Multilayer electronic components and their mounting plates

Abstract

This disclosure provides a multilayer electronic component and its mounting plate. The multilayer electronic component includes: a body having a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the width direction; the body includes a dielectric layer and a plurality of internal electrodes arranged alternately with the dielectric layer in the width direction; each of the plurality of internal electrodes includes a main portion and a lead-out portion extending from the main portion and exposed on the first surface; a groove formed on the first surface and extending in the width direction; and a connecting electrode disposed in the groove and electrically connected to the lead-out portion, thereby reducing the overall thickness of the multilayer electronic component and improving connection stability when mounted on a printed circuit board.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0018155, filed on February 12, 2025, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component and its mounting plate. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various electronic products, such as video devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, to charge or discharge them. MLCCs are used as components in a variety of electronic devices due to their miniaturization, high capacitance, and ease of installation.

[0004] The recent trend towards miniaturization in various electronic products has created a demand for thinner MLCCs (Multi-Layer Ceramic Capacitors) to be installed in these products. A typical MLCC consists of a ceramic body in which dielectric layers and internal electrodes are stacked, and an external electrode located outside the ceramic body and connected to the internal electrodes. Because the external electrode increases the thickness, length, and width of the MLCC, it is necessary to develop new types of MLCCs. Summary of the Invention

[0005] One aspect of this disclosure is to provide a multilayer electronic component that is small in size and exhibits excellent stability when mounted on a printed circuit board.

[0006] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a first surface and a second surface opposite to each other in a thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a width direction; the body including a dielectric layer and a plurality of internal electrodes alternately disposed with respect to the dielectric layer in the width direction, each of the plurality of internal electrodes including a main portion and a lead-out portion extending from the main portion and exposed to the first surface; a groove disposed on the first surface and extending along the width direction; and a connecting electrode disposed within the groove and connected to the plurality of leads-out portions.

[0007] According to another aspect of this disclosure, a multilayer electronic component includes: a body comprising a first surface and a second surface opposed to each other in a thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposed to each other in a length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposed to each other in a width direction; the body being provided with a groove disposed on the first surface and extending along the width direction; and a connecting electrode disposed within the groove. The body includes a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in the width direction, and the plurality of internal electrodes includes a main portion and a lead-out portion, the lead-out portion extending from the main portion and exposed to the inner wall of the groove and in contact with the connecting electrode.

[0008] According to one aspect of this disclosure, a mounting plate for a multilayer electronic component includes: a printed circuit board including electrode pads; a connecting post located on the electrode pads; and the aforementioned multilayer electronic component connected to the electrode pads. The connecting post is located within the groove.

[0009] According to another aspect of this disclosure, a mounting plate for a multilayer electronic component includes: a core layer; the multilayer electronic component embedded in the core layer, with the slot exposed on the upper surface of the core layer; and a metal layer disposed on the upper surface of the core layer, wherein the metal layer extends into the slot and is connected to the connection electrode. Attached Figure Description

[0010] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to an embodiment; Figure 2 It is along Figure 1 A schematic cross-sectional view of the planar structure of the first inner electrode, taken by line I-I'; Figure 3 It is along Figure 1 A schematic cross-sectional view of the planar structure of the second inner electrode, taken by line I-I'; Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II'; Figure 5 yes Figure 1 Floor plan; Figure 6 This is a schematic perspective view of a multilayer electronic assembly according to another embodiment; Figure 7 It is along Figure 6A schematic cross-sectional view of the planar structure of the first inner electrode, taken by line III-III'; Figure 8 It is along Figure 6 A schematic cross-sectional view of the planar structure of the second inner electrode, taken by line III-III'; Figure 9 yes Figure 6 Floor plan; Figure 10 and Figure 11 These are schematic cross-sectional views of a mounting plate on which multilayer electronic components are mounted, according to one embodiment and another embodiment; and Figure 12 and Figure 13 These are schematic cross-sectional views of a mounting plate incorporating multilayer electronic components according to one embodiment and another embodiment. Detailed Implementation

[0011] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, embodiments of the present disclosure may be exemplified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of explanation, the shape and size of the elements in the drawings may be exaggerated, and elements identified by the same reference numerals in the drawings are the same elements.

[0012] Furthermore, for clarity in describing this disclosure, irrelevant details have been omitted throughout the specification, and for ease of description, the dimensions (e.g., thicknesses) of the various components shown in the accompanying drawings are arbitrarily illustrated. Therefore, this disclosure is not necessarily limited to the illustrated embodiments. Additionally, the same reference numerals are used to describe components that have the same function within the scope of the same concept. Furthermore, throughout the specification, unless otherwise stated, when a component is referred to as "comprising" another component, it means that the component includes other components but does not exclude other components.

[0013] In the attached figures, the X direction can be defined as the thickness direction, the Y direction can be defined as the length direction, and the Z direction can be defined as the width direction.

[0014] Multilayer electronic components Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to an embodiment.

