A surface acoustic source line array loudspeaker system and its sound wave focusing method

Abstract

This invention relates to the field of loudspeaker technology and discloses a surface acoustic source linear array loudspeaker system and its sound wave focusing method. The system includes a housing, a honeycomb composite panel, excitation elements, a digital power amplifier, and a digital signal processor. The housing is a flat, elongated structure. Multiple honeycomb composite panels are located in the center of the housing. Multiple excitation elements are fixed to the bottom of each honeycomb composite panel. These excitation elements, along with adjacent honeycomb composite panels, form sound-generating units that drive the honeycomb composite panels to vibrate and produce sound. The multiple sound-generating units are linearly arrayed along the length of the housing. Multiple digital power amplifiers, corresponding to the honeycomb composite panels, are fixed to the inner wall of the bottom of the housing. A digital signal processor is fixed to the top of each digital power amplifier. This invention uses honeycomb composite panels driven by multiple excitation elements as sound-generating units and integrates all modules into a flat, integrated housing, which can adapt to the size requirements of embedded installation equipment in modern buildings.

Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and more specifically to a surface acoustic source line array loudspeaker system and its sound wave focusing method. Background Technology

[0002] Line array loudspeaker technology achieves long-distance, high sound pressure level, and uniform sound field coverage by controlling vertical directivity, and has become a standard solution for large venues, public address systems, and other fields.

[0003] To extend the low-frequency response or achieve specific radiation modes, existing technologies include solutions for functional supplementation or flexible assembly of basic linear arrays.

[0004] For example, Chinese patent CN115280794B discloses a stackable loudspeaker that, through the stacking and keyed interlocking structure of two identical conventional cone loudspeakers, can selectively form omnidirectional or cardioid radiation patterns and can be coupled to a line array loudspeaker. This solution embodies the design concept of enhancing system functional flexibility through modular combination.

[0005] However, existing technologies, including the aforementioned stackable loudspeakers, generally still use traditional cone-shaped loudspeakers as their basic acoustic transducer. This approach has inherent physical limitations: to achieve sufficient sound pressure level and good low-frequency response, the cone unit requires a matching magnetic circuit system, voice coil, and a heavy enclosure and waveguide structure for acoustic tuning. This results in a large and significantly thick individual unit module. When multiple such modules are combined or stacked in a line array, the overall appearance is even larger, more robust, and visually striking.

[0006] In modern public spaces such as high-speed rail stations, airport terminals, and large commercial complexes, architectural design increasingly emphasizes transparency, clean lines, and the concealment and integration of functional equipment. Clients have placed stringent aesthetic demands on loudspeakers, expecting them to be as thin and aesthetically pleasing as possible, seamlessly integrating with ceilings, walls, or structural components through embedding or fitting. Traditional bulky line array products based on cone drivers can no longer meet the needs of such high-end scenarios.

[0007] In the pursuit of thinner and lighter designs, some planar loudspeakers or distributed loudspeaker systems have emerged. However, these systems often have shortcomings in key performance areas such as sound pressure level, projection distance, and especially vertical beamforming, making it difficult to meet the stringent requirements of long-distance sound reinforcement in large spaces. Furthermore, integrating high-power digital amplifiers and processors into ultra-thin enclosures presents significant heat dissipation challenges, as traditional cooling solutions are difficult to implement within millimeter-thickness spaces. In addition, the maintenance of existing products is typically quite complex.

[0008] Therefore, the industry has long faced a prominent contradiction: how to achieve the ultimate physical thinness while maintaining the core performance of linear arrays such as high sound pressure, long projection and controllable directivity, so as to meet the requirements of modern architectural aesthetics and concealed installation. Traditional cone-shaped units and their supporting structural paradigms have become the fundamental obstacle to solving this contradiction. Summary of the Invention

[0009] The purpose of this invention is to provide a surface acoustic source line array loudspeaker system and its sound wave focusing method in order to solve the above-mentioned problems. The system uses a honeycomb composite plate driven by multiple excitation oscillators as the core sound-generating unit, which replaces the bulky cone speaker unit and its matching cavity and waveguide structure in the traditional line array. The various modules are integrated into a flat, integrated housing, which reduces the thickness of the entire system to the millimeter level. This allows the system to meet the size requirements of embedded installation equipment in modern buildings, as detailed below.

