Bonding device and bonding method for oil gap gasket

Abstract

This invention discloses a bonding device and method for oil gap gaskets, relating to the field of oil gap gasket manufacturing technology. The bonding device includes a base, a rotating disk, a main feeding module, an adhesive application module, a secondary feeding module, and a discharge module. The rotating disk is mounted on the top of the base via a vertically oriented rotating shaft, and has multiple bonding positions spaced around the shaft. The main feeding module, adhesive application module, secondary feeding module, and discharge module are all mounted on the top of the base and arranged sequentially around the rotating disk. The rotating disk can drive any bonding position to rotate closer to the main feeding module, adhesive application module, secondary feeding module, and discharge module. The bonding device for oil gap gaskets provided by this invention allows for the manufacture of oil gap gaskets without manual labor, simplifying the processing flow, effectively reducing labor intensity, and improving the product quality of the oil gap gaskets.

Description

Technical Field

[0001] This invention relates to the field of oil gap gasket manufacturing technology, and particularly to an adhesive bonding device and method for oil gap gaskets. Background Technology

[0002] In the winding production process of transformer manufacturing, oil gap spacers are key structural components that ensure the long-term safe, stable, and efficient operation of large power transformer coils. Currently, oil gap spacers are typically made by bonding a main plate and a secondary plate together, and their main function is to form uniform oil channels between the winding coils.

[0003] Currently, the manufacturing of oil gap gaskets usually involves manual bonding. Operators need to manually pick up the main board materials and the secondary board materials, and then manually bond them together to form the oil gap gasket. However, the process of manufacturing oil gap gaskets by manual bonding is complicated, labor-intensive, and the product quality is unstable. Summary of the Invention

[0004] The main objective of this invention is to provide an adhesive bonding device and method for oil gap gaskets, aiming to solve the technical problems of complex processing procedures, high labor intensity, and unstable product quality in the current manual manufacturing of oil gap gaskets.

[0005] To achieve the above objectives, the present invention provides an adhesive device for an oil gap gasket, the adhesive device comprising: Base; A rotating disk is mounted on the top of the base via a vertically arranged rotating shaft, and multiple bonding positions are formed on the rotating disk at intervals around the rotating shaft. The main feeding module, the glue coating module, the auxiliary feeding module, and the unloading module are all installed on the top of the base and are arranged in sequence around the rotating disk at intervals. The rotating disk can drive any bonding position to rotate to be close to the main feeding module, the glue coating module, the auxiliary feeding module, and the unloading module. The main feeding module can provide motherboard raw materials and place them on the bonding positions near them. The gluing module can apply glue to the motherboard raw materials placed on the bonding positions near them. The auxiliary feeding module can provide auxiliary board raw materials and place them on the glued motherboard raw materials on the bonding positions near them to form an oil gap pad. The unloading module can remove and store the oil gap pad placed on the bonding positions near them.

[0006] In one embodiment, the paperboard raw material is either main board raw material or auxiliary board raw material. The main feeding module and the auxiliary feeding module include a storage structure and a picking structure, both installed on the top of the base. The storage structure is spaced apart from the rotating disk, and the picking structure is located between the storage structure and the rotating disk. The storage structure includes a rotating frame and multiple hoppers arranged around the rotating frame. Each hopper is used to store paperboard raw material. The rotating frame can rotate any hopper to be close to the picking structure. The picking structure can take out the paperboard raw material from the hopper closest to it and place it at the bonding position closest to it.

[0007] In one embodiment, the material handling structure includes a material handling base, a first lifting drive, a first rotating drive, a first material handling arm, and a second material handling arm. The first lifting drive is mounted on the material handling base, and the first rotating drive is connected to the drive shaft of the first lifting drive. Both the first material handling arm and the second material handling arm extend horizontally and are arranged perpendicular to each other. One end of the first material handling arm and one end of the second material handling arm are connected to the drive shaft of the first rotating drive. The ends of the first material handling arm and the second material handling arm that are away from the first rotating drive are respectively the first material handling end and the second material handling end. Both the first material handling end and the second material handling end are provided with a first suction cup. A placement position is formed at the top of the base near the material picking seat. The first suction cup of the first material picking end is configured to pick up the cardboard material in the hopper near it and rotate with the first material picking arm to place the cardboard in the placement position. The first suction cup of the second material picking end is configured to pick up the cardboard material placed in the placement position and rotate with the second material picking arm to place the cardboard material in the bonding position near it.

