Inductors, circuit board assemblies and electronic devices

Abstract

This application provides an inductor, a circuit board assembly, and an electronic device. The inductor in this application includes an inductor body and an input conductor. The inductor body includes an inductor coil. The input conductor is connected to the input terminal of the inductor coil. A portion of the input conductor is wound to form a compensation coil. The axis of the compensation coil is aligned with the axis of the inductor coil, but the winding direction of the compensation coil is opposite to the winding direction of the inductor coil. A plane perpendicular to the axis of the inductor coil is a first reference plane. The area around the inductor coil is a first region, and the area around the compensation coil is a second region. At least a portion of the orthographic projection of the first region onto the first reference plane lies within the orthographic projection of the second region onto the first reference plane. Therefore, this application solves the technical problem of how to effectively suppress the influence of changing magnetic fields generated by an inductor on surrounding electronic components.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an inductor, circuit board assembly, and electronic device. Background Technology

[0002] In electronic devices, inductors are crucial components widely used in circuits for filtering, energy storage, impedance matching, and oscillation. However, the changing current in an inductor generates a varying magnetic field during operation, which can cause electromagnetic interference to surrounding electronic components, affecting the stability and performance of the electronic equipment. Therefore, effectively suppressing the influence of the inductor's magnetic field on surrounding electronic components has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application provides an inductor, a circuit board assembly, and an electronic device, aiming to solve the technical problem of how to effectively suppress the influence of changing magnetic fields generated by an inductor on surrounding electronic components.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides an inductor, which includes an inductor body and an input conductor. The inductor body includes an inductor coil. The input conductor is connected to the input end of the inductor coil. A portion of the input conductor is wound to form a compensation coil. The axial direction of the compensation coil is consistent with the axial direction of the inductor coil, and the winding direction of the compensation coil is opposite to the winding direction of the inductor coil. A plane perpendicular to the axial direction of the inductor coil is a first reference plane. The surrounding area of ​​the inductor coil is a first region, and the surrounding area of ​​the compensation coil is a second region. At least a portion of the orthographic projection of the first region onto the first reference plane is located on the orthographic projection of the second region onto the first reference plane.

[0006] In this application, the inductor utilizes a portion of its input conductor to form a compensation coil. The axis of the compensation coil is aligned with the axis of the inductor coil, but the winding direction of the compensation coil is opposite to that of the inductor coil. Furthermore, the projections of the compensation coil's winding region (second region) and the inductor coil's winding region (first region) onto the first reference plane at least partially overlap. Based on this, at least a portion of the magnetic field generated by the compensation coil during operation can be opposite to the magnetic field direction of the inductor coil. This allows the compensation coil to spatially cancel out the magnetic field direction of the inductor coil, significantly reducing the magnetic field intensity radiated outwards from the inductor body and preventing electromagnetic interference from the changing magnetic field generated by the inductor during operation to surrounding electronic components.

[0007] Furthermore, the compensation coil in this application is formed directly using a section of the input conductor. When the inductor is used in an electronic device, there is no need to add an additional independent compensation element or a complex shielding structure for the inductor. This not only saves space but also reduces the weight and manufacturing cost of the entire electronic device, meeting the demands of electronic devices for high integration and lightweight design.

[0008] In one possible implementation of the first aspect of this application, the compensation coil and the inductor coil are arranged coaxially to achieve more efficient magnetic field cancellation, significantly reduce the magnetic field strength radiated outward by the inductor body, and thus more effectively suppress electromagnetic interference of the inductor to surrounding components.

[0009] In one possible implementation of the first aspect of this application, the orthographic projection of the first region on the first reference plane is located on the orthographic projection of the second region on the first reference plane, so as to ensure that the magnetic field generated by the compensation coil can completely cover the magnetic field generated by the inductor coil.

[0010] In one possible implementation of the first aspect of this application, the number of turns of the compensation coil is less than the number of turns of the inductor coil. Based on this, the compensation coil can cancel the inductive magnetic field that the inductor generates under certain conditions. The fewer turns allow for precise matching of the strength of the inductive magnetic field, avoiding energy waste or reverse magnetic field interference caused by over-compensation.

[0011] In one possible implementation of the first aspect of this application, the number of turns of the compensation coil is greater than or equal to 1 to ensure that it can generate a sufficient magnetic field to counteract the inductive magnetic field generated by the inductor coil.

[0012] In one possible implementation of the first aspect of this application, the number of turns of the compensation coil is less than or equal to 2, so as to avoid the impedance generated by the compensation coil affecting the normal operation of the inductor.

[0013] In one possible implementation of the first aspect of this application, the inductor body further includes a packaging structure, inductor coil is packaged within the packaging structure, and the packaging structure protects the inductor coil and extends the service life of the inductor.

[0014] In one possible implementation of the first aspect of this application, the orthographic projection of the package structure on the first reference plane is located within the orthographic projection of the second region on the first reference plane, so as to ensure that the reverse magnetic field generated by the compensation coil can fully act on the inductor coil in the package structure, maximize the cancellation of the inductive magnetic field generated by the inductor coil, thereby significantly reducing electromagnetic interference to external electronic components.