[0010] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a surface acoustic source linear array loudspeaker system, comprising a housing, a honeycomb composite panel, excitation elements, a digital power amplifier, and a digital signal processor. The housing is a flat, elongated structure. Multiple honeycomb composite panels are located in the center of the housing. Multiple excitation elements are fixed to the bottom of each honeycomb composite panel. Each excitation element, together with adjacent honeycomb composite panels, forms a sound-generating unit. The excitation elements drive the honeycomb composite panels to vibrate and generate sound. The multiple sound-generating units are linearly arrayed along the length of the housing. Multiple digital power amplifiers corresponding to the honeycomb composite panels are fixed on the bottom inner wall of the housing. A digital signal processor is fixed on the top of the digital power amplifier. The digital signal processor and the digital power amplifier form a digital drive module. The power chip of the digital power amplifier is thermally connected to the inner wall of the housing.

[0011] Using the aforementioned surface acoustic source line array loudspeaker system, firstly, the end caps at both ends of the housing are removed. Next, a suspension pad is placed on top of the suspension plate on the inner wall of the housing. Then, multiple honeycomb composite panels are placed sequentially on the suspension pad along the length of the housing. Next, epoxy resin is applied to the back of each honeycomb composite panel, and four excitation oscillators are bonded and fixed with their driving surfaces facing the honeycomb composite panel. Then, shims are securely installed on the inner wall of the bottom of the housing corresponding to the position of each sound-generating unit, and spacers for limiting the position are installed on the shims. Next, the protective plate is placed on the shims, with its sides limited by the spacers. Afterward, the honeycomb composite panel with the bonded excitation oscillators is flipped over, epoxy resin is applied to the driving surface of the excitation oscillators, and then the honeycomb composite panel is aligned so that its back is bonded and fixed to the top surface of the corresponding protective plate below through the excitation oscillators. A pair of bases and an outer positioning bracket are fixedly installed on the inner wall of the housing at the position corresponding to each sound unit. Then, the digital power amplifier is placed on top of the two bases. Next, the springs on the bases are bent upward and inserted into the slots at the bottom of the positioning brackets. The elastic downward pressure of the springs makes the bottom of the digital power amplifier fit tightly against the thermal grease pad. When the springs are pressed to the working position, the positioning plates on them bend outward and pass through the positioning holes on the side wall of the positioning brackets to achieve locking. Finally, the digital signal processor is fixed on top of the digital power amplifier.

[0012] Before installing a digital power amplifier, a thermal grease sheet needs to be sandwiched between the mounting substrate of its power chip and the inner wall of the housing. When the digital power amplifier is fastened, its substrate is pressed against the inner wall of the housing through the thermal grease sheet, forming a thermally conductive connection.

[0013] Finally, the end caps are connected to the fixing holes on the end face of the housing using studs to complete the closure. The external acoustic mesh of the system is installed in the panel groove on the front of the housing, the strip-shaped acoustic opening on the back of the housing remains unobstructed, and the speaker slots on the side of the housing can be used to lock it to the external bracket.

[0014] Preferably, the inner wall of the housing is provided with multiple positioning frames corresponding to the digital power amplifier, with two positioning frames forming a group. The bottom of the positioning frame has an upwardly recessed slot. The inner wall of the housing is provided with multiple bases corresponding to the positioning frames. The bottom of the digital power amplifier is fixed to the top of the adjacent base. The side of the base near the positioning frame is provided with an upwardly protruding spring piece, which is adapted to the slot.

[0015] Preferably, the side wall of the positioning frame is provided with a positioning opening, and a positioning piece that bends outward and passes through the positioning opening is fixed in the middle section of the spring piece.

[0016] Preferably, the bottom of the housing is fixed with a plurality of gaskets corresponding to the honeycomb composite panel, the top of the gaskets is provided with a plurality of protective plates, the top of the gaskets is fixed with a plurality of pads adapted to the protective plates, the excitation oscillator is bonded to the top of the protective plates, and the protective plates are limited by adjacent pads, and the middle of the gaskets is provided with a slot for reducing their own weight.

[0017] Preferably, the digital signal processor is configured to perform independent delay, phase, and amplitude processing on the audio signal of each sound unit, so that multiple sound units work together to achieve digital beamforming in the vertical direction.

[0018] Preferably, the shell has a trapezoidal cross-section, and multiple strip-shaped sound-permeable openings are provided on both sides of the back of the shell.