[0008] In one embodiment, the hopper includes two enclosure assemblies spaced apart along the width direction of the paperboard material. The two enclosure assemblies are mounted on a rotating frame and are movable relative to each other along the width direction of the paperboard material. Each enclosure assembly includes two sub-plates spaced apart along the thickness direction of the paperboard material. The two sub-plates are connected by a telescopic member and are movable relative to each other along the thickness direction of the paperboard material.

[0009] In one embodiment, the adhesive application module includes an adhesive application base and an adhesive application spray gun. The adhesive application spray gun is movably mounted on the adhesive application base in a horizontal direction and is located directly above the bonding position adjacent to it. The adhesive application spray gun can apply adhesive to the motherboard material located below the bonding position.

[0010] In one embodiment, the rotating disk is also provided with a plurality of heaters, the number of which is the same as the number of bonding positions and they correspond one-to-one. Each heater is used to heat the bonding position corresponding to it.

[0011] In one embodiment, the unloading module includes a storage frame and an unloading structure. The storage frame is installed on the top of the base and is located near the rotating disk. The unloading structure includes a traveling track, a traveling seat, a second lifting drive, and a lifting plate, all located above the bonding position. The traveling track extends along the rotating shaft in the direction of the storage frame. The traveling seat is installed on the traveling track and can move along the traveling track. The second lifting drive is installed at the bottom of the traveling seat. The drive shaft of the second lifting drive is arranged downward and connected to the lifting plate. A second suction cup is provided at the bottom of the lifting plate. The second suction cup is used to adsorb the oil gap pad placed on the bonding position near it.

[0012] In one embodiment, an isolation cover is also provided on the base. The isolation cover covers the rotating disk, the main feeding module, the glue application module, the auxiliary feeding module and the unloading module. The isolation cover is provided with operation doors for opening or closing the isolation cover at the positions corresponding to the main feeding module, the glue application module, the auxiliary feeding module and the unloading module.

[0013] In one embodiment, the bonding device further includes two bonding units, each bonding unit including a main feeding module, an adhesive application module, a secondary feeding module and a feeding module, and the two bonding units are symmetrically arranged around the center of the rotation axis.

[0014] This invention also proposes a bonding method for an oil gap gasket, which utilizes the aforementioned bonding device for the oil gap gasket and includes the following steps: The main feeding module places one of the motherboard raw materials on the bonding position near it; Rotate the rotating disk to move the bonding position where the motherboard material is placed closer to the glue application module; The adhesive application module applies adhesive to the motherboard material at the bonding position adjacent to it; Continue rotating the turntable to move the bonding position where the motherboard material with the applied glue is placed closer to the auxiliary feeding module; The auxiliary feeding module places a secondary plate material on the main plate material near the bonding position to bond the secondary plate material and the main plate material to form the oil gap pad. Continue rotating the rotating disk to move the bonding position where the oil gap pad is placed closer to the unloading module; The feeding module removes and stores the oil gap pad block placed on the bonding position near it.

[0015] The technical solution of this invention achieves full automation of the oil gap pad bonding process by setting up a rotating disk and a main feeding module, an adhesive application module, a secondary feeding module, and a unloading module arranged sequentially around it. The main feeding module automatically provides and places the motherboard material, the adhesive application module automatically applies adhesive, the secondary feeding module automatically provides and places the secondary board material to complete the bonding, and the unloading module automatically removes and stores the finished oil gap pad. Compared with the manual method of picking up and bonding motherboard and secondary board materials, this invention eliminates the need for manual intervention in the processes of feeding motherboard materials, applying adhesive, feeding secondary board materials, and removing and storing oil gap pads, significantly reducing the intensity of manual labor. Furthermore, by driving the rotating disk, each bonding position is sequentially rotated to approach the main feeding module, glue application module, auxiliary feeding module, or unloading module. This allows the processes of feeding the main board material, applying glue, feeding the auxiliary board material, and removing and storing the oil gap pads to be completed continuously on the same device. This simplifies the processing flow of the oil gap pads and enables the continuous manufacturing of multiple oil gap pads, improving manufacturing efficiency. In addition, since the placement of the main board and auxiliary board materials and the glue application are all automatically completed by the corresponding main feeding module, glue application module, and auxiliary feeding module, the interference of human factors on process parameters such as glue application amount and bonding position is reduced, ensuring consistent bonding quality for each oil gap pad and thus improving product quality stability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the bonding device for the oil gap gasket provided by the present invention from a certain perspective; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 for Figure 1 A magnified view of a portion of point B in the middle; Figure 4 A schematic diagram of the structure of an embodiment of the bonding device for the oil gap gasket provided by the present invention from another perspective; Figure 5 for Figure 4 A magnified view of a portion of point C in the middle; Figure 6 A top view schematic diagram of an embodiment of the bonding device for the oil gap gasket provided by the present invention; Figure 7A schematic diagram of another embodiment of the bonding device for the oil gap gasket provided by the present invention; Figure 8 This is a schematic flowchart of an embodiment of the bonding method for the oil gap gasket provided by the present invention.