[0015] Figure 2 It is along Figure 1 The schematic cross-sectional view of the planar structure of the first internal electrode is shown by line I-I'.

[0016] Figure 3 It is along Figure 1 The schematic cross-sectional view of the planar structure of the second inner electrode is shown by line I-I'.

[0017] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0018] Figure 5 yes Figure 1 Floor plan.

[0019] In the following text, reference will be made to Figures 1 to 5 A multilayer electronic assembly 100 according to an embodiment is described in detail. Furthermore, although a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, this disclosure is not limited thereto, and the multilayer electronic assembly of this disclosure may also be an inductor, a piezoelectric element, a varistor, or a thermistor.

[0020] According to an embodiment, the multilayer electronic assembly 100 may include a body 110, slots 131 and 132, and connecting electrodes 141 and 142.

[0021] Although the specific shape of the main body 110 is not particularly limited, however... Figure 1 As shown, the body 110 can be formed in a hexahedral shape or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder contained in the body 110 during the firing process, or due to the polishing process of the edges of the body 110, the body 110 may not be a perfectly straight hexahedral shape, but may have a generally hexahedral shape.

[0022] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in the thickness direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction.

[0023] The body 110 may include a dielectric layer 111 and a plurality of internal electrodes 121 and 122 disposed alternately with the dielectric layer 111 in the width direction. The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, making it difficult to distinguish their boundaries without the use of a scanning electron microscope (SEM).

[0024] The size of the main body 110 is not particularly limited, but the length of the main body 110 may be greater than the width and thickness of the main body 110. However, the present disclosure is not limited thereto, and the length of the main body 110 may be less than the width of the main body 110. The width of the main body 110 may be less than or greater than the thickness of the main body 110, and this may vary according to the specifications or characteristics of the multilayer electronic component 100. In the present disclosure, the length of the main body 110 may refer to the size of the main body 110 in the length direction (Y direction), the width of the main body 110 may refer to the size of the main body 110 in the width direction (Z direction), and the thickness of the main body 110 may refer to the size of the main body 110 in the thickness direction (X direction).

[0025] For example, the dielectric layer 111 may include a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may include, for example, BaTiO3, (Ba y , x , , 1-y ,

[0026] , 1- , x , 1-y , 1-y , y , y , 1-x ,

[0028] , x , x , 1-y ,

[0027] , y , , Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- <00​​​​​​​​​​​​​​​​​​​​​​​​​​​The plurality of internal electrodes 121 and 122 may include main portions 121a and 122a and lead-out portions 121b and 122b extending from the main portions 121a and 122a and exposed to the first surface 1. The first internal electrode 121 may include a first main portion 121a and a first lead-out portion 121b extending from the first main portion 121a and exposed to the first surface 1, and the second internal electrode 122 may include a second main portion 122a and a second lead-out portion 122b extending from the second main portion 122a and exposed to the first surface 1.

[0029] The first main portion 121a and the second main portion 122a may be stacked on top of each other in the width direction. The first lead-out portion 121b and the second inner electrode 122 are not stacked in the width direction, and the second lead-out portion 122b and the first inner electrode 121 are not stacked in the width direction.

[0030] The shapes of the main portions 121a and 122a are not particularly limited, but they may have a flat plate shape perpendicular to the width direction. The lengths of the leads 121b and 122b (e.g., the dimensions of the leads 121b and 122b in the length direction) may be smaller than the lengths of the main portions 121a and 122a (e.g., the dimensions of the main portions 121a and 122a in the length direction). Although Figure 2 and Figure 3 The diagram shows a structure in which the lengths of the leads 121b and 122b are constant along the thickness direction, but the present disclosure is not limited thereto. For example, the lengths of the leads 121b and 122b may gradually decrease or increase from the main portions 121a and 122a toward the first surface 1.

[0031] At least one of the plurality of internal electrodes 121 and 122 may include at least one of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof. In particular, at least one of the plurality of internal electrodes 121 and 122 may include Ni, but this disclosure is not limited thereto.

[0032] There is no particular limitation on the average thickness of the plurality of internal electrodes 121 and 122. The average thickness of the plurality of internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0033] The average thickness of dielectric layer 111 and the average thickness of inner electrodes 121 and 122 can be measured by scanning an image of the width-thickness cross-section of the multilayer electronic assembly 100 at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average thickness of dielectric layer 111 can be obtained by measuring the thickness at multiple points (e.g., five equally spaced points in the X direction) on a single dielectric layer 111 and then averaging the results. Similarly, the average thickness of inner electrodes 121 and 122 can be obtained by measuring the thickness at multiple points (e.g., five equally spaced points in the X direction) on a single inner electrode 121 or 122 and then averaging the results. Five equally spaced points can be specified in the capacitor forming section Ac. Furthermore, by applying the above method for obtaining the average thickness to ten dielectric layers 111 and ten inner electrodes 121 and 122, the average thickness of dielectric layer 111 and the average thickness of inner electrodes 121 and 122 can be more generalized.