[0019] Preferably, the housing is made of an integrally formed aluminum alloy profile with a thickness of no more than 35mm.

[0020] Preferably, the housing has end caps at both ends, and a fixing hole is provided on the end face of the housing. The end caps are connected to adjacent fixing holes by studs passing through the end caps. The inner wall of the housing has hanging plates on both sides corresponding to the honeycomb composite panel. The top of the hanging plates is provided with a honeycomb composite panel. A hanging pad is provided between the honeycomb composite panel and the hanging plates. The outer wall of the housing has speaker slots along its length for locking with an external bracket. Panel grooves are provided on the top of both sides of the housing. A mesh plate is provided between the panel grooves. Multiple anti-slip textures are provided on the top of the hanging plates and the top of the panel grooves.

[0021] Preferably, the power chip of the digital power amplifier is thermally connected to the inner wall of the housing via a thermally conductive silicone grease sheet.

[0022] The present invention also provides a method for focusing sound waves in a surface acoustic source line array loudspeaker system, comprising the following steps: S1: For each of the aforementioned sound-producing units, an audio input signal is received through its corresponding digital signal processor; S2: Based on the pre-configured sound field control parameters, calculate and apply independent delay compensation, phase correction and amplitude weighting coefficients for each sound unit to control the sound wave superposition effect in the vertical direction. S3: Perform frequency division equalization and dynamic range control on the processed signal; S4: Transmit the signals of each channel to the corresponding digital power amplifier for amplification, and drive the excitation oscillator of the sound unit and the honeycomb composite plate to vibrate; S5: All sound-generating units work together to generate sound according to the delay compensation and phase correction, forming a synthetic sound beam with a predetermined directionality and coverage in free space, thereby achieving spatial focusing and distribution of sound energy.

[0023] The beneficial effects are as follows: 1. The present invention uses a honeycomb composite plate driven by multiple excitation oscillators as the core sound-generating unit, which replaces the bulky cone horn unit and its matching cavity and waveguide structure in the traditional linear array, and integrates each module into a flat integrated shell, so that the thickness of the entire system can be reduced to the millimeter level, which can meet the size requirements of modern buildings for embedded installation equipment. 2. By directly and tightly connecting the power chip of the digital power amplifier module to the inner wall of the metal housing with good thermal conductivity, the entire housing becomes an extended heat dissipation surface for the power chip. Passive heat dissipation is achieved by utilizing the large surface area of ​​the housing itself, eliminating the need for additional cooling fans or large heat dissipation fins inside the system. This ensures high power output while guaranteeing the long-term reliability of electronic components within the ultra-thin body.

[0024] 3. Each sound unit is equipped with an independent digital signal processor and digital power amplifier, forming an independent digital drive channel. Therefore, the audio signal of each unit can be independently processed for gain, delay, phase and frequency equalization. By co-programming the DSP parameters of all units in the array, digital beamforming can be achieved in the vertical direction, and the pointing angle, width and shape of the sound beam can be precisely controlled to adapt to the sound field coverage requirements of different distances and different areas, thereby improving the uniformity of sound field distribution and speech intelligibility.

[0025] 4. The excitation oscillator is connected to the housing via a transition pad, which is mechanically fixed by fasteners. The excitation oscillator and the honeycomb composite panel are connected by adhesive, avoiding the risk of reduced adhesion caused by direct bonding of the adhesive to the potentially oxidized metal surface of the housing. At the same time, the honeycomb composite panel, along with its excitation oscillator and pad, can be disassembled and replaced as a whole module without disassembling the entire system or a large number of internal cables, simplifying the maintenance process and reducing the maintenance cost throughout the entire life cycle.

[0026] 5. The back of the housing adopts a trapezoidal structure and has a strip-shaped sound-transmitting opening, which provides a rear cavity for the sound radiation on the back of the honeycomb composite panel, which helps to improve the low-frequency response of the system.