[0018] Explanation of icon numbers: 100. Bonding device; 10. Base; 11. Rotating disk; 12. Bonding position; 13. Rotating shaft; 14. Heater; 20. Main feeding module; 30. Glue application module; 31. Glue application seat; 32. Glue application spray gun; 40. Auxiliary feeding module; 50. Unloading module; 51. Storage frame; 52. Unloading structure; 521. Traveling track; 522. Traveling seat; 523. Second lifting drive; 524. Lifting plate; 525. Second suction cup; 60. Bonding unit; 70. Storage structure; 71. Rotating frame; 72. Material bin; 73. Enclosure assembly; 731. Subplate; 80. Material picking structure; 81. Material picking seat; 82. First lifting drive; 83. First rotating drive; 84. First picking arm; 85. Second picking arm; 86. First suction cup; 90. Isolation cover; 91. Operating door.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] In the winding production process of transformer manufacturing, oil gap spacers are key structural components that ensure the long-term safe, stable, and efficient operation of large power transformer coils. Currently, oil gap spacers are typically made by bonding a main plate and a secondary plate together, and their main function is to form uniform oil channels between the winding coils.

[0024] Currently, the manufacturing of oil gap gaskets usually involves manual bonding. Operators need to manually pick up the main board materials and the secondary board materials, and then manually bond them together to form the oil gap gasket. However, the process of manufacturing oil gap gaskets by manual bonding is complicated, labor-intensive, and the product quality is unstable.

[0025] This invention proposes an adhesive device 100 for oil gap gaskets.

[0026] Please see Figures 1 to 6In one embodiment of the present invention, the bonding device 100 for the oil gap gasket includes a base 10, a rotating disk 11, a main feeding module 20, an adhesive application module 30, a secondary feeding module 40, and a discharge module 50. The rotating disk 11 is mounted on the top of the base 10 via a vertically arranged rotating shaft 13, and a plurality of bonding positions 12 are formed on the rotating disk 11 and spaced around the rotating shaft 13. The main feeding module 20, the adhesive application module 30, the secondary feeding module 40, and the discharge module 50 are all mounted on the top of the base 10 and are arranged sequentially around the rotating disk 11. The rotating disk 11 is drivable. Any bonding position 12 can be rotated to be positioned close to the main feeding module 20, the gluing module 30, the auxiliary feeding module 40, and the unloading module 50. The main feeding module 20 can provide motherboard material and place the motherboard material on the bonding position 12 close to it. The gluing module 30 can apply glue to the motherboard material placed on the bonding position 12 close to it. The auxiliary feeding module 40 can provide auxiliary board material and place the auxiliary board material on the glued motherboard material on the bonding position 12 close to it to form an oil gap pad. The unloading module 50 can remove and store the oil gap pad placed on the bonding position 12 close to it.

[0027] The bonding device 100 for oil gap pads in the technical solution of this invention is used to realize the automated bonding production of transformer oil gap pads. The bonding device 100 includes a base 10, a rotating disk 11, a main feeding module 20, an adhesive application module 30, a secondary feeding module 40, and a feeding module 50. During operation, the main feeding module 20 provides the main board material and places it near the bonding position 12. Then, the rotating disk 11 drives the bonding position 12 to rotate closer to the adhesive application module 30, which applies adhesive to the main board material placed on the bonding position 12. Afterward, the rotating disk 11 drives the bonding position 12 to continue rotating closer to the secondary feeding module 40, which provides the secondary board material and places it on the adhesive-coated main board material at the bonding position 12, bonding the main board material and the secondary board material together to form the oil gap pad. Finally, the rotating disk 11 drives the bonding position 12 to rotate close to the unloading module 50, and the unloading module 50 removes and stores the oil gap pad placed on the bonding position 12. Furthermore, since the rotating disk 11 has multiple bonding positions 12 spaced around the rotating shaft 13, and the main feeding module 20, the gluing module 30, the auxiliary feeding module 40, and the unloading module 50 are sequentially spaced around the rotating disk 11, when the rotating disk 11 rotates, the multiple bonding positions 12 can simultaneously approach the main feeding module 20, the gluing module 30, the auxiliary feeding module 40, or the unloading module 50, respectively. This allows the processes of feeding the main board material, applying glue, feeding the auxiliary board material, and removing and storing the oil gap pad to be performed sequentially and continuously.