[0034] The main body 110 may include covers 112 and 113 located on two surfaces of the capacitor forming portion Ac that are opposite to each other in the width direction. Covers 112 and 113 do not include internal electrodes and may have a structure similar to that of the dielectric layer 111. In addition, covers 112 and 113 may include a first cover 112 and a second cover 113.

[0035] The average thickness of covers 112 and 113 is not particularly limited. For example, the average thickness of covers 112 and 113 may be less than or equal to 150 μm, less than or equal to 100 μm, less than or equal to 30 μm, or less than or equal to 20 μm. For example, the average thickness of covers 112 and 113 may be greater than or equal to 5 μm, greater than or equal to 10 μm, or greater than or equal to 30 μm. In this case, the average thickness of covers 112 and 113 refers to the average thickness of each of the first cover 112 and the second cover 113. The average thickness of covers 112 and 113 may be the average of the dimensions of covers 112 and 113 in the width direction measured at five equally spaced points in the cross-section of the multilayer electronic assembly 100 in both the width and thickness directions.

[0036] Grooves 131 and 132 may be located on the first surface 1 of the body 110 and extend in the width direction. Grooves 131 and 132 may extend from the first surface 1 into the interior of the body 110 and may be positioned spaced apart from the main portions 121a and 122a. Grooves 131 and 132 may be open to the first surface 1, and a plurality of outlets 121b and 122b may be exposed through the inner walls of grooves 131 and 132.

[0037] The slots 131 and 132 may include: a first slot 131 that exposes a plurality of first leads 121b; and a second slot 132 that is positioned longitudinally spaced from the first slot 131 and exposes a plurality of second leads 122b.

[0038] The shapes of slots 131 and 132 are not particularly limited. In a plan view of the multilayer electronic assembly 100 in the thickness and length directions, slots 131 and 132 may have rectangular or rounded rectangular shapes in which the dimensions of slots 131 and 132 in the width direction are larger than the dimensions of slots 131 and 132 in the length direction. Slots 131 and 132 may be configured to be spaced apart from the fifth surface 5 and the sixth surface 6.

[0039] like Figure 2 and Figure 5 As shown, the length dimension L1 of grooves 131 and 132 can be smaller than the length dimension L2 of leads 121b and 122b, and the thickness dimension T1 of grooves 131 and 132 can be smaller than the thickness dimension T2 of leads 121b and 122b.

[0040] Connection electrodes 141 and 142 may be disposed within slots 131 and 132 and connected to a plurality of leads 121b and 122b. For example, the plurality of leads 121b and 122b may contact connection electrodes 141 and 142 on the inner walls of slots 131 and 132. Connection electrodes 141 and 142 may be used as terminals for mounting multilayer electronic components 100 on a printed circuit board.

[0041] The connecting electrodes 141 and 142 may include: a first connecting electrode 141 disposed in the first groove 131 and connected to the first inner electrode 121; and a second connecting electrode 142 disposed in the second groove 132 and connected to the second inner electrode 122.

[0042] Because the external electrodes of the prior art are formed on the outside of the body, they have the problem of increasing the thickness, length and width of the multilayer electronic component. In contrast, in the multilayer electronic component 100 according to the embodiments of the present disclosure, the volume of the multilayer electronic component 100 can be reduced by replacing the external electrodes of the prior art with slots 131 and 132 and connecting electrodes 141 and 142, which achieves miniaturization and thinning of the multilayer electronic component 100.

[0043] To achieve a thinner multilayer electronic component 100, the connecting electrodes 141 and 142 can be located within slots 131 and 132, so as not to protrude further outward than the first surface 1. For example, the outermost surface of the multilayer electronic component 100 in the thickness direction can be the first surface 1 and / or the second surface 2.

[0044] In an embodiment, empty areas sp1 and sp2 extending along the width direction and exposed on the first surface 1 may exist within slots 131 and 132. Empty areas sp1 and sp2 provide space to accommodate electrode structures on and / or within which a printed circuit board for mounting the multilayer electronic component 100 will be mounted. Electrode structures may refer to metal layers located within the printed circuit board and electrode pads and / or solder located on the printed circuit board. This can improve stability and reduce the volume occupied by the multilayer electronic component 100 when mounting it on the printed circuit board.

[0045] It is sufficient to configure the slots 131 and 132 to expose the plurality of leads 121b and 122b. However, in an embodiment, the slots 131 and 132 may extend between the two ends of the leads 121b and 122b that are opposite to each other in the longitudinal direction, such that the leads 121b and 122b may have a plurality of exposed ends e1, e2, e3 and e4 separated from each other by the slots 131 and 132.

[0046] For example, the first groove 131 extends between the two opposite ends of the first lead-out portion 121b in the length direction, and the first lead-out portion 121b may have a plurality of first exposed ends e1 and e3 separated from each other by the first groove 131, and the second groove 132 extends between the two opposite ends of the second lead-out portion 122b in the length direction, and the second lead-out portion 122b may have a plurality of second exposed ends e2 and e4 separated from each other by the second groove 132.