[0015] In one possible implementation of the first aspect of this application, the orthographic projection area of ​​the second region on the first reference surface is the first area, and the orthographic projection area of ​​the encapsulation structure on the first reference surface is the second area. The ratio of the first area to the second area is greater than or equal to 1 to ensure sufficient magnetic field cancellation effect.

[0016] In one possible implementation of the first aspect of this application, the ratio of the first area to the second area is less than or equal to 3. The smaller projected area of ​​the compensation coil reduces material usage and manufacturing complexity, thereby lowering manufacturing costs.

[0017] Secondly, this application provides a circuit board assembly, which includes a circuit board and the aforementioned inductor. The inductor body is connected to the circuit board. Under the action of the compensation coil, the inductor will not interfere with other components on the circuit board, thereby further ensuring the stability of the circuit board assembly.

[0018] In one possible implementation of the second aspect, the compensation coil is located on the circuit board to improve the integration of the circuit board assembly.

[0019] In one possible implementation of the second aspect, the circuit board includes a first metal layer, at least a portion of which forms a compensation coil. The compensation coil is formed directly from the first metal layer of the circuit board, reducing additional material usage and manufacturing steps, and lowering manufacturing costs and process complexity.

[0020] In one possible implementation of the second aspect, the circuit board includes a first metal layer and a second metal layer stacked and spaced apart, and an insulating dielectric layer located between the first metal layer and the second metal layer. The compensation coil includes a first coil and a second coil, with at least a portion of the first metal layer forming the first coil and at least a portion of the second metal layer forming the second coil. The insulating dielectric layer is provided with metallized vias, which connect the first coil and the second coil. The first coil and the second coil are located on different metal layers and are connected through the metallized vias to form a multi-layer compensation coil structure. This enhances the reverse magnetic field strength generated by the compensation coil, more effectively counteracts the inductive magnetic field generated by the inductor coil, and significantly reduces electromagnetic interference to external electronic components.

[0021] In one possible implementation of the second aspect, the orthographic projection of the first coil onto the plane of the circuit board coincides with the orthographic projection of the second coil onto the plane of the circuit board, and their magnetic fields are completely aligned in space. Since the winding direction of the compensation coil is opposite to that of the inductor coil, the reverse magnetic fields generated by the first and second coils can be superimposed, thereby more efficiently canceling the inductive magnetic field generated by the inductor coil and significantly reducing electromagnetic interference to external electronic components.

[0022] In one possible implementation of the second aspect, the circuit board assembly further includes a camera module. The camera module is located on the side of the circuit board away from the inductor body, and the orthographic projection of the camera module on the circuit board overlaps with the orthographic projection of the inductor body on the circuit board. By placing the camera module on the side of the circuit board away from the inductor body and having its orthographic projection overlap with the orthographic projection of the inductor body, the vertical space of the circuit board can be fully utilized, and the camera module can avoid occupying additional planar area, thereby improving the overall utilization rate of the circuit board.

[0023] Thirdly, this application provides an electronic device, which includes a screen, a back cover, and a circuit board assembly. The back cover is located on the back side of the screen and is fixedly connected to the screen. The circuit board assembly is located inside the back cover, and the inductor body is located between the screen and the circuit board. By placing the inductor body between the screen and the circuit board, and combining it with the magnetic field cancellation effect of the compensation coil, the interference of the magnetic field on other electronic components set on the circuit board assembly can be effectively reduced, ensuring the clarity and stability of the display effect.

[0024] The technical effects of any of the design methods in the second to third aspects are the same as those of the different design methods in the first aspect. Attached Figure Description

[0025] Figure 1 An exploded view of an electronic device provided in some embodiments of this application;

[0026] Figure 2 According to Figure 1 A 3D view of the electronic device shown;

[0027] Figure 3 This is a schematic diagram of the installation of an inductor provided in some embodiments of this application;

[0028] Figure 4 According to Figure 3 A schematic diagram of the magnetic field distribution of the inductor shown.

[0029] Figure 5 According to Figure 1 One of the schematic diagrams of the back of the electronic device shown;

[0030] Figure 6 According to Figure 1 The second schematic diagram of the back of the electronic device shown;

[0031] Figure 7 According to Figure 4 One of the schematic diagrams of the winding of the compensation coil of the inductor shown;

[0032] Figure 8 According to Figure 4 The second schematic diagram of the winding of the compensation coil of the inductor shown;

[0033] Figure 9 According to Figure 4 The third schematic diagram of the winding of the compensation coil of the inductor shown;

[0034] Figure 10 According to Figure 4 The fourth schematic diagram of the winding of the compensation coil of the inductor shown;

[0035] Figure 11 According to Figure 10 The cross-sectional view of the inductor is shown.