[0027] 6. When the positioning bracket is installed, the spring clip on one side of the base snaps into the slot at the bottom of the positioning bracket. After snapping in, the spring clip deforms due to its own elasticity, generating a continuous downward force. This force is directly transmitted to the digital power amplifier through the base. The continuous pressure presses the substrate of the digital power amplifier against the thermal grease pad, thereby improving the efficiency of heat conduction from the digital power amplifier to the entire housing. No additional operation or fasteners are required, and heat dissipation optimization is achieved at the same time as completing the module installation. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a structural breakdown diagram of the present invention; Figure 3 This is the present invention. Figure 2 A magnified structural diagram at point A; Figure 4 This is a schematic diagram of the internal structure of the present invention; Figure 5This is the present invention. Figure 4 A magnified structural diagram at point B; Figure 6 This is the present invention. Figure 4 A magnified structural diagram at point C; Figure 7 This is a schematic diagram of the structure of the gasket and digital signal processor of the present invention; Figure 8 This is a partial structural breakdown diagram of the present invention; Figure 9 This is a schematic diagram of the positioning frame and base of the present invention; Figure 10 This is a structurally disassembled schematic diagram of the positioning frame and base of the present invention; Figure 11 This is a schematic diagram of the structure of the base of the present invention; Figure 12 This is a schematic diagram of the end cap structure of the present invention; Figure 13 This is a schematic diagram of the end cap structure from another angle of the present invention; Figure 14 This is a front view of the present invention; Figure 15 This is a rear view of the present invention; Figure 16 This is a top view of the present invention.

[0030] The annotations in the attached figures are explained as follows: 1. Housing; 101. Fixing hole; 102. Suspension plate; 103. Panel groove; 104. Strip-shaped sound-permeable opening; 105. Speaker slot; 106. Anti-slip texture; 107. Suspension pad; 108. Thermal grease sheet; 2. End cap; 201. Stud; 3. Mesh plate; 4. Honeycomb composite board; 5. Gasket; 501. Pad; 502. Groove; 503. Protective plate; 6. Positioning frame; 601. Positioning port; 602. Slot; 7. Base; 701. Spring; 702. Positioning piece; 8. Excitation oscillator; 9. Digital power amplifier; 10. Digital signal processor. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0032] It should be noted that all directional and positional terms used in this invention, such as "up," "down," "left," "right," "front," "back," "vertical," "horizontal," "inner," "outer," "top," "lower," "lateral," "longitudinal," and "center," are only used to explain the relative positional relationships and connections between components in a specific state (as shown in the accompanying drawings). They are merely for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0033] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0036] See Figures 1-16As shown, this invention provides a surface acoustic source line array loudspeaker system. The system carrier is a housing 1, which is elongated and has a flat cross-section. The housing 1 is made of aluminum alloy through an integral extrusion molding process. The aluminum alloy profile is made of 6061 aluminum alloy, and the surface is anodized. Its thickness is no more than 35mm. The back sides of the housing 1 are formed into trapezoidal cross-sections, and multiple strip-shaped sound-transmitting openings 104 along the length direction are opened on the trapezoidal surface (see details). Figures 3-6 The housing 1 has end caps 2 at both ends, which are connected to the fixing holes 101 on the end face of the housing 1 by studs 201 passing through the end caps 2 to achieve closure (see details). Figure 5 , Figure 13 The front sides of the housing 1 are recessed inward to form panel grooves 103 for installing the sound-permeable mesh 3 (see details). Figure 3 , Figure 5 The outer wall of housing 1 is provided with a speaker slot 105 along its length for locking with an external bracket (see details). Figure 3 ).

[0037] The housing 1 contains multiple sets of sound-generating units arranged linearly along its length. Each sound-generating unit includes a honeycomb composite panel 4 located on the housing 1, and multiple excitation oscillators 8 located at the bottom of the honeycomb composite panel 4. The excitation oscillators 8 are electromagnetic or piezoelectric vibration actuators with a thickness of 15mm. One sound-generating unit includes a honeycomb composite panel 4 and four excitation oscillators 8. The four electromagnetic excitation oscillators 8 with a rated power of 15W and an impedance of 4Ω drive the honeycomb composite panel 4. The four oscillators are arranged in a rectangular pattern and are bonded to the back of the honeycomb panel with epoxy resin. The honeycomb composite panel 4 has a sandwich structure, with two 0.3mm thick hard paper surfaces and an aluminum honeycomb core in the middle, with a total thickness of 3mm. To provide support, suspension plates 102 are processed on both sides of the inner wall of the housing 1. The edges of the honeycomb composite panel 4 are placed on top of the suspension plates 102 through suspension pads 107 (see details). Figure 3 , Figure 5 Multiple anti-slip textures 106 are provided on the top of the suspension plate 102 and the top of the panel groove 103.