[0047] The grooves 131 and 132 extend between the two ends of the leads 121b and 122b that are opposite each other in the longitudinal direction, thereby providing sufficient contact area between the inner electrodes 121 and 122 and the connecting electrodes 141 and 142.

[0048] Reference Figure 2 and Figure 3 The grooves 131 and 132 may include two side surfaces opposite each other in the longitudinal direction and bottom surfaces ls1 and ls2 facing the main portions 121a and 122a and connecting the side surfaces. For example, connecting electrodes 141 and 142 may be continuously disposed on the side surfaces and the bottom surfaces ls1 and ls2. For example, leads 121b and 122b may be exposed on the side surfaces and the bottom surfaces ls1 and ls2 of the grooves 131 and 132. This can increase the contact area between the inner electrodes 121 and 122 and the connecting electrodes 141 and 142.

[0049] The connecting electrodes 141 and 142 may include, for example, Ni electrode layers 141a and 142a that contact a plurality of leads 121b and 122b, and Sn electrode layers 141b and 142b disposed on the Ni electrode layers 141a and 142a. The Ni electrode layers 141a and 142a may be continuously disposed on both the side surfaces and the bottom surfaces ls1 and ls2 of the trenches 131 and 132 to contact the plurality of leads 121b and 122b, and the Sn electrode layers 141b and 142b may be disposed on the Ni electrode layers 141a and 142a to contact the electrode structure of the printed circuit board.

[0050] Ni electrode layers 141a and 142a and Sn electrode layers 141b and 142b can be thin film electrode layers formed using methods such as electroplating, electroless plating, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc.

[0051] Figure 6 This is a schematic perspective view of a multilayer electronic assembly according to another embodiment.

[0052] Figure 7 It is along Figure 6 The schematic cross-sectional view of the planar structure of the first inner electrode is shown by line III-III'.

[0053] Figure 8 It is along Figure 6 The schematic cross-sectional view of the planar structure of the second inner electrode is shown by line III-III'.

[0054] Figure 9 yes Figure 6 Floor plan.

[0055] In the following text, reference will be made to Figures 6 to 9 A multilayer electronic assembly 100' according to another embodiment is described. (This is in relation to...) Figures 1 to 5 The multilayer electronic assembly 100 described herein has the same construction, uses the same reference numerals, and repeated descriptions will be omitted.

[0056] The multilayer electronic assembly 100' may include connection electrodes 141' and 142' located within slots 131 and 132 and connected to a plurality of leads 121b and 122b. The connection electrodes 141' and 142' may include a first connection electrode 141' connected to a plurality of first leads 121b and a second connection electrode 142' connected to a plurality of second leads 122b.

[0057] The connecting electrodes 141' and 142' may include conductive posts 141d and 142d filling a portion of the grooves 131 and 132, and conductive segments 141e and 142e disposed between the conductive posts 141d and 142d and the first surface 1. Furthermore, the connecting electrodes 141' and 142' may also include seed layers 141c and 142c. The seed layers 141c and 142c may be disposed between the conductive posts 141d and 142d and the bottom surfaces ls1 and ls2 of the grooves 131 and 132.

[0058] For example, the first connecting electrode 141' may include a first seed layer 141c disposed on the bottom surface ls1 of the first groove 131, a first conductive post 141d disposed on the first seed layer 141c, and a first conductive joint 141e disposed on the first conductive post 141d. The second connecting electrode 142' may include a second seed layer 142c disposed on the bottom surface ls2 of the second groove 132, a second conductive post 142d disposed on the second seed layer 142c, and a second conductive joint 142e disposed on the second conductive post 142d.

[0059] The connecting electrodes 141' and 142' have shapes corresponding to the grooves 131 and 132, and can fill a portion of the grooves 131 and 132. Within the grooves 131 and 132, there may be empty regions sp1' and sp2' extending in the width direction and exposed to the first surface 1. The empty regions sp1' and sp2' may be disposed between the first surface 1 and the connecting electrodes 141' and 142'.

[0060] Seed layers 141c and 142c may comprise, for example, Ni and / or Cu. Seed layers 141c and 142c may be thin-film electrode layers formed using, for example, electroplating, electroless plating, physical vapor deposition (PVD), and / or chemical vapor deposition (CVD). Although Figure 5 and Figure 6 The diagram shows a structure in which seed layers 141c and 142c are located only between the bottom surfaces ls1 and ls2 of grooves 131 and 132 and the lower surfaces of conductive posts 141d and 142d. However, this disclosure is not limited to this, and seed layers 141c and 142c may also be configured to extend between the side surfaces of conductive posts 141d and 142d and the side surfaces of leads 121b and 122b.

[0061] The conductive pillars 141d and 142d may comprise, for example, Cu. The conductive pillars 141d and 142d may be formed using electroplating or similar methods. The conductive pillars 141d and 142d may have a cylindrical shape corresponding to the cylindrical shape of the grooves 131 and 132.