[0036] Figure label:

[0037] 100, Screen; 101, Light-transmitting cover; 102, Display screen; 200, Back cover; 201, Back cover; 202, Frame; 203, Middle plate; 300, Camera module; 400, Circuit board assembly; 401, Inductor; 4011, Inductor body; 4011a, Inductor coil; 4011b, Input pin; 4011c, Output pin; 4012, Package structure; 4013, Input wire; 4013a, Compensation coil; 4014, Output wire; 402, Circuit board; 403, Metallized via; L1, First turn coil; L2, Second turn coil; B1, Inductor magnetic field; B2, Reverse magnetic field; 500, Camera decorative cover; 501, Light-transmitting part. Detailed Implementation

[0038] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0039] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It is understood that "multiple" as used herein refers to two or more.

[0040] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0041] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within ±10°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within ±10°. “equal” includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0042] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet computer, a laptop computer, an in-vehicle device, a wearable device, augmented reality (AR) glasses, an AR headset, virtual reality (VR) glasses, or a VR headset, etc.

[0043] Please see Figure 1 and Figure 2 , Figure 1 This is an exploded view of an electronic device provided in some embodiments of this application. Figure 2 According to Figure 1 The diagram shows a perspective view of the electronic device. This application uses a mobile phone as an example of the electronic device. Specifically, the electronic device includes a screen 100 and a back cover 200, the back cover 200 being located on the back side of the screen 100 and fixedly connected to the screen 100.

[0044] Please continue reading. Figure 1 and Figure 2 The electronic device also includes a camera module 300, a circuit board assembly 400, and a camera decorative cover 500.

[0045] Screen 100 is used to display images, videos, etc. Screen 100 includes a light-transmitting cover 101 and a display screen 102. The light-transmitting cover 101 and the display screen 102 are stacked together. The light-transmitting cover 101 is mainly used to protect the display screen 102 and prevent dust. The material of the light-transmitting cover 101 includes, but is not limited to, glass.

[0046] The back cover 200 is used to protect the internal electronic components of an electronic device. The back cover 200 includes a back cover 201 and a frame 202. The back cover 201 is located on the side of the display screen 102 away from the light-transmitting cover plate 101, and is stacked with the light-transmitting cover plate 101 and the display screen 102. The material of the back cover 201 includes, but is not limited to, glass, metal, ceramic, or plastic. The frame 202 is located between the back cover 201 and the light-transmitting cover plate 101. The material of the frame 202 includes, but is not limited to, glass, metal, ceramic, or plastic. The frame 202 is fixed to the back cover 201. For example, the frame 202 can be fixedly connected to the back cover 201 by adhesive. The frame 202 can also be integrally formed with the back cover 201, that is, the frame 202 and the back cover 201 are a single structure. The light-transmitting cover plate 101 is fixed to the frame 202 by adhesive. The light-transmitting cover 101, the back cover 201, and the frame 202 form the housing of the electronic device, which has an internal accommodating space to accommodate the display screen 102.

[0047] The circuit board assembly 400 is located within the back cover 200. For details, please refer to [link / reference needed]. Figure 2 and combined Figure 1 The back cover 200 also includes a middle plate 203. The middle plate 203 is fixed to the inner surface of the frame 202. Exemplarily, the middle plate 203 can be fixed to the frame 202 by welding, snap-fitting, screw connection, or adhesive. The middle plate 203 can also be integrally formed with the frame 202. The middle plate 203 serves as the structural "skeleton" of the electronic device, and part of the circuit board assembly 400 can be fixed to the side surface of the middle plate 203 facing the back cover 201 by means of threaded connection, snap-fitting, welding, etc. In other examples, the middle plate 203 may be omitted, and the circuit board assembly 400 may be fixed to the surface of the display screen 102 facing the back cover 201.

[0048] The circuit board assembly 400 includes a circuit board 402 for integrating electronic components, including but not limited to an application processor (AP), double data rate synchronous dynamic random access memory (DDR), universal first-flash storage (UFS), a controller, and a power management IC (PMIC). In some embodiments, the circuit board 402 is electrically connected to the screen 100, and the circuit board 402 is used to control the screen 100 to display images or videos.

[0049] in, Figure 1 The circuit board 402 shown is for illustrative purposes only and is described in... Figure 1 The positions shown in the illustration are for the purpose of visually demonstrating the circuit board 402 in a specific example scenario. However, these positions should not be used to limit the specific positions of the circuit board 402 mentioned in this application in actual application scenarios or different embodiments.

[0050] The camera module 300 is used to capture video or images. The camera module 300 can be used as a rear camera module. In other embodiments, the camera module 300 can also be used as a front camera module. This embodiment and the embodiments described below are exemplified by using the camera module 300 as a rear camera module.

[0051] The camera module 300 is housed within the back cover 200. For details, please refer to [link / reference needed]. Figure 1 and combined Figure 2 The camera module 300 can be fixed to the surface of the middle plate 203 facing the back cover 201. In other examples, the camera module 300 can also be fixed to the surface of the circuit board 402 facing the back cover 201. The light-incident side of the camera module 300 faces the back cover 201. The back cover 201 has a mounting opening. A camera decorative cover 500 covers and is fixed to the mounting opening. The camera decorative cover 500 is used to protect the camera module 300.

[0052] The camera cover 500 has a light-transmitting part 501. The light-transmitting part 501 allows external light to pass through and enter the light-incident surface of the camera module 300.

