductive layer is less than 50 μm.

4. The bare cable according to claim 2 or 3, characterized in that, The substrate layer is made of Mylar, and / or the first conductive layer is made of metal foil or a conductive coating.

5. The bare cable according to claim 4, characterized in that, The metal foil may include aluminum foil or copper foil, or the conductive coating may be made of metal or metal oxide.

6. The bare cable according to claim 4 or 5, characterized in that, The thickness of the conductive coating is less than 20 μm, and / or the surface resistance of the conductive coating is less than 0.05 Ω / sq.

7. The bare cable according to any one of claims 2 to 6, characterized in that, The base layer and the first conductive layer are combined into a single structure.

8. The bare cable according to any one of claims 1 to 7, characterized in that, The signal lines consist of two wires and are used to transmit differential signals.

9. The bare cable according to any one of claims 1 to 8, characterized in that, The bare cable also includes a ground wire, which is used for grounding.

10. The bare cable according to claim 9, characterized in that, The bare cable also includes a second insulating layer and a second conductive layer. The second insulating layer wraps around the signal line, and the second conductive layer wraps around the second insulating layer. The ground wire is configured as two spaced-apart wires, which are in contact with and electrically connected to the second conductive layer.

11. The bare cable according to claim 8, characterized in that, The bare cable also includes a ground wire, which is placed between the two signal lines and is in contact with the two signal lines respectively.

12. The bare cable according to claim 1, characterized in that, The wrapping layer is a metal foil with a thickness of less than 50 μm.

13. The bare cable according to claim 12, characterized in that, The bare cable also includes a second insulation layer and two ground wires. The second insulation layer wraps around the signal line, and the two ground wires are spaced apart. The ground wires are in contact with and electrically connected to the wrapping layer.

14. A cable, characterized in that, The cable includes multiple bare cables and an outer sheath, wherein the multiple bare cables are disposed within the outer sheath, and the bare cables are the bare cables according to any one of claims 1 to 13.

15. The cable according to claim 14, characterized in that, The outer peripheral surfaces of the two bare cables are in contact and electrically connected.

16. A cable assembly, characterized in that, The cable assembly includes a cable and a cable end connector, wherein the cable is the cable as described in claim 14 or 15; the cable end connector includes a metal housing and a circuit board disposed in the metal housing, wherein multiple bare cables of the cable extend into the metal housing and are electrically connected to the circuit board; the sheathing layer of the multiple bare cables extending into the metal housing is in contact with and electrically connected to the metal housing.

17. The cable assembly according to claim 16, characterized in that, The portions of the multiple bare cables extending into the metal housing are electrically connected to the metal housing via flexible conductive elements.

18. The cable assembly according to claim 17, characterized in that, The flexible conductive element is made of at least one of conductive rubber, conductive foam, conductive plastic, microwave absorbing rubber, microwave absorbing plastic, or metal spring sheet, and the flexible conductive element is wrapped around the outer periphery of the plurality of bare cables.

19. The cable assembly according to claim 17 or 18, characterized in that, The flexible conductive element is bonded to the metal housing by conductive adhesive, or the flexible conductive element and the metal housing are press-fitted together.

20. The cable assembly according to claim 17, characterized in that, The flexible conductive component is made of conductive injection molding material, which fills the gaps between the bare cables and the gaps between the multiple bare cables and the metal shell.

21. The cable assembly according to any one of claims 16 to 20, characterized in that, The cable connector is configured as two cable connectors, one end of the bare cable is connected to one of the two cable connectors, and the other end of the bare cable is connected to the other cable connector.

22. A system, characterized in that, The system includes a first device and a second device, and a cable assembly according to any one of claims 16 to 21, the cable assembly being electrically connected to the first device and the second device.

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