[0062] The conductive joints 141e and 142e may include, for example, Sn. The conductive joints 141e and 142e may be solder or Sn plating. The conductive joints 141e and 142e can be used to physically connect / electrically connect the connection electrodes 141' and 142' to the electrode structure of the printed circuit board.

[0063] Methods for manufacturing multilayer electronic components Hereinafter, an example of a method for manufacturing the multilayer electronic components 100 and 100' is described. However, the method for manufacturing the multilayer electronic components 100 and 100' is not limited to this example.

[0064] First, a ceramic powder for forming the dielectric layer layer 11 is prepared. The ceramic powder may be a perovskite-type compound powder represented by ABO3. The ceramic powder may include, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y [[ID=2,2]]Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), among others. For example, BaTiO3 powder can be synthesized by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Methods for synthesizing the ceramic powder include, for example, the solid-phase method, the sol-gel method, the hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Next, the prepared ceramic powder is dried and ground, and then mixed with an organic solvent (such as ethanol) and a binder (such as polyvinyl butyral) to prepare a ceramic slurry. The ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0065] Next, a conductive paste (including metal powder, binder, organic solvent, etc.) for forming the internal electrode is printed on the ceramic green sheet to a predetermined thickness using a screen printing method, a gravure printing method, etc., thereby forming an internal electrode pattern.

[0066] Subsequently, ceramic green sheets with internal electrode patterns printed on them are peeled off from the carrier film. Then, a predetermined number of ceramic green sheets with internal electrode patterns printed on them are stacked and pressed together to form a ceramic laminate. A predetermined number of ceramic green sheets without internal electrode patterns printed on them can be stacked on the upper and lower parts of the ceramic laminate to form cover portions 112 and 113 after firing. Then, the ceramic laminate is cut into sheets of predetermined size, and the cut sheets are fired to form the body 110. The leads 121b and 122b of the internal electrodes 121 and 122 can be exposed on the first surface 1 of the body 110. For example, firing can be performed for 1 to 3 hours at a temperature of 1000°C to 1400°C in an atmosphere of 1.0% H2 / 99.0% N2 (vol%) to 3.5% H2 / 96.5% N2 (vol%) (H2O / H2 / N2).

[0067] Next, an end mill can be used to machine the portions of the first surface 1 that expose the leads 121b and 122b to form grooves 131 and 132. This exposes the leads 121b and 122b not only on the first surface 1, but also on the inner walls of the grooves 131 and 132.

[0068] Next, connecting electrodes 141 and 142 can be formed by sequentially forming Ni electrode layers 141a and 142a and Sn electrode layers 141b and 142b inside tanks 131 and 132 using electroplating, electroless plating, PVD, CVD, etc., thereby forming a multilayer electronic component 100.

[0069] Optionally, seed layers 141c and 142c can be formed in tanks 131 and 132 using electroplating, electroless plating, PVD, CVD, etc. Conductive pillars 141d and 142d can be formed on the seed layers 141c and 142c. Then, connecting electrodes 141' and 142' can be formed by forming Sn plating on the conductive pillars 141d and 142d or by filling with solder to form conductive joints 141e and 142e. This can form a multilayer electronic assembly 100'.

[0070] It is equipped with Mounting plate for multilayer electronic components Figure 10 and Figure 11 These are schematic cross-sectional views illustrating the mounting plate of a multilayer electronic assembly according to one embodiment and another embodiment.

[0071] In the following text, reference will be made to Figure 10 and Figure 11 Mounting plates 200 and 200', on which multilayer electronic components are mounted, are described respectively according to one embodiment and another embodiment. Reference numerals are used to designate... Figures 1 to 9The components of the multilayer electronic components 100 and 100' described herein are the same, and redundant descriptions are omitted.

[0072] Reference Figure 10 The mounting plate 200 may include: a printed circuit board 210 including electrode pads 221 and 222; connecting posts 231 and 232 disposed on the electrode pads 221 and 222; and a multilayer electronic component 100 connected to the electrode pads 221 and 222.

[0073] The printed circuit board 210 may comprise, for example, a resin (such as glass epoxy resin) or a ceramic (such as glass ceramic). For example, the printed circuit board 210 may have a form in which multiple insulating layers are stacked. The printed circuit board 210 may include a first electrode pad 221 connected to a first connection electrode 141 and a second electrode pad 222 connected to a second connection electrode 142.

[0074] According to an embodiment, connecting posts 231 and 232 may be disposed within slots 131 and 132, and connecting posts 231 and 232 may include a first connecting post 231 and a second connecting post 232. For example, the first connecting post 231 may be coupled to the first slot 131, and the second connecting post 232 may be coupled to the second slot 132. For example, the first connecting post 231 may be inserted into the space disposed within the first slot 131, and the second connecting post 232 may be inserted into the space disposed within the second slot 132.