[0028] Specifically, this invention achieves full automation of the oil gap pad bonding process by setting up a rotating disk 11 and surrounding it with a main feeding module 20, an adhesive application module 30, a secondary feeding module 40, and a unloading module 50 arranged in sequence. The main feeding module 20 automatically provides and places the main board material, the adhesive application module 30 automatically applies adhesive, the secondary feeding module 40 automatically provides and places the secondary board material to complete the bonding, and the unloading module 50 automatically removes and stores the finished oil gap pad. Compared to manually picking up and bonding the main board and secondary board materials, this invention eliminates the need for manual intervention in the processes of feeding the main board material, applying adhesive, feeding the secondary board material, and removing and storing the oil gap pad, significantly reducing labor intensity. Furthermore, the rotating disk 11 drives each bonding position 12 to rotate sequentially to approach the main feeding module 20, the gluing module 30, the auxiliary feeding module 40, or the unloading module 50. This allows the processes of feeding the main board material, applying glue, feeding the auxiliary board material, and removing and storing the oil gap pads to be completed continuously on the same device. This simplifies the processing flow of the oil gap pads and enables the continuous manufacturing of multiple oil gap pads, improving manufacturing efficiency. In addition, since the placement of the main board material and the auxiliary board material, as well as the glue application operation, are all automatically completed by the corresponding main feeding module 20, gluing module 30, and auxiliary feeding module 40, the interference of human factors on process parameters such as the amount of glue applied and the placement of the bonding positions 12 is reduced, ensuring that the bonding quality of each oil gap pad remains consistent, thereby improving the stability of product quality.

[0029] In one embodiment of the present invention, the paperboard raw material is a main board raw material or a secondary board raw material. The main feeding module 20 and the secondary feeding module 40 include a storage structure 70 and a picking structure 80, both installed on the top of the base 10. The storage structure 70 is spaced apart from the rotating disk 11. The picking structure 80 is located between the storage structure 70 and the rotating disk 11. The storage structure 70 includes a rotating frame 71 and a plurality of hoppers 72 arranged around the rotating frame 71. Each hopper 72 is used to store paperboard raw material. The rotating frame 71 can rotate any hopper 72 to be close to the picking structure 80. The picking structure 80 can take out the paperboard raw material in the hopper 72 that is close to it and place it in the bonding position 12 that is close to it.

[0030] Specifically, the storage structure 70 includes a rotating frame 71 and multiple hoppers 72 arranged around the rotating frame 71. The rotating frame 71 can rotate any hopper 72 to a position close to the picking structure 80, so that each hopper 72 can sequentially provide main board material or secondary board material. During the operation of this invention, when it is necessary to provide main board material or secondary board material to the bonding position 12, the rotating frame 71 rotates, causing the hopper 72 containing the corresponding cardboard material to rotate to a position close to the picking structure 80. The picking structure 80 then takes out the cardboard material from the hopper 72 closest to it and places it on the bonding position 12 closest to it, thereby completing the automatic feeding of main board material or secondary board material, improving the continuity and automation of the feeding process. Furthermore, the picking structure 80 is located between the storage structure 70 and the rotating disk 11, allowing the picking structure 80 to directly place the cardboard material taken from the hopper 72 onto the bonding position 12 closest to it, resulting in a more compact and rational structure. Furthermore, while the invention is in operation, the operator can also replenish the material in the hopper 72 located far from the material receiving structure 80, thereby enabling non-stop replenishment of paperboard raw materials.

[0031] In one embodiment of the present invention, the material handling structure 80 includes a material handling base 81, a first lifting drive 82, a first rotating drive 83, a first material handling arm 84, and a second material handling arm 85. The first lifting drive 82 is mounted on the material handling base 81, and the first rotating drive 83 is connected to the drive shaft of the first lifting drive 82. The first material handling arm 84 and the second material handling arm 85 both extend horizontally and are perpendicular to each other. One end of the first material handling arm 84 and one end of the second material handling arm 85 are both connected to the drive shaft of the first rotating drive 83. The first material handling arm 84 and the second material handling arm 85 are located away from the first lifting drive 81. One end of a rotary drive 83 is a first picking end and a second picking end, and both the first picking end and the second picking end are provided with a first suction cup 86; a placement position is formed on the top of the base 10 near the picking seat 81. The first suction cup 86 of the first picking end is configured to pick up the cardboard material in the hopper 72 near it and can rotate with the first picking arm 84 to place the cardboard in the placement position. The first suction cup 86 of the second picking end is configured to pick up the cardboard material placed in the placement position and can rotate with the second picking arm 85 to place the cardboard material in the bonding position 12 near it.