[0038] See Figure 7 As shown, at the position of each sound-generating unit on the bottom inner wall of the housing 1, a metal gasket 5 is installed by fasteners. A protective plate 503 is fixed on the top surface of the gasket 5. The bottom of each excitation oscillator 8 is bonded to the top surface of a protective plate 503 with epoxy resin. Subsequently, the back of the honeycomb composite board 4 is bonded to the driving surface of all corresponding excitation oscillators 8 with the same structural adhesive. To prevent the protective plate 503 from shifting, a pad block 501 is also provided on the gasket 5 to limit the position of the protective plate 503. A slot 502 is opened in the middle of the gasket 5 to reduce its own weight.

[0039] See Figures 8-11As shown, each sound-generating unit is equipped with an independent digital drive module, which consists of a digital signal processor 10 and a digital power amplifier 9. On the inner wall of the housing 1, corresponding to the position of each digital power amplifier 9, there is a pair of bases 7 and a positioning bracket 6. The bottom of the digital power amplifier 9 is fixed to the top of the two bases 7, and the positioning bracket 6 is located on the outside of the two bases 7. The bottom of the positioning bracket 6 has an upward-protruding slot 602, and one side of the base 7 has an upward-bent spring piece 701. During installation, the spring piece 701 is inserted into the slot 602 to achieve initial fixation. The slot 602 presses the spring piece 701, and the spring piece 701 springs back on its own. The force causes the spring 701 to slide downwards, driving the base 7 to continuously press down, so that the digital power amplifier 9 fixed to the base 7 is continuously pressed down and pressed against the thermal grease sheet 108. For further locking, the positioning frame 6 has a positioning hole 601 on its side wall, and the spring 701 has an outwardly bent positioning piece 702 in the middle section. When the spring 701 is pressed to the working position, the positioning piece 702 passes through the positioning hole 601 to prevent the spring 701 from accidentally coming out of the slot 602. The digital power amplifier 9 has a rated power of 60W and a peak power of up to 120W, which is used to drive four parallel excitation oscillators 8. The digital signal processor 10 is installed on the top of the digital power amplifier 9.

[0040] To achieve heat dissipation of high-power devices within the ultra-thin body, a layer of thermally conductive silicone grease 108 is sandwiched between the mounting substrate of the power chip of the digital power amplifier 9 and the aluminum alloy inner wall of the housing 1. When the digital drive module is fastened, it is simultaneously fixed on top of the thermally conductive silicone grease 108. The heat of the power chip is transferred to the entire housing 1 through the substrate and the thermally conductive silicone grease 108, and then dissipated into the environment through the huge outer surface area of ​​the housing 1, forming passive heat dissipation.

[0041] The present invention also provides a method for focusing sound waves in a surface acoustic source line array loudspeaker system, comprising the following steps: S1: For each sound-producing unit, an audio input signal is received through its corresponding digital signal processor 10.

[0042] S2: The digital signal processor 10 performs independent digital processing on the signal according to preset sound field control parameters. These preset parameters are calculated and sent by external control software based on the target coverage distance (e.g., 40 meters, 60 meters, or 80 meters) and beam pointing angle (which can be set within the range of 5° to 15°). The DSP algorithm calculates the delay and amplitude coefficients of each unit, independently calculating and applying signal processing to the corresponding sound unit. Core processing includes: Beamforming accuracy: Phase and amplitude fine-tuning is achieved through a 32-bit / 64-bit floating-point DSP, and the vertical plane beam pointing angle is continuously adjustable within the range of 5° to 15°, with sidelobe suppression better than -15dB. The beam pointing angle setting accuracy can reach ±1°.

[0043] Beam pointing calculation: In order to point the sound wave at the desired angle It is necessary to calculate the phase difference of each array element. According to the basic principles of linear arrays, this phase difference satisfies the following relationship:

[0044] in, For wave number, For the spacing between array elements, The wavelength of the sound wave is [6].

[0045] Signal delay compensation: The DSP needs to perform digital delay compensation on the signal of each array element. The calculation formula is as follows:

[0046] in, For the first The time delay of each array element relative to the reference array element For the speed of sound, It is the pointing angle.

[0047] Array factor calculation: The radiation pattern (array factor) of the entire linear array can be represented as:

[0048] in, For the first The amplitude excitation coefficient of each array element, This represents the phase difference between adjacent array elements.

[0049] Power and Equalization: The DSP processor of the digital power amplifier calculates the input signal of each speaker unit in real time. And through weighted coefficients Adjustments will be made:

[0050] This process ensures that the output signal is phase coherent and phase synchronized, thereby achieving efficient radiation and focusing of sound waves.