[0075] Therefore, the volume required to mount the multilayer electronic component 100 on the printed circuit board 210 can be reduced, and the multilayer electronic component 100 can be stably mounted on the printed circuit board 210.

[0076] Mounting plate 200 may further include solder sections 241 and 242. Solder sections 241 and 242 may be disposed on the upper surfaces of connecting posts 231 and 232. Solder sections 241 and 242 may be disposed between connecting posts 231 and 232 and connecting electrodes 141 and 142 to physically / electrically connect the two. Although Figure 10 The diagram shows a structure in which solder portions 241 and 242 are provided only between the upper surfaces of the connecting posts 231 and 232 and the connecting electrodes 141 and 142, but this disclosure is not limited thereto, and solder portions 241 and 242 may be configured to extend to the boundary between the side surfaces of the connecting posts 231 and 232 and the connecting electrodes 141 and 142.

[0077] The connecting posts 231 and 232 can be formed by electroplating or the like, and the solder parts 241 and 242 can be formed by forming a solder cap shape on the upper surface of the connecting posts 231 and 232 and then using a reflow process.

[0078] Reference Figure 11The mounting plate 200' may include: a printed circuit board 210 including electrode pads 221 and 222; connecting posts 231' and 232' disposed on the electrode pads 221 and 222; and a multilayer electronic component 100' connected to the electrode pads 221 and 222.

[0079] According to an embodiment, connecting posts 231' and 232' may be disposed within slots 131 and 132, and connecting posts 231' and 232' may include a first connecting post 231' and a second connecting post 232'. For example, the first connecting post 231' may be coupled to the first slot 131, and the second connecting post 232' may be coupled to the second slot 132. For example, the first connecting post 231' may be inserted into the space disposed within the first slot 131, and the second connecting post 232' may be inserted into the space disposed within the second slot 132.

[0080] Conductive posts 141d and 142d, and connecting posts 231' and 232', can be physically / electrically connected to each other via conductive joints 141e and 142e. Although Figure 11 The diagram shows a structure in which conductive joints 141e and 142e are disposed only between the lower surfaces of conductive posts 141d and 142d and the upper surfaces of connecting posts 231' and 232', but the present disclosure is not limited thereto, and conductive joints 141e and 142e may be configured to extend to the boundary surfaces between the side surfaces of connecting posts 231 and 232 and connecting electrodes 141 and 142, and / or the boundary surfaces between the side surfaces of connecting posts 231' and 232' and connecting electrodes 141' and 142'.

[0081] Mounting plate containing multiple layers of electronic components Figure 12 and Figure 13 These are schematic cross-sectional views illustrating mounting plates incorporating multilayer electronic components according to embodiments one and the other.

[0082] In the following text, reference will be made to Figure 12 and Figure 13 Mounting plates 300 and 300', in which multilayer electronic components 100 and 100' are embedded, are described respectively according to one embodiment and another embodiment. The same reference numerals are designated as references. Figures 1 to 9 The multilayer electronic components 100 and 100' described are the same components, and repeated descriptions will be omitted.

[0083] Reference Figure 12 The mounting plate 300 may include a core layer 310, a multilayer electronic component 100 embedded in the core layer 310, and metal layers 321 and 322 disposed on the upper surface of the core layer 310.

[0084] The slots 131 and 132 of the multilayer electronic assembly 100 may be exposed on the upper surface of the core layer 310. Metal layers 321 and 322 may include a first metal layer 321 and a second metal layer 322. The first metal layer 321 may extend into the first slot 131 and be connected to the first connection electrode 141, and the second metal layer 322 may extend into the second slot 132 and be connected to the second connection electrode 142.

[0085] When metal layers 321 and 322 are formed on the core layer 310 in which multilayer electronic components 100 are embedded using plating or deposition methods, a portion of the metal layers 321 and 322 may extend into and be disposed within the trenches 131 and 132 exposed on the upper surface of the core layer 310. For example, to connect the metal layers 321 and 322 to the connecting electrodes 141 and 142, the metal layers 321 and 322 may be formed directly within the trenches 131 and 132 without the need for a separate process.

[0086] Therefore, the volume occupied by the multilayer electronic components 100 can be reduced, and the multilayer electronic components 100 can be stably installed in the core layer 310, thereby improving the stability of the mounting plate 300.

[0087] Reference Figure 13 The mounting plate 300' may include a core layer 310, a multilayer electronic component 100' embedded in the core layer 310, and metal layers 321' and 322' disposed on the upper surface of the core layer 310.

[0088] Metal layers 321' and 322' may include a first metal layer 321' and a second metal layer 322'. The first metal layer 321' may extend into the first trench 131 and be connected to the first connection electrode 141', and the second metal layer 322' may extend into the second trench 132 and be connected to the second connection electrode 142'.