[0032] Further, during the material handling process, the first lifting drive 82 drives the first rotary drive 83, the first picking arm 84, and the second picking arm 85 to descend, bringing the first picking end closer to the hopper 72 and the second picking end closer to the placement position. The first suction cup 86 of the first picking end adsorbs the cardboard material in the hopper 72, while the first suction cup 86 of the second picking end adsorbs the cardboard material at the placement position. Subsequently, the first lifting drive 82 drives the first rotary drive 83, the first picking arm 84, and the second picking arm 85 to rise, simultaneously lifting the cardboard material from both locations. Next, the first rotary drive 83 drives the first picking arm 84 and the second picking arm 85 to rotate, bringing the first picking end closer to the placement position and the second picking end closer to the bonding position 12. The first lifting drive 82 drives the first rotary drive 83, the first picking arm 84, and the second picking arm 85 to descend, the first suction cup 86 of the first picking end stops adsorbing and places the cardboard material at the placement position, and simultaneously the first suction cup 86 of the second picking end stops adsorbing and places the cardboard material at the bonding position 12. Subsequently, the first lifting drive 82 drives the first rotary drive 83, the first picking arm 84, and the second picking arm 85 to rise. The first rotary drive 83 drives the first picking arm 84 and the second picking arm 85 to rotate in opposite directions to reset, so that the first picking end is close to the hopper 72 again and the second picking end is close to the placement position again, so as to carry out the next round of picking operation.

[0033] Furthermore, by setting up a first picking arm 84 and a second picking arm 85 that are perpendicular to each other, and by setting a first suction cup 86 at both the first and second picking ends, the first and second picking ends can alternately pick up and release materials. The first picking end picks up the cardboard raw material in the hopper 72 and transfers it to the placement position, while the second picking end picks up the cardboard raw material at the placement position and transfers it to the bonding position 12. The two picking ends form a relay picking operation, which improves the picking efficiency and the continuity of material supply. Since the first picking arm 84 and the second picking arm 85 are both connected to the drive shaft of the first rotary drive 83, the first and second picking ends can rotate synchronously. While the first picking end picks up the cardboard raw material in the hopper 72, the second picking end can pick up the cardboard raw material at the placement position; while the first picking end places the cardboard raw material at the placement position, the second picking end can place the cardboard raw material at the bonding position 12. This allows the picking and releasing actions to be performed synchronously, reducing process waiting time and further improving the manufacturing efficiency of the oil gap pad. The top of the base 10 near the material picking seat 81 forms a placement position, which serves as a transfer position for transferring paperboard raw materials from the hopper 72 to the bonding position 12. This facilitates the cooperation of the first material picking arm 84 and the second material picking arm 85 to complete continuous material picking, optimizes the material picking process, and improves the efficiency of material picking.

[0034] In one embodiment of the present invention, the first lifting drive member 82 in the auxiliary feeding module 40 can move horizontally relative to the picking seat 81, so as to place the auxiliary plate material adsorbed on the second picking arm 85 at different positions on the main plate material. By enabling the first lifting drive member 82 in the auxiliary feeding module 40 to move horizontally relative to the picking seat 81, the second picking arm 85 can adjust the horizontal placement position of the auxiliary plate material when placing it on the main plate material. Therefore, the auxiliary plate material can be placed at different positions on the main plate material to meet the production needs of oil gap pads of different specifications, improving the versatility and flexibility of the bonding device 100.

[0035] In one embodiment of the present invention, the hopper 72 includes two side panel assemblies 73 spaced apart along the width direction of the paperboard material. The two side panel assemblies 73 are mounted on the rotating frame 71 and can be movably mounted relative to each other along the width direction of the paperboard material. Each side panel assembly 73 includes two sub-plates 731 spaced apart along the thickness direction of the paperboard material. The two sub-plates 731 are connected by a telescopic member and can be moved relative to each other along the thickness direction of the paperboard material.