[0051] S3: Dynamic processing is performed on the digital signals of each channel after processing by S2.

[0052] When a strong signal, such as a drum sound, is present, the gain is automatically reduced to prevent speaker distortion. Gain attenuation The calculation formula is:

[0053] Threshold is the compression threshold, and Ratio is the compression ratio, which can be set according to the power amplifier power. When the signal falls below a certain threshold, the signal is cut off to prevent weak noise from being amplified.

[0054] The processed signals are then transmitted to the corresponding digital power amplifiers 9.

[0055] S4: Digital power amplifier 9 amplifies the signal, driving the connected excitation oscillator 8 to operate. The vibration of the excitation oscillator 8 is transmitted to the honeycomb composite panel 4, causing it to radiate sound waves.

[0056] S5: All sound generating units work together according to the delay, phase correction and amplitude weighting applied by their respective digital signal processors 10, so that the radiated sound waves are coherently superimposed and enhanced in a specific direction in space, and weakened in other directions, and finally synthesized into a highly directional sound beam, which focuses the sound energy on the preset target coverage area to achieve uniform coverage of high sound pressure level over long distances.

[0057] The honeycomb composite plate 4 driven by multiple excitation oscillators 8 serves as the core sound-generating unit, replacing the bulky cone horn unit and its associated cavity and waveguide structure in the traditional linear array. All modules are integrated into a flat, integrated housing 1, which reduces the thickness of the entire system to the millimeter level, thus meeting the size requirements of modern buildings for embedded installation equipment. By directly and tightly connecting the power chip of the digital power amplifier 9 module to the inner wall of the metal housing 1 with good thermal conductivity, the entire housing 1 becomes an extended heat dissipation surface for the power chip. The large surface area of ​​the housing 1 itself is used for passive heat dissipation, eliminating the need to add an extra cooling fan or large heat dissipation fins inside the system. This ensures high power output while guaranteeing the long-term reliability of electronic components in the ultra-thin body. Each sound unit is equipped with an independent digital signal processor 10 and a digital power amplifier 9, forming an independent digital drive channel. Therefore, the audio signal of each unit can be processed independently for gain, delay, phase and frequency equalization. By co-programming the DSP parameters of all units in the array, digital beamforming can be achieved in the vertical direction, and the pointing angle, width and shape of the sound beam can be precisely controlled to adapt to the sound field coverage requirements of different distances and different areas, thereby improving the uniformity of sound field distribution and speech intelligibility. The excitation oscillator 8 is connected to the housing 1 via a transition pad 5. The pad 5 is mechanically fixed by fasteners. The excitation oscillator 8 and the honeycomb composite plate 4 are connected by adhesive, which avoids the risk of reduced adhesion caused by direct bonding of the adhesive to the potentially oxidized metal surface of the housing 1. At the same time, it allows the honeycomb composite plate 4, together with its excitation oscillator 8 and pad 5, to be disassembled and replaced as a whole module without disassembling the entire system or a large number of internal cables, simplifying the maintenance process and reducing the maintenance cost throughout the entire life cycle. The back of the housing 1 adopts a trapezoidal structure and has a strip-shaped sound-transmitting opening 104, which provides a rear cavity for the sound radiation on the back of the honeycomb composite panel 4, which helps to improve the low-frequency response of the system. When the positioning bracket 6 is installed, the spring piece 701 on one side of the base 7 snaps into the slot 602 at the bottom of the positioning bracket 6. After snapping in, the spring piece 701 deforms due to its own elasticity, generating a continuous downward force. This force is directly transmitted to the digital power amplifier 9 through the base 7. The continuous pressure presses the substrate of the digital power amplifier 9 against the thermal grease sheet 108, thereby improving the efficiency of heat conduction from the digital power amplifier 9 to the entire housing 1. No additional operation or fasteners are required, and heat dissipation optimization is achieved at the same time as completing the module installation.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A surface acoustic source line array loudspeaker system, characterized in that: The system includes a housing (1), a honeycomb composite panel (4), an excitation oscillator (8), a digital power amplifier (9), and a digital signal processor (10). The housing (1) is a flat, elongated structure. There are multiple honeycomb composite panels (4), and the honeycomb composite panels (4) are located in the middle of the housing (1). Multiple excitation oscillators (8) are fixed at the bottom of each honeycomb composite panel (4). The excitation oscillators (8) and adjacent honeycomb composite panels (4) form a sound-generating unit. The excitation oscillators (8) are used to drive the honeycomb composite panels (4) to vibrate and generate sound. The multiple sound-generating units are linearly arrayed along the length of the housing (1). Multiple digital power amplifiers (9) corresponding to the honeycomb composite plate (4) are fixed on the bottom inner wall of the housing (1). A digital signal processor (10) is fixed on the top of the digital power amplifier (9). The digital signal processor (10) and the digital power amplifier (9) form a digital drive module. The power chip of the digital power amplifier (9) is thermally connected to the inner wall of the housing (1).

2. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The inner wall of the housing (1) is provided with multiple positioning frames (6) corresponding to the digital power amplifier (9). The positioning frames (6) are in groups of two. The bottom of the positioning frame (6) is provided with an upwardly recessed slot (602). The inner wall of the housing (1) is provided with multiple bases (7) corresponding to the positioning frames (6). The bottom of the digital power amplifier (9) is fixed to the top of the adjacent base (7). The side of the base (7) near the positioning frame (6) is provided with an upwardly protruding spring piece (701). The spring piece (701) is adapted to the slot (602).

3. The surface acoustic source line array loudspeaker system according to claim 2, characterized in that: The positioning frame (6) has a positioning opening (601) on its side wall, and a positioning piece (702) that bends outward and passes through the positioning opening (601) is fixed in the middle section of the spring piece (701).

4. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The bottom of the housing (1) is fixed with a plurality of gaskets (5) corresponding to the honeycomb composite panel (4). The top of the gaskets (5) is provided with a plurality of protective plates (503). The top of the gaskets (5) is fixed with a plurality of pads (501) adapted to the protective plates (503). The excitation oscillator (8) is bonded to the top of the protective plate (503), and the protective plate (503) is limited by the adjacent pads (501). The middle of the gaskets (5) is provided with a slot (502) for reducing its own weight.

5. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The digital signal processor (10) is configured to perform independent delay, phase and amplitude processing on the audio signal of each sound unit, so that multiple sound units work together to achieve digital beamforming in the vertical direction.

6. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The shell (1) has a trapezoidal cross-section, and multiple strip-shaped sound-permeable openings (104) are provided on both sides of the back of the shell (1).

7. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The shell (1) is made of an integrally formed aluminum alloy profile with a thickness of no more than 35mm.

8. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The housing (1) has end caps (2) at both ends. The end face of the housing (1) has a fixing hole (101). The end cap (2) is connected to the adjacent fixing hole (101) by a stud (201) that passes through the end cap (2). The inner wall of the housing (1) has a hanging plate (102) on both sides corresponding to the honeycomb composite plate (4). The top of the hanging plate (102) has a honeycomb composite plate (4). The honeycomb composite plate (4) is provided between the honeycomb composite plate (4) and the hanging plate (102). The outer wall of the housing (1) has a speaker slot (105) for locking with an external bracket along the length direction. The top of both sides of the housing (1) has a panel groove (103). The panel groove (103) is provided between the panel groove (103). The top of the hanging plate (102) and the top of the panel groove (103) are provided with multiple anti-slip patterns (106).

9. The surface acoustic source line array loudspeaker system according to claim 1, characterized in that: The power chip of the digital power amplifier (9) is thermally connected to the inner wall of the housing (1) through a thermally conductive silicone grease sheet (108).

10. The sound wave focusing method for a surface acoustic source line array loudspeaker system according to claim 1, characterized in that... This includes the following steps: S1: For each of the aforementioned sound-generating units, an audio input signal is received through its corresponding digital signal processor (10); S2: Based on the pre-configured sound field control parameters, calculate and apply independent delay compensation, phase correction and amplitude weighting coefficients for each sound unit to control the sound wave superposition effect in the vertical direction. S3: Perform frequency division equalization and dynamic range control on the processed signal; S4: The signals of each channel are transmitted to the corresponding digital power amplifier (9) for amplification, driving the excitation oscillator (8) of the sound-generating unit and the honeycomb composite plate (4) to vibrate; S5: All sound-generating units work together to generate sound according to the delay compensation and phase correction, forming a synthetic sound beam with a predetermined directionality and coverage in free space, thereby achieving spatial focusing and distribution of sound energy.

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