[0089] As described above, when metal layers 321' and 322' are formed on the core layer 310 in which multilayer electronic components 100' are embedded using plating or deposition methods, a portion of the metal layers 321' and 322' can extend into and be disposed in the trenches 131 and 132 exposed on the upper surface of the core layer 310. For example, in order to connect the metal layers 321' and 322' to the connection electrodes 141' and 142', the metal layers 321' and 322' can be formed directly in the trenches 131 and 132 without the need for a separate process.

[0090] The core layer 310 may include an insulating material and may consist of multiple layers. The insulating material may include thermosetting resins (such as epoxy resins), thermoplastic resins (such as polyimide), or materials prepared by impregnating inorganic fillers, organic fillers, and / or glass fibers (e.g., glass fabric, such as glass cloth) in such resins. The insulating material may include photosensitive insulating materials and / or non-photosensitive insulating materials. For example, insulating materials such as solder resist (SR), Ajinomoto deposited film (ABF), FR-4, bismaleimide triazine (BT), prepreg (PPG), resin-coated copper (RCC), and copper-clad laminate (CCL) may be used, but are not limited thereto, and other polymeric materials may also be used. Furthermore, the core layer 310 may also include glass. The glass may include, for example, pure silica (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc. However, this disclosure is not limited thereto, and alternative glass materials (such as fluorine glass, phosphate glass, and chalcogenide glass) may also be used as materials for the core layer 310. The core layer 310 may include, for example, flat glass, and may be, for example, a glass core.

[0091] Metal layers 321 and 322 may include metallic materials such as Cu, Ni, Al, etc., but this disclosure is not limited thereto.

[0092] Mounting plate 300 may also include through-holes 330 penetrating the core layer 310. Through-holes 330 may perform various functions depending on the design. For example, through-holes 330 may include grounding vias, power vias, signal vias, etc. Through-holes 330 may include electroplated layers, electroless layers, and / or sputtered layers.

[0093] Mounting plate 300 may also include stacked layers disposed on the upper and lower sides of core layer 310. For example, the board 300 in which multilayer electronic components are embedded may further include: one or more first stacked insulating layers 341 disposed on the upper surface of the core layer 310; one or more first stacked wiring layers 342 disposed on and / or within one or more first stacked insulating layers 341; one or more first stacked via layers 343 penetrating at least one of the one or more first stacked insulating layers 341; one or more second stacked insulating layers 351 disposed on the lower surface of the core layer 310; one or more second stacked wiring layers 352 disposed on and / or within one or more second stacked insulating layers 351; one or more second stacked via layers 353 penetrating at least one of the one or more second stacked insulating layers 351; a first resist layer 361 disposed on the uppermost first stacked insulating layer 341 among the one or more first stacked insulating layers 341; and a second resist layer 362 disposed on the lowermost second stacked insulating layer 351 among the one or more second stacked insulating layers 351.

[0094] Each of the first stacked insulating layer 341 and the second stacked insulating layer 351 may include an insulating material. The insulating material may include thermosetting resins (such as epoxy resins), thermoplastic resins (such as polyimide), or materials prepared by impregnating inorganic fillers, organic fillers, and / or glass fibers (e.g., glass fabric, such as glass cloth). For example, the insulating material may be a non-photosensitive insulating material such as Ajinomoto laminate (ABF) or prepreg (PPG), but is not limited thereto, and other polymeric materials may also be used. Furthermore, the insulating material may be a photosensitive insulating material such as a photosensitive dielectric (PID). The first stacked insulating layer 341 and the second stacked insulating layer 351 may include substantially the same insulating material or different insulating materials.

[0095] Each of the first stacked wiring layer 342 and the second stacked wiring layer 352 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Each of the first stacked wiring layer 342 and the second stacked wiring layer 352 may include, but is not limited to, copper (Cu). Each of the first stacked wiring layer 342 and the second stacked wiring layer 352 may perform various functions according to the design, for example, it may include signal patterns, power patterns, ground patterns, etc. These patterns may have various shapes such as lines, planes, and pads. Each of the first stacked wiring layer 342 and the second stacked wiring layer 352 may include electroless plating, electroplating, and / or sputtering layers, but this disclosure is not limited thereto.

[0096] Each of the first via layer 343 and the second via layer 353 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Each of the first via layer 343 and the second via layer 353 may include copper (Cu), but is not limited thereto. Both the first via layer 343 and the second via layer 353 may include filled vias that fill through-holes, but may also include conformal vias disposed along the wall surface of the through-holes. Each of the first via layer 343 and the second via layer 353 may perform various functions according to design, for example, may include grounding vias, power vias, signal vias, etc. In the cross-section of the mounting plate 300, each of the first via layer 343 and the second via layer 353 may have a tapered shape in opposite directions. For example, one or more first stacked via layers 343 may have a tapered shape in the thickness direction, and one or more second stacked via layers 353 may have a tapered shape in the direction opposite to the thickness direction. Each of the one or more first stacked via layers 343 and one or more second stacked via layers 353 may include an electroless plating layer, an electroplated layer, and / or a sputtered layer, but this disclosure is not limited thereto.