[0036] Specifically, the hopper 72 includes two enclosure assemblies 73, which are spaced apart along the width direction of the cardboard raw material. The two enclosure assemblies 73 are mounted on the rotating frame 71 and are movably mounted relative to each other along the width direction of the cardboard raw material, allowing the spacing between them to be adjusted according to the width of the cardboard raw material. Each enclosure assembly 73 includes two sub-plates 731, which are spaced apart along the thickness direction of the cardboard raw material. The two sub-plates 731 are connected by a telescopic member and are movably mounted relative to each other along the thickness direction of the cardboard raw material, allowing the spacing between them to be adjusted according to the thickness of the cardboard raw material. When storing the cardboard raw material, the relative positions of the two enclosure assemblies 73 along the width direction of the cardboard raw material are adjusted according to its width, so that the spacing between them matches the width of the cardboard raw material. Simultaneously, the relative positions of the two sub-plates 731 along the thickness direction of the cardboard raw material are adjusted via the telescopic member according to its thickness, so that the spacing between them matches the thickness of the cardboard raw material. Thus, the hopper 72 can form a storage space that matches the size of the paperboard raw materials to accommodate paperboard raw materials of different widths and thicknesses. By providing two enclosure assemblies 73, each enclosure assembly 73 including two sub-plates 731, the present invention can achieve loading of paperboard raw materials of different sizes, thus increasing its versatility.

[0037] In one embodiment of the present invention, the adhesive application module 30 includes an adhesive application base 31 and an adhesive application spray gun 32. The adhesive application spray gun 32 is movably mounted on the adhesive application base 31 in the horizontal direction and is located directly above the bonding position 12 near it. The adhesive application spray gun 32 can apply adhesive to the motherboard material on the bonding position 12 located below it.

[0038] Specifically, by setting up an adhesive application base 31 and an adhesive spray gun 32 that can move horizontally, the adhesive spray gun 32 can adjust its horizontal position relative to the adhesive application base 31, thereby applying adhesive to different positions of the motherboard material, improving the flexibility and uniformity of adhesive application.

[0039] In one embodiment of the present invention, a plurality of heaters 14 are also provided on the rotating disk 11. The number of heaters 14 is the same as that of the bonding positions 12 and they correspond one-to-one. Each heater 14 is used to heat the bonding position 12 corresponding to it.

[0040] Specifically, the rotating disk 11 is also equipped with multiple heaters 14, the number of which corresponds to the number of bonding positions 12. Each heater 14 is used to heat the bonding position 12 corresponding to it. During the bonding process of the oil gap pad, after the main board material and the secondary board material are bonded on the bonding position 12 to form an oil gap pad, the heater 14 heats the corresponding bonding position 12. The heat is transferred to the oil gap pad on the bonding position 12, promoting the curing of the adhesive between the main board material and the secondary board material, so that the main board material and the secondary board material can be bonded more quickly and firmly, thereby further improving the molding quality of the oil gap pad.

[0041] In one embodiment of the present invention, the unloading module 50 includes a storage frame 51 and an unloading structure 52. The storage frame 51 is installed on the top of the base 10 and is located near the rotating disk 11. The unloading structure 52 includes a walking track 521, a walking seat 522, a second lifting drive 523, and a lifting plate 524, all of which are arranged above the bonding position 12. The walking track 521 extends along the direction of the rotating shaft 13 pointing towards the storage frame 51. The walking seat 522 is installed on the walking track 521 and can move along the walking track 521. The second lifting drive 523 is installed at the bottom of the walking seat 522. The drive shaft of the second lifting drive 523 is arranged downward and connected to the lifting plate 524. A second suction cup 525 is provided at the bottom of the lifting plate 524. The second suction cup 525 is used to adsorb the oil gap pad placed on the bonding position 12 near it.

[0042] Specifically, when the rotating disk 11 drives the bonding position 12 carrying the oil gap pad to rotate close to the unloading module 50, the traveling seat 522 moves along the traveling track 521 to close to the bonding position 12, and the second lifting drive component 523 drives the lifting plate 524 to descend. During the descent of the lifting plate 524, it first compacts the main board material and the secondary board material downwards, so that the main board material and the secondary board material are fully bonded, thereby further improving the molding quality of the oil gap pad. Subsequently, the oil gap pad is picked up by the second suction cup 525, and the lifting plate 524 is driven to rise by the second lifting drive component 523. The traveling seat 522 moves along the traveling track 521 to above the storage frame 51, and the second lifting drive component 523 drives the lifting plate 524 to descend, placing the oil gap pad in the storage frame 51. This realizes the unloading and storage of the oil gap pad, which is simple and efficient.

[0043] In one embodiment of the present invention, an isolation cover 90 is also provided on the base 10. The isolation cover 90 covers the rotating disk 11, the main feeding module 20, the glue application module 30, the auxiliary feeding module 40 and the unloading module 50. The isolation cover 90 is provided with operation doors 91 for opening or closing the isolation cover 90 at positions corresponding to the main feeding module 20, the glue application module 30, the auxiliary feeding module 40 and the unloading module 50.