[0053] The camera module 300 is electrically connected to the circuit board 402 so that the circuit board 402 can receive and process electrical signals containing image information from the camera module 300, thereby enabling the circuit board 402 to control the camera module 300 to achieve wide-angle tracking, ultra-wide-angle shooting, optical image stabilization (OIS), or automatic focusing (AF). The camera module 300 includes, but is not limited to, a vertical camera module and a periscope camera module.

[0054] Understandable, Figure 1 and Figure 2 The illustration schematically shows some components of an electronic device, the actual shape, size, location, and construction of which are not subject to change. Figure 1 and Figure 2 The limitations. In other examples, the electronic device may also not include the screen 100 and the back cover 200.

[0055] The electronic device is generally rectangular and flat. Therefore, for the convenience of describing the embodiments below, an XYZ coordinate system is established. Specifically, the thickness direction of the electronic device is defined as the Z-axis, the width direction as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system of the electronic device can be flexibly set according to actual needs and is not specifically limited here. Of course, in other embodiments, the electronic device may also be generally circular, square, etc. This application does not specifically limit the shape of the electronic device.

[0056] In some embodiments, the circuit board assembly 400 further includes electronic components disposed on the circuit board 402. These electronic components include, but are not limited to, a processor, an antenna module, a Bluetooth module, a Wi-Fi module, a GPS module, a power supply and charging module, a screen display and operation module, and a connector module. The screen 100 display and operation module can be electrically connected to the screen 100 via the connector module to enable the screen 100 to have display and operation functions.

[0057] In some embodiments, please refer to Figure 1 and combined Figure 3 The circuit board assembly 400 also includes an inductor 401, which is used in the circuit for functions such as filtering, energy storage, and impedance matching. The inductor 401 includes an inductor body 4011, which is connected to the circuit board 402. Through the wiring of the circuit board 402, the inductor body 4011 can be connected to other electronic components (such as capacitors, resistors, integrated circuits, etc.) to form a complete circuit function.

[0058] In some embodiments, please refer to Figure 3 and combined Figure 4 The inductor body 4011 includes an inductor coil 4011a, which is typically made of conductive material (such as copper wire) and is used to generate a magnetic field and store energy. The inductor 401 also includes an input wire 4013 and an output wire 4014. The input wire 4013 is connected to the input terminal of the inductor coil 4011a, and the output wire 4014 is connected to the output terminal of the inductor coil 4011a. The input wire 4013 and output wire 4014 are conductive materials that connect the external circuit to the inductor coil 4011a. The input wire 4013 introduces current and signals from the external circuit into the inductor coil 4011a, and the output wire 4014 extracts the current and signals, enabling it to function normally. The input wire 4013 and output wire 4014 are connected to other electronic components (such as capacitors, resistors, integrated circuits, etc.) through the wiring of the circuit board 402 to form a complete circuit function.

[0059] In some embodiments, please refer to Figure 3 The inductor body 4011 also includes an input pin 4011b and an output pin 4011c. The two ends of the inductor coil 4011a are connected to the input pin 4011b and the output pin 4011c respectively. The input pin 4011b and the output pin 4011c are connected to the circuit board 402. The input pin 4011b forms the input terminal of the inductor coil 4011a, and the output pin 4011c forms the output terminal of the inductor coil 4011a.

[0060] In some embodiments, please refer to Figure 3 and combined Figure 4 In this application, a portion of the input conductor 4013 is wound to form a compensation coil 4013a. The axial direction of the compensation coil 4013a is consistent with the axial direction of the inductor coil 4011a, and the winding direction of the compensation coil 4013a is opposite to the winding direction of the inductor coil 4011a.

[0061] The inductor body 4011 can be located between the screen 100 and the middle plate 203. The inductor body 4011 can also be located between the back cover 200 and the middle plate 203. The former is used as an example in this application. When the inductor 401 is working, the inductor coil 4011a generates an alternating magnetic field when energized. For ease of explanation, the magnetic field generated by the inductor coil 4011a is referred to as the inductor magnetic field B1. This magnetic field may cause electromagnetic interference to electronic components located on the other side of the middle plate 203, leading to performance degradation or malfunction of these electronic components.

[0062] In the prior art, although the interference of the magnetic field of inductor 401 on surrounding electronic components can be reduced to some extent by adding magnetically shielded components, these methods often require additional shielding materials or occupy a large circuit space, which is difficult to meet the needs of modern electronic devices to develop towards high integration, lightweight and miniaturization.

[0063] Furthermore, as the battery life requirements of modern electronic devices increase, the size of electronic device batteries continues to grow, occupying more and more space inside the electronic devices. This inevitably squeezes the layout space of other electronic components, and adding magnetic blocking components will further exacerbate the tension in the internal space layout of electronic devices.

[0064] In this application, the compensation coil 4013a and the inductor coil 4011a are axially aligned but wound in opposite directions. Therefore, when current flows through the compensation coil 4013a, the direction of its generated magnetic field is opposite to that of the inductor coil 4011a. For ease of explanation, the magnetic field generated by the compensation coil 4013a is referred to as the reverse magnetic field B2 in this application. It is understood that the reverse magnetic field B2 generated by the compensation coil 4013a can partially or completely cancel the inductive magnetic field B1 generated by the inductor coil 4011a, thereby significantly reducing electromagnetic interference to external electronic components.