[0097] The first resist layer 361 and the second resist layer 362 may include, but are not limited to, liquid solder resist or film-type solder resist, and other types of insulating materials may also be used. The first resist layer 361 and the second resist layer 362 may each have a first opening and a second opening for exposing a pattern. If necessary, a surface treatment layer may be formed on the pattern exposed through the first opening and / or the second opening. Optionally, metal bumps may be formed on the pattern exposed through the first opening and / or the second opening.

[0098] As described above, according to the embodiments, a multilayer electronic component with small size and excellent stability when mounted on a printed circuit board is provided.

[0099] This disclosure is not limited to the above embodiments and drawings, but is intended to be defined by the appended claims. Therefore, it will be possible for those skilled in the art to make various substitutions, modifications and alterations within the scope of the technical spirit of this disclosure as described in the claims, and these are also considered to fall within the scope of this disclosure.

[0100] Furthermore, the term "embodiment" does not refer to the same embodiment and is provided to emphasize and describe different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, unless there is a description contrary to or contradictory to the content in another embodiment, even if the content described in one specific embodiment is not described in another embodiment, the content may be understood as a description related to the other embodiment.

[0101] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Furthermore, the term "electrical connection" includes both physical connections and non-physical connections. Additionally, expressions such as "first" and "second" are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the claims, a first element may be named a second element, and similarly, a second element may be named a first element.

[0102] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the width direction. The body includes a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in the width direction. Each of the plurality of internal electrodes includes a main portion and a lead-out portion extending from the main portion and exposed to the first surface. A groove is disposed on the first surface and extends along the width direction; as well as Connecting electrodes are disposed within the groove and connected to multiple leads.

2. The multilayer electronic component according to claim 1, wherein, The groove includes an empty area that extends in the groove along the width direction and is exposed to the first surface.

3. The multilayer electronic component according to claim 1, wherein, The groove extends between the two opposite ends of the plurality of leads along the length direction, and Each of the plurality of leads has a plurality of exposed ends separated from each other by the grooves.

4. The multilayer electronic component according to claim 1, wherein, The groove includes two side surfaces opposite each other in the length direction and a bottom surface connecting the two side surfaces, and The connecting electrodes are continuously disposed on the two side surfaces and the bottom surface.

5. The multilayer electronic component according to claim 1, wherein, The connecting electrode includes a Ni electrode layer in contact with the plurality of leads and a Sn electrode layer disposed on the Ni electrode layer.

6. The multilayer electronic assembly according to claim 1, wherein, The connecting electrode includes a conductive post that fills a portion of the groove and a conductive joint disposed between the conductive post and the first surface.

7. The multilayer electronic component according to claim 6, wherein, A seed layer is provided between the conductive post and the bottom surface of the groove.

8. The multilayer electronic component according to claim 6, wherein, The conductive pillar comprises Cu, and The conductive node includes Sn.

9. The multilayer electronic component according to claim 1, wherein, The groove is configured to be spaced apart from the fifth surface and the sixth surface.

10. The multilayer electronic assembly according to claim 1, wherein, The dimension of the groove in the length direction is smaller than the dimension of the plurality of leads in the length direction, and The dimension of the groove in the thickness direction is smaller than the dimension of the plurality of leads in the thickness direction.

11. The multilayer electronic assembly according to claim 1, wherein, The dimensions of the plurality of leads in the length direction are smaller than the dimensions of the main part in the length direction.

12. A multilayer electronic component, comprising: The body includes a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the width direction. The body is provided with a groove, which is provided on the first surface and extends along the width direction. as well as Connecting electrodes are disposed within the groove. The main body includes a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in the width direction, and The plurality of internal electrodes include a main portion and an extension portion, the extension portion extending from the main portion and exposed to the inner wall of the groove and in contact with the connecting electrode.

13. The multilayer electronic assembly according to claim 12, wherein, The groove includes an empty area that extends in the groove along the width direction and is exposed to the first surface.

14. The multilayer electronic assembly according to claim 12, wherein, The groove extends between the two opposite ends of the lead-out portion along its length, and The lead-out portion has a plurality of exposed ends separated from each other by the groove.

15. The multilayer electronic assembly according to claim 12, wherein, The groove includes two side surfaces opposite each other in the length direction and a bottom surface connecting the two side surfaces, and The outlet is exposed on the two side surfaces and the bottom surface of the groove.

16. A mounting plate for a multilayer electronic component, comprising: Printed circuit board, including electrode pads; The connecting post is located on the electrode pad; as well as The multilayer electronic component according to any one of claims 1 to 11 is connected to the electrode pads. The connecting post is located inside the groove.

17. A mounting plate for a multilayer electronic component, comprising: Core layer; The multilayer electronic component according to any one of claims 1 to 11 is embedded within the core layer, and the slot is exposed on the upper surface of the core layer; as well as A metal layer is disposed on the upper surface of the core layer. The metal layer extends into the groove and connects to the connecting electrode.

Images