[0044] Specifically, such as Figure 7 As shown, by setting an isolation cover 90 on the base 10, the rotating disk 11, main feeding module 20, glue application module 30, auxiliary feeding module 40, and unloading module 50 are enclosed inside the isolation cover 90, forming a relatively closed processing environment. This effectively prevents external dust, impurities, and other foreign objects from entering the bonding area, avoiding dust adhering to the surface of the main board material, auxiliary board material, or adhesive, thus affecting the bonding quality and improving the product quality of the oil gap pad. Simultaneously, the isolation cover 90 reduces the outward diffusion of adhesive volatiles during the glue application process, improving the surrounding working environment and providing safety protection, preventing operators from accidentally touching the rotating disk 11 and the moving parts of each module, thus improving production safety. Furthermore, operation doors 91 are set on the isolation cover 90 corresponding to the positions of each module, facilitating maintenance, debugging, or loading operations for the corresponding modules as needed, improving the convenience of equipment maintenance, and simplifying the operation process without requiring the complete disassembly of the isolation cover 90.

[0045] In one embodiment of the present invention, the bonding device 100 further includes two bonding units 60, each bonding unit 60 including a main feeding module 20, an adhesive application module 30, a secondary feeding module 40 and a feeding module 50, and the two bonding units 60 are symmetrically arranged around the rotating shaft 13.

[0046] Specifically, by setting up two bonding units 60, each of which includes a main feeding module 20, an adhesive application module 30, a secondary feeding module 40, and a discharge module 50, and symmetrically arranging the two bonding units 60 around the rotating shaft 13, the two bonding units 60 can simultaneously perform continuous operations of bonding oil gap pads, increasing the number of oil gap pads completed per unit time and significantly improving production efficiency. Furthermore, by setting the two bonding units 60 to be symmetrical around the rotating shaft 13, the bonding positions 12 on the rotating disk 11 can move sequentially relative to the two bonding units 60, approaching the main feeding module 20, adhesive application module 30, secondary feeding module 40, and discharge module 50, thus satisfying the continuous operation of the two bonding units 60 in bonding oil gap pads. This ingenious structural design ensures efficient bonding of the oil gap pads.

[0047] This invention also proposes a bonding method for an oil gap gasket, which utilizes an oil gap gasket bonding device and includes the following steps: Step S100: The main feeding module places a motherboard material on the bonding position near it. Step S200: Rotate the rotating disk to rotate the bonding position where the motherboard material is placed to be close to the glue coating module; Step S300: The adhesive application module applies adhesive to the motherboard material on the bonding position adjacent to it. Step S400: Continue to rotate the rotating disk to rotate the bonding position where the motherboard material with the applied glue is placed to be close to the auxiliary feeding module; In step S500, the auxiliary feeding module places a secondary plate material on the main plate material near the bonding position to bond the secondary plate material and the main plate material to form the oil gap pad. Step S600: Continue to rotate the rotating disk to rotate the bonding position where the oil gap pad is placed to be close to the unloading module; In step S700, the unloading module removes and stores the oil gap pad block placed on the bonding position near it.

[0048] The specific structure of the bonding device 100 for the oil gap gasket is as described in the above embodiments. Since the bonding method for the oil gap gasket adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0049] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the protection scope of the present invention.

Claims

1. A bonding device for an oil gap gasket, characterized in that, The bonding device includes: Base; A rotating disk is mounted on the top of the base via a vertically arranged rotating shaft, and the rotating disk has a plurality of bonding positions spaced apart around the rotating shaft. The system includes a main feeding module, an adhesive coating module, a secondary feeding module, and a discharge module. The main feeding module, the adhesive coating module, the secondary feeding module, and the discharge module are all mounted on the top of the base and are arranged sequentially around the rotating disk at intervals. The rotating disk can drive any of the bonding positions to rotate and be positioned close to the main feeding module, the adhesive coating module, the secondary feeding module, and the discharge module. The main feeding module provides motherboard material and places it on the bonding position near it. The gluing module applies glue to the motherboard material placed on the bonding position near it. The auxiliary feeding module provides auxiliary board material and places it on the glued motherboard material on the bonding position near it to form the oil gap pad. The unloading module removes and stores the oil gap pad placed on the bonding position near it.

2. The bonding device for the oil gap gasket as described in claim 1, characterized in that, The cardboard raw material is either the main board raw material or the auxiliary board raw material. The main feeding module and the auxiliary feeding module both include a storage structure and a picking structure installed on the top of the base. The storage structure is spaced apart from the rotating disk, and the picking structure is located between the storage structure and the rotating disk. The storage structure includes a rotating frame and multiple hoppers arranged around the rotating frame. Each hopper is used to store the cardboard raw material. The rotating frame can rotate any hopper to be close to the picking structure. The picking structure can take out the cardboard raw material from the hopper closest to it and place it at the bonding position closest to it.