[0065] It should be noted that the alignment of the compensating coil 4013a and the inductor coil 4011a means that their axes can overlap or be parallel. When the axes of the compensating coil 4013a and the inductor coil 4011a overlap, their magnetic fields are completely aligned in space, achieving a more efficient magnetic field cancellation effect. When their axes are parallel, the compensating coil 4013a can be flexibly arranged near the inductor coil 4011a to adapt to different circuit board 402 layout requirements.

[0066] Furthermore, this application uses a plane perpendicular to the axial direction of the inductor coil 4011a as the first reference plane. The surrounding area of ​​the inductor coil 4011a is the first region, and the surrounding area of ​​the compensation coil 4013a is the second region. At least a portion of the orthographic projection of the first region onto the first reference plane lies within the orthographic projection of the second region onto the first reference plane. The reverse magnetic field B2 generated by the compensation coil 4013a covers the region of the inductive magnetic field B1 of the inductor coil 4011a, ensuring that the reverse magnetic field B2 generated by the compensation coil 4013a can fully act on the region of the inductive magnetic field B1 generated by the inductor coil 4011a, achieving a more efficient magnetic field cancellation effect. Moreover, the compensation coil 4013a is formed by winding a portion of the input wire 4013, utilizing the components of the inductor 401 itself, eliminating the need for additional independent compensation elements and improving space utilization.

[0067] Meanwhile, the compensation coil 4013a and the inductor coil 4011a are coaxially arranged, and their projected areas partially overlap. This vertical stacking design makes full use of the space along the Z-axis of the circuit board 402 without occupying additional planar area. Furthermore, the design of using the input wire 4013 to form the compensation coil 4013a saves materials and costs, simplifies the manufacturing process of electronic devices, improves the energy utilization rate of electronic devices, and enhances mechanical strength and reliability.

[0068] In addition, the reason why this application uses the input wire 4013 to form the compensation coil 4013a is that the input signal transmitted by the input wire 4013 is a changing current signal, which can generate an alternating magnetic field in the compensation coil 4013a. Since the winding direction of the compensation coil 4013a is opposite to that of the inductor coil 4011a, its alternating magnetic field (i.e., the aforementioned reverse magnetic field B2) can effectively cancel the inductive magnetic field B1 generated by the inductor coil 4011a, thereby reducing electromagnetic interference to surrounding electronic components. In contrast, the output wire 4014 transmits a stable current signal after being filtered or stored by the inductor 401, and its current change is small, making it impossible to form the required alternating magnetic field.

[0069] In some embodiments, please refer to Figure 3 and combined Figure 1 This application uses the inductor body 4011 and the camera module 300 disposed on both sides of the circuit board 402 along the Z-axis as an example for illustration. See also Figure 5 and combined Figure 6 As can be seen, with the increasing performance demands of users for the camera module 300, the size of the camera module 300 in electronic devices is gradually increasing. If no components are placed on the other side of the circuit board 402 corresponding to the camera module 300, it will result in significant space waste. In this application, the camera module 300 is located on the side of the circuit board 402 opposite to the inductor body 4011, and the orthogonal projection of the camera module 300 on the circuit board 402 overlaps with the orthogonal projection of the inductor body 4011 on the circuit board 402. In this way, the reverse magnetic field B2 generated by the compensation coil 4013a cancels the inductive magnetic field B1 generated by the inductor coil 4011a, effectively solving the electromagnetic interference problem of the inductor 401 on the camera module 300. This not only ensures the normal operation of the camera module 300 but also makes full use of the previously idle space, significantly improving the space utilization rate of the electronic device. Meanwhile, the vertical stacking layout of inductor 401 and camera module 300 along the Z-axis further optimizes the planar space allocation of circuit board 402, providing more possibilities for the arrangement of other functional modules, thereby meeting the design requirements of modern electronic devices for high integration, lightweight and miniaturization.

[0070] In some embodiments, see Figure 7 and combined Figure 4 The compensation coil 4013a and the inductor coil 4011a are coaxially arranged. That is, the axes of the compensation coil 4013a and the inductor coil 4011a completely overlap, and their central axes coincide. When the axes of the compensation coil 4013a and the inductor coil 4011a overlap, their magnetic fields are spatially aligned but in opposite directions, achieving a highly efficient magnetic field cancellation effect.

[0071] For example, the compensation coil 4013a is wound directly around the outside of the inductor 401, ensuring that the two are fully axially aligned.

[0072] In some embodiments, see Figure 7 and combined Figure 4 The inductor body 4011 also includes a packaging structure 4012, within which the inductor coil 4011a is packaged. The "exterior of inductor 401" mentioned in this application refers to the exterior of the packaging structure 4012 of the inductor body 4011, meaning the compensation coil 4013a is wound outside the packaging structure 4012 of the inductor body 4011. Furthermore, winding the compensation coil 4013a outside the packaging structure 4012 facilitates adjustment of the number of turns and shape of the compensation coil 4013a to adapt to different magnetic field compensation requirements.

[0073] In some embodiments, see Figure 7 and combined Figure 4 The orthographic projection of the package structure 4012 on the first reference plane is located within the orthographic projection of the second region on the first reference plane. That is, the compensation coil 4013a is directly wound on the outside of the inductor 401. This avoids the gap between the compensation coil 4013a and the inductor body 4011 being too large, thereby avoiding the problem of overcompensation of the compensation coil 4013a.

[0074] The compensation coil 4013a can be wound at any position outside the inductor 401, and this application does not limit this.

[0075] In some embodiments, see Figure 7 and combined Figure 4 The orthographic projection of the first region on the first reference plane lies on the orthographic projection of the second region on the first reference plane. In this way, the reverse magnetic field B2 provided by the compensation coil 4013a can completely cover the magnetic field region of the inductor coil 4011a, thereby completely eliminating the inductive magnetic field B1 generated by the inductor coil 4011a. Simultaneously, the magnetic field of the compensation coil 4013a can uniformly surround the magnetic field of the inductor coil 4011a, avoiding localized interference problems caused by uneven magnetic field distribution. This uniform magnetic field distribution further reduces electromagnetic interference to surrounding electronic components, improving the stability and reliability of the circuit board assembly 400.

[0076] In some embodiments, see Figure 7 and combined Figure 4 In this application, the number of turns of the compensation coil 4013a is less than the number of turns of the inductor coil 4011a. This means that the reverse magnetic field B2 generated by the compensation coil 4013a can not only cancel the inductive magnetic field B1 generated by the inductor coil 4011a during operation, but also avoid overcompensation. Furthermore, the fewer turns of the compensation coil 4013a result in lower resistance and inductance values, thereby reducing energy loss and heat generation.

[0077] It should be noted that the number of turns of inductor coil 4011a refers to the number of turns of the wire of inductor coil 4011a around its axis, and the number of turns of compensation coil 4013a refers to the number of turns of input wire 4013 around the axis corresponding to compensation coil 4013a. However, the concept of the number of turns in this application is not limited to an integer in the traditional sense.

[0078] In some embodiments, the number of turns of the compensation coil 4013a is greater than or equal to 1 to ensure that the compensation coil 4013a can form the required reverse magnetic field B2 to counteract the inductive magnetic field B1 generated by the inductor coil 4011a.

[0079] In some embodiments, the number of turns of the compensation coil 4013a is less than or equal to 2 to avoid overcompensation. Furthermore, the number of turns of the compensation coil 4013a being less than or equal to 2 will not excessively increase the impedance of the inductor 401 itself, thereby reducing the impact of the compensation coil 4013a on surrounding electronic components or modules.

[0080] In addition, the number of turns of the precision compensation coil 4013a can accurately predict the magnitude of the reverse magnetic field B2, thereby reducing the volume of the compensation coil 4013a and avoiding interference with the rest of the traces on the circuit board 402.

[0081] In some embodiments, the number of turns of the compensation coil 4013a in this application is greater than or equal to 1 and less than or equal to 2.

[0082] For example, the number of turns of the compensation coil 4013a can be 1, 1.25, 1.5, 1.8, or 2, etc., and this application does not limit it.

[0083] This application limits the maximum and minimum number of turns of the compensation coil 4013a. On the one hand, by limiting the minimum number of turns of the compensation coil 4013a, it ensures that the compensation coil 4013a can prevent the inductor coil 4011a from generating leakage magnetic field. In other words, it ensures that the reverse magnetic field B2 generated by the compensation coil 4013a can attract and cancel the inductive magnetic field B1 generated by the inductor coil 4011a, thereby preventing the inductor 401 from affecting surrounding components during operation. On the other hand, by limiting the maximum number of turns of the compensation coil 4013a, it can prevent the compensation coil 4013a from overcompensating, and at the same time, it can prevent the excessive number of turns of the compensation coil 4013a from affecting the layout of other circuits in the circuit board assembly 400.

[0084] In some embodiments, see Figure 7 and combined Figure 4 The projected area of ​​the second region on the first reference plane is the first area, and the projected area of ​​the package structure 4012 on the first reference plane is the second area. The ratio of the first area to the second area is greater than or equal to 1.

[0085] In this way, the compensation coil 4013a is wound on the outer surface of the inductor 401 package, and the package structure 4012 is completely covered by the magnetic field of the compensation coil 4013a, thereby ensuring that the reverse magnetic field B2 generated by the compensation coil 4013a can fully act on the inductor coil 4011a in the package structure 4012, and maximize the cancellation of the inductor magnetic field B1 generated by the inductor coil 4011a.

[0086] In some embodiments, see Figure 7 and combined Figure 4 The ratio of the first area to the second area is less than or equal to 3.

[0087] By limiting the ratio between the area corresponding to the compensation coil 4013a and the area corresponding to the package structure 4012, it is possible to avoid the compensation coil 4013a occupying too much space on the circuit board 402, and to avoid the problem of overcompensation or the introduction of other magnetic field interference by the compensation coil 4013a.