3. The bonding device for the oil gap gasket as described in claim 2, characterized in that, The material handling structure includes a material handling base, a first lifting drive, a first rotating drive, a first material handling arm, and a second material handling arm. The first lifting drive is mounted on the material handling base. The first rotating drive is connected to the drive shaft of the first lifting drive. The first material handling arm and the second material handling arm both extend horizontally and are perpendicular to each other. One end of the first material handling arm and one end of the second material handling arm are both connected to the drive shaft of the first rotating drive. The ends of the first material handling arm and the second material handling arm away from the first rotating drive are respectively the first material handling end and the second material handling end. The first material handling end and the second material handling end are both provided with a first suction cup. A placement position is formed on the top of the base near the material picking seat. The first suction cup of the first picking end is configured to pick up the cardboard raw material in the hopper near it and rotate with the first picking arm to place the cardboard in the placement position. The first suction cup of the second picking end is configured to pick up the cardboard raw material placed in the placement position and rotate with the second picking arm to place the cardboard raw material in the bonding position near it.

4. The bonding device for the oil gap gasket as described in claim 2, characterized in that, The hopper includes two side panel assemblies spaced apart along the width direction of the paperboard material. The two side panel assemblies are mounted on the rotating frame and can move relative to each other along the width direction of the paperboard material. Each side panel assembly includes two sub-plates spaced apart along the thickness direction of the paperboard material. The two sub-plates are connected by a telescopic member and can move relative to each other along the thickness direction of the paperboard material.

5. The bonding device for the oil gap gasket as described in claim 1, characterized in that, The adhesive application module includes an adhesive application base and an adhesive application spray gun. The adhesive application spray gun is movably mounted on the adhesive application base in a horizontal direction and is located directly above the bonding position near it. The adhesive application spray gun can apply adhesive to the motherboard material on the bonding position located below it.

6. The bonding device for the oil gap gasket as described in any one of claims 1 to 5, characterized in that, The rotating disk is also provided with multiple heaters, the number of which is the same as the number of bonding positions and they correspond one-to-one. Each heater is used to heat the bonding position corresponding to it.

7. The bonding device for the oil gap gasket as described in any one of claims 1 to 5, characterized in that, The feeding module includes a storage frame and a feeding structure. The storage frame is installed on the top of the base and is located near the rotating disk. The feeding structure includes a traveling track, a traveling seat, a second lifting drive, and a lifting plate, all located above the bonding position. The traveling track extends along the rotating shaft in the direction of the storage frame. The traveling seat is installed on the traveling track and can move along the traveling track. The second lifting drive is installed at the bottom of the traveling seat. The drive shaft of the second lifting drive is arranged downward and connected to the lifting plate. A second suction cup is provided at the bottom of the lifting plate. The second suction cup is used to adsorb the oil gap pad placed on the bonding position near it.

8. The bonding device for the oil gap gasket as described in any one of claims 1 to 5, characterized in that, An isolation cover is also provided on the base. The isolation cover is located above the rotating disk, the main feeding module, the glue coating module, the auxiliary feeding module and the unloading module. The isolation cover is provided with operation doors for opening or closing the isolation cover at the positions corresponding to the main feeding module, the glue coating module, the auxiliary feeding module and the unloading module.

9. The bonding device for the oil gap gasket as described in any one of claims 1 to 5, characterized in that, The bonding device further includes two bonding units, each of which includes the main feeding module, the glue application module, the auxiliary feeding module and the unloading module. The two bonding units are symmetrically arranged around the center of the rotating shaft.

10. A method for bonding an oil gap gasket, characterized in that, The bonding method utilizes a bonding device for the oil gap gasket as described in any one of claims 1 to 9, and the bonding method includes the following steps: The main feeding module places one of the motherboard raw materials on the bonding position near it; Rotate the rotating disk to move the bonding position where the motherboard material is placed closer to the glue application module; The adhesive application module applies adhesive to the motherboard material on the bonding position adjacent to it; Continue rotating the turntable to move the bonding position where the motherboard material with the applied glue is placed closer to the auxiliary feeding module; The auxiliary feeding module places a secondary board material on the main board material near the bonding position to bond the secondary board material and the main board material to form the oil gap pad. Continue rotating the rotating disk to move the bonding position where the oil gap pad is placed closer to the unloading module; The feeding module removes and stores the oil gap pad block placed on the bonding position near it.

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