[0088] In some embodiments, see Figure 4 and combined Figure 1 The compensation coil 4013a is located on the circuit board 402. The compensation coil 4013a is laid on the circuit board 402 by means of wire winding or printed circuit so that it is directly integrated on the circuit board 402 without occupying additional internal space of the device.

[0089] In other embodiments, see Figure 4 and combined Figure 1The compensation coil 4013a is disposed between the circuit board 402 and the screen 100. In other words, the compensation coil 4013a and the circuit board 402 are spaced apart along the axial direction of the inductor coil 4011a.

[0090] In some embodiments, see Figure 4 and combined Figure 1 The compensation coil 4013a is coplanarly arranged, and the circuit board 402 includes a first metal layer for conducting electricity. The first metal layer realizes the electrical connection between electronic components on the circuit board 402, allowing current to flow between different components, thereby constructing a complete circuit and enabling the electronic equipment to work normally. At least a portion of the first metal layer forms the compensation coil 4013a. This application directly forms the compensation coil 4013a on the first metal layer of the circuit board 402, eliminating the need for additional independent coil components, saving space on the circuit board 402, and facilitating miniaturization and high-density integration of the circuit board 402. Furthermore, since the compensation coil 4013a is integrated with the circuit board 402, forming a unified structure, compared to externally added coils, the compensation coil 4013a in this application has better mechanical stability and is less susceptible to external vibrations, impacts, and other factors, thereby improving the reliability of the entire circuit system.

[0091] In some embodiments, the circuit board 402 includes a first metal layer and a second metal layer stacked and spaced apart. Various circuit lines are distributed on the first and second metal layers, and these lines transmit different voltage and current signals. This application also includes an insulating dielectric layer located between the first and second metal layers. The insulating dielectric layer acts as an isolation layer between the first and second metal layers, effectively preventing current from flowing between the first and second metal layers, thereby avoiding circuit failures caused by short circuits due to contact between the lines of the first and second metal layers.

[0092] When the number of turns of the compensation coil 4013a in this application is 2, this application includes at least the following three possible implementation methods:

[0093] In one feasible approach, see [link to relevant documentation] Figure 8The compensation coil 4013a includes a first coil L1 and a second coil L2. At least a portion of the first metal layer forms the first coil L1 and the second coil L2; that is, the compensation coil 4013a is located entirely within the first metal layer. In this configuration, both the first coil L1 and the second coil L2 of the compensation coil 4013a are formed by portions of the first metal layer. Current flows from one end of the compensation coil 4013a into the first coil L1, flows along the path of the first coil L1, and after the current path in the first coil L1 ends, it flows into the second coil L2, continues along the path of the second coil L2, and finally exits from the other end of the compensation coil 4013a.

[0094] In this implementation, only pattern design and etching processes are required on the first metal layer. There is no need to consider the alignment and connection between the first and second metal layers, which reduces the complexity and difficulty of the manufacturing process and lowers production costs.

[0095] In one feasible approach, see [link to relevant documentation] Figure 9 and combined Figure 10 The compensation coil 4013a includes a first coil L1 and a second coil L2. At least a portion of a first metal layer forms the first coil L1, and at least a portion of a second metal layer forms the second coil L2. A metallized via 403 is provided in the insulating dielectric layer, connecting the first coil L1 and the second coil L2. Current first flows into the first coil L1 located in the first metal layer and flows along the path of the first coil L1. When the current reaches the connection point between the first coil L1 and the metallized via 403, it passes through the insulating dielectric layer via 403 and enters the second coil L2 in the second metal layer. The current then continues to flow in the second coil L2 and finally exits from the output terminal of the compensation coil 4013a.

[0096] The metallized via 403 is a through-hole drilled in the insulating dielectric layer during the manufacturing process of the circuit board 402 to achieve electrical connection between different metal layers, and a conductive channel is formed by plating metal on the inner wall of the through-hole. The metallized via 403 allows current to flow smoothly between the first metal layer and the second metal layer of the circuit board 402.

[0097] In this implementation, the multi-layer structure of the circuit board 402 can be fully utilized, and different parts of the compensation coil 4013a can be distributed on different metal layers, avoiding the compensation coil 4013a from being too crowded on the same metal layer, thereby leaving more wiring space for other circuit components, which is conducive to achieving high-density integration of the circuit board 402.

[0098] In one feasible approach, see [link to relevant documentation] Figure 11The compensation coil 4013a includes a first coil L1 and a second coil L2. A first metal layer is connected to the inductor body 4011. At least a portion of the second metal layer forms the first coil L1 and the second coil L2. The insulating dielectric layer has a metallized via 403, which connects to either the inductor body 4011 or the first coil L1 and the second coil L2. Current flows in the first metal layer to the connection point with the metallized via 403. Then, the current passes through the metallized via 403 through the insulating dielectric layer and enters the first coil L1 or the second coil L2 in the second metal layer. The current flows in the corresponding coil. Assuming the current first flows into the first coil L1, after completing the flow in the first coil L1, the current enters the second coil L2 through the wiring connection on the second metal layer and continues to flow, finally exiting from the output terminal of the compensation coil 4013a.

[0099] Placing the compensation coil 4013a in the second metal layer, which is relatively independent from the inductor body 4011, can prevent the heat generated by the two from superimposing, which is conducive to heat dissipation, improves the heat dissipation performance of the entire circuit, and ensures the stability and reliability of the circuit in high-temperature environments.

[0100] In some embodiments, see Figure 11 , Figure 10 and combined Figure 3 as well as Figure 4 The orthographic projection of the first coil L1 on the circuit board 402 coincides with the orthographic projection of the second coil L2 on the circuit board 402. In this way, the reverse magnetic field B2 generated by the first coil L1 and the second coil L2 can be superimposed, which can more efficiently cancel the inductive magnetic field B1 generated by the inductor coil 4011a, thereby greatly reducing the electromagnetic interference to external electronic components.

[0101] The orthographic projection of the first coil L1 on the circuit board 402 is also its orthographic projection on the first reference plane, that is, the projection of the first coil L1 onto the plane perpendicular to the axial direction of the inductor coil 4011a. Similarly, the orthographic projection of the second coil L2 on the circuit board 402 is also its orthographic projection onto the first reference plane, that is, the projection of the second coil L2 onto the plane perpendicular to the axial direction of the inductor coil 4011a.

[0102] The coincidence of the orthographic projection of the first coil L1 on the first reference plane and the orthographic projection of the second coil L2 on the first reference plane means that the projections of the first coil L1 and the second coil L2 are completely or partially coincident.

[0103] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

[0104] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0105] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the scope of protection of this application includes the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of this application.

[0106] The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this application; at the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An inductor, characterized in that, include: An inductor body, the inductor body including an inductor coil; An input wire is connected to the input end of the inductor. A portion of the input wire is wound to form a compensation coil. The axial direction of the compensation coil is consistent with the axial direction of the inductor, and the winding direction of the compensation coil is opposite to that of the inductor. A plane perpendicular to the axial direction of the inductor is a first reference plane. The surrounding area of ​​the inductor is a first region, and the surrounding area of ​​the compensation coil is a second region. At least a portion of the orthographic projection of the first region onto the first reference plane lies within the orthographic projection of the second region onto the first reference plane.

2. The inductor according to claim 1, characterized in that, The compensation coil is coaxially arranged with the inductor coil.

3. The inductor according to claim 1 or 2, characterized in that, The orthographic projection of the first region onto the first reference plane is located at the orthographic projection of the second region onto the first reference plane.

4. The inductor according to claim 1, characterized in that, The number of turns of the compensation coil is less than the number of turns of the inductor coil.

5. The inductor according to claim 1, characterized in that, The number of turns of the compensation coil is greater than or equal to 1.

6. The inductor according to claim 5, characterized in that, The number of turns of the compensation coil is less than or equal to 2.

7. The inductor according to claim 1, characterized in that, The inductor body also includes a packaging structure, and the inductor coil is packaged within the packaging structure.

8. The inductor according to claim 7, characterized in that, The orthographic projection of the encapsulation structure onto the first reference plane lies within the orthographic projection of the second region onto the first reference plane.

9. The inductor according to claim 8, characterized in that, The orthographic projection area of ​​the second region onto the first reference surface is the first area, and the orthographic projection area of ​​the packaging structure onto the first reference surface is the second area. The ratio of the first area to the second area is greater than or equal to 1.

10. The inductor according to claim 9, characterized in that, The ratio of the first area to the second area is less than or equal to 3.

11. A circuit board assembly, characterized in that, include: The inductor according to any one of claims 1-10; A circuit board, wherein the inductor body is connected to the circuit board.

12. The circuit board assembly according to claim 11, characterized in that, The compensation coil is located on the circuit board.

13. The circuit board assembly according to claim 12, characterized in that, The compensation coils are arranged in the same plane, and the circuit board includes a first metal layer, at least a portion of which forms the compensation coils.

14. The circuit board assembly according to claim 12, characterized in that, The circuit board includes a first metal layer and a second metal layer stacked and spaced apart, and an insulating dielectric layer located between the first metal layer and the second metal layer. The compensation coil includes a first coil and a second coil, wherein at least a portion of the first metal layer forms the first coil and at least a portion of the second metal layer forms the second coil. The insulating dielectric layer is provided with metallized vias, which are connected between the first coil and the second coil.

15. The circuit board assembly according to claim 14, characterized in that, The orthographic projection of the first coil on the circuit board coincides with the orthographic projection of the second coil on the circuit board.

16. The circuit board assembly according to any one of claims 11-15, characterized in that, Also includes: A camera module is disposed on the side of the circuit board opposite to the inductor body, and the orthographic projection of the camera module on the circuit board overlaps with the orthographic projection of the inductor body on the circuit board.

17. An electronic device, characterized in that, include: Screen; A back cover, which is located on the back side of the screen and is fixedly connected to the screen; The circuit board assembly according to any one of claims 11-16, wherein the circuit board assembly is located within the back cover, and the inductor body is located between the screen and the circuit board.

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